Advanced Mezzanine Card Base Specification Advanced Mezzanine Card AMC.0 Specification R2.0,...

PICMG® AMC.0 R2.0

Advanced Mezzanine Card Base Specification

November 15, 2006

©Copyright 2006, PCI Industrial Computer Manufacturers Group.

The attention of adopters is directed to the possibility that compliance with or adoption of PICMG® specifications may require use of an invention covered by patent rights. PICMG® shall not be responsible for identifying patents for which a license may be required by any PICMG® specification or for conducting legal inquiries into the legal validity or scope of those patents that are brought to its attention. PICMG® specifications are prospective and advisory only. Prospective users are responsible for protecting themselves against liability for infringement of patents.

NOTICE:

The information contained in this document is subject to change without notice. The material in this document details a PICMG® specification in accordance with the license and notices set forth on this page. This document does not represent a commitment to implement any portion of this specification in any company's products.

WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE, PICMG® MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF TITLE OR OWNERSHIP, IMPLIED WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS FOR PARTICULAR PURPOSE OR USE.

In no event shall PICMG® be liable for errors contained herein or for indirect, incidental, special, consequential, reliance or cover damages, including loss of profits, revenue, data or use, incurred by any user or any third party. Compliance with this specification does not absolve manufacturers of CompactPCI® Express equipment from the requirements of safety and regulatory agencies (UL, CSA, FCC, IEC, etc.).

PICMG®, CompactPCI®, AdvancedTCA®, ATCA®, CompactPCI® Express and the PICMG, CompactPCI, AdvancedTCA and ATCA logos are regis-tered trademarks, and COM Express™, MicroTCA™, µTCA™, CompactTCA™, AdvancedMC™ and SHB Express™ are trademarks of the PCI Indus-trial Computer Manufacturers Group. All other brand or product names may be trademarks or registered trademarks of their respective holders.

ii PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

Revision History

Revision Level Date Action

R1.0 03-Jan-05 Revision 1.0 with minor changes to Sections 1-5 listed in the Release Notes.

R2.0 15-Nov-06 Revision 2.0 (Incorporates ECN001 and ECN002)

PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 iii

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iv PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

Contents1 Introduction and objectives...........................................................................................................1-1

1.1 Overview............................................................................................................................1-11.2 Introduction ........................................................................................................................1-1

1.2.1 Scope....................................................................................................................1-21.2.2 Design goals .........................................................................................................1-3

1.3 Theory and operation of usage..........................................................................................1-41.3.1 AdvancedMC Bays and Slots ...............................................................................1-51.3.2 AdvancedMC Modules..........................................................................................1-5

1.3.2.1 AdvancedMC Module in a Conventional Bay...........................................1-61.3.2.2 AdvancedMC Module in a Cutaway Bay..................................................1-61.3.2.3 Module Width ...........................................................................................1-71.3.2.4 Module Sizes ...........................................................................................1-7

1.3.3 Carrier Types ........................................................................................................1-81.3.4 AdvancedMC Connector.......................................................................................1-91.3.5 Module Management ............................................................................................1-91.3.6 Module Power.......................................................................................................1-91.3.7 Module Interconnect .............................................................................................1-9

1.4 Special word usage .........................................................................................................1-101.5 Statement of compliance .................................................................................................1-101.6 Dimensions ......................................................................................................................1-111.7 Regulatory guidelines ......................................................................................................1-111.8 Reference specifications..................................................................................................1-111.9 Name and logo usage......................................................................................................1-121.10 Signal naming convention................................................................................................1-131.11 Intellectual property .........................................................................................................1-131.12 Glossary...........................................................................................................................1-14

2 Mechanical ...................................................................................................................................2-12.1 Mechanical overview .........................................................................................................2-2

2.1.1 Orientation and references ...................................................................................2-42.1.2 Dimensions and tolerances ..................................................................................2-7

2.2 Module requirements .........................................................................................................2-82.2.1 Module PCB dimensions ......................................................................................2-8

2.2.1.1 Single Module PCB dimensions...............................................................2-92.2.1.2 Double Module PCB dimensions ...........................................................2-102.2.1.3 Suggested/ vendor-specific Module PCB Face Plate attachment .........2-112.2.1.4 Module ESD Strip ..................................................................................2-142.2.1.5 Module PCB thickness...........................................................................2-172.2.1.6 Module PCB warpage and stiffening......................................................2-17

2.2.2 Module Card-edge Interface dimensions ............................................................2-182.2.3 Module sizes.......................................................................................................2-21

2.2.3.1 Compact Module dimensions.................................................................2-222.2.3.2 Mid-size Module dimensions..................................................................2-232.2.3.3 Full-size Module dimensions..................................................................2-252.2.3.4 Voltage limits for components on Modules ............................................2-26

2.2.4 Module Face Plate ..............................................................................................2-262.2.4.1 Module LEDs .........................................................................................2-292.2.4.2 Module Face Plate labels.......................................................................2-33

2.2.5 Module Handle....................................................................................................2-34

PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 v

2.2.5.1 Module Latch Mechanism......................................................................2-372.2.5.2 Module Hot Swap Switch.......................................................................2-39

2.2.6 Module EMC Gasket...........................................................................................2-392.2.7 Filler Module .......................................................................................................2-422.2.8 Module mass ......................................................................................................2-45

2.3 AMC Bay requirements....................................................................................................2-452.3.1 Card Guides and Struts ......................................................................................2-452.3.2 Cutaway Bay.......................................................................................................2-47

2.3.2.1 AMC Connector placement for Cutaway Bay ........................................2-472.3.2.2 Cutaway Bay dimensions ......................................................................2-53

2.3.3 Conventional Bay................................................................................................2-572.3.3.1 AMC Connector placement for Conventional Bay .................................2-572.3.3.2 Conventional Bay dimensions ...............................................................2-612.3.3.3 Conventional Bay component allowance...............................................2-622.3.3.4 Voltage limits for components on Carriers.............................................2-642.3.3.5 Conventional Bay opening.....................................................................2-64

2.4 Carrier requirements........................................................................................................2-652.4.1 Carrier AdvancedTCA Board orientation ............................................................2-662.4.2 Bay and Slot locations ........................................................................................2-66

2.4.2.1 Double-Bay locations.............................................................................2-682.4.3 AMC Carrier AdvancedTCA Board dimensions..................................................2-69

2.4.3.1 Carrier PCB support interfaces - Cutaway.............................................2-692.4.3.2 Carrier PCB support interfaces - Conventional......................................2-722.4.3.3 Carrier PCB thickness ...........................................................................2-742.4.3.4 Carrier PCB warpage.............................................................................2-742.4.3.5 Carrier PCB stiffening ............................................................................2-74

2.4.4 AdvancedTCA Card Guides and Struts ..............................................................2-752.4.4.1 Card Guide and Strut Dimensions .........................................................2-76

2.4.5 Component Covers.............................................................................................2-782.4.6 Carrier AdvancedTCA Board Face Plate............................................................2-79

2.4.6.1 Carrier AdvancedTCA Board Face Plate labels ....................................2-812.4.6.2 Carrier AdvancedTCA Board LEDs .......................................................2-83

2.4.7 Carrier AdvancedTCA Board Handle mechanism ..............................................2-852.4.8 Carrier AdvancedTCA Board EMC Gasket.........................................................2-89

2.5 Module insertion sequencing ...........................................................................................2-93

3 Hardware platform management ..................................................................................................3-13.1 Overview............................................................................................................................3-1

3.1.1 IPMI and IPMB architecture overview...................................................................3-13.1.2 Module and Carrier Power architecture overview.................................................3-23.1.3 Module and Carrier requirements .........................................................................3-23.1.4 Overall relationship with IPMI and PICMG Specifications ....................................3-33.1.5 Determining the supported version of PICMG extensions....................................3-3

3.2 Module management interconnects...................................................................................3-43.2.1 Geographic Address [2..0] (GA[2..0]) ...................................................................3-53.2.2 PS0# and PS1# ....................................................................................................3-93.2.3 ENABLE#..............................................................................................................3-93.2.4 IPMB-L................................................................................................................3-103.2.5 Payload Power (PWR)........................................................................................3-103.2.6 Management Power (MP)...................................................................................3-10

3.3 Additional local Module functionality................................................................................3-11

vi PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

3.3.1 BLUE LED ..........................................................................................................3-113.3.2 LED 1 (mandatory) and other LEDs (optional)....................................................3-123.3.3 Module Handle signal .........................................................................................3-123.3.4 MMC watchdog timer ..........................................................................................3-12

3.4 Module hardware requirements for management............................................................3-133.5 Carrier hardware requirements for management.............................................................3-153.6 Module operational state management ...........................................................................3-17

3.6.1 Typical Module insertion .....................................................................................3-183.6.2 Typical Module extraction ...................................................................................3-213.6.3 Alternate Module extraction options ...................................................................3-233.6.4 Module reinsertion ..............................................................................................3-233.6.5 Behavior during Shelf power-up or Module-equipped Carrier insertion ..............3-243.6.6 Module Hot Swap sensor....................................................................................3-243.6.7 Behavior during Carrier extraction with Modules ................................................3-293.6.8 Communication lost ............................................................................................3-29

3.7 Power management.........................................................................................................3-303.7.1 Module Current Requirements record.................................................................3-313.7.2 Carrier Activation and Current Management record ...........................................3-32

3.8 Cooling management.......................................................................................................3-343.9 E-Keying ..........................................................................................................................3-35

3.9.1 Point-to-point E-Keying.......................................................................................3-363.9.1.1 Carrier point-to-point connectivity information .......................................3-363.9.1.2 AdvancedMC point-to-point interface information..................................3-383.9.1.3 Example: Carrier and AdvancedMC FRU Information ...........................3-453.9.1.4 Set AMC Port State command...............................................................3-503.9.1.5 Get AMC Port State command ..............................................................3-51

3.9.2 Clock E-Keying ...................................................................................................3-533.9.2.1 Clock E-Keying process.........................................................................3-543.9.2.2 Carrier clock interconnections................................................................3-573.9.2.3 Clock configuration information..............................................................3-603.9.2.4 Clock Configuration record examples ....................................................3-673.9.2.5 Clock control commands........................................................................3-71

3.10 Module Payload control ...................................................................................................3-743.11 Module sensor management ...........................................................................................3-76

3.11.1 Module SDR requirements .................................................................................3-763.11.2 Carrier IPMC SDR requirements ........................................................................3-77

3.12 FRU Information ..............................................................................................................3-793.12.1 FRU Information access commands...................................................................3-80

3.12.1.1 Carrier FRU Information requirements...................................................3-803.12.1.2 MMC requirements ................................................................................3-80

3.13 Explicit message bridging ................................................................................................3-813.13.1 Discovery of IPMB-L addresses..........................................................................3-823.13.2 Message flows and requirements .......................................................................3-82

3.14 AMC.0 FRU records, sensors, and entity IDs..................................................................3-863.15 IPMI functions and commands ........................................................................................3-87

3.15.1 Required Carrier IPMC and MMC functions .......................................................3-873.15.2 Command assignments ......................................................................................3-89

4 Power distribution .........................................................................................................................4-14.1 Overview............................................................................................................................4-14.2 Modules .............................................................................................................................4-2

PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 vii

4.2.1 Payload Power......................................................................................................4-24.2.1.1 Power.......................................................................................................4-24.2.1.2 Voltage.....................................................................................................4-3

4.2.2 Management Power..............................................................................................4-34.2.3 Grounding .............................................................................................................4-3

4.2.3.1 Logic Ground ...........................................................................................4-34.2.3.2 Shelf Ground............................................................................................4-3

4.3 Carriers ..............................................................................................................................4-44.3.1 Payload Power......................................................................................................4-4

4.3.1.1 Voltage.....................................................................................................4-44.3.1.2 Current.....................................................................................................4-4

4.3.2 Management Power..............................................................................................4-54.3.3 Grounding .............................................................................................................4-54.3.4 Module power interface ........................................................................................4-5

4.3.4.1 Hot Swap precautions..............................................................................4-74.4 ESD protection...................................................................................................................4-84.5 Gasket and Face Plate Shielding ......................................................................................4-8

5 Thermal ........................................................................................................................................5-15.1 Introduction ........................................................................................................................5-1

5.1.1 Baseline thermal conditions..................................................................................5-25.2 Airflow volume ...................................................................................................................5-2

5.2.1 Carrier airflow .......................................................................................................5-35.2.2 Module airflow.......................................................................................................5-7

5.3 Temperature ......................................................................................................................5-9

6 Interconnect..................................................................................................................................6-16.1 Connector contact allocation .............................................................................................6-1

6.1.1 Pin naming conventions........................................................................................6-26.1.1.1 Fabric Interface naming conventions.......................................................6-26.1.1.2 AMC Clock Interface naming convention.................................................6-3

6.1.2 Contact assignments ............................................................................................6-46.1.3 AMC Carrier connector pin assignment for the B+ footprint .................................6-66.1.4 AMC Carrier connector pin assignment for the AB footprint.................................6-76.1.5 AMC Carrier connector pin assignment for the A+B+ footprint.............................6-8

6.2 Fabric Interface................................................................................................................6-106.2.1 Fabric Interface electrical requirements for LVDS ..............................................6-116.2.2 Fabric Interface electrical requirements for non-LVDS.......................................6-13

6.3 AMC Clock Interface........................................................................................................6-136.3.1 AMC Clock architecture ......................................................................................6-146.3.2 AMC Clock electrical interface............................................................................6-186.3.3 Telecom Clock Interface .....................................................................................6-19

6.3.3.1 SONET/ SDH/ PDH line cards and applications....................................6-196.3.3.2 SONET/ SDH/ PDH System Timing Modules........................................6-22

6.3.4 Fabric Clock........................................................................................................6-246.4 JTAG Interface.................................................................................................................6-246.5 System integration guidelines..........................................................................................6-266.6 AMC Carrier fabric topologies..........................................................................................6-27

6.6.1 Fundamental routing models ..............................................................................6-276.6.1.1 Centralized AMC Carrier switch model..................................................6-276.6.1.2 Module-to-Module direct connectivity model .........................................6-28

viii PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

6.7 Guidance for AMC.0 subsidiary specifications ................................................................6-286.7.1 Fat Pipes Region ................................................................................................6-306.7.2 Common options region......................................................................................6-306.7.3 Extended options region .....................................................................................6-30

6.7.3.1 Non-LVDS interface guidance ...............................................................6-316.7.4 Naming conventions ...........................................................................................6-31

6.7.4.1 General naming guidelines ....................................................................6-31

7 AMC Connector ............................................................................................................................7-17.1 General information ...........................................................................................................7-1

7.1.1 AMC Connector options........................................................................................7-27.1.2 Family of AMC Connector styles...........................................................................7-37.1.3 Contact protection mechanism (optional) .............................................................7-5

7.2 Dimensions ........................................................................................................................7-67.2.1 Dimensions of AMC Connectors style B and style B+ ..........................................7-77.2.2 Dimensions of AMC Connector style AB ............................................................7-117.2.3 Dimensions of AMC Connector style A+B+ ........................................................7-157.2.4 Compression Connector braces for the Carrier Board........................................7-197.2.5 Compression mount Connector Carrier board layout .........................................7-207.2.6 PCB plating for compression Connectors ...........................................................7-24

7.3 Electrical characteristics ..................................................................................................7-247.3.1 Creepage and Clearance distances ...................................................................7-247.3.2 Voltage proof ......................................................................................................7-257.3.3 Current carrying capacity ....................................................................................7-267.3.4 Line resistance....................................................................................................7-277.3.5 Insulation resistance ...........................................................................................7-287.3.6 Inductance ..........................................................................................................7-287.3.7 Engagement under electrical load ......................................................................7-28

7.4 High-speed characteristics ..............................................................................................7-297.4.1 Differential impedance ........................................................................................7-297.4.2 Differential return loss.........................................................................................7-307.4.3 Differential attenuation........................................................................................7-307.4.4 Differential pair cross talk ...................................................................................7-317.4.5 Propagation characteristics ................................................................................7-31

7.5 Mechanical characteristics...............................................................................................7-337.5.1 Mechanical operation..........................................................................................7-337.5.2 Engaging and separating forces .........................................................................7-337.5.3 Gauge retention force .........................................................................................7-347.5.4 Vibration (sinusoidal) ..........................................................................................7-347.5.5 Shock..................................................................................................................7-347.5.6 Retention of AMC Connector on Carrier Board ..................................................7-357.5.7 Compression connection - remounting operation ...............................................7-357.5.8 Termination-specific testing ................................................................................7-35

7.6 Test schedule ..................................................................................................................7-367.6.1 Specimens ..........................................................................................................7-367.6.2 Test and measurement arrangements................................................................7-37

7.6.2.1 Arrangement for contact resistance and disturbance measurement .....7-377.6.2.2 Arrangement for insulation resistance measurement and voltage

proofing ...............................................................................................7-387.6.2.3 Arrangement for current carrying capacity proofing...............................7-397.6.2.4 Arrangement for signal integrity validation.............................................7-40

PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 ix

7.6.2.5 Arrangement for dynamic stress tests ...................................................7-437.7 Test schedule tables........................................................................................................7-43

7.7.1 Group P - Preliminary .........................................................................................7-447.7.2 Group A - Mixed Flowing Gas.............................................................................7-457.7.3 Group B - Mechanical endurance and Dust........................................................7-487.7.4 Group C - Thermal shock and moisture..............................................................7-507.7.5 Group D - High temperature and electrical load .................................................7-527.7.6 Group E - Signal integrity validation ...................................................................7-53

A AMC mating conditions..................................................................................................................... A-1A.1 Purpose ............................................................................................................................ A-1A.2 Alignment conditions......................................................................................................... A-1

A.2.1 Alignment in width direction (parallel to the plane of the Module PCB) ............... A-1A.2.1.1 Nominal width dimensions ...................................................................... A-1A.2.1.2 Alignment of the Module PCB to the Connector ..................................... A-2A.2.1.3 Minimum overlap between Module PCB and Card Guide rail ................ A-2A.2.1.4 Area for non-insulated components........................................................ A-2A.2.1.5 Inclination in width direction.................................................................... A-3

A.2.2 Alignment in height direction (perpendicular to the plane of the Module PCB) ... A-5A.2.2.1 Nominal height dimensions (for both slots)............................................. A-5A.2.2.2 Free alignment in height direction (both slots)........................................ A-5

A.3 Mating depth conditions.................................................................................................... A-5B Signal integrity analysis and guidelines............................................................................................ B-1

B.1 Modeling parameters ........................................................................................................ B-1B.2 De-emphasis..................................................................................................................... B-2B.3 Representative eye patterns............................................................................................. B-2B.4 Discussion of results and recommendations .................................................................... B-2

C Regulatory standards ....................................................................................................................... C-1C.1 All equipment .................................................................................................................... C-1

C.1.1 Safety (North America and Europe)..................................................................... C-1C.1.2 Electromagnetic compatibility (North America and Europe) ................................ C-1

C.2 Equipment for use in telecommunications central offices................................................. C-2C.2.1 Safety................................................................................................................... C-2C.2.2 Electromagnetic compatibility .............................................................................. C-2C.2.3 Environmental requirements................................................................................ C-2

C.2.3.1 NEBS–USA............................................................................................. C-2C.2.3.2 ETSI–Europe .......................................................................................... C-3C.2.3.3 Additional customer-specific recommendations ..................................... C-3

C.2.4 Additional Considerations .................................................................................... C-4C.3 Ecology standards ............................................................................................................ C-4C.4 Reliability/MTBF standards............................................................................................... C-4C.5 Cross reference list........................................................................................................... C-5

D Module Handle designs .................................................................................................................... D-1D.1 Handle concept 1 - Original Handle design and variants.................................................. D-2D.2 Handle concept 2 - Pivot Handle ...................................................................................... D-3D.3 Handle concept 3 - Push, Pull .......................................................................................... D-5

E Requirements Index ......................................................................................................................... E-1

x PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

Figures1-1 Four AdvancedMC Modules on an AMC Carrier AdvancedTCA Board ....................................1-21-2 General orientation and insertion of AdvancedMC Modules .....................................................1-41-3 Mid-size Module in a Conventional Bay (Section View) ............................................................1-61-4 Stacked Compact Modules in a Cutaway Bay (Section View)...................................................1-61-5 Full-size Module in a Cutaway Bay (Section View) ...................................................................1-62-1 Typical AMC Carrier AdvancedTCA Boards with AMC Modules ..............................................2-12-2 AMC orientation .........................................................................................................................2-32-3 AMC datums and references .....................................................................................................2-52-4 Single Module PCB dimensions ................................................................................................2-92-5 Double Module PCB dimensions ............................................................................................2-102-6 Example PCB Face Plate mounting for Single Modules..........................................................2-122-7 Example PCB Face Plate mounting for Double Modules ........................................................2-132-8 Module ESD Strip dimensions .................................................................................................2-142-9 ESD assembly cross section ...................................................................................................2-152-10 ESD assembly cross section - Detail A ...................................................................................2-162-11 Module PCB Card-edge Interface bow and twist measurement..............................................2-172-12 Module Card-edge Interface dimensions.................................................................................2-192-13 Module Card-edge Interface contact detail..............................................................................2-202-14 Compact Module component envelope ...................................................................................2-222-15 Mid-size Module component envelope ....................................................................................2-232-16 Full-size Module component envelope ....................................................................................2-252-17 Module Face Plate dimensions................................................................................................2-282-18 AMC Module LEDs ..................................................................................................................2-302-19 Example Modules on Cutaway and Conventional Carrier AdvancedTCA Boards...................2-312-20 Vendor and PICMG label dimensioning and positioning .........................................................2-332-21 Module Handle positions during Hot Swap with example handle ............................................2-352-22 Module Latch Mechanism dimensions and actuation ..............................................................2-382-23 EMC Gasket dimensions .........................................................................................................2-412-24 Filler Module example..............................................................................................................2-432-25 AMC Connector placement for a Cutaway Bay .......................................................................2-482-26 Cutaway Bay PCB for B/ B+ Connector ..................................................................................2-492-27 Cutaway Bay PCB for AB and A+B+ Connector......................................................................2-502-28 Cutaway Bay AMC Connector detail .......................................................................................2-512-29 Double Cutaway Bay AMC Connector detail ...........................................................................2-522-30 Cutaway Bay dimensions ........................................................................................................2-542-31 Card Guide and Strut detail .....................................................................................................2-552-32 Double Cutaway Bay dimensions ............................................................................................2-562-33 AMC Connector placement for Conventional Bay ..................................................................2-582-34 Conventional Bay AMC Connector detail ................................................................................2-592-35 Double Conventional Bay AMC Connector detail ....................................................................2-602-36 Single AMC Conventional Bay dimensions .............................................................................2-612-37 Double AMC Conventional Bay dimensions ............................................................................2-622-38 Conventional Bay component height allowance for Mid-size Modules....................................2-632-39 Conventional Bay component height allowance for Compact Modules...................................2-632-40 Stacked Bay location and naming convention, Cutaway Carrier AdvancedTCA Board

example ...................................................................................................................................2-672-41 Full-size Modules installed on an Cutaway Carrier AdvancedTCA Board...............................2-682-42 Double Bay location and naming example ..............................................................................2-692-43 Cutaway Carrier Board dimensions for B/B+ Connector - PICMG 3.0 ....................................2-70

PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 xi

2-44 Cutaway Carrier Board dimensions for AB and A+B+ Connector - PICMG 3.0 ......................2-712-45 Conventional Carrier Board dimensions - PICMG 3.0.............................................................2-732-46 Card Guide assembly dimensions for Cutaway Bay ...............................................................2-762-47 Card Guide assembly dimensions for Conventional Bay .......................................................2-772-48 Cutaway Carrier AdvancedTCA Board Face Plate dimensions ..............................................2-802-49 Conventional Carrier AdvancedTCA Board Face Plate dimensions .......................................2-812-50 Cutaway Carrier AdvancedTCA Board labels .........................................................................2-822-51 Conventional Carrier LEDs......................................................................................................2-842-52 Cutaway Carrier LEDs.............................................................................................................2-852-53 Conventional Carrier Handle example.....................................................................................2-862-54 Cutaway Carrier Handle example............................................................................................2-872-55 Cutaway Carrier AdvancedTCA Board EMC Gasket placement .............................................2-892-56 Conventional Carrier AdvancedTCA Board EMC Gasket placement ......................................2-902-57 Carrier AdvancedTCA Board EMC Gasket nominal compression ..........................................2-913-1 Module management infrastructure...........................................................................................3-23-2 Management interconnects between Carrier and Module.........................................................3-53-3 Module management hardware...............................................................................................3-133-4 Carrier management hardware................................................................................................3-153-5 FRU state transition diagram for AMC.....................................................................................3-183-6 Hot Swap management: typical Module insertion ...................................................................3-213-7 Hot Swap management: typical Module extraction .................................................................3-233-8 Power distribution management architecture ..........................................................................3-313-9 Relationship among fields of an AdvancedMC Point-to-Point Connectivity record .................3-403-10 Carrier Board with four AdvancedMCs ....................................................................................3-463-11 Example of Carrier clock distribution .......................................................................................3-543-12 Clock E-Keying process flow diagram .....................................................................................3-563-13 Example of Carrier Clock configuration ...................................................................................3-683-14 Message bridging ....................................................................................................................3-834-1 Power distribution block diagram ..............................................................................................4-14-2 Module power interface .............................................................................................................4-64-3 Module ESD Strip circuitry.........................................................................................................4-84-4 Shielding effectiveness..............................................................................................................4-95-1 Airflow impedance .....................................................................................................................5-35-2 Typical airflow pattern ...............................................................................................................5-45-3 Using an airflow mitigation device for more even cooling..........................................................5-45-4 Airflow zones of Modules and Carriers......................................................................................5-55-5 Carrier airflow impedance by zone ............................................................................................5-65-6 Example cross-sectional plane perpendicular to airflow............................................................5-65-7 Module airflow impedance by zone ...........................................................................................5-86-1 Fabric Interface naming convention ..........................................................................................6-36-2 Channel test points – Module to Module routing model example............................................6-116-3 Channel test points – Module to Carrier routing model example.............................................6-126-4 Point-to-point M-LVDS clocking scheme ................................................................................6-156-5 Example Clock generator circuit ..............................................................................................6-166-6 Example master Clock generator AMC ...................................................................................6-166-7 Example line synchronous AMC Module.................................................................................6-176-8 Example Carrier Telecom Clock implementation ....................................................................6-176-9 Centralized switch model.........................................................................................................6-276-10 Module-to-Module direct connectivity ......................................................................................6-286-11 AMC Port mapping regions .....................................................................................................6-29

xii PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

7-1 Overview of AMC Connector housings......................................................................................7-47-2 Overview of Connector housings with optional protrusions .......................................................7-57-3 Overall dimensions of AMC compression Connector style B and style B+................................7-77-4 View on the compression mounted bottom of AMC Connector style B .....................................7-87-5 View on the compression mounted bottom of AMC Connector style B+ ...................................7-97-6 Overall dimensions of AMC general Connector definition style B and B+...............................7-107-7 Overall dimensions of compression mounted AMC Connector style AB .................................7-117-8 View on compression mounted bottom of AMC Connector style AB.......................................7-127-9 Overall dimensions of AMC general Connector definition style AB .........................................7-147-10 Overall dimensions of compression mounted AMC Connector style A+B+.............................7-157-11 View on compression mounted bottom of AMC Connector style A+B+...................................7-167-12 Overall dimensions of AMC general Connector definition style A+B+.....................................7-187-13 Connector brace plate for compression mounted AMC Connectors style B, B+ and AB ........7-197-14 Connector brace plate for compression mounted AMC Connector style A+B+.......................7-207-15 B/ B+ Compression Connector PCB pad layout ......................................................................7-217-16 AB Compression Connector PCB pad layout ..........................................................................7-227-17 A+B+ Compression Connector PCB pad layout ......................................................................7-237-18 Derating curve for individual Connector contacts ....................................................................7-267-19 Typical impedance profile, including connections (example for guidance only) ......................7-297-20 Typical return loss profile, including connections (example for guidance only) .......................7-307-21 Typical attenuation profile, including connections (example for guidance only) ......................7-317-22 Propagation delay....................................................................................................................7-327-23 Arrangement for contact resistance measurement in Set 1.....................................................7-377-24 Arrangement for contact disturbance measurement in Set 1 ..................................................7-387-25 Layout of test boards Set 2......................................................................................................7-387-26 Layout of test boards Set 3......................................................................................................7-397-27 Placement of temperature probes ...........................................................................................7-407-28 Layout of the Carrier test board for set 4 .................................................................................7-417-29 Layout of the Module test PCB for set 4 ..................................................................................7-427-30 Fixture for dynamic stress tests ...............................................................................................7-43A-1 Insertion depth difference due to inclined insertion .................................................................. A-4B-1 Module to Carrier with trace length of 28cms at 5 Gbps........................................................... B-3B-2 Module to Carrier to Module with trace length of 46cms at 5 Gbps.......................................... B-4D-1 Original AMC Module Handle ................................................................................................... D-2D-2 New grip variant of Original Handle .......................................................................................... D-3D-3 Pivot handle in locked and unlocked positions ......................................................................... D-4D-4 Push-Pull handle positions ....................................................................................................... D-5D-5 Push-Pull handle variations and details.................................................................................... D-5

PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 xiii


xiv PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

Tables1-1 AMC.x subsidiary specifications........................................................................................... 1-31-2 Face Plate Connectors that fit on the different Module sizes ............................................... 1-81-3 Sample Module configurations and functionality .................................................................. 1-81-4 AdvancedMC terms............................................................................................................ 1-142-1 Module and AMC Bay compatibility matrix........................................................................... 2-42-2 AMC datum and reference line definition for Figure 2-3....................................................... 2-62-3 Sample drawing symbols ..................................................................................................... 2-62-4 General tolerance guidelines for AMC Module and Carrier PCBs ....................................... 2-72-5 General tolerance guideline for Module and Carrier envelope and other mechanical

components.......................................................................................................................... 2-72-6 Double Module PCB Mid-Board Component restrictions for Figure 2-5............................. 2-112-7 Card-edge Interface mating distances ............................................................................... 2-212-8 Voltage thresholds (working voltages) ............................................................................... 2-262-9 Module Face Plate tabulated dimensions for Figure 2-17.................................................. 2-292-10 Module Handle position sequence ..................................................................................... 2-362-11 Uncompressed and compressed EMC Gasket thicknesses .............................................. 2-402-12 EMC Gasket tabulated dimensions A and B for Figure 2-23.............................................. 2-422-13 Filler Module tabulated dimensions for Figure 2-24 ........................................................... 2-442-14 Conventional Bay opening tabulated dimensions for Figure 2-36 and Figure 2-37 ........... 2-652-15 Carrier AdvancedTCA Board Card Guide/Strut tabulated dimensions for Figure 2-46

and Figure 2-47 .................................................................................................................. 2-782-16 Module insertion sequencing.............................................................................................. 2-933-1 Get PICMG Properties command for MMCs........................................................................ 3-43-2 Geographic Address, IPMB-L address, and AdvancedMC Slot ID ...................................... 3-63-3 Carrier Information Table ..................................................................................................... 3-73-4 Example Carrier IPMB-L address and Physical Address mapping ...................................... 3-83-5 Get Address Info command extensions for Carrier IPMCs .................................................. 3-83-6 Module-specific, management-related signals .................................................................. 3-143-7 Carrier-specific management-related signals..................................................................... 3-153-8 Module Hot Swap event message...................................................................................... 3-243-9 Get Sensor Reading (Module Hot Swap sensor) ............................................................... 3-253-10 Module Current Requirements record ................................................................................ 3-313-11 Carrier Activation and Current Management record........................................................... 3-323-12 Module Activation and Current Descriptor.......................................................................... 3-343-13 Carrier Point-to-Point Connectivity record.......................................................................... 3-373-14 Point-to-Point AdvancedMC Resource Descriptor ............................................................. 3-373-15 Point-to-Point Port Descriptor............................................................................................. 3-383-16 AdvancedMC Point-to-Point Connectivity record ............................................................... 3-393-17 AMC Channel Descriptor.................................................................................................... 3-413-18 AMC Link Descriptor Asymmetric Match field values......................................................... 3-423-19 AMC Link Descriptor .......................................................................................................... 3-423-20 AMC Link Designator ......................................................................................................... 3-433-21 AMC Link Type................................................................................................................... 3-443-22 Point-to-Point Descriptors for AdvancedMC Slot A1 in Carrier FRU Information............... 3-473-23 Example AdvancedMC Channel Descriptors for AdvancedMC in Slot A1 ......................... 3-483-24 Example AdvancedMC Link Descriptors for AdvancedMC in Slot A1................................ 3-483-25 Example AMC Channel Descriptors for on-Carrier device ID 0 ......................................... 3-503-26 Example Link Descriptors for on-Carrier device ID 0 ......................................................... 3-50

PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 xv

3-27 Set AMC Port State command ........................................................................................... 3-513-28 Get AMC Port State command........................................................................................... 3-523-29 Carrier Clock Point-to-Point Connectivity record................................................................ 3-573-30 Clock Point-to-Point Resource descriptor .......................................................................... 3-583-31 Clock Resource ID definition.............................................................................................. 3-583-32 Point-to-Point Clock Connection descriptor ....................................................................... 3-583-33 Predefined Clock IDs for AMC clocks ................................................................................ 3-593-34 Predefined Clock IDs for ATCA Backplane clocks............................................................. 3-593-35 Clock Configuration record................................................................................................. 3-613-36 Clock Configuration descriptor ........................................................................................... 3-613-37 Indirect Clock descriptor..................................................................................................... 3-623-38 Direct Clock descriptor ....................................................................................................... 3-633-39 Clock Family definition ....................................................................................................... 3-633-40 Well known AMC clock frequencies ................................................................................... 3-643-41 SONET/ SDH Clock accuracy level ................................................................................... 3-653-42 Example clock resource configuration for Figure 3-13....................................................... 3-693-43 Example Indirect Clock descriptor ..................................................................................... 3-703-44 Set Clock State command.................................................................................................. 3-723-45 Get Clock State command ................................................................................................. 3-733-46 FRU Control command ...................................................................................................... 3-753-47 Get Device Locator Record ID ........................................................................................... 3-793-48 Send Message request ...................................................................................................... 3-843-49 Send Message reply .......................................................................................................... 3-853-50 PICMG AMC.0 FRU records: type ID = C0h (OEM) .......................................................... 3-863-51 PICMG AMC.0 sensors: Event/ reading type code = sensor specific (6Fh)....................... 3-873-52 PICMG AMC.0 entity IDs ................................................................................................... 3-873-53 IPMI, BMC, Carrier, and Module IPM functions ................................................................. 3-873-54 Command number assignments and requirements ........................................................... 3-893-55 Command privilege levels .................................................................................................. 3-974-1 Gasket tests to simulate gasket performance after 10 years ............................................... 4-95-1 Carrier airflow impedance values in CFM ............................................................................ 5-55-2 Representative Module power dissipation ........................................................................... 5-85-3 Thermal and noise environment (informative).................................................................... 5-106-1 AMC Module Card-edge Interface contact assignments...................................................... 6-46-2 AMC Connector B+ footprint pin assignments ..................................................................... 6-66-3 AMC Connector AB footprint pin assignments..................................................................... 6-76-4 AMC Connector A+B+ footprint pin assignments................................................................. 6-86-5 AMC Telecom Clock usage................................................................................................ 6-146-6 AMC Fabric Clock usage ................................................................................................... 6-146-7 Min/Max M-LVDS voltage ranges ...................................................................................... 6-186-8 Telecom Clock details - SONET/ SDH/ PDH Line Cards................................................... 6-196-9 Telecom Clock details - SONET/ SDH/ PDH System Timing Modules.............................. 6-226-10 JTAG signals...................................................................................................................... 6-256-11 General naming guideline examples.................................................................................. 6-327-1 Functional contact list: Basic Side........................................................................................ 7-27-2 Functional contact list: Extended Side ................................................................................. 7-37-3 Number of contacts in the fixed Connector .......................................................................... 7-37-4 Creepage and Clearance distances................................................................................... 7-247-5 Rated insulation voltages ................................................................................................... 7-257-6 Maximum line resistances.................................................................................................. 7-27

xvi PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

7-7 Minimum insulation resistances ......................................................................................... 7-287-8 Engaging and separating forces......................................................................................... 7-337-9 Vibration ............................................................................................................................. 7-347-10 Shock ................................................................................................................................. 7-357-11 Termination-specific conditions .......................................................................................... 7-367-12 Number of specimen for the full test sequence .................................................................. 7-377-13 Allocation of the test specimens......................................................................................... 7-377-14 Wiring arrangement for insulation resistance and voltage proofing ................................... 7-397-15 Group P - Preliminary testing sequence............................................................................. 7-447-16 Group A - Mixed flowing gas testing sequence .................................................................. 7-457-17 Group B - Mechanical endurance and dust testing sequence............................................ 7-487-18 Group C - Thermal shock and moisture testing sequence ................................................. 7-507-19 Group D - High temperature and electrical load testing sequence..................................... 7-527-20 Group E - High-speed performance testing sequence ....................................................... 7-53A-1 Nominal width dimensions....................................................................................................A-1A-2 Free alignment in width gap analysis ...................................................................................A-2A-3 Module PCB/Card Guide rail overlap gap analysis .............................................................A-2A-4 Gap analysis 1- Minimum component's gap from either Card Guide rail .............................A-3A-5 Gap analysis 2- Component envelope fits between Card Guide rails ..................................A-3A-6 Nominal height dimensions ..................................................................................................A-5A-7 Free alignment in height gap analysis..................................................................................A-5B-1 Modeling parameters............................................................................................................B-2C-1 Cross reference list ............................................................................................................. C-5

PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 xvii


xviii PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

Introduction and objectives 1

1.1 Overview¶ 1 The PICMG® Advanced Mezzanine Card™ (AdvancedMC or AMC) specification defines the

base-level requirements for a wide-range of high-speed mezzanine cards optimized for, but not limited to, AdvancedTCA® Carriers and PICMG® Micro Telecommunications Computing Architecture (MicroTCATM ) systems. This base specification defines the common elements for Modules and Carriers including mechanical, management, power, thermal, and the connector and signals that interconnect them. Subsidiary specifications will define the usage requirements for mapping specific interconnect protocols between AdvancedMC Modules and Carriers. Example interconnect protocols include PCI Express, Advanced Switching, Serial RapidIO, and Gigabit Ethernet.

1.2 Introduction¶ 2 AdvancedMC defines a modular add-on or “child” card that extends the functionality of a

Carrier Board (see Figure 1-1). Often referred to as mezzanines, these cards are called “AdvancedMC Modules” or “Modules” throughout this document. AdvancedMC Modules lie parallel to and are integrated onto the Carrier Board by plugging into an AdvancedMC Connector. Carrier Boards may range from passive boards with minimal “intelligence” to high performance single board computers. AdvancedMCs are also the core of PICMG's MicroTCA specification. Instead of employing a Carrier Board, MicroTCA configures AdvancedMCs directly on the backplane. Refer to the MicroTCA specification for more details.

¶ 3 AdvancedMC enables a modular building block design for industry standard and proprietary Carrier Boards and MicroTCA systems. This AMC.0 specification enables larger markets with more unique functions and creates economies of scale that lower prices.

¶ 4 Envisioned AdvancedMC Modules cover a wide range in terms of their functionality and include the following examples:

• Telecom connectivity (ATM/POS [OC-3/12/48], T1/E1, VoIP, GbE, etc.)

• Processors (CPUs, DSPs, and FPGAs)

• Network communication processors (NPUs)

• Network communications co-processors (Classification, Security or Intrusion Detection)

• Mass storage

PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 1-1

Figure 1-1 Four AdvancedMC Modules on an AMC Carrier AdvancedTCA Board

1.2.1 Scope¶ 5 This AMC.0 specification defines the framework or base requirements for a family of

anticipated subsidiary specifications. The objective of this document is to define the requirements for mechanical, thermal, power, interconnect (including I/O), system management (including Hot Swap), and regulatory guidelines for AdvancedMC Modules and Carriers. It includes the definitions and requirements for Face Plates with ejectors, defined component spaces, complete mechanical dimensions, thermal definitions, mounting, guides, and a connector necessary to interface between the Module and the Carrier Board. Carrier Board examples in this specification focus on single Slot AdvancedTCA Board implementations but the features and requirements can be applied to other Carrier form factors.

1-2 PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

¶ 6 This AMC.0 specification does not define specific interconnect usage, although it is optimized for current and emerging LVDS interconnect standards, such as PCI Express, Advanced Switching, Serial RapidIO, and Gigabit Ethernet. The Port mapping definitions for these and other interconnect protocols will be provided through AMC.x subsidiary specifications.

1.2.2 Design goals¶ 7 This AMC.0 specification was written with the following design goals in mind:

• PICMG 3.0 optimized: All elements must work within the bounds of the PICMG 3.0 base specification and build upon its strengths of Reliability, Availability, and Serviceability (RAS). The AdvancedMC Module should not be limited by other chassis standards.

• Building block for MicroTCA: After the initial release of this specification, PICMG developed the MicroTCA specification, PICMG MicroTCA.0, which uses AMC Modules plugged directly into a backplane.

• System management: System management should be an extension of the PICMG 3.0 Shelf management scheme.

• Hot Swap support: Hot Swap of AdvancedMC Modules should be enabled in support of Availability and Serviceability objectives. The focus should be on front loadable Hot Swap Modules with non Hot Swap being an optional implementation.

• Low Voltage Differential Signaling (LVDS) interconn3ect: AdvancedMC should be optimized for LVDS interconnects.

• Low pin count: The interconnect should be conservative in its total pin count, thereby reducing the amount of space required on both the Module and the Carrier Board, yet provide sufficient real estate for intended interconnects and usage models.

• Support for a rich mix of processors: This includes compute processors (CPUs), network processors (NPUs), and digital signal processors (DSPs).

• Reduced development time and costs: The reduced total cost of ownership should be accomplished through component standardization and by driving economies of scale.

• Communications and embedded industry focus: Target usage includes support for edge, core, transport, data center, wireless, wireline, and optical network design elements.

• Modularity, flexibility, and configurability: AMC Modules have designed-in modularity features with the physical sizes that offer flexibility in use and configuration on an AMC Carrier AdvancedTCA Board including the ability to stack mezzanines.

Table 1-1 AMC.x subsidiary specifications

Specification Title

AMC.1 PCI Express and Advanced Switching on AdvancedMC

AMC.2 AMC Gigabit Ethernet/ 10 Gigabit XAUI Ethernet

AMC.3 Advanced Mezzanine Card Specification for Storage

AMC.4 Serial RapidIO


• Future advances in signal throughput: AMC technology anticipates advances in interconnect technologies by supporting a minimum of 12.5 Gbps throughput per LVDS signal pair.

1.3 Theory and operation of usage¶ 8 The AdvancedMC Module is designed to be Hot Swappable into an AdvancedMC Connector,

seated parallel to the Carrier Board. The Carrier Face Plate provides one or more openings through which the Modules are inserted into AdvancedMC Bays. Struts and Module Card Guides located on the Carrier Board support the insertion of the Modules into the AdvancedMC Connectors (see Figure 1-2). The combination of Face Plate aperture, Struts, Card Guides and AdvancedMC Connector make up an AdvancedMC Bays which provides all the necessary mechanical support, power and signal connectivity and EMI shielding needed to accommodate AdvancedMC Modules.

¶ 9 Connectivity between the AdvancedMC Module and the Carrier is provided via an AdvancedMC Connector attached to the Carrier Board. Compression fit, compliant pin, SMT or other attachment techniques can be used to attach the AdvancedMC Connector to the Carrier Board. The AdvancedMC Connector has one or two Slots that can accept the Card-edge Interface located at the rear of each AdvancedMC Module.

¶ 10 An AdvancedMC Module can have I/O connections via the Face Plate and via the AdvancedMC Connector. I/O connections provided via the AdvancedMC Connector are routed on the Carrier to On-Carrier devices, to the backplane, to another AdvancedMC or to an RTM (Rear Transition Module), as is commonly done on AdvancedTCA systems.

Figure 1-2 General orientation and insertion of AdvancedMC Modules

Rear

Module Component Side 2

Carrier Component Side 1


1.3.1 AdvancedMC Bays and Slots¶ 11 AdvancedMC Modules are installed into AdvancedMC Bays. AdvancedMC Carriers integrate

the AdvancedMC Connector, Module Card Guides, Face Plate aperture, EMC Gaskets, Struts, and physical space that make up an AdvancedMC Bay. An AdvancedMC Bay comprises one or two AdvancedMC Slots, each providing support and connectivity for the installation of one AdvancedMC Module. AdvancedMC Bays of several sizes are defined in Section 1.3.2, “AdvancedMC Modules” the AdvancedMC Slot being their invariant subset comprising the Struts, Module Card Guides, and the Connector Slot for one AdvancedMC Module and includes the provided connectivity.

¶ 12 AdvancedMC Bays are classified as Conventional Bays and Cutaway Bays.

¶ 13 Cutaway Bay: The term “Cutaway” is derived from the fact that the PCB of Carrier Board below the AdvancedMC Slot is cut-away to make maximum use of the Face Plate and component area provided in a single Slot AMC Carrier AdvancedTCA Board to accommodate Full-size or stacked Compact Modules, as shown in Figure 1-4. Cutaway Bays are grouped as Single Slot and Dual Slot Cutaway Bays. Single Slot Cutaway Bays utilize a B or B+ style Connector to support one Full-size Module. Dual Slot Cutaway Bays utilize the AB or A+B+ style Connector to support two stacked Compact Modules or one Full-size Module per Cutaway Bay. Full-size Modules can be inserted into Slot B of an AB or A+B+ style Connector when Slot A is unoccupied. Cutaway Carrier AdvancedTCA Boards can support between one and four Cutaway Bays.

¶ 14 Conventional Bay: Conventional Bays can be built as Compact Conventional Bay or Mid-size Conventional Bay with different Face Plate apertures supporting the Conventional and Mid-size Modules accordingly. Both versions of the Conventional Bay are supported by B or B+ style AMC Connectors. A Mid-size Conventional Bay supports one Mid-size Module; a Compact Conventional Bay supports one Compact Module. Conventional Bays allow for the Carrier Board PCB and some limited-height components to reside in the area beneath the installed AdvancedMC Module. The Face Plate aperture of the Compact and Mid-size Conventional Bays are different to match the Face Plates of the corresponding Module types. Full-size Modules cannot be installed into Conventional Bays. Compact Modules cannot be installed into a Mid-size Conventional Bay, but Compact Modules can be converted to Mid-size Modules by changing the Face Plate to a Mid-Size Face Plate. Similarly, Mid-size Modules can be converted into Full-size Modules to match the aperture of the Cutaway Bay. Conventional Carrier AdvancedTCA Boards can support between one and four Conventional Bays.

¶ 15 AdvancedMC Bays can be configured as Single Bays or Double Bays. Single and Double Bays are analogous to a one car and two car garage; that is, the two car garage is twice as wide as a one car garage. Similarly, Single Bays accommodate Single Modules and Double Bays support Double Modules. A Single Bay is physically too small to accommodate a Double Module. A Double Bay can be created by removing the Strut and Module Card Guide between two adjacent Single Bays. AMC Carrier AdvancedTCA Boards can have up to four Single Bays or two Double Bays. Generally, a Single Bay is simply referred to as a Bay whereas a Double Bay is always described as a Double Bay.

1.3.2 AdvancedMC Modules¶ 16 AdvancedMC Modules come in several different sizes but all share some common attributes.

When installed onto a Carrier Board, AdvancedMC Modules are oriented parallel to the Carrier Board PCB plane and are installed through the Face Plate of the Carrier Board. AdvancedMC Modules have a Face Plate that is compatible with AMC Carrier


CB

er)

AdvancedTCA Board Face Plates such that it seats flush establishing an EMI seal. The Module Face Plate provides access to I/O connections, user LED indicators and the Module Handle. AdvancedMC Modules utilize a card-edge connection interface, consisting of conductive traces (gold fingers) along the edge of the Module PCB opposite the Face Plate, to provide Power and Management and I/O connectivity to/from the Carrier Board. The conductive traces at the card-edge of the AdvancedMC act as male pins, which mate to a female Slot in the AdvancedMC Connector mounted on the Carrier Board.

1.3.2.1 AdvancedMC Module in a Conventional Bay

¶ 17 AdvancedMC Modules in a Conventional Bay are placed such that Component Side 1 of the Module faces the Carrier Board. See Figure 1-3. The mechanical envelope of the Mid-size Conventional Bay is defined for the support of a single Mid-size Module, while allowing for components to be placed on the Carrier PCB underneath the Bay.

Figure 1-3 Mid-size Module in a Conventional Bay (Section View)

1.3.2.2 AdvancedMC Module in a Cutaway Bay

¶ 18 Cutaway Bays support two stacked Compact Modules (Figure 1-4) or one Full-size Module (Figure 1-5). As shown in Figure 1-4, the Compact Modules are stacked such that Component Side 1 of each Module faces in the direction towards the Carrier Board backing plate (Component Side 2 Cover). Single Slot Cutaway Bays support one Full-size Module using a B or B+ style Connector.

