Apple_iPod_Nano_152-00-050928-NTd

Apple iPod Nano4GB Portable Music Player

[email protected]

1.512.338.3600

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by Portelligent from generally available data. While Portelligent believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, Portelligent extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.

© 2005 by Portelligent Inc. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of Portelligent, Inc.

Report Contents:

• Detailed external and internal photos• Detailed step-by-step disassembly• Power measurements• Simplified Block Diagram• Circuit board & packaging metrics• Complete parts list & component count• Manufacturing cost analysis• Description of most interesting electronic

features and packaging concepts

Weight (with battery & Head Set):Product Description:

The iPod Nano is available in 2GB and 4GB capacity models, both using NAND flash memory for storage, so there is no skipping during playback of MP3, AAC and DRM audio file types. Music file storage capacity is 500 or 1,000 songs (on the 2.0 GB and 4.0 GB versions respectively in 128-Kbps AAC format). The Nano is capable of storing and viewing up to 25,000 "iPod Nano-viewable" photographs on its 1.5 inch color TFT screen. Other features include a contact list, calendar, and the ability to store and transfer data files in the same manner as a USB drive. PC connectivity is accomplished with a proprietary USB cable which also recharges the Nano’s non-removable 3.7V Li Ion Polymer battery. Battery life is claimed to be 14 hours of continuous music playback.

© Copyright 2005 Portelligent Inc., All Rights Reserved. Apple iPod Nano 152.00-050928-NTd – Comments about costing?

Email us at [email protected]

Table of Contents

Page Content Page Content

3 Executive Summary 41 Main PCB - 4GB Model (Side 2)4 Product Overview 42 Main PCB - 2GB Model (Side 2)

5 Accessories 43 Memory PCB - 4GB Model6 Packaging 45 Click Wheel PCB7 External Interface 46 Display Disassembled10 Battery Removed 48 Estimated Display Cost11 Estimated Battery Cost 49 Main PCB (IC Identification)12 Power Measurements 52 Memory PCB (IC Identification)18 Simplified Block Diagram 54 2GB Main PCB (Memory IC Identification)

19 Major Components 55 Click Wheel PCB (IC Identification)20 Component Weights 56 Main PCB (Module Identification)21 Component Arrangement 57 Substrate Data22 Dissasembly Photos 61 Integrated Circuit Components

25 Battery Removed 62 Modules & Odd Components

26 Main PCB Removed 63 Small Actives Components30 Display Removed 64 Passive Components31 Click Wheel Removed 65 Connectors

35 Memory PCB Removed – 4GB Model 66 Electronics Assemblies Metrics

37 Memory – 2GB Model 72 Non-Electronic & Assembly Cost38 Headphone Jack 73 Cost Summary39 Main PCB - 4GB Model (Side 1) 74 Cost Estimation Process Overview and Discussion40 Main PCB - 2GB Model (Side 1) 75 Metrics: Overview and Discussion



Executive SummaryThe iPod Nano was introduced in September 2005 as an “impossibly small” follow-on to the

ever-popular family of audio players from Apple. Weighing in at a modest 45 grams and consuming only 25cm2 of space (giving a product density almost twice that of water), the Nano comes in 2GB and 4GB capacity models, both based on NAND flash for storage. This teardown report focuses primarily on an analysis of the 4GB model but includes data from a 2GB model studied concurrently. Any slide not labeled as 2GB or 4GB should be considered as referring to the 4GB model, though differences were limited to the mounting of memory components (see photos).

In both units analyzed, Samsung was the provider of the NAND flash memory. The 4GB version utilized two 2GB packages (Samsung package #K9WAG08U1M) mounted on a separate plug-in daughter card with each of the two 48 pin TSSOP style packages containing 4 stacked 512MB NAND flash die (Samsung die #K9F4G08U0M). The 2GB model uses two 1GB NAND flash packages (Samsung #K9W8G08U1M), and unlike the 4GB model, packages were mounted directly on the main PCB. Interestingly – and somewhat to our surprise - each of the two 48 pin 1GB TSSOP packages also contained four older (2002) stacked NAND flash die (Samsung # K9F2G08U0M) with 256MB capacity. Though not observed first hand, others have also documented the use of Toshiba’s #TH58NVG3D4BTG00 1GB NAND package in the 2GB Nano models, pointing to at least a partial second-source strategy by Apple. Since memory sites in either configuration must support chip enables/selects for a four-die memory stack, the question remains – why a daughter card at all? Perhaps the most logical explanation comes from a sharp-eyed member of the Portelligent client community who suggested that postponement strategies for the more supply-constrained high-capacity devices used in the 4GB Nano were behind the design decision. By socketing the memory, Apple could complete the bulk of Nano board fabrication and plug in memory as a last-minute item, additionally improving the ability to take advantage of rapid NAND price declines, similar to the practice for desktop/notebook CPUs.

4GB Model

Daughter Card

2GB Model

The central processor of the Nano is a PortalPlayer custom variation (#PP5021), of the device used in previous hard-disk-based iPods, with LSI logic providing foundry services based on die markings. System memory for the PortalPlayer is provided by a Samsung 32MB Mobile SDRAM (#K4M56164), while instruction memory is provided by a Silicon Storage Technology (SST) 512KB flash device (#SST39WF400A). Because a direct NAND interface is not supported in the Portal Player chip, SST also provides a ATA flash disk interface chip (# SST55LD019), to translate the NAND into a standard hard disk interface. System power management is provided byPhilips (#PCF50607) and USB charge control comes from Linear Technologies’ #LTC4066. As with previous Portal Player-based iPods, the stereo CODEC / headphone amp are supplied by Wolfson Microelectronics (#WM8975G). In a departure from previous suppliers however, a Cypress ASIC (#CY8C21001A) was selected over the previous Synaptics solution for the capacitive scroll wheel interface controller. The Nano’s 1.5 inch color TFT LCD manufacturer was not able to be determined but the panel is driven by a Renesas single-chip TFT driver solution (#R61506A0). A simplified block diagram of the Nano is given on page 18.

