ALPHA OM -351 Solder Paste · ALPHA® OM-351 is a lead-free, Zero-halogen no-clean solder paste...

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

OMOMOMOM----351 Solder Paste351 Solder Paste351 Solder Paste351 Solder Paste

an Alent plc Company 1

ALPHAALPHA®®

OMOM--351 351

Solder Solder

PastePasteProduct Guide

ALPHA® OM-351 is a lead-free, Zero-halogen no-clean solder paste designed for applications where ultra low voiding performance, ultra fine feature printability, excellent ICT pin testing first pass yield, and the ability to pass JIS Copper Corrosion test are required.




ALPHA® OM-351Product Guide

2. Performance Summary 4

4. Print Performance 7 - 14

5. Reflow Performance 15 - 36

7. Reliability 42 – 49

CONTENTS Page #

9. Summary 51- 55

1. Introduction 3

3. Value Creation 5 - 6

8. Halogen Status 50

6. Field Trial Performance 37 - 41




Introduction

ALPHAALPHA®® OMOM--351:351:

1. Passes IPC 7095 Class III ultra low voids requirement for BGA and best in class

for LGA

2. Is both pin testable and JIS Cu corrosion compliant

3. Enables consistent printing capability with a 100µm (4 mil) stencil

4. Gives good coalescence down to 170 µm small circle size of CSP, even under the

high preheat soak condition of 175°C to 185°C

ALPHA® OM-351 is a lead-free, Zero-halogen no-clean solder paste designed for applications where ultra low voiding performance, ultra fine feature printability, excellent ICT pin testing first pass yield, and the ability to pass JIS Copper Corrosion test are required.




Performance Summary

Process Benefit OM-351 Property Performance Capability

Fine Feature Print Definition

Excellent print definition & consistant volumetric performance

- down to 220µm (8.5mil) diameter

- 0.4mm (16mil) pitch QFP

- Min Area Ratio of 0.6

Temperature Window Capable of printing in temperature from 20 - 32°C (68 - 90°F)

Tack/Stencil Life Long Tack and Stencil Life

Print Speed Range Wide Process Window from 25 - 150 mm/sec (1 - 6"/sec)

Peak Reflow Temperature (N2

Prefered)235 to 245°C (Optimal recommended: < 240°C; N2 Prefered)

Resistance to Voids Meet IPC 7095 Class III requirements

Resistance to Cold & Hot Slump Preferable J-STD-004A and JIS Level 2

Flux Residue Cosmetics Clear

Random Solderballs Preferable J-STD-004A and JIS Level 2

Flux Residue Characteristics Pin Testable & Pass JIS Cu Corrosion Test

SIR Meets/Exceeds JIS, J-STD-004B and Bellcore Requirements

Electromigration Resistance Meets/Exceeds JIS, Bellcore

Halide Content Halide Free

J-STD-004B Classification ROL0

Environmental Halogen Content Zero Halogen, No halogen intentionally added

Electrical Reliability

Print Process Window

Reflow Yield




Value Creation

• Key Data Required to quantify the value

delivered by OM-351

– First pass yield

– Finest feature component

– The major defects

– The defects that cause a board to be scrapped

– Total volume of boards manufactured per month

– Value of finished board




Value Creation

Pin Test Yield Value Word Equation

(OM-351 Pin Test Yield – Pin Test Yield Current Product)X

Total Number of Boards ProcessedX

Profit Margin Per Assembled Board

Cost of Reworking PCB with Pin Test FailureX

(OM-351 Pin Test Yield – Pin Test Yield Current Product)X

Total Number of Boards Processed

[(Price/kg of OM-351 – Price/kg of Current Product)X

Quantity of Solder Paste in kg Used per Month]

Total Increased Value to Customer

-

-

=




JIS Tack Life

Maintains consistent tack strength over 24 hours

Meets JIS Z3284-1994 Annex 9

Tack Force > 100gf for the 24-hr duration

Print Performance

TackForce Vs. Time (Relative Humidity Varies)

0.0

20.0

40.0

60.0

80.0

100.0

120.0

140.0

0 4 8 12 16 20 24

Time (h)

Ta

ck

forc

e (

gf)

25℃℃℃℃25%RH

25℃℃℃℃50%RH

25℃℃℃℃75%RH




Viscosity Stability

14 Day Viscosity Stability

Storage Temperature : 25°C (77°F)