Figure 1-4 Stacked Compact Modules in a Cutaway Bay (Section View)

Figure 1-5 Full-size Module in a Cutaway Bay (Section View)

Carrier Component Envelope

Conventional Carrier PB/B+ Connector

Module Component Side 2 Envelope

Mid-Size Face Plate

Carrier Face Plate

Slot B

Carrier Backing Plate (Component Side 2 Cover)

Bay Top Plate (Carrier Component Side 1 Cover)

Mid-Size Module Component Side 1 Envelope

Module Component Side 2 Envelope Connector

AB/A+B+

Cutaway Carrier PCBCompact Module Component Side 1 Envelope

Carrier Backing Plate (Component Side 2 Cover)


Module PCB

Slot B

Slot ACompact Module Component Side 1 Envelope

Compact ModuleFace Plate

Compact ModuleFace Plate

Module Component Side 2 Envelope AB/A+B+ Connector

Cutaway Carrier PCBFull -Size Module Component Side 1 Envelope

Carrier Backing Plate (Component Side 2 Cov


Module PCB

Slot B

Slot A

Full -Size Module

Face Plate


1.3.2.3 Module Width

¶ 19 AdvancedMC Modules can be Single or Double Modules. The PCB size and Face Plate size of Double Modules are twice as wide as Single Modules. The increased PCB size and power dissipation of the Double Module enables designs that would not fit on a Single Module implementation. Like Single Modules, Double Modules have a single Card-edge Interface that plugs into an AdvancedMC Connector. Stated differently, all Modules, whether Single or Double, have the same amount of connectivity to/from the Carrier. Generally, a Single Module is simply referred to as a Module whereas a Double Module is always described as a Double Module. Refer to Figure 2-4 and Figure 2-5.

¶ 20 A Single Module is approximately 74 mm wide. A Double Module is approximately 149 mm wide. Modules are approximately 180 mm deep. Refer to Section 2.2.1.1, “Single Module PCB dimensions” and Section 2.2.1.2, “Double Module PCB dimensions” for exact Module dimensions.

1.3.2.4 Module Sizes

¶ 21 AdvancedMC Modules come in three height variations: Full-size, Mid-size and Compact. The size of the Face Plate and the Component Side 1 height allocation varies for each size.

¶ 22 Full-size Modules: Full-size Modules make maximum use of the Face Plate and component height allowance afforded in a Cutaway Bay. The Full-size Module Face Plate size is capable of supporting dual-row SFPs and RJ-45 connectors for high density I/O implementations. The Full-size Module is installed into Slot B of the AB, A+B+, or B style AMC Connector in the Cutaway Bay. Full Size Modules cannot be installed into Conventional Bays.

¶ 23 Mid-size Modules: Mid-size Modules are built to be installed into Mid-size Conventional Bays. The Face Plate and component height allowance match the aperture and keepout areas for Mid-size Conventional Bays. A Mid-size Module cannot be installed into a Cutaway Bay, but it can be converted into a Full-size Module by exchanging its Face Plate to match the aperture of the Cutaway Bay.

¶ 24 Compact Modules: The Face Plate and the envelope of the Compact Module are specified such that two stacked Compact Modules occupy the same space as a Full-size Module. Two Compact Modules can be installed into a Dual Slot Cutaway Bay in a stacked fashion, one per Slot A and Slot B, allowing for highly dense deployments of AdvancedMC Modules. A Compact Module can be also installed into a Compact Conventional Bay. A Compact Module cannot be installed into a Mid-size Conventional Bay, but it can be converted into a Mid-size Module by exchanging its Face Plate for an installation into a Mid-size Conventional Bay.

¶ 25 A Compact Module is approximately 13mm high. A Mid-size Module is approximately 18mm high. A Full-size Module is approximately 28mm high.

¶ 26 Table 1-2 presents a general analysis of the different types of Face Plate connectors that fit on the different size Modules.


¶ 27 Table 1-2, “Face Plate Connectors that fit on the different Module sizes,” provides information on the number of a given connector type that can be supported on various size Modules. This information is for guidance only.

1 Indicates that the specified connector type will not fit on the Module2 With restricted pin length

¶ 28 Table 1-3 presents a general assessment of a variety of AdvancedMC Modules that would typically be expected to fit on the configurations identified.

1.3.3 Carrier Types¶ 29 AdvancedMC Carriers can support Cutaway Bays, Conventional Bays or both. This

specification describes AdvancedMC Carrier features and requirements with a focus on Carrier AdvancedTCA Board implementations but AdvancedMC Carriers can take different forms.

¶ 30 Conventional Carriers: The term Conventional Carrier refers to a Carrier Board with one or more Conventional Bays. A Compact Conventional Carrier provides up to four Compact Conventional Bays, while a Mid-size Conventional Carrier provides up to four Mid-size Conventional Bays.

Table 1-2 Face Plate Connectors that fit on the different Module sizes

Connector types Full-size Module Mid-size Module Compact Module

Single Wide Double Wide Single Wide Double Wide Single Wide Double Wide

XPAK (low profile) 1 3 1 3 1 3

XPAK2 (X2 MSA) (low profile) 1 3 1 3 12 32

XENPAK 1 2 NA1 NA1

SFP (MiniGBIC) 8 16 4 8 4 8

XFP 4 10 2 5 2 5

RJ-45 9 18 4 8 4 8

Table 1-3 Sample Module configurations and functionality

AMC Module configurations Example functionality

Single Compact Module

Laptop Disk Drive, DSP Array, FPGA Array, Encryption Engine, T1/E1/J1 Line Cards, T3/E3 Line Cards, OC-3/12/48 Line Cards, GbE WAN Cards, 10 GbE Optical WAN Card, InfiniBand WAN Card, Memory Arrays

Single Mid and Full-size ModulesAll of the above for the corresponding Single Modules plus: CPU Boards, DOCSIS Cable Modem, Baseband Modem, Radio Cards, Enterprise class disk drive

Double Compact, Mid and Full-size Modules

All of the above for the corresponding Single Modules plus: NPU Boards, DSP farms, Bulk RAMs, Optical disk drives


¶ 31 Cutaway Carriers: The term Cutaway Carrier refers to a Carrier Board with one or more Cutaway Bays. The term “Cutaway” is derived from the fact that the Carrier Board PCB is cut-away to provide maximum space for installation of Full-size Modules or stacked Compact Modules. Cutaway Carriers can support up to eight Compact Modules across an AMC Carrier AdvancedTCA Board if Dual Slot Cutaway Bays are supported.

¶ 32 Hybrid Carriers: Hybrid Carriers combine both Conventional and Cutaway Bays on a single Carrier Board.

1.3.4 AdvancedMC Connector¶ 33 The AdvancedMC Connector provides the electrical interface between the Module and the

Carrier. The AdvancedMC Connector is fixed to the Carrier Board and Modules plug into AdvancedMC Connector Slots. There are different styles of connectors for the different types of AdvancedMC Bays and for different levels of connectivity. AdvancedMC Connectors can be attached to the Carrier Board via compliant pin, SMT, through hole solder or compression mount techniques. Various connector footprints are allowed, but all AdvancedMC Connectors must adhere to the defined dimensional envelopes and electrical properties described in Section 7, “AMC Connector.” Four AMC connector styles B, B+, AB, and A+B+ are defined.

1.3.5 Module Management¶ 34 Module management is optimized for an AdvancedTCA environment. Other platforms may

require extensions to accommodate the AdvancedMC Modules. A management controller is located on every Module and it supports at least a defined minimal subset of IPMI commands. The intent of this subset of commands is to minimize both the size and the cost of the Module Management Controller. This specification also provides unique geographical address lines for each Module’s IPMI address. The Module’s management controller communicates with the Carrier Board using IPMB. Section 3, “Hardware platform management” describes all manageability requirements for AdvancedMC Modules and Carriers.

1.3.6 Module Power¶ 35 AdvancedMC Carriers provide +12V DC Payload Power and +3.3V DC Management Power

to AdvancedMC Modules via the AdvancedMC Connector. Section 4, “Power distribution” describes all requirements for AdvancedMC Modules and Carriers for power conditioning and distribution.

1.3.7 Module Interconnect¶ 36 The card-edge connection on AdvancedMC Modules provides a great deal of connectivity

between the Modules and their Carrier. In addition to power and IPMI management signals, the AdvancedMC Module can access connections to JTAG, clocking and high speed serial I/O through the AdvancedMC Connector. Section 6, “Interconnect” describes the mapping of the various signal interfaces to the AdvancedMC Connector and Module card-edge as well as how these signals might be routed on the Carrier Board.


1.4 Special word usage¶ 37 In this specification, the following key words (in bold text) will be used:

Note: When not in bold text, the words “may,” “should,” and “shall” are being used in the traditional sense; that is, they do not adhere to the strict meanings described above.

¶ 38 This document uses requirements numbering as a way to find and reference AdvancedMC requirements. Each requirement is numbered using the format “REQ X.YYz” where X is the original section where the requirement was located, YY denotes the requirement number and is a running sequence for each section, z denotes the revision of the requirement. Requirement revisions note changes made to a requirement from the originally published requirement. Requirements modified by ECN-001 are marked with a revision a. Requirements modified by AMC.0 R2.0 are marked with a revision b. An index of the requirements in this specification can be found in Appendix E, “Requirements Index.”

1.5 Statement of compliance¶ 39 Statements of compliance with this specification take the form specified in the PICMG

Policies and Procedures for Specification Development:

“This product complies with PICMG AMC.0 Revision 2.0.”

¶ 40 Products making this simple claim of compliance must provide, at a minimum, all features defined in numbered requirements (REQ X.YYz) listed in this specification as being mandatory by use of the keyword “shall” in the body of the requirement. Such products must not include any feature prohibited by the use of the keyword “shall not” in the numbered requirements contained in the specification. Such products may also provide recommended features associated with the keyword “should” and permitted features associated with the key word “may” contained within the numbered requirements.

¶ 41 A simple claim of compliance with a subsidiary specification indicates the presence of all features defined as being mandatory by the use of the keyword “shall” in the body of that specification and must not include any feature prohibited by the use of the keyword “shall not.” Because subsidiary specifications may also provide for recommended and permitted features beyond the mandatory minimum set and a range of performance capabilities, more complete descriptions of product compliance are encouraged.

may indicates flexibility of choice with no implied preference.

shouldindicates flexibility of choice with a strongly preferred implementation. The use of should not (in bold text) indicates flexibility of choice with a strong preference that the choice or implementation be avoided.

shallindicates a mandatory requirement. Designers shall implement such mandatory requirements to ensure interchangeability and to claim conformance with this specification. The use of shall not (in bold text) indicates an action or implementation that is prohibited.


1.6 Dimensions¶ 42 The controlling dimensions are millimeters (mm) unless noted otherwise. The controlling

units are metric unless noted otherwise. In some cases, English units have been provided in addition to the metric units due to common industry usage. Periods are used as the decimal separator throughout this specification.

¶ 43 Dimensions shown with an asterisk (*) are found in the referenced standards. All other dimensions and tolerances indication are specific to AdvancedMC.

1.7 Regulatory guidelines¶ 44 AdvancedMC equipment is intended primarily for central office and telecommunication

environments, which have unique regulatory requirements. A generally acceptable base set of these requirements is listed in Appendix C, “Regulatory guidelines” for North America, Europe, and other markets. Actual end-use regulatory requirements are application specific and may differ from this list. The purpose of Appendix C is to offer regulatory guidance for designers, manufacturers, and users of AdvancedMC equipment.

1.8 Reference specifications¶ 45 The following publications are used in conjunction with this standard. When any of the

referenced specifications are superseded by an approved revision, that revision applies. All documents may be obtained from their respective organizations.

• AdvancedTCA Base Specification document (PICMG 3.0 R2.0) and as amended by PICMG 3.0 R2.0 ECN-002. Referred to as AdvancedTCA Specification in the rest of this document. www.picmg.org

• ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits, January 1, 2001. www.ansi.org

• ANSI/TIA/EIA-899-2002: Electrical Characteristics of Multipoint-Low-Voltage Differential Signaling (M-LVDS) Interface Circuits for Multipoint Data Storage, March 1, 2002. www.ansi.org

• IEEE P802.3ap_D2.3 <http://standards.ieee.org/reading/ieee/std/lanman/drafts/P802.3ap_D2.3.pdf>Unapproved Draft Amendment of: IEEE Standard for Information technology- Telecommunications and information exchange between systems-Local and metropolitan area networks-Specific requirements Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer Specifications Amendment: Ethernet Operation over Electrical Backplanes.

• GR-253-CORE, Synchronous Optical Network (SONET) Transport Systems: Common Generic Criteria, and is a module of TSGR, FR-440, FR-SONET-17, and FD-29. www.telcordia.com

• GR-1244-CORE, Clocks for the Synchronized Network: Common Generic Criteria, GR-1244 provides criteria that generally apply to the various clocks used in the synchronized network. www.telcordia.com


www.picmg.org

www.ansi.org

www.ansi.org

http://standards.ieee.org/reading/ieee/std/lanman/drafts/P802.3ap_D2.3.pdf

http://standards.ieee.org/reading/ieee/std/lanman/drafts/P802.3ap_D2.3.pdf

www.telcordia.com

www.telcordia.com

• IPMI – Intelligent Platform Management Bus Communications Protocol Specification V1.0 Document Revision 1.0, November 15, 1999. http://www.intel.com/design/servers/ipmi/index.htm

• IPMI – Intelligent Platform Management Interface Specification, v1.5. Document Revision 1.1, February 20, 2002. http://www.intel.com/design/servers/ipmi/index.htm

• IPMI – Platform Event Trap Format Specification V1.0 Document Revision 1.0, December 7, 1998. http://www.intel.com/design/servers/ipmi/index.htm

• IPMI – Platform Management FRU Information Storage Definition, V1.0 Document Revision 1.1, September 27, 1999. http://www.intel.com/design/servers/ipmi/index.htm

• IPMI – Wired for Management Baseline, Version 2.0. http://www.intel.com/design/servers/ipmi/index.htm

• ITU-T Recommendation G.813 (1996), Timing characteristics of SDH equipment slave clocks (SEC) http://www.itu.int/rec/T-REC-G.813/en

• Micro Telecommunications Computing Architecture Base Specification R1.0. www.picmg.org

• PICMG® Policies and Procedures for Specification Development, Revision 2.0, September 14, 2004, PCI Industrial Computer Manufacturers Group (PICMG®), 401 Edgewater Place, Suite 500, Wakefield, MA 01880 USA, Tel: 781.224.1100, Fax: 781.224.1239, www.picmg.org

1.9 Name and logo usage¶ 46 The PCI Industrial Computer Manufacturers Group policies regarding the use of its logos and

trademarks are as follows:

¶ 47 Permission to use the PICMG organization logo is automatically granted to designated members only as stipulated on the most recent Membership Privileges document (available at www.picmg.org) during the period of time for which their membership dues are paid. Non-members must not use the PICMG organization logo.

¶ 48 The PICMG organization logo must be printed in black or color as shown in the files available for download from the member’s side of the Web site. Logos with or without the “Open Modular Computing Specifications” banner can be used. Nothing may be added or deleted from the PICMG logo.

¶ 49 Manufacturers’ distributors and sales representatives may use the AdvancedTCA and AdvancedMC logos (but not the PICMG organization logo) in promoting products sold under the name of the manufacturer. The use of AdvancedMC and MicroTCA logos is a privilege granted by the PICMG organization to companies who have purchased the relevant specifications (or acquired them as a member benefit), and who believe their products comply with these specifications. Use of the logos by either members or non-members implies such compliance. PICMG may revoke permission to use logos if they are misused. The AdvancedMC logo can be found on the PICMG web site www.picmg.org.

¶ 50 The term “AMC” is an abbreviation and may not be used as a logo or in logo form due to the possible infringement of an existing trademark outside of PICMG for the term “AMC.


http://www.intel.com/design/servers/ipmi/index.htm







http://www.itu.int/rec/T-REC-G.813/en

www.picmg.org

www.picmg.org

¶ 51 The PICMG name and logo are registered trademarks of PICMG. Registered trademarks must be followed by the ® symbol, and the following statement must appear in all published literature and advertising material in which the logo appears:

The PICMG name and logo are registered trademarks of the PCI Industrial Computer Manufacturers Group.

1.10 Signal naming convention¶ 52 All signals are active high unless denoted by a trailing # symbol. Differential signals are

denoted by a trailing + (positive) or – (negative) symbol.

1.11 Intellectual property¶ 53 The Consortium draws attention to the fact that it is claimed that compliance with this

specification may involve the use of a patent claim(s) (“IPR”). The Consortium takes no position concerning the evidence, validity, or scope of this IPR.

¶ 54 The holder of this IPR has assured the Consortium that it is willing to license or sublicense all such IPR to those licensees (Members and non-Members alike) desiring to implement this specification. The statement of the holder of this IPR to such effect has been filed with the Consortium.

¶ 55 Attention is also drawn to the possibility that some of the elements of this specification may be the subject of IPR other than those identified below. The Consortium is not responsible for identifying any or all such IPR.

¶ 56 No representation is made as to the availability of any license rights for use of any IPR inherent in this specification for any purpose other than to implement this specification.

¶ 57 This specification conforms to the current PICMG Intellectual Property Rights Policy and the Policies and Procedures for Specification Development and does not contain any known intellectual property that is not available for licensing under Reasonable and Non-discriminatory terms. In the course of Membership Review the following disclosures were made:

¶ 58 Necessary Claims (referring to mandatory or recommended features):

None

¶ 59 Unnecessary Claims (referring to optional features or non-normative elements):

Lucent Technologies has a patent, US #6646890, titled “Mounting of mezzanine circuit boards to a base.” This patent, filed on 9/4/02 and issued on 11/11/03, may cover aspects of the mechanical concepts that are detailed in the AMC.0 specification.

Mercury Computer has a patent, US #6697255, referring to “Circuit board assembly with inte-grated shaping and control of flow resistance curve”. This patent, filed on 2/14/02 and issued on 2/24/04, may cover aspects of the examples of airflow mitigation as shown in Figure 5-3.


¶ 60 Refer to PICMG IPR Policies and Procedures and the company owner of the patent for terms and conditions of usage.

¶ 61 PICMG makes no judgment as to the validity of these claims or the licensing terms offered by the claimants.

1.12 Glossary¶ 62 AMC is the abbreviation of Advanced Mezzanine Card as is AdvancedMC and is used

throughout the document as such. AdvancedMC is the preferred name and AMC is used throughout the document as well.

Table 1-4 AdvancedMC terms

Term or acronym Description

A Amps

A+B+ Connector

The AMC Connector style A+B+ is a Connector used in Cutaway Bays. A+B+ Connectors have two Slots to accommodate up to two Compact Modules. The “+” indicates this connector is an Extended Connector meaning each Slot has 170 connections to the AMC Module.

AB Connector The AMC Connector style AB is used in Cutaway Bays. AB Connectors have two Slots to accommodate up to two Compact Modules. AB is a Basic Connector meaning each Slot has 85 connections to the AMC Module.

AdvancedMC Slot, AMC Slot, or Slot

The environment providing connectivity for an AMC Module to a Carrier or Backplane.

AdvancedTCA® or AdvancedTCA

A registered trademark of the PCI Industrial Computer Manufacturers Group® referring to the PICMG 3.0 architecture.

AggressorA signal inductively and/or capacitively coupled to a Victim signal and considered to be source of noise that distorts the Victim signal being transferred between transmitter and receiver.

AMC When the term “AMC” is used on its own, it can refer to the AMC.0 specification or it can generically refer to the family of AMC specifications, depending on the context.

AMC Bay or Bay

Mounting location on an AMC Carrier for AMC Modules. An AMC Bay provides the mechanical housing and structural support necessary to properly align, install and secure an AMC Module onto an AMC Carrier. There are two kinds of AMC Bays, Cutaway Bays and Conventional Bays.

AMC Carrier or Carrier or Carrier Board

An AMC Carrier supports all the design elements necessary to house and activate one or more AMC Modules; including AMC Bays, IPMC support, power distribution and signal routing to/from the AMC.

AMC Carrier AdvancedTCA Board

An AdvancedTCA Board, which provides AMC Bays. This is the primary target environment for AMC Modules.

AMC Connector or Connector

Used to refer to any of the connector styles B, B+, AB, A+B+ as defined in this specification, mounted on a Carrier for the insertion of AMC Modules.

AMC Connector Slot

The B and B+ Connectors support one Slot (Slot B) to accept an AMC Module. The AB and the A+B+ Connectors support two Slots (lower Slot A and upper Slot B).


AMC Module or Module

An AMC Module is a mezzanine or modular add-on card that extends the functionality of a Carrier Board. The term is also used to generically refer to the different varieties of Multi-Width and Multi-Height Modules.

AMC Slot ID An AMC Slot ID identifies the physical location of each Slot in all AMC Bays on a Carrier into which AMC Modules can be installed.

ANSI American National Standards Institute

ASIC Application Specific Integrated Circuit

B Connector The AMC Connector style B is a Basic Connector which supports one AMC Module. The style B connector is used in Conventional Bays or Single Slot Cutaway Bays.

B+ ConnectorThe AMC Connector style B+ is an Extended Connector which supports one AMC Module. The style B+ Connector is used in Conventional Bays or Single Slot Cutaway Bays.

Backend Power Backend Power includes all the power supplies on the Module derived from Payload Power.

Basic Connector

Provides conductive contacts on only one side of each Connector Slot and supports all the indispensable connectivity including power and management, and yields 8 Ports. Basic Connector contains 85 contacts per Slot. Conventional and Cutaway Connectors can be Basic Connectors.

Basic Side Refers to the side of the AMC Connector that supports the defined connections via Pins 1 to 85.

BGA Ball Grid Array

BITS Building Integrated Timing Supply

Card-edge Interface The conductive fingers used on AMC Modules that interface to the AMC Connector.

Card Guide See Module Card Guide or Card Guide

Carrier Face Plate Face Plate of the Carrier Board.

Carrier Handle The Handle of the AMC Carrier AdvancedTCA Board.

Carrier IPMC IPM Controller on the Carrier. This is the required intelligent controller on the Carrier that interfaces with the Module's MMC over the IPMB-L.

Carrier SDRR Sensor Data Record Repository that resides on the Carrier Board.

CFM Cubic Feet per Minute. One CFM is equivalent to 472 cubic centimeters per second, or 0.000,471,947 cubic meter/second.

ChannelAn arbitrary set of up to four Ports which are logically grouped together via E-Keying to define the physical traces of a Link between Link partners. Multiple Channels can be aggregated for a wider Link.

Clearance The shortest distance between two conductive parts, measured through air.

Clock Link A connection between two clocks, together with the associated protocol.

Common Options Region

A region on the Basic Connector (Ports 0-3) used to define essential interfaces that are common across diverse assignments in the Fat Pipes Region. Ideal candidates for this region include storage (e.g., SAS, SATA and FC) and Control Path interfaces.

Table 1-4 AdvancedMC terms (Continued)



Compact Module

Compact Modules are the smallest size Module. The Face Plate and component height on Component Side 1 are defined to allow for two Compact Modules to be installed into a Dual Slot Cutaway Bay. Compact Modules can also be installed into Compact Conventional Bays. (Previously termed Half-height AMCs in AMC.0 R1.0)

Component Side 1 Cover and Component Side 2 Cover

Board Covers provide mechanical rigidity for the Carrier Boards as well as a place to mount the Module Card Guides and the AMC Connector body. Board covers are required on both sides of all AMC Carrier Board configurations.

Component Envelope Depth

Maximum length for placing components between the Face Plate and rear connector.

Component Envelope Height Maximum height allowed for components.

Component Side 1The side of the AMC which supports the greater Component Envelope Height and faces the Carrier Board when the Module is installed into a Bay. Component Side 1 height definition varies between Compact, Mid-size and Full-size Modules.

Component Side 2The side of the AMC which supports the lesser Component Envelope Height and does not face the Carrier Board when the Module is installed into a Bay. Component Side 2 height definition is the same for Compact, Mid-size and Full-size Modules.

Connector Brace

A counter-pressure plate needed in conjunction with compression mount connectors that is mounted on Component Side 2 of the Carrier Board, opposite the AMC Connector and required to guarantee uniform contact conditions between Connector and Carrier by preventing the Carrier Board from bending.

Contact List Defines the use of each contact. Directed signals appear in the lists differently, as applies to the respective viewpoint of the Module and the Carrier.

Conventional Bay

A Conventional Bay utilizes the B or B+ style AMC Connector and is characterized by the presence of the Carrier PCB and components under the AMC Bay. A Compact Conventional Bay supports a Compact Module, while a Mid-size Conventional Bay supports a Mid-size Module.

Conventional Carrier

A Conventional Carrier exclusively supports one or more Conventional Bays. Conventional Carrier AdvancedTCA Boards can support up to four Conventional Bays.

CPU Central Processing Unit or Computer

Creepage The shortest path between two conductive parts, measured along the surface of the insulation.

Cutaway Bay

A Cutaway Bay is characterized by cutaway of the Carrier PCB between the AMC Connector and the Face Plate. A Cutaway Bay may be a Dual Slot Cutaway Bay or a Single Slot Cutaway Bay. The Dual Slot Cutaway Bay is equipped with the AB or the A+B+ style connector and supports two Compact Modules or one Full-size Module. The Single Slot Cutaway Bay is equipped with a B or B+ style Connector and supports one Full-Size Module.

Cutaway Carrier A Cutaway Carrier exclusively supports one or more Cutaway Bays. Cutaway Carrier AdvancedTCA Boards can support up to four Cutaway Bays.

Depth Edge-to-edge length from the leading edge of the Face Plate to the trailing edge of the connector.

Double Bay Mounting location on an AMC Carrier for Double Modules. Double Bays can be Conventional or Cutaway Bays.




Double ModuleA Module that is roughly twice the width of a Single Module and requires a Double Bay. Compact, Mid-size and Full-size Modules can be Double Module configurations. (Previously termed Double-width AMCs in AMC.0 R1.0)

DSP Digital Signal Processor

EIA Electronic Industry Association

E-KeyingAbbreviation for Electronic Keying. Electronic Keying defines the process in which a Carrier determines a matching configuration of the Channel and clock connections to an AMC Module.

EMI Electromagnetic interference. Electromagnetic radiation created by rapid switching in electronic circuits that causes unwanted signals to be induced in other circuits.

EMC

Electromagnetic Compatibility is the condition that prevails when telecommunications (communication-electronic) equipment is collectively performing its individual designed functions in a common electromagnetic environment without causing or suffering unacceptable degradation due to electromagnetic interference to or from other equipment/systems in the same environment.

EMC Gasket An electrically conductive elastic strip mounted to defined edges of the Face Plate, of the Carrier, and of the Shelf, providing EMC closure around the AMC Modules.

Envelope 1, Envelope 2, Envelope 3

Envelope 1, 2 and 3 define the amount of space available on a Mid-size Module or Conventional Carrier in the defined step segments. Envelope 1 is closest to the Face Plate with Envelopes 2 and 3 going successively towards the rear of the Module or Carrier.

ESD Contact

Conductive element in the Carrier's Strut that provides a low-impedance path to Shelf Ground in the Carrier. The ESD Contact touches the Module ESD Strip during Module insertion/removal and provides a path for controlled discharge of electrostatic energy from the Module PCB to Shelf Ground.

ESD Segment

ESD Segment 1, ESD Segment 2, and ESD Segment 3 constitute the Module ESD Strip. The ESD Segments are the contact areas on the Module which the ESD Contact wipes along during the Module insertion providing discharge phases for the Shelf Ground and Logic Ground domains and granting a low impedance connection of the Module Face Plate to Shelf Ground for the installed Module.

ETSI European Telecommunications Standards Institute

ETTE Environmental Testing for Telecommunication Equipment

Extended Connector

Provides conductive traces on both sides of the Connector and is an extension of the Basic Connector definition. Extended Connectors contain 170 contacts per Slot and are identified with the “+” designation (i.e., B+ and A+B+).

Extended Options Region

The Extended Options Region is loosely defined but recommend for use for RTM (Rear Transition Module) support. It is also recommended for use as an extension of both the Common Options and Fat Pipes Regions, when additional Ports are needed.

Extended Side Refers to the side of the AMC Connector associated with the additional connectivity provided by an Extended Connector.

Face PlateThe front-most element of a Module, attached perpendicular to the PCB, and serves to mount connectors, indicators, controls, and also seals the front of the Subrack for airflow and EMC.




Fat Pipes RegionPorts 4 though 11 of the AMC Connector constitute the Fat Pipes Region. This Region of Ports is intended for the assignment of multiple Lane interfaces, also called “fat pipes”.

FIC Fabric Interface Component

Filler Module A unit with no or very limited functionality used for filling up the empty Bays and Slots that often has air baffle included.

FRU

Field Replaceable Unit. Any entity that can be replaced by a user in the field. FRU Information is data that describes a FRU, with an emphasis on data that characterizes the FRU. Format for this data is described in IPMI Platform Management FRU Information Storage Definition and extended herein.

Full-size ModuleFull-size Modules utilize the maximum size Module Face Plate and component area on Component Side 1. Full-size Modules can be installed into Cutaway Bays only. (Similar to what were termed Full-height AMCs in AMC.0 R1.0)

g Grams

GbE Gigabit Ethernet

Gbps Gigabits per second

Geographic Address

The term Geographic Address identifies the physical location of the AMC Slots in the AMC Bays on a Carrier via three, three-state signals. Each valid GA combination of the three signals maps to a specific AMC Slot ID in which the A and B layers of the AMC Bays that are implemented on a Carrier are numbered sequentially in their order of occurrence starting with 1 and from the top of the Carrier.

GPS

A satellite-based global navigation system that consists of (a) a constellation of 24 satellites in orbit 11,000 nmi above the Earth, (b) several on-station (i.e., in-orbit) spares, and (c) a ground-based control segment. The satellites transmit signals that are used for extremely accurate three-dimensional (latitude, longitude, and elevation) global navigation (position determination), and for the dissemination of precise time. GPS-derived position determination is based on the arrival times, at an appropriate receiver, of precisely timed signals from the satellites that are above the user's radio horizon

GUID

A Globally Unique Identifier (GUID) is 128 bits long and if generated in a compliant manner, is either guaranteed to be different from all other GUIDs generated until 3400 A.D. or extremely likely to be different (depending on the mechanism chosen). An OEM GUID is constructed and processed as specified in Chapter 17.8 of the IPMI specification.

HA High Availability

Hot SwapTo remove a component (e.g., an AMC Module) from a system (e.g., an AMC Carrier AdvancedTCA Board) and plug in a new one while the power is still on and the system is still operating.

Hot Swap SwitchA switch that is integrated with the Module Latch Mechanism so that its state reflects the state of the Module Handle. The Hot Swap Switch is activated when the Module Handle is fully inserted.

HP Horizontal Pitch (5.08 mm or 0.2 inches)

Hybrid Carrier An AMC Carrier that has both Conventional and Cutaway Bays.

I/F Interface




I/O Input/Output

I2C Inter-integrated Circuit bus. A multi-master, two-wire serial bus used as the basis for IPMBs.

IEC International Electro-technical Commission

IEEE Institute of Electrical and Electronics Engineers

IPMBIntelligent Platform Management Bus. The lowest level hardware management bus as described in the Intelligent Platform Management Bus Communications Protocol Specification.

IPMB-0 Intelligent Platform Management Bus Channel 0 as defined in the IPMI v1.5 specification. This is the logical aggregation of ATCA IPMB-A and IPMB-B, as defined in the PICMG 3.0 specification.

IPMB-L or Local IPMB

The IPMB located on the Carrier interconnecting the Module’s MMC with the Carrier IPMC. This bus is electrically separate and occupies a separate address space from the Carrier's IPMB (IPMB-0).

IPMI

Intelligent Platform Management Interface. A specification and mechanism for providing inventory management, monitoring, logging, and control for elements of a computer system as defined in Intelligent Platform Management Interface Specification.

ITU

International Telecommunication Union (ITU): A civil international organization established to promote standardized telecommunications on a worldwide basis. Note: The ITU-R and ITU-T are committees under the ITU. The ITU headquarters is located in Geneva, Switzerland. While older than the United Nations, it is recognized by the U.N. as the specialized agency for telecommunications

JTAG Joint Test Action Group (test bus, IEEE 1149.1)

kHz kilohertz

Lane

1. A set of differential signal pairs, one pair for transmission and one pair for reception. One or more Lanes operate together to form a Link. Same as Port.2. E-Keying definition of a differential pair associated with a specific Link (e.g.,a Link generally consists of Lanes[x:0])

LED Light Emitting Diode

LFM Linear Feet per Minute. A measure of air velocity. One LFM is equivalent to 0.508 centimeters per second, or 0.005,08 meter/second.

Link

1. One or more Ports aggregated under a common protocol. Links are groups of Ports that are enabled and disabled by Electronic Keying operations. A xN Link (pronounced “by-N Link”) is composed of N Ports. 2. A group of Lanes which operate together to connect two devices; the number of Lanes used is negotiated.

Logic Ground, Ground, or GND

The reference potential for logic signaling and local power distribution on the Carrier and on the Module.

LUN Logical Unit Number as defined by IPMI.

LVDS Refers to Low Voltage Differential Signaling and defined in ANSI/EIA-644-A.

m meters




MAC Media Access Control

Management Power or MP

The 3.3V power for a Module's Management function, individually provided to each Slot by the Carrier.

MHz Megahertz

MicroTCA A PICMG specification in which AMC Modules plug directly into a backplane.

Mid-size Module

Mid-size Modules are optimized for installation into Conventional Bays. Each Conventional Bay can accept one Mid-size Module. Mid-size Modules can also be installed into Cutaway Bays if converted to a Full-size Module with a different Face Plate.

M-LVDS A later development of LVDS defined in ANSI/TIA/EIA-644. It is specifically designed for multi-drop and multi-sourced signaling.

mm millimeters

MMC Module Management Controller. The MMC is the required intelligent controller that manages the Module and is interfaced to the Carrier via IPMB-L.

Module Card Guide or Card Guide

Card Guide utilized by AMC Modules to facilitate insertion into the AMC Bay and to help facilitate Hot Swap of Modules.

Module Handle Hand grip that is connected to the Module Latch Mechanism, provides user interface that initiates Hot Swap sequence and Module removal.

Module Latch Mechanism

Mechanism to hold the Module locked in the AMC Bay with the Module in contact with the bottom of the AMC Connector Slot. The Module Latch Mechanism also provides coupling to the Hot Swap Switch.

Module ESD StripPlated region on the Module PCB that provides a path for controlled discharge of electrostatic energy. The Module ESD Strip includes all three ESD Segments found on an AdvancedMC Module.

Module LEDsThe collective name for the following LEDs available at the Module Face Plate:BLUE LED, LED 1, and LED 2.

NEBS Network Equipment Building Systems

non-AMC Carrier AdvancedTCA Board

An AMC Carrier which is not an AdvancedTCA Board.

Octet A normally contiguous group of eight bits not necessarily byte aligned.

PayloadThe primary function that a FRU provides. This includes all the hardware on the FRU except that associated with management. It may also include the firmware, operating system and application software running on the Payload hardware.

Payload Power or PWR

The nominal 12V supply power, individually provided to each Slot by the Carrier for the payload function of the Module.

PDHPDH refers to the DS1/DS2/DS3 family of signals which were developed as an asynchronously multiplexed hierarchy for transmission systems which are now more frequently encountered as payload in a SONET system.

PHY Physical Layer Device

PICMG PCI Industrial Computer Manufacturers Group




Pin The elementary connectivity provided by the Connector.

Port A set of differential signal pairs, one pair for transmission and one pair for reception. Same as a Lane.

PRS

Primary reference source. Equipment that provides a timing signal whose long-term accuracy is maintained at 1 x 10-11 or better with verification to Coordinated Universal Time (UTC), and whose timing signal may be used as the basis of reference for the control of other clocks within a network. The primary reference source may generate a timing signal completely autonomous of other references, in which case cesium beam technology is suitable. Alternatively, the primary reference source may not be a completely autonomous implementation, in which case it may employ direct control from normal UTC-derived frequency and time services.

RAS Reliability Availability Serviceability

RJ-45 Short for Registered Jack-45, an eight-wire connector used commonly to connect computers onto a local-area network (LAN), especially Ethernets.

RoHS Restriction of the Use of Certain Hazardous Substances

s second

SBC Single Board Computer

SDH Synchronous Digital Hierarchy

SerDes Serializer-Deserializer

SELV Safety Extra-Low Voltage. A designation defined in IEC 60950-1 and related documents for circuits with a voltage that remains below 60 V.

SFP Small Form-factor Pluggable. An industry standard definition for a pluggable Module and cage typically used for fiber optic connections.

Shelf Ground The electrical potential of the metal frame of the system, the Face Plate of the Carrier, and the Face Plate of the Module.

Shelf Manager

The entity responsible for managing the power, cooling, and interconnects (with Electronic Keying) in an AdvancedTCA Shelf. The Shelf Manager also: routes messages between the System Manager Interface and IPMB-0, provides interfaces to System repositories, and responds to event messages. The Shelf Manager can be partially or wholly deployed on the ShMC and/or System Manager Hardware.

ShMC Shelf Management Controller. An ShMC is a mandatory component part of an AdvancedTCA Shelf.

Single Bay Mounting location on an AMC Carrier for Single Modules. Single Bays can be Conventional or Cutaway Bays.

Single Module AMC Module with a width around 74mm which fits into a Single Bay. (Previously termed Single-width AMCs in AMC.0 R1.0)

Site Number Architecture-independent abstraction of the AMC Slot identification for the purposes of System Management.

Slot See AdvancedMC Slot, AMC Slot, or Slot

Slot A The lower Slot of an AB or an A+B+ Connector. It is located in the cutout section of a Cutaway Bay and is utilized by Compact-Modules only.




Slot B The upper Slot of and AB or A+B+ Connector or the Slot position of a B or B+ Connector.

SMC SONET minimum clock

SMT Surface Mount Technology

SONET An interface standard for synchronous optical-fiber transmission, applicable to the Physical Layer of the OSI Reference Model

Stacked Modules Used to describe two Compact Modules installed into a Cutaway Bay.

STM Synchronous transport mode

Strut Used to align the Module Card-edge within the AMC Bay

System Manager

A level of management functionality above the Shelf Manager charged with the management of an entire System, whatever that may mean in a specific implementation. The System Manager can, nevertheless, be partially or wholly deployed on the ShMC and/or System Manager Hardware.

V Volts

Victim A signal inductively and/or capacitively coupled to an Aggressor signal and considered to be a receptor of noise that distorts the signal being transferred between transmitter and receiver.

XENPAK A fiber-optic transceiver Module which conforms to the 10 Gigabit Ethernet (10 GbE) standard as laid down by the IEEE 802.3ae.

XFP 10 Gigabit Small Form-factor Pluggable. An industry standard definition for a 10 Gigabit pluggable Module and cage typically used for fiber optic connections.

XPAKA specification authored by a number of companies to build a small form factor 10 Gigabit Module that is Face Plate pluggable, and is mounted on the top of a customer printed circuit (rather than requiring a cutout in the board).




Mechanical 2

¶ 1 AMC Modules are intended to be installed into a Carrier to be operational. Carriers can come in many different sizes and shapes, but the mechanical interfaces necessary to house an AMC Module are referred to as the AMC Bay. Figure 2-1, “Typical AMC Carrier AdvancedTCA Boards with AMC Modules” shows the general relationship of an AMC Module with a Carrier Board and some key features and interfaces of the Module and the Bay.

¶ 2 This section defines the essential mechanical features and requirements for AMC Modules and AMC Bays. The AMC Bay requirements can be applied to any type or size of Carrier. In addition to the AMC Module and AMC Bay definitions, this section also describes mechanical requirements and considerations specific to AdvancedTCA Carriers. For the purposes of this specification, an AdvancedTCA Carrier is defined to be any ATCA Board or blade equipped with 1 or more AMC Bays.

¶ 3 Requirements and description of the AMC Connector are provided in Section 7, “AMC Connector.”

¶ 4 A Carrier Board may be a self-contained functional unit or a sub Module of a larger system. The mechanical interface between a Carrier Board and its associated backplane is outside the scope of this specification; for Carrier AdvancedTCA Boards refer to PICMG 3.0.

Figure 2-1 Typical AMC Carrier AdvancedTCA Boards with AMC Modules

Card Guide and Strut

AMC Handle

AMC Module Card-edge Connector

AMC Connector (Carrier Board Connector)

AMC Bay

AMC Module

AMC Carrier AdvancedTCA Board or host Face Plate

AMC Carrier or AMC host PCB


2.1 Mechanical overview¶ 5 AMC Modules are installed onto Carrier Boards in an orientation that is parallel to the

Carrier Board PCB. The Modules slide into an aperture, called a Bay, in the Carrier Face Plate and the Card-edge Interface on the Module plugs into a Slot in the AMC Connector. Struts and Card Guides align the Module Card-edge with the AMC Connector Slot. A Module Handle and Latch allow the Module to be secured into the Slot and extracted when required. The Module's Face Plate seats flush to the Carrier Face Plate, ensuring an EMC seal.

¶ 6 Orientation of the AMC Module and Bay is referenced relative to the Carrier Board as shown in Figure 2-2, “AMC orientation” where the Carrier Face Plate represents the “front” of the Carrier Board and thus the “front” of the AMC Module and Bay. The opposite end of the Carrier Board is called the “rear”, thus the axis that runs from “front” to “rear” is described in terms of “depth.” The axis that runs parallel to the Carrier Board Face Plate is described in terms of “width.” The side of the Carrier Board PCB that contains the AMC Bay is called the “top” side of the Carrier, the other side of the Carrier Board PCB is called the “bottom.” The axis that runs from “top” to “bottom” is described in terms of “height.” This orientation is consistent with IEEE 1386.

¶ 7 In order to support a wide variety of application requirements, AMC Modules come in 3 different sizes (Compact, Mid-size, and Full-size) and there are different AMC Bay configurations to accommodate certain sized Modules. Basically, Modules and Bays can vary in “height” and “width”, but all have a fixed “depth.” Three sizes of Modules are defined with different “height” allowances for the Module Face Plate and the components placed on the Module. Two types of AMC Bays (Conventional Bay and Cutaway Bay) are defined to support Compact, Mid-size and Full-size Modules as described in Table 2-1, “Module and AMC Bay compatibility matrix.” Both Modules and Bays can come in Single or Double “widths”. Double Bays/Modules are twice as “wide” as Single Bays/Modules. Single Bays accommodate Single Modules and Double Bays accommodate Double Modules. Two adjacent Single Bays can be converted into a Double Bay (by removing the center Strut and Card Guide) to accommodate a Double Module, if the implementation supports convertible Bays.


Figure 2-2 AMC orientation

¶ 8 Conventional Bays and Cutaway Bays serve different application requirements and are mechanically different based on the style of AMC Connector employed. Bays using the B/B+ AMC Connector have one Slot to accommodate one AMC Module, whereas Bays using the AB/A+B+ AMC Connector have two Slots to accommodate two Compact AMC Modules. Table 2-1, “Module and AMC Bay compatibility matrix” illustrates the possible combinations of Modules supported by the different AMC Bay configurations.

¶ 9 Carriers can support Conventional Bays or Cutaway Bays or both. Carriers that support Conventional Bays are known as Conventional Carriers. Carriers that support Cutaway Bays are known as Cutaway Carriers. Carriers that support both Conventional and Cutaway Bays are known as Hybrid Carriers. AMC Carrier AdvancedTCA Boards are capable of supporting up to four Single Bays or up to two Double Bays.

Rear

Module Component Side 2

Carrier Component Side 1


Table 2-1 Module and AMC Bay compatibility matrix

2.1.1 Orientation and references¶ 10 Figure 2-2, “AMC orientation” shows Module and Carrier orientation references used

throughout this section. Figure 2-3, “AMC datums and references” and Table 2-2, “AMC datum and reference line definition for Figure 2-3” outline the references and terminology used for all dimensional figures throughout the section. For example, Front-Rear (Depth); Top-Bottom (Height); Face Plate axis (Width).

Bay Bay aperture

Connector style

Compact Module

Mid-size Module

Full-size Module

supported via Slot

Compact Conventional Bay 3 HP B, B+ B - -

Mid-size Conventional Bay 4 HP B, B+

Convert Face Plate to Mid-size

B -

Single Slot Cutaway Bay 6 HP B, B+

Convert Face Plate to Full-size


B

Dual Slot Cutaway Bay 6 HP AB, A+B+ A and B


B


Figure 2-3 AMC datums and references

Note: Refer to Table 2-2, “AMC datum and reference line definition for Figure 2-3.”


-

Table 2-2 AMC datum and reference line definition for Figure 2-3

Datum Meaning Direction Notes

F Component Side 1 of Carrier PCB Z See PICMG 3.0, Figure 213

F1 Bottom of connector touches F on Carrier PCB Z AMC.0 Datum

J Module PCB leading edge X AMC.0 Datum

J1 Bottoming position of Module PCB within Carrier Connector X AMC.0 Datum

L Module PCB Center Line Y AMC.0 Datum

L1 Center Line of Carrier Connector Y AMC.0 Datum

M Center Line of Module PCB thickness Z Redefinition of M

M1 Center Line of B/B+ Connector cavity Z AMC.0 Datum

M2 Center Line of A/A+ Connector cavity Z AMC.0 Datum

R Front of Module Face Plate X AMC.0 R1.0

ECarrier Face Plate mounting positionPositioning the Carrier mounted Module Connector

X See PICMG 3.0

D Carrier Face Plate mounting position. Positioning the Carrier mounted Module connector. Y See PICMG 3.0

S Center of the mounting hole for the Connector X AMC.0 Datum

Table 2-3 Sample drawing symbols

Symbol Meaning

Datum. The datum for this callout is the surface identified by the leader line.

Datum. The datum for this callout is the median plane or axis of the dimensioned feature.

Referenced dimension. This dimension is toleranced in other drawings in this specification.

Theoretically exact dimension. There are no tolerances on this dimension.

Parallelism. The toleranced dimension in this example must remain parallel to within 0.13 mm of datum A.

Flatness. The surface in this example must lie within two planes 0.05 mm apart.

Perpendicularity. The referenced dimension in this example must lie within two parallel planes perpendicular to datum K and 0.2 mm apart.

True position. In this example, the axis of the referenced holes must be within 0.13 mm axis perpendicular to reference datums G and H.

Profile of any surface

Concentricity

AA

AA 3

(0.13)

21.33

A0.13 A

0.05

K0.2 K

G H0.13 G H

0.1 M J L

0.1 M R


2.1.2 Dimensions and tolerances¶ 11 All dimensions are in millimeters (mm) or other appropriate metric units unless otherwise

noted.

Table 2-4 General tolerance guidelines for AMC Module and Carrier PCBs

Table 2-5 General tolerance guideline for Module and Carrier envelope and other mechanical components

Requirements

REQ 2.13b The tolerances specified in Table 2-4, “General tolerance guidelines for AMC Module and Carrier PCBs” and Table 2-5, “General tolerance guideline for Module and Carrier envelope and other mechanical components” shall be used except where other tolerances are specified in drawings and tables.

Feature fabrication Tolerance (mm)

Routed edge to datum ±0.13

Unplated hole diameter+0.05–0.025

Hole location (radial dimension to datum ±0.1

Board thickness ± 10%

Feature fabrication Tolerance (mm)

Standard feature size resulting from a single process (i.e., hole diameter, square, etc.) ±0.13

Standard feature size resulting from more than one process (i.e., countersunk hole, etc.) ± 0.2

Raw edge location to raw edge location (i.e., length, cut/sheared end/edge to cut/sheared end/edge, etc.) ± 0.25

Location of one feature to another feature on a single surface (i.e., hole to hole, hole to cut/sheared end/edge, etc.) ± 0.25

Location of a feature to a raw edge (i.e., hole to cut/sheared end/edge, etc.) ± 0.25

Location of an edge resulting from a secondary process to a raw edge (i.e., cut/sheared end/edge to a bend, cut/sheared end/edge to a secondary machined surface, etc.)

± 0.3

Location of a feature to an edge resulting from a secondary process (i.e., hole to bend, hole to a secondary machined surface, etc.) ± 0.3

Location of an edge resulting from a secondary process to an edge resulting from a tertiary process (i.e., bend to bend, secondary machined surface to a tertiary machined surface, etc.)

± 0.5

Angularity ± 1°


2.2 Module requirements¶ 12 This section includes all the detailed mechanical requirements for AMC Modules. Details

such as how the Module Face Plate attaches to the Module PCB, the component placement guidelines for both sides of the PCB, the mechanical structure of the Card-edge Interface and EMC Gasket seals are described in this section. Figure 2-1, “Typical AMC Carrier AdvancedTCA Boards with AMC Modules” shows an AMC Module with its key features identified.

2.2.1 Module PCB dimensions¶ 13 AMC Modules may be Single or Double Modules. The PCB area of a Double Module is

approximately twice the area of a Single Module. The Card-edge Interface is the same for Single and Double Modules. The PCB details related to these two configurations are shown in Figure 2-4 and Figure 2-5.

¶ 14 On Component Side 1 and Component Side 2, keepout areas exist along the edges of the Module PCB. On Component Side 2, the keepout area contains the ESD Segments along with additional spacing to ensure proper mechanical and electrical operation (See Figure 2-8 for dimensional definition). See Figure 2-4, Figure 2-5, Figure 2-6, Figure 2-7, and Figure 2-8 for complete dimensional requirements of the keepout areas. Mounting hardware and LEDs can also exist in the forward portions of these keepout zones.

Requirements

REQ 2.18 All Module dimensions shall adhere to the requirements in Figure 2-4, “Single Module PCB dimensions” or Figure 2-5, “Double Module PCB dimensions.”