With a stainless-steel lower tub married to a two-shot molded plastic top case, construction and mechanicals of the Nano follow previous hard-disk members of the family closely. The Nano takes simply takes the iconic iPod design to a new level of small.

Cost-of-goods-sold (COGS) was particularly difficult for the Nano as NAND flash dominates the BOM and Apple was widely rumored to be achieving spectacularly-discounted memory from Samsung. Because of the unique circumstances, we priced most of the system and “backed into” a NAND pricing which would still allow Apple to achieve roughly 40% gross margins on the end product, translating into approximately $26/GB - a steep discount on NAND from contract pricing estimates for the current time frame. Total COGS for the 4GB Nano using this method came to $149.54 for the Nano, with an additional $3.62 estimated for accessories. The 2GB model is presumed to take about $45 off of the total bill. For reference, the 4GB and 2GB models sell for $249 and $199 respectively at retail.

While margins may have slipped a bit with the Nano, both Apple and Samsung seemingly see the Nano as the ticket to maintain a tight lock on their respective markets. Whatever the case, consumers win with yet another cool widget on which to play their tunes.



Product Overview

2317

1361.90.063

$249.00$149.54$129.34

80.20%2.90%1.40%1.50%9.30%1.40%2.80%0.50%0.10%Body Volume (cm²) 25.2 Final Assembly

Weight (grams) 44.7 Mechanical (Non-Electronic)Product Dimensions (mm) 90.1x40x7.1 Card Test

Key Subsystems *Note: The total manufacturing cost does not include the cost of the accesssories shown on the following pages.

Main Display 132x176 (1.5 inch color TFT)Battery 3.7v Li Ion Polymer

System Metrics Display ModuleBattery Pack

SubstratesComponent Insertion

File Storage Device (USB Key)14hours of battery life

Integrated CircuitsModules, Discretes & Connectors

Contact ListCalendar

Music Storage Capacity 1000 songs @ 128Kbps % Total Manufacturing CostPhoto Storage Capacity 25,000 "iPod Nano viewable"

Product Features Retail PriceTotal Manufacturing Cost*

File Format MP3, AAC, DRM Electronics Cost

Origin China Substrate Tiling Density (Main BD)Official Release Date 9/7/2005 Cost MetricsProduct Memory 4GB

Product Name iPod Nano IC Package CountBrand Apple Die Area (mm²)

Product Description Complexity/Integration MetricsProduct Type Portable Music Player IC Die Count



Accessories

Total Estimated Cost of Accessories- $3.62

Packaging $0.90

Documentation $0.25USB Cable $0.65

Head Phones $1.65

Base Stand $0.12

Foam headphonecovers $0.05



Packaging



External Interface (controls)

Display

Headphones Port

Dock Connector Port

Menu

Previous/Rewind

Play/Pause

Next/Fast-Forward

Select

Click Wheel

Grid Scale = 1cm



External Interface (dimensions & controls)

Hold Switch

90.1mm

40.0mm

7.1mm

Grid Scale = 1cm



External Interface (dimensions & controls)

Headphones Port

Dock Connector Port

Grid Scale = 1cm



Battery Removed

Grid Scale = 1cm



Estimated Battery Cost

Amperex Technology Ltd

3.7Li Ion Polymer

20038.9 x 22.7 x 3.98

21.17.0

105.7Cell(s) $1.18Electronics $0.45Non-electronics $0.13Assembly $0.19Test $0.10Margin $0.00

$2.06

Pack Weight (grams)Wt. Energy Density (mWHrs/g)

Est'dCosts

Estimated Pack Price

TypeRating (mAHrs)Pack Size (mm)Vol. Energy Density (mWHrs/cc)

Battery PackBrandPart NumberVoltage

18- Mfr Unknown#UnknownMOSFET

17- Seiko Instruments#S-8261

Battery Protection IC

Grid Scale = 1cm

Note: 200mAh is estimated from size/weight and closest fit to Amperex standard cells, but exact capacity is unknown.



Power Measurements(Page 1 of 6)

Boot Up and Shut Down Sequence

1 Boot up sequence

Unit is idle with LCD backlight ON

LCD backlight turns OFF

Navigate menu to Solitaire, LCD backlight turns ON

Play Solitaire

Navigate back to main menu

Unit is idle with LCD backlight ON

LCD backlight turns off

Unit turns off due to inactivity

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0 50 100 150 200

Time (Seconds)

Pow

er (W

atts

)

1

2

3

4 5 6 78

9

2

3

4

5

6

7

8

9




Play AAC Music File Over Head PhonesMusic File Compression – iTunes High Quality (128kbps)

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0 10 20 30 40 50 60 70 80 90

Time (Seconds)

Pow

er (W

atts

)

1 Unit is idle with LCD backlight OFF

Navigate menu to Playlist, LCD backlight turns ON

Play music file with volume at 50%


Increase volume to 100%, LCD backlight turns ON


Flip Hold switch to lock position

1

2

34

5

6

7

2

Music is playing

3

4

5

6

7

NOTE: LCD backlight is set to turn off after 10 seconds of inactivity.