Viscosity : 139 – 148 Pas, Less than 10% change

Print Performance

25degC Viscosity Stability

148140 139

0

50

100

150

200

0 2 4 6 8 10 12 14

days

Vis

co

sit

y(P

a.s

) 10rp

m




Viscosity dropped during the first 4 hours, but remained stable for the remaining 20 hours of the test

24-hr Continuous Rolling (Kneading) Process Print Performance

24hrs Rolling Viscosity Change

(10rpm, 23~25C, 21~23%RH)

142134 128 130

0

50

100

150

200

0 4 8 12 16 20 24

Time (h)

Vis

co

sity

(P

a.s

)




Excellent Out of Jar & Response to Pause Performance

Print - Response to pause Print Performance

5 mil Thickness Stencil, Type 4.5 Powder

Condition

Board

C. After 2 Hour PauseB. After 100 KneadsA. Out Of Jar

432143214321

600

500

400

300

200

100

0

Volume (cubic m

ils)

60% of Theoretical Volume (339 cubic mils)

Theoretical Volume (565 cubic mils)

BGA225 (12 mil circles)

Condition

Board


432143214321

1600

1400

1200

1000

800

600

400

200

0

Volume (cubic m

ils)




Condition

Board


432143214321

3500

3000

2500

2000

1500

1000

500

0

Volume (cubic m

ils)



QFP120 90% Opening (16 mil pitch, 56.7x9 mils)




Print Volume Repeatability (25°C) Print Performance

5 mil Thickness Stencil, Type 4.5 Powder

Speed

Board

6 inch/sec4 inch/sec2 inch/sec

432143214321

600

500

400

300

200

100

0

Volume (cubic m

ils)




Speed

Board

6 inch/sec4 inch/sec2 inch/sec

432143214321

3500

3000

2500

2000

1500

1000

500

0

Volume (cubic m

ils)




Excellent Print Volume Repeatability




Excellent 8-hour stencil life performance

Print - Stencil Life (5 mil Stencil, Type 4.5 Powder, 25°C) Print Performance

T-8T-7T-6T-5T-4T-3T-2T-1T-0

700

600

500

400

300

200

100

0

Time (hrs)

Volume (cubic m

ils)




T-8T-7T-6T-5T-4T-3T-2T-1T-0

2000

1500

1000

500

0

Time (hrs)

Volume (cubic m

ils)




T-8T-7T-6T-5T-4T-3T-2T-1T-0

700

600

500

400

300

200

100

0

Time (hrs)

Volume (cubic m

ils)




T-8T-7T-6T-5T-4T-3T-2T-1T-0

3000

2500

2000

1500

1000

500

0

Time (hrs)

Volume (cubic m

ils)







Good 8-hour high temperature stencil life performance

Print - Stencil Life (5-mil Stencil, Type 4.5 Powder, 32°C) Print Performance

T-8T-7T-6T-5T-4T-3T-2T-1T-0

2000

1500

1000

500

0

Time (hrs)

Volume (cubic m

ils)




T-8T-7T-6T-5T-4T-3T-2T-1T-0

3000

2500

2000

1500

1000

500

0

Time (hrs)

Volume (cubic m

ils)




T-8T-7T-6T-5T-4T-3T-2T-1T-0

700

600

500

400

300

200

100

0

Time (hrs)

Volume (cubic m

ils)




T-8T-7T-6T-5T-4T-3T-2T-1T-0

700

600

500

400

300

200

100

0

Time (hrs)

Volume (cubic m

ils)






an Alent plc Company

Wipe FrequencyType 4.5 Powder, 16mil Pitch QFP, 90% Opening

Print Performance

• Outstanding wipe frequency performance

14




Reflow Performance

SAC305 Typical Reflow Profile

Nitrogen Preferred




Reflow Performance

0.7 degC/sec ramp, 240 degC peak

0

50

100

150

200

250

300

0 60 120 180 240 300 360 420 480

Time [min]

Te

mp

. [d

eg

C]

BGA Center BGA Corner

0

50

100

150

200

250

300

0 60 120 180 240 300 360

Time [min]

Te

mp

[d

eg

C]


155-175 degC 1min. soak, 240 degC peak

1.3 degC/sec ramp, 240 degC peak

0

50

100

150

200

250

300

0 60 120 180 240 300

Time [min]

Te

mp

. [d

eg

C]


175-185 degC 1min. soak, 240 degC peak

0

50

100

150

200

250

300

0 60 120 180 240 300 360

Time [min]

Te

mp

. [d

eg

C]


Profile A

Profile B

Profile C

Profile D

Tested In Nitrogen




OM-351 outperformed all benchmarks.

