AMD Embedded G-Series Press Presentation

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1| AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11 THE AMD EMBEDDED G-SERIES PLATFORM The World’s First APU for Embedded Systems Embargo until 12:01 a.m. EST 1/19/2011

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Transcript of AMD Embedded G-Series Press Presentation

Page 1: AMD Embedded G-Series Press Presentation

1 | AMD Embedded G-Series Platform Launch | Embargo until 12:01 a.m. EST 1/19/11

THE AMD EMBEDDED G-SERIES PLATFORMThe World’s First APU for Embedded Systems

Embargo until 12:01 a.m. EST 1/19/2011

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Strong Commitment to x86 Embedded Systems

AMD increases performance and features, while driving down power, area, and price barriers for x86 in embedded

2003 2005 20072004 2006 2008 2009 2010 2011

Introduction of AMD64 technology into

embedded markets with AMD Opteron™

processor

Addition of graphics and chipset options for

comprehensive embedded solution

Ball Grid Array (BGA) packaging introduced

to meet customer demand

The AMD Geode™processor

The AMD Embedded G-

SeriesPlatform

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The Embedded Market is Key in AMD’s Strategy

¹ As predicted by VDC research 2009 Global Embedded Market Analysis² “Served Available Market”; as estimated by VDC research 2009 Global Embedded Market Analysis³ Based on AMD internal data 2007-2010

10%+ per year growth in the CPU market for embedded applications¹

The x86 CPU SAM² is more than 3B/year in 2010 alone²

>350% growth for AMD’s 64-bit embedded CPU/chipset business in just 3 years³

Market is huge and growing

Systems are more compute intensive with high-performance graphics requirements

This market wants innovative, complete platforms

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The Next Step Forward for AMD in Embedded: AMD G-Series Platform

We live in an always-on environment that requires high performance.

There is an ongoing push for decreased power, smaller size, higher capability systems at lower prices.

There is a strong visual element and growing need for quality graphics in many embedded markets

Today, AMD is delivering the world’s first and only APU for embedded systems,

incorporating the new, very low power x86 “Bobcat” core with a world-class DirectX® 11-

capable GPU on a single piece of silicon.

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Traditional Vertical Markets

Thin-clients

Point-of-sale (POS) & Kiosk Systems

Ruggedized, Field, & Military Systems

Digital Signage

Gaming Machines

Medical Imaging

Industrial Controls

Telecommunications& Networking

Small/Home Office to Enterprise Storage

Single Board Computing (SBC)

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The Future of Embedded Systems is Here

3.5” Single Board Computer

More compelling designs in traditional markets

Incredible user experiences in smaller form factors

Enabling brand new markets and products in a world of connected devices

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CPU

General Program

Task

General Program

Task

ExternalGPU sub-systemsMulti-Core CPUs

GPU

Display

ATI Stream

Video

Graphics

Designed for:

Specialized tasks (e.g. graphics, video)

Most visual applications

Data processing in parallel

APU

Serial Data Processing

Parallel Data Processing

Designed for:

General purpose tasks

Most common applications

Data processing serially

• General-purpose, programmable scalar and vector processor cores, form heterogeneous capability

• High-speed bus architecture

• Shared, low-latency memory model

• All on the same die

The AMD Fusion Family of Accelerated Processing Units

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The AMD Embedded G-Series Platform: APU + Fusion Controller Hub

APU• 2 x86 CPU Cores (40nm “Bobcat” core – 1 MB L2, 64-bit

FPU)• C6 and power gating• Array of SIMD Engines

–DX11 graphics performance– Industry leading 3D and graphics processing

• 3rd Generation Unified Video Decoder–H.264, VC1, DixX/Xvid format

• Two dedicated digital display interfaces–Configurable externally as HDMI, DVI, and/or Display Port–Also supports a single link LVDS for internal panels

• Integrated VGA DDR3 800-1066, 2 DIMMs, 64 bit channel• BGA package

AMD Fusion Controller Hub for display and I/O• 4x1 PCIe® • “Hudson” Fusion Controller Hub

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Developer Support

Reference designs, development boards, and schematics

Support for differentiated embedded products at every phaseDesign

DevelopmentGo-to-market

Commitment to an open ecosystem for embedded developers

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Current Customer Systems

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Select AMD Embedded G-Series Platform Customer and Partners

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The AMD Embedded G-Series Platform In Summary

AMD’s strong commitment to embedded is in a separate league

•The world’s first and only APU for embedded systems

•Cutting-edge AMD Fusion technology •Immediately available for embedded •Driving down power consumption and board area•Leveraging open and industry standards•Improving time to market

The premier solution for a new generation of differentiated, small form factor embedded systems that consume less power, yet deliver improved performance and features, including an outstanding visual experience

