1 © 2015 ANSYS, Inc. 15/01/2018 ANSYS Confidential

ANSYS Tool and Product Summary – R19

ANSYS

PLATFORM

Enterprise Solutions

EKM

Enterprise Cloud

NICE DCV

Optimization

DesignXplorer

RBF Morph

Topology Optimization

optiSLang

Optimetrics

High Performance Computing

HPC

Parametric Pack

DSO

Core Technologies

Workbench

Electronics Desktop

ACT

Geometry

MCAD Interfaces

Alinks for EDA

SYSTEMS

Simplorer

SCADE Suite

SCADE Display

SCADE Architect

SCADE LifeCycle

SCADE Test

SEMICONDUCTOR

PathFinder

PowerArtist

Redhawk

Totem

SeaScape

ELECTRONICS

Signal and Power

Integrity

HFSS

SIwave

Q3D Extractor

SI Option

Electronics Cooling

Icepak

High Frequency

HFSS

RF Option (EMIT included)

SBR+

Electromechanical

Maxwell

RMxprt

PExprt

Q3D Extractor

FLUIDS

Fluent

CFX

FENSAP-ICE

Chemkin-Pro

Model Fuel Library

Forte

Polyflow

Turbogrid

BladeModeler

STRUCTURES

Mechanical

Composite PrepPost

Rigid Body Dynamics

Autodyn

LS-Dyna

nCode

3D DESIGN

AIM

Discovery Live

SpaceClaim

Ensight

ANSYS Tool Hierarchy

15/01/2018 2

Developed by ANSYS Inc. Software Partners

Click to learn more about each tool

ANSYS Maxwellis a low frequency electromagnetic FEA tool for modeling electro-mechanical devices such as motors, transformers, sensors, permanent-magnet devices and more.

Engineers are able to take advantage of its multiple solver algorithms to account for things like saturation, eddy currents, hysteresis and more.

ANSYS Maxwell also has a direct two-way integration with ANSYS Mechanical and the ANSYS CFD tools to accurately predict the thermal footprint of these electromechanical devices.

Go back to Hierarchy ELECTRONICS

ANSYS HFSSis the industry standard for modeling high frequency electromagnetic fields. It has the ability to solve a wide range of applications from RF and microwave to high-speed PCB and package signals.

HFSS is a full-wave solver that also has dynamic links to circuit simulators that allow engineers to virtually prototype antennas, high-speed interconnects, RF components and wearables.

It even has built in tools for biomedical applications including the full representation of the human body to account for both shielding concerns and signal interruption concerns.

HFSS also has strong connections with ANSYS Mechanical, ANSYS Icepack and others to account for both thermal and structural effects.

Go back to Hierarchy ELECTRONICS

ANSYS RF OptionThe ANSYS RF Option adds RF circuit analysis to HFSS. This allows engineers to design RF and microwave circuits as well as complete end-to-end wireless communication systems based on standard communications schemes.

Perform linear and nonlinear simulations such as harmonic balance, filter synthesis plus DC, transient, oscillator, and load-pull/envelope analyses.

RF Option also includes a 2.5-D planar MoM solver and ANSYS EMIT for predicting RF co-site interference.

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Transponder HFSS RFID

RF Input Backscattering ModulationFull System Analysis

Transient Oscillator Circuit Load-pull Analysis

ELECTRONICS

ANSYS SBR+is a powerful tool that lets engineers determine the performance of installed antennas in large structures and domains.

Because of its ray tracing techniques, ANSYS SBR+ provides the far field radiation pattern significantly faster than traditional FEA. It even has capabilities to model multiple bounces, edge diffraction and creeping wave rays.

Engineers designing or implementing antennas on cars, planes, ships, towers and other large domain problems can leverage the hybrid solver techniques that ANSYS SBR+ has within ANSYS HFSS for a more accurate solution

Go back to Hierarchy ELECTRONICS

ANSYS EMITenables the complex calculation of RF cosite interference (RFI). It manages all of the data including input data, models and more to enable engineers to understand potential issues that may arise during deployment.

EMIT enables users to define bandwidth and spectral profiles to more accurately predict behavior. It also has a built in library of radios and RF components that users can leverage.

EMIT is also able to be coupled with ANSYS HFSS for a seamless RF system interference analysis tied with electromagnetic field analyses.

Go back to Hierarchy ELECTRONICS

ANSYS Icepakis an integration electronics thermal analysis tool that allows engineers to predict the thermal footprint of anything from single chips all the way up to PCBs and even full data centers.

Icepak’s strength is in its ability to provide easy-to-use drop in objects such as fans, heatsinks, sources, blowers and more. This alleviates the need for the designer to manually create those thermal control devices within the CAD tool.

Icepak uses the flagship CFD solver Fluent in the background which allows for all modes of heat transfer as well as direct connection with the FEA tools for modeling conjugate heat transfer as well.

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Current Density(SIwave)

Temperature

(Icepak)

Power Map

Temperature

ELECTRONICS

ANSYS Q3D Extractorenables the extraction of RLCG parameters in a variety of electromagnetic applications including traces, connectors bus bars and cables. It also is widely used in touchscreen applications.

