AIXTRON Investor Presentation · AIXTRON Investor Presentation IR Presentation – Q1/2015 ......

AIXTRON Investor Presentation IR Presentation – Q1/2015 (FSE: AIXA, ISIN DE000A0WMPJ6, NASDAQ: AIXG, ISIN: US0096061041)

© AIXTRON Investor Relations, April 2015

Forward-Looking Statements

This document may contain forward-looking statements regarding the business, results of operations, financial condition and earnings outlook of AIXTRON within the meaning of the safe harbor provisions of the US Private Securities Litigation Reform Act of 1995. These statements may be identified by words such as “may”, “will”, “expect”, “anticipate”, “contemplate”, “intend”, “plan”, “believe”, “continue” and “estimate” and variations of such words or similar expressions. These forward-looking statements are based on our current views and assumptions and are subject to risks and uncertainties. You should not place undue reliance on these forward-looking statements. Actual results and trends may differ materially from those reflected in our forward-looking statements. This could result from a variety of factors, such as actual customer orders received by AIXTRON, the level of demand for deposition technology in the market, the timing of final acceptance of products by customers, the condition of financial markets and access to financing for AIXTRON, general conditions in the market for deposition plants and macroeconomic conditions, cancellations, rescheduling or delays in product shipments, production capacity constraints, extended sales and qualification cycles, difficulties in the production process, the general development in the semi-conductor industry, increased competition, fluctuations in exchange rates, availability of public funding, fluctuations and/or changes in interest rates, delays in developing and marketing new products, a deterioration of the general economic situation and any other factors discussed in any reports or other announcements field by AIXTRON with the U.S. Securities and Exchange Commission. Any forward-looking statements contained in this document are based on current expectations and projections of the Executive Board and on information currently available to it and are made as at the date hereof. AIXTRON undertakes no obligation to revise or update any forward-looking statements as a result of new information, future events or otherwise, unless expressly required to do so by law.

AIXTRON INVESTOR PRESENTATION

2

Who we are

Headquarters based in Herzogenrath, Germany

Worldwide presence with 12 sales/representatives offices

and production facilities

Company founded in 1983 – over 30 years of experience

760+ employees

Technology leader in deposition systems

More than 3,000 deposition systems delivered

all over the world

State of the art R&D center and demo facilities

Annual R&D budget of approx. € 60 Million

3 About aixtron

Global Presence

ABOUT AIXTRON 4

Our Vision

Technology. Materials. Performance.

Technology. We are the recognized technology leader in complex material deposition.

Materials.

We enable our customers to successfully shape the markets of the future, exploiting the potential offered by new materials.

Performance.

We deliver the performance driving economic success through our expertise, our employees and the quality of our products.

ABOUT AIXTRON 5

One Technology – Multiple Solutions

TECHNOLOGY

6

Technology Deposition Technology

Nano Scale Material Engineering

Systems Compound Semiconductor (MOCVD, OVPD®, PVPDTM, PECVD)

Silicon Semiconductor (PECVD, CVD, ALD. MOCVD)

Applications

• LEDs/OLEDs for displays

• LEDs/OLEDs for lighting

• SiC/GaN for power devices

• Optoelectronics for telecom/datacom

• Organic Electronics

• CD-, DVD-, Blu-ray-lasers

• High frequency for wireless

• III-V Compound and Organic solar cells

• Carbon Nanostructure Applications

• Metal and oxide films for CMOS transistors

• NAND-Flash Memory

• Next generation DRAM Memory

• PCRAM, ReRAM

• III-V for Channel Engineering

• Graphene, CNT

Compound Semiconductors – New AIX R6

• Close Coupled Showerhead® (CCS)

• CoO benefit vs. prior generation systems: > 30%

• Capacity increase vs. largest prior generation system: > 60%

• Throughput benefit vs. prior generation systems: >120%

AIX R6 Setting New Standards in LED Manufacturing

AIXTRON TECHNOLOGIES AND PRODUCTS 7

Annual Equipment Revenues by Application (excl. spares)

OPERATIONS 8

0

100

200

300

400

500

600

700

800

1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014

LED Silicon Power Electronics Optoelectronics* Others

(EUR million)

* Optoelectronics includes applications in Consumer Optoelectronics, Telecom/Datacom, Solar, etc.