Play AAC Music File Over Head Phones and Play SolitaireMusic File Compression – iTunes High Quality (128kbps)






Navigate menu to Solitaire

Play Solitaire

Close Solitaire



0

0.05

0.1

0.15

0.2

0.25

0.3

0.35

0.4

0.45

0.5

0 20 40 60 80 100 120 140 160

Time (Seconds)

Pow

er (W

atts

)

1

2 3

4

56 7 8

910

2

3

4

5

6

Music is playing 7

8

9NOTE: LCD backlight is set to turn off after 10 seconds of inactivity.

10




Play MP3 Music File Over Head PhonesMusic File Compression - 128kbps, 44kHz, Stereo

0

0.05

0.1

0.15

0.2

0.25

0.3

0.35

0.4

0.45

0 10 20 30 40 50 60 70 80

Time (Seconds)

Pow

er (W

atts

)







Flip Hold switch to lock position1

2 3

45

6

7

Music is playing

2

3

4

5

6

7





Play MP3 Music File Over Head PhonesMusic File Compression - 320kbps, 44kHz, Stereo







Flip Hold switch to lock position0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0 10 20 30 40 50 60 70

Time (Seconds)

Pow

er (W

atts

)

1

2

3

4

56

7

2

Music is playing

3

4

5

6

7





Play WAV Music File Over Head PhonesMusic File Compression - PCM 44-100kHz_16 Bit, Stereo CD Quality

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0 20 40 60 80

Time (Seconds)

Pow

er (W

atts

)





Increase volume to 100%, LCD backlight comes ON



1

2

3

4

5

67

2

3

4

5

6

7




Simplified Block Diagram

Estimated block diagram based on observation of this specific product implementation, manufacturer’s data sheets where available, and best engineering judgment. Certain detains of the interface circuitry are not reflected in this block diagram.Partitioning and connectivity are speculative.

PiezoelectricSpeaker

Headphones

PortalPlayer#PP5021

Portal Player CPU

Samsung#K4M56164

Mobile SDRAM Memory - 32 MB

Linear Technology#LT4066

USB Power Management

Philips#PCF50607

Power Management

Cypress Semiconductor#CY8C21001A

Scroll Wheel Controller

Silicon Storage Technology #SST39WF400A

Flash Memory - 512 KB

Wolfson Microelectronics#WM8975G

Stereo Codec

SamsungPkg#K9WAG08U1M, Flash Memory - 2 GB

Die#1 P/N K9F4G08U0M, NAND Flash Memory - 512 MBDie#2 P/N K9F4G08U0M, NAND Flash Memory - 512 MBDie#3 P/N K9F4G08U0M, NAND Flash Memory - 512 MBDie#4 P/N K9F4G08U0M, NAND Flash Memory - 512 MB

Silicon Storage Technology#SST55LD019

ATA Flash Disk Controller

SamsungPkg#K9WAG08U1M, Flash Memory - 2 GB


Renesas#R61506A0

TFT Display Driver

* *

Scroll Wheel

National Semi#LM34910

Step Down Regulator Amperex Li-Ion Polymer Battery

Toshiba or Samsung 1GB stacked die packages replace for 2GB Nano

*

I/O Connector



Major Components

Rear Enclosure

Click Wheel Plate

Click Wheel PCB

Click Wheel

Select Button

Display

Battery

Main PCB

Memory PCB

Front Enclosure



Component Weights

Item Weight (grams)

Enclosures 20.0Rear Enclosure 14.1Front Enclosure 5.9

Circuit Boards 8.3Main PCB 6.0Memory PCB 1.7Click Wheel PCB 0.6

Battery 7.0 Display 4.5 Click Wheel & Plate 4.3 Screws 0.1

Total 72.5

Enclosures45.2%

Displays10.2%

Circuit Boards18.8%

Battery15.8%

Screws.2%

Click Wheel & Plate9.7%



Component Arrangement

Front Enclosure

Click Wheel

Select Button

Click Wheel PCB

Click Wheel Plate

Display

Memory PCB

Main PCB

Battery

Click Wheel Buzzer

Rear Enclosure



Rear Enclosure Removed

Grid Scale = 1cm

Piezoelectric Buzzer



Main PCB Mounting

Grid Scale = 1cm

The Main PCB is mounted to the Front Enclosure with three (3) screws



Main PCB Mounting

Grid Scale = 1cm



Battery Removed

Grounding Strap(grounds the click wheel, battery and Main PCB together

Grid Scale = 1cm

The battery is held in place with an adhesive and connected to the Main PCB via a hand-soldered connection.



Main PCB Removed

The Main PCB is held to the display by four (4) clips on the display

frame The fourth clip obstructed by the battery in this photo

Display

Click Wheel

Grid Scale = 1cm



Main PCB Removed

DisplayClick Wheel

Display Cable

Click Wheel Cable

Memory PCB

Grid Scale = 1cm

The memory PCB is located on the back side of the Main PCB in a daughter card configuration



Main PCB Removed

Grid Scale = 1cm

Display

Click WheelPlate

Display Cable

Click Wheel Cable

Display Cable Connector

Click Wheel Cable Connector

Both the Display and Click Wheel Cables are connected to the main PCB with Zero Insertion Force (ZIF) Connectors.



Main PCB Removed

Grid Scale = 1cm

Display

Click WheelPlate

Display Cable

Click Wheel Cable

Display Cable Connector

Click Wheel Cable Connector



Display Removed

The display is held in place with an adhesive film cut to the shape outlined in yellow.

