Chipper SMD-500

OPERATING AND MAINTENANCE MANUALAutomated Production Equipment, Inc. (A.P.E.)

2 North Blackwater Lane Key Largo, FL 33037 USA

Tel. (305) 451-4722 Fax (305) 451-3374

Internet: apecorp.com Email: Sales@ape.com

Introduction

The A.P.E. Chipper SMD-500 is

a compact, benchtop hot air based rework system designed for the removal and replacement of most surface mount (SMT) electronic components. Like its larger counterpart, the Chipmaster SMD-1000, the Chipper combines Low Temperature, low velocity High Power heating to allow rework at much lower temperatures than other hot air systems. The Chipper uses the same heater and blower assembly as the more advanced Chipmaster, only with a simple heating control system and fewer "bells and whistles". Although the Chipper is a more economical system than the Chipmaster, it is built with the same high-quality and reliable components used in the Chipmaster.

With proper care and usage, the Chipper will provide years of reliable service. This manual is designed to not only teach you how to use the Chipper properly, but to care for and maintain the unit as well for optimum results.

Features of the Chipper

Low Temperature Operation: Accurate closed-loop temperature monitoring of a patented high-power heater reduces rework temperatures below 232C (450F).

Automatic Lift-off: An automatic vacuum pick-up assembly lifts the part from the board once eutectic temperature has been reached and continues to hold the part during the cooling cycle.

Board Holder: A standard 8”x 8” (203 X 203mm) board holder is included for most board sizes, adjustable in all axis. A board release mechanism allows each board to snap into place and be quickly released when required. In addition, an “on demand” Z-axis clearance piston avoiding profile obstructions, when locating to or moving from the nozzle.

Cool Operation: Once the system is switched on, the controller carries out a “self test” and the internal blower motor engages to provide a constant stream of high volume, low velocity cool air, that will not disturb or create solder balls within the rework area.

Nozzle Selection: An appropriate size nozzle is easily installed and the correct temperature selected. The work piece is mounted in the board holder, and the nozzle placed over the component allowing a gap of 1/8” - 3/8” (3 - 9mm) above the body of the component.

Bench top System: The Chipper is a complete benchtop rework system, not a Handpiece on an arbor press. It includes nozzles, and a board holder for complete hands-off hot air soldering and desoldering.

Setting Up The Chipper

Before opening the shipping box, ensure that the box is in an upright position, and undamaged. Carefully open the box and remove the top Styrofoam panel. Immediately below this is a molded Styrofoam tray containing parts and accessories for the Chipper. Remove this tray and set it aside for the moment. This tray contains several small parts and accessories, so be sure not to lose anything. The bottom molded Styrofoam tray contains the Chipper, and possibly other boxed accessories according to what has been ordered. If there are any damages or shortages, please report them to APE immediately at (305) 451-4722. Email sales@apecorp.com

Remove the Chipper from the box and set on a firm and level work surface near a power outlet with a 3-prong grounded plug. Do not attach the power cord until all other accessories have been assembled and attached .

The component pickup vacuum plunger is shipped in the top molded Styrofoam compartment. A small clear plastic bag will also contain extra vacuum cups and a spare black rubber plunger cap. These items are spare parts and should be inventoried and stored. The plunger assembly will have a black cap on one end and a red rubber vacuum clip on the other. It will also include a pickup spring on the barrel of the plunger. Remove the plunger assembly from its wrapper and place it in the metal sleeve in the Chipper’s head. Cycle the plunger assembly several times to ensure that the movement is smooth and friction free. (NOTE: the spring should be on top of the sleeve). Depress the plunger and attach the black rubber hose that runs along the side of the Chipper’s heat screen, and is loosely tucked into one of the screen openings.

Next, unwrap the foot pedal assembly and place it on the floor. Take the loose end of the foot pedal with the DIN connector and attach it to the correct receptacle on the back of the Chipper. Do not force the plug. It only goes in one way and is keyed so that insertion orientation is easily determined.

