Amkor Confidential I May-16 1 - Insight SIP · PDF fileAdvanced System-in-Package (SiP) ......

Amkor Confidential I May-16 1


Bio

Kamel Ait Mahiout

Joined Amkor in 2000 from various experiences R&D,

Manufacturing and Sales Marketing.

RF/Microwave and Semi-conductor technical and business

management expertise.

General Manager Amkor Europe since 2009 with a role of

growing Europe region by gaining market share and

focusing on innovation and differentiation providing

customised services to the customers.


Amkor SiP Overview

Kamel AIT Mahiout

Europe General Manager


Agenda

SiP Business Model

Amkor Market Focus

Manufacturing Excellence

Amkor SiP Capabilities

Amkor Overview


Broad

Geographic

Footprint 8+ million sq. ft.

of Manufacturing

Space in Asia

Korea 2.3M sf

Japan J-Devices 2.4M sf

China 1.0M sf

Taiwan 850k sf

Philippines 1.4M sf

Malaysia 400k sf


Amkor at a Glance

*Outsourced Assembly and Test


Amkor + J-Devices End Markets: 2015

46%

COMMUNICATIONS

Smartphone

Tablet

Handheld device

CONSUMER

Television

Set-top box

Personal electronics

7%

COMPUTING

PC/Laptop

Hard disk drive

Peripherals

10% NETWORKING

Server

Router

Switch

15%

22% AUTOMOTIVE

Infotainment

Safety

Performance


Advanced System-in-Package (SiP)

$725 Million Sales in 2015. 16% Growth Year-on-Year

Baseband Modules Digital, Memory,

PMU, Audio Digital + RFA

Sensory Modules Biometric

Silicon microphones

Automotive Infotainment

ECU MEMS motion sensor

Companion Modules WLAN, WiMax, GPS, Mobile TV

Radio Modules PA, Transceiver, FEM, FES, Radio


World’s Largest OSAT For Automotive ICs

Camera

Modules

Body

Systems

Safety

Systems

Info-

Center

MEMS &

Sensors

$750 Million Combined Amkor + J-Devices Sales in 2015


SiP Business Model


Traditional Semiconductor and System model

OEM (ESI, Lenovo, Sony

etc)

EMS (Foxcon, Flextronixs,

Jabil etc)

Semi Comp. (Avago, Skyworks,

QTI etc)

OSAT ( AMKOR, ASE, etc)

OSAT model

Single Die Pkg

Trend

Multi Die SiP: - RF FE

- Connectivity

EMS model:

Board and Final

Assy

Trend

Modularization


SiP - Emerging model driven by modularization

OEM (ESI, Lenovo, Sony

etc)

EMS (Foxcon, Flextronixs,

Jabil etc)

Semi Comp. (Avago, Skyworks,

QTI etc)

OSAT ( AMKOR, ASE, etc)

OSAT model

Single Die Pkg

Trend

Multi Die SiP: - RF FE

- Connectivity

EMS model:

Board and Final

Assy

Trend

Modularization

OSAT / EMS

SiP for mobile

devices

• NEO / Trinity

• WLSiP

- Complexity of mobile devices drives further modularization: ESI lead OEM

- OSAT technology required / EMS expertise insufficient: System companies take the lead


Transforming Reference Design to SiP

Integrated Solutions

Plug-in Solutions

Wearable Solutions

SiP

Single/Multiple

Die Package

Reference Design PCB Mother Board

Sys

tem

Siz

e R

eductions

MCP

http://www.solidatum.com/showproduct.asp?lgID=EN&LID1=3&PID=2


Reference Design

Amkor SiP Solution Capabilities

Small Form Factor Passive comp.

/IPD/Embedded

Embedded & Conformal Shielding

Antenna, Crystal, SAW/BAW Filters

Side by Side

Stacked

PoP .

3D-WLFO Benefits

H

Cavity

POSSUM™

F2F

Leadframe 2.5D/3D


SiP Design & Design for Manufacturability


Amkor Market focus


SiP Market Segments

Wireless (frontend, transceiver, …)

Solid state drive (SSD)

Automotive

IoT (connectivity, MEMS, sensors, …)


Mobile SiP – FEM, Display, Touch, GPS, WiFi PMIC, etc.

Application Processor

Baseband Processor

NAND

Touch Screen

Controller

Display Touch-Screen

FEM

Multiband/ mode

Transceiver

An

ten

na sw

itch

Filters

Du

ple

xer

Po

we

r Am

plifie

r

Mobile DDR

WiFi/BT

MEMS

Camera

Audio Processor

Battery PMIC

GPS

SiP SCSP

PoP/fcSCSP

WLCSP

fcCSP

WLCSP

MLF MLF

CABGA

WLCSP

WLCSP

fcCSP SiP


SSD Market Segment

Market Segment

– Enterprise

– Client

Platform

– Enterprise SSDs

– Standard SATA

– mSATA

– M.2

– SiP (single package)

www.samsung.com

www.Intel.com

www.amzaon.com

www.amzaon.com

Amkor SSD SiP


Amkor Automotive SiP

Large singulated body SiP

Infotainment & ADAS

Autonomous driving

Computers in a car

Increasing trend in designs

55 x 72 mm, Network Switch, ASIC + Memory

42.5 x 42.5 mm, Infotainment, Processor + DDR


IoT/Wearable SiP

Driving advanced packaging fusion with and without sensors

Memory ASIC L


Manufacturing Excellence


High accuracy chip shooter 3D Solder Paste Inspection

X-axis high accuracy screen printer

Amkor K4 Advanced SMT Center of Excellence

Full inline hands-free SMT machine configuration

Recipe control by RFID

HVM for 150um pitch CuP and available 90um CuP pitch

HVM of 0402 and possible 0201

Automatic component withdrawal by RFID base component

management system


Thank You

Amkor Confidential I May-16 1 - Insight SIP · PDF fileAdvanced System-in-Package (SiP) ......

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