REQ 2.21b The Card Guide and Strut component keepout zone shall exclude all components, traces, test points, vias, and features that can form a mechanical impediment or provide an electrical conduction including traces protected by solder mask, with the exception of the features required to implement the “Module ESD Strip” as defined in Section 2.2.1.4, “Module ESD Strip.”

REQ 2.22 The Connector component keepout zone shall exclude all components, test points, and features that can form an impediment during the Module's insertion into or its extraction from the AMC Connector.

REQ 2.128 Face Plate mounting interface features shall not protrude beyond the reserved area described in Figure 2-4, “Single Module PCB dimensions” and Figure 2-5, “Double Module PCB dimensions.”

REQ 2.129 Keepout and reserved areas on the PCB shall extend perpendicular to the PCB surface through the component envelope.


2.2.1.1 Single Module PCB dimensions

Figure 2-4 Single Module PCB dimensions


2.2.1.2 Double Module PCB dimensions

Figure 2-5 Double Module PCB dimensions

Note: Refer to Table 2-6, “Double Module PCB Mid-Board Component restrictions for Figure 2-5.” Double Modules have only one Card-edge Interface.


Table 2-6 Double Module PCB Mid-Board Component restrictions for Figure 2-5

Requirements

REQ 2.23b Double Modules shall have one Card-edge Interface in the lower position opposite the Module Latch Mechanism as shown in Figure 2-5, “Double Module PCB dimensions.”

REQ 2.130 Double Modules shall adhere to the component height restrictions and keepout details of Double Modules as defined in Figure 2-5, “Double Module PCB dimensions” and Table 2-6, “Double Module PCB Mid-Board Component restrictions for Figure 2-5.”

2.2.1.3 Suggested/ vendor-specific Module PCB Face Plate attachment

¶ 15 The Module Face Plate is attached to the Module PCB. Provisions for supporting the Module Face Plate are described in Figure 2-6, “Example PCB Face Plate mounting for Single Modules” and Figure 2-7, “Example PCB Face Plate mounting for Double Modules.” The attachment points for different Face Plates can vary; however, they must fit into the designated areas shown in Figure 2-6 and Figure 2-7. These figures also describe the preferred mounting interface support features.

Module Size Component Side 1 Component Side 2

Compact 5.58 maximum Keepout zone

Mid-size See Figure 2-15 Keepout zone

Full-size 21.05 maximum Keepout zone


Figure 2-6 Example PCB Face Plate mounting for Single Modules


Figure 2-7 Example PCB Face Plate mounting for Double Modules


Requirements

REQ 2.131 Module PCBs should support the Module Face Plate attachment interfaces as described in Figure 2-6, “Example PCB Face Plate mounting for Single Modules” or Figure 2-7, “Example PCB Face Plate mounting for Double Modules.”

2.2.1.4 Module ESD Strip

¶ 16 This section defines the mechanical requirements for the Module ESD Strip. Electrical requirements for the Module ESD Strip are defined in Section 4.4, “ESD protection.”

Figure 2-8 Module ESD Strip dimensions


Figure 2-9 ESD assembly cross section


Figure 2-10 ESD assembly cross section - Detail A

Note: The cross-section is through the ESD Contact where it rests on the AMC PCB which is why the section of Card Guide channel does not appear below the ESD Contact.

Requirements

REQ 2.24b The Module ESD Strip on the Module PCB shall conform to Figure 2-8, “Module ESD Strip dimensions”, Figure 2-9, “ESD assembly cross section”, and Figure 2-10, “ESD assembly cross section - Detail A.”

REQ 2.25b Modules shall provide a minimum of 1.5 mm of Creepage and 0.7 mm of Clearance between all elements of the Shelf Ground domain and the Logic Ground based circuitry.

REQ 2.26b Module ESD Strip plating shall be gold, silver or tin-silver.

REQ 2.132 Module ESD Strip plating shall be a minimum of 0.25 μm (10 micro inches) thick.

REQ 2.133 Module ESD Strip plating should be a minimum of 0.38 μm (15 micro inches) thick.

REQ 2.28b Module ESD Strip’s 8kV/15kV performance should comply with Telcordia GR-78 Checklist item R9-2.


REQ 2.29b AMC Module vendors should identify in their product collateral whether the AMC has been tested to GR-78 R9-2.

2.2.1.5 Module PCB thickness

¶ 17 Module PCB thickness is critical to ensure proper connection of the Card-edge Interface with the AMC Connector Slot.

Requirements

REQ 2.30 The thickness of the Module PCB shall be 1.6 mm ±10% (absolute range of 1.44 mm to 1.76 mm).

2.2.1.6 Module PCB warpage and stiffening

¶ 18 Module flatness at the edge fingers ensure smooth entry of the Module into the connector receptacle. The move to lead-free solder for RoHS compliance could increase the need for supplemental Module stiffening.

¶ 19 For all Module sizes, the nominal limit for Component Side 2 height is 3.6mm measured from Datum M; this translates to 2.8 mm from the surface of a 1.6mm thick PCB. Actual usable Component Side 2 height is implementation-specific, based on Module PCB thickness tolerance and any allowance for bow and twist on the Module.

Figure 2-11 Module PCB Card-edge Interface bow and twist measurement


Requirements

REQ 2.37b The Card-edge interface shall stay within a zone as shown in Figure 2-11, “Module PCB Card-edge Interface bow and twist measurement.” This zone measures the combination of PCB thickness, bow and twist. This shall apply for Single and Double Modules. The warpage limitations shall apply during the insertion process and also under conditions of the specified environment (e.g vibration).

REQ 2.134 Other than the Card-edge Interface, bow and twist shall be accounted for by being subtracted from the available component envelope.

REQ 2.38 Modules may apply stiffeners for controlling warpage, insertion force deflection, or vibration deflection.

REQ 2.39 Stiffening may be accomplished by adding mechanical stiffeners on Component Side 1, Component Side 2, or both sides of the Module PCB.

REQ 2.40b When stiffeners are implemented, they shall be taken into account in the Module airflow considerations and the characterization of the Module's airflow requirements.

REQ 2.41b Standard PCB production tolerances indicate that stiffeners should be used on Double Modules.

2.2.2 Module Card-edge Interface dimensions¶ 20 The Module interface to the AMC Connector uses card-edge conductive fingers and is

referred to as the Card-edge Interface. Figure 2-12, “Module Card-edge Interface dimensions” and Figure 2-13, “Module Card-edge Interface contact detail” show the details of this interface.


Figure 2-12 Module Card-edge Interface dimensions


Figure 2-13 Module Card-edge Interface contact detail

¶ 21 Pin staging on the Card-edge Interface is achieved by varying the length of the gold plated contact pads on the Module's Card-edge Interface. Four contact stages are supported by the Card-edge Interface. The First Mate contacts are the longest, they are defined as continuous contact pads. The Second Mate, Third Mate, and Last Mate contacts are defined with an unconnected pre-pad followed by the staged contact pad. The pre-pad has the same gold plating as the contact pads and its purpose is to prevent the deterioration of the AMC Connector contacts during Module insertion and extraction. First Mate contacts are used for the power and ground connections, Second Mate contacts are used for system management related signals, Third Mate contacts are used for the high speed differential pairs, and Last Mate contacts are used for the PS0# and PS1# signals.


¶ 22 Table 2-7 provides the mating sequence distance for the Card-edge Interface.

Requirements

REQ 2.135 Modules shall support the Module Card-edge Interface dimensions as described in Figure 2-12, “Module Card-edge Interface dimensions” and Figure 2-13, “Module Card-edge Interface contact detail.”

REQ 2.136 If a Module implements the Card-edge Interface of something other than PCB material, the separation distances between contact stages may be reduced to a minimum distance of 0.4 mm between the first and second or second and third stages.

REQ 2.19b Modules Card-edge Interfaces shall implement all 170 hard gold plated contact pads and pre-pads regardless of whether they are electrically required or not in order to protect the contacts of the AMC Connectors.

REQ 2.20b The Module contacts shall be 0.76 μm (30 micro inches) minimum hard gold over 2.54 μm (100 micro inches) minimum nickel.

REQ 2.137 The AMC Module PCB shall withstand 200 mating cycles with one AMC Connector under the conditions stated in Section 7.5, “Mechanical characteristics” and Section 7.7, “Test schedule tables”, without damage that would impair normal operation.

REQ 2.138 The Module contact surface roughness should not exceed Ra = 0.2 µm.

2.2.3 Module sizes¶ 23 In all there are six possible sizes of AMC Modules. Compact Modules, Mid-size Modules

and Full-size Modules can all come in either Single or Double Module configurations.

¶ 24 Component height allowances (or envelopes) described for Compact, Mid-size and Full-size Modules apply to both Single and Double Modules. Both sides of the AMC Module PCB can be utilized for component placement. When installed in an AMC Bay, the side of the Module PCB facing the Carrier Board is called Component Side 1 and the side facing away from the Carrier Board is called Component Side 2. Component Side 2 dimensions are consistent for all AMC Module sizes allowing placement of components more than 2 mm tall on that side of the PCB. Component Side 1 dimensions vary between Full-size, Mid-size and Compact Modules.

Requirements

REQ 2.139 All AMC Module components that could come in contact with a Carrier’s Component Side 1 Cover or Component Side 2 Cover shall be free from all burrs, sharp edges, and foreign materials.

Table 2-7 Card-edge Interface mating distances

Mating Sequence Nominal distance (mm) Minimum Distance (mm)

First Mate to Second Mate 1.15 1.1

Second Mate to Third Mate 0.75 0

Third Mate to Last Mate 0.3 0.2

Last Mate to PCB bottomed in Connector 0.6 0.35


2.2.3.1 Compact Module dimensions

Figure 2-14 Compact Module component envelope

Requirements

REQ 2.31b Compact Module components shall not protrude beyond the component envelope described in Figure 2-4, “Single Module PCB dimensions”, Figure 2-5, “Double Module PCB dimensions”, Table 2-6, “Double Module PCB Mid-Board Component restrictions for Figure 2-5” , and Figure 2-14, “Compact Module component envelope.”

REQ 2.140 Compact Module Face Plates shall adhere to the dimensions shown in Figure 2-14, “Compact Module component envelope.”


2.2.3.2 Mid-size Module dimensions

Figure 2-15 Mid-size Module component envelope

Requirements

REQ 2.32b Mid-size Module components shall not protrude beyond the component envelope in Figure 2-4, “Single Module PCB dimensions”, Figure 2-5, “Double Module PCB dimensions”, Table 2-6, “Double Module PCB Mid-Board Component restrictions for Figure 2-5” , and Figure 2-15, “Mid-size Module component envelope.”


REQ 2.141 Mid-size Module Face Plates shall adhere to the dimensions shown in Figure 2-15, “Mid-size Module component envelope.”

REQ 2.142 Mid-Size Modules may provide protection (mechanical stop or barrier) in case of wrongful insertion in smaller Bays, to avoid possible damages to its components.


2.2.3.3 Full-size Module dimensions

Figure 2-16 Full-size Module component envelope

Requirements

REQ 2.33b Full-size Modules that have components exceeding the Mid-size Module component profile defined in Figure 2-15, “Mid-size Module component envelope” (with the


exception of the faceplate) shall provide a 20mm-tall (minimum) mechanical stop capable of withstanding 204 N force without damage or degradation in the event of the attempted installation in a Mid-Size Conventional Bay on a Carrier, to avoid damaging components on that Carrier. The stop shall hit the Faceplate of the Mid-Size Bay Carrier with a soft surface designed to avoid noticeable damages to that faceplate. This stop shall also hit, without noticeable damage, the front edge of a Conventional (non-Cutaway) Carrier PCB as defined in the PICMG® AMC.0 R1.0 specification.

REQ 2.143 Full-size Module components shall not protrude beyond the component envelope in Figure 2-4, “Single Module PCB dimensions”, Figure 2-5, “Double Module PCB dimensions”, Table 2-6, “Double Module PCB Mid-Board Component restrictions for Figure 2-5” , and Figure 2-16, “Full-size Module component envelope.”

REQ 2.144 Full-size Module Face Plates shall adhere to the dimensions shown in Figure 2-16, “Full-size Module component envelope.”

2.2.3.4 Voltage limits for components on Modules

¶ 25 The component envelopes defined in previous portions of Section 2.2.3, “Module sizes” and Section 2.2.1, “Module PCB dimensions” are built on the assumption that all circuits will either be electrically insulated or operate at low voltage levels. If Modules have higher-voltage circuits on board, these higher voltage components must be properly insulated or protected from operator access. When adjacent Modules are removed from a MicroTCA chassis or AMC Carrier, the remaining Module(s) may be easily touched by operators.

¶ 26 Due to the possible presence of unknown energized circuits on adjacent Carriers or Modules, circuits exceeding the limits of Table 2-8, “Voltage thresholds (working voltages)” might need more insulation to guarantee Module-to-Module or Module-to-Carrier insulation requirements as defined in IEC 60950-1 than they would need with non-energized surrounding circuits. These additional insulation requirements are beyond the scope of this specification.

Table 2-8 Voltage thresholds (working voltages)

Note: RS-232 allows signals up to 25V. Modules and Carriers need to ensure that incoming RS-232 signals are constrained to 15V range before circuits are left uncovered.

Requirements

REQ 2.145 All circuits on Modules exceeding the limits in Table 2-8 shall be inaccessible according to the operator access test defined in IEC 60950-1 with the Module not protected by any enclosure. These voltage limits shall be met under normal operating and single fault conditions.

2.2.4 Module Face Plate¶ 27 Module Face Plates fulfill a series of tasks:

• Support for the Module Handle

DC voltage AC voltage

Positive +27V +27V peak

Negative -15V -15V peak


• Mounting surface for I/O connectors

• EMC containment

• Mounting and mating of EMC Gasket surfaces

• Mechanical interface to the AMC Module PCB

• ESD shield

• Mounting for LED indicators

• Mounting and display of product information


Figure 2-17 Module Face Plate dimensions

Note: Refer to Table 2-9, “Module Face Plate tabulated dimensions for Figure 2-17” for tabulated dimensions.


Table 2-9 Module Face Plate tabulated dimensions for Figure 2-17

Note: Compact Modules can be converted to Mid-size or Full-size Modules by exchanging the Face Plate accordingly. Mid-size Modules can be converted to Full-size Modules by exchanging the Face Plate accordingly.

Requirements

REQ 2.42b The Face Plates shall be conductive in areas as shown in Figure 2-17, “Module Face Plate dimensions.”

REQ 2.43 The front face of the Face Plate may have a resilient finish or overlay which is conductive or non-conductive.

REQ 2.44b Face Plate metal thickness should be 0.65 ± 0.1 mm to maintain a uniform look and feel.

REQ 2.45b The Face Plate shall be built according to Figure 2-17, “Module Face Plate dimensions.” Module Face Plate dimensions and I/O Area shall be per Table 2-9, “Module Face Plate tabulated dimensions for Figure 2-17.”

2.2.4.1 Module LEDs

¶ 28 The LEDs defined in this section provide service personnel with important status information. Consistent placement and functional definitions of LEDs are crucial to the reduction of service complexity in a multi-vendor environment.

¶ 29 This section defines three general status LEDs for the Front Board Face Plate: two mandatory LEDs (BLUE LED and LED 1) plus one optional LED (LED2). The IPM Controller and Shelf Manager have knowledge and a level of operational control over these LEDs. LED 1, LED 2, and the BLUE LED have similar meanings to their use as defined in the PICMG 3.0 specification. LED 1 is used to indicate an “out of service” condition, LED 2 generally denotes a product health or “in service” status, and the BLUE LED is used to indicate Hot Swap status of the Module. See Section 3.3, “Additional local Module functionality” for more details on LED operation.

¶ 30 Additional LEDs may be added on the Face Plate outside the areas reserved for the three LEDs defined below. Control of these application-specific LEDs is outside the scope of this specification.

Module Type Dimension A (mm) Dimension B (mm) Dimension C (mm)

Single, Compact Module 13.88 73.8 31.4

Single, Mid-size Module 18.96 73.8 31.4

Single, Full-size Module 28.95 73.8 31.4

Double, Compact Module 13.88 148.8 106.4

Double, Mid-size Module 18.96 148.8 106.4

Double, Full-size Module 28.95 148.8 106.4


Figure 2-18 AMC Module LEDs

¶ 31 The LED positions shown in Figure 2-18, “AMC Module LEDs” provide at least 5 mm center-to-center spacing between Module LEDs, as demonstrated in Figure 2-19, “Example Modules on Cutaway and Conventional Carrier AdvancedTCA Boards.”


Figure 2-19 Example Modules on Cutaway and Conventional Carrier AdvancedTCA Boards

Requirements

REQ 2.46b Each LED should provide a minimum viewing angle of 120° with no cables attached.

REQ 2.47 Each LED should be visible from 8 m (meters) from the Face Plate with no front cables installed.


REQ 2.48b LED 1 shall be capable of being red.

REQ 2.49b LED 1 may be multicolored (if that includes red) to meet different geographic requirements.

REQ 2.50 LED 2 should be green.

REQ 2.146 LED 2 may be multi-colored.

REQ 2.52 The BLUE LED shall be blue.

REQ 2.147 Modules should not use blue colored LEDs except for the BLUE LED functionality as defined in this specification.

REQ 2.148 LEDs other than LED 1, LED 2, and the BLUE LED shall not be placed in the areas reserved for specific LEDs as depicted in Figure 2-18, “AMC Module LEDs.”

REQ 2.149 LED 1 shall be located in the upper reserved LED space depicted in Figure 2-18, “AMC Module LEDs.”

REQ 2.150 LED 2 may be omitted.

REQ 2.151 LED 2 (if present) shall be located in the upper reserved LED space as depicted in Figure 2-18, “AMC Module LEDs.”

REQ 2.152 The BLUE LED shall be located in the lower reserved LED space as depicted in Figure 2-18, “AMC Module LEDs.”

REQ 2.153 The display area for LED 1, LED 2 (if present), and the BLUE LED shall be at least 2.5 mm in diameter or diagonal.

REQ 2.154 Module LEDs meeting the requirements of prior revisions of the AMC.0 spec may be used for products released to market prior to July 1, 2007.


2.2.4.2 Module Face Plate labels

Figure 2-20 Vendor and PICMG label dimensioning and positioning

Requirements

REQ 2.76 Vendor label may be placed as shown in Figure 2-20, “Vendor and PICMG label dimensioning and positioning” or of any size and position that does not interfere with other requirements or product function.

REQ 2.77 Barcode and other labels may be positioned on the Module as desired without restriction.


REQ 2.155 Where space allows, barcode labels should be placed as shown in Figure 2-20, “Vendor and PICMG label dimensioning and positioning.”

2.2.5 Module Handle¶ 32 The Module Handle is an assembly that provides several functions. The Module Handle

provides a means for an operator to pull an installed Module from a Bay, it integrates the Module Latch Mechanism used to secure the Module in the Bay, and integrates the Hot Swap Switch function to alert the system manager of an impending Hot Swap action.

¶ 33 The Module Handle provides a means for a human operator to grab and extract an installed AMC Module. The Module Latch Mechanism provides a locking function that secures the inserted Module in the AMC Bay. To extract an installed AMC Module, the Module Handle is grasped and pulled by the operator. The Module Latch Mechanism supports a three-position operation to facilitate the Module extraction process with the Hot Swap Switch to properly notify the Module Management Controller that a Module extraction is occurring. When the AMC Module is installed, the Module Handle is in the “locked” position. The operator pulls the Handle into the “Hot Swap” position to initiate the Module extraction process. Finally, the operator pulls the Handle again to the “unlocked” position and continues to pull to fully extract the AMC Module. The three-position travel requirements are described in Figure D-1, “Original AMC Module Handle” and Figure 2-21, “Module Handle positions during Hot Swap with example handle.”


Figure 2-21 Module Handle positions during Hot Swap with example handle


Table 2-10 Module Handle position sequence

¶ 34 Module Handles can come in various styles, but must adhere to the functional requirements described in this section to ensure consistent behavior regardless of the physical appearance of the Handle. In addition to the Module Handle described in Figure D-1, “Original AMC Module Handle”, Figure 2-21, “Module Handle positions during Hot Swap with example handle” and Figure 2-22, “Module Latch Mechanism dimensions and actuation” examples of differing Module Handle designs are provided in Appendix D, “Module Handle designs.” In all cases, the Module Handle is held in position by the Module Face Plate, while the Hot Swap Switch is mounted on the Module PCB. The interface between the Module Latch Mechanism and the Hot Swap Switch is not rigidly defined; thus, different Module Handles and Module Latch Mechanisms may have unique location and actuation requirements for the Hot Swap Switch placed on the AMC Module.

Requirements

REQ 2.55b Module Handles shall provide distinct mechanical positions for actuation and sequencing of the three-position Module insertion and extraction process as shown in Table 2-10, “Module Handle position sequence.”

REQ 2.57b The generic Module Handle color is black but the Module Handle color may be selected by the implementer.

REQ 2.58b The Module Handle shall be optimized for the typical Module extraction force of about 72 N.

REQ 2.59b Module Handles shall not deform or degrade when subjected to Module extraction or insertion forces (parallel within 20 degrees) of up to 204 N.

REQ 2.65b Module Handles shall have a 3.0 mm diameter hole or equivalent feature to facilitate the use of an extraction tool such as an appropriately-sized Allen wrench.

REQ 2.156 Module Handles should be adaptable for non-Hot Swap applications, providing a means to ensure the Module cannot be extracted without the aid of a special tool once installed into the Bay.

REQ 2.157 Module Handles shall provide grip assistance necessary for a human (without tools) to overcome the insertion/extraction forces to install and remove a Module without slipping, in accordance with NEBS GR-1217.

REQ 2.158 Module Handles may support an integrated Blue LED.

REQ 2.159 Module Handles shall not exceed the reserved area of the Module Face Plate as shown in Figure 2-17, “Module Face Plate dimensions.”

Module Handle position Function

Locked• Module Card-edge Interface fully bottomed in the AMC Connector• Module Latch Mechanism locked• Hot Swap Switch activated

Hot Swap• Module Card-edge Interface fully bottomed in the AMC Connector• Module Latch Mechanism locked• Hot Swap Switch de-activated

Unlocked• Module Card-edge Interface fully bottomed in the AMC Connector• Module Latch Mechanism unlocked• Hot Swap Switch de-activated


REQ 2.160 Module Handles shall not protrude beyond the Module Face Plate by more than 38 mm regardless of the Module Handle position.

2.2.5.1 Module Latch Mechanism

¶ 35 The Module Latch Mechanism locks the AMC Module into the AMC Bay. When fully installed into a Bay/Slot, the Module Card-edge Interface is bottomed in the AMC Connector Slot. The Module Latch Mechanism's function is to keep the Module from moving away from the AMC Connector until the Module Latch is released. When the Module Handle is in the “Locked” position, the Module Latch Mechanism engages the Locking Latch against the Strut, preventing the Module from moving out of the Slot. When the Module Handle is in the “Unlocked” position, the Module Latch Mechanism releases the Locking Latch from the Strut and the AMC Module can be extracted from the Bay/Slot. Modules can be installed regardless of whether the Locking Latch is in the “locked” or “unlocked” position. Figure 2-21, “Module Handle positions during Hot Swap with example handle” shows the relationship between Module Handle positions and the Module Latch Mechanism functions. Figure D-1, “Original AMC Module Handle” shows dimensional requirements for the Module Latch Mechanism and details of the Locking Latch and Strut interfaces.

¶ 36 The Module Latch Mechanism also engages the Module Hot Swap Switch in conjunction with physical manipulation of the Module Handle during the Module insertion/extraction process. During this process the Module Latch Mechanism engages the Hot Swap Switch on the Module as required for Module extraction or insertion, see Table 2-10, “Module Handle position sequence” for a description of the Hot Swap Switch engagement. The interface between the Module Latch Mechanism and the Hot Swap Switch is not rigidly defined. Different Module Latch Mechanism designs (Hot Swap Switch and Hot Swap Switch actuator) might have unique location and actuation requirements for the Hot Swap Switch placed on the AMC Module.


Figure 2-22 Module Latch Mechanism dimensions and actuation


Requirements

REQ 2.60b During Hot Swap events the Module Latch Mechanism shall activate and deactivate the Hot Swap Switch while the locking Latch of the Module Latch Mechanism is engaged, preventing any Module movement as described in Figure 2-21, “Module Handle positions during Hot Swap with example handle.”

REQ 2.62b The Module Latch Mechanism shall withstand a 35 N minimum locking force before and after NEBS Zone 4 earthquake tests.

REQ 2.63b The Module Latch Mechanism shall allow the Module to be fully bottomed regardless of the locking Latch's position during Module insertion.

REQ 2.64b The Module Latch Mechanism shall reside within the dimensions of the Latch Component Area described in Figure 2-21, “Module Handle positions during Hot Swap with example handle.”

REQ 2.66b Minimum Creepage of 1.5 mm and Clearance of 0.7 mm shall be maintained to any components of the Module Latch Mechanism that are at Shelf Ground potential.

REQ 2.161 The Module Latch Mechanism components on Side 1 and Side 2 shall not interfere with the Card Guides or Struts of the Bay/Slot, including worst case stack up conditions created under maximum EMC Gasket compression by multiple Modules.

REQ 2.162 The Module Latch Mechanism shall actuate the Hot Swap Switch and the Latch in accordance with the Module Handle position as described in Table 2-10, “Module Handle position sequence” and Figure 2-21, “Module Handle positions during Hot Swap with example handle.”

REQ 2.163 The Module Latch Mechanism shall meet the latching requirements defined in this specification when the latch engagement point in the Strut is between 164.2 and 165.2 mm from datum J as indicated in Figure 2-22, “Module Latch Mechanism dimensions and actuation.”

2.2.5.2 Module Hot Swap Switch

Requirements

REQ 2.67b Module Hot Swap Switch shall ensure at least 1.5 mm Creepage and 0.7 mm Clearance from any Module Handle components which are at Shelf Ground potential.

REQ 2.68b The Hot Swap Switch contacts shall be actuated when the Module Handle is fully inserted.

2.2.6 Module EMC Gasket¶ 37 The EMC Gasket on Modules can be the same as the EMC Gasket on PICMG 3.0-compliant

Front Boards.


Table 2-11 Uncompressed and compressed EMC Gasket thicknesses

Description Value (mm)

Maximum uncompressed Gasket thickness 2.54

Nominal gap between two Compact Module Face Plates (nominal compression) 1.2

Maximum gap between Face Plates (min compression) 2.0

Minimum gap between Face Plates (max compression) 1.0


Figure 2-23 EMC Gasket dimensions

Note: Refer to Table 2-12, “EMC Gasket tabulated dimensions A and B for Figure 2-23” for tabulated dimensions.


Table 2-12 EMC Gasket tabulated dimensions A and B for Figure 2-23

Requirements

REQ 2.69b The EMC Gasket shall perform a minimum of 400 insertion/extraction cycles without significant change in effectiveness or usability as tested at 70º C.

REQ 2.70b An EMC Gasket shall be located on the Module Face Plate as per Figure 2-23, “EMC Gasket dimensions.”

REQ 2.71b The EMC Gasket shall conform to the dimensions in Figure 2-23, “EMC Gasket dimensions” and Table 2-12, “EMC Gasket tabulated dimensions A and B for Figure 2-23.”

REQ 2.72b Rather than wrapped around the corner of the Module Face Plate (option 2, as shown in Figure 2-23, “EMC Gasket dimensions”) the EMC Gasket may consist of two straight segments (option 1 as shown in Figure 2-23, “EMC Gasket dimensions”).

REQ 2.73b The EMC Gasket, when compressed to its nominal thickness of 1.2 mm, shall exert a force in the range of 0.1 ± 0.05 N/mm.

REQ 2.164 The EMC Gasket shall support the compression requirements described in Table 2-11, “Uncompressed and compressed EMC Gasket thicknesses.”

2.2.7 Filler Module¶ 38 AMC Bays without AMC Modules installed must not be left empty. Filler Modules are

installed into “empty” Bays/ Slots to provide, at a minimum, an EMI seal and “good citizen” airflow baffling to encourage air to stream over the installed AMC Modules in adjacent Bays or Slots. The airflow baffling requirements such as airflow direction and impedance can vary for different applications. Figure 2-24, “Filler Module example” shows a conceptual drawing of a Full-size Filler Module. The Filler Module physical dimensions described in Table 2-13, “Filler Module tabulated dimensions for Figure 2-24” mimic those of AMC Modules. Filler Modules utilize standard AMC Face Plates and EMC Gaskets as described in Section 2.2.4, “Module Face Plate” and Section 2.2.6, “Module EMC Gasket” respectively. The Filler Module Face Plate is typically attached to the PCB (or other material such as metal) and is dimensioned for the appropriate Bay size as described in Section 2.2.4, “Module Face Plate.” Airflow management devices are typically attached to the PCB (or alternate material) and are sized appropriately within AMC Module component areas, as described in Section 2.2.3, “Module sizes.” Filler Modules also need a Module Handle or equivalent device that assists with insertion/extraction and that secures the Filler Module into the Bay/Slot.

¶ 39 To meet various airflow impedance needs, Filler Module baffles could be made available with specific percentages open, such as 25%, 50%, and 75% open.

Module Type Dimension A (mm) Dimension B (mm)

Single, Compact Module 13.3 73.3

Single, Mid-size Module 18.4 73.3

Single, Full-size Module 28.4 73.3

Double, Compact Module 13.3 148.3

Double, Mid-size Module 18.4 148.3

Double, Full-size Module 28.4 148.3


Figure 2-24 Filler Module example

Note: Refer to Table 2-13, “Filler Module tabulated dimensions for Figure 2-24” for tabulated dimensions.


Table 2-13 Filler Module tabulated dimensions for Figure 2-24

¶ 40 Typically, Filler Modules are mechanical constructions that do not behave as intelligent FRUs, do not require power or signal connections to the Card-edge Interface, and do not have any LEDs or other connections on the Face Plate. These simple Filler Modules are not required to have a Card-edge Interface at all. Some applications, however, may require the system management software to detect the presence of a Filler Module installed into a Bay/Slot. Filler Modules for these applications can behave as a fully intelligent FRU that supports the MMC, BLUE LED, Hot Swap Switch/sensor, temperature sensor, and fully operational Handle and Latch Mechanism. Another approach is for the Filler Modules to simply short the PS0# and PS1# signals together. This allows the Shelf Manager to detect something installed into the Bay/Slot, but not recognize it as a FRU device. In either of these last two cases, the Filler Module must support the Card-edge Interface.

Requirements

REQ 2.78b Filler Modules shall be installed into any empty AMC Bay or Slot.

REQ 2.79b The installed Filler Module shall match the airflow requirements of the AMC Bay for the target application as described in Section 5.2.2, “Module airflow.”

REQ 2.165 Baffles, vanes or other integrated devices on Filler Modules shall adhere to Module component envelope requirements for the appropriate size Module as described in Figure 2-14, “Compact Module component envelope”, Figure 2-15, “Mid-size Module component envelope” or Figure 2-16, “Full-size Module component envelope.”

REQ 2.166 Double Filler Modules shall meet the envelope restrictions defined in Figure 2-5, “Double Module PCB dimensions” and Table 2-6, “Double Module PCB Mid-Board Component restrictions for Figure 2-5.”

REQ 2.80b Filler Modules shall meet the Face Plate dimensional requirements described in Section 2.2.4, “Module Face Plate.”

REQ 2.82b To support detection of an installed Filler Module, the Filler Module may connect PS0# and PS1# pins together as described in Figure 3-3, “Module management hardware.” More elaborate Filler Modules may support the MMC and related connections shown in Figure 3-3 and behave as hot swappable FRUs.

REQ 2.83b The Filler Module shall be equipped with a Handle that facilitates extraction of the Filler Module and a Module Latch Mechanism that secures it in place while installed.

REQ 2.167 Filler Modules with the Card-edge Interface shall support at a minimum a contact to Module ESD Segment 3 as described in Section 2.2.4.1, “Module LEDs.”

Module Type Dimension A (mm)

Dimension B (mm)

Dimension C (mm)

Dimension D (mm)

Single, Compact Module 8.00 69.50 65.00 73.50

Single, Mid-size Module 11.00 69.50 65.00 73.50

Single, Full-size Module 23.00 69.50 65.00 73.50

Double, Compact Module 8.00 144.50 65.00 148.50

Double, Mid-size Module 11.00 144.50 65.00 148.50

Double, Full-size Module 23.00 144.50 65.00 148.50


REQ 2.168 Filler Modules may utilize PCB substrate or other substitute material that meets UL 94 V0 (28% oxygen index) rating.

REQ 2.169 Filler Modules without a Card-edge Interface shall be 168 mm deep as shown in Figure 2-24, “Filler Module example.”

REQ 2.170 Filler Modules that utilize any connections (signals, grounds or power pins) to the Card-edge Interface shall support the placement and plating requirements for Card-edge contacts as described in Section 2.2.2, “Module Card-edge Interface dimensions.”

REQ 2.171 Filler Modules with Face Plate LEDs shall support the LED placement requirements described for AMC Modules in Section 2.2.4.1, “Module LEDs.”

REQ 2.172 Filler Modules shall support the EMC Gasket requirements described for AMC Modules in Section 2.2.6, “Module EMC Gasket.”

REQ 2.173 Filler Modules shall be retained into the Bay/ Slot to comply with the shock, vibration, and seismic requirements.

REQ 2.174 The Filler Module may support a standard AMC Module Handle and Latch Mechanism.

2.2.8 Module massRequirements

REQ 2.14b The mass of Single Compact Modules shall not exceed 0.175 kg (6.2 oz).

REQ 2.15b The mass of Single Mid-size or Single Full-size Modules shall not exceed 0.35 kg (12.35 oz).

REQ 2.16b The mass of Double Compact Modules shall not exceed 0.35 kg (12.35 oz).

REQ 2.17b The mass of Double Mid-size or Full-size Modules shall not exceed 0.7 kg (24.7 oz).

2.3 AMC Bay requirements¶ 41 A Carrier has one or more AMC Bays to receive AMC Modules. An AMC Bay comprises

several separate elements that must be mechanically aligned for proper AMC operation. AMC Bays comprise Struts, Module Card Guides, the AMC Connector, and the physical space allocated to house AMC Modules, including a Face Plate opening for the AMC Module to slide into. Struts and Card Guides align the Module properly for insertion into the AMC Connector attached to the Carrier Board. Features and requirements for Cutaway and Conventional Bays described in this section can be applied to any suitable Carrier form factor.

2.3.1 Card Guides and Struts¶ 42 Card Guides provide the channels where the Module PCB edges ride in and out of the AMC

Bay. The Card Guides are typically attached to the Carrier Component Side 1 Cover and can be removable or non-removable. Struts support the Card Guide and they also include the interface geometry for the Module Latch Mechanism. The Struts tie the Carrier Component Side 1 Cover to the Carrier Component Side 2 Cover or to the Carrier PCB. Strut and Card


Guide design interfaces and dimensions are described in Figure 2-29, “Double Cutaway Bay AMC Connector detail” and Figure 2-46, “Card Guide assembly dimensions for Cutaway Bay.”

¶ 43 Card Guides and Struts provide guiding and alignment for the insertion of Modules into the AMC Connector Slots. The relationship between Module Card Guides and Struts with other Bay components and geometries is shown in Figure 2-30, “Cutaway Bay dimensions.”

Requirements

REQ 2.117b The Card Guides shall provide a non-conductive means for Module PCB support in the AMC Bay.

REQ 2.118b The Card Guide or Strut at the top of the AMC Bay shall provide a single ESD Contact on the upper edge of the Component Side 2 at the front of the Bay, providing a discharge path to Shelf Ground for each supported Slot.

REQ 2.119 Card Guides and Struts shall provide a lead-in feature to facilitate aligning the Module PCB into the Card Guide.

REQ 2.120 When the Module is fully inserted into the Connector, the Card Guide shall not constrain the Module; the back end of the Module PCB shall be solely supported by the Connector.

REQ 2.121 The Card Guides shall ensure an overlap with the Module PCB of at least 0.7 mm under all insertion/withdrawal and mating circumstances.

REQ 2.123 The Card Guides shall limit the rotation in the vertical direction of the Module PCB versus the Connector to ± 0°20' under all mating circumstances.

REQ 2.126 Struts and Card Guides may be constructed as a single component but the required dimensions shall remain unchanged.

REQ 2.127bModule PCB centering contacts should be provided in the Card Guide (as shown in Figure 2-31, “Card Guide and Strut detail.”)

REQ 2.27b The ESD Contact shall be made of stainless steel with less than 0.1 Ω resistivity to Shelf Ground.

REQ 2.175 Module Card Guides shall be positioned relative to the AMC Connector Slot as described in Figure 2-28, “Cutaway Bay AMC Connector detail” and Figure 2-29, “Double Cutaway Bay AMC Connector detail” for Single and Double Cutaway Bays or Figure 2-34, “Conventional Bay AMC Connector detail” and Figure 2-35, “Double Conventional Bay AMC Connector detail” for Single and Double Conventional Bays.

REQ 2.176 The ESD Contact shall perform 200 cycles of Module insertion/extraction without degradation.

REQ 2.177 The ESD Contact contact pressure shall not damage the Module ESD Strip within 200 cycles of Module insertion/extraction.

REQ 2.178 The ESD Contact shall not have any sharp edges facing the Module ESD Strip.

REQ 2.179 Card Guides and Struts for Slot A (the Slot closest to the Carrier PCB) may be omitted for Single Slot Cutaway Bays.


2.3.2 Cutaway Bay¶ 44 A Cutaway Bay is created by removing the Carrier's PCB between the Face Plate and the

AMC Connector. The AB or the A+B+ Connector style support a Dual Slot Cutaway Bay while the B or B+ Connector supports a Single Slot Cutaway Bay. The Single Slot Cutaway Bays that utilize the B or B+ style AMC Connector are optimized to support one Full-size Module.

2.3.2.1 AMC Connector placement for Cutaway Bay

¶ 45 Depending on the style of AMC Connector utilized for a Cutaway Bay, the connector footprint varies. The A+B+ style AMC Connector occupies more space than the AB or B/B+ style AMC Connectors. Proper placement of the AMC Connector is critical to ensure the Module is properly seated when installed into the Bay. Figure 2-25, “AMC Connector placement for a Cutaway Bay” shows the placement area for each AMC connector style. Figure 2-26, “Cutaway Bay PCB for B/ B+ Connector” and Figure 2-27, “Cutaway Bay PCB for AB and A+B+ Connector” show the PCB dimensions for each AMC Connector style. Figure 2-28, “Cutaway Bay AMC Connector detail” shows the dimensions and positions of the A and B Slots relative to the Bay opening envelope and Card Guides. Figure 2-29, “Double Cutaway Bay AMC Connector detail” shows the AMC Connector dimensions and Slot positions for a Double Cutaway Bay.


Figure 2-25 AMC Connector placement for a Cutaway Bay


Figure 2-26 Cutaway Bay PCB for B/ B+ Connector


Figure 2-27 Cutaway Bay PCB for AB and A+B+ Connector

¶ 46 See Section 7, “AMC Connector” for specific Connector mounting requirements and PCB cutouts.


Figure 2-28 Cutaway Bay AMC Connector detail


Figure 2-29 Double Cutaway Bay AMC Connector detail


Requirements

REQ 2.180 AMC Connectors in a Cutaway Bay shall be placed on the Carrier PCB within the allotted area described for each AMC Connector style in Figure 2-25, “AMC Connector placement for a Cutaway Bay.”

REQ 2.181 AMC Connectors in a Cutaway Bay shall be positioned relative to the Bay Opening envelope as described in Figure 2-28, “Cutaway Bay AMC Connector detail” and Figure 2-29, “Double Cutaway Bay AMC Connector detail” for Single or Double Bays respectively.

2.3.2.2 Cutaway Bay dimensions

¶ 47 The Carrier Face Plate aperture, or opening, in a Cutaway Bay is intended to support two Compact Modules or one Full-size Module including the EMC Gasket material for each Module. The Cutaway Bay Opening envelope is the same size as the Carrier AdvancedTCA Board’s Face Plate. Cutaway Carrier AdvancedTCA Boards have no Face Plate in the area of any Cutaway Bays. Figure 2-30, “Cutaway Bay dimensions” and Figure 2-32, “Double Cutaway Bay dimensions” show the Cutaway Bay Opening envelope for Single and Double Bays respectively.


Figure 2-30 Cutaway Bay dimensions


Figure 2-31 Card Guide and Strut detail


Figure 2-32 Double Cutaway Bay dimensions

Requirements

REQ 2.182 Cutaway Bays shall adhere to the dimensions and tolerances described in Figure 2-30, “Cutaway Bay dimensions” or Figure 2-32, “Double Cutaway Bay dimensions” for Single and Double Bays respectively.

REQ 2.183 Cutaway Bay opening envelope shall adhere to the dimensions and tolerances described in Figure 2-30, “Cutaway Bay dimensions” or Figure 2-32, “Double Cutaway Bay dimensions” for Single and Double Bay respectively.


2.3.3 Conventional Bay¶ 48 Conventional Bays utilize B/B+ style AMC Connectors to support either one Mid-size

Module or one Compact Module per Bay. The Conventional Bay Opening defines whether a Conventional Bay is a Compact Conventional Bay or a Mid-size Conventional Bay. Compact Conventional Bays can only accommodate Compact Modules. Mid-size Conventional Bays can only accommodate Mid-size Modules. Full-size Modules are not supported by Conventional Bays.

2.3.3.1 AMC Connector placement for Conventional Bay

¶ 49 The Conventional Bay utilizes either a Basic or Extended (B/B+) AMC Connector placed to accommodate a Mid-size or Compact Module.

Requirements

REQ 2.184 AMC Connectors (B/B+) shall be placed within the allotted Carrier PCB area described in Figure 2-33, “AMC Connector placement for Conventional Bay.”

REQ 2.185 AMC Connectors shall be positioned relative to the Conventional Bay Opening envelopes as described in Figure 2-34, “Conventional Bay AMC Connector detail” and Figure 2-35, “Double Conventional Bay AMC Connector detail” for Single or Double Bays respectively.


Figure 2-33 AMC Connector placement for Conventional Bay


Figure 2-34 Conventional Bay AMC Connector detail


Figure 2-35 Double Conventional Bay AMC Connector detail


2.3.3.2 Conventional Bay dimensions

Figure 2-36 Single AMC Conventional Bay dimensions


Note: See Figure 2-31, “Card Guide and Strut detail” for Strut/Card Guide details. Refer to Table 2-14, “Conventional Bay opening tabulated dimensions for Figure 2-36 and Figure 2-37” for tabulated dimensions.

Figure 2-37 Double AMC Conventional Bay dimensions

Note: Refer to Table 2-14, “Conventional Bay opening tabulated dimensions for Figure 2-36 and Figure 2-37” for tabulated dimensions.

2.3.3.3 Conventional Bay component allowance

¶ 50 The Conventional Bay allows Carriers to support AMC Modules while still making use of the Carrier PCB area underneath the Bay. A Conventional Carrier can utilize the Carrier PCB area to place components, connectors or other items within the described component area. Coincident with the Bay opening envelope the height of components that can be placed on the Carrier differs. Figure 2-38, “Conventional Bay component height allowance for Mid-


size Modules” and Figure 2-39, “Conventional Bay component height allowance for Compact Modules” show the component area allowances for Carrier PCB within Conventional Bays.

Figure 2-38 Conventional Bay component height allowance for Mid-size Modules

Figure 2-39 Conventional Bay component height allowance for Compact Modules

Requirements

REQ 2.92b Components placed on the Carrier PCB (Component Side 1) within the Conventional Bay area shall adhere to the Carrier envelope dimensions described in Figure 2-38, “Conventional Bay component height allowance for Mid-size Modules” or Figure 2-39, “Conventional Bay component height allowance for Compact Modules.”


REQ 2.186 Carrier Components in Compact Conventional Bays may extend up to 8.14 mm above the Carrier’s Component Side 1 reference plane, only if the Carrier implements a barrier the full width of the Bay that extends at least 0.5 mm taller than the tallest Carrier component within that Bay. This barrier may be implemented as an upturned extension to the Carrier Face Plate return flange, provided that this extension or barrier remains at maximum 8.77mm above the Carrier's Component Side 1 reference plane.

2.3.3.4 Voltage limits for components on Carriers

¶ 51 The component envelopes defined in previous portions of Section 2.3.3.2, “Conventional Bay dimensions” are built on the assumption that all circuits will either be electrically insulated or operate at low voltage levels. If Carriers have higher-voltage circuits on board, these higher voltage components must be properly insulated or protected from operator access.

¶ 52 Due to the possible presence of unknown energized circuits on installed Modules, circuits exceeding the limits of Table 2-8, “Voltage thresholds (working voltages)” might need more insulation to guarantee Module-to-Carrier insulation requirements as defined in IEC 60950-1 than they would need with non-energized surrounding circuits. These additional insulation requirements are beyond the scope of this specification.

Note: RS-232 allows signals up to 25V. Modules and Carriers need to ensure that incoming RS-232 signals are constrained to 15V range before circuits are left uncovered.

Requirements

REQ 2.187 All circuits on Carriers exceeding the limits in Table 2-8, “Voltage thresholds (working voltages)” shall be inaccessible according to the operator access test defined in IEC 60950-1 even if Modules are removed from Carriers. These voltage limits shall be met under normal operating and single fault conditions.

2.3.3.5 Conventional Bay opening

¶ 53 The Face Plate openings for the Compact Conventional Bay and the Mid-size Conventional Bay are different. Figure 2-36, “Single AMC Conventional Bay dimensions” and Figure 2-37, “Double AMC Conventional Bay dimensions” along with Table 2-14, “Conventional Bay opening tabulated dimensions for Figure 2-36 and Figure 2-37” describe the options for the Bay opening.

¶ 54 When a Module is installed in the Conventional Bay, the Module EMC Gasket seals against the Carrier Face Plate.


Table 2-14 Conventional Bay opening tabulated dimensions for Figure 2-36 and Figure 2-37

Note: Dimensions shown in Table 2-14 are consistent with Figure 2-36, “Single AMC Conventional Bay dimensions” and Figure 2-37, “Double AMC Conventional Bay dimensions.” Dimension A represents the “height” of the Bay opening; Dimension B represents the AMC Module pitch line within the Bay; and Dimension C represents the “width” of the Bay opening.

Requirements

REQ 2.188 The Conventional Bay opening envelope shall adhere to dimensions and tolerances described in Figure 2-36, “Single AMC Conventional Bay dimensions” or Figure 2-37, “Double AMC Conventional Bay dimensions” and Table 2-14, “Conventional Bay opening tabulated dimensions for Figure 2-36 and Figure 2-37.”

2.4 Carrier requirements¶ 55 This section provides the mechanical requirements for Carrier Boards over and beyond the

AMC Bay. The AMC Module form factor was optimized for PICMG 3.0. Therefore, the Carrier Board descriptions in this section are focused on AdvancedTCA designs, but the requirements called out should be used with other Carrier form factors.

¶ 56 A Carrier Board has one or more AMC Bays to receive AMC Modules. An AMC Bay comprises several separate elements that must be mechanically aligned for proper AMC operation. AMC Bays comprise Struts, Module Card Guides, the AMC Connector, and the physical space allocated to house AMC Modules. Struts and Card Guides align the Module properly for insertion into the AMC Connector attached to the Carrier Board.

¶ 57 Carrier Boards can support Conventional Bays, Cutaway Bays or both. Carriers that support one or more Cutaway Bays are called Cutaway Carriers. Carriers that support one or more Conventional Bays are called Conventional Carriers. Carriers that support both Cutaway and Conventional Bays are called Hybrid Carriers. AMC Carrier AdvancedTCA Boards can support up to four Single Bays or two Double Bays.

¶ 58 Cutaway Carrier AdvancedTCA Boards have no Face Plate area where Cutaway Bays reside. The Cutaway Bay opening is sized to accommodate one Full-size Module or two Compact Modules. Cutaway Carrier AdvancedTCA Boards that support Bays near the edge of the board, such as with four Bay configurations, have specific Face Plate design requirements for LED and Carrier Handle support.

¶ 59 Conventional Carrier AdvancedTCA Boards have some Face Plate area that can be used to support LEDs or labels. The Bays can support either a Mid-size or a Compact Module individually, providing the corresponding aperture.

Bay Opening envelope size Dimension A (mm)without EMI gasket Dimension B (mm) Dimension C (mm)

without EMI gasket

Compact Module 16.77 15.24 76.2

Mid-size Module 21.89 20.32 76.2

Double, Compact Module 16.77 15.24 151.2

Double, Mid-size Module 21.89 20.32 151.2


2.4.1 Carrier AdvancedTCA Board orientationRequirements

REQ 2.6b Carrier Boards and AMC Modules within a Subrack shall be defined as being in the standard orientation when the Carrier Boards are positioned in a vertical orientation. When viewed from the front, Carrier Component Side 1 faces right, and Carrier Component Side 2 faces left. The bottom Carrier Board edge is closest to the Zone 1 connector, and the top Carrier Board edge is closest to the Zone 3 connector.

REQ 2.7 If a physical implementation of a Shelf requires the Carrier Boards to be mounted horizontally, their orientation shall be with Carrier Component Side 1 facing upward and Carrier Component Side 2 facing downward.