Reflow Performance

OM-351 had almost zero defects

17




Reflow Performance

OM-351 comparable to leading Alpha paste on larger Chip Components

OM-351 outperformed leading competitor paste

18




Random Solder Ball Test

175°C Soak Profile, 240°C Peak Temperature, N2 Reflow

Pass JIS Level 2

Reflow Performance

0-hr 6hrs at 25% RH

6hrs at 50% RH 6hrs at 75% RH

* Coalesced Ball was lost during testing




Reflow Performance

RSB cross print performance in line

with leading benchmarks.

Excellent RSB cross printing performance.

Random Solder Ball Test




JIS ‘Solder Bath’ Spread PerformanceReflow Performance

250°°°°C, 30sec in air

74.4% Spread

OM-351 prefers N2 reflow environment




Flux Residue Tackiness

JIS Z 3197 8.5.1 Tack Test

The Talc Powder is easily brushed off, indicating the residue is not sticky

Talc Powder

�

Reflow Performance




Flux Residue Cosmetics

AIR

N2Clear, colorless flux residue with no evidence of bubbles in flux and flux burning in copper substrate

AIR

High Soak Profile – 180-190°C soak for 60 seconds, N2 Reflow

Reflow Performance




Cold & Hot Slump Test

COLDSlump

HOTSlump

JIS-Z-3284, 3 minute soak at 150°C.

Pass 0.1-mm

Pass 0.4-mm

Reflow Performance




Fine Feature Coalescence Test – SAC305

175 - 185°C, 60 sec soak, N2 Reflow

Reflow Performance

OM

-35

1




Fillet Wetting – In line with leading benchmarks Reflow Performance

OM

-35

1

26

Note: Tested Under N2 Reflow




Large Pad Wetting – In line with leading benchmarks Reflow Performance

OM

-35

1

27





Head In Pillow – In line with leading benchmarks Reflow Performance

Note: Tested Under N2 Reflow, Sample Size = 3

Comparable HIP performance against leading benchmarks.




Reflow Yield: Application Note

Definition of Voiding Performance

0.1d

0.25d

Solder Outline

Void Outlines

d

Example:

Total Void Diameter

0.10d +0.25d = 0.35d

IPC Criteria for Voids in BGAs, IPC 7095 7.4.1.6

The IPC criteria provide three classes of acceptance for both the solder sphere and the sphere-

pad interface.

Where multiple voids exist, the dimensions will be added to calculate total voiding in the joint.

Location of Void Class I Class II Class III

Void in Solder

(Solder Sphere)

60% of diameter

= 36% of Area

42% of diameter

= 20.25% of Area

30% of diameter

= 9% of Area

Void at interface of

Solder (Sphere)

and Substrate

50% of diameter

= 25% of Area

25% of diameter

= 12.25% of Area

20% of diameter

= 4% of Area

Reflow Performance




Paste

Prof ile

OM

-351

Leadi

ng C

ompe

ti tio

n

Alpha

Lead

ing

Paste

St R

amp 1

.3C

/S

St R

amp 0

. 7C

/S

Soak

175-1

85C

Soak

155-175

C

St R

amp 1

. 3C

/S

St R

amp 0

.7C

/S

Soak

175-185

C

Soak 1

55-175

C

St R

amp 1

.3C

/S

St R

amp

0.7C

/S

Soak

175-

185C

Soak 1

55-17

5C

30

25

20

15

10

5

0

Void %

IPC Class 3

Voiding Performance vs Solder Paste(Across Different Reflow Profiles)

30

Voiding Performance – BGA256, SAC305

Excellent, Low Voiding Performance

Reflow Performance





Reflow PerformanceLGA Voiding Performance - Outperforms leading benchmarks

0.7ºC/s Linear Ramp

31


OM-351 Alpha Leading Competitor




Reflow Performance

32


OM-351 Alpha Leading Competitor

LGA Voiding Performance - Outperforms leading benchmarks

155ºC - 175ºC, 60s Soak




Reflow Performance

33

DPAK Voiding Performance– In line with leading benchmarks

OM

-35

1





MLF Voiding Performance – In line with leading benchmarksReflow Performance

OM

-35

1





Flying Probe Pin Testing Vehicle & Test Method

All pads coated with Cu OSP (Entek Plus 106A)

