Alain Michel Business Development Manager, Electronics, … UK/staticassets/HFSS... · – Create a...

HFSS for ECAD: HFSS for ECAD: Package Package ModelingModeling, , MMIC and onMMIC and on--die die

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HFSS for ECAD: HFSS for ECAD: Package Package ModelingModeling, , MMIC and onMMIC and on--die die

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Alain MichelAlain MichelAlain MichelAlain Michel

© 2010 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary© 2010 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary

Alain MichelAlain MichelBusiness Development Manager,Business Development Manager,

Electronics, EuropeElectronics, Europe

Alain MichelAlain MichelBusiness Development Manager,Business Development Manager,

Electronics, EuropeElectronics, Europe

• Introduction

• HFSS Solver on Demand in Detail

– Create a project from A to Z

• Application

Agenda

© 2010 ANSYS, Inc. All rights reserved. 2 ANSYS, Inc. Proprietary

• Application

– Package and Board

– MMIC application with UMS PH15 design kit

• Integration in ECAD Flow: ECAD Translator

• New Features in Designer 7.0

• Conclusion

IntroductionIntroductionIntroductionIntroduction


• MCAD (Mechanical Computer-Aided Design) vs. ECAD (Electronic Computer-Aided Design)

– HFSS application can be mostly split into two families:

• Application originally designed with MCAD: Antennas, Connector, Wave Guide, filters …

• Application originally designed with ECAD: PCB, RFIC,

Why HFSS in Ansoft Designer?


• Application originally designed with ECAD: PCB, RFIC, MMIC, Planar Antenna, Package …

• HFSS original GUI perfectly address MCAD application needs

• HFSS Solver on Demand provides a new interface for ECAD application

• Available with Ansoft Designer 6.0

• 2D layout design entry

– Import from APD, ODB++

– Full custom layout

• Layers stackup definition

• Easy of Use with setup automation

HFSS Solver on Demand Overview


• Easily toggle between FEM and MOM solvers

• Support scripted footprint

• HFSS technology for reliable and accurate models

– Adaptative meshing

– 3D Objects: wirebonds, arbitrary shaped vias…

– Finite dielectric

– Support for multimoded wave ports and gap sources

HFSS Solver on Demand HFSS Solver on Demand in Detailin Detail

HFSS Solver on Demand HFSS Solver on Demand in Detailin Detail


• Standard HFSS design entry uses 3D Object

• HFSS in Designer combine 2D drawing with stackupdefinition

Stackup Definition


+=

• Define port by selecting edge

• Solver specific properties

• HFSS gap or wave port available

Easy and Automated Port Setup


• Size setup

• Deembeding available

• PEC launch allows wave port inside air box

Wave Port Setup


• Radiation Boundary for air box

• Dielectric size setup

• Air box size setup

Boundaries Setup


• Solution Frequency

• Adaptive solution

• Mixed order elements and iterative solver available

HFSS Solution Setup


• Rectangular, smith chart … plots

• Current, far and near field display

• Meshing

Post-Processing

-25.00

-12.50

0.00

Y1

Ansoft LLC spir2_20S11_12_dB ANSOFT

Curve Info

S12_3D_HFSSSetup HFSS_gap : Sw eep 1



2.00 4.50 7.00 9.50 12.00 14.50 17.00 19.50F [GHz]

-37.50

5.002.001.000.500.200.00

5.00

-5.00

2.00

-2.00

1.00

-1.00

0.50

-0.50

0.20

-0.20

0.000

10

20

30

40

50

6070

8090100110

120

130

140

150

160

170

180

-170

-160

-150

-140

-130

-120-110

-100 -90 -80-70

-60

-50

-40

-30

-20

-10

spir2_20Smith Chart 1 ANSOFTCurve Info

S(Port1,Port1)Setup HFSS_gap : Sw eep 1

-30.00

-25.00

-20.00

-15.00

-10.00

-5.00

0.00

Y1

Ansoft LLC spir2_20S11_12_dB ANSOFT

Curve Info

S11_3D_MoMSetup 3D MoM edge : Sw eep 1

S12_3D_MoMSetup 3D MoM edge : Sw eep 1



Spirale example

• 1 project 2 setup


2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 20.00F [GHz]

-45.00

-40.00

-35.00

Package and BoardPackage and BoardPackage and BoardPackage and Board


• From 2D to 3D

– Finite dielectric definition in stackup

– Use Bondwire type primitive

– Padstack definition for BGAPad

• Quick and easy port

setup

• Display current

MMIC Package example


• Display current

• Current distribution

Package example


Stackup Parameterization

Bondwire


Via

Imported Package Example

• Import from APD/Allegro

• .mcm, .sip, .brd, .anx

• Import stackup and bondwire profile

• Setup solderball profile

• Automatically port setup for pin

• Cutout sub-design


• Cutout sub-design

Package Cutout

• Cutout region can either be auto generated or determined by user

• Select signal, power and ground nets to create cutout


Cutout package portion Original package layout

Package/PCB Merge

Copy package

Paste into PCB layout

Independent package and board stackup


Board

HFSS Solver on Demand

Final Model in Designer


Dielectrics not rendered

Lumped ports on package bumps

Wave Porton traces end

MMIC application MMIC application with UMS PH15 with UMS PH15

design kitdesign kit

MMIC application MMIC application with UMS PH15 with UMS PH15

design kitdesign kit


• Provide UMS PH15 Design Kit with passive component simulable with HFSS

• Includes parameterized footprint for

– MIM capacitor

– Spirale inductor

UMS Partnership


– Tan and TiWSi Resistors

– Vias

• Footprint are both valid for GDS export and HFSS simulation

• Technology file loads design kit components, layer

definition and stackup

• Stackup is defined with regards to process technology definition given by foundry

What is a Design Kit?