Now, take the three prong power cord, and attach it to the back of the Chipper. Before supplying power to the Chipper, make sure the green plastic main power switch is in the off position. Also locate the red plastic vacuum activator switch, and ensure that it is in the off position. Plug the machine into a regulated power supply, and you are ready to operate the machine.

The Chipper is supplied with a standard board holder for up to 8” x 8” (203 x 203mm) boards. The Holder is shipped in two parts, each individually wrapped and located in the upper Styrofoam tray. The Z-axis piston (black cylindrical) attaches to the flat black base plate. The holder frame itself is golden in color (anodized) and attaches to the Z-axis piston via a single hex head machine bolt (9/64”). The holder frame should be installed with the small black knob (fork adjustment) on top, and the large black knob (snap board gripper) in the front.

The Chipper is simple and flexible, a complete bench top repair system. The Chipper uses a spring-loaded vacuum pick-up tube to automatically remove the component when it reaches eutectic temperature. The spring has been carefully chosen to be both powerful enough to lift heavy parts, and gentle enough not to lift pads from the PCB. The black sleeve that the pick up tube passes through can be raised or lowered to adjust the tension on the spring. Three sizes of vacuum cups are available for the pick up assembly; 0.20”, 0.30”, and 0.52”. (5, 7.6 & 13.2mm)

The Board support is provided by an innovative fork and cylinder assembly. The forks are adjustable in width with a simple thumb screw. Loosen the thumb screw on top of the back fork, and adjust the width until it is slightly smaller than the board, then retighten the screw. Once the

board width has been set, the forks can be opened by depressing the black knob on the front of the board holder to open the forks, and releasing it when the board is in place.

The cylinder that supports the forks has a lock lever that can be loosened to set the height of the board and then tightened to lock in position. The top of the cylinder is spring loaded so that it can be depressed to a allow the boa rd to clear any tall components in order to position the board under the nozzle.

The Heat Delivery System

The Chipper has a robust heat delivery system. A resistive element heats the air, which is driven by a maintenance free, sealed heavy duty brushless motor-driven blower that delivers 12.7 c.f.m. of

high volume air through the heater assembly and out through the nozzles to the workpiece. The heater is a 1200 watt coil type heater that runs the length of the heater tube. Because of the low temperatures at which the Chipper properly operates, heater life is extended.

Temperature Control System

The Chipper uses a closed-loop control system for "real time" temperature measurement and control, via a type “K” thermocouple, linked to the Controller, extending along the length of the heater tube. The sensor end of the thermocouple is floating free inside the nozzle block of the machine to keep the nozzle block itself from giving the thermocouple false readings. When the machine is calibrated at the factory this thermocouple is strategically placed to ensure accurate board temperatures coinciding with the controller set point temperature.

The temperature controller used in the Chipper is an Autotune PID (Proportional Integral Derivative) digital controller, which has been Factory set to provide optimum performance in reworking SMT Components, it is not recommended to alter the conditioning of the controller. See Appendix A, for information on the Autotune PID Controller and calibration of the Chipper.

Preparing for Rework

Nozzle Selection: The Chipper uses directed forced heated convection to heat a component. A component must be heated sufficiently that its solder connections melt, either for removal or attachment. Heated air is directed at the component and its solder connections via an interchangeable metal nozzle. It is important to choose the correct nozzle for each component heated, to maximize the effectiveness of heating, and to minimize the possibility of heating adjacent components.

The following figures may help you choose the correct size nozzle:

Figure A shows a nozzle too large for the component. Adjacent areas are being heated that should not necessarily be, including small chip components. Because the volume of air flowing to the device has also been decreased due to the larger size, cycle times may also be extended.

Figure B shows a too-small nozzle being used. Only the center of the top of the component is being effectively heated. Air flows across the flat surface of the component, heating adjacent components. The device being heated is not being uniformly heated across its total area. As a result, heating time is prolonged because heat must migrate through the component itself to achieve reflow temperatures at the lead attachment area.