2.4.2 Bay and Slot locations¶ 60 Modules installed on a Carrier are identified by an alphanumeric value representing the Bay

and Slot position. For Carrier AdvancedTCA Boards, as shown in Figure 2-40, “Stacked Bay location and naming convention, Cutaway Carrier AdvancedTCA Board example”, Figure 2-41, “Full-size Modules installed on an Cutaway Carrier AdvancedTCA Board” and Figure 2-42, “Double Bay location and naming example”, Bays are numbered 1 through 4 and Slots are designated as A or B. Slot designations of A or B coincide with Slot A/B positions for AB or A+B+ Connectors. Note that Slots on Conventional Carriers will always be designated as “B”. In the vertical orientation shown in the figures below, Bay numbers are assigned starting with the Bays nearest Zone 3 (the top-most as shown in Figure 2-40, “Stacked Bay location and naming convention, Cutaway Carrier AdvancedTCA Board example.”)

Requirements

REQ 2.1b Slots shall be identified by a capital letter followed by a numeral. The letter shall coincide with AMC Connector Slot positions (A or B). The number shall identify the Bay's position, starting with number 1 for the top-most Bay in a vertically oriented Carrier such as shown in Figure 2-40, “Stacked Bay location and naming convention, Cutaway Carrier AdvancedTCA Board example.”


Figure 2-40 Stacked Bay location and naming convention, Cutaway Carrier AdvancedTCA Board example


Figure 2-41 Full-size Modules installed on an Cutaway Carrier AdvancedTCA Board

¶ 61 A Cutaway Carrier which supports the B layer only is illustrated in Figure 2-41, “Full-size Modules installed on an Cutaway Carrier AdvancedTCA Board.”

2.4.2.1 Double-Bay locations

¶ 62 By removing the Card Guides and Struts between two adjacent AMC Bays, two Single Bays are converted to one Double Bay. When viewed from the front, the AMC Connector in the lower portion of the Bay will support the Double Module. The AMC Connector in the upper portion of the Double Bay is not used.

¶ 63 Location and naming conventions for Double-Bays follow the general guidelines listed below. See Figure 2-42, “Double Bay location and naming example” for a graphical representation of the following rules.

• Double-Bays are supported in positions “1 and 2,” “2 and 3,” and “3 and 4" on an AMC Carrier equipped with 4 Bay positions.

• Modules installed into Double Bays are identified with the Slot identification of the mating Connector. (e.g. the Module which occupies Slot positions B1 and B2 is referred to as B2.)


Figure 2-42 Double Bay location and naming example

Requirements

REQ 2.3b Bays may be positioned anywhere along the Carrier Face Plate.

REQ 2.4b When two or more AMC Bays are implemented on a Carrier, they should be placed adjacent to one another and should support removable Card Guide and Struts to allow a field reconfiguration of two Single-Bays to a Double-Bay.

2.4.3 AMC Carrier AdvancedTCA Board dimensions

2.4.3.1 Carrier PCB support interfaces - Cutaway

¶ 64 The Cutaway Carrier AdvancedTCA Board configuration is used to accommodate up to eight Compact Modules, or four Full-size Modules.


Figure 2-43 Cutaway Carrier Board dimensions for B/B+ Connector - PICMG 3.0


Figure 2-44 Cutaway Carrier Board dimensions for AB and A+B+ Connector - PICMG 3.0

¶ 65 See Section 7, “AMC Connector” for specific Connector mounting requirements and PCB cutouts.

¶ 66 Cutaway Carriers can be constructed by utilizing multiple PCB segments.


Requirements

REQ 2.87b Carrier AdvancedTCA Boards with 4 Cutaway Bays shall comply with all the dimensions shown in Figure 2-43, “Cutaway Carrier Board dimensions for B/B+ Connector - PICMG 3.0” or Figure 2-44, “Cutaway Carrier Board dimensions for AB and A+B+ Connector - PICMG 3.0.”

2.4.3.2 Carrier PCB support interfaces - Conventional

¶ 67 The Conventional Carrier AdvancedTCA Board configuration is used to accommodate up to four Mid-size Modules or Compact Modules.


Figure 2-45 Conventional Carrier Board dimensions - PICMG 3.0


Requirements

REQ 2.89b The Conventional Carrier Board configuration is used to accommodate Compact or Mid-size Modules in the B Layer. The maximum number of the Modules is four. B or B+ style AMC Connectors shall be mounted on the Conventional Carrier.

REQ 2.90b AMC Carrier AdvancedTCA Boards with 4 Conventional Bays shall comply with the dimensions and interfaces shown in Figure 2-45, “Conventional Carrier Board dimensions - PICMG 3.0.”

2.4.3.3 Carrier PCB thickness

¶ 68 All AMC Carrier Boards, component designs and documentation are based on Carrier PCB nominal thickness of 2.4 mm, if PCB thickness other than 2.4 mm ± 0.2mm are used, issues such as thicknesses of Carrier Handles and AMC Connector brace plates as well as height of Carrier PCB standoffs, etc. will require special consideration and possible modifications.

Requirements

REQ 2.189 The Carrier PCB thickness should be 2.4mm ± 0.2mm

2.4.3.4 Carrier PCB warpage

Requirements

REQ 2.93b The sum of the PCB thickness, component height, optional covers, and warpage shall conform to all PICMG 3.0 specifications for AMC Carrier AdvancedTCA Boards.

2.4.3.5 Carrier PCB stiffening

¶ 69 As there is a Component Side 2 Cover, additional stiffeners are probably not required.

Requirements

REQ 2.94 The Carrier Board PCB may require stiffening to controlling warpage, to control deflection caused by insertion forces, and/or to control deflection during applicable environmental tests (See PICMG 3.0, Section 2.6.9, Subrack Integrity tests).

REQ 2.95 Stiffening may be accomplished by adding mechanical stiffeners either on Component Side 1 or Component Side 2 of the Carrier PCB.

REQ 2.96 The design and placement of stiffeners shall not impede airflow.

REQ 2.97 Stiffeners shall be placed within the Carrier’s Component Height requirements specified in Section 2.4.3.3, “Carrier PCB thickness.”


2.4.4 AdvancedTCA Card Guides and Struts¶ 70 AdvancedTCA Module Card Guides are typically mounted to the Component Side 1 cover

while the Struts tie the Carrier Component Side 1 Cover to the Carrier Component Side 2 Cover. Struts and Card Guides are typically re-usable between Cutaway and Conventional Bays. Figure 2-46, “Card Guide assembly dimensions for Cutaway Bay” and Figure 2-47, “Card Guide assembly dimensions for Conventional Bay” describe positioning and dimensions for Card Guides and Struts in a Carrier AdvancedTCA Board.

¶ 71 The Strut requirements for AMC Carrier AdvancedTCA Boards are specified in this section, other AMC Carriers might require a different height of the Struts.

Requirements

REQ 2.124 For AMC Carrier AdvancedTCA Boards, Card Guides and Struts shall comply with the dimensions shown in Figure 2-46, “Card Guide assembly dimensions for Cutaway Bay” or Figure 2-47, “Card Guide assembly dimensions for Conventional Bay” for the A and B Layers respectively.


2.4.4.1 Card Guide and Strut Dimensions

Figure 2-46 Card Guide assembly dimensions for Cutaway Bay

Note: Refer to Table 2-15, “Carrier AdvancedTCA Board Card Guide/Strut tabulated dimensions for Figure 2-46 and Figure 2-47” for tabulated dimensions.


Figure 2-47 Card Guide assembly dimensions for Conventional Bay

Note: Refer to Table 2-15, “Carrier AdvancedTCA Board Card Guide/Strut tabulated dimensions for Figure 2-46 and Figure 2-47” for tabulated dimensions.


Table 2-15 Carrier AdvancedTCA Board Card Guide/Strut tabulated dimensions for Figure 2-46 and Figure 2-47

2.4.5 Component Covers¶ 72 AMC Carrier AdvancedTCA Board configurations require Covers on Component Side 1 and

Component Side 2. The Component Side 1 and Component Side 2 Covers provide mechanical rigidity for the Carrier Board. The Struts and Card Guides are mounted to the Component Covers.

Requirements

REQ 2.109 Screw heads, press-in hardware, or other features shall not protrude beyond the outside plane of the Component Covers.

REQ 2.111b Cutaway Carriers shall provide sheet metal Component Side 1 and Component Side 2 Covers in the supported Cutaway Bays with a thickness of 0.6 ± 0.1 mm without electrical insulator.

REQ 2.190 Conventional Carriers shall provide sheet metal Component Side 1 Cover in the supported Conventional Bays with a thickness of 0.6 ± 0.1 mm without electrical insulator.

REQ 2.112b To prevent Modules from shorting to the Component Covers, an electrical insulator capable of withstanding 2500V shall be added to the inside surface (surface closest to the Module) of each Component Cover. The maximum insulator thickness shall be 0.1 mm.

REQ 2.113 Component Cover insulation material shall cover all exposed conductive surfaces within 1.5 mm of the Module or Carrier component envelopes as defined in Figure 2-4, “Single Module PCB dimensions”, Figure 2-5, “Double Module PCB dimensions”, Figure 2-8, “Module ESD Strip dimensions”, Figure 2-14, “Compact Module component envelope”, Figure 2-15, “Mid-size Module component envelope” or Figure 2-16, “Full-size Module component envelope.” Figure 2-47, “Card Guide assembly dimensions for Conventional Bay”, Figure 2-48, “Cutaway Carrier AdvancedTCA Board Face Plate dimensions”, Figure 2-49, “Conventional Carrier AdvancedTCA Board Face Plate dimensions” and Figure 2-55, “Cutaway Carrier AdvancedTCA Board EMC Gasket placement” are provided as examples.

REQ 2.114b Uninstalled Card Guides’ attachment points and Strut mounting features on the Component Covers shall be insulated with removable non-conductive covers to insulate the otherwise exposed conductive Component Cover. Card Guide attachment covers shall not be wider than 6.3 mm or taller than 2.6 mm or extended more than 1 mm beyond the feature to be covered.

REQ 2.191 The Component Side 1 and Component Side 2 Covers shall support the Module mass requirements as described in Section 2.2.8, “Module mass.”

Module width Dimension A (mm) MIN Dimension B (mm) Dimension C (mm)

Single 70.5 74 75

Double 145.5 149 150


2.4.6 Carrier AdvancedTCA Board Face Plate¶ 73 Supporting Cutaway Bays affects the AdvancedTCA Board Face Plate. For Cutaway Bays,

the Carrier Face Plate is open between the Component Side 1 and Component Side 2 Covers. Module Face Plates or Filler Modules occupy this open area. Using all of the available Carrier AdvancedTCA Board Face Plate area allows the deployment of two Compact Modules into a Cutaway Bay and up to eight Compact Modules per single Slot Carrier Board.

¶ 74 For Conventional Bays, the Carrier Face Plate occupies some of the available AdvancedTCA Face Plate area. Compact and Mid-size Conventional Bay openings of the Carrier Board Face Plate are occupied by the Face Plates of the installed Modules (or Filler Modules) of the appropriate type.

¶ 75 The Carrier Face Plate is used to accommodate LEDs, labels, and the AdvancedTCA Handle. The following sections describe the locations and dimensions of Carrier LEDs, Labels, Carrier Handle and Hot Swap Switch for example Cutaway and Conventional Carrier configurations.


Figure 2-48 Cutaway Carrier AdvancedTCA Board Face Plate dimensions


Figure 2-49 Conventional Carrier AdvancedTCA Board Face Plate dimensions

Requirements

REQ 2.98b The Cutaway Carrier Face Plate shall conform to Figure 2-48, “Cutaway Carrier AdvancedTCA Board Face Plate dimensions” with regard to AMC Bay positions (connector datum L1) for an AMC Carrier AdvancedTCA Board with 4 Cutaway Bays.

REQ 2.192 The Conventional Carrier Face Plate shall conform to Figure 2-49, “Conventional Carrier AdvancedTCA Board Face Plate dimensions” AMC Bay positions (connector datum L1) for an AMC Carrier AdvancedTCA Board with 4 Conventional Bays.

2.4.6.1 Carrier AdvancedTCA Board Face Plate labels

¶ 76 The logo label for Cutaway Carrier AdvancedTCA Boards has been slightly modified from the PICMG 3.0 requirements in order to fit in the available space on an AMC Cutaway Carrier's Face Plate. Since the two required LEDs (LED1 and the BLUE LED) use some of the label space, a special AdvancedTCA logo label has been defined. Refer to http://www.picmg.org/advancedTCAlogos.stm for the logo artwork. Bar code labeling for Cutaway Carriers is application specific.


Figure 2-50 Cutaway Carrier AdvancedTCA Board labels


Requirements

REQ 2.107bCarrier AdvancedTCA Board Face Plates shall include the AdvancedTCA logo as specified in PICMG 3.0 or the special AdvancedTCA logo placed as shown in Figure 2-50, “Cutaway Carrier AdvancedTCA Board labels”, consistent with the provisions in Section 1.9, “Name and logo usage.”

REQ 2.108bCarrier AdvancedTCA Board Face Plates shall include room for a vendor logo label. If present, the logo shall be placed as specified in PICMG 3.0 or shown in Figure 2-50, “Cutaway Carrier AdvancedTCA Board labels.”

2.4.6.2 Carrier AdvancedTCA Board LEDs

¶ 77 PICMG 3.0 provides placement information and recommended colors for up to four standard LEDs: BLUE LED, LED 1, LED 2, and LED 3. Conventional Carriers can use the standard PICMG 3.0 locations for the BLUE LED, LED 1, and LED 2. If LED 3 is provided on a Conventional Carrier with a Strut placed as shown in Figure 2-45, its location may need to be adjusted by 2.0 mm from the location defined in PICMG 3.0 to ensure there is sufficient room to mount a strut near LED 3. This slight adjustment keeps LED 3 in the reserved area for specific LEDs defined in Section 2.2.8 of the PICMG 3.0 specification.

Note: Some strut designs or AMC Bay designs may allow LED 3 to be placed in its normal PICMG 3.0 position. This is preferable to the 2.0 mm movement of LED 3 allowed above.

¶ 78 Because AMC Modules consume the entire Face Plate in a Cutaway Bay, some Cutaway Carriers do not have any Carrier Face Plate where the standard LEDs are located. If the standard LED locations cannot be used, AMC.0 defines alternate LED locations for Carriers.

¶ 79 Refer to PICMG 3.0 for the definitions of these LEDs and other LED requirements such as color and control. LED definition for other Carrier Board form factors is outside the scope of this document.

Requirements

REQ 2.99b For AMC Carrier AdvancedTCA Boards, the required General Status LEDs and any used optional General Status LEDs shall be placed either as shown in the PICMG 3.0 specification or in Figure 2-51, “Conventional Carrier LEDs” or in Figure 2-52, “Cutaway Carrier LEDs.”

REQ 2.193 For AMC Carrier AdvancedTCA Boards implementing LEDs according to Figure 2-52, “Cutaway Carrier LEDs”, the BLUE LED should be placed in the preferred location near the bottom of the Face Plate, as shown in Figure 2-52, “Cutaway Carrier LEDs.”


Figure 2-51 Conventional Carrier LEDs


Figure 2-52 Cutaway Carrier LEDs

2.4.7 Carrier AdvancedTCA Board Handle mechanism¶ 80 Conventional Carrier AdvancedTCA Boards can use standard AdvancedTCA Handles as

described in the PICMG 3.0 specification. Figure 2-53, “Conventional Carrier Handle example” shows an example Conventional Carrier AdvancedTCA Boards with a typical PICMG 3.0 Handle. Cutaway Carriers with Bays at the top or bottom of the Carrier must use


different Carrier Handles that do not interfere with Module insertion/extraction while the Carrier is installed. An example of such a Carrier Handle implementation is shown in Figure 2-54, “Cutaway Carrier Handle example.”

Figure 2-53 Conventional Carrier Handle example

8U ATCAPITCH LINE


Figure 2-54 Cutaway Carrier Handle example

8U ATCA PITCH LINE


Requirements

REQ 2.100 Regardless of which Handle mechanism is used on the Carrier, the mechanism shall not interfere with the AMC Modules’ insertion/extraction.

REQ 2.101bAMC Carrier AdvancedTCA Board Handles shall have a latching device and shall remain in the latched position during and after the earthquake test per ANSI T1.329, IEC 61587-1 waveform A, NEBS-GR-63-CORE Zone 4, ETSI EN 300 019-2-3 and ETSI EN 300 019-2-4.

REQ 2.194 AMC Carrier AdvancedTCA Board Handles shall operate within the 8U allocated subrack pitch lines.


2.4.8 Carrier AdvancedTCA Board EMC GasketFigure 2-55 Cutaway Carrier AdvancedTCA Board EMC Gasket placement


Figure 2-56 Conventional Carrier AdvancedTCA Board EMC Gasket placement


Figure 2-57 Carrier AdvancedTCA Board EMC Gasket nominal compression

Requirements

REQ 2.195 The EMC Gasket on Carriers may be the same as the EMC Gasket on AdvancedTCA Boards.


REQ 2.102bWhen placed in the standard orientation, form factors outside the scope of this document shall provide gasketing at the right side of the AMC Bay as shown in Figure 2-57, “Carrier AdvancedTCA Board EMC Gasket nominal compression.”

REQ 2.103bWhen placed in the standard orientation, form factors outside the scope of this document shall provide a Gasket mating surface at the left side of the AMC Bay as shown in Figure 2-57, “Carrier AdvancedTCA Board EMC Gasket nominal compression.”

REQ 2.104bWhen placed in the standard orientation, all Carriers shall provide the Gasket at the top of uppermost AMC Bay.

REQ 2.105bWhen placed in the standard orientation, all Carriers shall provide the Gasket mating surface at the bottom of the lowermost AMC Bay.

REQ 2.106 Gasket mounting and mating surfaces shall be conductive.


2.5 Module insertion sequencing¶ 81 Table 2-16 shows the sequencing that occurs during Module insertion.

Table 2-16 Module insertion sequencing

Assuming 0.5 m/s.

Distance from Fully Inserted

(mm)

Event Travel (mm)

Cumulative Time(ms)

Event Duration

(ms)Event description

181.5 - 0 - Module PCB leading edge (Datum J) in line with Carrier Face Plate outer surface

168 13.5 27 27 Module PCB leading edge in line with leading edge of Card Guide

157.2 10.8 48.6 21.6 Shoulder of Module PCB meets leading edge of Card Guide

125.9 31.3 111.2 62.6 Shoulder of Module PCB at Centering of ESD Contact

120.2 5.7 122.6 11.4 ESD Contact enters ESD Segment 1

110.2 10 142.6 20 ESD Contact leaves ESD Segment 1 and enters first gap

107.2 3 148.6 6 ESD Contact leaves first gap and enters ESD Segment 2

97.2 10 168.6 20 ESD Contact leaves ESD Segment 2 and enters second gap

94.2 3 174.6 6 ESD Contact leaves second gap and enters the longest possible ESD Segment 3

7.1 87.1 348.8 174.2 Module PCB leading edge in line with front of connector main body

3.9 3.2 355.2 6.4 ESD Contact leaves maximum second gap and enters shortest allowed ESD Segment 3

3.5 0.4 356 0.8 Connector electrical contacts' centers in line with lead edge of Module PCB

2.8 0.7 357.4 1.4 Electrical contacts' centers contact First Mate pads

1.65 1.15 359.7 2.3 Electrical contacts' centers contact Second Mate pads

0.9 0.75 361.2 1.5 Electrical contacts' centers contact Third Mate pads

0.6 0.3 361.8 0.6 Electrical contacts' centers contact Last Mate pads

0 0.6 363 1.2 Module PCB bottoms out in the Connector


Hardware platform management 3

3.1 Overview¶ 1 The management aspects of Modules are intended to be platform agnostic. This specification

focuses on the use of Modules in AdvancedTCA-based Carriers. Platforms that are exclusively Module-based or platforms that mix Modules with other form factors are possible, but not addressed by this specification. Designers of AdvancedMC Modules and Carriers will need the PICMG 3.0 AdvancedTCA Specification.

¶ 2 In defining the role of the Module in system management it is the intent of this section to minimize the management burden on the Module, where resources are at a premium. Modules are controlled by a management controller with minimal functionality called the Module Management Controller or MMC. The commands that the MMC must support are intended to be a bare minimum in order to lower the cost of the MMC and save space on the Module. Out of Band (OOB) management is performed through IPMI messaging over an on-board IPMB referenced throughout this specification as IPMB-L. Each Module has a unique IPMB-L address derived from its Geographic Address.

3.1.1 IPMI and IPMB architecture overview¶ 3 The Carrier and Module communicate through a limited set of IPMI commands. The intent is

to allow the use of inexpensive single chip microcontrollers on the Module. The IPMI command set is summarized in Section 3.15.1, “Required Carrier IPMC and MMC functions.” This specification requires that the Carrier provide ways to isolate the IPMB-L connection to each Module. This is done to prevent a single malfunctioning Module from disrupting the entire IPMB-L. The specification also allows IPMB-L to be implemented radially rather than on a bused basis. For clarity, the term IPMB-0 refers to the AdvancedTCA shelf-level IPMB and the term IPMB-L refers to the local, on-Carrier IPMB that links the Carrier IPMC with the MMCs of installed Modules. IPMB-0 and IPMB-L are physically separate buses. In general, the Carrier IPMC is responsible for forwarding messages between the ShMC and Modules as necessary.


Figure 3-1 Module management infrastructure

3.1.2 Module and Carrier Power architecture overview¶ 4 The Carrier provides Management Power (MP) and Payload Power (PWR) to a Module.

Management Power (MP) is used for the management circuitry in the Module. The management circuitry includes the MMC, and pullup resistors for IPMB-L and ENABLE#. Management Power is current-limited by the Carrier. An MMC reset function is provided on the Carrier via the ENABLE# signal. The Carrier holds the MMC in reset until the Module is fully inserted. The MMC reset can also be controlled by the Carrier in the event that it becomes necessary to reset the MMC. Payload Power (PWR) is the power provided to the Module from the Carrier for the main function of the Module. Module FRU Information contains a record that defines the power requirements for the Payload. A Carrier enables PWR if it (together with the Shelf Manager) determines that enough power and cooling exist to support the Module. For additional information, see Section 4, “Power distribution.”

3.1.3 Module and Carrier requirements¶ 5 This document separates the requirements for the Module and the Carrier. In the context of

this specification, a Carrier is a PICMG 3.0 compliant AdvancedTCA Front Board or similar Carrier. The hardware interfaces between the Module and Carrier are presented in generic form with specific requirements under separate Module and Carrier sections. Throughout this

Key:ShMC Shelf Management ControllerIPMC IPM ControllerCarrier IPMC Carrier IPM Controller MMC Module Management ControllerShelf

ManagerActive

ShelfManagerBackup

Shelf External System Manager

ShMC ShMC

Carrier IPMC

Redundant IPMB-0

ATCA Board

MMC

Carrier Board

IPMB-L

AMC

AMC

AMC

AMC

MMC

MMC

MMC

Isolator

Isolator

Isolator

IPMC

2x Redundant Radial Internet Protocol -Capable Transport

Isolator


section, the management controller on the Carrier is referred to as the Carrier IPMC and the management controller on the Module is referred to as the MMC. Many concepts shown for Carriers also apply to MicroTCA Carriers.

3.1.4 Overall relationship with IPMI and PICMG Specifications¶ 6 The management aspects of this specification are based on and inherit many aspects of both

the IPMI and PICMG 3.0 Specifications. Where necessary, extensions or modifications to those specifications have been made. Where differences between this document and those specifications exist, this document takes precedence.

¶ 7 This document assumes knowledge of the IPMI specification and Section 3, “Hardware Platform Management” of the PICMG 3.0 Specification. The following sections of the PICMG 3.0 Specification provide especially relevant background on IPMI conventions used in this document:

• Section 3.1.5, “Command and record definition conventions”

• Section 3.1.6, “IPMI specification clarifications”

¶ 8 Section 3.15, “IPMI functions and commands” of this specification provides tables covering the IPMI command and function requirements of Carriers and Modules, highlighting areas of difference from the base IPMI specification.

3.1.5 Determining the supported version of PICMG extensions¶ 9 This specification defines PICMG command extensions for MMCs. Carrier IPMCs or other

Shelf entities may need to determine what version of these extensions is supported by a particular MMC. The “Get PICMG Properties” command is used for this purpose. In the response to the “Get PICMG Properties” command issued to a Carrier IPMC, the Max FRU Device ID field indicates the maximum FRU ID supported by Carrier IPMC. It does not imply that all FRUs with FRU IDs between 0 and Max FRU ID are installed in the Carrier, since the AdvancedMC Slots implemented by the Carrier are not necessarily occupied.

¶ 10 Table 3-1 defines the “Get PICMG Properties” command as implemented on MMCs. Response bytes 4 and 5 are required to be zero in this context (because MMCs do not have subsidiary FRUs by definition), but are retained in the response data for compatibility with other use contexts for this command.


Requirements

REQ 3.1 All MMCs shall implement the “Get PICMG Properties” command, as defined in Table 3-1.

3.2 Module management interconnects¶ 11 Figure 3-2 shows the management interconnects between a Module and its Carrier. Note that

active low signals are denoted with a trailing #. All logic levels are assumed to be 3.3 V compatible unless otherwise noted.

Table 3-1 Get PICMG Properties command for MMCs

Byte Data field

Request data 1 PICMG Identifier. Indicates that this is a PICMG-defined group extension command. A value of 00h must be used.

Response data 1 Completion Code

2 PICMG Identifier. Indicates that this is a PICMG-defined group extension command. A value of 00h must be used.

3

PICMG Extension Version. Indicates the version of PICMG extensions implemented by the MMC.[7:4] = BCD encoded minor version[3:0] = BCD encoded major versionThis specification defines version 4.1 of the PICMG extensions for MMCs. MMCs implementing the extensions defined by this specification must report a value of 14h. The value of 00h is reserved.

4 Max FRU Device ID. MMCs must report 0.

5 FRU Device ID for MMC. MMCs must report 0.


Figure 3-2 Management interconnects between Carrier and Module

3.2.1 Geographic Address [2..0] (GA[2..0])¶ 12 Three Geographic Address (GA) pins are used to assign the address of a Module on IPMB-L.

Each of the GA pins can encode three different levels: they can be connected to Logic Ground, to the respective Slot’s Management Power, or left unconnected on the Carrier to define the Geographic Address of the Module. Correspondingly, in the GA[2..0] code of the Geographic Address, the state of each GA signal is represented by G (grounded), U (unconnected), or P (pulled up to Management Power). This scheme requires that the Module be able to distinguish among the three states. The state of the GA lines on the Module can be determined if each of the GA lines are connected to an MMC output (P1 in Figure 3-3, “Module management hardware” ) through a resistor. The MMC drives P1 low and reads the GA lines. The MMC then drives P1 high and reads the GA lines. Any line that changes state between the two reads indicate an unconnected (U) pin.

¶ 13 Table 3-2, “Geographic Address, IPMB-L address, and AdvancedMC Slot ID” shows valid combinations of GA lines and the associated IPMB-L address. The IPMB-L addresses in the range 70h-89h are reserved for Modules. The IPMB-L address of a Module can be calculated as (70h + Site Number x 2). For example, a Module with GA address GGU (Site Number 1) is accessed at IPMB-L address 72h. Table 3-2 also defines AdvancedMC Slot IDs beyond the current A and B layers defined in this specification. AMC Slot IDs marked as NA might be used in future versions of this specification. All unlisted AMC Slot IDs are reserved.

Module CarrierSCL_L

GA0

MP

ENABLE#

PS1#PS0#

GA1

GA2

SDA_L


Table 3-2 Geographic Address, IPMB-L address, and AdvancedMC Slot ID

¶ 14 Table 3-3 shows the required FRU Information format that describes the specific AdvancedMC Slots implemented on a Carrier, based on the address mapping data described in Table 3-2. For each AdvancedMC Slot on the Carrier, the Carrier Information Table

GA[2..0] IPMB-L address

MicroTCA Carrier’s AMC

Slot ID

AMC Carrier AdvancedTCA Board’s AMC

Slot ID

Module Physical address

Site Number Site type

GGG 70h Reserved Reserved NA NA

GGU 72h 1 A1 1 AMC (07h)

GUG 74h 2 A2 2 AMC (07h)

GUU 76h 3 A3 3 AMC (07h)

UGG 78h 4 A4 4 AMC (07h)

UGU 7Ah 5 B1 5 AMC (07h)

UUG 7Ch 6 B2 6 AMC (07h)

UUP 7Eh 7 B3 7 AMC (07h)

UPU 80h 8 B4 8 AMC (07h)

UPP 82h 9 NA 9 AMC (07h)

PUU 84h 10 NA 10 AMC (07h)

PUP 86h 11 NA 11 AMC (07h)

PPU 88h 12 NA 12 AMC (07h)

GGP 8Ah NA NA 13 AMC (07h)

GUP 8Ch NA NA 14 AMC (07h)

GPG 8Eh NA NA 15 AMC (07h)

GPU 90h NA NA 16 AMC (07h)

GPP 92h NA NA 17 AMC (07h)

UGP 94h NA NA 18 AMC (07h)

UPG 96h NA NA 19 AMC (07h)

PGG 98h NA NA 20 AMC (07h)

PGU 9Ah NA NA 21 AMC (07h)

PGP 9Ch NA NA 22 AMC (07h)

PUG 9Eh NA NA 23 AMC (07h)

PPG A0h NA NA 24 AMC (07h)

UUU A2h NA NA 25 AMC (07h)

PPP A4h NA NA 26 AMC (07h)


includes a Site Number for that AdvancedMC Slot. The Carrier Information Table also includes a byte that contains the AMC.0 specification revision supported by the Carrier IPMC.

Requirements

REQ 3.2b The Carrier FRU Information shall include a Carrier Information Table as defined in Table 3-3, “Carrier Information Table.” The array of Carrier Site Numbers shall contain the Site Numbers for each AdvancedMC Slot implemented on the Carrier.

REQ 3.3b AdvancedMC Slots that are not physically implemented in the Carrier shall not appear in the Carrier Information Table.

Table 3-3 Carrier Information Table

Offset Length Definition

0 1 Record Type ID. For all records defined in this specification, a value of C0h (OEM) must be used.

1 1

End of List/Version[7] – End of List. Set to one for the last record.[6:4] – Reserved, write as 0h[3:0] – Record format version (= 2h for this definition)

2 1 Record Length

3 1 Record Checksum. Holds the zero checksum of the record.

4 1 Header Checksum. Holds the zero checksum of the header.

5 3Manufacturer ID. Least significant byte first. Write as the three byte ID assigned to PICMG. For this specification, the value 12634 (00315Ah) must be used.

8 1 PICMG Record ID. For the Carrier Information Table, the value 1Ah must be used.

9 1 Record Format Version. For this specification, the value 0h must be used.

10 1

AMC.0 Extension Version. Indicates the version of AMC.0 specification extensions implemented by the IPMC.[7:4] = BCD encoded minor version[3:0] = BCD encoded major versionIPMCs must report a value of 02h for AMC.0 R2.0

11 1 Carrier Site Number Count. Indicates the number of entries in the Carrier Site Numbers array.

12 NCarrier Site Numbers. An array of Carrier Site Numbers. Each entry must be one byte in length. The array contains a list of the Site Numbers of all AMC Slots supported by the Carrier.


¶ 15 Table 3-4 shows an example set of Physical Addresses (including Site Numbers and Site Types), with corresponding IPMB-L addresses, for a hybrid Carrier with A1, A4, and B1–B4 AdvancedMC Slots.

¶ 16 For convenience in identifying AdvancedMC Slots implemented on a Carrier, Carrier IPMCs implement extensions to the “Get Address Info” command. Table 3-5 describes these extensions, but does not attempt to repeat the basic functionality of this command that is required in any AdvancedTCA IPM Controller. One way to use the extension described here is discussed in Section 3.13, “Explicit message bridging.”

¶ 17 The extended version of the “Get Address Info” command can be addressed to a Carrier IPMC to retrieve either:

• the FRU Device ID, using the Site Number of an AdvancedMC Slot on the Carrier, or

• the Site Number, using the FRU Device ID of an AdvancedMC Slot on the Carrier. The resulting Site Number can be converted to an IPMB-L address for the AdvancedMC Slot according to Table 3-2, “Geographic Address, IPMB-L address, and AdvancedMC Slot ID.”

Table 3-4 Example Carrier IPMB-L address and Physical Address mapping

Physical Address

IPMB-L address Site Number Site Type

72h 1 AMC (07h)

78h 4 AMC (07h)

7Ah 5 AMC (07h)

7Ch 6 AMC (07h)

7Eh 7 AMC (07h)

80h 8 AMC (07h)

Table 3-5 Get Address Info command extensions for Carrier IPMCs

Byte Data field

Request data 1 PICMG Identifier. Indicates that this is a PICMG®-defined group extension command. A value of 00h must be used.

2 FRU Device ID. Indicates an individual FRU, which must identify an AMC for this extension to apply. This field is optional for generic IPM Controllers, but required in the Carrier IPMC extensions described in this table. This field is ignored when Address Key Type is set to Physical Address. This field is required if Address Key Type is present.

(3) Address Key Type. This field defines the type of address that is being provided in the Address Key field; only Physical Address is defined in this extension. This field is optional. If this field is not present, the command must return addressing information for the FRU specified by the FRU Device ID.03h = Physical AddressAll other values reserved.


3.2.2 PS0# and PS1#¶ 18 PS0# and PS1# pins are used to detect the presence of a Module in a Carrier. The PS0# and

PS1# pins are last mate connections located on opposite ends of the connector. These pins are used to compensate for any skew on the Module during insertion and provide confirmation that all pins of the AdvancedMC Connector have mated (with a complementary role on extraction). The Carrier connects PS0# to Logic Ground and pulls up PS1# to the Carrier's 3.3V Management Power. The Module connects PS1# to PS0# through a diode, providing a low voltage drop path from PS1# to PS0#. The Carrier can detect the presence of a Module by an active PS1# signal.The Module can determine insertion into a Carrier by the Carrier’s feedback of PS1# on ENABLE# as well as current flowing through the PS0# - PS1# connection.

¶ 19 When designing additional circuitry connecting to PS1# on the Module, it has to be considered that Management Power (MP) to the Module can be on or off before the Module is detected. Therefore standard logic parts equipped with ESD protection diodes on the signal inputs cannot be directly connected to PS1# as they could falsely assert PS1# low while PS0# is not mated and Management Power is off.

3.2.3 ENABLE#¶ 20 The ENABLE# pin is an active low input to the Module pulled up on the Module to

Management Power (MP). This signal is inverted on the Module to create a RESET# signal toward the MMC. The negated state of this RESET# indicates to the MMC that the Module is fully inserted and valid states exist on all inputs to the Module. The MMC is not allowed to read the GA inputs or use the IPMB-L while ENABLE# is inactive. (See Figure 3-3.)

(4) Address Key. This field is required if Address Key Type is present, and holds the Site Number of an AMC on the Carrier in this extension.

(5) Site Type. This field is required if Address Key Type is a Physical Address, and must be 07h = AMC in this extension.

Response data 1 Completion Code.

2 PICMG Identifier. Indicates that this is a PICMG®-defined group extension command. A value of 00h must be used.

3 Hardware Address of the Carrier.

4 IPMB-0 Address of the Carrier.

5 Reserved. Must have a value FFh.

6 FRU Device ID. The FRU Device ID associated with the AMC that the Site ID designates.

7 Site ID. The Site Number associated with the AMC that the FRU Device ID designates.

8 Site Type. Always 07h = AMC in this extension.

Table 3-5 Get Address Info command extensions for Carrier IPMCs

Byte Data field


3.2.4 IPMB-L¶ 21 IPMB-L is made up of clock (SCL_L) and data (SDA_L) signals. These signals are to be

considered valid by the Module only when ENABLE# is active. Each Module receives an individually controlled connection to IPMB-L. This individually controlled connection to IPMB-L can be provided using FET type switches or I2C buffers, shown as IPMB-L isolators in Figure 3-4, “Carrier management hardware.” Note that although each Module receives an individually controlled connection to IPMB-L, there may only be one logical IPMB-L on the Carrier. The designer of the Carrier is free to provide totally independent IPMBs to each AdvancedMC. Designers should take appropriate action to ensure that the MMC provides a high impedance state to the IPMB-L when Management Power is ramping up to its specified range. The ESD protection diodes in most I2C drivers provide a potential path for leakage. The designer has flexibility in how the Carrier’s IPMB-L pullups are implemented. The specification mandates a maximum rise time and on-board capacitance. The designer can chose how to meet the rise time. If each AdvancedMC Slot has individual buffers, a separate resistor is required for each AdvancedMC Slot. If FET isolators are used, then it is possible to use a single pullup. In this case, care must be taken to ensure the pullup is still provided in the event that the Carrier disables an IPMB-L to a malfunctioning Module.

¶ 22 The following requirements apply to IPMB-L implementations on both Modules and Carriers. Later sections provide additional requirements that are specific to one or the other domain.

Requirements

REQ 3.4 The Module and Carrier shall use IPMB-L clock and data signals (SCL_L and SDA_L) for signaling as defined in the IPMB specification.

REQ 3.5 The Module and Carrier IPMB-L interface shall support 3.3 V signaling levels.

REQ 3.6 The MMC and Carrier IPMC should comply with the recommendations in Sections 2.7 and 4.0 of the IPMB specification.

REQ 3.7 Neither a Module nor a Carrier shall hold the data line low longer than the maximum “Overall Message Duration” limit, T1, in the IPMB specification.

REQ 3.8 All IPMB-L devices on the Module and the Carrier shall clock the IPMB-L bus at a maximum of 100 kHz.

3.2.5 Payload Power (PWR)¶ 23 Refer to Section 4.2.1, “Payload Power” for information on Payload Power.

3.2.6 Management Power (MP)¶ 24 Refer to Section 4.2.2, “Management Power” for information on Management Power.


3.3 Additional local Module functionality

3.3.1 BLUE LED¶ 25 The BLUE LED is local to the Module. The BLUE LED is mounted on the front of the

Module and is used to provide basic feedback to the user on the Hot Swap state of the Module. The BLUE LED states are off, short blink, long blink, and on. Once Management Power is available to the Module, the BLUE LED is turned on as soon as possible. Since the Carrier is responsible for the Module’s Hot Swap state, it controls the states of the corresponding Module’s BLUE LED during various operational states of the Module. See the “FRU states” table and the “Managed FRU state transition diagram” in the PICMG 3.0 Specification for the typical use of the BLUE LED during the various operational states. The BLUE LED is off when a Module is operational and unsafe for extraction. When the BLUE LED is on, the Module can safely be extracted. Finally, when applying AdvancedTCA Hot Swap state machine definitions to Module operation, note that the Hot Swap Switch plays the role of the AdvancedTCA Handle Switch.

Requirements

REQ 3.9 Modules shall implement the BLUE LED (see Section 2.2.4.1, “Module LEDs” for mechanical considerations).

REQ 3.10b The BLUE LED and its control shall be operational whenever Management Power (MP) is available on the Module.

REQ 3.11 Upon insertion of the Module or power up of the Carrier, the BLUE LED shall be turned on as soon as possible.

REQ 3.12b Modules shall support the Blue LED in the context of the following FRU LED control commands from the PICMG 3.0 Specification: “Get FRU LED Properties,” “Get LED Color Capabilities,” “Get FRU LED State,” and “Set FRU LED State.”

REQ 3.13b The long blink rate, the short blink rate, and the sequence of LED illumination and non-illumination states in each blink cycle shall comply with the requirements stated in Section 3.2.5.1, “BLUE LED” of PICMG 3.0.

REQ 3.14 If instructed to perform long or short blinks of the BLUE LED, the Module shall perform at least one full blink cycle before changing the BLUE LED to a different state.

REQ 3.15b Modules shall support the Lamp Test function for the BLUE LED as defined in Section 3.2.5.6 “FRU LED Control Commands” of the PICMG 3.0 Specification.

REQ 3.16b The Carrier IPMC shall perform mapping of commands, sent by the Shelf Manager or other IPM Controllers to the FRUs representing Modules and addressing the BLUE LED, to the same commands directed to Module MMCs, using FRU ID 0. The Carrier shall track responses to these commands from the MMCs and forward them to the original initiators. This requirement does not apply to the command “Set FRU LED State” with LED function other than FBh (Lamp Test).

REQ 3.17 The Carrier IPMC shall reject any “Set FRU LED State” command sent by the Shelf Manager and other IPM Controllers to the FRUs representing Modules and affecting the BLUE LED, with LED Function different from FBh. The completion code returned to the initiator in that case shall be “Invalid data field in Request (CCh)”.


3.3.2 LED 1 (mandatory) and other LEDs (optional)¶ 26 LED 1 typically provides basic feedback about failures and out of service status (see

Section 2.2.4.1, “Module LEDs” for mechanical considerations).

¶ 27 Modules optionally implement additional LEDs that are controlled by the MMC. Such LEDs are referenced with LED numbers 2 through 255. Application function of any such additional LEDs is not addressed by this specification, but they are accessed and controlled via the LED commands as detailed below.

Requirements

REQ 3.18b LED 1 and its control shall be operational whenever Management Power (MP) is available on the Module since failure and out of service cases can occur during times when Payload Power has not been applied.

REQ 3.19b Modules shall support the FRU LED control commands from the PICMG 3.0 Specification: “Get FRU LED Properties,” “Get LED Color Capabilities,” “Get FRU LED State,” and “Set FRU LED State” for control of the LED 1. Modules should support these FRU LED control commands for implemented optional LEDs numbered in the range 2 through 255.

REQ 3.20 The Carrier IPMC shall perform mapping of all LED-related commands, sent by the Shelf Manager or other IPM Controllers to the FRUs representing Modules and addressing LEDs 1 through 255, to the same commands addressed to Module MMCs, FRU 0. The Carrier shall track responses to these commands from the MMCs and forward them to the original initiators.

3.3.3 Module Handle signal ¶ 28 The Module Handle signal is used to indicate the insertion of the Module or to indicate a

request for extraction of the Module to the MMC. The Module Handle signal is pulled up to Management Power so that it can be read independent of Payload Power. The MMC sends an event message to the Carrier IPMC when the Module Handle signal changes state. See Section 3.6, “Module operational state management” for further information on Hot Swap operations.

Requirements

REQ 3.21 The Module shall debounce the state of the Module Handle signal in either hardware or firmware so that the MMC does not generate multiple events from a single change of state.

REQ 3.22 The Module Handle signal state shall be readable for the MMC independent of the Payload Power (PWR) status.

3.3.4 MMC watchdog timer¶ 29 A watchdog timer is provided to reset the MMC in the event that the MMC is unresponsive.

The watchdog could be integrated into the MMC. This specification does not mandate what the watchdog checks; just that a watchdog be provided to reset an unresponsive MMC. Note that the state of the Payload must not be impacted if an MMC watchdog timer reset occurs.


Requirements

REQ 3.36 The Module shall provide a watchdog timer strobed by the MMC.

REQ 3.37 The watchdog timer shall reset the MMC if it is not strobed.

3.4 Module hardware requirements for management¶ 30 This section defines the Module management hardware requirements. Figure 3-3 presents a

simplified block diagram showing the relevant circuitry on a Module. Any aspect of this diagram that is not covered by formal requirements is provided solely on an example basis.

Figure 3-3 Module management hardware

CarrierMMC

3.3K 3.3K 3.3K

33K 33K

10K

GA0

GA1

GA2

SCL_L

SDA_L

MP

GND

MP

MP

MP MP

10K

MP

PS1#

PS0#

RESET#

P1

GA0

GA1

GA2

SCL_L

SDA_L

ENABLE #

Module Handle

Blue LED

330 Ohm

MP

P2

Module Handle signal

Note: P1, P2 and P 3 are GPIO pins

Module

MP

LED1

330 Ohm

P3


¶ 31 Table 3-6 lists the management-related signals that a Module implements for Carrier connectivity.

Requirements

REQ 3.24b The Module shall be able to detect the three states used for encoding the GA inputs. The three states are: unconnected, pulled to MP, or tied to Logic Ground.

REQ 3.25 The Module shall use the IPMB-L address derived from the GA[2..0] pins with the formula: IPMB-L address = 70h + (Site Number x 2). See Table 3-2, “Geographic Address, IPMB-L address, and AdvancedMC Slot ID.”

REQ 3.28b The Module shall provide a connection through a low voltage drop diode (or similar mechanism) from PS1# to PS0# to allow the Carrier to detect whether or not a Module is fully inserted into a Slot.

REQ 3.153 The Module shall guarantee for its PS1# connection a maximum low level output voltage (VOL) of 0.6 V under a loading of 2 mA when the PS0# contacts of the Module and Slot are mated.

REQ 3.154 The Module shall guarantee a maximum leakage current (IOZ) of 20 µA for its PS1# connection in a loading range of 0 V to 3.63 V when its PS0# contact is unmated.

REQ 3.29 The Module shall pull up the ENABLE# signal to Management Power (MP) with a 10K ± 10% resistor.

REQ 3.30 When ENABLE# is inactive, the Module shall hold the MMC in reset.

REQ 3.31 The Module shall consider the GA lines valid only when ENABLE# is active.

REQ 3.32 When ENABLE# is inactive, the Module shall not use the IPMB-L.

REQ 3.33b The Module shall present a load of 22 pF or less on each of the SLC_L and SDA_L signals. This includes contributions from traces, vias, the MMC, the pullup resistors, and the Card-edge Interface contacts.

REQ 3.34 The Module shall pull up the SCL_L and SDA_L signals to Management Power (MP) with a 33K ±10% resistor.

REQ 3.35 The MMC and the pull-up resistor shall be the only components connected to the IPMB-L interface on the Module.

Table 3-6 Module-specific, management-related signals

Signal name

Input/ output/ ground Description

IPMB-L Input/ output IPMB, for IPMI messaging between Carrier and Modules

GA [2:0] Input Geographic Address pins are used to assign IPMB address to Modules

ENABLE# Input When active, indicates to the Module that it is fully inserted in the Carrier, that all the inputs are connected correctly.

MP Input Carries Management Power

PS1# Output Used by the Carrier to detect the presence of a Module

PS0# Input Connected on the Module to PS1# through a low voltage drop diode.


3.5 Carrier hardware requirements for management¶ 32 This section defines the management hardware requirements for the Carrier. Figure 3-4

shows a simplified version of the relevant Carrier circuitry.

Figure 3-4 Carrier management hardware

¶ 33 Table 3-7 lists the management-related signals that a Carrier implements for Module connectivity.

Module

Carrier IPMC

3.3K3.3K

IPMB-L interface

3.3V3.3V

2.2K

3.3V

PS1#

PS0#

Reset_MMC#

GA0

GA1

GA2

SCL_L

SDA_L

ENABLE #

MP Control & Monitoring

Circuits

PUG

(Pull up to MP )UGPUG

3.3V

Carrier’s 3.3V Management Power (3.3V)

IPMB-L Isolator

MPMP Control

MP Monitoring

IPMB-L Enable

GND

P

(GND)(Unconnected )

Carrier

Table 3-7 Carrier-specific management-related signals

Signal name


IPMB-L Input/ output IPMB, for IPMI messaging between Carrier and Modules.

GA [2:0] Output Geographic Address of the AMC Slot, defined by tying these signals to MP or Logic Ground or leaving them unconnected.

ENABLE# Output The Carrier asserts ENABLE# when PS1# is asserted. The Carrier can negate ENABLE# to reset the MMC.


Requirements

REQ 3.39b The Carrier shall assign a unique address for each Module’s MMC using the GA[2..0] signals as defined in Table 3-2, “Geographic Address, IPMB-L address, and AdvancedMC Slot ID.” These addresses shall comply with the requirements on AdvancedMC Slot IDs in Section 2.4.2, “Bay and Slot locations.”

REQ 3.40b For encoding of the GA[2..0] signals, the Carrier shall connect to Logic Ground the pins that are to represent a G, float pins that are to represent U, and connect to the respective Slot’s Management Power (MP) pins that are to represent P.

REQ 3.41 The IPMB address of the Carrier IPMC on IPMB-L shall be 20h.

REQ 3.42b The Carrier shall pull up PS1# to the Carrier's 3.3V Management Power with a 2.2 K ±10% resistor.

REQ 3.43 The Carrier shall connect PS0# to Logic Ground.

REQ 3.155 The Carrier shall provide an open drain driver for the ENABLE# signal.

REQ 3.44b The Carrier shall assert ENABLE# when PS1# is asserted and Reset_MMC# is negated, and de-assert it in all other cases.

REQ 3.45b The Carrier shall provide the capability to individually connect or isolate IPMB-L to each Module using either FET type isolators or buffers.

REQ 3.46b The Carrier shall ensure that the IPMB-L signals to the AdvancedMC Slot are isolated when the Slot is empty.

REQ 3.47b The maximum capacitance on an IPMB-L signal (SCL_L and SDA_L) shall be 224 pF, including contributions from traces, vias, ICs, pull-up resistors, the isolators, connection pads for the AdvancedMC Connector pins, the AdvancedMC Connectors, and the connected 22pf for each implemented Slot. If FET type isolators are used, then the sum of all contributors on all segments shall not exceed 224pF. If buffer repeaters are used for the isolation function, then the signal segments’ capacitance shall not exceed 224pF individually.

REQ 3.48b The Carrier may implement Carrier-based IPMI devices on IPMB-L in addition to AdvancedMC Slots. Non-intelligent sensors or other I2C devices shall not be connected to the IPMB-L on the Carrier.

REQ 3.156 The Carrier shall be able to detect the fault case if an IPMB-L interface signal is stuck low longer than the maximum “I2C Clock Low hold” limit, T8, specified in Chapter 4 of the IPMB specification. The detected faulted or unpowered Module which pulls down the IPMB-L signals for an extended period of time needs to be isolated from IPMB-L.

