Powering the c-Si Roadmap

APPLIED HCT™ WAFERING SYSTEMS

32

Silicon and wafering costs together represent over 30% of module cost. They must be reduced dramatically to meet industry cost reduction objectives.

The rapid expansion of solar energy is fueled by a relentless reduction in cost per watt. Because silicon and wafering represent over 30% of total module cost, advances in wafering technology are paramount. Applied HCT, the world leader in wafering technology, is accelerating the c-Si

Wire size has a major impact on silicon cost through kerf loss. Process optimization drives nearly 50% of total wafer cost, primarily through yield, wire and slurry consumables and tool fixed costs. Process performance has direct impact on wafer slicing yield. Wafering process optimization is also critical to achieve even thinner wafers.

Achieving lowest overall wafering cost requires process optimization among multiple variables. Each reduction strategy has potential trade-offs. An integrated approach to process optimization using platform design flexibility, advanced consumables and process know-how is required for lowest total cost.

WAFERING COST

LOWEST TOTAL COST PER WAFER

PROCESS OPTIMIZATION CHALLENGE

DRIVINGDOWN

THE CHALLENGE

Yield

Yield has tremendous leverage in reducing wafering cost. Yield is affected by wafer surface quality (TTV, TV, saw marks) and wafers lost during the wafering process (wafer and wire breaks). Advances in net throughput, consumables and wire technology must be accomplished without sacrificing yield. Advanced wire handling, along with tight process control and sophisticated tool automation, are key yield enablers.

Reduced Silicon UsageSilicon is still the largest single cost component of wafer cost. Ultra-thin wire capability is required to reduce kerf loss but it can come at the expense of productivity. Balance of the trade-off depends largely on raw silicon market price which can fluctuate and so can optimal wire size. Thinner wafers lower the cost of Si per wafer but can also reduce productivity. Careful process optimization is required to achieve the largest potential gain.

Consumables CostWire and slurry consumption drive consumables cost. Slurry recycling is a powerful way to lower slurry cost if yield is not impacted. Wire breakage severely impacts consumables cost — process optimization is critical in keeping productivity high at the same time as maintaining low wire breakage rates. Advanced wire technologies, such as structured and diamond wire, promise to lower consumables cost per wafer while boosting productivity.

Net ThroughputAchieving high productivity or MW/Y from the system has a direct impact on fixed costs and return on invested capital. Both higher table speed and higher load size can boost productivity but careful balance with yield is required.

Current

Mod

ule

Cos

t – $

/Wat

t

$1.40

$1.20

$1.00

$0.80

$0.60

$0.40

$0.20

$0

Si + waferingSi + wafering

roadmap with process solutions to attack all high leverage areas that reduce wafer cost. From advances in platform architecture that enhance productivity and performance, to accelerating new wire technology, Applied HCT is propelling the industry forward with unique wire saw innovation.

Silicon and wafering are >30% of module cost

Driving down cost per watt

Wafering influences nearly 2/3 of wafer costs

Wafering cost reduction strategies

Kerf Loss

Wafer Si Consumables

Capital CostsYield

WaferingWafer Cost

Thinner Wire

Higher Table Speed

Lower Wire Speed

Recycled Slurry

Thinner Wafer

LowerKerf Loss

DecreasedWire Costs

Decreased Wire Cost

Decreased Slurry Cost

Decreased Si Wafer Cost

ReducedProductivity

Reduced Yield

Reduced Yield

Reduced Yield

ReducedProductivity

54

THE APPLIED HCT B5

B5 WAFERING TECHNoLoGyTHE FUNDAMENTAL ADVANTAGE OF LARGER LOAD SIZE

A wider process window delivers yield with higher productivity

B5 uniquely optimizes load and table speed for lowest total cost

With 2x the load potential of conventional competing systems, the B5 wafering system gives users a wider process window to tune load size and table speed for highest yield and productivity and, as a result, lowest wafer cost.