Figure C shows the correct nozzle being used. It is slightly larger than the outside edges of the leads of the component, but not so large as to interfere with adjacent components.

BOARD HOLDER: To adjust the board holder for your work, observe the following steps:

First, inspect the PCB to determine the best orientation for the board in the forks of the holder. The location of the part to be reworked, as well as any obstructions on the side of the board, should be

taken into consideration. It may also be convenient to have the path of the nozzle to the rework site be free of any tall or easily damaged devices.

Loosen the adjustable (rear) fork arm using the small thumb screw on top of the fork arm. Locate the front of the PCB in the "V" groove of the fixed fork, and slide the movable fork arm back until it is slightly{ 1 /8” (3mm)} smaller than the width of the boa rd. Then securely tighten the adjustable fork. Firmly grasp the fork assembly with one hand and push in the large plastic knob on the front of the Board Holder to open the forks. Place the rear of the PCB in the movable fork "V" groove, and release the black plastic knob, securing the board in the board holder. Ensure that there is not too much tension on the board, which could resulting in "bowing" of the board. If this happens, loosen the adjustable arm until the warp disappears.

Once the board has been positioned in the holder, the correct height of the board and nozzle must be determined. The spring-loaded “plunger” action of the top of the cylinder is designed to allow components with heat sinks on top or with special accessibility problems to be positioned under the nozzle, without adjusting the hard stop on the piston. This ensures process repeatability, because the process height is always the same.

The correct height of the board, however, must first be adjusted. This is accomplished by mounting the board in the holder, and sliding the stand and board under the Chipper. Depress the plunger top and move the target component directly under the appropriate nozzle. Release the plunger slowly, allowing the board to rise closer to the nozzle. The spacing of the component to the nozzle should be from 1/8” to 3/8” (3 - 9.52mm). If there is too much space between the nozzle and the component, loosen the friction lever on the side of the column and adjust until the component is directly under the nozzle with only a small space for the heated air to escape. The following illustrations show how to select the correct nozzle height:

Figure 1 Shows the nozzle located much too close to the component. The convection cannot escape the nozzle, and fresh heated air cannot reach the component. This results in the creation of a thermal "wall" inside the nozzle, slowing down the heating process. This also backs the air up inside the heater tube, and can result in reduced heater life .

Figure 2 Shows the nozzle located too far away from the component. Too large a gap between the device and the nozzle will allow the hot air to escape from under the nozzle, and dissipate before it reaches the component. With heating efficiency lost, it will greatly increase the time needed to reach the appropriate rework temperature. In addition, this creates a laminar or horizontal flow of hot air across the circuit board, heating adjacent components than should not be heated. This, in combination with the extended reflow cycle time, could result in reflowing (melting the solder on) large sections of the PCB.

Figure 3 Shows the correct height of the board in relation to the nozzle. This correct distance of 1/8” to 3/8” (3 - 9.52mm) allows room for the heated gas to escape without unduly heating nearby areas.

THE VACUUM PICKUP: The spring on the vacuum pickup assembly has been carefully selected to provide enough force to lift most components off the board, without too much force which could result in lifted pads. To adjust the tension or height of the pickup assembly, use the set screw located on the front of the nozzle block (0.050” Allen head) which can be loosened. This allows the pickup tube to be raised and lowered for proper lifting distance and pressure. If the component gently lifts off the board, then tension and height have been correctly set. If the component doesn’t lift or springs off the board, then these should be adjusted. Since most components are roughly the same height, the need for adjustment is typically rare.