REQ 3.157 The Carrier shall be able to individually enable/disable the IPMB-L buffers/isolators.

MP Output Carries Management Power

PS1# Input Pulled up to the Carrier's 3.3V Management Power

PS0# Output Connected to Logic Ground

Table 3-7 Carrier-specific management-related signals

Signal name



REQ 3.50b The Carrier shall provide pullup resistors to 3.3 V on the SCL_L and SDA_L signals with appropriate values to compensate for the capacitance of the signal traces and their connected loads on the Carrier. Each isolatable segment shall have a pullup corresponding the capacitance of the segment. The segments which are connected to an AdvancedMC Connector shall pull up to the MP connected to that Connector. The segments which are directly connected to the Carrier IPMC shall have pullup resistors to the local 3.3V Management Power which is active whenever the Carrier IPMC is active. The capacitive loading of a segment includes contributions from traces, vias, ICs (isolators), a connection pad and an AdvancedMC Connector pin as appropriate. The value of the pullup shall be selected such that the SCL_L or SDA_L signal can transition from 0.99 V to 2.31 V with a Module capacitance of 22 pF and the appropriate Carrier capacitance in 1 μs and such that the total sink current does not exceed 5 mA. The value of this resistor should be 3.3 K. In placing the resistor, the designer needs to take into consideration the impact that switching off a FET isolator might have on the pullup resistance. It is likely that the 3.3 K will be divided among all AdvancedMC Slots on a Carrier.

3.6 Module operational state management¶ 34 This subsection discusses the requirements for a Module’s activation and deactivation in a

Carrier, specifically the state definitions, messaging and state transition sequences.

¶ 35 The operator interface elements associated with operational state management of Modules include 1) the Module Handle, which is used to insert and extract the Module into and out of a Carrier, 2) the Module Handle state, which is open or closed, and 3) the BLUE LED that gives a visual indication to the operator of the operational state of the Module.

¶ 36 When a Module is inserted into a Carrier it goes through a series of states to become active. It also goes through a series of states as it deactivates in preparation for extraction. These states are explained in Table 3-15, “FRU states” in the PICMG 3.0 Specification and Figure 3-5, “FRU state transition diagram for AMC.”

¶ 37 These FRU states for the Module are tracked and reported by the Carrier IPMC for all its Modules. AMCs do not track their own FRU states and FRU state transitions.


Figure 3-5 FRU state transition diagram for AMC

3.6.1 Typical Module insertion¶ 38 This subsection describes only normal insertion flow. A Module begins in M0 state. This is

equivalent to having the Module in hand rather than installed in the Carrier. The Carrier returns M0 states for any of its AdvancedMC Slot IDs that are implemented but not occupied.

¶ 39 Before a Module is inserted into an empty Slot of a Carrier, the ENABLE# signal is in the negated state and the PS1# signal is inactive. The MP is preferably not enabled; PWR must not be enabled. The Carrier also ensures that the IPMB-L signals to the empty Slot are isolated.When a Module is inserted into a Carrier, the following sequence of steps occurs. For a pictorial representation, see Figure 3-6, “Hot Swap management: typical Module insertion.”

M1FRU

Inactive(Blue LED On)

M2FRU

Activation Request

(Blue LED Long Blink)

M3FRU

ActivationIn Progress

(Blue LED Off)

M6FRU

DeactivationIn Progress

(Blue LED Short Blink)

M5FRU

DeactivationRequest

(Blue LED Short Blink)

M4FRUActive

(Blue LED Off)

M0FRU

Not Installed(Blue LED Off)

Set FRU Act ivation (Deactivate FRU) Or Module Handle Open ed

(Locked bit Set)

AM

C H

andl

e C

lose

d an

dLo

cked

Bit

Cle

ared

Activation Complete(i.e. AMC Payload Power Enabled, E-Keyed Interfaces May Be Enabled)

Set F

RU

Act

ivat

ion

(Dea

ctiv

atio

n FR

U)

(Loc

ked

bit

Set)

Mod

ule

Han

dle

Clos

ed

Set F

RU

Act

ivat

ion

(Act

ivat

e FR

U)

(Dea

ctiv

atio

n-Lo

cked

bi t

Set)

AMC Inserted (PS1# Active)

AMC Extracted (PS1# Inactive)Set F

RU A

ctiv

atio

n(D

eact

ivat

e FR

U)

(Lo

cked

bit

Set

)

AMC

Han

dle

Ope

ned

Set F

RU

Act

ivat

ion(

Act

ivat

e FR

U)

(Dea

ctiva

tion-

Lock

ed b

it Se

t)

AMC

Han

dle

Ope

ned

orD

eact

ivat

ion-

Lock

ed B

it C

lear

ed S

et F

RU

Act

ivat

ion

(Dea

ctiv

ate

FRU)

(L

ocke

d bi

t Set

)

Deactivation Complete(i.e. AMC Payload Power Disabled, E-Keyed Interface Disabled)


1. The first, second, and third length pins connect. When the last mate pins PS0# and PS1# connect, PS1# goes active, indicating to the Carrier IPMC that the Module is fully seated. (See Figure 3-4, “Carrier management hardware.”)

2. When Carrier IPMC detects assertion of PS1#, the Carrier enables Management Power (MP) for the Module, powering the MMC and associated management circuitry

3. When the Module’s Management Power is enabled, the BLUE LED turns on as soon as possible.

4. When the Management Power control for the Module signals Power Good, Carrier hard-ware asserts ENABLE# (refer to Figure 3-4, “Carrier management hardware” ), indicat-ing to the Module that the Carrier acknowledges that the Module is fully seated and releasing the MMC from reset. The Carrier enables IPMB-L signaling toward the Slot.

5. Also at this time, the Carrier IPMC sends an M0 to M1 transition event message to the Shelf Manager on behalf of the Module, indicating that the Carrier has detected a new Module.

6. At this point, the Module is ready to attempt activation. The operator can initiate activa-tion by pushing and securing the Module Handle, which changes the Module Handle state. When the Module Handle in the Module is closed, the MMC sends a Module Hot Swap (Module Handle Closed) event message to the Carrier IPMC, as described in Table 3-8, “Module Hot Swap event message.”

7. The Carrier IPMC sends a “Set FRU LED State” command to the MMC with a request to perform long blinks of the BLUE LED, indicating to the operator that the new Module is waiting to be activated.

8. The Carrier IPMC reads the Module’s Module Current Requirements record and AdvancedMC Point-to-Point Connectivity record. The Carrier IPMC checks that the power requested by a Module can be delivered by the Carrier. This involves checking that the Maximum Module Current is greater than Current Draw and that Maximum Internal Current is greater than Current Draw of all Modules that have been allocated power plus the Current Draw for the Module being negotiated. See Table 3-10, “Module Current Requirements record” and Table 3-16, “AdvancedMC Point-to-Point Connec-tivity record.”

9. If the Module FRU Information is valid and if the Carrier can provide the necessary Pay-load Power then:

• The Carrier IPMC transitions the FRU representing the Module from M1 to M2 and sends an M1 to M2 transition event message to the Shelf Manager on behalf of the Module

• The Carrier IPMC clears the Locked bit for the FRU representing the Module. The Locked-bit and Deactivation-Locked bit logic for the Module is maintained by the Carrier IPMC, as described in the PICMG 3.0 Specification.

If the Module FRU Information is invalid or if the Carrier cannot provide the necessary Payload Power then:

• The Carrier IPMC sends a “Set FRU LED State” command to the MMC requesting the “on” state for the BLUE LED. The FRU remains in M1.

10. While the Module is in M2, the Carrier awaits permission from higher level manage-ment (Shelf Manager or System Manager) to proceed with the activation.


11. On receipt of the “Set FRU Activation (Activate FRU)” command by the Carrier IPMC, designating a particular Module, the Carrier IPMC sends an M2 to M3 transition event message to the Shelf Manager on behalf of the Module and sends a “set FRU LED State” command to the MMC with a request to turn off the BLUE LED.

12. Now the Carrier IPMC waits for the Shelf Manager to begin power negotiation. The Shelf Manager sends a “Get Power Level” command to the Carrier IPMC. The Carrier IPMC responds with the power level necessary to power the Module. The Carrier is responsible for compensating for any efficiency loss expected internal to the Carrier and provides this data in the “Get Power Level” command response. The negotiation com-pletes with a “Set Power Level” command from the Shelf Manager to the Carrier IPMC for the Module.

13. The Carrier IPMC enables Payload Power (PWR) for the Module.

14. At this point, the Carrier uses the E-Keying information it has read and issues “Set AMC Port State (Enable)” commands to the relevant Modules and on-Carrier devices enabling all compatible Ports.

15. Finally, the Carrier sends an M3 to M4 transition event message to the Shelf Manager on behalf of the Module indicating that the Module has been activated.


Figure 3-6 Hot Swap management: typical Module insertion

3.6.2 Typical Module extraction¶ 40 This subsection describes only normal extraction flow. A Module in normal operational state

will have its BLUE LED off in M4 state with the Payload Power enabled.

¶ 41 The following steps occur during normal extraction of a Module from a Carrier:

1. The operator can initiate deactivation by pulling the Module Handle, which changes the state of the Module Handle to open. When the Module Handle in the Module is opened, the MMC in the Module sends a Module Hot Swap (Handle Opened) event message to the Carrier IPMC (as described in Section 3-8, “Module Hot Swap event message.” )

System Manager

Shelf Manager Carrier Module

M1 to M2

Blue LED long blink

Retrieve E-Keying and Power Reqs from Carrier and Module

Set Deactivation - Locked bit

Module Latch Handle closed and Carrier can deliver power to the Module

M0 to M1

M2 to M3

Direct hardware connection

IPMI Command

Hot Swap Event

PS1# Active

Blue LED - OffGet Power LevelSet Power Level Power Negotiation

M3 to M4

Given power availability, enable Payload Power and enable E-Keying

OR

Set FRU Activation (Activate)

Set FRU Activation (Activate)

Management Power Active Blue LED - on

ENABLE# active


2. When the Carrier IPMC receives the Module Hot Swap (Module Handle Opened) event message, the Carrier clears the Deactivation-Locked bit. This initiates an M4 to M5 tran-sition event message as described in the PICMG 3.0 Specification.

3. The IPMC in the Carrier sends a “Set FRU LED State” command to the MMC in the Module with a request to perform short blinks of the BLUE LED. This indicates to the operator that the Module is waiting to be deactivated.

4. While the Module is in M5, the Carrier awaits permission from higher level manage-ment (Shelf Manager or System Manager) to proceed with the Module's deactivation.

5. The Carrier IPMC sets the Locked bit for the FRU representing the Module. When there is permission for the Module to continue the deactivation, the Carrier IPMC sends an M5 to M6 transition event message to the Shelf Manager on behalf of the Module.

6. The Carrier IPMC now issues “Set AMC Port State (Disable)” command(s) for all Ports on the Module and for all Ports that connect to the Module. This will disable all Ports associated with the Module about to be removed.

7. When the Carrier IPMC has transitioned the Module to M6 state, the Carrier IPMC sends a “FRU Control (Quiesce)” command to the Module and awaits a Module Hot Swap (Quiesced) event message from the MMC.

8. Next, the Carrier IPMC disables the Module’s Payload Power.

9. When the Module Payload Power is disabled, the Carrier IPMC sends an M6 to M1 state transition event message on behalf of the Module.

10. At this point, the Carrier IPMC sends a “Set FRU LED State” command to the MMC with a request to turn on the BLUE LED. This indicates to the operator that the Module is ready to be safely extracted.

11. At this point the operator removes the Module. The Carrier detects the extraction by sensing that PS1# is deactivated. Next, the Carrier IPMC sends an M1 to M0 transition event message to the Shelf Manager on behalf of the Module. The Carrier negates ENABLE# to the Slot, isolates the IPMB-L interface to the Slot, and preferably disables Management Power (MP) to the Slot. The Carrier keeps Payload Power (PWR) disabled to the empty Slot.


Figure 3-7 Hot Swap management: typical Module extraction

3.6.3 Alternate Module extraction options¶ 42 There are several alternative Module extraction or deactivation paths in addition to the

typical extraction explained above. The possible alternatives are explained in Section 3.2.4.1.3, “Alternate FRU extraction options” in the PICMG 3.0 Specification.

3.6.4 Module reinsertion¶ 43 When the Module is deactivated and in the M1 state, the possible options of activating it

again are explained in Section 3.2.4.1.4, “FRU reinsertion” in the PICMG 3.0 Specification.

¶ 44 The Locked bit for the Module is set when the Module transitions from M5 to M6, so that the Module does not automatically transition from M1 to M2. Also the Module Handle will typically be open at this point. Closing the Module Handle will cause the Locked bit to be cleared (when the Carrier IPMC receives the Module Hot Swap (Module Handle Closed) event). If there is a need to reactivate the same Module without physical operator action, the

OR

System Manager Shelf Manager Carrier Module

Set FRU Activation (Deactivate)

M6 to M1

FRU Control (Quiesce)

Remove Payload Power

M4 to M5

Clear Deactivation - Locked bit

Blue LED short blink

M5 to M6

Blue LED on

Module Latch Handle opened

Set Locked bit

Module quiesced

M1 to M0PS1# goes inactive

Remove managementpower

Set FRU Activation (Deactivate)

IPMI CommandHot Swap Event

Direct hardware connection

Set AMC Port State (Disable)


Locked bit can be cleared using the “Set FRU Activation Policy (Clear Locked)” command. If the Carrier has received the Module Hot Swap (Module Handle Closed) event, the Insertion Criteria Met condition will exist and the Module will move from M1 to M2.

3.6.5 Behavior during Shelf power-up or Module-equipped Carrier insertion¶ 45 When a complete Shelf with a Carrier and Modules already installed is powered up or when

a Carrier with Modules installed on it is inserted into a Shelf, Management Power (MP) is applied to the associated MMCs roughly simultaneously. Carriers are activated based on the order of their FRU Activation and Power Descriptors in the Shelf FRU Information. Each Carrier is powered up ahead of any Module installed on that Carrier. Each MMC will send the Module Hot Swap (Module Handle Closed) event message to its Carrier. The Carrier, in turn, will report the respective transitions of the Module (i.e., M0 ⇒ M1 and M1 ⇒ M2) to the Shelf Manager. Once the Module is in M2, transitions to states beyond M2 are subject to arbitration delays at a minimum, but more typically these transitions take place on a timetable defined by the Carrier IPMC.

3.6.6 Module Hot Swap sensor¶ 46 Each MMC contains one Module Hot Swap sensor. This sensor proactively generate events

(Module Handle Closed, Module Handle Opened, Quiesced, Backend Power Shut Down, and Backend Power Failure) to enable the Carrier IPMC to perform Hot Swap management for the Modules it represents.

¶ 47 A Module’s Backend Power includes all the power supplies on a Module derived from Payload Power. Module Backend Power could be disabled by a Module as an implementation defined option. How a Module Payload communicates with the MMC to indicate it has Quiesced, has requested that its Module Backend Power be shut down, or to indicate a Module Backend Power Failure is outside the scope of this specification and is implementation defined.

¶ 48 One example of a Module requesting its Backend Power be disabled could involve an application running on the Payload that requests that the Module power off. An example of a Backend Power Failure could involve local voltages that are outside their specified operating range and, to protect the Module, the Backend Power supplies shut off. This specification expects that Modules that assert the Backend Power Shut Down and Backend Power Failure events also implement MMC Payload Power monitoring which is used by the MMC to clear these bits when Payload Power transitions from disabled to enabled. An implementation with Payload Power monitoring could implement clearing of the Quiesced bit when Payload Power transitions from disabled to enabled. How a Module Payload communicates with the MMC to indicate it is no longer Quiesced is outside the scope of this specification and is implementation defined.

Table 3-8 Module Hot Swap event message

Byte Data field

Request data 1 Event Message Rev = 04h (IPMI specification)

2 Sensor Type = F2h (Module Hot Swap)

3 Sensor Number = xxh (Implementation specific)


¶ 49 There is a FRU Hot Swap sensor (a distinct object from the Module Hot Swap sensor) for each FRU that a Carrier IPMC manages (including the Module FRUs). Since the Carrier IPMC is responsible for maintaining the Hot Swap states for its Module FRUs, the current state of a Module can be determined by sending a “Get Sensor Reading (FRU Hot Swap sensor)” command to the Carrier IPMC with the appropriate Hot Swap sensor number. The AdvancedTCA specification Section 3.2.4.3.2 “Reading the FRU Hot Swap Sensor” provides more details on this subject.

¶ 50 Table 3-9, “Get Sensor Reading (Module Hot Swap sensor)”shows the result from a “Get Sensor Reading” command issued to a Module Hot Swap sensor. Byte 4 returns the sensor's current state. The bitwise encoding of the state aligns the Module Hot Swap state with that of an IPMI discrete sensor.

4Event Direction (bit 7) = 0b (Assertion)Event Type[6:0] = 6Fh (Generic Availability)

5

Event Data 1[7:4] = 00h (unspecified Event Data 2 and 3)[3:0] = Current Event

0 = Module Handle Closed1 = Module Handle Opened2 = Quiesced3 = Backend Power Failure4 = Backend Power Shut Down 5-Fh = Reserved

6 Event Data 2 = FFh or not present

7 Event Data 3 = FFh or not present


Table 3-9 Get Sensor Reading (Module Hot Swap sensor)

Byte Data field

Request data 1 Sensor Number (FFh = reserved)


2Sensor Reading[7:0] Not used. Write as 00h.

Table 3-8 Module Hot Swap event message

Byte Data field


Module requirements

REQ 3.52b A Module Hot Swap sensor shall be implemented in the MMC.

REQ 3.53b The “Get Sensor Reading” command shall be implemented in the MMC to enable the Carrier IPMC to determine the current state of the Module. The Carrier IPMC can issue this command at any time to get the sensor status. This command can also be used by a Carrier when it regains contact with a Module after a loss of contact (see Section 3.6.8, “Communication lost.” )

REQ 3.54 When Management Power (MP) is applied to the MMC and its associated management circuitry, the ENABLE# signal is active, and a valid Geographic Address has been read, the MMC shall read the state of the Module Handle and send a Module Hot Swap (Module Handle Opened or Module Handle Closed) event message appropriately, as described in Table 3-8, “Module Hot Swap event message.”

REQ 3.55 When the Module Handle transitions to closed, the MMC shall send a Module Hot Swap (Module Handle Closed) event message as described in Table 3-8, “Module Hot Swap event message.”

REQ 3.56 When the Module Handle state transitions to open, the MMC shall send a Module Hot Swap (Module Handle Opened) event message as described in Table 3-8, “Module Hot Swap event message.”

REQ 3.57 MMCs shall periodically re-send Module Hot Swap event messages until either a Command Completed Normally (00h) Completion Code has been returned from the Carrier IPMC or the Module wants to send a new Module Hot Swap event message.

3

Standard IPMI byte (See “Get Sensor Reading” in the IPMI specification):[7] – 0b = All Event Messages disabled from this sensor[6] – 0b = Sensor scanning disabled[5] – 1b = Initial update in progress. This bit is set to indicate that a “Re-Arm Sensor Events” or “Set Event Receiver” command has been used to request an update of the sensor status, and that update has not occurred yet. Software should use this bit to avoid getting an incorrect status while the first sensor update is in progress. This bit is only required if it is possible for the MMC to receive and process a “Get Sensor Reading” or “Get Sensor Event Status” command for the sensor before the update has completed. This is most likely to be the case for sensors, such as fan RPM sensors, that may require seconds to accumulate the first reading after a re-arm.[4:0] Reserved. Ignore on read.

4 Current State Mask[7:5] Reserved. Ignore on read.[4] - 1b = Backend Power Shut Down [3] – 1b = Backend Power Failure[2] – 1b = Quiesced[1] – 1b = Module Handle Opened[0] – 1b = Module Handle Closed

(5) [7-0] – Optional/Reserved. If provided, write as 80h (IPMI restriction). Ignore on read.

Table 3-9 Get Sensor Reading (Module Hot Swap sensor) (Continued)

Byte Data field


REQ 3.158 MMCs on Modules implementing local on/ off switching control of power derived from Payload Power shall set the Backend Power Shut Down bit in the Module Hot Swap sensor Current State Mask field to 1b when the MMC has turned off its Module Backend Power. MMCs on Modules implementing local on/ off switching control of power derived from Payload Power shall clear the Backend Power Shut Down bit to 0b when Payload Power from the Carrier transitions from disabled to enabled.

REQ 3.159 MMCs on Modules implementing local on/ off switching control of power derived from Payload Power shall set the Backend Power Failure bit in the Module Hot Swap sensor Current State Mask field to 1b when the Module Backend Power fails. MMCs on Modules implementing local on/ off switching control of power derived from Payload Power shall clear the Backend Power Failure bit to 0b when Payload Power from the Carrier transitions from disabled to enabled.

REQ 3.160 MMCs shall set the Quiesced bit in the Module Hot Swap sensor Current State Mask field to 1b after the Module Payload has quiesced. The MMC shall clear the Quiesced bit to 0b upon reception of the “FRU Control (Quiesce)” request just prior to the Module Payload being quiesced. MMCs with Payload Power monitoring capability should clear the Quiesced bit to 0b when Payload Power from the Carrier transitions from disabled to enabled.

Carrier requirements

REQ 3.58b Unless explicitly stated otherwise in this specification, the IPM Controller Hot Swap requirements contained in Section 3.2.4.3.1, “FRU Hot Swap Event Message” of the PICMG 3.0 Specification shall apply to a Carrier IPMC’s representation of its Modules’ state transitions.

REQ 3.59b When the Carrier IPMC detects a Module’s presence (PS1# signal is active), the Carrier IPMC shall transition the corresponding Module’s state from M0 to M1 and release the isolation of the IPMB-L signals to the Slot.

REQ 3.60 In M1 state, when the Carrier IPMC receives a Module Hot Swap (Module Handle Closed) event message, the Carrier shall assume that the Module Handle is closed. The Carrier shall then send a “Set FRU LED State” command to the MMC with a request to perform long blinks of the BLUE LED. The Carrier IPMC will then read the FRU Information from the Module. If the FRU Information is valid and contains a valid Module Current Requirements record and if the Carrier is able to provide the necessary Payload Power then the Carrier shall clear the Locked bit for that Module and transition the Module state from M1 to M2. If any of the above conditions are not true then the Carrier shall leave the Module in M1 and send a “Set FRU State” command to the MMC with a request to turn on the BLUE LED.

REQ 3.61 The Carrier IPMC shall transition the Module from M2 to M3 upon receipt of a “Set FRU Activation (Activate FRU)” command for that Module and shall send a “Set FRU LED State” command to the MMC with a request to turn off the BLUE LED.

REQ 3.62b When the “Set FRU Activation (Activate FRU)” command is received for a Module by the Carrier IPMC, it shall set the Deactivation-Locked bit for the designated Module to 1b before the command response is sent.

REQ 3.63 The Carrier IPMC shall add any power-conversion loss (see Section 3.7.2, “Carrier Activation and Current Management record”) internal to the Carrier to the power requirements defined in the Module’s FRU Information to the response for the “Get Power Level” command of the Module. Note that there is only one power level for the Module; this power level is inserted in the Power Draw [1] field of the “Get Power Level” command response. Refer to the AdvancedTCA specification for information about the “Get Power Level” command.


REQ 3.64 If the Shelf Manager sends a “Set Power Level (Level=0)” command for a Module in M4 or M5 state, the IPMC shall immediately transition the Module to M6 state, de-assert Payload Power (PWR) to the Module and transition it to M1 state. The Carrier IPMC shall send a “Set FRU LED State” command to the MMC on the Module with the request to perform short blinks of the BLUE LED, and after that it shall send another “Set FRU LED State” command to the same MMC with the request to turn ON the BLUE LED. Under this condition, the IPMC shall not send a “FRU Control (Quiesce)” command to the Module and wait for a “Module Hot Swap (Quiesced)” event from the Module.

REQ 3.65 When a Module is in M3 state, if the Carrier IPMC receives a “Set Power Level (1)” command, the IPMC shall enable Payload Power (PWR) for that Module.

REQ 3.66 The Carrier IPMC shall transition a Module from M3 to M4 after that Module’s Payload Power has been enabled. This indicates to the operator that the Module is activated.

REQ 3.67b When the Carrier IPMC receives the Module Hot Swap (Module Handle Opened) event, the Carrier shall assume that the Module Handle is opened and shall clear the Deactivation-Locked bit. After clearing the Deactivation-Locked bit, the Carrier IPMC shall transition the Module state from M4 to M5 and shall send a “Set FRU LED State” command to that Module's MMC with a request to display short blinks of the BLUE LED.

REQ 3.68 When the Carrier IPMC receives the “Set FRU Activation (Deactivate FRU)” command for a Module in M3, M4 or M5 state, the IPMC shall set the Locked bit for that Module and transition the Module to M6 state.

REQ 3.69 When a Module is in M6 state, the Carrier IPMC shall issue a “Set AMC Port State (Disabled)” command for all Ports on the Module and corresponding Ports on the Carrier.

REQ 3.70b When a Module is in M6 state, the Carrier IPMC shall gracefully remove the Module Payload Power by sending the “FRU Control (Quiesce)” command to the Module and wait for the Module to send Module Hot Swap (Quiesced) event message before switching off Payload Power.

REQ 3.71 After switching off the Payload Power (PWR) to the Module, the Carrier IPMC shall transition the Module from M6 to M1 and shall send a “Set FRU LED State” command to the MMC in that Module with a request to turn on the BLUE LED, which indicates to the operator that the Module is ready to be safely extracted.

REQ 3.72b The “Set FRU Activation” commands and the overall Locked bit and Deactivation-Locked bit logic shall be implemented as required by Section 3.2.4.1 “FRU states and transitions” in the PICMG 3.0 specification, unless otherwise stated in this specification.

REQ 3.161 When the Carrier IPMC receives the “Module Hot Swap (Backend Power Failure)” or “Module Hot Swap (Backend Power Shut Down)” event message for a Module in M4 or M5 state, the Carrier IPMC shall immediately transition the Module to M6 state, de-assert Payload Power (PWR) to the Module and transition it to the M1 state. The Carrier IPMC shall send a “Set FRU LED State” command to the MMC on the Module with the request to perform short blinks of the BLUE LED, and after that it shall send another “Set FRU LED State” command to the same MMC with the request to turn on the BLUE LED. At least one cycle of Short Blink shall occur when the FRU transitions from M4 to either M5 or M6.


3.6.7 Behavior during Carrier extraction with Modules¶ 51 Consider the situation when the Handle on a Carrier with some number of installed Modules

(all in M4 state) is opened. The Deactivation-Locked bit of the Carrier IPMC (FRU ID 0) is cleared. The Carrier IPMC sends an M4 to M5 transition event message to the Shelf Manager requesting deactivation. Assuming that the Shelf Manager determines to grant deactivation, it responds by sending “Set FRU Activation (Deactivate FRU)” command to the Carrier IPMC. The Locked bit of the Carrier IPMC is set. Alternatively, this command can be sent by a Shelf or System Manager to the Carrier IPMC in the M4 state. In both situations, the Modules can be considered part of the Payload of the Carrier. When the Carrier proceeds into the M6 state, the Carrier IPMC needs to deactivate all installed Modules by transitioning them to the M1 state. The Carrier IPMC needs to make sure all the installed Modules are in the M1 state, before it can transition the Carrier, itself, into the M1 state. Before the installed Modules are powered off, the Locked bit for each of them is set. If the Handle on the Carrier is later closed, the Carrier IPMC clears the Locked bit for FRU ID 0 for each Module that is present.

Requirements

REQ 3.162 When a Carrier is transitioned in to the M6 state, the Carrier IPMC shall deactivate all of its installed Modules to the M1 state.

REQ 3.163 The Carrier IPMC shall transition the Carrier Payload FRU to M1 only after all Module FRUs have transitioned to M1.

3.6.8 Communication lost¶ 52 Section 3.2.4.4, “Communication Lost” in the PICMG 3.0 Specification states the

requirements on IPM Controllers that represent other FRUs regarding monitoring the ability of those IPM Controllers to maintain contact with those FRUs. As AdvancedTCA IPM Controllers, Carrier IPMCs are subject to these requirements. Note, however, that Carrier IPMCs have some additional resources to apply to these requirements:

• Carrier IPMCs can use PS1# to distinguish between: 1) a Module that has been surprise extracted and 2) a Module that is present but not communicating on IPMB-L. AdvancedTCA Shelf Managers are not able to make this distinction about IPM Controllers in a Shelf.

• Carrier IPMCs can use the Reset_MMC# signal to reset a non-communicating MMC in an attempt to restore communication. AdvancedTCA Shelf Managers do not have this capability for IPM Controllers.

Requirements

REQ 3.73 If the Carrier IPMC detects communication errors on IPMB-L and Isolation is required, the Carrier shall isolate the errant Module Management Controller (MMC) and disable the IPMB buffers to the Module and transition the Module to communication lost state.

REQ 3.74 On re-enabling of the IPMB buffer to the Module, if communication is successful, the Carrier IPMC shall transition the Module back to a known state as communication is regained.


3.7 Power management¶ 53 Section 3.6, “Module operational state management” introduces the role played by the

Carrier IPMC in managing the power requirements of the Modules it hosts. This subsection explains how the Carrier IPMC determines how much Payload Power can be delivered by the Carrier to an AdvancedMC Slot.

¶ 54 The power management of Modules is a shared responsibility between the Carrier and Shelf Manager. The Carrier is responsible for determining if the Carrier can supply the necessary power to a Module. If the Carrier can supply the power, the Carrier will request the necessary power budget from the Shelf Manager. Once the Carrier has been allocated power from the Shelf Manager, it is then able to enable PWR to the Module.

¶ 55 As explained in the PICMG 3.0 Specification, in order to make intelligent decisions about when FRUs (in this case, AdvancedMCs) are powered up or down and what power levels to assign for each FRU (in this case, AdvancedMC), the Shelf Manager must collect several items of data. Power-related data records in Figure 3-8, “Power distribution management architecture” are defined in the PICMG 3.0 and this specification. Figure 3-8 shows the specific decision points and data items used by the Shelf Manager (italicized in dark green) and the Carrier IPMC (underlined in dark blue) to act on Power allocation for a Module.


Figure 3-8 Power distribution management architecture

3.7.1 Module Current Requirements record¶ 56 Each Module defines its maximum current requirement even if that value is required for only

a transitional amount of time (for all components on the Module). The Module FRU Information structure described below informs the Carrier of these requirements.

Power Feed 2Power Feed 1

AMC nAMC 1

ATCA Shelf

ATCA Board

Max. External Available Current (Shelf Power Distribution

Record )

Max. Internal Current (Shelf Power Distribution

Record)

Max. FRU Power Capability (Shelf Activation and Power

Management Record )

Carrier AdvancedTCA Board

Max. Internal Current (Carrier Activation and Current Management

Record)

Max. Module Current (Carrier Activation and Current Management

Record)

Current Draw (Module Current

Requirement Record )

48V

12V

Table 3-10 Module Current Requirements record




Requirements

REQ 3.75 The Module FRU Information shall contain the Module Current Requirements record as shown in Table 3-10.

3.7.2 Carrier Activation and Current Management record ¶ 57 This subsection describes the Carrier level data that is used in power management. The

details of this data are provided in Table 3-11. The structures describe the maximum internal current, the current capacity of the AdvancedMC Slots, and their power on treatment.

1 1

End of List/Version[7] – End of List. Set to one for the last record[6:4] – Reserved, write as 0h[3:0] – Record format version (= 2h for this definition)

2 1 Record Length



5 3Manufacturer ID. Least significant byte first. Write as the three byte ID assigned to PICMG. For this specification the value 12634 (00315Ah) must be used.

8 1 PICMG Record ID. For the Module Power Descriptor table, the value 16h must be used.


10 1Current Draw. This field holds the Payload Power (PWR) requirement of the Module given as current requirement in units of 0.1A at 12V. (This equals the value of the power in W divided by 1.2.)

Table 3-10 Module Current Requirements record


Table 3-11 Carrier Activation and Current Management record



1 1

End of List/Version[7] – End of List. Set to one for the last record[6:4] – Reserved, write as 0h[3:0] – Record format version (= 2h for this definition)

2 1 Record Length





8 1 PICMG Record ID. For the Carrier Activation and Power Management Record, the value 17h must be used.


10 2

Maximum Internal Current. Least significant byte first. This field holds the value of the total Payload Power (PWR) available on the Carrier to the entire set of AMC Slots, given as a current value in units of 0.1A at 12V. (This equals the value of the available power in W divided by 1.2.)

12 1Allowance for Module Activation Readiness. This field contains the number of seconds after Carrier start-up that Modules have to transition to state M3 and maintain their power up sequence position.

13 1Module Activation and Current Descriptor Count. This contains a count of the number of entries (M) in the Module Activation and Current Descriptor Table.

14 M*3

Module Activation and Current Descriptors. This is an array of activation and current descriptors for each AMC Slot implemented on the Carrier. Each descriptor is 3 bytes in size and follows the format found in Table 3-12, “Module Activation and Current Descriptor.”

Table 3-11 Carrier Activation and Current Management record (Continued)



¶ 58 The Carrier is responsible for determining a Module's current requirements from its FRU Information and validating it against the Maximum Internal Current and Maximum Module Current data defined in the Carrier FRU Information.

¶ 59 The Payload Power DC to DC converter in the Carrier that acts as the power source for the Modules has a power conversion loss that varies with load (including load changes when Modules are inserted or extracted). The Carrier is responsible for compensating for this loss. The power requirements of a Module must be incremented with a calculated efficiency loss value when responding to the “Get Power Level” command defined in Section 3.9.1.2, “Board/FRU participation” in the PICMG 3.0 Specification.

Requirements

REQ 3.76b The Carrier FRU Information shall contain a Carrier Activation and Current Management record as defined in Table 3-11 for each AdvancedMC Slot implemented by the Carrier.

REQ 3.77b The Carrier shall use the order of the Module Activation and Current Descriptors (see Table 3-11 and Table 3-12) to determine the power up sequencing of the Modules it hosts.

REQ 3.78b The Carrier shall check that the power requested by a Module can be delivered by the Carrier before a Module can transition from M2 to M3. This involves checking that the Maximum Module Current is greater than Current Draw and that Maximum Internal Current is greater than Current Draw of all Modules that have been allocated power plus the Current Draw for the Module being negotiated.

3.8 Cooling management¶ 60 To support higher level management in appropriately managing the cooling resources, the

Module must provide reports of abnormal temperature in its environment. Every Module must have temperature sensors; when an MMC detects that a monitored temperature sensor crosses one or more thresholds in either direction, the MMC sends an IPMI temperature event message to the Carrier IPMC. The Carrier IPMC, or higher level management, uses this information to manage the cooling.

Table 3-12 Module Activation and Current Descriptor

Offset Length Description

0 1 Local IPMB Address. This is IPMB-L address of the AMC Slot. The order of this record in the table determines the power-on sequencing.

1 1Maximum Module Current. This field holds the value for the maximally allowed power draw by the AMC Slot identified by the Local IPMB Address, given as a current value in 0.1A at 12V. (This equals the value of the maximum power in W divided by 1.2.)

2 1

This byte is intended to contain activation and power configuration parameters for the AMC Slot identified by Local IPMB Address. This byte is not implemented in the current version of the specification. This byte must be set to FFh.


¶ 61 Every Carrier and Module ought to contain at least two temperature sensors and appropriate Sensor Data Records (SDRs) to describe the sensors.

Requirements

REQ 3.164 The Module and the Carrier shall support the SDRs for the temperature sensors implemented.

REQ 3.80b The Module shall generate temperature sensor events in accordance with Section 3.9.3.2 “Abnormal Event Message” of the PICMG 3.0 specification.

REQ 3.165 For each on-Module temperature sensor, Modules shall provide the warning operating temperature (upper non critical threshold) and the maximum operating temperature (Upper critical threshold) in the SDR information.

REQ 3.166 For each on-Carrier temperature sensor, the Carrier shall provide the warning operating temperature (upper non critical threshold) and the maximum operating temperature (Upper critical threshold) in the SDR information.

¶ 62 Electronic Keying is the mechanism by which the mandatory AMC.0 Management infrastructure is used to dynamically satisfy the needs that had traditionally been satisfied by various mechanical connector keying solutions:

• Prevent mis-operation

• Verify fabric compatibility

¶ 63 This specification defines two types of E-Keying. Point-to-point E-Keying deals with the point-to-point fabric connections for Modules and on-Carrier devices. Clock E-Keying deals solely with Clock Channel signals (which can also be implemented on a point-to-point basis) and includes clock-specific features.

3.9 E-Keying¶ 64 The AMC.0 specification supports two types of topologies for point-to-point fabric

connections. One type is a direct Module to Module connection. The Carrier provides a connection between two Modules. No other device is allowed to be connected to the Module Port in this scenario. In the second type, the Carrier contains an on-Carrier device. The Module Port is terminated at the on-Carrier device. This device might contain connections to other AdvancedMC Slots or to the AdvancedTCA Zone 2 connector. The Carrier IPMC is responsible for E-Keying between the Modules and their connections to Carrier resources. E-Keying for an on-Carrier device to backplane interface is out of scope of the AMC.0 specification and is covered by PICMG 3.0.

¶ 65 Point-to-point fabric E-Keying is done on a Port by Port basis. Ports are enabled if both ends of the Port have matching protocols. The term enable when used in this section may not refer to the actual enabling of the LVDS driver for a Port. In this specification, Ports that are LVDS are not required to support the physical enabling/disabling of the driver. Note that non-LVDS Ports must power up in a disabled state.

¶ 66 The basis for the E-Keying process is the E-Keying entries present as FRU Information in the Carrier and all Modules. References in this section to AdvancedMCs refer to information that is relevant to Carriers as well as Modules. When necessary, Carrier and Module will be used to denote device specific information. There are two records that contain the E-Keying information. The Carrier Point-to-Point Connectivity record contains information about the


Carrier's Port physical connections. The AdvancedMC point-to-point connectivity record describes the protocols supported by the port. The AdvancedMC point-to-point connectivity can be found in the Carrier and Module's FRU Information. The Carrier Point-to-Point Connectivity record is located in the Carrier's FRU Information. Those E-Keying entries describe the Fabric Interface implemented. It is the IPMC's responsibility to perform the Module Port E-Keying function. The AdvancedTCA Shelf Manager does not participate in the Module E-Keying.

¶ 67 For AdvancedMCs, the primary unit of point-to-point connectivity is a Port. A Port is two differential pairs (one transmit and one receive). One to four Ports can be grouped into a logical AdvancedMC Channel that is similar to an AdvancedTCA Channel. An AdvancedMC Channel is composed of an arbitrary (not necessarily numerically or physically contiguous) set of up to four Ports.

¶ 68 AdvancedMC Channels are identified by AdvancedMC Channel IDs. In the data structures and commands defined in this section, AdvancedMC Channel IDs play essentially the same role as Channel numbers in AdvancedTCA E-Keying. AdvancedMC Channel IDs start at 0 and are numbered sequentially on a Carrier or separately on a Module. A Channel ID is simply an index into the list of AdvancedMC Channels that are defined on a Carrier or on a Module.

3.9.1 Point-to-point E-Keying¶ 69 As mentioned above, point-to-point fabric E-Keying supports two AdvancedMC Carrier

routing models: the centralized AdvancedMC on-Carrier device model and the AdvancedMC direct connectivity model. The point-to-point connectivity provided in a Carrier is described in the Carrier FRU Information. The capabilities of an AdvancedMC Module to communicate over point-to-point connections are described in the Module’s FRU Information. Similar information for the Links supported by the connected on-Carrier devices is provided in the Carrier FRU Information. In this E-Keying section, there are references to on-Carrier device ID; these refer to the ID (number) assigned to an on-Carrier device. The assignment of that number is arbitrary.

3.9.1.1 Carrier point-to-point connectivity information

¶ 70 The Carrier Point-to-Point Connectivity record is included in the Carrier FRU Information and describes the point-to-point connections implemented on the Carrier. The Carrier FRU Information may include several Carrier Point-to-Point Connectivity records if a single record is not sufficient for describing all point-to-point connections implemented on the Carrier. The Carrier IPMC treats these multiple records as a single logical point-to-point AdvancedMC Slot Descriptors list, broken into parts due to limits on multi-record area record lengths.


¶ 71 Each variable length Point-to-Point AMC Resource Descriptor defines the point-to-point connectivity for the corresponding AdvancedMC Slot or on-Carrier device. Table 3-14 shows the Point-to-Point AMC Resource Descriptor format.

¶ 72 Each Point-to-Point Port Descriptor describes a point-to-point Port associated with the indicated resource. Each 24-bit entry provides bit-fields indicating the remote resource and the remote Port within the remote resource to which the local Port is connected. The term

Table 3-13 Carrier Point-to-Point Connectivity record



1 1

End of List/ Version[7] – End of List. Set to one for the last record.[6:4] – Reserved, write as 0h[3:0] – Record format version (= 2h for this definition)

2 1 Record Length




8 1 PICMG Record ID. For the Carrier Point-to-Point Connectivity record, the value 18h must be used.


10 m

Point-to-Point AMC Resource Descriptor List. A list of variable length Point-to-Point AMC Resource Descriptors (see Table 3-14) totaling m bytes in length. Each Point-to-Point AMC Resource Descriptor describes the number of Ports and the connectivity thereof from one AMC Slot or on-Carrier device.

Table 3-14 Point-to-Point AdvancedMC Resource Descriptor


0 1

Resource ID. Indicates the AMC Slot ID or on-Carrier device.[7] Resource Type. 1 AMC, 0 indicates on-Carrier device ID[5:4] Reserved; write 0h[3:0] On-Carrier device ID or AMC Site Number

1 1 Point-to-Point Port Count. Indicates the number of point-to-point Ports associated with this Resource.

2 3*nPoint-to-Point Port Descriptors. An array of n Point-to-Point Port Descriptors (each with Least significant byte first) (see Table 3-15) where n is specified in the Point-to-Point Port Count byte.


“remote” refers to AdvancedMC Slots or on-Carrier devices other than the one designated by the resource ID field in the containing point-to-point resource descriptor. The term “local” refers to Ports within that AdvancedMC Slot or on-Carrier device. Table 3-15, “Point-to-Point Port Descriptor” shows the format of Point-to-Point Port Descriptor entries.

Requirements

REQ 3.81 The Carrier FRU Information shall include one or more Carrier Point-to-Point Connectivity records described above.

REQ 3.82 If several records are included, the Point-to-Point AMC Resource Descriptor List fields shall be treated as different parts of a single Point-to-Point AMC Resource Descriptor List.

REQ 3.83 The Carrier FRU Information shall describe all point-to-point connections implemented on the Carrier in the Carrier Point-to-Point Connectivity record(s).

REQ 3.84b The FRU Information may include two Point-to-Point Port Descriptors for each implemented connection in the two Point-to-Point AMC Resource Descriptors of the two AdvancedMC resources (AdvancedMC Slots or on-Carrier device) on either end of the connection.

REQ 3.85 Alternatively, the FRU Information may include only a single Point-to-Point Port Descriptor describing the connection from one of its end points only.

3.9.1.2 AdvancedMC point-to-point interface information

¶ 73 One or more AdvancedMC Point-to-Point Connectivity records are included in the AdvancedMC FRU Information and describe the Channel and Link connectivity that is implemented on the AdvancedMC Module. Similarly, one or more such records are included in the Carrier FRU Information to describe connectivity implemented by on-Carrier device(s).

¶ 74 Each AdvancedMC point-to-point connectivity record contains AMC Link Descriptors, each of which identifies a Link and an associated protocol. Multiple AMC Link Descriptors can exist for a given point-to-point AdvancedMC Channel. This would be used when a Channel can support multiple protocols such as PCI-Express and Advanced Switching.

Table 3-15 Point-to-Point Port Descriptor

Bits Description

23:18 Reserved. Must be 0.

17:13 Local Port. Indicates the Port number within the local AMC Slot or on-Carrier device.

12:8 Remote Port. Indicates the Port number within the remote AMC Slot or on-Carrier device ID to which this point-to-point connection is routed.

7:0

Remote Resource ID. In AMC.0 systems:[7] Resource Type. 1 AMC, 0 indicates on-Carrier device[6:4] Reserved; write 0h[3:0] On-Carrier device ID or AMC Site Number


¶ 75 An implementation that provides multiple AMC Link Descriptors affecting the same physical Channel for either an AdvancedMC Module or an on-Carrier device could produce an undesired E-Keying result, because the Carrier IPMC algorithm for processing such AMC Link Descriptors is beyond the scope of this specification. An application can avoid the selection of an undesired protocol by ensuring that the AdvancedMC and Carrier FRU Information AMC Point-to-Point Connectivity records contain only the desired AMC Link Descriptors.

Table 3-16 AdvancedMC Point-to-Point Connectivity record



1 1

End of List/Version[7] End of List. Set to one for the last record.[6:4] Reserved; write as 0h[3:0] Record format version (= 2h for this definition)

2 1 Record Length




8 1 PICMG Record ID. For the AMC Point-to-Point Connectivity record, the value 19h must be used.


10 1 OEM GUID Count. The number, n, of OEM GUIDs defined in this record.

11 16*n OEM GUID List. A list 16*n bytes of OEM GUIDs.

11 + 16*n 1[7] Record Type – 1 AMC Module, 0 On-Carrier device[6:4] Reserved; write as 0h[3:0] Connected-device ID if Record Type = 0, Reserved, otherwise.

12 + 16*n 1 AMC Channel Descriptor Count. The number, m, of AMC Channel Descriptors defined in this record.

13 + 16*n 3*mAMC Channel Descriptors. A variable length list of m three-byte AMC Channel Descriptors, each defining the Ports that make up an AMC Channel (least significant byte first).

14 + 16*n + 3*m 5*p

AMC Link Descriptors. A variable length list of p five-byte AMC Link Descriptors (Least significant byte first) (see Table 3-19, “AMC Link Descriptor”, Table 3-20, “AMC Link Designator”, and Table 3-21, “AMC Link Type”) totaling 5 * p bytes in length. The value of p and the length of the list are implied by Record Length, since the list is at the end of this record.Each AMC Link Descriptor details one type of point-to-point protocol supported by the referenced Ports.


-1

¶ 76 The AdvancedMC Point-to-Point Connectivity record defines the options and requirements supported by the Module and Carrier. The Carrier IPMC searches this record(s) on the AdvancedMC Module and Carrier (or on a pair of connected Modules) to determine if there is a match. Figure 3-9 describes the relationship among a subset of these record fields and summarizes their functions.

Figure 3-9 Relationship among fields of an AdvancedMC Point-to-Point Connectivity record

¶ 77 The Record Type field indicates whether an AdvancedMC Point-to-Point Connectivity record describes the connectivity of a Module or an on-Carrier device.

¶ 78 AMC Channel Descriptors (as detailed in Table 3-17, “AMC Channel Descriptor”) define AdvancedMC Channels (each composed of an essentially arbitrary set of up to four Ports) that are implemented on a Module or an on-Carrier device (depending on the value of the Record Type field in the AdvancedMC Point-to-Point Connectivity record). An

Record HeaderRecord Type• Module or On-Carrier device

AMC Channel Descriptor Count• Count = M

#0 #M-2AMC Channel Descriptor

• Binding of Lanes to PortsChannel ID = 0

#M-1AMC Channel Descriptor

• Binding of Lanes to PortsChannel ID = M-2

AMC Channel Descriptor• Binding of Lanes to Ports

Channel ID = M-1

AMC Link Descriptor

AMC Link Designator• Enable/Disable Ports• AMC Channel ID

AMC Link Type

Asymmetric MatchCompliance to additional asymmetric options/functionality

Link Grouping IDIdentifies optional multi-Channel Links

AMC Link ExtensionsCompliance to additional options/functionality

AMC Link Descriptor


AMC Link Type




AMC Link Descriptor


AMC Link Type




AMC Link Descriptor


AMC Link Type




#P#1#0 #P-2


AdvancedMC Channel is referenced in other FRU Information records via an AdvancedMC Channel ID, which is the zero-based sequential index into the corresponding AMC Channel Descriptor in a composite list combining the AdvancedMC Channel Descriptors from all the AdvancedMC Point-to-Point Connectivity records that occur in a given FRU Information area. This list preserves the order of the groups of AdvancedMC Channel Descriptors to match the order of the containing AdvancedMC Point-to-Point Connectivity records in the FRU Information area.

¶ 79 A Port Number of 31 (1Fh) indicates that the corresponding Lane is not included in the Channel defined by an AMC Channel Descriptor. This allows an AMC Channel Descriptor to reserve only those Lanes needed when alternate uses are expected for unused Lanes.

¶ 80 Table 3-19, “AMC Link Descriptor” shows the fields of an AMC Link Descriptor. The AMC Link Designator field defines the subset of an AdvancedMC Channel’s Lanes that are included in a Link.

¶ 81 The next two fields detail a capability of an AdvancedMC Module to drive a particular protocol on a point-to-point connection through an AMC Link Type and an AMC Link Extension. The AMC Link Type indicates which AMC subsidiary specification governs the AMC Link Descriptor. The AMC Link Extension indicates a particular compliance if the subsidiary specification covers multiple variations on a given protocol. The AMC Link Type can also indicate that a given AdvancedMC Channel is configured with OEM specific capabilities. The combination of AMC Link Designator, AMC Link Type, and AMC Link Type Extension forms a unique key used to enable or to disable capabilities. Multiple AMC Link Descriptors can be specified for a single AdvancedMC Channel.