Grid Scale = 1cm



Click Wheel Removed

The click wheel is held in place with an adhesive attached to the click

wheel plate

Grid Scale = 1cm



Click Wheel Disassembly

Click Wheel

Select Button

Click Wheel Substrate

Click Wheel Plate

Grid Scale = 1cm

The select button has a beveled edge which causes it to be slightly larger than the center hole in the click wheel. This allows for the select button to be held in place behind the click wheel.




Grid Scale = 1cm




Click Wheel

Select Button

Grid Scale = 1cm

The click wheel substrate is held to the click wheel with an adhesive.



Memory PCB Removed – 4GB Model

Grid Scale = 1cm

The memory PCB is held in place with two (2) screws and an adhesive



Memory PCB Removed – 4GB Model

Each side of the memory PCB has 1 TSSOP style package that is under filled

Grid Scale = 1cm



Memory – 2GB Model

Grid Scale = 1cm

The 2GB Model has two (2) TSSOP style memory packages soldered directly to the Main PCB. Both packages are underfilled.



Headphone Jack

1

2

3

Grid Scale = 1cm

The headphone jack is connected to a polyimide substrate, soldered to the main PCB and anchored with a screw for isolating mechanical stress from the associated solder joints.



Main PCB - 4GB Model (Side 1)

Grid Scale = 1cm




Grid Scale = 1cm



Memory PCB - 4GB Model (Side 1)

Grid Scale = 1cm



Memory PCB - 4GB Model (Side 2)

Grid Scale = 1cm



Click Wheel PCB

Grid Scale = 1cm



Display Disassembled

Grid Scale = 1cm



Display Disassembled



Estimated Display Cost

Unknown27V5H013138837.4 x 34.2 x 4.7

4.50View Size (mm) 21.8 x 29.5Type TFTColors ?Rows / Columns 132 / 176Backlighting Scheme 2 White LEDsPanel(s) $4.75Electronic Parts $3.37Circuit Assembly $0.26Non-Electronic Parts $0.94Final Assembly $0.02Test $0.55Markup $3.95

$13.84

Est'd Costs

Est'd Module Price

BrandPart NumberModule DimensionsWeight (grams)

Display Module

19- Renesas#R61506A0

TFT Display Driver

30.1mm

23.2mm

1.5 in38.1mm

Grid Scale = 1cm

Driver Die Manufacturer: RenesasPart# R61506A0

Dimensions:23.3 x 1.17 x 0.44



Main PCB (Side 1 IC Identification)

1- Silicon Storage Technology#SST55LD019

ATA Flash Disk Controller

2- Wolfson Microelectronics#WM8975G

Stereo Codec

3- National Semiconductor#LM34910

Step Down Switching Regulator

9- Philips#PCF50607

Power Management

7- Samsung#K4M56164

Mobile SDRAM Memory - 32 MB

Grid Scale = 1cm




5- TI#TPS61061LED Driver

4- Maxim#MAX8512

120mA LDO Regulator

8- Linear Technology#LTC4066

USB Power Management

6- PortalPlayer#PP5021

Portal Player CPU

Grid Scale = 1cm




10- TI#SN74LVC1G32

2-input Positive OR Gate

11- TI#SN74LVC1G14

Schmitt-Trigger Inverter

12- Silicon Storage Technology #SST39WF400A

Flash Memory - 512 KB

Grid Scale = 1cm



Memory PCB (Side 1 IC Identification)

13- SamsungPkg#K9WAG08U1M, Flash Memory - 2 GB


Grid Scale = 1cm



Memory PCB (Side 2 IC Identification)

14- SamsungPkg#K9WAG08U1M, Flash Memory - 2 GB


Grid Scale = 1cm



2GB Main PCB (Memory Identification)

20- SamsungPkg#K9W8G08U1M, Flash Memory - 1 GB


21- SamsungPkg#K9W8G08U1M, Flash Memory - 1 GB


Grid Scale = 1cm



Click Wheel PCB (IC Identification)

15- Cypress Semiconductor#CY8C21001A

Click Wheel Controller

16- Mitsumi#MM3004A

CMOS Voltage Regulator

Grid Scale = 1cm



Main PCB (Side 1 Module Identification)

1- Mfr.#Unknown

Crystal: CeramicSize (mm) = 4.16x1.51x.97

Connections = 2

2- Mfr.#Unknown

Crystal: MetalSize (mm) = 3.16x2.47x.78

Connections = 4

3- Mitsumi#Unknown

Switch Micro: SMTSize (mm) = 7.21x4.66x1.02

Connections = 3

Grid Scale = 1cm



Substrate Data(Page 1 of 3)

Main PCBBoard Area: 21.7cm²

87.2mm3

7.6

mm

Grid Scale = 1cm

AssemblyName Manufacturer Mfg. Technology Core

Material Area(cm²) Layers

Min.TracePitch(mm)

Min.TraceWidth(mm)

ThruViaLand Dia

(mm)

ThruViaHole Dia

(mm)

BlindViaLand Dia

(mm)

BlindViaHole Dia

(mm)

Thickness(mm)

RoutingDensity

EstimatedCosts

Main PCB 1298MD BuildUp FR4 21.7 4 0.20 0.10 0.40 0.20 0.30 0.10 0.6 45.7 1.48$

Substrates




Memory PCBBoard Area: 5.3cm²

40.6mm

12.9mm

Grid Scale = 1cm



Min.TracePitch(mm)

Min.TraceWidth(mm)

ThruViaLand Dia

(mm)

ThruViaHole Dia

(mm)

BlindViaLand Dia

(mm)

BlindViaHole Dia

(mm)

Thickness(mm)