Order Intake per Quarter

OPERATIONS 9

Source: Deutsche Bank Equity Research, AIXTRON SE

0

50

100

150

200

250

1Q98

2Q98

3Q98

4Q98

1Q99

2Q99

3Q99

4Q99

1Q00

2Q00

3Q00

4Q00

1Q01

2Q01

3Q01

4Q01

1Q02

2Q02

3Q02

4Q02

1Q03

2Q03

3Q03

4Q03

1Q04

2Q04

3Q04

4Q04

1Q05

2Q05

3Q05

4Q05

1Q06

2Q06

3Q06

4Q06

1Q07

2Q07

3Q07

4Q07

1Q08

2Q08

3Q08

4Q08

1Q09

2Q09

3Q09

4Q09

1Q10

2Q10

3Q10

4Q10

1Q11

2Q11

3Q11

4Q11

1Q12

2Q12

3Q12

4Q12

1Q13

2Q13

3Q13

4Q13

1Q14

2Q14

3Q14

4Q14

*1Q

15

Compound Semiconductor Market China Investments

driven by notebook

backlighting

driven by LED TV

driven by strategic China investments

(EUR million)

driven by mobile phone

penetration

driven by telecom/datacom and mobile phone

* total order intake including spares & service from Q1/15

5-Point-Program - Return to Sustainable Profitability

OPERATIONS 10

Customer

Technology & Products

Finance

Efficiency

Employees

1

2

3

4

5

Focusing on customer benefit

Putting unique technology portfolio to more effective use, further strengthening future products

Optimizing process and project structures systematically

Value driven financial orientation

Strengthening AIXTRON’s culture, instill self-responsibility, fortifying communication

Compound Semiconductors

MOCVD ALD/MOCVD

LEDs, Lasers and

Optoelectronics

• LEDs for display: TVs, mobile phones, tablets, etc.

• LEDs for lighting

• LEDs for automotive

• LEDs for data communication

• Telecom lasers

• Concentrator Photovoltaics

Increasing Equipment

Demand Expected by:

2014/2015

Our Technology Portfolio

11

Silicon Semiconductors

• RF transistors

• AC-DC converters

• DC-DC converters

• Solar inverters

• Motor drives in industrial applications automotive and consumer electronics

Power Management GaN / SiC

• DRAM Dielectric and Metal Electrode

• Flash Inter Poly Dielectric and Metals

• Logic Gate stack

• ReRAM and PCRAM Active element and Electrode

• Logic High Mobility Channel

Silicon Semiconductors


Demand Expected by:

end of 2014/2015


Demand Expected by:

2015

• OLEDs for display: TVs, mobile phones, tablets, etc.

• OLEDs for lighting

• Organic, flexible electronics

• Organic Photovoltaics

• Transistors

• Interconnects

• Flexible Electronics

• Energy Storage

• Sensors, etc.

Organic Electronics Graphene,

CNTs and CNWs

Organic Carbon

OVPD®/PVPD®/(TFE) PECVD


Demand Expected by:

2016/2017


Demand Expected by:

Beyond 2018

AIXTRON TECHNOLOGIES AND PRODUCTS

71.6 72.859.6 64.2 66.4 70.7 65.2

79.0

24 - Month Business Development

Financials 12

Q2/2013 Q3/2013 Q4/2013 Q1/2014 Q2/2014 Q3/2014 Q4/2014 Q1/2015

45.3 46.2 51.1 43.9 46.2 45.6 58.0

40.3

41.4 47.0 49.0 49.5 49.7 50.2 49.3 48.9Order Intake1

(€ million)

Total Revenues

Order Backlog

1) total order intake including spares & service from Q1/2015; adopted for Q2/2013~Q4/2014 for comparison reasons

USD order intake and backlog were recorded at the prevailing budget rate (2015: $1.25/€)

USD revenues were converted at the actual period average FX rate (Q1/2015: $1.156/€)

*

@ $1.30

@ $1.30

@ 1.327

@ $1.35

@ $1.35

@ $1.334

*) revalued on Jan.1, 2015 to €69.0m at $1.25/€

@ $1.25

@ $1.25

@ $1.16

Revenue Analysis

OPERATIONS 13

Q1/2015: by region

Q1/2015: by equipment & spares

72%

28%

Spares

Equipment

Q1/2015: by end application

(equipment only)