¶ 82 Some protocols and usages span multiple AdvancedMC Channels. The Link Grouping ID field in an AMC Link Descriptor identifies Channels and their associated Ports that are grouped together in multi-Channel Links. A Link Grouping ID of zero indicates a Single-Channel Link, while a common, non-zero Link Grouping ID in multiple AMC Link Descriptors indicates that the Channels covered by those AMC Link Descriptors can be operated together. A unique non-zero Link Grouping ID in an AMC Link Descriptor also indicates a Single-Channel Link. AMC Link Descriptors with a matching Link Grouping ID must also match in the AMC Link Type, AMC Link Extension and AMC Asymmetric Match fields, while they will differ in the AMC Link Designator field.

Table 3-17 AMC Channel Descriptor

Bits Description

23:20 Reserved. Must be 1111b.

19:15 Lane 3 Port Number. The Port within this AMC resource that functions as Lane 3 of this AMC Channel.





¶ 83 Certain protocols and usages require Links with asymmetric peer functionality such as Master/Slave or Upstream/Downstream. AMC Asymmetric Match, the final field in an AMC Link Descriptor, enables matching of asymmetric peers independent of their location on a Module or Carrier. If the combination of AMC Link Designator, AMC Link Type, and AMC Link Type Extension form an exact match, the Asymmetric Match field is further compared for compatibility. Bits [1:0] of AMC Asymmetric Match detail whether a compatible Link Descriptor requires an exact match or a complementary code in the Asymmetric Match field, as shown in Table 3-18.

¶ 84 In an AMC Link Designator, the AMC Channel ID identifies the AdvancedMC Channel. The Lane 0 Bit Flag…Lane 3 Bit Flag fields indicate whether the corresponding Lane of that AdvancedMC Channel is used in the Link. An AMC Link Designator must not indicate use of a Lane which has a Port Number of 31 in the corresponding AMC Channel Descriptor.

¶ 85 When a Carrier IPMC is determining an E-Keying match, the AMC Link Designator/Link Type/Link Type Extension fields are compared, and for AMC Link Types governed by an AMC.0 subsidiary specification, there must be an exact match of those fields and compatibility in the AMC Asymmetric Match fields before the “Set AMC Port State (Enable)” command is sent. For AMC Link Types indicating a proprietary definition as

Table 3-18 AMC Link Descriptor Asymmetric Match field values

Value Description

00b Matches with '00b' (exact match)

01b Matches with '10b'

10b Matches with '01b'

11b Reserved

Table 3-19 AMC Link Descriptor

Bits Description

39:34 Reserved. Must be 111111b.

33:32AMC Asymmetric Match. Indicates whether exact or asymmetric match is required, and if asymmetric further defines which end of an asymmetric Link this Descriptor represents. See Table 3-18.

31:24

Link Grouping ID. Indicates whether the Ports of this Channel are operated together with Ports in other Channels. A value of 0 always indicates a Single-Channel Link. A common, non-zero Link Grouping ID in multiple Link Descriptors indicates that the Ports covered by those Link Descriptors must be operated together. A unique non-zero Link Grouping ID also indicates Single-Channel Link.

23:20AMC Link Type Extension. Identifies the subset of a subsidiary specification that is implemented and is defined entirely by the subsidiary specification identified in the Link Type field.

19:12 AMC Link Type. Identifies the AMC.x subsidiary specification that governs this description or identifies the description as proprietary; see Table 3-21, “AMC Link Type.”

11:0 AMC Link Designator. Identifies the AMC Channel and the Ports within the AMC Channel that are being described; see Table 3-20, “AMC Link Designator.”


defined below, a comparison of AMC Link Designator/Link Type Extension/ Asymmetric Match and the corresponding OEM GUID is performed instead, while AMC Link Type is not compared. In both cases, the AMC Channel ID field in the Link Designator is not included in these comparisons, because there is no need for AMC Channel IDs to be identical at each end of a Link.

¶ 86 Note that a match is necessary, but not sufficient, for sending the “Set AMC Port State (Enable)” command. The connectivities implemented on the Carrier and, for protocols that span multiple Channels, the Link Grouping ID must be factored in as well. Finally, the Carrier IPMC may use user-determined policies, such as multi-tenancy security, that can affect the decision process. Two Link Types in an OEM range are considered to match when the associated OEM GUIDs match.

¶ 87 A Globally Unique Identifier (GUID) is 128 bits long and if generated in a compliant manner, is either guaranteed to be different from all other GUIDs generated until 3400 A.D. or extremely likely to be different (depending on the mechanism chosen). An OEM GUID is constructed and processed as specified in Chapter 17.8 of the IPMI specification, which defines the “Get Device GUID” command. That section defers primarily to Attachment A of the Wired for Management Baseline, Version 2.0 specification for the detailed requirements (such as for how GUIDs are compared).

Table 3-20 AMC Link Designator

Bits Description

11 Lane 3 Bit Flag (1 = Lane Included; 0 = Lane Excluded)




7:0 AMC Channel ID. Identifies an AMC Channel Descriptor defined in an AMC Point-to-Point Connectivity record.


Table 3-21 AMC Link Type

¶ 88 The AMC Link Type is a single-byte value. Each AMC.0 subsidiary specification is assigned one or more AMC Link Type values. Values in the range F0h … FEh indicate OEM specific definitions. The low order four-bit value is an index into a common table of OEM-defined 128-bit GUIDs. This table is created as a concatenation of the OEM GUID List fields (see Table 3-16, “AdvancedMC Point-to-Point Connectivity record”) of all AdvancedMC Point-to-Point Connectivity records of a given Module or Carrier FRU Information area in the order in which the records are included in the FRU Information. Thus, an AdvancedMC Link Type defined in an AdvancedMC Link Descriptor residing in one AdvancedMC point-to-point connectivity record can refer to an OEM GUID defined in a different AdvancedMC point-to-point connectivity record, as long as both records are in the same FRU Information area—either on a specific Module or on the Carrier itself. This secondary indexing allows a minimum number of bytes to be read for support of the AMC.0 subsidiary specifications but allows for up to 15 OEM specific protocols per FRU Information area to be supported by the Carrier IPMC during the E-Keying process.

Note: It is the 128-bit OEM GUID value that is compared and not the particular AMC Link Type value in the F0h ... FEh range.

Requirements

REQ 3.86b A given point-to-point AdvancedMC Channel may have as many AMC Link Descriptor entries as the hardware driving that AdvancedMC Channel is capable of supporting. The AMC Link Descriptor shall be used to describe interconnections defined by both AMC subsidiary specifications and OEMs.

REQ 3.88 Every AdvancedMC Channel and every capability for such AdvancedMC Channels shall be described in the multi-record area of the Module’s FRU Information in AdvancedMC Channel Descriptors and Link Descriptors, respectively.

REQ 3.89 Every Channel connected to a device on a Carrier and every capability for such AdvancedMC Channels shall be described in the multi-record area of the Carrier’s FRU Information in AdvancedMC Channel Descriptors and Link Descriptors, respectively.

REQ 3.90 The AdvancedMC Channel Descriptors shall be designated by AdvancedMC Channel IDs that represent a zero-based index into a combined AdvancedMC Channel Descriptor table for each FRU Information area. The combined AdvancedMC Channel Descriptor table shall be constructed as a concatenation of the AdvancedMC Channel Descriptor lists of all AdvancedMC Point-to-Point Connectivity records in a given FRU

Type Description

00h Reserved

01h Reserved

02h AMC.1 PCI Express

03h, 04h AMC.1 PCI Express Advanced Switching

05h AMC.2 Ethernet

06h AMC.4 Serial RapidIO

07h AMC.3 Storage

08h…EFh Reserved

F0h…FEh E-Keying OEM GUID Definition

FFh Reserved


Information area (Module or Carrier), in the order in which those records are included in that FRU Information.

REQ 3.91 An AMC Link Descriptor shall indicate in the Asymmetric Match field if the Link requires an exact match or an asymmetric match. If an asymmetric match is indicated, the descriptor shall further indicate in this field which end of the asymmetric Link is described in that AMC Link Descriptor.

REQ 3.92 For multi-protocol support, every protocol for an AdvancedMC Channel shall have a separate Link Descriptor. The records shall be entered in order of preference, but policies of the Carrier IPMC may override that preference if multiple, compatible Link capabilities exist.

REQ 3.93 Multi-Channel Links shall not mix AdvancedMC Channels from different point-to-point interfaces. All AdvancedMC Channels in a multi-Channel Link shall be of a single interface type.

REQ 3.94 AMC Link Descriptors indicating a matching Link Grouping ID shall also have matching AMC Link Type, AMC Link Extension, and AMC Asymmetric Match fields.

REQ 3.95 For Link types in the range of F0h to FEh, a corresponding entry in the combined OEM GUID table shall be included. The combined OEM GUID table shall be constructed as a concatenation of the OEM GUID Lists of all AdvancedMC Point-to-Point Connectivity records in a given FRU Information area (Module or Carrier), in the order in which those records are included in that FRU Information. Each OEM GUID shall be constructed and processed in accordance with Section 17.8 of the IPMI specification.

3.9.1.3 Example: Carrier and AdvancedMC FRU Information

¶ 89 The following example describes a Carrier Board with four AdvancedMC Modules with GbE Module to Module interconnects as well as a Module to an on-Carrier device for one of the AdvancedMCs. Table 3-22, “Point-to-Point Descriptors for AdvancedMC Slot A1 in Carrier FRU Information” shows the protocol configuration options that may be supported with an AdvancedMC Channel for this example.


Figure 3-10 Carrier Board with four AdvancedMCs

GbESwitch ID 0

AdvancedMCSlot A4

AdvancedMCSlot A2

AdvancedMCSlot A3

AdvancedMC Slot A1

2 2 2 2

Por

ts 0

, 1

Por

ts 0

, 1

Por

ts 0

, 1

Ports

0, 1

Ports

8, 9

Ports

10,

11

Ports

12,

13


Table 3-22 Point-to-Point Descriptors for AdvancedMC Slot A1 in Carrier FRU Information

Field Value Description

Local Port 00h Port 0

Remote Port 00h Port 0

Remote Resource ID 82h AMC Slot A2










Local Port 0Ah Port 10



Local Port 0Bh Port 11



Local Port 0Ch Port 12


Remote Resource ID 00h On-Carrier device ID 0

Local Port 0Dh Port 13


Remote Resource ID 00h On-Carrier device ID 0


Table 3-23 Example AdvancedMC Channel Descriptors for AdvancedMC in Slot A1


AMC Channel Descriptor 0 FFFFE0h Lane 0 Port Number = 0; Lanes 1,2 and 3 unused




AMC Channel Descriptor 4 FFFFEAh Lane 0 Port Number = 10; Lanes 1,2 and 3 unused

AMC Channel Descriptor 5 FFFFEBh Lane 0 Port Number = 11; Lanes 1,2 and 3 unused

AMC Channel Descriptor 6 FFFFECh Lane 0 Port Number = 12; Lanes 1,2 and 3 unused

AMC Channel Descriptor 7 FFFFEDh Lane 0 Port Number = 13; Lanes 1,2 and 3 unused

Table 3-24 Example AdvancedMC Link Descriptors for AdvancedMC in Slot A1


Link Designator (AMC Channel ID) 00000000b AMC Channel ID = 0

AMC Link Designator (Lane x Bit Flag) 0001b Lane 0 Bit Flag = Included

AMC Link Type 5h Link Type = AMC.2 Ethernet

AMC Link Type Extension 0000b Link Type Extension = 0000b

Link Grouping ID 00h Link Grouping ID = 00h (independent)

AMC Asymmetric Match 00b AMC Asymmetric Match = Exact

AMC Link Designator (Channel ID) 00000001b AMC Channel ID = 1









Link Type Extension 0000b Link Type Extension = 0000b


































Table 3-24 Example AdvancedMC Link Descriptors for AdvancedMC in Slot A1



3.9.1.4 Set AMC Port State command

¶ 90 The “Set AMC Port State” command is used to enable or disable Ports associated with an AdvancedMC Channel using Link Descriptor information from an AdvancedMC point-to-point connectivity record. The AMC specification does not mandate that drivers for LVDS Ports have the physical ability to be disabled or enabled. The “Set AMC Port State” command contains Link information. The Link information could be used by Modules that provide a configurable interface. The Module could configure the interface to match the type used in the “Set AMC Port State” command allowing for the creation of Modules that can be configured to support a variety of Fabric Interfaces. The MMC might receive this command at any time as other Modules are inserted into or extracted from the Carrier.

Note: When Port states for on-Carrier devices need to be modified, the Carrier IPMC can choose to use some implementation-specific means of doing that. That implementation-specific means may not involve the explicit use of this command at all (since the target of the command would be the Carrier IPMC itself). This command can also be directed to a Carrier IPMC if some other entity needs to explicitly force a state change on a particular AdvancedMC Channel ID that references on-Carrier device Ports. Therefore this command is required to be accepted by Carrier IPMCs as well.

Table 3-25 Example AMC Channel Descriptors for on-Carrier device ID 0


AMC Channel Descriptor 0 FFFFE0h Lane 0 Port Number = 0

AMC Channel Descriptor 1 FFFFE1h Lane 0 Port Number = 1

Table 3-26 Example Link Descriptors for on-Carrier device ID 0



AMC Link Designator (Lane x Port) 0001b Lane 0 Bit Flag = Included






AMC Link Designator (Lane x Port) 0001b Lane 0 Bit Flag = Included






3.9.1.5 Get AMC Port State command

¶ 91 The “Get AMC Port State” command provides a way to query the current Link, if any, on an AdvancedMC Channel. In the request, the AdvancedMC Channel ID is provided to the MMC. The MMC returns a response containing the state of that Link.

Note: When Port states for on-Carrier devices need to be modified, the Carrier IPMC can choose to use some implementation-specific means of doing that. That implementation-specific means may not involve the explicit use of this command at all (since the target of the command would be the Carrier IPMC itself). This command can also be directed to a Carrier IPMC if some other entity needs to explicitly query the state of a particular AdvancedMC Channel ID that references on-Carrier device Ports. Therefore this command is required to be accepted by Carrier IPMCs as well.

Table 3-27 Set AMC Port State command

Byte Data field

Request Data 1 PICMG Identifier. Indicates that this is a PICMG®-defined group extension command. A value of 00h must be used.

2–5

Link Info. Least significant byte first. Describes the Link that should be enabled or disabled.[31:24] – Link Grouping ID[23:20] – Link Type Extension[19:12] – Link Type[11] – Lane 3 Bit Flag[10] – Lane 2 Bit Flag[9] – Lane 1 Bit Flag[8] – Lane 0 Bit Flag[7:0] – AMC Channel ID

6

State. Indicates the desired state of the Link as described by Link Info.00h = Disable01h = EnableAll other values reserved.

(7)

Present if AMC Channel ID is associated with an on-Carrier device, absent otherwise.[7:4] Reserved; write as 0h[3:0] On-Carrier device ID. Identifies the on-Carrier device to which the described AMC Channel is connected.

Response Data 1 Completion Code



Table 3-28 Get AMC Port State command

Byte Data field


2 AMC Channel ID. Identifies the AMC Channel being queried.

(3)

Present if AMC Channel ID is associated with an on-Carrier device, absent otherwise.[7:4] Reserved; write as 0h[3:0] On-Carrier device ID. Identifies the on-Carrier device to which the described AMC Channel is connected.



(3:5)

Link Info 1. Least significant byte first. Optional. Describes information about the first Link associated with the specified AMC Channel ID, if any. If this set of bytes is not provided, the AMC Channel ID does not have any defined Link.[23:16] – Link Grouping ID[15:12] – Link Type Extension[11:4] – Link Type [3] – Lane 3 Port[2] – Lane 2 Port[1] – Lane 1 Port[0] – Lane 0 Port

(6)

State 1. Must be present if Link Info 1 is present. Indicates the first state of the Link.00h = Disable01h = EnableAll other values reserved.

(7:9) Link Info 2. Least significant byte first. Optional. Bit assignments identical to Link Info 1. Used for cases where a second Link has been established.

(10) State 2. Bit assignments identical to State 1.

(11:13) Link Info 3. Least significant byte first. Optional. Bit assignments identical to Link Info 1. Used for cases where a third Link has been established.


(15:17) Link Info 4. Least significant byte first. Optional. Bit assignments identical to Link Info 1. Used for cases where a fourth Link has been established.



¶ 92 A single AdvancedMC Channel ID may have up to four active Links (where each of the Links uses a distinct Port of the four identified by the corresponding AdvancedMC Channel Descriptor. Therefore, just as in the AdvancedTCA “Get Port State” command, the “Get AMC Port State” command can return distinct Link Info and State for up to four Ports.

Requirements

REQ 3.96b Modules and Carriers shall support the “Set AMC Port State” and the “Get AMC Port State” commands if they are designed to support the Fabric interface governed by E-Keying. Carrier support shall include the ability for an external entity to address these commands to the Carrier IPMC, referencing an on-Carrier AdvancedMC Channel ID.

REQ 3.97 The Carrier may send a “Set AMC Port State” command any time after reading a Module’s FRU Information.

REQ 3.98 The Carrier shall send a “Set AMC Port State” command, regardless of whether the outcome is to enable or disable the Port, as soon as the Carrier has computed the E-Key matches for the Fabric Interface Links.

REQ 3.99 The Carrier may send a “Set AMC Port State” command any time after the initial computation as the E-Keying status changes.

3.9.2 Clock E-Keying¶ 93 The AMC Clock Interface is comprised of four Telecom clocks (TCLKA, TCLKB, TCLKC

and TCLKD) plus one fabric clock (FCLKA). These AMC clocks are typically connected to corresponding on-Carrier clock resources or, in the case of an AMC Carrier AdvancedTCA Board, the AdvancedTCA Backplane clocks. A connection between two clocks of these types, together with the associated protocol, is called a Clock Link. Clock Links can be dynamically configured based on the requirements of the application. By default, all AMC clocks and on-Carrier clock resources are in the disabled state when the AMC Module or Carrier is initially activated.

¶ 94 Just like fabric E-Keying which is discussed in the previous section, clock E-Keying provides a mechanism to manage the clock resources, including the on-Carrier devices and AMC clocks, and to prevent hardware damage due to a mismatch between the clock source and clock receiver at the Clock Link endpoints. Only when a match is found between the clock source and clock receiver, including the protocol, are the clocks activated. Typically the Carrier IPMC performs the clock E-Keying operation, but if an implementation needs the application to conduct the E-Keying operation, the clock activation can be controlled by the application.

¶ 95 To perform the E-Keying function, two types of information are needed. First, the clock interconnect information, which is described by Carrier Clock Point-to-Point Connectivity record, is stored in the Carrier FRU Information. Second, the AMC clock/on-Carrier device clock configuration information, which is described by the Clock Configuration record, is stored in AMC Module or Carrier FRU Information. The clock E-Keying operation includes gathering the clock E-Keying related records from the Carrier FRU Information and AMC Module FRU Information, comparing the clock configurations from the clock receiver and the clock source (clock configuration pair) of the Clock Link, and setting the clock state for both.

¶ 96 Normally the clocks are distributed through multiplexers on the Carrier. For AMC Modules, the Carrier is acting as a clock distribution hub. The clock sources can be routed to a multiplexer on the Carrier and redistributed to different clock receivers. Each Clock Link is a


point-to-point interconnect link between a clock source and a clock receiver utilizing a common protocol. Figure 3-11, “Example of Carrier clock distribution” shows an example of clock distribution interconnections. The on-Carrier clock resources can include an on-Carrier master clock generator, clock multiplexer, etc. Section 6.3, “AMC Clock Interface” provides more detailed information about the clock distribution topology and interconnection diagram. After successful enabling of a clock, an application can use the clock until the clock is disabled.

Figure 3-11 Example of Carrier clock distribution

3.9.2.1 Clock E-Keying process

¶ 97 Similar to the fabric E-Keying process, the clock E-Keying process starts by gathering clock interconnect and configuration information. In order to find a matching clock source and clock receiver (a clock configuration pair), the process goes through a series of steps to compare the clock attributes from the clock receiver and clock source that, when matched, comprise a Clock Link. If a compatible clock source and receiver are found, a “Set Clock State (Enable)” command is issued to the corresponding Carrier IPMCs and/ or MMCs; otherwise, the clocks are disabled. The following steps summarize the clock E-Keying process:

AMC1

AMC2

ClockMultiplexer

ATCA Backplane

On-Carrier Clock Generator

Other on-Carrier device

AMCn

TCLKA

TCLKB

TCLKC

TCLKD

FCLKA

TCLKA

TCLKB

TCLKC

TCLKD

FCLKA

TCLKA

TCLKB

TCLKC

TCLKD

FCLKA

CLK1

CLK2

CLK3B

Carrier

Redundancy Circuits

Redundancy Circuits

CLK3A

CLK1ACLK1B

CLK2ACLK2B


1. Collect the clock connectivity information from the Carrier FRU Information.

2. Collect the clock configuration information from the AMC Modules’ FRU Information and Carrier FRU Information.

3. Work through the clock resources of the next clock configuration pair based on the order of records stored in the FRU Information. If either the clock source or clock receiver is configured for activation by the application, skip to the next clock configuration pair. If the connection between a clock source and a clock receiver passes through another device such as a multiplexer it is considered to be an indirect clock configuration and the connection dependencies need to be resolved. If the clock configuration information cannot be obtained due to an absent dependent resource, skip that clock configuration.

4. Conduct the clock configuration pair matching according to the following steps. A matching clock configuration pair satisfies all the criteria set by these steps. For the case where multiple clock configurations are supported by the clock source and clock receiver, the algorithm or priority for clock configuration matching is implementation defined and outside the scope of this specification. If the clock E-Keying operation is performed by an application rather than the Carrier IPMC, the application must follow the clock E-Keying process outlined in this section in addition to any application spe-cific requirements for matching clock configuration pairs.

a. Compare the clock direction of each clock resource (Clock Asymmetric Match). A clock receiver must connect to a clock source.

b. Compare the clock signal type (Clock Family). The clock protocol must be equal on both ends of the clock configuration pair.

c. Compare the clock accuracy (Clock Accuracy Level). The clock accuracy of the clock source must meet or exceed the clock accuracy of the clock receiver.

d. Compare the clock frequency tolerance (Clock Frequency). The frequency tolerance of the clock source must meet or exceed the frequency tolerance specified by the clock receiver.

5. Clock control commands are issued to the MMC(s) and Carrier IPMC to enable the clock source and/or clock receiver when a matching clock pair is found; otherwise clock control commands are issued to disable the clocks.

6. Repeat the steps from Step 3 for the remaining clock configuration pairs.

¶ 98 Figure 3-12, “Clock E-Keying process flow diagram” outlines the complete clock E-Keying process when a FRU is activated.


Figure 3-12 Clock E-Keying process flow diagram

Collect Carrier clock connectivity information

Collect clock configuration information from relevant Modules

Match the clock attributes for the clock resources (clock configuration pair )1. Clock Asymmetric Match2. Clock Family3. Clock Accuracy Level4. Clock Frequency

Send clock control commands to the Carrier IPMC / MMC(s) to enable the clock source

and clock receiver

Start the clock configuration matching process

Match found?

Resolve clock configuration dependency1. Examine the dependent clock 2. If the dependent clock is connected with a

known clock resource, collect the clock attributes

3. Otherwise skip the configuration, recheck at a later time

Start

End

Send clock control commands to the Carrier IPMC / MMC(s) to disable the clock source

and clock receiver

Next Clock?

Start the clock E-Keying process

Yes

No

Yes

No

No

Yes

Yes

No

Indirect clock used?

Next configuration pair?

Clock activated by the Carrier IPMC?

Yes

Skip the clock ,the application activates it

later

No


3.9.2.2 Carrier clock interconnections

¶ 99 The Carrier Clock Point-to-Point Connectivity record is used to describe a Carrier's clock distribution interconnections among the AMC clocks and on-Carrier devices. The Carrier is required to provide the Carrier Clock Point-to-Point Connectivity record in the Carrier FRU Information. The Carrier Clock Point-to-Point Connectivity record includes a set of Clock Point-to-Point Resource descriptors.Table 3-29, “Carrier Clock Point-to-Point Connectivity record” describes the details of the Carrier Clock Point-to-Point Connectivity record.

Table 3-29 Carrier Clock Point-to-Point Connectivity record

¶ 100 The details of Clock Point-to-Point Resource descriptor are described in Table 3-30, “Clock Point-to-Point Resource descriptor.” Every connection between two clock resources needs to have a Point-to-Point Clock Connection descriptor entry. Potential clock resources include AMC Modules, on-Carrier devices and the ATCA Backplane clocks. The combination of the Clock Resource ID and Clock ID fields identify the clock source and clock receiver that make up a clock configuration pair.



1 1


2 1 Record Length




8 1 PICMG Record ID. For the Carrier Clock Point-to-Point Connectivity record, the value 2Ch must be used.

9 1 Record Format Version. Value 00h must be used.

10 1 Clock Point-to-Point Resource Descriptors Count (m)

11 VariableClock Point-to-Point Resource Descriptors, see Table 3-30, “Clock Point-to-Point Resource descriptor.” The size varies depending on the number of Clock Point-to-Point Resource descriptors (m) and their sizes.


Table 3-30 Clock Point-to-Point Resource descriptor

Table 3-31 Clock Resource ID definition

¶ 101 The Point-to-Point Clock Connection descriptor includes the Clock ID for both local and remote clocks of the clock configuration pair, plus the Clock Resource ID for the remote clock. Each clock resource needs to have a descriptor entry in the record. For AMC clocks and ATCA Backplane clocks, predefined Clock IDs need to be used in the descriptor. For on-Carrier devices, the Clock IDs are implementation defined.

Table 3-32 Point-to-Point Clock Connection descriptor

¶ 102 For AMC clocks, the Clock ID is predefined. Table 3-33, “Predefined Clock IDs for AMC clocks” describes the Clock ID assignment for AMC clocks. For the on-Carrier devices, the Clock ID is assigned by the Carrier implementation within the range of the field. The Clock IDs of the ATCA Backplane clocks are defined in Table 3-34, “Predefined Clock IDs for ATCA Backplane clocks.” CLK1, CLK2, and CLK3 are used for the abstracted redundant ATCA Backplane clocks.


0 1 Clock Resource ID. Refer to Table 3-31, “Clock Resource ID definition” for details.

1 1 Point-to-Point Clock Connection Count. Indicates the number (n) of point-to-point clock connections associated with this Resource.

2 3*nPoint-to-Point Clock Connection Descriptors. An array of Point-to-Point Clock Connection descriptors (see Table 3-32, “Point-to-Point Clock Connection descriptor”).

Bit Offset Definition

7:6 Resource Type

00b = On-Carrier device

01b = AMC Module

10b = Backplane

11b is reserved

5:4 Reserved; write as 0h

3:0 Device Identification; This field is set according to Resource Type and contains one of the following:

On-Carrier device ID, for on-Carrier devices

AMC Site Number, for AMCs

Write as 0h for ATCA Backplane clocks


0 1 Local Clock ID. Indicates the Clock ID for the local resource, see Table 3-33 and Table 3-34 for pre-defined Clock IDs.

1 1 Remote Clock ID. Indicates the Clock ID for a remote resource, see Table 3-33 and Table 3-34 for pre-defined Clock IDs.

2 1 Remote Clock Resource ID. Refer to Table 3-31 for details.


Table 3-33 Predefined Clock IDs for AMC clocks

Table 3-34 Predefined Clock IDs for ATCA Backplane clocks

Requirements

REQ 3.167 Carrier FRU Information shall contain one or more Carrier Clock Point-to-Point Connectivity records as defined in Table 3-29, “Carrier Clock Point-to-Point Connectivity record” for the connections between AMC clocks, on-Carrier devices, and ATCA Backplane clocks. If multiple records are included, the Clock Point-to-Point Resource Descriptor fields shall be treated as different parts of a single Clock Point-to-Point Resource Descriptor list.

REQ 3.168 Each implemented clock shall have a Point-to-Point Clock Connection descriptor in the Carrier Clock Point-to-Point Connectivity record.

REQ 3.169 The Carrier FRU Information may include two Point-to-Point Clock Connection descriptors for each implemented connection in the two Clock Point-to-Point Resource descriptors of the two clock resources (AMC clocks, on-Carrier device or ATCA Backplane clocks) on either end of the connection. Alternatively, the Carrier FRU Information may include only a single Point-to-Point Clock Connection descriptor describing the connection from one of its end points.

REQ 3.170 The Clock IDs for AMC clocks shall be assigned according to Table 3-33, “Predefined Clock IDs for AMC clocks” in Point-to-Point Clock Connection descriptors.

REQ 3.171 The Clock IDs for ATCA Backplane clocks shall be assigned according to Table 3-34, “Predefined Clock IDs for ATCA Backplane clocks” in Point-to-Point Clock Connection descriptors.

Value Description

1 TCLKA

2 TCLKB

3 TCLKC

4 TCLKD

5 FCLKA

Other values Reserved

Value Description

1 CLK1A

2 CLK1B

3 CLK1, is used for CLK1A and CLK1B combination

4 CLK2A

5 CLK2B


7 CLK3A

8 CLK3B


Other values Reserved


3.9.2.3 Clock configuration information

¶ 103 A Clock Configuration record describes the usage of an AMC clock or an on-Carrier device. These supported clock configurations are stored in the AMC Module FRU Information or Carrier FRU Information. If multiple clock configurations are supported for a single clock resource, the order of clock configuration entries represents the preferred order used to find a matching clock. When performing the clock E-Keying operation, there could be other factors to be considered; thus, a clock is not always enabled based on the order of the entries.

¶ 104 In many cases, there will not be sufficient information available during initial clock E-Keying for the Carrier IPMC to determine whether a match is available. In these cases, the Clock Activation Control bit shown in Table 3-36, “Clock Configuration descriptor” can be set to 1 at either the clock source or clock receiver to disable automatic clock E-Keying for that clock. In cases where the Carrier IPMC is expected to determine a match, the Clock Activation Control bit needs to be set to 0 on both ends of the clock configuration pair. Regardless of the setting of this bit, management software can adjust the clock settings through the commands defined in Section 3.9.2.5, “Clock control commands.” Clock E-Keying still serves a purpose in cases where an application determines the proper clock settings by defining a standardized mechanism for upper-level software to use when adjusting clock settings, rather than relying on vendor-specific or proprietary methods for setting up the clocks.

¶ 105 Clock configurations are classified into two categories: direct and indirect. A direct clock configuration involves fixed clock attributes: clock family, clock accuracy level, clock frequency and frequency tolerance. Direct clock configuration is suitable for AMC clocks or on-Carrier devices which can be used as a clock source or receiver. For example, an on-Carrier master clock generator can be described using direct clock configuration.

¶ 106 Indirect clock configuration is used when the clock attributes are defined by another device. Indirect clock configuration is used for devices like multiplexers, which are neither a clock source nor a clock receiver. A multiplexer is a switching device located between the clock source and clock receiver. For such an on-Carrier device, the clock configuration is determined by the clock source or clock receiver to which it is connected. For indirect clock configuration, the attributes of the clock configuration are only valid at the time checked, and could change if checked at a later time. Indirect clock configurations need to be closely tracked for accuracy purposes. When referring to indirect clock configurations, the combination of the Clock Resource ID and the Clock ID serves as a pointer to the attributes of the indirect clock. This indirection needs to be resolved during the clock E-Keying operation.


Table 3-35 Clock Configuration record

Table 3-36 Clock Configuration descriptor

¶ 107 As mentioned earlier, an Indirect Clock descriptor serves as a pointer to another clock resource that is linked to its clock resource, eventually to the endpoint making up the clock configuration pair. The PLL Connection field of an Indirect Clock descriptor indicates if the hardware connection between the clock configuration pair identified via Clock ID and Dependent Clock ID involves a PLL device or not. Some applications require the clock signal not to go through multiple PLLs. The PLL information in the records can be used by an application to determine if any PLL needs to be bypassed. It is beyond the scope of this specification to determine how to use a PLL. The Clock Asymmetric Match field is used to indicate whether the clock is a clock source or clock receiver. The clock designated by the



1 1


2 1 Record Length



5 3 Manufacturer ID. Least significant byte first. Write as the three byte ID assigned to PICMG. For this specification, the value 12634 (00315Ah) must be used.

8 1 PICMG Record ID. For the Clock Configuration record, the value 2Dh must be used.

9 1 Record Format Version. The value 00h must be used.

10 1 Clock Resource ID. Refer to Table 3-31, “Clock Resource ID definition” for details. For AMC resources, this field is ignored and must be FFh.

11 1 Clock Configuration Descriptors Count

12 Variable Clock Configuration Descriptors, see Table 3-36, “Clock Configuration descriptor.”


0 1Clock ID. Indicates the Clock ID on the described resource, see Table 3-33, “Predefined Clock IDs for AMC clocks” and Table 3-34, “Predefined Clock IDs for ATCA Backplane clocks” for pre-defined Clock IDs.

1 1

Clock Control[7:1] - Reserved, write as 0h[0] - Clock Activation Control 0b = Activated by Carrier IPMC 1b = Activated by application.

2 1 Indirect Clock Descriptors Count (m)

3 1 Direct Clock Descriptors Count (n)

4 2*m Indirect Clock Descriptors, see Table 3-37, “Indirect Clock descriptor.”

4+2*m 15*n Direct Clock Descriptors, see Table 3-38, “Direct Clock descriptor.”


Dependent Clock ID in the Indirect Clock descriptor must have the opposite value for the Clock Asymmetric Match field. Table 3-37, “Indirect Clock descriptor” describes the fields in the Indirect Clock descriptor.

Note: The Phase Locked Loop (PLL) information is not used in the clock E-Keying matching process. How to use the PLL information is application-dependent and outside the scope of this specification. Based upon the clock usage requirements, the application can use the PLL information stored in the FRU Information records and determine if the clock needs to go through the PLL or bypass it.

Table 3-37 Indirect Clock descriptor

¶ 108 Table 3-38, “Direct Clock descriptor” describes the Direct Clock descriptor. The usage of the Clock Features field is the same as in the Indirect Clock descriptor described earlier. The Clock Family field allows the implementation to categorize the clock into different groups, which may have specific ways to define the Clock Accuracy Level. If accuracy is not a concern for the clock, then the “Unspecified” option can be used. The clock tolerance is defined by the range specified with the Minimum Clock Frequency and Maximum Clock Frequency. Direct Clock descriptors can be used to describe ATCA Backplane clock configurations.


0 1

Clock Features[7:2] - Reserved, write as 0h[1] - PLL Connection 1b = Connected through PLL 0b = Not connected through PLL[0] - Clock Asymmetric Match 1b = Clock source 0b = Clock receiver

1 1 Dependent Clock ID. Identifies another clock within the same resource,


Table 3-38 Direct Clock descriptor

Table 3-39 Clock Family definition

¶ 109 Table 3-40, “ Well known AMC clock frequencies” lists clock frequencies used in the telecom industry. Specific values for these frequencies are listed here to avoid rounding errors that could occur if the values are calculated with fewer than the necessary number of significant digits.


0 1

Clock Features

[7:2] - Reserved, write as 0h

[1] - PLL Connection

1b = Connected through PLL

0b = Not connected through PLL

[0] - Clock Asymmetric Match

1b = Clock source.

0b = Clock receiver.

1 1 Clock Family

See Table 3-39, “Clock Family definition.”

2 1 Clock Accuracy Level

This field is defined based on the Clock Family.

3 4 Clock Frequency in Hz. Least significant byte first.

7 4 Minimum Clock Frequency in Hz of the clock tolerance range. Least significant byte first.

11 4 Maximum Clock Frequency in Hz of the clock tolerance range. Least significant byte first.

ID Definition

00h Unspecified

01h SONET/SDH/ PDH

02h Reserved for PCI Express

03h-C8h Reserved

C9h-FFh Vendor defined clock family


Table 3-40 Well known AMC clock frequencies

¶ 110 Table 3-41, “SONET/ SDH Clock accuracy level” lists the clock accuracy specifications defined by ANSI T1.101 and ITU-T G.781. These stratum levels have been universally adopted by the SONET, SDH and PDH standards.

Frequency Frequency Value

Decimal Hex (32-bit)

8 KHz 8,000 00001F40h

1.544 MHz 1,544,000 00178F40h

2.048 MHz 2,048,000 001F4000h

19.44 MHz 19,440,000 0128A180h


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he a

f a

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M s, 72

ed

if ). in

Table 3-41 SONET/ SDH Clock accuracy level

Description Acronym Accuracy Level

ATCA E-Keying

Applicability

ATCA Clock Management applicability

Comments

Stratum 1 PRS 10 No Yes

A Stratum 1 clock is the foundation for all network timing. It is also referred to as a PRor PRC and originates from either a GPS receiver or a Cesium Beam oscillator. Stratu1 clocks distributed throughout the networkare peers of each other, and network nodesderiving timing from different Stratum 1 clocwill interwork without any performance degradation. This is the highest quality clocin the network and is a source of absolute frequency, and as such has no holdover performance or filtering specification.

Synchronized - Traceability Unknown

STU 20 No Yes

A node transmitting an STU quality level is indicating that it is distributing timing from asource that is a Stratum 1, but that does nosupport the exchange of Sync Status Messages (SSM). STU can be considered tequivalent of Stratum 1; however if there is Stratum 1 source that transmits SSM messages, it would be given priority over STU.

Stratum 2 ST2 30 No Yes

A Stratum 2 clock is generally provided for use as a high-level holdover clock on loss oStratum 1 reference clock. This type of oscillator is generally used in BITS clocks toprovide extended holdover capability (~ 2 weeks) when the GPS signal or the Cesiumoscillator providing the Stratum 1 signal is loThis type of clock can also be used in high capacity SONET nodes (OC-48/OC-192) thform part of a SONET ring backhaul topologThe physical oscillator is a Rubidium-baseddevice which is quite large and costly, and irarely used outside the application domainsdescribed above.

Transit Node Clock TNC 40 No Yes

A TNC clock is a European standard providiless holdover stability and filtering than a Stratum 2 clock. It would typically see application in high-capacity SDH backhaul nodes.

Stratum 3E ST3E 50 Yes (preferred) Yes

Stratum 3E clocks are generally found in nodes that subtend backhaul equipment, TDswitching equipment, Digital Cross-connectetc. It offers excellent holdover capability (~hours) and has good noise filtering characteristics when it is in tracking mode. Generally, when a Stratum 3E clock enters holdover, service personnel will be dispatchto the site, however, the holdover performance is good enough that bearer traffic will experience little to no degradationthe service provider chooses not to addressthe issue over a weekend (OPEX reductionThis is the recommended oscillator for use ATCA equipment as the master clock.


ith d

of

3

t

ly

t. d t 3/

to

ly

ify

g at

Requirements

REQ 3.172 AMC FRU Information shall contain one or more Clock Configuration records as defined in Table 3-35, “Clock Configuration record” for the clock configuration implemented on the AMC Module.

Stratum 3 ST3 60 Yes Yes

Stratum 3 clocks offer similar frequency characteristics as Stratum 3E clocks, but wreduced holdover capability (~12 hours) anless stringent noise filtering characteristics when in tracking mode. This type of clock sees application in the same types of equipment as the Stratum 3E. The majority equipment in the field today use Stratum 3 clocks, but with the drive to lower operatingcosts, service providers are increasingly calling for Stratum 3E clocks for their extended holdover performance. A Stratumclock would serve as an alternate clock for use in ATCA master clocks, however, the reduced holdover performance becomes a trade-off between slightly lower material cos(CAPEX) versus the MTTR (OPEX costs) once it has entered holdover (i.e. service personnel need to be dispatched immediateto get the clock out of holdover mode).

SONET Minimum Clock

SMC 70 Yes (preferred) Yes

The SONET Minimum Clock (SMC) is the lowest allowable clock in SONET equipmenIt has poor holdover capability (< 1 hour) anminimal filtering in tracking mode. The intenof this clock is for use in a node behind a ST3E master clock, and allows only for an AISsignal to be recognized at a far-end node. Holdover entry will result in loss of SONET payload for all the affected circuits. Service personnel must be dispatched immediately restore service. This oscillator is often usedon Carrier AdvancedTCA Boards as part ofthe AMC clock distribution with a ST3/3E clock providing the master backplane reference signals.

Stratum 4 ST4 80 No Yes

Stratum 4/4E clocks are intended for use onwith T1/E1 electrical interfaces and have neither holdover or filtering specifications. These clocks are not recommended for useon Carrier AdvancedTCA Boards for local clock distribution to AMC Modules.

DON'T USE for Synchronization

DUS 90 No Yes

DUS is a logical designation intended to notdownstream optical/electrical nodes that under no circumstances can the clock be used for synchronization purposes. It is generally used to prevent catastrophic timinloops between nodes and also to indicate ththe clock does not fall under any of the Stratum clock hierarchy categories.

Description Acronym Accuracy Level

ATCA E-Keying

Applicability

ATCA Clock Management applicability

Comments


REQ 3.173 Carrier FRU Information shall contain one or more Clock Configuration records as defined in Table 3-35, “Clock Configuration record” for each implemented on-Carrier clock device and each implemented ATCA Backplane clock.

REQ 3.174 There shall be a single Clock Configuration descriptor for each Clock Resource ID/Clock ID pair, and that Clock Configuration descriptor shall be present in only one Clock Configuration record.

REQ 3.175 Individual Clock Configuration descriptors shall not contain both Indirect Clock descriptors and Direct Clock descriptors. Either Indirect Clock Descriptors Count or Direct Clock Descriptors Count shall be set to zero based on the type of the clock resource.

REQ 3.176 When multiple clock configurations are supported, the listing order of Clock descriptor entries should be treated as the preference order during clock E-Keying operations.

REQ 3.177 When the Clock Activation Control bits on both ends of a clock configuration pair are set to “0”, the Carrier IPMC shall activate the clock source and clock receiver using the “Set Clock State” command, if there is a clock pair match.

REQ 3.178 When the Clock Activation Control bit on either end of a clock configuration pair indicates activation by application (1b); the Carrier IPMC shall not perform the clock E-Keying operation for that clock configuration pair. Clock resource activation by an application-specific clock management function is outside the scope of this specification.

REQ 3.179 The Clock Frequency field of a Direct Clock descriptor describing a clock receiver or clock source should contain the nominal frequency for the clock. Clock frequencies listed in Table 3-40, “ Well known AMC clock frequencies” shall use the associated Frequency Value.

REQ 3.180 To describe the dependency between two clock resources within a clock configuration, the Carrier FRU Information may include two Indirect Clock descriptors to describe the dependency relationship from each clock resource respectively. Alternatively, the Carrier FRU Information may include just one Indirect Clock descriptor to describe such a dependency from one side only.

REQ 3.181 For a given Clock Family, a lower value of the Clock Accuracy Level shall represent higher clock quality.

3.9.2.4 Clock Configuration record examples

¶ 111 The following example describes how Indirect Clock Configuration descriptors are used. Figure 3-13, “Example of Carrier Clock configuration” and Table 3-42, “Example clock resource configuration for Figure 3-13” describe a possible clock distribution for an AMC Carrier AdvancedTCA Board. This example is intended to show a variety of possible clock configurations for use of Indirect clock configuration and does not necessarily conform to the AMC clock usage guidelines stipulated in Section 6, “Interconnect.” A clock multiplexer is used to control the distribution of clocks between AMC clocks, on-Carrier devices and the ATCA Backplane clocks. In the example, we assume the redundancy of ATCA Backplane clocks (CLK1 and CLK2) is managed by other circuits on the Carrier before they are connected to the clock multiplexer. When discussing the ATCA Backplane clocks, CLK1 represents the combination of CLK1A and CLK1B and CLK2 is the combination of CLK2A and CLK2B.


Figure 3-13 Example of Carrier Clock configuration

¶ 112 The Clock Resource ID for the on-Carrier devices as well as the Clock IDs within those devices are implementation defined. In this example, Direct Clock descriptors can be used to describe the AMC Carrier’s MCG (Master Clock Generator) and the ATCA Backplane clocks. The clock multiplexer allows multiple options for a clock source to be connected to a clock receiver or visa versa. Indirect Clock descriptors are used to describe the clock multiplexer resource and the configuration dependencies for clocks that pass through the device. Table 3-42, “Example clock resource configuration for Figure 3-13” describes the example clock resources and their possible configurations.

¶ 113 On the clock multiplexer, the muxCLK1 output is routed from either of the inputs muxCLK11 or muxCLK12 via the multiplexer switch circuits. Using the Indirect Clock descriptor, the Carrier IPMC learns the dependency of muxCLK11 to muxCLK1. Since muxCLK11 is connected with CLK1 (ATCA Backplane clock) the Carrier IPMC can resolve the muxCLK1 dependency by reading the Direct Clock descriptor of CLK1. This is repeated for several Indirect Clock descriptors in the example.

¶ 114 To help the reader understand the Indirect Clock descriptor, Table 3-43, “ Example Indirect Clock descriptor ” provides the details of the Indirect Clock descriptors for selected clocks on the clock multiplexer in this example configuration.

AMC1(Resource ID 41h)

AMC2(Resource ID 42h)

ATCA Backplane

(Resource ID 80h)

TCLKA

TCLKB

TCLKC

TCLKD

FCLKA

TCLKA

TCLKB

TCLKC

TCLKD

FCLKA

muxCLK 1

muxCLK 3

CLK1

Clock Multiplexer (Resource ID 01h)

CLK2

CLK3A

CLK3B

MCG(Resource ID 02h)

1

2

Carrier

Redundancy Circuits

Redundancy Circuits

CLK1ACLK1B

CLK2ACLK2B

CLK3B

CLK3A

muxCLK 11muxCLK 12

muxCLK 13

muxCLK 14

muxCLK 15

muxCLK 16

muxCLK 4

muxCLK 5

muxCLK 6

muxCLK 7

muxCLK 8

muxCLK 10

muxCLK 2

muxCLK 9


Table 3-42 Example clock resource configuration for Figure 3-13

Clock Resource Clock Configuration

ATCA Backplane

CLK1 8 KHz clock source

CLK2 19.44 MHz clock source

CLK3A 1.544 MHz clock receiver

CLK3B 1.544 MHz clock receiver

Master Clock GeneratorMCG 1 100 MHz clock source

MCG 2 50 MHz clock source

Clock Multiplexer

muxCLK 1 Source output routed from muxCLK 11 or 12 on multiplexer

muxCLK 2 Not used

muxCLK 3 Receiver input routed to muxCLK 13 & 6

muxCLK 4 Receiver input routed to muxCLK 6

muxCLK 5 Source output routed from muxCLK 15

muxCLK 6 Source output routed from muxCLK 3 or 4



muxCLK 9 Not used








AMC 1

TCLKA 8 KHz clock receiver

TCLKB Not used

TCLKC 1.544 MHz clock source

TCLKD 2.48 MHz clock source

FCLKA 100 MHz clock receiver

AMC 2

TCLKA 8 KHz clock receiver

TCLKB 19.44 MHz clock receiver

TCLKC 1.544 MHz clock source

TCLKD Not used

FCLKA 50 MHz clock receiver


Table 3-43 Example Indirect Clock descriptor


Clock ID 01h Clock ID = 1 on the clock multiplexer

Clock Control 00h Clock activated by Carrier IPMC

Indirect Clock Descriptors Count 02h Indirect Clock Descriptor Count = 2

Direct Clock Descriptor Count 00h Direct Clock Descriptor Count = 0

Indirect Clock descriptor 1

Clock Features 01h PLL Connection = 0 (Not Connected through PLL), Clock Asymmetric Match = 1 (Clock Source).

Dependent Clock ID 0Bh Dependent Clock ID = 11 on the clock multiplexer


Clock Features 01h PLL Connection = 0 (Not Connected through PLL), Clock Asymmetric Match = 1 (Clock Source).

Dependent Clock ID 0Ch Dependent Clock ID = 12 on the clock multiplexer

……



Indirect Clock Descriptors Count 02h Indirect Clock Descriptors Count = 2

Direct Clock Descriptors Count 00h Direct Clock Descriptors Count = 0


Clock Features 00h PLL Connection = 0 (Not Connected through PLL), Clock Asymmetric Match = 0 (Clock Receiver).

Dependent Clock ID 0Dh Dependent Clock ID = 13 on the clock multiplexer



Dependent Clock ID 06h Dependent Clock ID = 06 on the clock multiplexer

……







Dependent Clock ID

06h Dependent Clock ID = 6 on the clock multiplexer

……Clock ID 0Bh Clock ID = 11 on the clock multiplexer





3.9.2.5 Clock control commands

¶ 115 As the result of the clock E-Keying process, clock sources and clock receivers are enabled or disabled through the “Set Clock State” command. In addition, hardware platform management and applications can get the current clock state information using the “Get Clock State” command. The “Set Clock State” command is defined for the Carrier IPMC or other management functions to enable or disable a clock. The clock control commands provide a standardized mechanism for management software to configure the clocks, rather than relying on prior mechanisms that varied from vendor to vendor or even product to product.

¶ 116 During the clock E-Keying process, if a matching clock configuration pair is found and one or both ends of the pair are AMC clocks, the “Set Clock State” command is sent by the Carrier IPMC to the respective Module(s) to enable the appropriate AMC clock(s). Since on-Carrier clock devices and ATCA Backplane clocks are controlled by the Carrier IPMC via OEM interfaces, the “Set Clock State” command is not necessarily used to enable the clocks of these clock resources. However, the Carrier IPMC must support the “Set Clock State” command in the case where an application configures the clocks.

