ALPHA ARGOMAX SINTER TECHNOLOGY/media/Files... · 2017-02-13 · ALPHA® ARGOMAX® SINTER...

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ALPHA ® ARGOMAX ® SINTER TECHNOLOGY How can you improve the performance and reliability of your Si/SiC/GaN devices? Introducing ALPHA ® Argomax ® technology for increased die attach reliability and cost effective, high volume manufacturing processes. Environmentally friendly Argomax ® technology was specifically designed for low pressure sintering die attachment, based on highly engineered particles, manu- factured by Alpha. It provides high thermal and electrical conductivity silver bonds, high reliability and flexible bondline thickness. For challenging Si/SiC/GaN die attach processes Argomax ® offers: Low process temperatures from 190°C to 300°C • Recommended sintering pressure 5-10 MPa or higher • High thermal conductivity silver bondline from 200-300 W/m°K • Dies from <1mm 2 to wafers >70,000mm 2 • Bondline from 5μm to 100μm • Lead free and zero voiding • Long shelf life at room temperature • Compatible with attachment to Cu Power Modules Lower Capital Cost Level of Capital Investment 0 1 2 3 4 5 6 7 8 Argomax ® Competition Volume of Production Throughput Less Low High More Argomax ® High Throughput Process Speed Cycles High Thermal Shock Resistance for Extended Die Bond Life ΔT 220°C 2000 >40MPa Bond Strength (die shear)

Transcript of ALPHA ARGOMAX SINTER TECHNOLOGY/media/Files... · 2017-02-13 · ALPHA® ARGOMAX® SINTER...

ALPHA® ARGOMAX® SINTER TECHNOLOGY

How can you improve the performance and reliability of your Si/SiC/GaN devices?Introducing ALPHA® Argomax® technology for increased die attach reliability and cost effective, high volume manufacturing processes.

Environmentally friendly Argomax® technology was specifically designed for low pressure sintering die attachment, based on highly engineered particles, manu­factured by Alpha. It provides high thermal and electrical conductivity silver bonds, high reliability and flexible bondline thickness.

For challenging Si/SiC/GaN die attach processes Argomax® offers:• Low process temperatures from 190°C to 300°C• Recommended sintering pressure 5­10 MPa or higher• High thermal conductivity silver bondline from 200­300

W/m°K• Dies from <1mm2 to wafers >70,000mm2

• Bondline from 5μm to 100μm• Lead free and zero voiding• Long shelf life at room temperature • Compatible with attachment to Cu

Power Modules

Lower Capital Cost

Leve

l of

Cap

ital

Inve

stm

ent

012345678

Argomax®Competition

Volume of Production

Throughput

LessLow

High

More

Argomax®

High Throughput

Pro

cess

Sp

eed

Cycles

High Thermal Shock Resistancefor Extended Die Bond Life

ΔT 220°C

2000

>40MPa

Bo

nd S

tren

gth

(die

she

ar)

Global Headquarters300 Atrium Drive Somerset, NJ 08873 USATel: +1-814-946-1611

European HeadquartersUnit 2, Genesis Business Park Albert Drive, Woking, Surrey, GU21 5RWUKTel: +44 (0) 1483 758400

Asia/Pacific8/F, Paul Y. Centre, 51 Hung To RoadKwun Tong, KowloonHong KongTel: 852-3190-3100

AlphaAssembly.com

For increased Si/SiC/GaN die attach reliability and cost effective, high volume manufacturing processes, contact your Alpha sales representative.

©2016 Alpha Issued 10/16 SM0148-3

ALPHA® Argomax® Sinter Technology delivers many cost savings and process benefits to Si/SiC/GaN die attach.

No DelaminationEven after 800 Thermal Shock Cycles

No. CyclesΔT 220°C

0 200 400 800

Argomax®

SAC 305

Thermal Cycles (–40°C / +175°C, 30 min.)

20

40

60

80

100

0

Cu (CTE 17 ppm/°C)Si (CTE 2 ppm/°C)

300200100

∆ CTE: 15 ppm/°C

400 500

Argomax®

SAC305

Argomax® is Superiorin Independent Tests

% D

elam

inat

ion

ALPHA® ARGOMAX® SINTER TECHNOLOGY

ALPHA® Argomax®

Top Side Bonding

ALPHA®Argomax®

Die AttachALPHA® Argomax®

Heat Spreader Attach

Top Side Contact

Die

Substrate

Heat Spreader

PASTE• Print with Argomax®

2010, 2020 and 5020• Dispense with

Argomax® 2040 and 5040 (Advanced Dispense Technology – ADT)

FILM (foils or rolls)• Laminate large areas

with Argomax® 8010 • Die Transfer Film (DTF)

with Argomax® 8020 • Wafer level process

with Argomax® 8030

PREFORMS• 100% customizable in

shape• Ideal for large area

attachments

ALPHA® Argomax® Sinter Technology is available in four different forms to meet your application needs.

Power modules made with Argomax® SinterTechnology meet the increasingly challengingrequirements of today’s and tomorrow’s powergeneration and consumption applications.

• Si, SiC, GaN, etc.• Multi-chip modules, discretes, cavity

packages, stacked dies, lead frames, and more

• Dies from <1mm2 to wafers >70,000mm2 • Bondlines from 5µm to 100µm

ALPHA® Argomax® for all applications.

Argomax® Sinter TechnologyTECHNICAL PROPERTIES

Granulometry 20nmRec. Processing Temp. 190-300°CThermal Conductivity 200-300W/mKElectrical Resistivity 2.5-3.5 µohm/cmCTE 18 PPM/°CRoom Temp. Storage 6 months

Tem

pera

ture

Pressure

Time

GOOD

BOND