49%

34%

9%4%

4%

82%

13%

5%

USA

Europe

Asia

Power Electronics

Silicon

LED

Optoelectronics

Others

Consolidated Income Statement*

14

(€ million) Q1/15 Q1/14

Restated +/- Q1/15

Q4/14 Restated

+/-

Revenues 40.3 43.9 -8% 40.3 58.0 -31%

Cost of sales 31.5 34.01 -7% 31.5 47.61 -34%

Gross profit 8.8 10.01 -12% 8.8 10.41 -15%

Gross Margin 22% 23%1 -1 pp 22% 18%1 4 pp

Selling expenses 3.3 3.11 6% 3.3 4.01 -18%

General & admin expenses 4.3 5.1 -16% 4.3 5.4 -21%

R&D 12.9 13.7 -6% 12.9 21.2 -39%

Net other op.(income)/expenses -3.0 -1.1 -173% -3.0 -1.3 -126%

EBITDA -6.4 -7.1 10% -6.4 -13.9 54%

EBIT -8.8 -10.9 19% -8.8 -18.9 53%

EBIT Margin -22% -25% 3 pp -22% -33% 11 pp

Result before tax -8.5 -10.7 20% -8.5 -18.7 54%

Pre-Tax Margin -21% -24% 3 pp -21% -32% 11 pp

Net result -9.5 -11.8 19% -9.5 -19.1 50%

Net Return on Sales -23% -27% 4 pp -23% -33% 10 pp

Financials

*) rounded figures; may not add up 1) Restated; please refer to “Accounting Policies” in Q1-Report

Consolidated Statement of Financial Position*

15

(€ million) 31/3/15 31/12/14 31/3/14

Property, plant & equipment 79.4 77.3 80.2

Goodwill 65.7 64.8 64.2

Other intangible assets 2.3 2.5 2.8

Others 5.0 4.6 5.6

Non-current assets 152.5 149.2 152.8

Inventories, WIP & Finished Goods 88.8 81.7 67.0

Trade receivables 26.2 26.3 26.2

Others 12.3 8.3 15.0

Cash & Cash Equivalents incl. CD 263.2 268.1 292.0

Current Assets 390.5 384.4 400.3

Shareholders' equity 419.2 415.7 453.1

Non-current liabilities 1.3 1.3 2.2

Trade payables 12.8 16.4 17.1

Advance payments from customers 79.6 66.9 49.8

Others 30.1 33.2 31.0

Current liabilities 122.4 116.5 97.8

Balance Sheet total 543.0 533.5 553.2

Financials

*) rounded figures; may not add up

Consolidated Statement of Cash Flows*

16

(€ million) Q1/15 Q1/14 Q1/15 Q4/14

Cash Flow from operating activities -10.1 -9.8 -10.1 9.8

Cash Flow from investing activities 11.3 -24.3 11.3 -29.3

Cash Flow from financing activities 0.0 0.1 0.0 0.3

Exchange rate changes 6.2 -0.4 6.2 0.7

Net change in Cash & Cash Equivalents 7.4 -34.5 7.4 -18.4

Cash & Cash Equivalents (beginning of period) 116.6 167.5 116.6 135.0

Cash & Cash Equivalents (end of period) 124.0 133.0 124.0 116.6

Change in Cash deposits -14.8 20.3 -14.8 25.4

Free Cash Flow1 -12.12 -13.8 -12.12 5.9

Capex 3.5 4.0 3.5 4.0

Financials

*) rounded figures; may not add up 1) Operating CF + Investing CF + Changes in Cash Deposits 2) Excl. an effect of €-1.5m resulting from a short term loan prior to the acquisition of PlasmaSi Inc.

Market Prospects

Short-Term • Further increasing adoption of LEDs for exterior, public infrastructure & commercial lighting

• Increased adoption of LEDs for consumer & residential lighting

• Market positioning of the new AIX R6 MOCVD tool for LED manufacturing

• Increasing adoption of GaN for power electronics

• Increased emergence of silicon carbide (SiC) hybrid automotive & photovoltaic applications

• Next generation NAND, DRAM & PRAM memory applications

Mid- to Long-Term • Development of organic semiconductors applications using efficient deposition and thin-film

encapsulation technologies

• Development of GaN-on-Si based power electronics or LEDs

• Further development of plastic electronics/flexible TFT backplanes

• Increased development for specialized compound solar cells

• Higher demand for High-k as well as interconnect components

• Progress in the convergence of compound material applications, e. g. substituting materials in the silicon semiconductor industry