¶ 117 The “Set Clock State” command includes a Clock Configuration Descriptor Index and other clock attribute information. The Clock Configuration Descriptor Index is used to identify the Indirect or Direct Clock descriptor describing the clock or multiplexer configuration to be enabled. The clock attributes specified in the command fields are provided for information purposes, and are cached for later use (e.g. to return in the “Get Clock State” response). The “Set Clock State” command also provides a method for an application to control the PLL, if such control is desired and supported. An application must use the current clock setting in all other fields of the command when it changes the PLL. If clock E-Keying is performed by the Carrier IPMC, the PLL Control field is always set to 00b (Default State) in the “Set Clock State” command. Table 3-44, “ Set Clock State command” describes the details of this command.



Dependent Clock ID




Dependent Clock ID


……



Table 3-44 Set Clock State command

¶ 118 The “Get Clock State” command is used to query the current state of a clock resource from its respective management controller. For Carriers, the clocks are identified by combining the Clock Resource ID with the Clock ID. For AMC Modules, the AMC clocks are identified by the Clock ID. For any enabled clock, the “Get Clock State” command provides the clock state as well as the clock attributes in the response. If the clock is disabled, the response reports that the clock is disabled with the remaining fields not present. Table 3-45, “ Get Clock State command” describes the details of this command.

Byte Data Field

Request Data 1 PICMG Identifier. Indicates that this is a PICMG®- defined group extension

command. A value of 00h must be used.

2Clock ID. Identifies the clock being configured. See Table 3-33, “Predefined Clock IDs for AMC clocks” and Table 3-34, “Predefined Clock IDs for ATCA Backplane clocks.”

3

Clock Configuration Descriptor IndexThis field identifies one element in an array of Direct or Indirect Clock descriptors in a particular Clock Configuration descriptor. The Clock Configuration descriptor is uniquely identified by the Clock Resource ID field, if present, and the Clock ID.

4

Clock Setting[7:4] Reserved, write as 0h. [3] - Clock State 0b = Disable 1b = Enable[2] - Clock Direction 0b = Clock receiver 1b = Clock source[1:0] - PLL Control 00b = Default state (Command receiver decides the state) 01b = Connect through PLL 10b = Bypass PLL (No action if no PLL used) 11b = Reserved

(5)Clock FamilySee Table 3-39, “Clock Family definition.”Present if the clock is enabled, otherwise absent.

(6)Clock Accuracy Level. This field has different definitions, depending on the Clock Family.Present if the clock is enabled, otherwise absent.

(7-10)Clock Frequency in Hz. Least Significant Byte First.Present if the clock is enabled, otherwise absent.

(11)Clock Resource IDPresent if Clock ID is associated with an on-Carrier device or ATCA Backplane clocks, absent otherwise. See Table 3-31, “Clock Resource ID definition.”


2 PICMG Identifier. Indicates that this is a PICMG®- defined group extension command. A value of 00h must be used.


Table 3-45 Get Clock State command

Requirements

REQ 3.182 Carriers and Modules shall support the “Set Clock State” command defined in Table 3-44, “ Set Clock State command” for all implemented clocks.

REQ 3.183 When the clock E-Keying process is performed by the Carrier IPMC, the PLL Control field in the “Set Clock State” command shall be set to “Default state (00b)”.

Byte Data Field

Request Data

1 PICMG Identifier. Indicates that this is a PICMG®-defined group extension command. A value of 00h must be used

2 Clock ID. Identifies the clock being queried. See Table 3-33, “Predefined Clock IDs for AMC clocks” and Table 3-34, “Predefined Clock IDs for ATCA Backplane clocks.”

(3) Clock Resource IDPresent if Clock ID is associated with an on-Carrier device or ATCA Backplane clocks, absent otherwise. See Table 3-31, “Clock Resource ID definition.”

Response Data

1 Completion Code


3 Clock Setting[7:4] Reserved, write as 0h. [3] - Clock State 0b = Disable 1b = Enable[2] - Clock Direction 0b = Clock receiver 1b = Clock source[1:0] - PLL Control 00b = Default state (Command receiver decides the state) 01b = Connect through PLL 10b = Bypass PLL (No action if no PLL used) 11b = Reserved

(4) Clock Configuration Descriptor IndexPresent if the clock is enabled, otherwise absent.

(5) Clock FamilySee Table 3-39, “Clock Family definition.” Present if the clock is enabled, otherwise absent.

(6) Clock Accuracy LevelPresent if the clock is enabled, otherwise absent. This field is defined based on the Clock Family.

(7-10) Clock Frequency in Hz. Least Significant Byet First. Present if clock is enabled, otherwise absent.


REQ 3.184 The Clock Configuration Descriptor Index in the “Set Clock State” command shall be used to select a clock or multiplexer configuration for the designated clock by referring to an Indirect Clock descriptor or a Direct Clock descriptor, where an index value of 0 refers to the first descriptor, an index of 1 refers to the second descriptor, and so on. Other clock information within the command shall be cached by the command receiver.

REQ 3.185 Carriers and Modules shall set the corresponding clock state based on the “Set Clock State” command. If the frequency specified in the request is out of range, the Carrier IPMC/ MMC shall return the “Parameter out of range in Request (C9h)” Completion Code. If any other parameter specified in the request is not supported, The Carrier IPMC/ MMC shall return the “Invalid data field in Request (CCh)” Completion Code.

REQ 3.186 Carriers and Modules shall support the “Get Clock State” command defined in Table 3-45, “ Get Clock State command.” If the designated clock resource has no clock enabled, Carriers and Modules shall indicate the clock as “Disabled” in the Clock State field.

REQ 3.187 In response to the “Get Clock State” command, if the clock enabled on the designated clock resource is described by an Indirect Clock descriptor, the cached clock information previously received in a “Set Clock State” command shall be returned.

REQ 3.188 Indirect clock source dependencies shall be resolved during the clock E-Keying process for any clock.

REQ 3.189 The Clock Asymmetric Match field shall be treated as matching when one end of a clock configuration pair is configured as a “Clock source” and the other end is configured as a “Clock receiver”.

REQ 3.190 The Clock Family field shall be equal on both ends of a clock configuration pair to be treated as matching. When the Clock Family of the clock receiver is set to 00h (Unspecified), the clock configuration pair shall always be treated as matching.

REQ 3.191 The Clock Accuracy Level field of a clock receiver shall contain a value that is greater than or equal to the value in the Clock Accuracy Level field of the respective clock source to be treated as matching.

REQ 3.192 The Maximum Clock Frequency of a clock receiver shall be greater than or equal to the Maximum Clock Frequency of the respective clock source, and the Minimum Clock Frequency of the clock receiver shall be less than or equal to the Minimum Clock Frequency of the respective clock source, to be treated as matching.

REQ 3.193 The Clock Asymmetric Match, Clock Family, Clock Accuracy Level and Clock Frequency fields of both ends of a clock configuration pair shall match in order for the respective clock sources and clock receivers to be enabled during the clock E-Keying process.

3.10 Module Payload control¶ 119 The “FRU Control Capabilities” Command provides a way to query which specific options

an AdvancedMC supports in the “FRU Control” command. These capabilities are expected to be static throughout the life of the AdvancedMC. The “FRU Control (Cold Reset)” variant is mandatory, so the corresponding bit is marked reserved and the System Manager can assume that it is always supported.

¶ 120 The “FRU Control” command provides base level control over the Modules to the Carrier IPMC. Through this command, the Modules can be reset, rebooted, instructed to quiesce, or have its diagnostics initiated. The implementation of these commands will vary, and all command variants with the exception of the “FRU Control (Cold Reset)” and “FRU Control


(Quiesce)” are optional. The “FRU Control” command does not directly change the operational state of the Module as represented by the Carrier IPMC (which is typically M4 or FRU Active).

¶ 121 Table 3-46 provides specifics for the FRU Control command.

Requirements

REQ 3.194 An MMC shall respond to the “FRU Control Capabilities” command defined in Table 3-24 of the PICMG3.0 specification by identifying the optional capabilities of the “FRU Control” command that the Module supports.

REQ 3.100bThe “FRU Control” command should not directly change Modules’ FRU states.

REQ 3.101 Receipt of a “FRU Control (Cold Reset)” command shall cause a hardware reset to its Payload, similar to a power on reset.

REQ 3.102bReceipt of a “FRU Control (Warm Reset)” command on a Module which supports this command shall cause the Module’s Payload to be reset to a stable condition, attempting to preserve its operational state. If this command variant is unsupported, the MMC shall return the “Invalid data field in Request (CCh)” Completion Code.

REQ 3.103 Receipt of a “FRU Control (Graceful Reboot)” command on a Module which supports this command shall initiate a graceful shutdown and reboot of its Payload operating system. If this command variant is unsupported, the MMC shall return the “Invalid data field in Request (CCh)” Completion Code.

REQ 3.104 Receipt of a “FRU Control (Issue Diagnostic Interrupt)” command on a Module which supports this command shall trigger a diagnostic interrupt to the Module’s Payload. If this command variant is unsupported, the MMC shall return the “Invalid data field in Request (CCh)” Completion Code.

REQ 3.105bOn receipt of the “FRU Control (Quiesce)” command, the MMC shall take appropriate action (implementation specific) to bring the Payload to a quiesced state and shall send a Module Hot Swap (Quiesced) event message to the Carrier IPMC.

Table 3-46 FRU Control command

Byte Data field


2 FRU Device ID. Since MMC local FRU ID is always 0, this field is ignored and should be set to 0.

3

FRU Control Options are:00h = Cold Reset01h = Warm Reset02h = Graceful Reboot03h = Issue Diagnostic Interrupt04h = Quiesce05h – FFh = Reserved




REQ 3.38 If the watchdog timer or the negation of ENABLE# resets the MMC, the Payload state shall not be impacted.

3.11 Module sensor management¶ 122 MMCs have the capability of supporting any of the IPMI or OEM sensor types (analogous to

an IPM Controller on an AdvancedTCA Board). The MMC’s sensors on IPMB-L are visible to the Shelf Manager through the Carrier IPMC over IPMB-0. Since the IPMC must present unique sensor numbers and sensor Logical Unit Numbers (LUNs) over IPMB-0, it is necessary for the Carrier IPMC to translate the MMC’s sensor number and sensor LUN to Carrier IPMC-wide unique numbers. The Carrier IPMC device SDR repository holds a combination of its own SDRs and SDRs from the installed Module’s MMC. The Carrier IPMC adds the MMC’s SDRs into its SDR Repository after Management Power (MP) has been enabled to the MMC. Conversely, the MMC’s SDRs are removed from the Carrier IPMC’s SDR repository after Management Power (MP) has been removed from an MMC. As mentioned previously, when a Carrier IPMC adds the MMC’s SDRs into its SDR repository, it needs to ensure that the sensor number and sensor LUN assigned are unique to the Carrier IPMC.

¶ 123 The Carrier IPMC will also need to provide unique FRU IDs for all Modules installed in a Carrier. The local FRU ID for an MMC is always 0; the IPMC will need to assign unique FRU IDs to all MMCs. MMC SDRs are linked with a Module using the entity fields of the SDR; the entity ID identifies that SDR as coming from a Module FRU and the entity instance is set to the AdvancedMC Site Number + 60h, to identify the Module on the Carrier. See Table 3-2, “Geographic Address, IPMB-L address, and AdvancedMC Slot ID” for Site Numbers. 60h is added to make the entity instance device-relative, in accordance with Section 3.4.3 in the PICMG 3.0 Specification. Refer to this section of the AdvancedTCA specification and to Chapter 33.1 of the IPMI specification for more information on IPMI entities.

¶ 124 The Carrier IPMC can maintain a table for the translation of the Carrier IPMC-wide unique sensor number, sensor LUN, and FRU ID to the MMC’s sensor number, sensor LUN, and FRU ID. When a Carrier IPMC receives a request over IPMB-0 for an MMC’s sensor or FRU data, the Carrier IPMC substitutes the received sensor number, sensor LUN, or FRU ID with the target MMC’s sensor number, sensor LUN, or FRU ID and sends the request over the IPMB-L to the MMC. The Carrier IPMC then returns the requested data substituting the MMC’s identifying data with the Carrier IPMC’s identifying data. The Carrier IPMC is also responsible for redirecting events generated on IPMB-L to the Shelf event receiver on IPMB-0. In doing so, the Carrier IPMC substitutes the event generator ID with its own ID and substitutes the sensor number and sensor LUN from the received message with the Carrier IPMC-wide unique sensor number and sensor LUN. The message is then transmitted over IPMB-0.

3.11.1 Module SDR requirementsRequirements

REQ 3.106 The MMC shall support IPMI commands “Get Device SDR Info”, “Get Device SDR” and “Reserve Device SDR Repository”. (See Chapter 29 of the IPMI specification.)


REQ 3.107 The MMC Device SDR shall have a static sensor population. (See Table 29-2 of the IPMI specification.) The number of MMC SDRs is fixed. All MMC sensors shall be assigned to LUN 0.

REQ 3.108 The MMC shall use AdvancedMC Module entity ID C1h for all device SDRs.

REQ 3.109 The MMC shall use its own Site Number + 60h as a device-relative entity instance number.

REQ 3.110 Each MMC shall have one management controller device locator (SDR type 12h).

REQ 3.111 The MMC shall not have FRU locator records (SDR type 11h) as only one FRU may be represented by one MMC.

REQ 3.112 The MMC shall not expect any Init Agent action from the Carrier IPMC.

REQ 3.113 The MMC shall initialize its sensors, set the event receiver address to 20h and event receiver LUN to 0 on reset.

3.11.2 Carrier IPMC SDR requirementsRequirements

REQ 3.114b The Carrier IPMC shall merge the Module device SDRs with its Device SDR Repository after the Module starts responding to “Get Device ID” commands. The IPMC may delay applying Management Power (MP) or asserting ENABLE# to additional Modules until the merge process is complete with the current Module.

REQ 3.115 The Carrier IPMC Device SDR shall use AdvancedMC Module entity ID C1h and AdvancedMC Site Number + 60h (see Table 3-2, “Geographic Address, IPMB-L address, and AdvancedMC Slot ID”) as device-relative entity instances for all Module SDRs. The Carrier IPMC SDR repository shall use its IPMC IPMB-0 address as sensor owner ID/ device slave address for all SDRs.

REQ 3.116 The Carrier IPMC shall convert MMC device locator records to FRU device locator records in the Carrier IPMC device SDR.

REQ 3.195 When merging the AMC’s SDRs, the Carrier IPMC shall ensure that MMC Module Hot Swap sensor (F2h) SDRs are substituted with appropriate FRU Hot Swap sensor (F0h) SDRs in the Carrier IPMC device SDR.

REQ 3.117b Since it is possible that the Carrier has managed FRUs other than Modules, the Carrier IPMC shall identify all managed FRUs on the Carrier using unique FRU Device IDs as described in the PICMG 3.0 Specification. Management SW shall not assume that AdvancedMC Slot Site Numbers directly map to FRU Device IDs.

REQ 3.118 The Module FRU Device Locator records cached by the Carrier IPMC shall reflect the FRU Device ID assigned by the Carrier IPMC.

REQ 3.119b The Carrier IPMC shall not send a Module M0 to M1 transition event message to the Shelf Manager’s event receiver until it finishes Module SDR merging.

REQ 3.120 The Carrier IPMC may disable event message generation by the Module via the Set Event Receiver command until completion of Module SDR merging. The Carrier IPMC shall enable Module event generation after completing the merge using the IPMI “Set Event Receiver” command.

REQ 3.121 The Carrier IPMC Device SDR Repository shall assign unique sensor numbers to all merged Module sensors. The Carrier IPMC shall retain mapping information for the original Module sensor number, LUN, and IPMB-L address.


REQ 3.122 Sensor number and sensor LUN representation in the Carrier IPMC device SDR repository shall be preserved when other Module sensors are merged as a result of additional Hot Swap operations. The sensor numbers of removed sensors may be reused.

REQ 3.123 The Carrier IPMC device SDR sensor numbering should be preserved in case of Carrier IPMC resets caused by watchdog or IPMI reset commands. If a Carrier IPMC’s device SDR sensor numbering changes because of IPMC resets, IPMC designer shall implement an system event sensor type and shall send an system reconfigured event message to the event receiver (Shelf Manager). This event message can be used by Shelf Managers to initiate process to read Device SDRs from the IPMC, as the sensor numbers for any present Modules may have changed. Refer to IPMI Specification, Section 36.2 for information on system event sensor type (type 12h).

REQ 3.124bWhen PS1# of an AMC Slot deactivates, the Carrier IPMC shall remove the Module SDRs of the respective Module from the Carrier IPMC Device SDR repository. SDRs with an entity instance field equal to that AMC Slot’s AdvancedMC Site Number + 60h shall be removed.

REQ 3.196 The Carrier IPMC device SDR repository shall not change if the MMC is reset via the negation of ENABLE# or via a watchdog reset.

REQ 3.125 The Carrier IPMC device SDR repository shall report a dynamic sensor population. (See Table 29-2 in the IPMI specification.) The number and order of the Carrier IPMC SDRs may change.

REQ 3.126bThe Carrier IPMC shall forward sensor commands received through IPMB-0 to the Module if the command is addressed to a Module sensor. The Carrier IPMC shall reformat forwarded commands and use the Module IPMB-L address, sensor number, sensor LUN, and FRU ID.

REQ 3.127 The Carrier IPMC shall forward sensor command responses from the Module to the source of the original command. The Carrier IPMC shall reformat forwarded replies using the IPMB-0 address and sensor number and sensor LUN from the Carrier IPMC device SDR.

REQ 3.128 The Carrier IPMC shall forward Module sensor events, except for Module Hot Swap events, from IPMB-L to the Shelf event receiver. The Carrier IPMC shall reformat forwarded events and use the IPMB-0 address and sensor number and sensor LUN from the Carrier IPMC device SDR.

REQ 3.129 The Carrier IPMC shall forward event acknowledgements from the Shelf event receiver to the Module. The Carrier IPMC shall reformat forwarded acknowledgements and substitute the Module’s IPMB-L address and sensor LUN.

REQ 3.130bThe AdvancedTCA “Get Device Locator Record ID” command, as implemented by the Carrier IPMC, shall return the converted FRU device locator record ID from the Carrier IPMC device SDR repository or Completion Code “Destination unavailable (D3h)” if the designated Module is not installed or ENABLE# to the Module is inactive, or SDR merging is not completed.

REQ 3.131 The Carrier IPMC shall implement the extended form of the “Get Device Locator Record ID” command defined in Table 3-47, “Get Device Locator Record ID.”

REQ 3.132 If the optional bytes 3-4 of the “Get Device Locator Record ID” command are present, the command shall return the record IDs for the next sequential SDR associated with the FRU Device ID designated in the request and contained in the Carrier IPMC device SDR repository. The SDR record ID may change if a Carrier IPMC Device SDR reservation is cancelled (see Chapter 27.11.2 of the IPMI specification).


¶ 125 Table 3-47 shows the particulars for the “Get Device Locator Record ID” command.

3.12 FRU Information¶ 126 All Carriers and Modules must contain a FRU Information storage device (for instance, an

SEEPROM) that contains information about capabilities (e.g. E-Keying) and inventory data. The format of the FRU Information follows the requirements set forth in Section 3.6.3, IPM Controller FRU Information, in the PICMG 3.0 Specification. In addition to this basic information, additional records are required to support functions unique to the Modules.

¶ 127 Chapters 1.6.11 through 1.6.14 of the IPMI specification provide an overview of FRU Information principles and implementations. While the IPMI specification highly recommends that each IPMC implement the “FRU Inventory Device” commands, this document makes that a requirement of each MMC.

¶ 128 The term Field Replaceable Unit (FRU) is used to reference a unit that can be replaced by customers in the field. All Modules are FRUs.

¶ 129 The term FRU Information refers to information stored within the Module or Carrier in some non-volatile storage location. For instance, it could be contained in a SEEPROM within the unit. In all cases, the FRU Information is accessed through a controller that communicates with the non-volatile storage within the FRU to read and write data.

Table 3-47 Get Device Locator Record ID

Byte Data field


2

FRU Device ID. This contains the FRU Device ID to use when returning the Record ID. A value of zero returns the “Management Controller Device Locator Record” ID. A value between 1 and Max FRU Device ID (see Table 3-9, “Get PICMG Properties command“) in the PICMG 3.0 Specification returns the “FRU Device Locator Record” ID. As per the IPMI specification, a value of FFh is reserved. If bytes 3 and 4 are used in Request data, the FRU Device ID identifies which FRU device Record ID is retrieved.

(3-4)(Optional) Record ID, Least significant first. Contains the Record ID for the appropriate SDR. 0000h returns the first record for given FRU device ID.



3

Record ID LSB. Contains the least significant byte of the record ID for the appropriate device locator SDR or the record ID for the next SDR if bytes 3 and 4 are used in request data. The ‘Last Record ID’ value (FFFFh) is used if an appropriate SDR is not present.

4

Record ID MSB. Contains the most significant byte of the record ID for the appropriate device locator SDR or the record ID for the next SDR if bytes 3 and 4 are used in request data. The ‘Last Record ID’ value (FFFFh) is used if an appropriate SDR is not present.


3.12.1 FRU Information access commands¶ 130 Access to read or write a Module’s FRU Information is provided by three IPMI commands

designating the FRU Device ID that represents the corresponding AdvancedMC Slot on the Carrier. FRU Device IDs corresponding to particular Modules can be identified by scanning the Carrier IPMC device SDR repository for device locator records (Type 11h) with entity ID fields set to C1h (Advanced Mezzanine Card). These records represent Modules and their entity instance fields identify the Site Number in which they are installed. The Carrier IPMC is responsible for forwarding any FRU Inventory Device IPMI commands that are directed to these FRU Device IDs on to the proper MMCs via IPMB-L. The Carrier IPMC is also responsible for tracking and sending back the corresponding responses.

¶ 131 Refer to the Platform Management FRU Information Storage Definition document for the details of the IPMI FRU Information data structures referenced in the following requirements (including the Product Info, Multi-Record Info, Board Info, Chassis Info, and Internal Use Areas).

3.12.1.1 Carrier FRU Information requirements

Requirements

REQ 3.133 The Carrier shall implement the point-to-point E-Keying connectivity records as defined in Section 3.9, “E-Keying.”

REQ 3.134 The Carrier shall implement the records defined in Section 3.7, “Power management.”

REQ 3.135 The Carrier shall implement the Carrier Information Table as defined in Section 3.2, “Module management interconnects.”

REQ 3.136bThe Carrier FRU Information shall be accessed via the Carrier’s FRU ID 0.

REQ 3.137 The Carrier shall forward the FRU Inventory Device IPMI commands (specified in Chapter 28 of the IPMI specification), that are directed to FRU Device IDs on the Carrier representing Modules, to the corresponding MMCs (FRU Device ID 0 of the MMCs) via IPMB-L; the Carrier shall also track the corresponding responses and send them to the originators of the requests.

3.12.1.2 MMC requirements

Requirements

REQ 3.138 The MMC shall support the “FRU Inventory Device” commands specified in Chapter 28 of the IPMI specification.

REQ 3.139 Module FRU Information shall be available when MP is available.

REQ 3.140 The entity updating the Module FRU Information shall be responsible for updating all appropriate checksums as well.

REQ 3.141 The MMC may write protect data in the Module storage area and return a Completion Code of “write protected offset (80h)” for a command that attempts to change such data.

REQ 3.142 If an MMC implements write protected data, it shall do it by areas (Board Info, Product Info, etc.) with the exception of the multi-record area where it shall implement write protection at the record level.

REQ 3.143 If an MMC implements write protected multi-record data, it shall allow moving a record to a new offset (without any change to the data). That is, the size or number of


records prior to a particular record may change and it may be necessary for system management software to move a record without changing its contents. The MMC shall allow this, but may confirm that the data has not been changed.

REQ 3.144 MMC FRU Information shall meet the requirements in Chapter 3.6.3 of the IPMI specification.

REQ 3.145 The MMC shall implement the relevant records defined in Section 3.7, “Power management” and Section 3.9, “E-Keying.”

REQ 3.146 All Modules that are sold as independent products shall fill in all predefined fields in Product Info Area record, as this is the only location where product version number is defined.

REQ 3.147 Every MMC shall place the MultiRecords defined by this specification in its MultiRecord Info Area.

REQ 3.148 Any MMC may place private data in the Internal Use Area and/or MultiRecord Info Area.

3.13 Explicit message bridging¶ 132 A Carrier IPMC represents its Modules to the Shelf Manager and in most contexts the Shelf

Manager does not need to concern itself with the existence of IPMB-L and the fact that each Module is itself represented by an MMC. For instance, sensors on all the Carrier's Modules are included in the Carrier IPMC’s Device SDRs so the Shelf Manager issues “Get Sensor Reading” commands directly to the Carrier IPMC, which (for Module-owned sensors) transparently bridges that command to the Module where that sensor is implemented. If the Shelf Manager needs to communicate with an MMC in areas where transparent bridging is not supported, explicit bridging via the “Send Message” command must be used. For instance, to confirm the revision of the PICMG extensions for MMCs that is supported by a particular Module, the Shelf Manager uses the “Send Message” command to send a “Get PICMG Properties” command to the relevant MMC. Similarly, the “Send Message” command can be used by an MMC to bridge an IPMI message through the Carrier IPMC to the Shelf Manager. All Carrier IPMCs must support the “Send Message” IPMI command in both bridging directions.

¶ 133 System Managers communicating with an MMC using RMCP must encapsulate a Send Message within another Send Message. The IPMI message has to be bridged from the LAN channel to IPMB-0 by the Shelf Manager and then from IPMB-0 to IPMB-L by Carrier IPMC. This reduces the maximum message size of an encapsulated IPMI message sent by the System Manager to an MMC. After subtracting the overhead of the two Send Message wrappers, IPMI messages from a System Manager to an MMC are limited to a maximum length of 17 bytes.

¶ 134 The remainder of this subsection explains how a “Send Message” command issued to a Carrier IPMC can be used to bridge an IPMI command to an MMC via IPMB-L or to the Shelf Manager via IPMB-0, and provides corresponding specific requirements.


3.13.1 Discovery of IPMB-L addresses¶ 135 The first challenge is getting the IPMB-L addresses for AdvancedMCs of interest so that

messages can be addressed to them. IPMB-L address spaces on Carriers are distinct from each other and from the IPMB-0 address space.

¶ 136 The Shelf Manager or other Shelf entities can discover the IPMB-L address of an AdvancedMC represented by a Carrier IPMC by using the “Get Address Info” command as follows:

1. Compose a “Get Address Info” request containing the FRU Device ID representing the target AdvancedMC Module.

2. Send this request to the relevant Carrier IPMC. The Carrier IPMC returns the AdvancedMC Site Number for that AdvancedMC.

3. Convert the AdvancedMC Site Number to the IPMB-L address according to Table 3-2.

¶ 137 The overall message flow described in the next subsection uses the IPMB-L address resulting the above steps.

3.13.2 Message flows and requirements¶ 138 Commands originating from the Shelf Manager (or other entity that can talk to the Carrier

IPMC via IPMB-0) and directly targeting a Module need to traverse through two physical channels, as shown in Figure 3-13, “Example of Carrier Clock configuration.” Refer to the IPMI specification for relevant background on this topic: Section 6.12.3 and 6.12.4 on the response tracking variant of the “Send Message” command, and Section 6.2 on IPMI’s channel model. Commands originating from a Module to the Shelf Manager traverse through the same two physical channels, but with the request originating from the Module instead of the Shelf Manager. Since this form of message bridging is very similar to the example in shown in Figure 3-14, “Message bridging” , it is not shown in this specification.

¶ 139 The main IPMB (IPMB-0 in AdvancedTCA) is always channel 0 in IPMI. This specification requires that IPMB-L be implemented as channel 7. As the figure shows, the MMC-targeted request first passes across IPMB-0 (encapsulated within a “Send Message” command, as detailed below). The Carrier IPMC strips the “Send Message” encapsulation and issues the command to the target MMC. The MMC’s response returns across IPMB-L to the Carrier IPMC, which passes it back over IPMB-0 to the Shelf Manager.

¶ 140 The Carrier IPMC also supports message bridging to the Shelf Manager from an MMC. When the Carrier IPMC receives a “Send Message” command to IPMI messaging Channel 0 from an MMC, it extracts the message and redirects the command to the Shelf Manager over IPMB-0. If the Shelf Manager’s response is received, the Carrier IPMC reformats the response and sends it to the MMC.


Figure 3-14 Message bridging

¶ 141 The format of a “Send Message” command encapsulating a message that needs to be bridged from IPMB-0 to IPMB-L is shown in Table 3-48).

Carrier IPMC

ShelfManager

MMC

IPMB - 0 (Channel 0)

IPM

B-L (Channel 7)

ATCA Shelf

ATCA Board

AMC

1) Request to MMC

4) Response from MMC

2) Re-routed request to M

MC

3) Response from

MM

Cisolator

MMCAMC

isolator

MMCAMC

isolator

MMCAMC

isolator


Table 3-48 Send Message request

¶ 142 Upon receiving a “Send Message” request from the Shelf Manager, the Carrier IPMC parses it, performs validation checks, stores the “Send Message” header and sends the encapsulated message to IPMB-L on behalf of itself (i.e. substitutes the requester address with 20h).

¶ 143 Having done that, the Carrier IPMC waits for the responder to send a command response to the encapsulated message over IPMB-L. If it happens within a fixed period of time, the Carrier IPMC sends a reply, encapsulating the received response, to the original sender of the “Send Message” command, as detailed in Table 3-49.

Byte No. Field(s) Value

1 rsSA IPMB-0 address of the Carrier IPMC

2 netFn / rsLUN 18h (netFn = 06h, rsLUN =0)

3 Checksum for bytes 1 through 2 Calculated by the request sender

4 rqSA IPMB-0 address of the request sender

5 rqSeq / rqLUN Sender-specific, filled in by the request sender

6 Cmd 34h

7 Tracking/ Channel Number 47h (Tracking = 01h [Track Request], Channel number = 07h)

Encapsulated message

8 rsSA IPMB-L address of the target AMC

9 netFn / rsLUN Command-specific, filled in by the request sender

10 Checksum for bytes 8 through 9 Calculated by the request sender

11 rqSA IPMB-L address of the Carrier IPMC, filled in by the Carrier IPMC

12 rqSeq / rqLUN Sequence number and LUN of the Carrier IPMC, filled in by the Carrier IPMC

13 Cmd Command-specific, filled in by the request sender

14 - N Optional data Command-specific, filled in by the request sender

N + 1 Checksum for bytes 11 through N

Filled in by the request sender, re-calculated by the Carrier IPMC after substi-tuting the rqSA, rqSeq, and rqLUN fields with its own IPMB-L address, sequence number, and LUN.

End of encapsulated message

N + 2 Checksum for bytes 4 through (N + 1) Filled in by the request sender


Table 3-49 Send Message reply

¶ 144 If the Carrier IPMC does not receive a timely response, it sends a “Send Message” command reply containing the C3h (Timeout) completion code and no encapsulated message to the original sender of the “Send Message” command.

Requirements

REQ 3.149 Carrier IPMCs shall support the “Send Message” command with response tracking.

REQ 3.150 The size of IPMI messages transmitted over IPMB-0 or IPMB-L shall not exceed 32 bytes.

REQ 3.151 Carrier IPMCs and MMCs shall implement IPMB-L as IPMI messaging channel number 7.

Byte No. Field(s) Value

1 rqSA IPMB-0 address of the “Send Message” request sender

2 netFn / rqLUN netFn = 07h, rqLUN is taken from the Send Message Request

3 Checksum for bytes 1 through 2 Calculated by the Carrier IPMC

4 rsSA IPMB-0 address of the Carrier IPMC

5 rqSeq / rsLUN rsLUN = 0, rqSeq is taken from the “Send Message” request

6 Cmd 34h

7 Completion Code 00h

Encapsulated reply

8 rqSA IPMB-L address of the Carrier IPMC

9 netFn / rqLUN Filled by the MMC using the contents of the message bridged from IPMB-0 to IPMB-L

10 Checksum for bytes 8 through 9 Calculated by the MMC

11 rsSA IPMB-L address of the AMC, filled in by the MMC

12 rqSeq / rsLUN Taken from the message bridged from IPMB-0 to IPMB-L

13 Cmd Taken from the message bridged from IPMB-0 to IPMB-L

14 - N Optional data Command-specific, filled in by the MMC

N + 1 Checksum for bytes 11 through N Calculated by the MMC

End of encapsulated message

N + 2 Checksum for bytes 4 through (N + 1) Calculated by the Carrier IPMC


REQ 3.197 A Carrier IPMC shall send a “Send Message” command reply containing C3h (timeout) Completion Code if it does not receive a timely (within the IPMI command response time) response from the MMC.

REQ 3.198 Carrier IPMCs shall bridge a “Send Message” command that targets IPMI messaging Channel 0 to IPMB-0. The intent is to allow an MMC to send a message to the Shelf Manager.

REQ 3.199 Carrier IPMCs shall return a Completion Code of C9h (Parameter out of range) for a “Send Message” command that targets IPMI messaging Channel 0 when received over IPMB-0 or IPMI messaging Channel 7 when received over IPMB-L.

REQ 3.152bCarrier IPMCs shall send a “Send Message” command reply containing D3h (Destination unavailable) if the designated Module is not installed or ENABLE# to the Module is inactive.

3.14 AMC.0 FRU records, sensors, and entity IDs¶ 145 This section summarizes the FRU records and additional IPMI sensors defined by PICMG®

AMC.0. These records and sensors are to be used as described in the respective tables and sections cross-referenced in Table 3-50 and Table 3-51.

¶ 146 This section also summarizes the PICMG AMC.0 entity ID assignments in Table 3-52, “PICMG AMC.0 entity IDs.” For context, see Section 3.11.2, “Carrier IPMC SDR requirements.”

Table 3-50 PICMG AMC.0 FRU records: type ID = C0h (OEM)

Record description PICMG AMC.0 PICMG record ID Record present in

Module Current Requirements

Table 3-10, “Module Current Requirements record” 16h Module FRU

Carrier Activation and Current Management

Table 3-11, “Carrier Activation and Current Management record”

17h Carrier FRU

Carrier Point-to-Point Connectivity

Table 3-13, “Carrier Point-to-Point Connectivity record” 18h Carrier FRU

AMC Point-to-Point Connectivity

Table 3-16, “AdvancedMC Point-to-Point Connectivity record” 19h Carrier FRU and

Module FRU

Carrier Information Table

Table 3-3, “Carrier Information Table” 1Ah Carrier FRU

Carrier Clock Point-to-Point Connectivity

Table 3-29, “Carrier Clock Point-to-Point Connectivity record” 2Ch Carrier FRU

Clock configuration Table 3-35, “Clock Configuration record” 2Dh Carrier FRU and

Module FRU


3.15 IPMI functions and commands¶ 147 This section contains annotated and augmented versions of tables from the IPMI

specification and the PICMG 3.0 Specification that are used in that specification to summarize the function and command requirements (using the notation “M” for Mandatory, “O” for Optional and “O/M” for Optional/Mandatory). The designation “O/M” is used in a similar manner as in the IPMI specifications: to designate functionality that is mandatory if certain conditions apply and optional otherwise.

3.15.1 Required Carrier IPMC and MMC functions¶ 148 Table 3-53 summarizes the major required and optional functions for a Carrier IPMC and an

MMC, with the corresponding requirements on an IPMI Baseboard Management Controller (BMC) for comparison. For each functional area, the table shows whether it is mandatory (M), or optional (O).

Table 3-51 PICMG AMC.0 sensors: Event/ reading type code = sensor specific (6Fh)

Sensor description PICMG AMC.0 Sensor type code

Module Hot Swap Table 3-8, “Module Hot Swap event message” F2h

Table 3-52 PICMG AMC.0 entity IDs

Entity type description Entity ID

PICMG AMC Module C1h

Table 3-53 IPMI, BMC, Carrier, and Module IPM functions

Function IPMI BMC req.

Carrier IPMC req.

ModuleMMC req. Supplementary comments

IPM Device M M M

System Interface (BT, KCS, or SMIC) M O O

This specification does not mandate that IPMC or MMC support any of the standard IPMI System Interfaces.

SDR repository M O O

IPMB Interface O M M

IPMB-Local or IPMB-L is required. (See Section 3.4, “Module hardware requirements for management” and Section 3.5, “Carrier hardware requirements for management.” )

Watchdog timer M O OModule has a watchdog Timer for resetting the MMC, but there are no required timers that are exposed by the MMC for other consumers.


Event receiver M M O The Carrier contains the event receiver for all Modules located on the Carrier.

SEL Interface M O O

FRU inventory M M M Each MMC must support FRU data access.

Initialization Agent M M MIndividual MMCs are responsible for initializing the event generation and sensors on the local FRU(s).

Sensors O M M MMCs must support all implemented temperature sensors.

Internal event generation M O O Whether the MMC generates internal events is an

implementation choice.

External event generation O M M The MMCs must be able to send events over the

IPMB-L.

PCI Management Bus Interface O O O

LAN messaging O O O

LAN alerting O O O

Serial messaging O O O

Basic mode M M O

PPP mode O O O

Terminal mode O O O

Direct connect mode M M O

Modem con-nect mode O O O

Bridging support O/M M O

Dial page O O O

PPP alerting O O O

Callback O O O

Basic mode callback M M O

PPP mode call-back O O O

CBCP callback O O O

Platform Event Filtering (PEF) and alert policies

O/M O/M O

Table 3-53 IPMI, BMC, Carrier, and Module IPM functions (Continued)


Carrier IPMC req.



3.15.2 Command assignments¶ 149 Table 3-54 lists the commands defined in the IPMI specification and in this specification.

Each command is grouped by general function, with an indication of whether the command is mandatory (M), (NA) not applicable and not implemented, or optional (O) for: 1) IPMI BMCs, 2) Module MMCs, and 3) Carrier IPMCs. Unless otherwise specified, the listed IPMI commands, if supported, must be accessible through LUN 00b and on IPMB. This table is based on the corresponding set of tables spread through the sections of the IPMI specification that define command requirements for each of the general functions.

PICMG® 3.0 commands NA

Refer to Table 3-54 for the PICMG 3.0 and AMC.0 commands that Carrier IPMCs and MMCs must implement.

Table 3-53 IPMI, BMC, Carrier, and Module IPM functions (Continued)


Carrier IPMC req.


Table 3-54 Command number assignments and requirements

Spec reference NetFn CMD

IPMIBMCreq.

CarrierIPMC req.

Module MMC req.

Module Payload

req

IPMI spec section

IPM Device “Global” Commands M M M M

Get Device ID 17.1 App 01h M M M M

Cold Reset 17.2 App 02h O[3] O[3] O O

Warm Reset 17.3 App 03h O O O O

Get Self Test Results 17.4 App 04h M M O O

Manufacturing Test On 17.5 App 05h O O O O

Set ACPI Power State 17.6 App 06h O O O O

Get ACPI Power State 17.7 App 07h O[3] O[3] O O

Get Device GUID 17.8 App 08h O O O O

Broadcast “Get Device ID”[1] 17.9 App 01h O/M M[3,4] M[3,4] NA

BMC Watchdog Timer Commands M M O O

Reset Watchdog Timer 21.5 App 22h M M O O

Set Watchdog Timer 21.6 App 24h M M O O

Get Watchdog Timer 21.7 App 25h M M O O


BMC Device and Messaging Commands[5] M O O O

Set BMC Global Enables 18.1 App 2Eh M O/M[5] O O

Get BMC Global Enables 18.2 App 2Fh M O/M[5] O O

Clear Message Flags 18.3 App 30h M O/M[5] O O

Get Message Flags 18.4 App 31h M O/M[5] O O

Enable Message Channel Receive 18.5 App 32h O O O O

Get Message 18.6 App 33h M O/M[5,6] O O

Send Message 18.7 App 34h M M O O

Read Event Message Buffer 18.8 App 35h O O O O

Get BT Interface Capabilities 18.9 App 36h M O/M[3,5] O O

Master Write-Read 18.10 App 52h M O/M[3,5] O O

Get System GUID 18.13 App 37h O O[3] O O

Get Channel Authentication Capabilities 18.12 App 38h O O[3] O O

Get Session Challenge 18.14 App 39h O O[3] O O

Activate Session 18.15 App 3Ah O O[3] O O

Set Session Privilege Level 18.16 App 3Bh O O[3] O O

Close Session 18.17 App 3Ch O O[3] O O

Get Session Info 18.18 App 3Dh O O[3] O O

Get AuthCode 18.19 App 3Fh O O O O

Set Channel Access 18.20 App 40h O O[3] O O

Get Channel Access 18.21 App 41h O O[3] O O

Get Channel Info 18.22 App 42h O O[3] O O

Set User Access 18.23 App 43h O O[3] O O

Get User Access 18.24 App 44h O O[3] O O

Set User Name 18.25 App 45h O O[3] O O

Get User Name 18.26 App 46h O O[3] O O

Set User Password 18.27 App 47h O O[3] O O

Chassis Device Commands O O O O

Table 3-54 Command number assignments and requirements (Continued)


IPMIBMCreq.

CarrierIPMC req.

Module MMC req.

Module Payload

req


Get Chassis Capabilities 22.1 Chassis 00h M O O O

Get Chassis Status 22.2 Chassis 01h O/M[3] O O O

Chassis Control 22.3 Chassis 02h O/M[3] O O O

Chassis Reset 22.4 Chassis 03h O O O O

Chassis Identify 22.5 Chassis 04h O O O O

Set Chassis Capabilities 22.6 Chassis 05h O O O O

Set Power Restore Policy 22.7 Chassis 06h O O O O

Get System Restart Cause 22.9 Chassis 07h O[3] O[3] O O

Set System Boot Options 22.10 Chassis 08h O[3] O[3] O O

Get System Boot Options 22.11 Chassis 09h O[3] O[3] O O

Get POH Counter 22.12 Chassis 0Fh O O O O

Event Commands M M M M

Set Event Receiver 23.1 S/E 00h M M M M

Get Event Receiver 23.2 S/E 01h M M M M

Platform Event (a.k.a. “Event Message”) 23.3 S/E 02h M M M M

PEF and Alerting Commands O O O O

Get PEF Capabilities 24.1 S/E 10h M[3] M[3] O O

Arm PEF Postpone Timer 24.2 S/E 11h M[3] M[3] O O

Set PEF Configuration Parameters 24.3 S/E 12h M[3] M[3] O O

Get PEF Configuration Parameters 24.4 S/E 13h M[3] M[3] O O

Set Last Processed Event ID 24.5 S/E 14h M[3] M[3] O O

Get Last Processed Event ID 24.6 S/E 15h M[3] M[3] O O

Alert Immediate 24.7 S/E 16h O[3] O[3] O O

PET Acknowledge 24.8 S/E 17h O[3] O[3] O O

Sensor Device Commands O M M M

Get Device SDR Info 29.2 S/E 20h O M M M

Get Device SDR 29.3 S/E 21h O[3] M[3] M[3] M[3]

Reserve Device SDR Repository 29.4 S/E 22h O[3] M[3] M M



IPMIBMCreq.

CarrierIPMC req.

Module MMC req.

Module Payload

req


Get Sensor Reading Factors 29.5 S/E 23h O[3] O[3] O[3] O[3]

Set Sensor Hysteresis 29.6 S/E 24h O O O O

Get Sensor Hysteresis 29.7 S/E 25h O O O O

Set Sensor Threshold 29.8 S/E 26h O O O O

Get Sensor Threshold 29.9 S/E 27h O[3] O[3] O O

Set Sensor Event Enable 29.10 S/E 28h O O O O

Get Sensor Event Enable 29.11 S/E 29h O[3] O[3] O[3] O[3]

Re-arm Sensor Events 29.12 S/E 2Ah O[3] O[3] O[3] O[3]

Get Sensor Event Status 29.13 S/E 2Bh O O O O

Get Sensor Reading 29.14 S/E 2Dh M M M M

Set Sensor Type 29.15 S/E 2Eh O O O O

Get Sensor Type 29.16 S/E 2Fh O[3] O[3] O[3] O[3]

FRU Device Commands M M M M

Get FRU Inventory Area Info 28.1 Storage 10h M M M M

Read FRU Data 28.2 Storage 11h M M M M

Write FRU Data 28.3 Storage 12h M M M M

SDR Device Commands M O O O

Get SDR Repository Info 27.9 Storage 20h M M O O

Get SDR Repository Allocation Info 27.10 Storage 21h O O O O

Reserve SDR Repository 27.11 Storage 22h M M O O

Get SDR 27.12 Storage 23h M[3] M[3] O O

Add SDR 27.13 Storage 24h M[3] O/M[3,5] O O

Partial Add SDR 27.14 Storage 25h M[3] O/M[3,5] O O

Delete SDR 27.15 Storage 26h O[3] O[3] O O

Clear SDR Repository 27.16 Storage 27h M[3] O/M[3,5] O O

Get SDR Repository Time 27.17 Storage 28h O/M[3] O/M[3] O O

Set SDR Repository Time 27.18 Storage 29h O/M[3] O/M[3] O O

Enter SDR Repository Update Mode 27.19 Storage 2Ah O[3] O[3] O O



IPMIBMCreq.

CarrierIPMC req.

Module MMC req.

Module Payload

req


Exit SDR Repository Update Mode 27.20 Storage 2Bh M[3] M[3] O O

Run Initialization Agent 27.21 Storage 2Ch O[3] O[3] O O

SEL Device Commands M O O O

Get SEL Info 25.2 Storage 40h M M O O

Get SEL Allocation Info 25.3 Storage 41h O O O O

Reserve SEL 25.4 Storage 42h O[3] O[3] O O

Get SEL Entry 25.5 Storage 43h M M O O

Add SEL Entry 25.6 Storage 44h M[3] M[3] O O

Partial Add SEL Entry 25.7 Storage 45h M[3] M[3] O O

Delete SEL Entry 25.8 Storage 46h O O O O

Clear SEL 25.9 Storage 47h M M O O

Get SEL Time 25.10 Storage 48h M M O O

Set SEL Time 25.11 Storage 49h M M O O

Get Auxiliary Log Status 25.12 Storage 5Ah O O O O

Set Auxiliary Log Status 25.13 Storage 5Bh O[3] O[3] O O

LAN Device Commands O O O O

Set LAN Configuration Parameters 19.1 Transport 01h O/M[3] O/M[3] O O

Get LAN Configuration Parameters 19.2 Transport 02h O/M[3] O/M[3] O O

Suspend BMC ARPs 19.3 Transport 03h O/M[3] O/M[3] O O

Get IP/UDP/RMCP Statistics 19.4 Transport 04h O O O O

Serial/Modem Device Commands O O O O

Set Serial/Modem Configuration 20.1 Transport 10h O/M[3] O/M[3] O O

Get Serial/Modem Configuration 20.2 Transport 11h O/M[3] O/M[3] O O

Set Serial/Modem Mux 20.3 Transport 12h O[3] O[3] O O

Get TAP Response Codes 20.4 Transport 13h O[3] O[3] O O

Set PPP UDP Proxy Transmit Data 20.5 Transport 14h O[3] O[3] O O

Get PPP UDP Proxy Transmit Data 20.6 Transport 15h O[3] O[3] O O



IPMIBMCreq.

CarrierIPMC req.

Module MMC req.

Module Payload

req


Send PPP UDP Proxy Packet 20.7 Transport 16h O[3] O[3] O O

Get PPP UDP Proxy Receive Data 20.8 Transport 17h O[3] O[3] O O

Serial/Modem Connection Active 20.9 Transport 18h O/M[3] O/M[3] O O

Callback 20.10 Transport 19h O O O O

Set User Callback Options 20.11 Transport 1Ah O[3] O[3] O O

Get User Callback Options 20.12 Transport 1Bh O[3] O[3] O O

Bridge Management Commands (ICMB)[2] O O O O

Get Bridge State [ICMB] Bridge 00h O/M[2] O O O

Set Bridge State [ICMB] Bridge 01h O/M[2] O O O

Get ICMB Address [ICMB] Bridge 02h O/M[2] O O O

Set ICMB Address [ICMB] Bridge 03h O/M[2] O O O

Set Bridge Proxy Address [ICMB] Bridge 04h O/M[2] O O O

Get Bridge Statistics [ICMB] Bridge 05h O/M[2] O O O

Get ICMB Capabilities [ICMB] Bridge 06h O/M[2] O O O

Clear Bridge Statistics [ICMB] Bridge 08h O/M[2] O O O

Get Bridge Proxy Address [ICMB] Bridge 09h O/M[2] O O O

Get ICMB Connector Info [ICMB] Bridge 0Ah O/M[2] O O O

Get ICMB Connection ID [ICMB] Bridge 0Bh O/M[2] O O O

Send ICMB Connection ID [ICMB] Bridge 0Ch O/M[2] O O O

Discovery Commands (ICMB)[2] O O O O

Prepare For Discovery [ICMB] Bridge 10h O/M[2] O O O

Get Addresses [ICMB] Bridge 11h O/M[2] O O O

Set Discovered [ICMB] Bridge 12h O/M[2] O O O

Get Chassis Device ID [ICMB] Bridge 13h O/M[2] O O O

Set Chassis Device ID [ICMB] Bridge 14h O/M[2] O O O

Bridging Commands (ICMB)[2] O O O O

Bridge Request [ICMB] Bridge 20h O/M[2] O O O

Bridge Message [ICMB] Bridge 21h O/M[2] O O O

Event Commands (ICMB)[2] O O O O



IPMIBMCreq.

