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“Non-traditional methods of material properties and defect ...€¦ · Workshop on Defect...
Transcript of “Non-traditional methods of material properties and defect ...€¦ · Workshop on Defect...
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
“Non-traditional methods of material properties and defect parameters
measurement
Juozas Vaitkus on behalf of a few Vilnius groups
Vilnius University, Lithuania
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Outline:• Definition of aims• Photoconductivity kinetics• Free carrier diffusion and capture process
measurement • Photo-Hall and magnetoresistance• Photo-ionization spectroscopy
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
A few general words:
• Profile of our group “self-formed” 40 years ago as: “measurement of properties of high resistivity and wide bandgap materials”.
• These materials have many different type of local levels and, usually, different non-uniformities.
• Therefore it was developed or modified a few of methods for exclusion or activation of a definite level or non-uniformity.
• The modification of methods was oriented on:– Exclusion of an origins of nonlinearities;– Avoiding an influence of contacts;– Creation of scenario that allows to understand the process.
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Free carrier kinetics
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Direct measurement of trapping and recombination:photoconductivity decay (short pulse excitation)
1 23
4
EC
EV
EM
ER
1 τM=1/γnM(M-m)2 τN=1/γnMΝCM
ΘI = 1/[γnMΝCM + γnM(M-m)]ΘII = 1/[γnMΝCM]
3 τR=1/γnR(R-r)4 τP=1/γpR r
( ) ⎟⎟⎠
⎞⎜⎜⎝
⎛
+−
+= 20
01nN
mM
CMRasymp ττ
Measurement of this dependence:
E.Gaubas talk!
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Limitations and possibilities
• Excitation pulse duration: ~10 ps, ~10 ns and longer pulses or mosulated dc light.
• Generation of carriers – direct band-band or extrinsic (via deep levels or from/to deep level)
• Problems appears in high quality samples due to influence of the recombination at the surface (if the diffusion is significant)
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Transient gratings
• Free carriers change the refractive index of semiconductor, therefore if the excitation is by the light interference pattern, then semiconductor become as a periodical grating.
• The incident or probe beam pulse will diffract in it.
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Transient gratings - contactless, non-destructive semiconductor
homogeneity controlparameters (D, S, τ and etc.) measurement method
Iλ sampleI-1
I
Λ I+1
I0
Also allows to indicate the internal electric field related to impurities if the optical symmetry allows the effect.
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Two step excitation spectroscopy: generation of carriers via deep centers
0 50 100 150 200 250 300
10-5
10-4
10-3
10-2
10-1
Ι0 = 0.7 mJ/cm2
-p 17 (irradiated) -p 17 Reference
Ι0 = 0.7 mJ/cm2
-p 17 (irradiated) -p 17 Reference
Diff
. Eff
icie
ncy
a. u
.
Temperature, K
SiG.G.Macfarlane et al, J.Phys.Chem.Solids8,(1959) 388-392.
Identification if the centre is localized or Hydrogen-type
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Free carrier lifetime (trapping time and diffusion) measurement by transient grating method
Iλ sampleI-1
I
Λ I+1
I0
DRG
⋅Λ⋅
+= 2
2411 πττ
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
0 500 1000 1500
10-2
10-1
100
0 500 1000 1500Delay (ps)
Λ = 4.0 µmτ
G = 1900 ps
Λ = 4.4 µmτ
G = 740 ps
Λ = 4.9 µmτ
G = 480 ps
Λ = 5.8 µmτ
G = 400 ps
Λ = 9.5 µmτ
G = 300 ps
Iexcitation = 5 mJ/cm2
Diff
ract
ion
effic
ienc
y (a
. u.)
Delay (ps)
Λ = 4.0 µmτ
G = 1310 ps
Λ = 4.4 µmτ
G = 640 ps
Λ = 4.9 µmτ
G = 440 ps
Λ = 5.8 µmτ
G = 370 ps
Λ = 9.5 µmτ
G = 300 ps
Si (CE2419) Si (CH2259)Iexcitation = 5 mJ/cm2
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
200 400 600 800 1000 1200
0,1
1
200 400 600 800 1000 1200
0,1
1
CE 2419, ( phi_p [cm-2] 1.06 x 1014), τR > 15 ns
CE 2437, ( phi_p [cm-2] 1.84 x 1014), τR > 15 ns
CE 2458, ( phi_p [cm-2] 4.25 x 1014), τR = 11 ns
Delay time (ps)
Diff
ract
ion
effic
ienc
y. (a
. u.)