• Development of applications using carbon nanostructures including graphene

FUTURE MARKETS 17

AIXTRON INVESTOR PRESENTATION 18

LED Lighting Market: Multiple Tipping Points

INDUSTRY & MARKETS 19

Various Applications

Different Regions

Numerous Players

LED Lighting Cycle

Source: : AIXTRON, McKinsey 2012

0

10,000

20,000

30,000

40,000

50,000

60,000

2014e

2015e

2016e

2017e

2018e

HB L

ED

Mark

et (2

" Equiv

ale

nt W

afe

r in

000)

Mobile & Others Display Lighting

Increasing LED Area Demand Driving Growth


0

50

100

150

2014e

2015e

2016e

2017e

2018e

HB L

ED

Mark

et (b

n u

nits)

Mobile & Others Display Lighting

• Growth through increasing LED-unit and area demand

• Consistent epitaxial area growth will trigger equipment demand

• LED-lighting gaining further momentum

Based on compilation of latest opinions by: DisplaySearch; Strategies Unlimited; Displaybank; Gartner Dataquest; IMS Research.; McKinsey Lighting Report

(0.1mm²) (0.25mm²) (0.75-1mm²)

LED Units 2” Equivalent Wafer

Production Supply 3rd Party Estimates for HB LEDs


• Analysts’ Bull-Bear MOCVD system demand estimates

• Larger area and future replacement to drive equipment demand

• SSL is the strongest driver for material area growth

• Incremental LED units and area growth every year

Based on compilation of latest opinions by: Strategies Unlimited; DisplaySearch; Gartner Dataquest; IMS Res; McKinsey Lighting Report; Baader Bank; Bankhaus Lampe; Berenberg; Canaccord Genuity; CLSA; Commerzbank; Deutsche Bank, DZ Bank; Exane BNP; Goldman Sachs; JG Capital; JP Morgan; Liberum; Morgan Stanley; Needham; Susquehanna; UBS

Incremental LED Units Incremental Material Area

0

5

10

2014e 2015e 2016e 2017e 2018e

Incre

menta

l H

B L

ED

s (b

n u

nits)

Incremental HB LEDs - Units

0

200

400

600

0

1,000

2,000

3,000

4,000

5,000

6,000

7,000

2014e 2015e 2016e 2017e 2018e

Required n

um

ber

of

MO

CVD r

eact

ors

Incr

em

enta

l HB L

EDs

(2"

Equiv

ale

nt

Wafe

r in

000)

Incremental HB LEDs - Area (LHS)

MOCVD Systems - Bear (RHS)

MOCVD Systems - Bull (RHS)

0%

5%

10%

15%

20%

25%

30%

35%

40%

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

201

3

201

4

201

5e

201

6e

201

7e

201

8e

201

9e

202

0e

202

1e

202

2e

LED lamps (LHS)

LED lamps as % of total

LED Lighting Market Estimates


Source: IHS Q1/2015

Globalization and urbanization to drive LED lighting opportunities:

• Emerging countries: need for energy efficient lighting solutions

• Developed countries: SSL driven by expanding renovation market

• Outdoor: Early adoption streetlight replacement market

• Commercial: LED Light Bulb reaching price tipping point

LED Market Forecast Global LED lamp shipments

bill

ion u

nits

LED

penetr

ation

-

2

4

6

8

10

12

14

16

2014 2015e 2016e 2017e 2018e 2019e

Others Automotive Signs Lighting Mobile/Display

Mark

et

size

(in

US$ b

illio

n)

A-19 Bulb: 60W* LED Replacement – Global Pricing


Source: Various websites; AIXTRON

* According to Tab. 6 of EU-Regulation 244/2009 requiring >700lm minimum for 60W

Global Brands: Samsung, Osram, Philips, GE, Toshiba, etc.

New light bulbs with higher lm/W being offered

Brand suppliers increasingly offering attractively priced devices

Regions Halogen CFL LED QoQ +/-

Low High LED vs. Hal.