Reflow : 238 degC peak, Probe : Sharp Chisel, 6.5 oz. force

Reflow Performance




Flying Probe Pin Testing Test Results

OM-351 demonstrates better pin testability

Flying probe pin test yield number of hits < 5ohm (N=2), Max.1000

�Reflow Performance

Note: Test Boards Reflowed Under N2 Reflow




Excellent Print Deposits

• Printing Parameters– Print Speed: 80 mm/s– Separation Speed: 10 mm/s– Environmental conditions 23.6°C/40%RH

Field Trial Performance




Excellent Print Deposits

• Printing Parameters– Print Speed: 50 mm/s– Separation Speed: 7 mm/s





Excellent, Bright Solder Joints Formation

0.4-mm QFN 0.4-mm QFP0.8-mm BGA





Good Residue Characteristics

0.4-mm QFN 0.4-mm QFP0.8-mm BGA



41



Excellent Voids Performance Field Trial Performance




Copper Mirror Corrosion Test –IPC J-STD-004A/JIS-Z-3197-1999 8.4.2

Reliability

No breakthrough in the Cu layer – Pass Copper Mirror Corrosion Test

25% Rosin SolutionOM-351




Copper Corrosion Test IPC J-STD-004B/JIS-Z-3197-1999

No Evidence of Green Corrosion

Reliability




Copper Corrosion Test IPC J-STD-004B/JIS-Z-3197-1986

No Evidence of Green Corrosion

Reliability

44




Ag Chromate TestIPC J-STD-004A/JIS Z 3197 8.1.4.2.3

No presence of white patch

Pass Silver Chromate Test

Reference OM-351

Reliability




Fluoride Spot Test

JIS-Z-3197-1999 8.1.4.2.4

No change in coloration of purple lake to yellow

concludes the absence of Fluoride in the formulation

OM-351

Reference

Reliability




PNC1201N solder Paste

8.00

9.00

10.00

11.00

12.00

13.00

14.00

0 1 2 3 4 5 6 7

Time,days

Lo

g S

IR

-------- A

-------- B

-------- C

--------- D

Control Boards

8.00

9.00

10.00

11.00

12.00

13.00

14.00

0 1 2 3 4 5 6 7

Time,days

Lo

g S

IR

-------- A

-------- B

-------- C

--------- D

Conclusion: All the coupons had passing SIR values. Figure 6. Shows microscopic photographs of the coupons processed with solder paste OM-351 with backlighting. No visual evidence of greening or any electromigration was found. The solder paste OM-351 met all the requirements of J-STD-004B SIR test.

Pass IPC SIR

OM-351

Control

IPC SIR Pass

47

Reliability




Solder Paste OM-351Test:RLB/BS/050312SP1 05/03/2012 T/H/B:35/85/-48Tested by:Soma Reported by:Soma P/F limit:1E11 Ohms

_________________________________________________MATERIAL TESTED/ SIR SIR COMMENTSCONDITION (1 day) (4 days)

-------- --------OM-351 1.1E+13 5.0E+12 Visually OKSAC305 1.1E+13 4.6E+12uncleaned 1.1E+13 4.8E+12

1.1E+13 5.6E+121.1E+13 5.0E+121.1E+13 5.6E+121.1E+13 4.4E+121.1E+13 4.6E+128.2E+12 5.3E+121.0E+13 4.0E+121.1E+13 4.8E+121.1E+13 3.7E+12----- -----

Geometric mean: 1.1E+13 4.8E+12

Control boards 6.5E+11 2.2E+121.6E+12 7.8E+121.7E+12 3.4E+121.7E+12 3.9E+123.3E+12 2.6E+124.0E+12 2.7E+122.5E+12 3.0E+122.1E+12 2.6E+129.4E+11 2.0E+121.2E+12 2.3E+121.5E+12 2.7E+121.9E+12 2.7E+12----- -----