• Create parameterized footprint

– With respect to design rules defined for manufacturing

– With respect to physical design used for HFSS simulation• Layer deposition

• Air bridges

Challenge


• Air bridges

• ….

Source UMS PH15 design guide

• Shape of the same layer is drawn twice

– User type for manufacturing (GDSII export)

– Signal, dielectric or ground for HFSS simulation

• Stackup definition validated with UMS

• Automatically loaded with the technology file

Layer Definition


1.00

Cap_0_26pF_merge_nitrideCap_value ANSOFT

Curve Info

cap_pf

Name X Y

m4 7.5000 0.2929

• Good agreement with UMS model

Simulation results:

MIM capacitor 0.26pf

wint_um=28

lint_um=28.5

CapOnGrid_pF=0.263pF

Port1 Port2


0.00 5.00 10.00 15.00 20.00 25.00 30.00 35.00 40.00F [GHz]

0.00

0.20

0.40

0.60

0.80

Y1

m4m5

m7

m6

cap_pf_UMS_Model

m4 7.5000 0.2929

m5 7.5000 0.2699

m6 30.0000 0.5092

m7 30.0000 0.4319

Name Delta(Y)

d(m4,m5) -0.0230

d(m6,m7) -0.0773

Spiral Inductor 1.91nh

Ldrawn=1.902nH

Port1

Port2


Ldrawn=1.902nHNdrawn=4

Longdrawn=1760um

1.00 6.00 11.00 16.00 20.00F [GHz]

1.00

1.50

2.00

2.50

3.00

Y1

Ansoft LLC Self_1_91nhInd_Value_zoom ANSOFT

Curve Info

ind_nh_HFSS

ind_nh_UMS_Model

-20.00

-15.00

-10.00

-5.00

0.00

Y1

LPFS Parameters ANSOFT

Curve Info

Simple LPF


0.00 10.00 20.00 30.00 40.00 50.00 60.00F [GHz]

-45.00

-40.00

-35.00

-30.00

-25.00

Y1 Curve Info

dB(S(Port1,Port1))

dB(S(Port2,Port1))

• Coupling between components

• No need of internal port

ECAD TranslatorECAD TranslatorECAD TranslatorECAD Translator


What is ECAD Translator?

• It offers direct import of Cadence

– APD, SiP, Allegro, layout files without creation of an .anx file

– Virtuoso with .anx file creation

• Integrated in Designer

• Must have Cadence installed


• Support for ODB++

– Common PCB Manufacturing format

• Supported by Mentor, Zuken, Cadence, Altium

Cadence SPB Integration

– Available through ECAD Translators

– Create models in Cadence SPB that are ready for simulation using HFSS Solver on Demand.


Cadence SPB Integration

– View of the package in the Designer layout editor after export from Allegro Package

Designer


Virtuoso Integration

• User Interface for Solver on Demand model

creation in Virtuoso

– Lumped ports (vertical and horizontal)

– Simulation setup and sweeps

• Improve storage of database for use with

other designs in the same CDN lib.

• Simplify layer stackup

• Cluster via arrays

Solver on Demand


• Cluster via arrays

Virtuoso Layout

Setup for Model Export

Layout Cell View Export Process

• Open layout cell view in Cadence and customized Ansys menu to load cadence interface to export to HFSS

• Load or define material to be used in the stackup

• Define and save stackup (only first


• Define and save stackup (only first time)

• Define port

• Create Flatten cell

• Define Air Box size

• Define HFSS setup

• Export .anx file

• Import .anx file using Ansoft Links from Designer

• Run simulation

Define Stackup

• Add layer in stackup

– Select from LSW Layers for

via and metal

– Add dielectric

– Specify thickness and elevation

• Merge operation (horizontal)


– Metal

– Dielectric

• Combine operation (Vertical)

– Metal

– Dielectric

• Stackup definition saved at selected levels

– Cell view

– Design library

– Reference library

Merge layer: Ground Pattern

example

• Original cell with ground pattern • Flattened cell with 0.5 um setting


• Flattened cell with 1.1 um setting

Via Cluster

• Original cell no via cluster • Flattened cell with via cluster

Original cell no via cluster exported Flattened cell with via cluster


• Original cell no via cluster exported in HFSS Solver on Demand

• Flattened cell with via cluster exported in HFSS Solver on Demand

HFSS Setup

• Define HFSS setup for simulation

– Mesh frequency

– Frequency sweep

– Order of basis functions

– Iterative solver

• Create project


• Create project

– Create an .anx file for importing in Designer

HFSS Solver On Demand Project

• Import from anx file automatically create project ready to solve:

• Stackup definition created

• Port setup

• HFSS setup

• Air Box defined


NET_A_LEFT NET_A_RIGHT

ODB++ Import

• ODB++ Import via Designer Links


HFSS Solver On DemandHFSS Solver On DemandDesigner 7.0Designer 7.0

HFSS Solver On DemandHFSS Solver On DemandDesigner 7.0Designer 7.0


Layout Editor

– One layout editor for 2D and 3D views


HFSS Setup Advanced Setting

• Frequency dependent mesh

• Convergence versus output variable


Parameterized Padstack


• Target ECAD application

• 2D layout design entry

– 2D Layout + Stackup

• Easy and quick setup of an HFSS project

• HFSS technology for reliable and accurate models


Conclusion



– 3D Objects: wirebonds, arbitrary shaped vias…

– Finite dielectric

– Support for multimoded wave ports and gap sources

• ECAD Translator offers powerful link with EDA tool– Preparing model for electromagnetic simulation

– Automates settings: ports, setup, boundaries ...

Thank youThank youThank youThank you


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