As load size increases above 1m, table speed is reduced to optimize performance and yield. However, the larger load size more than compensates, delivering higher overall productivity. At work here is the unique relationship linking productivity to table speed and load, P = ƒ (load size x table speed) and higher tool uptime with less frequent swaps of larger loads. By tuning load and table speed, users can maintain yield and rapidly increase productivity, for the lowest total cost.

Reference data collected by Applied HCT on a B5 with 120μm wire, 180μm wafer, 80% recycled slurry, with load size 0.85m, 1.1m and 1.73m.

BEST IN CLASS YIELD INDUSTRY’S HIGHEST PRODUCTIVITY LOWEST TOTAL COST

• The benchmark in process performance

• Industry leading throughput and lowest total cost

• Designed for high availability in volume manufacturing

• Proven thin wire capability down to 120μm and below

• Robust platform extendable to advanced wire technologies

Load Length

Tabl

e Sp

eed

1mLoad Tool

2mLoad Tool

Productivity = ƒ (load size x table speed)

Flexible loading up to 2m

The unique 4 position architecture has the capacity for up to 2m in total load, easily configurable to provide a high degree of flexibility to meet industry roadmaps at high yield with major advances in productivity.

B5 2m Load LengthConventional 1m Load Length

1m 1.25m 1.5m 1.75m 2m

Load Length

0.6

400

350

300

250

200

150

Optimized table speed

Minimum table speed

0.8 1.0 1.2 1.4

Load (m)

Tabl

e Sp

eed

(µm

/min

)

1.6 1.8

9.5

9.0

8.5

8.0

7.5

7.0

0.6 1.0

Load (m)

Prod

uctiv

ity (

MW

/Yea

r)

1.4 1.8

Load (m)

Tota

l CoO

($/

waf

er)

Table Speed Productivity

Process Yield Wafer Total Cost

Sing

le Y

ield

(%

)

0.6 1.0 1.4 1.8

Com

peti

ng T

echn

olog

yC

ompe

ting

Tec

hnol

ogy

Load (m)

100

99

98

970.6 1.0 1.4 1.8

76

THE DIFFERENCE

BEST IN CLASS YIELD 98% yield with >15% more productivityData collected at Applied HCT Cheseaux R&D Center: 120µm Wire, 180µm Wafer and 80% Recycled Slurry

Total wafer cost savings combined with higher productivity results in a powerful cash flow generation per tool advantage for wafer manufacturers. The B5 advantage results in a 20% higher net cash flow generation.

A wider B5 process window enables high yield with greater productivity. Comparison of process data for runs at 0.85m, 1.1m and 1.73m loads shows virtually identical process yields >98% at industry leading 30µm TTV, 20µm TV and 20µm saw marks limit while productivity increases by nearly 25%.

As part of the 20% productivity advantage of larger load, lies a lower system downtime advantage due to less frequent swaps of larger loads.

Both load sizes demonstrate best in class performance TV yield >98% at <20µm limit.

Total wafer cost modeling comparison at 120µm wire size and 180µm wafer size shows as much as a 3¢/wafer total CoO advantage between a 7.9MW/Y 0.95m load conventional tool and a 9.2MW/Y 1.73m load B5.

Both load sizes demonstrate best in class performance saw marks yield >98% at <20µm limit, with a 13µm average.

At industry leading 120µm wire size and 180µm wafer thickness, the B5 load advantage delivers >15% higher productivity per system when compared with conventional 1m load tools. When combined with the B5’s 25% footprint advantage over these same tools, the productivity advantage for a given factory size approaches 50% more wafers per year.

Both load sizes demonstrate best in class performance TTV yield >98% at <30µm limit, with a 15µm average.