Next, choose the appropriate vacuum cup for the pickup assembly. APE currently offers three sizes of vacuum cups. The size of your component and the nozzle determines the size of vacuum cup needed. The larger the cup diameter, the greater the lifting power, but the larger the surface area on the component needed to accommodate the cup. When the vacuum cup is placed on the barb at the end of the pickup assembly, ensure that it is firmly seated, but not pushed on so far as to allow the barb to protrude below the surface of the pad. The standard sizes of the vacuum cups offered by APE are 0.200”, 0.300”, and 0.520”, (5, 7.6 & 13.2mm). The vacuum cup is molded of a high temperature silicone, but it will nonetheless wear out and crack over time with frequent usage. This is the only wear item on the Chipper.

THE CONTROLLER: The next step in setting up the machine for your process is to determine the correct temperature setting. Note: 110V Chipper machines are supplied with temperature scale set to Fahrenheit, 220V machines are set to Celsius. The Chipper uses a unique closed loop thermal process to allow rework at much lower temperatures than normally required. This loop consists of a heater / blower assembly to provide heat, a thermocouple to sense the heating, and a controller to interpret the thermocouple readings, and control the demand upon the heater. The controller is a digital PID controller, which provides quick and accurate response to heating requirements. Due to the high power of the Chipper heater, one is able to provide sufficient thermal energy to the process area without increasing the air temperature beyond safe ranges. The normal operating range of the Chipper is from 218C to 232C, (425F. to 450F)., but special situations may require either higher or lower settings. Soft plastic parts that melt at temperatures above 218C, (425F) can be reworked on the Chipper by lowering the temperature to 215, (420F). Processes with heavy thermal demands may require the temperature to be increased to higher levels.

In all cases, due to the automatic liftoff capabilities of the Chipper, the actual temperature of the component reworked is very close to the melting point of the solder. Because the spring loaded vacuum picks up the component as soon as the solder is reflowed, the temperature setpoint is a reference rather than an absolute. Due to the closed loop characteristics of the Chipper however, the board temperature will not exceed the temperature setting.

The Rework ProcedureIn the previous chapter, we discussed how to choose the correct nozzle, and correctly position the PCB in the board holder. We will now step you through a typical rework application. The basic steps of this procedure are generally applicable to any process, however, certain auxiliary steps may be prudent in some cases.

Before applying heat to the part, slide the board holder out from under the heater nozzle and carefully inspect the area surrounding the component, and the area underneath the work area to determine if there are any devices that may be damaged by the heat. If necessary, either remove these devices, or, by using small strips of metal, shield them from the direct air flow of the nozzle. Although the CHIPPER minimizes heating of adjacent components, there may be situations where delicate components are located in close proximity to a device being reworked.

Next, use the APE flux paste (8100-1310) from the SMT tool kit (not included), and cover the lead area of the component to be reworked with a fine bead of flux paste. You may also use other types of flux for this operation, but we recommend using the APE flux paste that has been specially formulated for no-clean rework situations. Depress the plunger on the board holder and center the component under the rework head. You are now ready to begin the rework process.

Select the proper temperature for the component, {suggested 232 C, ( 450F )}. Activate the vacuum by turning on the Vacuum Pump switch on the front of the Chipper, and lower the pick up assembly so that it contacts the component and is held in place by the vacuum.

Now depress and hold down the foot pedal to begin the heating cycle. Keep your foot on the pedal until the spring lifts the part from the board ( Removal time is dependent on component and PCB mass, average 1.5 to 2.5 minutes) . Remove pressure from the Foot Pedal when the device lifts off and use any simple Timer device (example a Wrist Watch) to note the time to remove. This will enable a repeatable removal and placement process.

When the part is removed from the board, depress the pickup assembly, turn off the vacuum, and use tweezers to remove the part from the vacuum pad. Since the component is removed at eutectic there will be icicles on the PCB. To smooth out these pads for easier component replacement, flux the pad array, place the area under the reflow nozzle, and depress the heater pedal until the pads have reflowed and smoothed out. Clean this pad area with the APE pad prep pen (8100-1350) or similar cleaner and use the APE Antistatic wipe (8200-1500) to remove the residue.