RoutingDensity

EstimatedCosts

Memory PCB 820-1856-A Conventional, 0.30FR4 5.3 2 0.20 0.10 0.50 0.20 0.5 68.0 0.11$

Substrates




Click Wheel PCBBoard Area: 8.1cm²

51.2mm

32.9mm

28.8mm 10m

m

Grid Scale = 1cm



Min.TracePitch(mm)

Min.TraceWidth(mm)

ThruViaLand Dia

(mm)

ThruViaHole Dia

(mm)

BlindViaLand Dia

(mm)

BlindViaHole Dia

(mm)

Thickness(mm)

RoutingDensity

EstimatedCosts

Click Wheel PCB18 NKC 0532 Flex,PI with Vias Polyimide 8.1 2 0.20 0.10 0.50 0.15 0.3 15.5 0.49$

Substrates



Substrate Cross Section(Page 1 of )

Main PCBTotal Area = 21.7cm²

Via-in-pad at Portal Player BGA chip site

Construction:6-layer build-up -

• Four layer drilled core fabrication followed by hole fill and microvia layers top and bottom• Via-in-pad design utilized

• OPC Board markings suggest Oriental Printed Circuits [Meadville Technologies Group] as manufacturer



Integrated Circuit Components

Brand Name Part Number Form Pin Count Pitch(mm)

Length(mm)

Width(mm)

Height(mm) Brand Name Part Number Description Length

(mm)Width(mm) Each Total

1.0 1 Silicon Storage Technology (SST) SST55LD019 PBGA (UF) 84 0.50 6.08 6.04 0.56 Silicon Storage Technology (SST) SST55LD019 ATA Flash Disk Controller 4.32 4.18 $ 1.619 $ 1.619 2.0 1 Wolfson Microelectronics WM8975G QFN 32 0.50 5.02 5.06 0.94 Wolfson Microelectronics WM8975G Stereo CODEC 3.25 3.25 $ 1.223 $ 1.223 3.0 1 National Semiconductor LM34910 LLP 10 0.80 4.01 4.03 0.82 National Semiconductor LM34910 Step Down Switching Regulator 2.52 1.84 $ 0.360 $ 0.360 4.0 1 Maxim MAX8512 SOT-353 5 0.65 1.97 1.17 1.20 Maxim MAX8512 120mA LDO Regulator 0.77 0.73 $ 0.101 $ 0.101 5.0 1 TI TPS61061 Flip Chip 8 0.50 1.49 1.53 0.40 TI TPS61061 LED Driver 1.48 1.49 $ 0.160 $ 0.160 6.0 1 PortalPlayer PP5021 PBGA (UF) 188 0.50 9.02 9.03 1.13 PortalPlayer / LSI Logic PP5021 Portal Player CPU 4.67 4.56 $ 5.110 $ 5.110 7.0 1 Samsung K4M56164 PBGA (UF) 54 0.80 11.04 8.00 0.86 Samsung K4M56164 Mobile SDRAM Memory - 32 MB 8.29 5.76 $ 2.620 $ 2.620 8.0 1 Linear Technology LTC4066 QFN 24 0.50 4.00 4.00 0.76 Linear Technology LTC4066 USB Power Management 2.10 1.80 $ 0.420 $ 0.420 9.0 1 Philips PCF50607 QFN 48 0.40 6.03 6.02 0.77 Philips PCF50607 Power Management 3.97 3.67 $ 1.337 $ 1.337

10.0 2 TI SN74LVC1G32 Flip Chip (UF) 5 0.50 1.41 1.05 0.34 TI SN74LVC1G32 2-input Positive OR Gate 1.41 1.05 $ 0.083 $ 0.166 11.0 1 TI SN74LVC1G14 Flip Chip (UF) 5 0.50 1.47 1.05 0.34 TI SN74LVC1G14 Schmitt-Trigger Inverter 1.47 1.05 $ 0.070 $ 0.070 12.0 1 Silicon Storage Technology (SST) SST39WF400A PBGA 48 0.50 6.01 4.02 0.53 Silicon Storage Technology (SST) SST39WF400A Flash Memory - 512 KB 4.32 2.13 $ 0.758 $ 0.758

13.0 Samsung K9F4G08U0M NAND Flash Memory - 512 MB 14.08 10.82 $ 13.150 $ 13.150 13.1 Samsung K9F4G08U0M NAND Flash Memory - 512 MB 14.08 10.82 $ 13.150 $ 13.150 13.2 Samsung K9F4G08U0M NAND Flash Memory - 512 MB 14.08 10.82 $ 13.150 $ 13.150 13.3 Samsung K9F4G08U0M NAND Flash Memory - 512 MB 14.08 10.82 $ 13.150 $ 13.150

14.0 Samsung K9F4G08U0M NAND Flash Memory - 512 MB 14.08 10.82 $ 13.150 $ 13.150 14.1 Samsung K9F4G08U0M NAND Flash Memory - 512 MB 14.08 10.82 $ 13.150 $ 13.150 14.2 Samsung K9F4G08U0M NAND Flash Memory - 512 MB 14.08 10.82 $ 13.150 $ 13.150 14.3 Samsung K9F4G08U0M NAND Flash Memory - 512 MB 14.08 10.82 $ 13.150 $ 13.150

15.0 1 Cypress Semiconductor CY8C21001A ? QFN 24 0.50 4.71 4.68 0.91 Cypress Semiconductor CY8C21001A ? Click Wheel Controller 2.90 1.90 $ 0.630 $ 0.630 16.0 1 Mitsumi MM3004A SOT-343 4 1.27 2.08 1.33 0.95 Mitsumi MM3004A CMOS Voltage Regulator 0.88 0.62 $ 0.092 $ 0.092