20% GREATER CASH FLoW/TooLyIELD LoAD SIZE CoMPARISoN

30% LoWER SySTEM DoWNTIMETV LoAD SIZE CoMPARISoN

3¢ LoWER CoST/WAFERSAW MARKS LoAD SIZE CoMPARISoN

TTV LoAD SIZE CoMPARISoN

Productivity is driven by larger load size

High availability through reduced loading frequency

100

90

80

70

60

50

40

30

20

10

0

TTV<30μmPos A1.41%

TT

V μ

m

TTV<30μmPos D0.86%

100

90

80

70

60

50

40

30

20

10

0

TTV<30μmPos A1.54%

TTV Average

TTV<30μmPos B1.46%

TTV<30μmPos C1.06%

TTV<30μmPos D1.21%

TT

V μ

m

TTV LimitTTV Average

0.85m Load, 7.4MW/Y 1.73m Load, 9.2MW/Y

TTV Limit

50

45

40

35

30

25

20

15

10

5

0

SM<20μmPos A0.66%

Saw

Mar

ks μ

m

SM<20μmPos D0.67%

50

45

40

35

30

25

20

15

10

5

0

SM<20μmPos A1.54%

TTV Average

SM<20μmPos B1.71%

SM<20μmPos C0.59%

SM<20μmPos D0.51%

Saw

Mar

ks μ

m

TTV LimitTTV Average

0.85m Load, 7.4MW/Y 1.73m Load, 9.2MW/Y

TTV Limit

230

220

210

200

190

180

170

160

150

140

130

TV±20μmPos A0.50%

Thic

knes

s μm

TV±20μmPos D0.57%

230

220

210

200

190

180

170

160

150

140

130

TV±20μmPos A0.83%

TTV Average

TV±20μmPos B

2.20%

TV±20μmPos C

0.94%

TV±20μmPos D0.81%

Thic

knes

s μm

TTV LimitTTV Average

0.85m Load, 7.4MW/Y 1.73m Load, 9.2MW/Y

TTV Limit

0.85m, 7.4MW/Y

Limits: 30μm TTV, 20μm TV, 20μm Saw Marks

1.1m, 8.6MW/Y 1.73m, 9.2MW/Y

100%

99%

98%

97%

96%

95%

94%

93%

92%

91%

90%

0.95m Load, 7.9MW/Y 1.73m Load, 9.2MW/Y

2.21

2.20

2.19

2.18

2.17

2.16

Tota

l CoO

in $

/Waf

er

0.95m Load7.9MW/Y

1.73m Load9.2MW/Y

0.95m Load7.9MW/Y

Discounted Cash Flow (10%)Net Cash Flow

1.73m Load9.2MW/Y

12

10

8

6

4

2

0

5 Ye

ar N

et C

ash

Flow

Per

Too

l in

$M

0.95mConventional

1.73mOptimized

9.5

9

8.5

8

7.5

7

1.00

0.90

0.80

0.70

0.60

0.50

0.40

0.30

0.20

0.10

0.00

0.95mConventional

MW

/Y P

er T

ool P

er m

2 of F

acto

ry

MW

/Y P

er T

ool

1.73mOptimized

0.95m Load, 7.9MW/Y

1.73m Load, 9.2MW/Y

Load SwapDowntime

>15% MoRE MW/y PER TooL

INDUSTRY’S HIGHEST NET THROUGHPUT AND LOWEST TOTAL COST

98

DESIGNED FOR HIGH AVAILABILITY IN VOLUME MANUFACTURING

PROVEN THIN WIRE CAPABILITY DOWN TO 120μm AND BELOW

Flexible load sizeFlexible 2m maximum load size, in 0.25m increments, lets factories adjust capacity and achieve the highest yield and productivity.

Reduced downtime for slurry changeThe B5 design provides for simple, rapid change of slurry canisters, with the option for automatic slurry refill.

Greater process reproducibilityInterface to Applied’s E3™ process automation software enables real-time data logging, fault detection and function control.

Minimal downtime for breakageEarly-warning wire wear detection alerts operators before wire failure, minimizing yield loss and downtime.

Reduced footprintWith 25% smaller footprint than competing tools, the B5 produces 50% more MW annually for a given factory size.

Minimal wire breakageAdvanced wire management continuously controls acceleration, tension and alignment angle for low breakage and consistent cut.

PRoVEN PERFoRMANCE

Low inertia wire managementA proprietary low-inertia design carefully controls wire vibration and strain at the wafer level and reduces tension in transition periods.