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BACKUP

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Features that “Shrink the Design, Not the Performance”

BGA and lidless options

Small area footprint

Reliability

Low cost

Fanless operation

Low-z-height for small, compact form factors

Packaging

Multi-core leadership

DDR3 memory

High-performance I/O with HyperTransport™ 3.0 technology

Consistent 64-bit capability

Low memory latency

Direct ConnectArchitecture

Enterprise-class Features

ECC

Multiple power management/ reduction features

Enhanced virus protection

Virtualization

No compromise on application performance

Scalability

Clear roadmap progression

Socket-compatibility for easy design upgrade

Easy migration path to higher performance

Chipset & graphics compatibility

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With the AMD Embedded G-Series Platform: Further Shrink the Design, Improve the Experience

Reduced Board Space

Brings together CPU and GPU into a single, smaller package

Enables small form factors with high levels of SoC integration

Integrated Graphics Performance

DirectCompute 11

World-class integrated AMD Radeon™ graphics core with DirectX® 11 support

Smooth playback of Blu-ray titles

Low Latency, high-bandwidth memory access enables high performance graphics

Up to 1080p video playback supported (18W processors and above only)

Up to 2560x1600 display resolution

Rich Display and I/O Support

Up to 6 digital display ports connect one HDMI™, multiple DP, or DVI displays and docks

PCIe® general purpose ports provide low-latency, high bandwidth I/O direct to memory to support demanding peripherals

Low Idle Power

Easy migration path to higher performance

Optimized display refresh minimizes DRAM activity during idle states, does not require external I/O or chipset activity

UVD 3.0 offloads video decode dramatically reducing CPU loading during video playback

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APipe

MPipe

FP Scheduler

ICACHE

DCACHE

StorePipe

AddressScheduler

LoadPipe

IPipe

IPipe

IntegerScheduler

Fetch

“Bobcat” Low-Power

Core

BU

L2

Decode

New Low-Power "Bobcat" x86 Core

Advanced Micro-architecture Dual x86 Decode Advanced Branch Predictor Out-of-Order Instruction Execution

– Full OOO Instruction Execution– Full OOO Load/Store Engine

High Performance Floating Point AMD64 64-bit ISA SSE1,2,3, SSSE3 ISA, SSE4A Secure Advanced Virtualization 32KB L1s, 512KB L2

Low Power Design Power Optimized Execution Micro-architecture that minimizes data movement

and unnecessary reads Clock Gating, Power Gating System Low Power States Sub 1W capable

Small Core Mainstream performance in less

than half of the silicon area of previous solutions 40nm / 10 metal layer process

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Intel Atom

400-500

Intel Atom 600

Series

Better Footprint than Intel Atom Solutions

484mm2

559 balls

361mm2

413 balls

= 890mm2

= 1445mm2

FT1

529mm2

605 balls

APU

FCBGA559

2.5-4.3W

2.7W-4.7W9,18W

5.5-13W

= 11.7W-22.7W

= 8W-17.3W

= 1018 balls

= 1235 balls

To scale

529mm2

376 balls484mm2

676 balls

= 1013mm2FCBGA559

1.55W2.7-3.9W = 4.25W-5.45W

= 1052 balls

AMD Embedded G-Series Platform

Intel Atom E6xx Series

Intel Atom 400 and 500 Series

IntelEG20T

Controller Hub

IntelICH9 I/O Controller

ControllerHub

961mm2

676 balls

Source: http://download.intel.com/embedded/processors/prodbrief/324100.pdf

Source: http://ark.intel.com/Product.aspx?id=29823&code=82801HM and http://download.intel.com/embedded/processors/prodbrief/323288.pdf

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Intel Core i5-520M

Better Footprint : AMD Embedded G-Series Platform vs. Intel Core i5-520M

APU

To scale

AMD Embedded G-Series Platform

IntelQM57

ControllerHub

ControllerHub

361mm2

413 balls

= 890mm2FT1

529mm2

605 balls

2.7W-4.7W9,18W = 11.7W-22.7W

= 1018 balls

675mm2

1071 balls952mm2

1288 balls

= 1627mm2BGA1288

3.5W35W =38.5W

= 2359 balls

Intel Core i5-520M

82% larger footprint with more than 2X balls to route

Source: http://ark.intel.com/Product.aspx?id=47341 and http://ark.intel.com/chipset.aspx?familyID=43185

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DISCLAIMER

The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors.

The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or the like. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes.

AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION.

AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

ATTRIBUTION

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AMD, the AMD arrow logo, AMD Geode, AMD Sempron, AMD Turion, AMD Opteron, and combinations thereof, are trademarks of Advanced Micro Devices, Inc.All other products names and logos are for reference only and may be trademarks of their respective owners.