Totals 17 640 $119.87

Memory PCB, Side 1

Memory PCB, Side 2

1

Main PCB, Side 1

Main PCB, Side 2

Samsung K9WAG08U1M TSOP II (UF) 48 0.50

Click Wheel PCB, Side 1

18.32 12.21 1.10

Samsung1 K9WAG08U1M TSOP II (UF) 48 0.50 18.31 12.20 1.19

Package Info Die Info Estimated Costs

Ref. # PkgQtyLocation

2GB Nano Memory IC BOMFor comparison only – Cost is not included

Brand Name Part Number Form Pin Count Pitch(mm)

Length(mm)

Width(mm)

Height(mm) Brand Name Part Number Description Length

(mm)Width(mm) Each Total

20.0 Samsung K9F2G08U0M Flash Memory - 256 MB 16.10 9.09 $ 7.550 $ 7.550 20.1 Samsung K9F2G08U0M Flash Memory - 256 MB 16.10 9.09 $ 7.550 $ 7.550 20.2 Samsung K9F2G08U0M Flash Memory - 256 MB 16.10 9.09 $ 7.550 $ 7.550 20.3 Samsung K9F2G08U0M Flash Memory - 256 MB 16.10 9.09 $ 7.550 $ 7.550 21.0 Samsung K9F2G08U0M Flash Memory - 256 MB 16.10 9.09 $ 7.550 $ 7.550 21.1 Samsung K9F2G08U0M Flash Memory - 256 MB 16.10 9.09 $ 7.550 $ 7.550 21.2 Samsung K9F2G08U0M Flash Memory - 256 MB 16.10 9.09 $ 7.550 $ 7.550 21.3 Samsung K9F2G08U0M Flash Memory - 256 MB 16.10 9.09 $ 7.550 $ 7.550

Totals 2 96 $60.40

18.37 12.21 1.09

2GB Main PCB, Side 1

TSOP II (UF) 48 0.50

18.37 12.21 1.09TSOP II (UF) 48 0.501 Samsung K9W8G08U1M

1 Samsung K9W8G08U1M

Estimated Costs

Die Info

Ref. # PkgQtyLocation

Package Info



Modules & Odd Components

Pin Count

Length(mm)

Width(mm)

Height(mm) Each Total

1 Mitsumi Unknown Switch Micro: SMT 3 7.21 4.66 1.02 $ 0.120 $ 0.120 1 Unknown T24D 63B Crystal: Metal 4 3.16 2.47 0.78 $ 0.350 $ 0.350 1 Unknown Unknown Crystal: Ceramic 2 4.16 1.51 0.97 $ 0.280 $ 0.280

Main PCB, Side 2 1 Unknown Unknown Piezo Buzzer: Click Wheel Buzzer 2 15.00 15.00 0.70 $ 0.120 $ 0.120 TOTALS 4 11 $0.87

Qty Brand Name Part Number

Main PCB, Side 1

PackageEstimated

CostsDescriptionLocation



Small Actives Components

Form Top Marking

Pin Count

Length(mm)

Width(mm) Each Total

1 Diode SOD-123f F04 53 2 3.70 1.60 $0.050 $0.0501 Transistor SOT-416 1ES3 3 1.60 1.60 $0.060 $0.0601 Transistor SOT-363 LO4 6 1.52 1.14 $0.060 $0.060

4 Transistor SOT-353 566 5 1.60 1.17 $0.060 $0.2401 Transistor SOT-363 TU7 6 1.58 1.15 $0.060 $0.0604 Transistor SOT-363 L02 6 1.65 1.18 $0.060 $0.2401 Transistor SOT-363 L04 6 1.65 1.21 $0.060 $0.0601 Transistor SOT-363 TX6 6 1.58 1.16 $0.060 $0.060

TOTALS 14 73 $0.83

Location

Main PCB, Side 1

Main PCB, Side 2

Functional DescriptionQty

PackageEstimated

Costs



Passive Components

Form Pin Count Length(mm)

Width(mm) Each Total

6 Capacitor Ceramic Chip 0201 2 0.71 0.25 $0.005 $0.03014 Resistor Chip 0201 2 0.71 0.25 $0.001 $0.01813 Capacitor Ceramic Chip 0402 2 1.02 0.51 $0.005 $0.0652 Ferrite Chip 0402 2 1.02 0.51 $0.010 $0.0202 Resistor Chip 0603 2 1.52 0.76 $0.001 $0.0037 Capacitor Ceramic Chip 0603 2 1.52 0.76 $0.005 $0.0351 Ferrite Chip 0603 2 1.52 0.76 $0.016 $0.0168 Capacitor Ceramic Chip 0805 2 2.03 1.27 $0.005 $0.0401 Capacitor Ceramic Chip 1206 2 3.05 1.52 $0.005 $0.0052 Capacitor Ceramic Chip 1210 2 3.05 2.54 $0.010 $0.0201 Capacitor Tantalum 0603 2 1.70 0.90 $0.080 $0.0801 Capacitor Tantalum 1510 2 3.67 2.80 $0.100 $0.1002 Coil 1210 2 3.56 2.45 $0.060 $0.1201 Coil 1210 2 3.56 2.45 $0.070 $0.0701 Coil 1818 2 4.60 4.60 $0.090 $0.090