Delay time (ps)
CE 2459, ( phi_p [cm-2] 6.36 x 1014), τR = 9 ns CH 2259, ( phi_p [cm-2] 9.80 x 1014), τR = 6 ns
CH 2253, ( phi_p [cm-2] 6.36 x 1014), τR = 7 ns
CH 2237, ( phi_p [cm-2] 4.25 x 1014), τR = 9 ns
CH 2219, ( phi_p [cm-2] 1.84 x 1014), τR > 15 ns
CH 2210, ( phi_p [cm-2] 1.06 x 1014), τR > 15 ns
I0 = 0.2 mJ/cm2, grating period Λ = 60 µm (decay time ~ recombination (trapping) time)
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
200 300 400 500 600 700
0,01
0,1
1
200 300 400 500 600 700 800 900 1000 1100 1200
1E-3
0,01
0,1
1
CE 2419,( phi_p [cm-2] 1.06 x 1014),τG = 370 ps, D = 17.6 cm2/s
CE 2437,( phi_p [cm-2] 1.84 x 1014),τG = 395 ps, D = 16.5 cm2/s
CE 2458,( phi_p [cm-2] 4.25 x 1014),τG = 390 ps, D = 16.3 cm2/s
Delay time (ps)
Diff
ract
ion
effic
ienc
y. (a
. u.)
Delay time (ps)
CE 2459,( phi_p [cm-2] 6.36 x 1014),τG = 390 ps, D = 16.2 cm2/s
I0 = 0.12 mJ/cm2 I0 = 0.25 mJ/cm2
CE 2419,( phi_p [cm-2] 1.06 x 1014),τ
G = 450 ps, D = 14.4 cm2/s
CE 2437,( phi_p [cm-2] 1.84 x 1014),τG = 455 ps, D = 14.2 cm2/s
CE 2458,( phi_p [cm-2] 4.25 x 1014),τG = 445 ps, D = 14.2 cm2/s
CE 2459,( phi_p [cm-2] 6.36 x 1014),τG = 440 ps, D = 14.2 cm2/s
200 300 400 500 600 700 800
1E-3
0,01
0,1
1
100 200 300 400 500 600 700 800 900 1000 1100 1200 1300
1E-3
0,01
0,1
1
I0 = 0.12 mJ/cm2
Delay time (ps)
Diff
ract
ion
effic
ienc
y. (a
. u.)
Delay time (ps)
I0 = 0.25 mJ/cm2
CH 2259,( phi_p [cm-2] 9.80 x 1014),τG = 380 ps, D = 16.2 cm2/s
CH 2253,( phi_p [cm-2] 6.36 x 1014),τG = 360 ps, D = 17.4 cm2/s
CH 2237,( phi_p [cm-2] 4.25 x 1014),τG = 385 ps, D = 16.4 cm2/s
CH 2219,( phi_p [cm-2] 1.84 x 1014),τG = 400 ps, D = 16.2 cm2/s
CH 2210,( phi_p [cm-2] 1.06 x 1014),τG = 400 ps, D = 16.3 cm2/s
CH 2259,( phi_p [cm-2] 9.80 x 1014),τG = 440 ps, D = 13.9 cm2/s
CH 2253,( phi_p [cm-2] 6.36 x 1014),τG = 430 ps, D = 14.4 cm2/s
CH 2237,( phi_p [cm-2] 4.25 x 1014),τG = 445 ps, D = 14.1 cm2/s
CH 2219,( phi_p [cm-2] 1.84 x 1014),τG = 470 ps, D = 13.7 cm2/s
CH 2210,( phi_p [cm-2] 1.06 x 1014),τG = 460 ps, D = 14.1 cm2/s
Rτ
Grating period Λ = 5 µm (diffusion influence).
