1 © 2016 ANSYS, Inc.

ANSYS Icepak R18 Update

2 © 2016 ANSYS, Inc.

Icepak R18 Highlights• Enhancements to SIwave Icepak solution

Added automated iterative loop

• Improved Via handling capabilities Individually modeling vias – no K averaging Via Drill holes imported

• RedHawk CTM import with back annotation of Temps into RH

• Meshing Improvements

• Solver Improvments Vacuum -> enable radiation control in fluid zones Support for Streamwise Periodicity

• Inputs for Mass Flow or Pressure Gradient

• SpaceClaim Direct Modeler incorporates DME “Simplify Functions”

• ECXML support for data exchange

• Improved HPC performance

• Arbitrary Board Outline Imports using IDF

• Improved Krylov ROM for efficient network modeling

• Post Processing LED – Efficiency as a function of temp. Solar Heat Flux reporting Improved Surface Probing Smooth 3D Contours Optimized Manhattan displays Transient option for “Full Reports” Node-weighted interpolation for accurate facet-based post-processing

Cu-brass

3 © 2016 ANSYS, Inc.

SIwave-Icepak Workflow Improvements

Joule Heating

Thermal Cut-Planes• From ANSYS SIwave:

Conduction only analysis

Natural convection analysis

Forced convection (fan) analysis

Multi-phase VRM design support

IDF boundary conditions & Heat Sink creation

Geometry pre-processing for stand-alone Icepak

Component power (Watts) allocation during setup

Joule heating power mapping into Icepak & Mechanical

Cut plane temperature monitoring in XY-, XZ-, and YZ-planes

Ability to “Open” and perform more detailed analysis & reporting in stand-alone Icepak!

4 © 2016 ANSYS, Inc.

SIwave-Icepak Workflow ImprovementsIcepak Setup in SIwave

• ANSYS Icepak is solved directly in SIwave for ‘conduction only’ and basic convection models

• After setting up in SIwave, an Icepak project is built and run in the background and the temperatures are post-processed in the SIwave GUI

• Automation of iterative loop until DC convergence

5 © 2016 ANSYS, Inc.

SIwave-Icepak Workflow ImprovementsIcepak Setup in SIwave

• Filter added to delete all RLC components below a certain power

• Helps reduce number of components in Icepak

6 © 2016 ANSYS, Inc.

SIwave-Icepak Workflow ImprovementsIcepak Setup in SIwave

• Button added for convection to auto-size the Cabinet in the ANSYS Icepak project

7 © 2016 ANSYS, Inc.

SIwave-Icepak Workflow ImprovementsIcepak Setup in SIwave

• Updated Mesh settings for improved robustness

• Spatial Profile implementation for the power dissipation map has resulted in major improvements in overall turnaround time and robustness

• If available, most generic setups (old Automatic setup in ANSYS Icepak) can be run directly in the SIwave project setup

8 © 2016 ANSYS, Inc.

SIwave-Icepak Workflow ImprovementsIcepak Enhancements

• Improved usability and robustness Spatial Profile implementation

(using PCB primitive in Icepak) for the power dissipation map has resulted in major improvements in overall turnaround time and robustness

Boards can be offset or rotated from their original location

9 © 2016 ANSYS, Inc.

SIwave-Icepak Workflow ImprovementsIcepak Enhancements

• Support for Multiple Boards Boards of same setup can

point to the same initial SIwave project

The macro will launch the initial run, create the individual sitemp files and then queue the individual launches of new SIwaveprojects

Each board/substrate must have a separate SIwaveproject

10 © 2016 ANSYS, Inc.

SIwave-Icepak Workflow ImprovementsIcepak Enhancements

• Improved Usability Macro now only requires pointing to the board in Icepak and the project file for the

SIwave project

11 © 2016 ANSYS, Inc.

Chip Package System Workflow Enhancements

CTM View in Icepak

• ANSYS Redhawk CTM Import into Icepak

12 © 2016 ANSYS, Inc.

Chip Package System Workflow Enhancements

• Back annotation from Icepak to Redhawk− Main Menu/Report/Export/RedHawk Back Annotation− Export the temperature at each tile to RedHawk

Select the die block.

Select the CTM file

Select location for output

13 © 2016 ANSYS, Inc.

MCAD to Icepak Enhancements

• ANSYS SpaceClaim is the new de facto CAD Cleanup Tool for all ANSYS products

• Geometry simplification, repair, and modification is significantly streamlined compared to ANSYS DesignModeler

• At v18, several of the “DesignModeler Electronics Utility” capabilities have been incorporated into ANSYS SpaceClaim.

SpaceClaim Icepak

14 © 2016 ANSYS, Inc.