55 Capacitor Ceramic Chip 0201 2 0.71 0.25 $0.005 $0.27584 Resistor Chip 0201 2 0.71 0.25 $0.001 $0.10919 Capacitor Ceramic Chip 0402 2 1.02 0.51 $0.005 $0.09519 Resistor Chip 0402 2 1.02 0.51 $0.001 $0.02519 Ferrite Chip 0402 2 1.02 0.51 $0.010 $0.1901 Fuse 2 1.00 0.50 $0.040 $0.0401 Ferrite Chip Array 0402x2 4 1.02 1.02 $0.020 $0.0201 Resistor Chip Array 03015x4 8 2.03 0.76 $0.005 $0.005

Memory PCB, Side 1 3 Capacitor Ceramic Chip 0402 2 1.02 0.51 $0.005 $0.015

Memory PCB, Side 2 1 Capacitor Ceramic Chip 0402 2 1.02 0.51 $0.005 $0.005TOTALS 265 538 $1.49

Main PCB, Side 1

Main PCB, Side 2

Qty Functional DescriptionPackage

Estimated Costs

Location



Connectors

Pin Count

Pitch(mm)

Length(mm)

Width(mm)

Height(mm) Each Total

1 Unknown Bd to Bd: Memory PCB Connector 34 0.50 11.51 4.78 1.17 $0.220 $0.2201 Unknown Connector: Display 22 0.65 8.87 4.04 1.34 $0.204 $0.2041 Unknown Connector: Click Wheel 8 0.65 4.62 3.89 0.62 $0.106 $0.1062 Unknown Connector: Stand-off 1 0.00 2.45 2.45 1.24 $0.010 $0.0201 Unknown Connector: USB Sync 30 0.50 21.90 5.10 2.95 $0.220 $0.2201 Foxconn Jack: Headphone 4 1.65 12.05 10.81 4.75 $0.190 $0.190

Main PCB, Side 2 2 Unknown Connector: Click Wheel Buzzer 1 0.00 4.70 1.52 1.07 $0.010 $0.020

Memory PCB, Side 2 1 Unknown Bd to Bd: Male 34 0.50 9.89 2.50 0.99 $0.220 $0.220TOTALS 10 136 $1.20

Location

Main PCB, Side 1

Estimated Costs

Qty Brand Name FormPackage



Electronics Assemblies Metrics

NOTE: Occasional inconsistencies in totals may be present due to rounding error.

Ass

embl

y N

ame

Subs

trat

e A

rea

(sq.

cm)

Met

al L

ayer

s

Circ

uit A

rea

(sq.

cm)

Rou

ting

Den

sity

(cm

of r

outin

g pe

r sq

.cm

of s

ubst

rate

)

Num

ber o

fC

ompo

nent

s

Num

ber o

fC

onne

ctio

ns

Com

pone

nt D

ensi

ty(C

ompo

nent

s/sq

.cm

)

Con

nect

ion

Den

sity

(Con

nect

ions

/sq.

cm)

Avg

. Pin

Cou

nt

Ass

embl

y W

eigh

t(g

ram

s)

Click Wheel PCB 8.1 2 16.2 15.5 6 36 0.7 4.4 6.0 0.6Main PCB 21.7 4 86.8 45.7 301 1232 13.9 56.8 4.1 6Memory PCB 5.3 2 10.6 68.0 7 138 1.3 26.0 19.7 1.8System Totals 35.1 8 113.60 314 1406 8.9 40.1 4.5 8.4

Electronic Assembly Metrics





Ass

embl

y N

ame

Tota

l

Inte

grat

ed C

ircui

ts

Mod

ular

& O

dd F

orm

C

ompo

nent

s

Smal

l Act

ive

Com

pone

nts

Pass

ive

Com

pone

nts

Con

nect

or C

ompo

nent

s

Subs

trat

es

Inse

rtio

n

Car

d Te

st

Click Wheel PCB 1.32$ 0.72$ -$ -$ 0.02$ -$ 0.49$ 0.04$ 0.05$ Main PCB 22.25$ 13.94$ 0.87$ 0.83$ 1.47$ 0.98$ 1.48$ 2.08$ 0.60$ Memory PCB 105.77$ 105.20$ -$ -$ 0.02$ 0.22$ 0.11$ 0.17$ 0.05$ System Totals 129.34$ 119.87$ 0.87$ 0.83$ 1.51$ 1.20$ 2.07$ 2.29$ 0.70$

Electronics Costs by Assembly





Ass

embl

y N

ame

Opp

ortu

nitie

s

IC P

acka

ge C

ount

IC C

onne

ctio

ns

Mod

ular

/Odd

For

m

Com

pone

nts

Mod

ular

/Odd

For

m

Com

pone

nt C

onne

ctio

ns

Smal

l Act

ive

Com

pone

nts

Smal

l Act

ive

Com

pone

nt

Con

nect

ions

Pass

ive

Com

pone

nts

Pass

ive

Com

pone

nt

Con

nect

ions

Con

nect

ors

Con

nect

or C

onne

ctio

ns

Click Wheel PCB 42 2 28 0 0 0 0 4 8 0 0Main PCB 1533 13 516 4 11 14 73 261 530 9 102Memory PCB 145 2 96 0 0 0 0 4 8 1 34System Totals 1720 17 640 4 11 14 73 269 546 10 136

Counts by Assembly





Ass

embl

y N

ame

IC D

ie C

ount

IC P

acka

ge C

ount

Num

ber o

f Pac

kage

Con

nect

ions

Die

Are

a(s

q.m

m)

Subs

trat

e Ti

ling

Den

sity

(die

are

a / s

ubst

rate

are

a)

Pack

age

Are

a(s

q.m

m)