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
1 2 3 4 5 60
1
2
3
1/τ G
(ps-1
)
1/Λ (µm-2)
Si (CE2419) D = 13.6 cm2/s (∆D = 0.1 cm2/s) τR > 30 ns
Si (CH2259) D = 12.5 cm2/s (∆D = 0.1 cm2/s) τR = 5.7 ns (∆τR = 0.3 ns)
Iexcitation = 5 mJ/cm2
Excitation Si (CE2419) Si (CE2459) Si (CH2259) (mJ/cm2) 1.06 1014cm-2 6.36 1014cm-2 9.80 1014cm-2
0.7 D (cm2/s) 16 (± 0.1) 15.7 (± 0.1) 17.2 (± 0.1)
τR (ns) > 30 >30 20 (± 2)
5.0 D (cm2/s) 13.6 (± 0.1) 13.1 (± 0.1) 12.5 (± 0.3)
τR (ns) > 30 > 30 5.7 (± 0.3)
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Photo-Hall effect• An influence of impurities on free
carrier mobility.• The indications of scattering on
impurities, clusters and etc.:– According the scattering
coefficient value– According the different
dependence on temperature
I
t
Digital processing:High input impedance, small capacitance !
BMagnetic field up to 2 T
Intense laser pulse
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
( ) x
iiii
iiiii
H BEttne
tAtnetE
∑∑ −
=)()(
)()()1( 2
µ
µ
( ) ( )[ ] wEBrBtEEwtU HHHH ⋅∆=−=∆ µ0
1. Basic relationships:
(3)(5)
(6)
(1)
(2)
(4)
Transient Photo-Hall and photo-magnetoresistance effects
2
2
><><
=ττ m
Hr
2)()( BTt MB
B µρρ
=∆
4
223
><><−>><<
=m
mmmMT
ττττ
eff
m
me ><
=τµ
( ) ( ) ( )tNtvStH
βµµ
+=0
11∑ ><>=<
i imm ττ11
Matthiessen’s rule
(7) (8)
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Transient Photo-Hall and photo-magnetoresistance effects
2. Practical considerations:
( ) ( ) ( )tNtvStH
βµµ
+=0
11
( ) ( )
10
0000 1111
−
⎟⎟⎠
⎞⎜⎜⎝
⎛∆±
+=⎟⎟⎠
⎞⎜⎜⎝
⎛−∆=−=∆
H
H
H UU
vUwBE
tvSNNSSN
βµµβ ( )1
01−
⎟⎟⎠
⎞⎜⎜⎝
⎛∆
+=H
H
UUtY
( ) ( )[ ] ( )tYconsttNtS ⋅=∆ (12)
(9)(10) (11)
(8)
Further analyze depends on the model and a number of re-chargeable centers
23
.. ~ Tiionµ
( ) 12/1*2−
⎥⎦⎤
⎢⎣⎡= SkTmNe ss
µ
1. ~ −Tbarrµ
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Photo-Hall effect
• If the sample has micro/nano non-uniformities, then the signal is more complex dependent on parameters.
(That should be in a case of change of conductivity type)
• It changes an effective active volume therefore changes the effective Hall-mobility (a lot of models, quite complicated expressions)
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Photo-ionization spectrumMeasurement of photoconductivity (possible effect also: quenching of
photoconductivity, if additional excitation is used), photo-voltage, short circuit current.
Possible regime of constant signal: varying of excitation. It excludes different non-linearities.
Determination of defect optical ionization energy.
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Si photoconductivity spectrumSample from Hamburg:
Example of data from literature:
0,8 1,0 1,2 1,4 1,6 1,810-9
10-8
10-7
10-6
I (A
)
ε (eV)
Si CH22374,25e+14pT=79K
2006.06.24
Workshop on Defect Analysis in Radiation Damaged Silicon Detectors, Hamburg, 23./24. August 2006 J. Vaitkus
Conclusions:
1. It exists additional (time consuming)methods for carrier capture processes and defect parameters measurement.2. It is most important to have the samples, that are interesting for supplier.
Thank You for Your attention!