(x) LED vs. CFL

(x)

Average US $ 1.5 $ 1.7 $ 7 10% $6 $9 4.9x 4.5x

Average Japan $ 1.6 $ 3.2 $ 12 1% $7 $15 7.3x 3.7x

Average EU $ 1.4 $ 4.2 $ 9 10% $7 $14 6.6x 2.2x

Average Korea $ 1.5 $ 3.3 $ 10 1% $7 $13 6.3x 2.9x

Average Taiwan $ 2.5 $ 3.9 $ 9 3% $6 $10 3.5x 2.2x

Average $ 1.7 $ 3.3 $ 9 5% $6 $15 5.5x 2.9x

Compound Semiconductors – System Generations

• Extendibility: Extensive choice of configurations and enhancements

• Scalability: Multiple technologies on one platform

• Productivity: Highest throughput, best yield, fastest growth rates

Two Reactor Technologies Planetary Reactor® & Close Coupled Showerhead® (CCS)


24

Year of Introduction Technology Chambers

2002 • G3 Planetary

• 19x2” CCS

• 24x2”, 8x4”

• 19x2”

2006 • G4 HT Planetary

• CRIUS® CCS

• 42x2”, 11x4”, 6x6”

• 31x2”, 12x3”, 7x4”, 3x6”, 1x12”

2010/ 2011 • G5 HT Planetary

• CRIUS® II-eXL CCS

• 56x2”, 14x4”, 8x6’’, 5x8’’

• 75x2”, 19x4”

2012 • G5+ HT Planetary • 5x8” GaN-on-Si Technology

2014 • G5 WW

• AIX R6

• 12x4”, 8x6”

• 121x2”, 31x4”, 12x6”

Compound Semiconductors – MOCVD

• Addressing multiple industries

• Established industry standard & market leading

• Configurable, extendable common platform

• Introduced the latest MOCVD technology - AIX R6

Two Reactor Technologies Planetary Reactor® & Close Coupled Showerhead® (CCS)


Planetary Reactor®

AIX G5+, 5x8 Close Coupled Showerhead®

AIX R6, 31x4”

• Unique Planetary reactor design

• Horizontal reactor type

• Patented CCS Technology

• Vertical reactor design

Compound Semiconductors for Power Electronics


Source: Yole Développement

GaN/Si | SiC & GaN/Si competition

Superjunction Silicon Technology

Benefits – Compound Semiconductors for Power Electronics

• GaN-on-Si emerging into 30-300V voltage range devices

• GaN-on-Si and SiC to compete for attractive 600V devices

• SiC with superior device performance and reliability for >1,200V

Compound and Silicon Semiconductors – Two Converging Worlds


Compound Semiconductors

• Dominated by Small Wafers – 2”, 4” & 6”

• Low Level of Automation and Fab Integration

• Complex Binning Process Required

• No Industry Wide Roadmap

• AIXTRON G5+ MOCVD Planetary Reactor Offers Flexibility; Accommodating Wafer Sizes From 2” to 200 mm

• Process Migration Path Without Changing Platforms

• 300 mm Wafers (450 mm on Roadmap)

• Fully Automated Fabs

• Excellent Yield Management Practices

• Recognized Industry Roadmap

Silicon Semiconductors - ALD

28

Product Description – ALD

• Up to 3 patented TriJet vaporizers

• Small volume confined process space ensure short ALD cycle time

• > 40 % less precursor consumption • Efficient purge

• Isolated multi wafer processing with

> 40% higher throughput

• Close Coupled Showerhead for uniform distribution

• Flexibility and ease of maintenance

• 300mm ALD Technology

• QXP-8300 Mini-batch system

• High throughput : 2 Process Chambers – 8 stations

• Up to 3 vaporizers and one bubbler

• Applications : DRAM, Logic and Flash High k Dielectric Metal electrode : ReRAM and PCRAM Active elements

• Proven in HVM with >40% lower CoO and >90% Uptime in DRAM and Flash Fabs

“Best-in class technology, state of the art deposition system, lowest CoO”


Product Features

Silicon Semiconductors – ALD and MOCVD

29

Benefits – ALD and MOCVD

• Multi generation film development for Memory and Logic

• Advanced technology nodes require high productivity ALD equipment

• Introduction of new materials drives ALD and MOCVD processes


-

100

200

300

400

500

600

Worldwide Fab Capacity

all nodes

Worldwide Fab Capacity

≤ 22nm

2014 2019e

ReRAM

III-Vs /Si

nanometers

22 Transistor gate length

10

CNT Graphene

14 7

Silicon ICs: “Decade of Materials”

R&D HVM

AIXTRON Positioning

Source: Gartner 2015

(2014: Indexed=100) CAGR: 38%

CAGR: 2%

Rapid growth in advanced tech nodes

5

Metal Gates

High-k dielectrics

Organic Electronics – OVPD®

30

• Proprietary carrier-gas enhanced gas phase deposition approach for organic thin films