Die

Are

a/Pa

ckag

e A

rea

Rat

io

Pack

age

Con

nect

ions

per s

q.cm

of P

acka

ge A

rea

Vola

tile

Mem

ory

(KB

ytes

)

Non

-Vol

atile

Mem

ory

(KB

ytes

)

Click Wheel PCB 2 2 28 6.1 0.007 24.8 0.24 112.9 0 0Main PCB 13 13 516 137.1 0.063 333.6 0.41 154.7 32000 512Memory PCB 8 2 96 1218.8 2.300 1788.3 0.68 5.4 0 4096000System Totals 23 17 640 1361.9 2146.7 0.63 29.8 32000 4096512

IC Metrics



Electronics Assemblies MetricsCost Break Down

Estimated Cost of Electronics

$129.34

Card Test1%

IC Components92%

Insertion2%

Substrates1%

Connectors1%

Passive Components

1%

Small Active Components

1%Modules & Odd

Components1%




Electronics Assemblies MetricsIC Cost Distribution By Manufacturers

Philips1.1%

Cypress Semiconductor

0.5%

Wolfson Microelectronics

1.0%

SST2.0%

PortalPlayer4.3%

Samsung90.0%

Other1.1%

Manufacturer Cost

Samsung $107.82PortalPlayer $5.11Silicon Storage Technology (SST) $2.38Philips $1.34Wolfson Microelectronics $1.22Cypress Semiconductor $0.63Other Linear Technology $0.42 TI $0.40 National Semiconductor $0.36 Maxim $0.10 Microchip $0.09Total $119.87




Non-Electronic & Assembly Cost

Estimated Mechanical (Non-Electronic) Cost

Subsystem Qty Description Fabrication Process Material Dimensions (mm)Weight (grams)

Est'd Cost Each

Est'dExtended Cost

1 Front Enclosure Molded - Two shot resin Plastic 90 x 39.9 x 5.06 5.2 $0.800 $0.8001 Display Adhesive Die Cut Tape 35.4 x 36.3 x 0.2 0.1 $0.020 $0.0201 Dock Connector Port Machined Aluminum 34.7 x 6.75 x 4.8 0.6 $0.750 $0.7501 Dock Connector Port Adhesive die cut plastic 25 x 4 x 0.1 0.1 $0.005 $0.0051 Rear Enclosure Stamped + Tack-weld Spring Finger Rail Stainless Steel 89.9 x 39.8 x 4.5 14.0 $1.850 $1.8501 Click Wheel Plate Stamped Metal 35.7 x 41.1 x 0.7 3.6 $0.100 $0.1002 Click Wheel Adhesive Die Cut Plastic 35.7 x 41.1 x 0.2 0.1 $0.005 $0.0101 Click Wheel Molded - Two-shot resin Plastic 33.9 x 33.9 x 1.35 0.4 $0.220 $0.2201 Select Button Molded Plastic 13.6 x 13.6 x 1.96 0.1 $0.050 $0.0501 PCB & Rear Enclosure insulator Die Cut Plastic 86.2 x 35.3 x 0.5 0.1 $0.050 $0.0504 Insulator Tape Die Cut Plastic 19 x 8 x 0.3 0.1 $0.050 $0.2002 EMI Insulator Die Cut EMI Gasket Material 3 x 4 x 1.5 0.1 $0.020 $0.0405 Gasket Die Cut Foam Rubber 8 x 3.5 x 1.2 0.1 $0.005 $0.0251 Ground Tape Die Cut Copper 10.3 x 1.7 x 0.68 0.1 $0.020 $0.0206 Screws Machined Metal 3.58 x 2.55 x 3.58 0.0 $0.005 $0.030

$4.17Estimated Cost

Main

Estimated Final Assembly Labor Cost

Assembly Location China

Total Number of Parts 35

Cost/Hour $1.00

Assembly Time (Seconds) 472

Assembly Cost $0.13



Cost Summary

NOTE:An Additional

Cost of$3.62for the

SupportingMaterials

Page 5

Total Cost Notes

• Estimated final assembly cost includes labor only

• Total Cost does not include:

Non-recurring, R&D, G&A, IP licensing fees/royalties, software, sales & marketing, distribution

• Assumes fully scaled production

Electronic Assemblies86.5%

MechanicalNon-Electronic

2.8%

Display9.3%

Battery Pack1.4%

Final Assembly0.1%

129.34$ 13.84$ 4.17$ 2.06$ 0.13$

149.54$ Total

DisplayMechanical (Non-Electronic)Battery PackFinal Assembly

Total CostElectronic Assemblies

(For 4GB Nano)



Cost Estimation ProcessOverview and Discussion

Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time.

Portelligent’s philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, Portelligent does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge.

Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources.

Costs of injection molded plastics, sheet metal parts, mechanical enclosures and fasteners are modeled using Boothroyd Dewhurst design-for-manufacturing (DFM) software. Each mechanical element is entered into the BD DFM software package, providing measured/observed attributes of geometry, weight, size, thickness, material, and secondary operations from which the BD DFM software derives an estimated cost of manufacture. Other system items such as optics, antennae, batteries, and so on are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost.

The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), printed circuit boards, electronics assembly, mechanical/housing elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate.

We believe our cost estimates generally fall within ±15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the Portelligent cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce.

Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input.



Metrics: Overview and DiscussionIn our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either “raw” measured data or ratios of these measured data sets.

Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine.Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology.Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting.Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces).Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the ‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits.Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic.Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances.Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is a empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity.

Apple_iPod_Nano_152-00-050928-NTd

Documents

Transcript of Apple_iPod_Nano_152-00-050928-NTd