Controlled acceleration and deceleration algorithmsThe B5 system’s control software continuously manages wire acceleration/deceleration to reduce the potential for wire breakage.

Continuously adjustable wire trackingContinuous wire position tracking at the feeding spool ensures optimum alignment during unwinding, avoiding unwanted tension and wire breakage risk.

B5 design optimized for thin wire performance

Existing installed B5 tools can be easily upgraded to

thin wire capability with a thin wire retrofit kit. Local

process application consultation can assist customers

to achieve optimal process performance and

productivity with the B5 platform.

Minimal downtime for wire changeThe B5’s unique conical take-up spool and expandable shaft feeding spool enable fast wire change in a production environment.

Thin wire capability is essential to reduce kerf loss.

With Applied HCT’s system engineering approach,

the proven B5 system has been designed for optimum

performance with thin wire technology, providing

high yield with industry leading productivity. With

over 1000 systems in production with thin wire

capability, the B5 is the clear leader in bringing thin

wire to volume manufacturing.

The experience from more than 1000 systems in volume production.

1110

STRUCTURED WIRE BENEFITS

A CoMPLETE SoLUTIoN FRoM APPLIED HCT

• More efficient slurry transport

• Works on both mono- and multi- crystalline silicon

• Enables greater table speed leading to lower wire consumption and higher productivity

• No impact on yield (TV, TTV, Saw Marks)

• Low (<3μm) additional kerf loss

• Advanced wire management system to handle structured wire eliminating twisting and misalignment

• Structured wire specially developed, qualified and proven on the B5 platform

• Process optimization for structured wire, including load size, table speed and wire tension to maximize yield and throughput

• Upgrade available for standard B5 systems

ADVANCED WIRE TECHNoLoGIES

The cost of consumables, wire and slurry, is the largest component of wafering cost. Reducing wire cost has an immediate impact on lowering cost per wafer and improving customer profitability. Structured wire transports slurry more efficiently, enabling higher table speeds, which reduces wire consumption and increases productivity. The 20% wire consumption saving and >20% productivity improvement provide an incremental 2¢ per wafer total cost of ownership reduction over standard wire B5, for a 5¢ per wafer total cost of ownership (TCO) reduction over conventional 1m tools.

INTRODUCING STRUCTURED WIRE WAFERING UPGRADE AN EXCLUSIVE INNOVATION FROM APPLIED HCT

HIGHER PRoDUCTIVITy WITHoUT IMPACTING yIELD

APPLIED HCT B5 – THE oNLy SySTEM IN THE MARKET FoR STRUCTURED WIRE WAFERING

30% GREATER CASH FLoW/TooL

>20% IMPRoVEMENT IN PRoDUCTIVITy

2¢/WAFER SAVINGS IN TCo

20% SAVINGS IN WIRE CoNSUMPTIoN

<1 day upgrade time

Yie

lded

km

of w

ire/m

2

1.73m loadstandard wire B5

1.73m loadstructured wire B5

6

5

4

3

2

1

0

0.95m load tool

Tota

l CoO

in $

/waf

er

(Capital excluded)

1.73m loadstandard wire B5

1.73m loadstructured wire B5

$2.21

$2.20

$2.19

$2.18

$2.17

$2.16

$2.15

$2.14

$2.13

$2.12

0.95m load tool

MW

/Y

1.73m loadstandard wire B5

1.73m loadstructured wire B5

14

12

10

8

6

4

2

0

5 ye

ar c

ash

flow

per

tool

in M

$

0.95mload tool

1.73m loadstandard wire B5

Discounted Net Cash Flow

1.73m loadstructured wire B5

$7.0

$6.0

$5.0

$4.0

$3.0

$2.0

$1.0

$0.0

Data collected at Applied HCT Cheseaux R&D Center: 120μm Wire, 180μm Wafer and 80% Recycled Slurry

The B5 with structured wire enables greater table speed for wafering, thereby reducing wire consumption by 20% over B5 systems that use standard wire for the same load size.