After some practice with the Chipper, the operator may choose to use an alternative method for removing parts. By not attaching the vacuum pickup assembly to the part for reflow, the operator can observe the part as it is being reflowed, activate the vacuum, and carefully lower it until it touches the component, then let it rise slowly. This reflow method of component removal eliminates the step of smoothing out the solder icicles since the removal happens at reflow, not at eutectic.

Reinstalling the new component is as simple as removing the old one. Since taking the old one off and noting the time, it provided an accurate gauge of how long it takes to reflow the part, reinstalling will require only a slightly longer heating time of 10 -15 seconds. First, clean the pad area using the method discussed above. Next, dispense a fine bead of flux paste on the pad area. The flux paste creates a tacky surface to help hold the part in place on the slightly rounded pads, in addition to evaporating more slowly to increase solderability. Place the new component on the pad array, and using tweezers and/or dental probes, align the component leads to the solder pads. A magnifier or microscope may be used to assist in alignment of the component.

Once the part has been located, depress the plunger on the board holder assembly and move the part under the reflow nozzle. Depress the foot pedal and hold it until the solder has reflowed. Sometimes, lightly tapping the board holder will break the surface tension of the solder and a allow the component to self-align. The low temperature operation of the Chipper enhances the self-centering properties of the molten solder on the pads (The surface tension of the molten solder helps the component align itself). Remove the board from under the reflow nozzle and allow it to cool. Then inspect the part for errors and perform any necessary cleaning.

Appendix A Autotune PID Controller

1.0 Overview

1.1 The Autotune is a Proportional Integral Derivative (PID) Controller, which has been Factory set in all fields to provide a linear ramp temperature profile, averaging 7 degrees a second. The ramp rate will provide an optimum reflow time, well within component specifications for limiting thermal stress. It should also be noted that the Chipper is providing reflow at Low Temperature, reducing stress even further.

1.2 To avoid complications in incorrectly altering the Factory set parameters, the Controller “LOCK” feature is enabled, however it is still possible to change Set Point temperature as necessary. To disable the “LOCK” feature, see paragraph 6.0 of this Appendix.

1.3 The Autotune does not need to be adjusted and will accommodate all SMT devices, with the exception of BGA’s, CSP’s and Micro BGA components, which should be reworked with alternative APE Rework machines, call 305-451-4722 for information.

1.4 Although it is not necessary to change any of the configuration settings, information as to the Menus available and their defaults is listed below. We have not detailed an explanation on each PID field, as this is outside the necessary scope of operating the Chipper.

2. 0 Set Point Temperature

2.1 The most common requirement to access the Controller will be to change the Set Point Temperature. Set Point Temperature is the highest (Reflow) temperature that the Chipper will cycle to during the rework operation. For most applications this will be 232C (450F) but may be adjusted either up or down. Attention should be drawn to the user, that most solder manufacturers recommend at least 10C (50F) above eutectic condition (183C, 361F) for reflow, (193C, 411F minimum). IMPORTANT: CHECK WHETHER THE CHIPPER HAS A TEMPERATURE SCALE SET IN CELSIUS OR FAHRENHEIT BEFORE CHANGING TEMPERATURE.

3.0 Change of Celsius to Fahrenheit, Temperature Scale.

3.1 The Chipper is supplied with temperature measured in Fahrenheit for110V systems and Celsius for 220V systems. The Controller may be configured to the users preference by following the procedure in 7.0 (after following paragraph 6.0 “Lock” disable):

4. Menus

4.1 The Autotune Controller has three (3) levels of menus, each being accessed in ascending order, usually these Levels do not concern the user, unless it is required to disable the “Lock” feature and/or to change the temperature scale. These menus include special Tuning features and are factory set and should not be altered. Level 2, however, provides access to Temperature Scale and therefore may require access to change from Celsius to Fahrenheit, before this is carried out the “Lock” feature in Level 3 must be disabled.

4.2 When reading the labels for the fields, note that Higher and Lower Case are used to describe the characters, this protocol is due to the limited ability of an eight segment display. In describing these fields below we have used Higher Case for all characters to avoid confusion.