Q3D has the ability to import both MCAD geometry from sources such as Solidworks and Creo to ECAD layout files such as from Cadence and Mentorgraphics.

Q3D is also able to transfer data to both ANSYS Mechanical and ANSYS Icepak for accurate thermal analyses.

Go back to Hierarchy ELECTRONICS

ANSYS SI OptionThe ANSYS SI Option adds transient circuit analysis to HFSS. This allows engineers to create high-speed channel designs that include the driving circuitry as well as the channel.

The driving circuitry can be transistor level, IBIS-based or ideal sources. Generate statistical eye diagrams and bathtub curves, check and enforce passivity and causality, integrate with HSPICE, and optimize designs with DOE and Monte Carlo analyses.

SI Option also includes a 2D extractor and a 3D time domain solver for HFSS.

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Eye Diagrams

Transient 3D Field AnalysisTDR Analysis

Contour Plots

ELECTRONICS

ANSYS RedHawkis a tool in the ANSYS semiconductor portfolio geared to the integrity and reliability of ICs.

It has been the go to sign off solution for all foundries and processes and enable users to create robust, high performance SoCs even using the latest in FinFET technology.

RedHawk enables users to design SoCs that are power efficient, reliable against thermal, electromigration and electorstatic discharge issues across several industries such as mobile, IoT and automotive.

RedHawk also provides model interoperability with ANSYS board and system level tools to ensure that the chip performs as intended in the entire system.

Go back to HierarchySEMICONDUCTO

R

ANSYS Simploreris a multi domain system modeling tool enables true system level virtual prototypes with its tight integration with ANSYS 3D Physics tools, ANSYS Embedded Software tools along with its built in circuit and control system design functionality.

Simplorer also supports Standards-Based interoperability such as support for the FMI standard as well as interfaces for C/C++ code and Simulink models.

Simplorer’s strength is its ability to connect and tie in various simulation sources together to provide users with the ability to generate a full system virtual prototype model that accurately represents real world operation.

Go back to Hierarchy SYSTEMS

ANSYS MCAD Interfacesprovides the ability for users to import direct native format CAD geometry files from major CAD tools such as Solidworks, NX, CATIA, Creo and Autocad.

These translators also provide an ability for a two-way interaction between ANSYS and the CAD tool. ANSYS is able to recognize tagged dimensions as parameters that can be modified within ANSYS for a design study.

This reduces an engineer’s effort by providing an easy way to iterate through the design process and to provide a quicker method to reach an optimized part.

Go back to Hierarchy PLATFORM

ANSYS ALinks for EDAprovides the ability for ANSYS tools to import native and neutral electrical CAD formats from such tools like Cadence, Zuken and Mentorgraphics. They also support the ability to bring in ODB++ standard.

These translators ensure that the details of the PCB or electrical layout is brought in to ANSYS for accurate and easy validation.

Go back to Hierarchy PLATFORM

ANSYS Optimetricsenables users to create and solve small, medium and large scale design of experiments studies within the ANSYS Electronics Desktop suite of capabilities such as ANSYS HFSS, ANSYS Maxwell and ANSYS Simplorer.

Its capabilities include Parametric Variation, Optimization, Sensitivity, Statistical and Analytic Derivatives.

Optimetrics also enables ANSYS DesignXplorer functionality with ANSYS Electronics Desktop as well.

This allows for users to fully investigate the design space without needing to manually set up large sets of simulation runs.

Go back to Hierarchy PLATFORM

ANSYS HPCenables users to solve larger, more complex problems without creating an impractical time commitment.

The idea of HPC is to increase simulation throughput – which leads to more designs being analyzed and investigated which leads to a quicker turnaround of an optimized design, less prototyping and quicker to market.

ANSYS HPC leverages various different kinds of hardware configurations from single laptops to powerful workstations to large clusters and datacenters.

ANSYS partners with several key hardware partners such as Intel and NVidia to ensure performance and scalability.

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PLATFORM

ANSYS Distributed Solve Optionenables users who are running parametric variations of Electromagnetic analyses to parallelize the solution of these design points simultaneously.

Essentially since each parametric variation can be assumed to be its own standalone project, it can be sent out to its own set of cores and memory to solve.

This enables you to leverage high performance computing hardware to solve multiples of these variations simultaneously without needing several solver licenses.

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PLATFORM

ANSYS Workbenchis a platform on which the different ANSYS tools and solvers are able to communicate with each other.

Workbench is used for everything from connecting upstream CAD tools to creating a two-way coupling between CFD and FEA for Fluid-Structure Interaction Problems.

The power of Workbench is that it allows the users to create these connections with nothing more than a drag and drop of connection links. Workbench handles all the behind scenes functionality.

This is the core of the strength of the ANSYS platform.

Go back to Hierarchy PLATFORM

ANSYS ACTis a powerful customization tool that provides users of ANSYS to develop and utilize functional add-ins to the ANSYS portfolio.

Users can leverage these add-ins to automate workflows, add functionality, tie in 3rd party tools and more. These work across the flagship tools across the ANSYS toolset.

ANSYS has a large App store that contain both free and paid apps that were either developed by ANSYS Inc., Partners and even customers.

Users can develop these add ins using Python, which is an easy programming language.

Go back to Hierarchy PLATFORM