Geometric mean: 1.7E+12 2.9E+12

OM-351 - Pass Bellcore SIR

24 hrs �� 1.1E+13 ohm

96 hrs �� 4.8E+12 ohm

Bellcore SIR Pass

48




Electrical Reliability Data JIS-Z-3197-1999 8.5.4

Passed JIS ECM 85°C/85%RH 48V DC 1000 hours test

• No Dendrite Growth after 1,000hr at 85°C/85%RH 48V

• SIR Value > 1.0E+10

Time (Hr)

SIR (Ohm)

Reliability

1.00E+06

1.00E+07

1.00E+08

1.00E+09

1.00E+10

1.00E+11

1.00E+12

1.00E+13

0 200 400 600 800 1000

Control-1 Control-2 Control-3 OM-351 Board 1 OM-351 Board 2 OM-351 Board 3

100x Mag.

100x Mag. (Back Light)


50



Halogen Status

�‘Zero Halogen’ Product

(Meets the Halogen Standards Below)




Summary

• Product Value Propositions are – IPC 7095 Class III Ultra Low Voids Performance

– Fine Feature Printing and Coalescence

– Zero Halogen

– Excellent Pin Testing Performance

– Pass JIS Cu Corrosion Test

• Targeted Applications– Optimised for N2 Reflow Applications

• Value Created Offerings

– Improved Throughput and Yield




Leading Products:

No Clean, SnPb

•ALPHA OM-5100

•ALPHA OM-5300

No Clean, Lead-free

• ALPHA OM-338 T

•ALPHA OM-338 PT

• ALPHA OM-340

•ALPHA CVP-390

•ALPHA CVP-360

•ALPHA OM-234HF

No Clean, Low Temperature Lead-free

•ALPHA CVP-520

Water Soluble, SnPb

• ALPHA WS-809

Water Soluble, Lead-free

• ALPHA WS-820




AMERICAS

California, USA

Florida, USA

Illinois, USA

New York, USA

Pennsylvania, USA

Mexico City, Mexico

Monterrey, Mexico

Manaus, Brazil

Sao Paulo, Brazil

EUROPE

Woking, England

Turnhout, Belgium

Cholet, France

Budapest, Hungary

Hatar, Hungary

Naarden, Netherlands

East Kilbride, Scotland

ASIA-PACIFIC

Hong Kong, ChinaGuangxi, ChinaShenzhen, ChinaShanghai, ChinaChennai, IndiaHiratsuka, JapanSihung City, KoreaSingaporeTaoyuan, Taiwan

Global Manufacturing Sites




AMERICAS

California, USAGeorgia, USAIllinois, USANew Jersey, USAPennsylvania, USAOntario, CanadaGuadalajara, MexicoBuenos Aires, ArgentinaSao Paulo, Brazil

EUROPE

Woking, EnglandTurnhout, BelgiumCholet, FranceLangenfeld, GermanyHatar, HungaryDublin, IrelandMilano, ItalyNaarden, NetherlandsEast Kilbride, Scotland

ASIA-PACIFIC

Hong Kong, ChinaShenzhen, ChinaBeijing, ChinaChengdu, ChinaGuangxi, ChinaNanjing, ChinaShanghai, ChinaSuzhou, ChinaTianjin, ChinaXiamen, ChinaBangalore, India

Global Sales Support

Chennai, IndiaHiratsuka, JapanSihung City, KoreaPenang, MalaysiaMuntinlupa, PhilippinesSingaporeTaoyuan, TaiwanBangkok, ThailandThomastown, AustraliaAuckland, New ZealandVietnam




AMERICAS

California, USANew Jersey, USAGeorgia, USAGuadalajara, MexicoMonterrey, MexicoBuenos Aires, ArgentinaSao Paulo, BrazilManaus, Brazil

EUROPE

Woking, EnglandTurnhout, BelgiumCholet, FranceLangenfeld, Germany

ASIA-PACIFIC

Hong Kong, ChinaShenzhen, ChinaBeijing, ChinaShanghai, ChinaSuzhou, ChinaTianjin, ChinaBangalore, India

Global Customer Technical Support

Chennai, IndiaHiratsuka, JapanSihung City, KoreaPenang, MalaysiaSingaporeTaoyuan, Taiwan

ALPHA OM -351 Solder Paste · ALPHA® OM-351 is a lead-free, Zero-halogen no-clean solder paste...

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Transcript of ALPHA OM -351 Solder Paste · ALPHA® OM-351 is a lead-free, Zero-halogen no-clean solder paste...