5.0 Change of Temperature Up or Down

IMPORTANT: CHECK WHETHER THE CHIPPER HAS A TEMPERATURE SCALE SET IN CELSIUS OR FAHRENHEIT BEFORE CHANGING TEMPERATURE

Change Temperature Down

5.1 Press * and keys together for two (2) seconds to begin decreasing temperature. When the desired temperature is reached, release the keys.

Change Temperature Up

5.1 Press * and keys together for two (2) seconds to begin increasing temperature. When the desired temperature is reached, release the keys.

6.0 Disabling “Lock” feature:

To access the First Menu:

a. Press keys for three (3) seconds to enter “LEVEL”1

b. Display will read “TUNE”

c. Press key once to access “LEVEL” field.

d. Change “LEVEL” 1 to “LEVEL” 3 by pressing * and key twice.

e. Press key eleven (11) times stepping through each field until field “VER” is reached.

f. Press keys together and hold for fifteen (15) seconds, enter “LOCK” sub menu.

g. Press * and step three times from “ALL” (Lock out ALL menus) to “NONE”.

h. Press and keys together for three (3) seconds to exit Menu.

7.0 Change of Celsius to Fahrenheit, Temperature Scale (after disabling the “LOCK” feature in “LEVEL 3, see paragraph 6.0).

To access the First Menu:

a. Press keys for three (3) seconds to enter “LEVEL”1

b. Display will read “TUNE”

c. Press key once to access “LEVEL” field.

d. Change “LEVEL” 1 to “LEVEL” 2 by pressing * and key once.

e. Press key eleven (11) times stepping through each field until field “UNIT” is reached.

f. Press * and keys once to change from C to F, or * and keys to change from F to C.

g. Press and keys together for three (3) seconds to exit Menu.

8.0 Enabling “Lock” feature:

To access the First Menu:

a. Press keys for three (3) seconds to enter “LEVEL”1

b. Display will read “TUNE”

c. Press key once to access “LEVEL” field.

d. Change “LEVEL” 1 to “LEVEL” 3 by pressing * and key twice.

e. Press key eleven (11) times stepping through each field until field “VER” is reached.

f. Press keys together and hold for fifteen (15) seconds, enter “LOCK” sub menu.

g. Press * and step three times from “NONE” (No lock) to “ALL”.(Lock out all menus).

Press and keys together for three (3) seconds to exit Menu

9.0 Menu Field Default Values

9.1 These values are detailed in order to correct any data, which may have been entered erroneously by the user. They are not meant to serve as an invitation to change any Factory set value, however should experimentation be desired, it is possible using an external Profiler, such as the APE Kic Temperature Profile system, which can accurately register and display the effect of the changes made. In the opinion of the manufacturer any alteration in the Factory set profile is unnecessary.

9.2 “LEVEL” 1

To access “LEVEL” 1, press keys for three (3) seconds, display will read “TUNE”, index to each field in turn by pressing key. There will be a short pause in each field to display the value:

TUNE OFF

BAND 50

INT.T 0.5

DER.T 1

DAC 4.5

CYC.T 0.4

OFST 0

SP.LY OFF

SET.2 0

BND.2 2.0

CYC.2 ON/OFF

9.3 “LEVEL” 2

If currently in “LEVEL” 1 Menu and at “CYC.2” field, press key constantly until “LEVEL” field is seen, (First field in Menu). Press * and keys to change from “LEVEL” 1 to “LEVEL” 2.

SP1.P 0

HAND OFF

PL.I 100

PL.2 100

SP2.A NONE

SP2.B NONE

DISP 1

HI.SC 600

LO.SC 0

INPT TC.Y ( K Thermocouple selected)

UNIT C or F

9.4 “LEVEL” 3

If currently in “LEVEL” 2 Menu and at “UNIT” field, press key constantly until “LEVEL” field is seen, (First field in Menu). Press * and keys to change from “LEVEL” 2 to “LEVEL” 3.