Total wafer cost modeling comparison shows a 2¢ per wafer TCO advantage between a B5 system using structured wire and a B5 system using standard wire for the same load size. This translates to savings of 5¢ per wafer over conventional 0.95m load tools.

The B5 with structured wire delivers >20% higher productivity per system when compared with standard wire B5 systems. This amounts to >35% increase in productivity over conventional 0.95m load tools.

The B5 with structured wire results in 30% higher net cash flow generation per tool over standard wire B5 systems and a >60% higher net cash flow generation per tool over conventional 0.95m tools.

A fast, low risk upgrade path to immediately lower wafer costs:

Fo R B oT H M o N o - A N D M U LT I - C RYS TA L L I N E S I L I Co N

>15%

2¢/WAFER

30%/TOOL

>20%

20%

E N E R G Y S Av I N G S

T Co S Av I N G S

I N C R E A S E D C A S H F LoW

I N C R E A S E D P R o D U C T I v I T Y

W I R E U S AG E S Av I N G S

1312

ADVANCED WIRE TECHNoLoGIES

2012 2013

Thin structured wire CoO

Thin structured wire productivity

Diamond wire CoO

Diamond wire productivity

Increased by>20%

Reduced by2¢

per wafer Reduced by5–10%

Increased by50–100%

Diamond Wire

DIAMoND WIRE: CoNTINUoUS DEVELoPMENT FRoM APPLIED HCT

Driving the industry roadmap

Advanced wire technology promises to improve cut performance, increase productivity and substantially reduce slurry costs. However, implementation is a significant challenge: hardware, consumables and process must be fully optimized for yield, high productivity and low cost. Applied HCT is aggressively driving the roadmap to provide new wire technologies that are proven to deliver consistent, robust performance at a lower cost. Now, Applied HCT Squarer High Tension upgrade kit for Slurry and Diamond Wire is available.

DIAMoND WIRE BENEFITS• Water based coolant, no slurry

• Dramatic improvement in cut rate

• Reduced energy consumption

• Expected lower sub-surface damage

• Maintain cleaner environment

DIAMoND WIRE CHALLENGES• Quality of diamond wire

• Wire price and consumption

• Wire damage/breakage risk

• Coolant formulation, distribution and price

• Mono vs. multi dependence

Structured Wire

Baseline : Standard wire B5

ADVANCED SQUARER TECHNoLoGIES

APPLIED SQUARER HIGH TENSION UPGRADE FOR STRUCTURED AND DIAMOND WIRE:

UPGRADE KIT: MAXIMIZES PRODUCTIVITY WITHOUT COMPROMISING YIELD, SAME FOOTPRINT

The industry’s current best-practice for ingot squaring uses 300μm diameter structured wire at relatively low tension and table speed. Applied Materials is making available a High Tension upgrade kit that can withstand up to 300N wire tension, enabling higher productivity.

This state-of-the-art upgrade is retrofitable on all Applied HCT slurry and diamond wire (DW) Gen 5 squarers. It is suitable for both mono- and multi-crystalline silicon. The upgrade kit enables to 2 – 3x faster cutting than the conventional squaring process, resulting in 1.6 – 2.0x higher throughput on current equipment.

As the cost of DW comes down, customers can convert from conventional slurry to DW with minimum adjustments.

DW technology is recognized as an oppor-

tunity to improve squaring productivity and be more environmentally-friendly. It eliminates slurry, using water based coolant and enables faster cutting and lowering energy consumption, this technology simplifies the squaring process by eliminating the complexity and expense of slurry management.

Our advanced DW water coolant solution, with automated rinsing kit, eliminates excess kerf built-up while maintaining system cleanliness and overall performance. Quick and easy installation is low risk and delivers immediate benefits to our customers.

New Tension Arm with Pulley Tires:Designed for 300N wire tension, enables precision cuts with higher productivity. New long-life pulley tires minimize jumps and tire changes after each cutting cycle.

The High Tension upgrade enables to 2x (slurry) and

3x (DW) faster than the conventional squaring process,

resulting in 1.6x (slurry) and 2.0x (DW) higher throughput.