Auto-Identify Simple Icepak Shapes in SpaceClaim

• After initial geometry cleanup is complete, the Identify Objectscommand can automatically create simple Icepak shapes

Input Geometry Structure Tree Icons are Updated

Before After

Icepak block icon

MCAD to Icepak Enhancements

15 © 2016 ANSYS, Inc.

Icepak Simplification Levels in SpaceClaim

Level 0 Level 1

Level 2 Level 3

• Level 0: Converts geometry to a bounding box prism

• Level 1: Converts geometry to a collection of prisms and cylinders

• Level 2: Converts geometry to a polygonal approximation

• Level 3: Keeps the geometry as-is (use only when needed)

MCAD to Icepak Enhancements

16 © 2016 ANSYS, Inc.

Modify Icepak Object Type in SpaceClaim

• Sometimes it makes sense to change the object type, some examples are− Icepak Plate → Source, Wall, Opening− Icepak Block → PCB

Icepak Block Icepak PCB

The geometry remains the same, but the object options

are different in Icepak

Structure tree icon is updatedLevel 2 simplification already done

MCAD to Icepak Enhancements

17 © 2016 ANSYS, Inc.

ECXML: Icepak – Flotherm Data Exchange Format

• Supported Features:

• Cabinet, Plates, Blocks, Walls, Sources, PCBs, Grilles, Resistances, Enclosures, Heatsinks, 2R Network Blocks, 2D & 3D Fans

• Materials: Solid

• Assemblies

• Monitor Points

• Implemented cross-platform encryption algorithm

• Joint testing effort with Mentor

18 © 2016 ANSYS, Inc.

• Icepak Model highlights: MCAD, ECAD, Non-conformal Assemblies, 734 objects

• Icepak Mesh highlights: ~11 M cells using unstructured, non-conformal, multi-level, hex-dominant meshing scheme

• Icepak Solution highlights: Steady state, Turbulent Flow, Conjugate Heat Transfer, Double Precision.

Solver Enhancements – Improved HPC Performance

Desktop Server Setup in Icepak

19 © 2016 ANSYS, Inc.

• System Information

– Intel Xeon CPU E5-4650L 2.6 GHz processors, 512 GB RAM

– 4 processors, 32 cores

– Running Windows Server 2012 R2 Standard.

• HPC Test Summary

– Trials were run using ANSYS Icepak v18.0 and ANSYS Icepak v17.0.

– Each trial was run for 250 iterations.

– Solution time tracking:

• Overall Run Time: Includes Case Setup and Computational Effort.

Solver Enhancements – Improved HPC Performance

20 © 2016 ANSYS, Inc.

Icepak R17 vs R18

• Overall Run Time vs Number of Cores

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rall

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n T

ime

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Number of Cores

R17 - Overall Run Time R18 - Overall Run Time

Solver Enhancements – Improved HPC Performance

21 © 2016 ANSYS, Inc.

• Speed-up vs Number of Cores

• Overall run time for 1 core taken as reference to calculate Speed-up

0.00

2.00

4.00

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Spe

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-up

Number of cores

Speed-up - v17 Speed-up - v18

Icepak R17 vs R18

Solver Enhancements – Improved HPC Performance

22 © 2016 ANSYS, Inc.

• Enable facet-based post processing for object face contours

• Temperature, Heat flux, Heat transfer coefficient variables available

• Export values to profile files

• Option to display contours on wall and wall-shadow

Solver Facet-based Post Processing: Object Faces

23 © 2016 ANSYS, Inc.

• ANSYS product information is highly confidential and proprietary. By proceeding with ANSYS product discussions, recipients agree not to use or disclose this information for any purpose.

• ANSYS product information is not a binding commitment, and is subject to change in ANSYS’ sole discretion. ANSYS undertakes no obligation to update product information.

• Purchase decisions, investments and other actions should not be taken in reliance on ANSYS product information, which may be prospective in nature, forward-looking and not guaranteed to occur.

Legal Disclaimer

24 © 2016 ANSYS, Inc.

Icepak Vision -> R18.1 & Beyond

Create an Automated, Streamlined Electro-Thermal Multi-Physics Solution that utilizes Native MCAD/ECAD for First Pass Mesh/Solve Success

Key Drivers/Mandates

• Modern UI, Ease-of-Use

• Integration into AEDT

• Rapid Release Cycles

R18.1 First release

• Initial exposure with most common feature set

• CPS with Enclosure

• Steady-state thermal

Improved Workflow

• Native MCAD Modeler

• ECAD-MCAD Assembly

• Integrated Electro-Thermal Workflow

• Geometry Clean Up & Simplification

ANSYS Electronics Desktop (AEDT)• AEDT-Icepak