SP1.D 55D

SP2.D RLY

BURN UP.SC

REU.D 1R.2D

REU.L 1N.2N

SPAN 0.0

ZERO 0.0

CHEK OFF

READ VAR

DATA CTA

VER 3

RSET NONE

Press and keys together for three (3) seconds to exit Menu.

10.0 Calibration

10.1 The Chipper includes a K thermocouple, which provides a close loop sense to the Autotune Controller. The K thermocouple is a highly sensitive sensor, which needs to be correctly positioned within the Nozzle Block of the Chipper to ensure an accurate response.

10.2 The Chipper is factory calibrated to provide a correct correlation of the sensor measurement to the Autotune display reading. If by any mischance the thermocouple is dislodged from it’s correct location the following simple procedure can be followed to relocate the position.

10.3 The procedure uses the exact melting point of eutectic solder (183C, 361F) as a calibration medium to check that the Controller display registers the correct temperature as the solder begins to melt i.e. (183C, 361F).

10.4 Calibration Steps:

a. Place a 0.80” x 0.80” Nozzle APE # 8100-0000-44 in position in the Nozzle Block.

b. Use a small 3” x 3” piece of junk PCB material and place in the Board Holder.

c. Tightly Roll a 6 inch length of thin gauge eutectic solder, or a size that when rolled into a ball is approx. 5/16” in size.

d. Place the solder roll on the junk PCB to become a Test Rig.

e. Position the Test Rig under the nozzle allowing approx. 3/8” gap between the PCB and the Nozzle, this should be sufficient to allow the user to slide the board holder and the test rig from under the nozzle during the calibration process.

f. Set the Controller to 177C, (350F), see 5.0, and run to temperature using the Foot Pedal. When at temperature note the time and add 20 seconds to ensure saturation, quickly check that the solder coil is still intact and return to position under the nozzle, the solder should not melt at this temperature.

g. With the Foot Pedal still depressed change the temperature to 183C (361F), when at temperature , add 20 seconds and the solder should be showing the first sign of melting. It is permitted to continue to 190C (375F) before total melt down. Within this measurement the machine is calibrated. A 3-5% Hot Air difference, is an aggregate of the PID holding pattern and the distance from the thermocouple location and the point of contact on the board.

h. Reflow before 177C, (350F)

If the solder starts reflowing at or before177C, (350F), the test must be stopped (foot off the pedal) and the thermocouple wire adjusted. The wire runs along the bottom of the Heater Tube, entering the Nozzle Block through a small aperture in it’s rear. Adjust the wire by using a pair of smooth snipe nose pliers to grip the wire before the entry aperture to the Nozzle Block and move (pull) the thermocouple INTO the Nozzle Block by 1/16”. Be careful not to over adjust and pull too much, which would reverse the problem. Run the test again.

i. Reflow after 190C (375F)

If the solder does not melt at 190C (375F) or over, the test must be stopped (foot off the pedal) and the thermocouple wire adjusted. The wire runs along the bottom of the Heater Tube, entering the Nozzle Block through a small aperture in it’s rear. Adjust the wire by using a pair of smooth snipe nose pliers to grip the wire before the entry aperture to the Nozzle Block and move (push) the thermocouple OUT OF the Nozzle Block, TOWARDS THE REAR OF THE MACHINE by 1/16”. Be careful not to over adjust and push too much, which would reverse the problem. Run the test again.

j. Using this simple test procedure it is possible to obtain very accurate results, however if a Temperature Meter is available the Meter probe can be inserted between the Nozzle and the PCB instead of the solder coil and the test conducted in the manner described above. IMPORTANT: IT IS NECSSARY TO ATTENUATE THE THERMAL ENVIORNMENT BY USING THE 0.80” x 0.80” NOZZLE AND A PCB UNDER THE NOZZLE WHEN CONDUCTING THERMAL MEASUREMENTS.