Tracking Unit:Non-conductive tracking unit with removable fingers reduce the risk of double-touch alarms and provide for easier maintenance.

Travel Unit:Redesigned travel unit features the 0° kit which greatly reduces wire breakage by preventing twisting, improved linear bearing alignment provides longer unit lifetime.

Fixed Pulley Racks with Cam Indexer:Minimizes pulley adjustments, improves wire alignment. New cam indexer enables fast and precise wire guide groove indexing.

Applied HCT Squarer

AN UPGRADE PATH TO IMMEDIATELY INCREASE PRODUCTIVITY

THE HIGH TENSIoN UPGRADE oFFERS A RoADMAP To FURTHER INCREASE PRoDUCTIVITy AND LoWER CoSTS

UPGRADE DELIVERS UP To 2X THRoUGHPUT

Slurry conventional

Slurry High Tension

1.6X

2X

Diamond WireHigh Tension

15

CoMPLETE SoLUTIoNCoMPLETE SoLUTIoN

AUTOMATION SOFTWARE

APPLIED GLOBAL SERVICES®

CROPPER

E3 AUTOMATION

SQUARER B5

SMARTFACTORY™

The Applied HCT Cropper cuts the tops and tails from crystalline silicon ingots at a high load capacity. It offers the same low kerf loss, high throughput and high reliability as the Applied HCT Squarers.

The Applied HCT Squarer is capable of squaring both mono and multi-crystalline silicon ingots with productivity of up to 80MW per year and low kerf loss (300–350μm wire). The system is upgradable to both diamond and thick structured wire.

The Applied HCT B5 wafering system cuts both monocrystalline and multi-crystalline silicon stock into ultra-thin wafers. The system provides best in class process yield with the industry’s highest productivity, and is a proven platform for advanced wire technologies.

The Applied Materials E3 equipment diagnostics platform connects to any solar tool, providing pre-integrated MES connectivity specifically designed for c-Si manufacturing. For example, the E3 SPC component automatically detects product quality variations, providing control charts, automatic notification and a corrective action plan to factory operators.

SmartFactory software is a scalable, affordable factory automation solution that improves tool utilization and increases throughput. By tracking work-in-progress (WIP) within a factory, SmartFactory assures high factory productivity.

Applied Global Services has the solar industry’s largest team of highly trained support experts, ready to help you get the most out of your tools. We also provide spare parts, parts refurbishment and system upgrades.

Ingot production

Squaring Cropping Wafering Grinding & Chamfer

Clean Metrology

A FULL RANGE OF SOLUTIONS FOR CRITICAL WAFERING STEPS

REDUCING THE TIME, CoST AND RISK FoR CUSToMERS• Advanced wafering equipment development• Process research and optimization • Wire technology development and performance validation• Wafer performance validation on full cell line• Application development for Customer demos and training specific solutions

STATE OF THE ART R&D TECHNoLoGy CAPABILITy

Wafering Apps and Cell Manufacturing Lab Xi’an ChinaProcess validation on wider data sets

Hardware reliability testing

Performance validation on cell line

Customer demos and training

Wafering Center of ExcellenceCheseaux, Switzerland New product and process development

Development and demonstration of advanced wire sawing processes

Engineering fast turn design for

manufacturability

R&D Lab for performance

validation

Manufacturing proximity to

engineering for fast cycles of learning

SWISS DESIGN, ACCELERATED LEARNING

R&D LEADERSHIP

Applied Materials3050 Bowers AvenueP.O. Box 58039Santa Clara, CA 95054-3299U.S.A.Tel: +1-408-727-5555

Applied Materials Route de Genève 421033 CheseauxSwitzerlandTel: 41 21 731 9100Fax: 41 21 731 9101

solar_marketing@amat.com

www.appliedmaterials.com/technologies/solar

© Applied Materials, Inc. 2012. Applied Materials, the Applied Materials logo, and other trademarks so designated or otherwise indicated as product names or services, are trademarks of Applied Materials, Inc. in the U.S. and other countries. All rights reserved. October, 2012.