• Based on AIXTRON‘s core competence of carrier gas enhanced vapor phase deposition

• Free scalability: suitable for all relevant substrate generations

• Manufacturing technology applicable for OLED displays, OLED lighting, organic semiconductors, and organic photovoltaic

• High deposition rates for high throughput • Reduced thermal stress for organic materials

• High material utilization efficiency • Flexible process control

• Simplified scaling due to

• Close Coupled Showerhead and • Decoupled source technology

• Flexible integration solutions for batch and inline

• Reduced number of deposition chamber and footprint

Product Description – OVPD®

Product Features

“Disruptive deposition technology for cost efficient OLED manufacturing”


AIXTRON in Organic Electronics OVPD + Encapsulation


Source: DisplaySearch, AIXTRON

Front-end Array process equipment

Front-end Cell process equipment

Coating

Etching

Stripping

Test and repair

ITO deposition

Cleaning

Organic material deposition

Encapsulation

Cathode deposition

Cleaning Glass cutting

Bonding

Aging

Final test

Back-end Module process equipment

Targeted technology

OLED manufacturing process

Front-end Cell Process Equipment

MARKET OPPORTUNITIES 32

Cleaning Deposition Cathode

deposition Encapsulation Module

preparation Automation

5%

40%

10% 20%

5%

20%

Cumulative Capex

45%

55%

75%

80%

100%

Focus Activities

Key competency: Thin-film deposition

Value creation: 60%

Source: IHS; AIXTRON internal estimates

Carbon Nanostructures – PECVD

33

Product features

• Proprietary thermal and plasma enhanced chemical vapour deposition technology

• Excellent uniformity and reproducibility with fast turnaround cycle times

• BM platform: BM R&D (2-inch), BM Pro (4-inch and 6-inch), BM GB (4-inch glovebox), BM HT (high temperature, 1,700C), BM300T (300mm)

• Graphene and carbon nanotube films for electronics, energy storage, thermal management, sensors and flexible/transparent applications

Graphene and Carbon Nanotube Deposition Systems

• Fast response heater and turnaround

• Thermal CVD

• Substrate and top heating

• Closed loop infrared wafer temperature control

• Plasma enhanced CVD with frequency control

• Flexible processing for different applications

• Low cost of ownership

• Easy maintenance and cleaning

• User management features and growth library

Graphene (2D) and Carbon nanotube (1D)

Unique combination of high electrical/ thermal conductivity, mobility, flexibility and transparency

Serving R&D market today

AIXTRON BM Pro

Production ready for tomorrow

AIXTRON BM300T

Material Properties

AIXTRON Technology

Enabling Applications


Technology Position


R&D Demo &Qualification Pilot Production High Volume Production

MOCVD for III-V on Silicon

Carbon

Thin-Film Encapsulation for

OLED

OVPD for OLED deposition

ALD for Memory Customer B & C

ALD for Memory Customer A

MOCVD for LEDs, Lasers and

Optoelectronics

MOCVD for Power Management

Global Presence

AIXTRON SE Headquarters

Herzogenrath, Germany

Core of AIXTRON’s activities is

the Technology and R&D Center

near Aachen.

Focus on engineering and

process development in MOCVD

and organic semiconductors.

AIXTRON Inc.

Sunnyvale, California, USA

Focus on silicon applications for

leading suppliers of DRAM and

CMOS.

AIXTRON Ltd.

Cambridge, United Kingdom

Focus on the enhancement of

material sciences and carbon-

nanotechnology research.

35 ABOUT AIXTRON

Financial Calendar & Contact Data

• May 20, 2015 Annual General Meeting, Aachen

• July 28, 2015 H1/2015 Results, Conference Call

• October 2015 9M/2015 Results, Conference Call

• February 2016 FY 2015 Results, Conference Call

For further information please contact:

Investor Relations & Corporate Communications AIXTRON SE Dornkaulstr. 2 52134 Herzogenrath, Germany

IR Team Europe Phone: +49 (241) 8909-444 Email: [email protected]

IR Team USA – Andrea Su Phone: +1 (408) 747-7140 ext. 1292 Email: [email protected]

36

AIXTRON SE Dornkaulstr. 2 52134 Herzogenrath Germany Phone +49 (2407) 9030-0 Fax +49 (2407) 9030-40 E-Mail [email protected]

Thank you very much for your attention.

AIXTRON Investor Presentation · AIXTRON Investor Presentation IR Presentation – Q1/2015 ......

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