CarrierIPMC req.

Module MMC req.

Module Payload

req


Get Event Count [ICMB] Bridge 30h O/M[2] O O O

Set Event Destination [ICMB] Bridge 31h O/M[2] O O O

Set Event Reception State [ICMB] Bridge 32h O/M[2] O O O

Send ICMB Event Message [ICMB] Bridge 33h O/M[2] O O O

Get Event Destination [ICMB] Bridge 34h O/M[2] O O O

Get Event Reception State [ICMB] Bridge 35h O/M[2] O O O

OEM Commands for Bridge NetFn O O O O

OEM Commands [ICMB] Bridge C0h- FEh O/M[2] O O O

Other Bridge Commands O O O O

Error Report [ICMB] Bridge FFh O/M[2] O O O

AdvancedTCA[7] PICMG 3.0 Table M M M

Get PICMG Properties 3-9 PICMG 00h M M M

Get Address Info 3-8 PICMG 01h M[9] NA NA

Get Shelf Address Info 3-13 PICMG 02h O NA NA

Set Shelf Address Info 3-14 PICMG 03h O NA NA

FRU Control 3-22 PICMG 04h M M[13] M[13]

Get FRU LED Properties 3-24 PICMG 05h M M M

Get LED Color Capabilities 3-25 PICMG 06h M M M

Set FRU LED State 3-26 PICMG 07h M M M

Get FRU LED State 3-27 PICMG 08h M M M

Set IPMB State 3-52 PICMG 09h M NA NA

Set FRU Activation Policy 3-17 PICMG 0Ah M NA NA

Get FRU Activation Policy 3-18 PICMG 0Bh M NA NA

Set FRU Activation 3-16 PICMG 0Ch M NA NA

Get Device Locator Record ID 3-29 PICMG 0Dh M M M

Set Port State 3-42 PICMG 0Eh O/M[10] NA NA

Get Port State 3-43 PICMG 0Fh O/M[10] NA NA

Compute Power Properties 3-61 PICMG 10h M NA NA



IPMIBMCreq.

CarrierIPMC req.

Module MMC req.

Module Payload

req


Table notes:1 This command is sent using the broadcast format on IPMB-0 and IPMB-L. See command description for details.2 See ICMB specification for details. If an ICMB is implemented, then these commands are mandatory.3 Additional constraints apply, see appropriate IPMI specification for details.4 PICMG® 3.0 requires IPMB-0 (Channel 0) for ShMC to IPMC communication; AMC.0 requires IPMB-L (Channel 7) for Car-

rier IPMC to MMC communication.5 PICMG® 3.0 does not require the implementation of any of the three IPMI-defined System Interfaces (KCS, SMIC, or BT)

on any IPMC, including an ShMC. PICMG® 3.0 designates the interface between an IPMC and its Payload as the Payload interface but does not constrain the implementation of that interface. If any of the IPMI-defined system interfaces are imple-mented, these commands are mandatory. These comments also apply to the interface between the MMC and Payload on a Module.

6 These commands are required if a System Manager interface or other Channels are supported.7 All PICMG® specific request commands use the NetFN 2Ch with the PICMG® identifier 00h. The response uses NetFN 2Dh

Set Power Level 3-63 PICMG 11h M NA NA

Get Power Level 3-62 PICMG 12h M NA NA

Renegotiate Power 3-67 PICMG 13h O NA NA

Get Fan Speed Properties 3-64 PICMG 14h M[8] NA NA

Set Fan Level 3-66 PICMG 15h O/M[8] NA NA

Get Fan Level 3-65 PICMG 16h O/M[8] NA NA

Bused Resource 3-45 PICMG 17h O/M[11] NA NA

Get IPMB Link Info 3-50 PICMG 18h O/M[12] NA NA

Get Shelf Manager IPMB Address 3-34 PICMG 1Bh NA NA NA

Set Fan Policy 3-84 PICMG 1Ch NA NA NA

Get Fan Policy 3-85 PICMG 1Dh NA NA NA

FRU Control Capabilities 3-24 PICMG IEh M M M

FRU Inventory Device Lock Control 3-37 PICMG IFh O O O

FRU Inventory Device Write 3-38 PICMG 20h O O O

Get Shelf Manager IP Addresses 3-32 PICMG 21h O O O

Get Shelf Power Allocation 3-80 PICMG 22h NA NA NA

AMC AMC.0 Table

Set AMC Port State Table 3-27 PICMG 19h O/M[14] O/M[14] NA

Get AMC Port State Table 3-28 PICMG 1Ah O/M[14] O/M[14] O/M[14]

Set Clock State Table 3-44 PICMG 2Ch O/M[15] O/M[15] NA

Get Clock State Table 3-45 PICMG 2Dh O/M[15] O/M[15] O/M[15]



IPMIBMCreq.

CarrierIPMC req.

Module MMC req.

Module Payload

req


with the PICMG® identifier 00h.8 These commands are required by the IPMCs that control Shelf fans.9 IPMCs are only required to support a subset of this command. (See Section 3.2.3, “Addressing” in the PICMG 3.0 Specifi-

cation.) Carrier IPMC must implement extensions defined in Table 3-5.10 These commands are only mandatory for boards that implement E-Keying-governed interfaces.11 These commands are only mandatory for boards that implement E-Keying-governed shared bus interfaces, namely the Syn-

chronization clocks and metallic test bus.12 Mandatory for IPMCs that incorporate an IPMB-0 Hub.13 FRU device ID is ignored and should be set to 0 (See Section 3.10, “Module Payload control”). The “FRU Control” command

is extended in Table 3-46 of this specification.14 These commands are Mandatory for IPMCs and MMCs supporting the Fabric interface governed by E-Keying.15 These commands are Mandatory for IPMCs and MMCs supporting the Clock Channel governed by E-Keying.

¶ 150 The IPMI commands listed above use the privilege levels defined in the IPMI specification in Appendix G, Table G-1, with a single exception. Privilege levels for the AdvancedTCA commands defined above are provided in the PICMG 3.0 specification. The following table contains the minimum privilege levels for the AdvancedMC commands and describes the modified AdvancedMC requirement for the minimum privilege level for the “Send Message” command.

Table 3-55 Command privilege levels

Command Minimum privilege level

BMC device and messaging commands

Send Message

For channel #0 (IPMI): The minimum privilege level of the message contained in the Send Message command For channel #15 (System Interface): User For other channels: Operator

AdvancedMC commands

Set AMC Port State Operator

Get AMC Port State User

Set Clock State Operator

Get Clock State User


Power distribution 4

¶ 1 The purpose of this section is to describe the specifications for features and components required to support the Advanced Mezzanine Card (AMC), such as:

• Payload Power

• Management Power

• AMC Module power interface

• AMC Connector

• AMC Backend Power distribution

¶ 2 Standard Carrier Board features outside the scope of this document include power source isolation, safety grounding, backplane interface, limiting inrush current, providing over-current protection, and steady state operational current.

4.1 Overview¶ 3 The power distribution required to support AMCs on the Carrier includes power sources for

both Payload Power and Management Power. Figure 4-1, “Power distribution block diagram” shows the major components comprising the power distribution system.

Figure 4-1 Power distribution block diagram

¶ 4 AMC uses single 12V Payload Power, which can be converted on the Module to any voltage required. Single Payload Power voltage helps to minimize number of power pins. This also accounts for the supply voltages migrating to lower and lower voltages as chip geometries shrink. This approach has the additional advantage of lending itself to a point of load (POL)

CarrierModule

GND

GND

Management Power (MP)

GND

GND

Carrier’s AMC Management Power

Source

Extended Side

Management Signals Management Signals

AMC Backend Power Distribution

Payload Power (PWR) Carrier’s AMC Payload

Power Source

AMC Connector

Basic Side

AMC Module(s) Power Interfaces

Management Power (MP)

Payload Power (PWR)


regulated power distribution strategy (to all payload circuits on the Module), which is recommended as a superior design technique. AMC Payload Power distribution is variable and determined by the Module design, as long as it conforms to the requirements of this section.

¶ 5 Management Power needs to be available at the AMCs even if the Carrier Payload Power is not activated. Therefore the Management Power for the Modules must be derived from the Carrier's Management Power.

¶ 6 Different AMC Connector construction techniques will result in some differences in the equivalent circuits of these Connectors. Therefore, to ensure interoperability of Connectors and Modules, it is advised to tie together all Payload Power pins at the AMC Connector on Carriers and Modules.

Requirements

REQ 4.38 The Carrier shall be able to enable Management Power to the Module Bays independent of Carrier Payload Power.

4.2 Modules¶ 7 Upon surprise extraction, Carrier circuitry is designed to immediately disable Payload Power

in order to avoid permanent damage to Module Power Contacts. This shown in Figure 4-2, “Module power interface” where the Presence signal PS1# must be active to enable Payload Power.

4.2.1 Payload PowerRequirements

REQ 4.2 The eight edge contacts of the AMC Module contacting to the Payload Power pins of the AMC Connector (2, 9, 18, 27, 42, 57, 72 and 84) shall be connected together on the Module with equal impedances that do not differ by more than 20% to ensure that the current flow is equal within ± 20%.

REQ 4.3 The Module shall be designed so that sudden power loss to the Module shall not cause permanent damage to the Module.

4.2.1.1 Power

¶ 8 The Payload Power dissipation can be estimated, measured, or both based on FRU data. Measuring has the added value of an indicator of the health of the Module. Due to thermal design requirements and the limitations of the power supply connections, a maximum value is defined for the Module power consumption.

Requirements

REQ 4.4b The average power consumed by an AMC Module during a 25 ms duration shall not exceed 80 W. This shall apply to all size versions of Single and Double AMC Modules. The value includes all power drawn from the PWR and the MP connections.

REQ 4.39 The Module PWR input capacitance shall not exceed 800μF.


REQ 4.40 The AMC Module should provide an input capacitance of at least 0.5µF on Payload Power per W of its maximum Payload Power requirement.

4.2.1.2 Voltage

¶ 9 Payload Power (PWR) voltage is specified with wide tolerances in order to allow the usage of DC-DC converters with higher efficiency.

Requirements

REQ 4.5 The AMC Module shall operate with Payload Power (PWR) in the range of 10 V to 14 V.

4.2.2 Management Power¶ 10 Module management subsystem is powered by Module Management Power (MP). The

Module is ensured via requirements to the Carrier that Payload Power is only available if Management Power is available.

Requirements

REQ 4.6b The Modules shall not draw more than 150 mA current from MP.

REQ 4.41 The Module MP input capacitance shall not exceed 150μF.

REQ 4.7b Circuitry on the Module shall be designed in order to tolerate up to 500 mA of Management Power (even under fault conditions) to the MMC and associated circuitry.

REQ 4.9 Modules shall operate normally with MP voltage within a range of 3.3V ± 0.3V.

4.2.3 Grounding

4.2.3.1 Logic Ground

¶ 11 Logic Ground fulfills several specific tasks. It is the common return for Management Power and Payload Power, it is the reference potential for the single ended logic signaling, and it is also used as high frequency shielding between the differential pair signals in the AMC Connector.

Requirements

REQ 4.11 A Module shall have a DC resistance of greater than 100 MΩ. between Logic Ground and Shelf Ground as measured with a 100 V test voltage.

REQ 4.12 Modules should provide a mechanism for an installer configurable, low impedance connection between Logic Ground and Shelf Ground in the vicinity of the Face Plate. Impedance value is application specific.

4.2.3.2 Shelf Ground

¶ 12 The Module Shelf Ground circuit at a minimum will include the Module Face Plate, the LED/ Face Plate support bracket, the Module Latch Mechanism/ support bracket, the ESD Segment 3 and a 10 MΩ resistor which connects to ESD Segment 1. The Module Shelf Ground circuit is connected to Carrier Shelf Ground via Face Plate mounting connections


and ESD Segment 3/ ESD Contact, which is mounted on the strut and is part of Carrier Shelf Grounded components. The Module EMC Gasket conducts directly to adjacent Modules, Carriers and/ or Boards. Refer to Section 4.5, “Gasket and Face Plate Shielding” for shielding requirements.

4.3 Carriers

4.3.1 Payload Power¶ 13 A Carrier can limit the power it provides to each AMC Slot to any value below the limits set

in this section.

Requirements

REQ 4.13 The eight contact pads connecting to the Payload Power pins of the AMC Connector (2, 9, 18, 27, 42, 57, 72 and 84) shall be connected together on the Carrier with equal impedances that do not differ by more than 20% to ensure that the current flow is equal within ± 20%.

REQ 4.14 Payload Power circuitry shall be independent for each AMC Slot on the Carrier Board.

4.3.1.1 Voltage

¶ 14 It is recommended that Payload Power voltage be designed at the higher end of the specified voltage range under no load conditions so that under high load conditions the current will be as low as possible.

Requirements

REQ 4.15b The Payload Power voltage shall be at least 10.8 V and not more than 13.2 V at the Module contacts under all loads.

REQ 4.16b The Payload Power output noise level (over its entire output current range while driving a resistive load) shall not be greater than 200 mV, peak to peak.

4.3.1.2 Current

¶ 15 The maximum current value for the Payload Power is derived from a 25% NEBS derating of the connector pin capabilities. The maximum total current equals 1.52 A per pin X 8 pins X 0.75 = 9.12 A. The maximum continuous current limit value is based on the AMC Module’s power limit of 80 W. At the minimum supply voltage of 10.8 V, the 80 W requires approximately 7.4 A.

Requirements

REQ 4.17b The Carrier shall limit the Payload Power (PWR) current to prevent exceeding 9.1 A. The current limiter for an 80W Slot should be designed for 8.25A±10%.

REQ 4.18b When the Payload Power is in current limit, the current shall be reduced (foldback current limited) to less than 0.6 A within 1 second.

REQ 4.19 Payload Power management may be augmented by the use of current measurement circuit which would provide registers accessible to the IPMC.


REQ 4.20b The Carrier shall not enable Payload Power to a Slot unless the Management Power control circuitry for the Slot measured MP to be in its operational voltage range and signaled this via the assertion of the “MP GOOD” signal.

4.3.2 Management Power¶ 16 Current limiting on the Carrier is required to prevent defective Modules from bringing down

the other Modules on the Carrier. Since the current and resistances are quite low, it is possible to implement a Carrier design which will not require separate regulators for each AMC Slot. However, isolation of each AMC power management interface is required. So each Module source must be individually current limited on the Carrier. The Carrier power is determined indirectly by the fraction of total power that is consumed by the Modules. As an example, eight Modules would directly consume 4 W, which would be subtracted from the total power budgeted for the Carrier.

Requirements

REQ 4.1 Module Management Power shall be derived from the Carrier Management Power source.

REQ 4.21 The Management Power voltage measured on the AMC at the connector shall be +3.3 V ± 5%.

REQ 4.22b The Carrier shall guarantee that the MP current to an AMC Slot never exceeds the AMC Connector’s current capacity for the MP contact and never exceeds 500m A (even under fault conditions).

REQ 4.42 The Carrier shall provide at least 165 mA of MP current to an AMC Slot.

REQ 4.43 The Carrier should disable Management Power (MP) to a Slot if PS1# is negated, signaling that no Module is installed.

4.3.3 GroundingRequirements

REQ 4.23b A Carrier with no Modules installed shall have a DC resistance of greater than 100 MΩ between Logic Ground and Shelf Ground as measured with a 100 V test voltage.

REQ 4.24b Carriers should provide a mechanism for a manufacturer configurable, low impedance connection between Logic Ground and Shelf Ground in the vicinity of the Face Plate. The impedance value is application specific.

4.3.4 Module power interface¶ 17 Module power interface presented in Figure 4-2, “Module power interface” includes

Management Power (MP) and Payload Power (PWR) current limiters; these two supply voltages need to have power-good indicators so that the system management can detect boot sequence events and nominal operating conditions.

¶ 18 PS0# and PS1# provide for AMC presence detection. Two signals are used to ensure that the Module is fully seated at both ends of the connector. Also, the interface circuitry presented in Figure 4-2, “Module power interface” recurs for every Module-Carrier combination. The power interface also provides an ENABLE# signal which is an open drain signal, driven by


the Carrier and pulled up to MP on the Module. This signal is asserted when the Carrier detects that the Module is fully inserted. The Carrier may additionally cycle ENABLE# to restart the MMC if needed. The MMC is supposed to not execute a payload reset on the Module in this case.

¶ 19 The IPMC might be able to sense the actual amount of Payload Power current flow for any AMC Slot. This allows the IPMC to dynamically respond if an AMC Slot draws more current than the stored value on the FRU ROM. The response of the IPMC could be to inform the Shelf Manager of this or to immediately shut down the offending AMC Slot’s Payload Power.

Figure 4-2 Module power interface

¶ 20 In cases of using multiple different power potentials in the payload hardware of an AMC, and especially if some components require different power potentials (like core voltage and I/O voltage), it is possible that these voltages have to follow specific relations to each other.

¶ 21 Before the Module would report “Module Power Quiescence”, as a last step the local power sequence control will power down the local power domains according to the specific requirements.

Module

IPMC

Carrier

AMC Module Power Distribution

ModuleManagement

Power

10K

Low DropSchottky Diode

ModulePayload Power

Carrier(non-recurring circuit)

Module Management Power source

Carrier Management Power

Payload Power source

MP

ENABLE#

PS1#

PS0#

PWR

AMC Power Interface(recurring circuit for each Slot)

MP GOOD

Presence

Reset

PWR Enable

PWR Current Limit

PWR GOOD

2.2K

MP Current Limit


¶ 22 The case of a surprise extraction, i.e. removing an AMC without waiting for the BLUE LED being turned on, is forbidden. Nevertheless, there are no mechanical precautions to prevent this forbidden case. Without further measures the aforementioned power down sequence cannot be executed, and it is possible that the payload hardware would be damaged permanently by not adhering to the power down sequence. For the purpose of preventing this from happening, the AMC has to detect the surprise extraction as early as possible.

¶ 23 The AMC can detect its extraction by checking whether current flows between the PS0# and PS1# connections. When the current flow is interrupted, at least one of PS0# and PS1# is disconnected, so the Module is being removed. This information can be used to immediately start the power down sequence. At this point the Carrier also detects that the Module is being extracted, so PWR will be switched off. Capacitively stored energy on the Module is still available for a short time thereafter. Designers are cautioned that it is good design practice to ensure that no damage can be done by this stored charge.

Requirements

REQ 4.28b The Carrier Board shall include the logical equivalent circuit to the Payload Power interface as shown in Figure 4-2, “Module power interface” for each AMC Slot.

REQ 4.29 PWR Enable signals shall not change state during IPMC reset or IPMC firmware upgrade operations.

REQ 4.30 PWR Enable shall come up disabled during power-up of the Carrier.

REQ 4.25 MP and PWR shall have current limiters and inrush protection as shown in Figure 4-2, “Module power interface” .

REQ 4.26b The Carrier shall assert the “MP GOOD” signal to the IPMC when the measured Management Power voltage and current are within the required levels specified in Section 4.3.2, “Management Power.”

REQ 4.27b The Carrier shall assert the “PWR GOOD” signal to the IPMC when the measured Payload Power voltage and current are within the required levels specified in Section 4.3.1, “Payload Power.”

REQ 4.44 Modules shall ensure they are not permanently damaged if the Payload Power voltage drops below the Module's functional level, including when the Module experiences a surprise extraction.

4.3.4.1 Hot Swap precautions

¶ 24 Payload Power is controlled by the IPMC and by the presence signal (a series combination of signals: PS0# and PS1# signals). These two signals are the last mate pins on the connector and are present as contacts on each end of the connector. It is essential to protect the Module and the AMC Connector from an AMC extraction or insertion while Payload Power (PWR) is active in order to get full Module life expectancy. Thus, the presence signals’ main purpose is to safeguard that Payload Power is only enabled if the Module is fully seated.

RequirementsREQ 4.32 The Carrier Board’s AMC Hot Swap/current limiter circuit shall accept a control signal

from the IPMC controller, which will enable or disable the Payload Power to the Module.

REQ 4.33b The Carrier Board Hot Swap circuit shall have input from the Module presence signal PS1#, and shall disable Payload Power within 100 μs after PS1# becomes de-asserted.


4.4 ESD protectionFigure 4-3 Module ESD Strip circuitry

¶ 25 ESD discharge is achieved via a sequence of three discharge segments. The first, ESD Segment 1, provides a current limited discharge of the Module Face Plate and other Shelf Ground connected components on the Module to Shelf Ground circuit of the Carrier. The second, ESD Segment 2, provides a current limited discharge of the Module Logic Ground connected components on the Module to Shelf Ground circuit of the Carrier. Then the final discharge segment, ESD Segment 3, provides a low resistance, sub 1Ω connection of the Shelf Ground on the Module to the Shelf Ground circuit of the Carrier.

Note: Carrier ESD Contacts are described in Section 2.3.1, “Card Guides and Struts.”

Requirements

REQ 4.34b The current limiting resistors' value shall be 10 MΩ ± 20% measured at a 2 kV test voltage. The resistors and Module shall remain within specifications following the application of 10 discharges of a 150 pF capacitor pre-charged at 2 kV or a total of 10 discharges of 2 kV applied directly across the resistors' terminals using an IEC61000-4-2 compliant ESD generator in contact mode with an interval of 1 second allowed between the discharges. Resistance and discharge testing shall be performed with the resistors installed on the Module with Logic Ground and Shelf Ground shorted together. Testing shall be performed in both polarities.

REQ 4.35b The Module shall support the three-segment Module ESD Strip described above.

REQ 4.36b The ESD Segments shall be installed as described in Section 2.2.1.4, “Module ESD Strip.”

4.5 Gasket and Face Plate Shielding¶ 26 AMC Modules and Carriers restrict electromagnetic emissions behind their respective Face

Plates, and EMC gaskets are used to seal between these Face Plates. The Modules and Carriers work together to contain the emissions, since emissions from one Module could radiate through the Face Plate of an adjacent Module or Carrier.

¶ 27 When various Modules and Carriers are integrated into systems, it's important that each component provide enough shielding to ensure that the system as a whole can meet typical limits for electromagnetic emissions. This must be true not only when the equipment is new, but when the equipment has been installed and operating for many years. In particular, the EMC gaskets used on Modules and Carriers need to retain a baseline shielding capability.

ESD Segment 3

10 M Ω

ESD Segment 2 ESD Segment 1

10 M Ω


¶ 28 Figure 4-1, “Power distribution block diagram” below shows some of the common criteria that are used to measure key gasket criteria over a 10-year time frame.

¶ 29 After going through the criteria defined above, gaskets need to provide at least the minimum level of shielding shown in Figure 4-4, “Shielding effectiveness.”

Figure 4-4 Shielding effectiveness

¶ 30 Other than the gaskets, the shielding effectiveness of Face Plates doesn't normally degrade over time. However, the full Module (or Carrier) assembly needs to provide some baseline level of shielding effectiveness.

Requirements

REQ 4.45 Gaskets on Modules and Carriers shall meet the minimum shielding effectiveness criteria shown in Figure 4-4, “Shielding effectiveness” after going through the 10-year life tests defined in Table 4-1, “Gasket tests to simulate gasket performance after 10 years” and compressed to 1.53 mm.

Table 4-1 Gasket tests to simulate gasket performance after 10 years

Criteria Specification

Accelerated aging ASTM D845

Duty cycle 400 cycles per ASTM D3886

Compression set ASTM D3574

Minimum Shielding Effectiveness per MIL-DTL-83528C

0102030405060708090

100110120

1 10 100 1000 10000Frequency (MHz)

Shie

ldin

g Ef

fect

iven

ess

(dB

)


REQ 4.46 Module Face Plate assemblies (with connectors, gaskets, etc.) should meet the shielding effectiveness criteria shown in Figure 4-4, “Shielding effectiveness.”

REQ 4.47 Carrier Face Plate assemblies (with Modules, connectors, gaskets, etc.) should meet the shielding effectiveness criteria shown in Figure 4-4, “Shielding effectiveness.”


Thermal 5

5.1 Introduction¶ 1 Thermal design requirements of this sort are relatively new to specifications such as PICMG

3.0 and PICMG AMC.0. They are included here because of the experiences of the committee members in the market. Printed circuit board manufacturers have not been able to create designs with clearly defined capabilities to dissipate heat, and system integrators have not had the necessary thermal data to design a system, mandated by the specifications. This portion of this specification is an attempt to bring a new level of understanding and information exchange to meet this market need.

¶ 2 Being in compliance with the “shall” requirements in this section will not guarantee complete compatibility of Modules and Carriers. The system integrator will be required to evaluate the compatibility/ interoperability of Modules and Carriers involved. Also, in this section alone, compliance with the “should” provisions is intended to provide good evidence of interoperability, but not a guarantee. The committee felt that it was too restrictive for a Module originally designed for unique specific applications to match the features of a general-purpose Module.

¶ 3 Carriers with mezzanine cards are in fact the most challenging thermal design applications and some issues that cause them to be so are:

• Multiple Carrier form factors

• Wide range of Module types

• Higher airflow impedance

• Varying power levels

¶ 4 There are at least two approaches to obtaining the thermal data required in this section: 1) Thermal analysis using Computational Fluid Dynamics modeling tools, such as ICEPAK from Fluent or Flotherm from Flomerics, and 2) Empirical measurement using a wind tunnel. The analysis approach requires specified pressure gradients across Modules or Carriers. Analysis can be carried out early in the design cycle. Empirical measurements also provide values for the pressure across a device for a set of airflows. One advantage of measurements is that the effect of every component on the board is included, provided that any errors introduced by the measurement process are accounted for. Knowing the design pressure will enable the ability to calculate volumetric airflow based on impedance curves of the individual components. Then having determined airflow, heat dissipation and temperature rise can be calculated.


5.1.1 Baseline thermal conditions¶ 5 The derivation and use of Standard Air is described in PICMG 3.0 Section 5.11, “Standard

air (informative).”

Requirements

REQ 5.23 Cooling requirements and capabilities shall be defined using “Standard Air” with the following two conditions:

• Temperature shall be 26oC.

• Water vapor pressure shall be 16800 Pa which is the equivalent of relative humidity of 50% at 26oC at sea level.

Note: Standard air as defined above has a density of 1.2225 kg/m3 and a latent heat of 1006 J/kgoC.

5.2 Airflow volume¶ 6 At any time during the operation of the system the heat produced by the components installed

on the Carrier and the AMCs has to be transferred to the air moved through the system. The thermal energy dissipated in a time unit will be removed from the system in the same time unit by a certain volume of air warmed up by the difference between the ingress air temperature and the egress air temperature. The airflow through the ATCA Slot has to work against the resistance incurred by the formations on the Board and the installed Modules. The resistance corresponds to a pressure drop. The pressure drop is a function of the speed of the air movement. The functional relation can be established via simulation or via measurements on the object. Verification using Computational Fluid Dynamics (CFD) modelling tools or empirical measurement for the specific Module and Carrier combinations is recommended for these applications. See Figure 5-1, “Airflow impedance” for one example of a Slot impedance curve.


Figure 5-1 Airflow impedance

5.2.1 Carrier airflow ¶ 7 Refer to the requirements for Carrier Board baffles in the PICMG3.0 specification.

¶ 8 Carrier airflow paths have significant influence on Module cooling. Depending on the configuration of the Carrier and the installed AMCs, the power dissipation may be extremely unbalanced. The ATCA enclosure provides an equally distributed airflow resource to each ATCA Slot. The Carrier with the installed AMCs should represent a homogenous airflow impedance to maintain a homogenous volumetric airflow along the cross-section of the ATCA Board. In some cases, baffles will be required to force the airflow to remain in a range despite high airflow impedance.

¶ 9 An unbalanced distribution of the power dissipation cannot be repaired by deviating from the uniform airflow pattern. The thermal energy must be distributed on the AMC from the Face Plate to the Connector so that the heat is transferred to the air evenly along the depth of the Module.The Carrier has the responsibility to balance the airflow impedance between the airflow range of the AMC Slot or Bay and the range between the AMC Connectors and the ATCA Backplane.

¶ 10 It is especially important to meet the airflow impedance and exhaust temperature uniformity requirements. When ducted cooling air is blown through a Carrier's cross-section, as shown in Figure 5-2, “Typical airflow pattern” the majority of the air flows through the most open passages, bypassing dense areas of a Carrier. Therefore, multiple AMCs may not be adequately cooled.

0.15

0.2

0.25

0.3

0.35

0.4

0.45

0.5

40

50

60

70

80

90

100

110

120

5 10 15 20 25 30 35 40 45

0.004 0.008 0.012 0.016 0.02

Pres

sure

Dro

p (in

ches

H20

)

Volumetric Flow Rate (CFM)

Volumetric Flow Rate (m3/s)

Pres

sure

Dro

p (P

a)


Figure 5-2 Typical airflow pattern

¶ 11 Figure 5-3, “Using an airflow mitigation device for more even cooling” shows how an adjustable airflow mitigation device can be used to achieve more even temperature uniformity across an entire Carrier. This device can be adjusted to redistribute the cooling airflow so that denser areas of a Carrier receive increased airflow in comparison to the more open areas.

Figure 5-3 Using an airflow mitigation device for more even cooling

Note: Mercury Computer Systems has patents that apply to devices like the “adjustable airflow mitigation device” in Figure 5-3, “Using an airflow mitigation device for more even cooling.” Refer to Section 1.11, “Intellectual property” for additional information.

Multiple AMCs on a Blade

Blad

e

Ducted Air Cross-Section

Maj

ority

of

Cool

ing

Air

Ducted Cooling Air

Adjustable Air Flow Mitigation Device

Ducted Cooling Air

Blad

e

Ducted Air Cross-Section

Even Airflow

Multiple AMCs on a Blade


¶ 12 In the case of the Conventional Carrier, the components mounted on the Carrier between the Face Plate and the AMC Connectors have to enable evenly distributed power dissipation and display an airflow impedance distributed proportionally with the allowed component height.

Figure 5-4 Airflow zones of Modules and Carriers

¶ 13 To assist systems integrators' efforts to assess airflow paths through the Carrier, it is often useful to provide a table showing the Carrier's impedance through each of the five zones outlined in Figure 5-4, “Airflow zones of Modules and Carriers.”

Table 5-1 Carrier airflow impedance values in CFM

¶ 14 This data can also be represented visually.

32.8 34

I/OZONE

34 34 34ZONE A ZONE B ZONE C ZONE D

mm mm mm mm mm

CFM IO Zone Zone A Zone B Zone C Zone D

5 0.204 0.121367 0.127435 0.133807 0.10923

10 0.312669 0.181867 0.19096 0.200508 0.16368

15 0.659535 0.4092 0.42966 0.451143 0.36828

20 1.094338 0.727467 0.76384 0.802032 0.65472

25 1.587768 1.136668 1.193501 1.253176 1.023001

30 2.11051 1.636801 1.718641 1.804573 1.473121


Figure 5-5 Carrier airflow impedance by zone

Figure 5-6 Example cross-sectional plane perpendicular to airflow

0

0.5

1

1.5

2

2.5

0

100

200

300

400

500

600

0 5 10 15 20 25 30 35

0 0.002 0.004 0.006 0.008 0.01 0.012 0.014 0.016

IO ZoneZone AZone BZone CZone D

Pres

sure

Dro

p (in

ches

H2O

)


Pres

sure

Dro

p (P

a)

Volumetric Flow Rate (m3/sec)


Requirements

REQ 5.2 The system integrator shall ensure that the airflow through the Carrier and all installed AMCs ensures the required operational temperatures of the installed components in the defined environment.

REQ 5.3b Carrier documentation should include a table showing Carrier impedance by zone at 5, 10, 15, 20, 25, and 30 CFM through the AMC Bay(s), as demonstrated in Table 5-1, “Carrier airflow impedance values in CFM.” Carrier documentation should also include a graph showing this same information visually. The graph and table should be supplied in both metric (Pa, m3/sec) and imperial (Inches of Water, CFM) units. If provided, the documentation shall include the airflow impedance of a blank AMC PCB with Face Plate installed in each AMC Slot

REQ 5.4b The uniformity of airflow paths' resistance on a Conventional Carrier for the portion under Module(s) should provide an impedance on A, B, C, and D zones that is within ±25% of the average value of the four rear zones (A, B, C, and D), as depicted in Figure 5-4, “Airflow zones of Modules and Carriers.” Note that this constraint is not applied to the I/O zone and it should be met for all Module Bays on the Carrier.

REQ 5.5 Thermal model and/or measured data should be provided as a part of product documentation.

REQ 5.24 In the area adjacent to the AMC Bays, Conventional Carriers should provide at least an average of 30% open area within any cross section perpendicular to the airflow path.

REQ 5.25 Throughout the airflow path outside the AMC Bays, Conventional Carriers should provide 20% to 70% open area within any cross section made perpendicular to the airflow path.

5.2.2 Module airflow¶ 15 As covered in the introduction, it is not possible to provide ‘general purpose’ specifications

for Module cooling. Analysis of the interaction of the airflow of Modules and Carrier is not trivial and the following guidelines do not guarantee results. Air is sticky and at the velocities we encounter virtually incompressible. Airflow vectors are 3 dimensional adding to the complication.

¶ 16 A Module can be placed in any position in a Carrier. The air entering the Module may be laminar, turbulent or in a transition state between laminar and turbulent. There may also be eddies from the previous Module. Analysis in this area requires that all the components are modelled. This is difficult and computationally demanding. Component placement is critical. Some large components do not need cooling but they will restrict airflow and could mask the following components. Component height is a factor as air can be directed above following components. Large heat sinks must be carefully chosen both for their effectiveness as well as the effect on following components. It may be useful to consider larger than normal heatsinks for airflow uniformity reasons, in addition to the typical considerations of heat dissipation.

¶ 17 Though the AMC.0 specification allows any Module to draw and dissipate up to 80 W regardless of size, such a high dissipation level may not be viable for all Module sizes. In addition, Carriers can limit the amount of power allotted to Modules to a lesser value; this is handled through the IPMI subsystem as described in Section 3.7, “Power management.” A first-order approximation of AMC Module thermal density compared with 200 W AdvancedTCA Boards gives a rough idea of what Module dissipation may be reasonable in AMC Carrier AdvancedTCA Boards.


Table 5-2 Representative Module power dissipation

¶ 18 To assist systems integrators' efforts to assess airflow paths through each Module, it is often useful to provide a table showing the Module's impedance through each of the five zones outlined in Figure 5-7, “Module airflow impedance by zone.” .

¶ 19 This data can also be represented visually:

Figure 5-7 Module airflow impedance by zone

Single Double

Compact 24 48

Mid-size 30 60

Full-size 48 80

CFM IO Zone Zone A Zone B Zone C Zone D

5 0.068 0.030342 0.031859 0.033452 0.027308

10 0.104223 0.045467 0.04774 0.050127 0.04092

15 0.219845 0.1023 0.107415 0.112786 0.09207

20 0.364779 0.181867 0.19096 0.200508 0.16368

25 0.529256 0.284167 0.298375 0.313294 0.25575

30 0.703503 0.4092 0.42966 0.451143 0.36828

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0

40

80

120

160

0 5 10 15 20 25 30 35

0 0.002 0.004 0.006 0.008 0.01 0.012 0.014 0.016

IO ZoneZone AZone BZone CZone D

Pres

sure

Dro

p (in

ches

H2O

)


Volumetric Flow Rate (m3/sec)

Pres

sure

Dro

p (P

a)


Requirements

REQ 5.6b Module documentation should include a table showing Module impedance by zone at 5, 10, 15, 20, 25, and 30 CFM through an AMC Bay, as demonstrated in Table 5-1, “Carrier airflow impedance values in CFM.” Module documentation should also include a graph showing this same information visually. The graph and table should be supplied in both metric (Pa, m3/sec) and imperial (Inches of Water, CFM) units. If provided, the documentation for Compact and Mid-size Modules shall include the airflow impedance of a blank Carrier PCB with Face Plate with the AMC Module installed in the B Slot connection.

REQ 5.26 The uniformity of airflow paths’ impedance on a Module should provide a resistance on A, B, C, and D zones that is within ±25% of the average value of the four rear zones (A, B, C, and D), as depicted in Figure 5-4, “Airflow zones of Modules and Carriers” including the effect of stiffener. Note that this constraint is not applied to the I/O zone.

REQ 5.8 Thermal models and/or measured data shall be provided with product documentation.

REQ 5.27 Modules should provide 20% to 70% open area in any cross section made perpendicular to the airflow path (the corresponding 80% to 30% blockage includes the Module's PCB).

5.3 Temperature¶ 20 It is recommended that a target pressure drop from inlet side of the shelf to exhaust side be

used as a primary thermal design parameter. This allows each element of a thermal system to be independently planned. Using this methodology, blower capacity can be planned based on the total shelf power and the airflow impedance of the most resistive Slot assemblies. Airflow distribution can be planned based on power to be dissipated in each shelf Slot. Then knowing the resistance of each Front Board assembly, the airflow impedance compensation can be designed for each Slot in the shelf. This is of course to suggest that monitoring shelf pressure drop is desirable. A few of the more pertinent values are listed in Table 5-3, “Thermal and noise environment (informative),” for convenience to aid the designer on common environments expected for indoor telco applications. These values are based on cabinet criteria; however, the designer should keep in mind that chassis level requirements may be slightly different. For example, to account for internal cabinet temperature rises, NEBS chassis level products could be required to evaluate at 40oC + 5oC = 45oC for maximum normal operation.


Table 5-3 Thermal and noise environment (informative)

¶ 21 For typical central office applications, a general rule of thumb is that systems integrators need to ensure that temperature rise from inlet to exhaust air of Module(s) or a Carrier or any combination of Module(s) and Carrier does not exceed 15º C for the complete assembly under normal operating conditions. In fact, it is generally advisable to keep this overall rise to 10º C or less. For the Module developer, this generally means that the temperature rise from inlet to exhaust air for an individual Module cannot exceed 2.5º C under normal operating conditions if up to four of these Modules can be stacked on a Carrier.

¶ 22 However, the specific limits for temperature rise for Carrier or for individual Modules is application-specific, and depends on application environmental specifications and component thermal specifications, and is beyond the scope of this specification. The specification requires the Carrier and Module vendors to document the thermal requirements in their product documentation.

¶ 23 In order to allow a Module to be installed at the top of an AMC Carrier AdvancedTCA Board or with up to three Modules below it, Modules typically need to be able to operate with a higher incoming ambient temperature than Carriers, which typically get fresh air at their inlet. The recommended temperatures in the requirements below allow 10º C total rise for three Modules or Carrier components below the top Module when the Shelf ambient temperature is 55º C. Since fans could be running slower under “normal” conditions, the total rise for long term ambient temperatures is 12º C for long term exposure. These temperatures are slightly lower for Double Modules since there is less chance for thermal rise prior to the leading edge of the Module PCB.

Note: Airflow volume alone is not sufficient to guarantee thermal compatibility.

CriteriaETSI NEBS Level 3

Specification Reference Specification Reference

Temperature

Storage: –25 to +55 °C, 0.5 °C/min changeTrans: –40 to +70 °C, –40/+30 °C changeOperating (Class 3.1, Including 3.1E): 5 to +40°C, 0.5°C/min (normal operation), and -5 to +45°C, 0.5°C/min (exceptional operation)

ETSI EN 300 019-2-1ETSI EN 300 019-2-2ETSI EN 300 019-2-3

Operating normal: 5 to 40 °COperating short-term: –5 to 55 °C for 96 hrOperating change: 30 °C/hr

GR-63-CORE, R4-6 and R4-14

Humidity

Storage: 10% to 100% RH (non-condensing & condensing)Trans slow change: 95% RH @ 45 °CTrans fast change: 95% RH @ –40 to +30 °COperating (normal): 5% to 85% RH non-condensing Operating (short-term, exception): 5 to 90% RH non-condensing

ETSI EN 300 019-2-1ETSI EN 300 019-2-2ETSI EN 300 019-2-3

Operating normal: 5% to 85% RHOperating short-term: 5 to 90% RH

GR-63-CORE, R4-6

Altitude Altitude: –471 to 3708 m ASL ETSI EN 300 019-2-3

–60 to 1800 m ASL (no temperature derating)1800 m to 4000 m ASL - temperature derating OK

GR-63-CORE, R4-8, R4-9, R4-10, O4-11, 04-12


Note: See Section 3.8, “Cooling management” and Section 3.9.2.1, “Clock E-Keying process” for information on temperature sensors.

Requirements

REQ 5.28 Single Modules should not exceed 2.5o C temperature rise from inlet to exhaust. Double Modules should not exceed 5o C temperature rise from inlet to exhaust.

REQ 5.29 Modules and Carriers shall specify the supported operating ambient air temperature range for both short term and long term conditions. Refer to NEBS-GR-63 for information on short term time limits.

REQ 5.30 Single Modules should be designed to operate with a NEBS short term incoming air temperature (measured at leading edge of the Module PCB) of 65o C and a long term incoming ambient temperature of 52o C. Double Modules should be designed to operate with a NEBS short term incoming air temperature (measured at leading edge of the Module PCB) of 62o C and a long term incoming ambient temperature of 48o C.

REQ 5.31 Carrier documentation shall specify the maximum expected ambient air temperature rise as a function of airflow at 10, 15, 20, 25. and 30 CFM through the Bay(s).

REQ 5.32 Module documentation shall specify the maximum expected ambient air temperature rise as a function of airflow at 10, 15, 20, 25. and 30 CFM through the Bay(s).

REQ 5.33 Carrier documentation shall specify the maximum total Carrier power dissipation in watts. This value shall be based on testing with representative high workload, if load affects the power consumption.

REQ 5.34 Module documentation shall specify the maximum total Module power dissipation in watts. This value shall be based on testing with representative high workload, if load affects the power consumption.


Interconnect 6

¶ 1 The AMC.0 interconnect framework comprises the physical Connector used to mate the AMC with its Carrier Board, the mapping of signals to that Connector, and the routing of those signals among the AMCs across the Carrier, and also to the Carrier based switching elements. The performance headroom in the Connector will allow future interconnect technologies with higher signal rates to be accommodated within the framework. The generic signal mapping across the AMC Connector supports a variety of system fabric topologies for connecting AMCs. The Interconnect interfaces are divided into five functional groups:

• Fabric Interface

• System Management Interface

• AMC Clock Interface

• JTAG Test Interface

• Power/ Ground

¶ 2 These interfaces are connected between the AMC Carrier and the AMC Module across the AMC Connector.

¶ 3 AMC Carrier and Module compatibility guidelines are defined within this section for the following functional groups: Fabric Interface, AMC Clocks and JTAG. System Management and Power Interconnect specifics are covered in Sections 3 and 4 respectively.

¶ 4 The AMC.0 base specification provides a physical framework for the Fabric Interface. AMC.0 subsidiary specifications define how to overlay a specific switching interconnect technology onto the AMC.0 Fabric Interface physical framework.

¶ 5 Governance of AMC Module and Carrier Board compatibility for the Interconnect interfaces, including the Fabric Interface, is provided by an Electronic Keying mechanism that is an integral part of the AMC.0 Module Management architecture.

¶ 6 The ability to deploy interconnect technologies to the Fabric Interface (through subsidiary specifications) is limited by the number of assigned Fabric Interface Ports on the AMC Connector and the signal rate capacity defined by that Connector. See Table 1-1, “AMC.x subsidiary specifications” for a sampling of subsidiary specifications.

6.1 Connector contact allocation¶ 7 The AMC Connector supports 170 contact. The Connector and pin definition are optimized

around supporting high speed interconnects. The AMC Carrier can be optionally fitted with either a full connectivity 170 pin Connector, or with an 85 pin version to reduce cost where less Fabric connectivity can be accepted.

¶ 8 The AMC Connector contacts are allocated to the five functional groups as follows:

• 40 signal pairs allocated to the Fabric Interface

• 5 signal pairs allocated to the AMC Clock Interface


• 5 contacts allocated to the JTAG Test Interface

• 9 contacts allocated to the System Management Interface

• 8 contacts allocated to Payload Power

• 56 contacts to allocated to Logic Ground

• 2 contacts reserved

¶ 9 Four levels of sequential mating (first mate, second mate, third mate, and last mate) are provided to ensure a correct electrical connection sequence is followed during insertion and extraction of the Module.

Requirements

REQ 6.64 The AMC Connector contact positions 6 and 8, identified as RSVD6 and RSVD8 shall remain unconnected on Carriers and on Modules. These contact positions are reserved for future definition by PICMG.

6.1.1 Pin naming conventions¶ 10 Table 6-1, “AMC Module Card-edge Interface contact assignments” takes the AMC

Modules’ perspective in the naming convention, i.e., Tx refers to the transmission of data from the Module to the Carrier, and conversely Rx is data received by the Module. The figure shows a signal direction field to clarify the source and termination points where applicable.

¶ 11 Table 6-2, Table 6-3 and Table 6-4 take the AMC Carriers’ perspective in the naming convention, i.e., Tx refers to the transmission of data from the AMC Carrier to the Module.

¶ 12 The symbol “#” is used to indicate the active low signal type.

¶ 13 In order to differentiate between the Module and Carrier connection nomenclature and to identify the connectivity to the A or B layers, the signal connections on a Carrier will appear with a prefix of MAm_ or MBm_ (where m is the Bay number), e.g. MB3_Tx0+ for a Fabric Interface signal or MB3_TCLKA+ for a Telecom Clock Interface signal for Slot B3.

6.1.1.1 Fabric Interface naming conventions

¶ 14 Pin mapping for the Fabric Interface is defined at a Port granularity, with Ports comprised of single transmit differential pair and single receive differential pair.

¶ 15 For the Module, the Fabric Interface signal naming convention follows: Tx/Rx[n]p, where:

• Tx/Rx = transmit/receive

• n = Port number (0-15and 17-20)

• p = polarity (+,–)


Figure 6-1 Fabric Interface naming convention

6.1.1.2 AMC Clock Interface naming convention

¶ 16 Telecom Clock Interface signal naming convention follows: TCLKxp, where:

• x= A, B, C, or D

• p = polarity (+,–)

¶ 17 The Fabric Clock Interface signals are named FCLKA+ and FCLKA-.

Note: JTAG, TCLKC and TCLKD signals are not supported on Basic Connectors.

pin11

pin 12

Tx0+ Tx0-pin 14

pin 15

Rx0+ Rx0-

AMC Module

MB3_Rx0+ MB3_Rx0- MB3_Tx0+ MB3_Tx0-

AMC Slot B3pin11

pin12

pin14

pin 15


6.1.2 Contact assignmentsTable 6-1 AMC Module Card-edge Interface contact assignments

Pin No. Signal Driven by Mating Pin Function on the AMC Pin No. Signal Driven by Mating Pin Function on the AMC

85 GND First Logic Ground 86 GND First Logic Ground84 PWR Carrier First Payload Power 87 Rx8- Third Port 8 Receiver -83 PS0# Carrier Last Presence 0 88 Rx8+ Third Port 8 Receiver +82 GND First Logic Ground 89 GND First Logic Ground81 FCLKA- Third Fabric Clock A - 90 Tx8- Third Port 8 Transmitter -80 FCLKA+ Third Fabric Clock A + 91 Tx8+ Third Port 8 Transmitter +79 GND First Logic Ground 92 GND First Logic Ground78 TCLKB- Third Telecom Clock B - 93 Rx9- Third Port 9 Receiver -77 TCLKB+ Third Telecom Clock B + 94 Rx9+ Carrier Third Port 9 Receiver +76 GND First Logic Ground 95 GND First Logic Ground75 TCLKA- Third Telecom Clock A - 96 Tx9- Third Port 9 Transmitter -74 TCLKA+ Third Telecom Clock A + 97 Tx9+ Third Port 9 Transmitter +73 GND First Logic Ground 98 GND First Logic Ground72 PWR Carrier First Payload Power 99 Rx10- Third Port 10 Receiver -71 SDA_L IPMI Agent Second IPMB-L Data 100 Rx10+ Third Port 10 Receiver +70 GND First Logic Ground 101 GND First Logic Ground69 Rx7- Third Port 7 Receiver - 102 Tx10- Third Port 10 Transmitter -68 Rx7+ Carrier Third Port 7 Receiver + 103 Tx10+ Third Port 10 Transmitter +67 GND First Logic Ground 104 GND First Logic Ground66 Tx7- Third Port 7 Transmitter - 105 Rx11- Third Port 11 Receiver -65 Tx7+ Third Port 7 Transmitter + 106 Rx11+ Third Port 11 Receiver +64 GND First Logic Ground 107 GND First Logic Ground63 Rx6- Third Port 6 Receiver - 108 Tx11- Third Port 11 Transmitter -62 Rx6+ Third Port 6 Receiver + 109 Tx11+ Third Port 11 Transmitter +61 GND First Logic Ground 110 GND First Logic Ground60 Tx6- Third Port 6 Transmitter - 111 Rx12- Third Port 12 Receiver -59 Tx6+ Third Port 6 Transmitter + 112 Rx12+ Third Port 12 Receiver +58 GND First Logic Ground 113 GND First Logic Ground57 PWR Carrier First Payload Power 114 Tx12- Third Port 12 Transmitter -56 SCL_L IPMI Agent Second IPMB-L Clock 115 Tx12+ Third Port 12 Transmitter +55 GND First Logic Ground 116 GND First Logic Ground54 Rx5- Third Port 5 Receiver - 117 Rx13- Third Port 13 Receiver -53 Rx5+ Third Port 5 Receiver + 118 Rx13+ Third Port 13 Receiver +52 GND First Logic Ground 119 GND First Logic Ground51 Tx5- Third Port 5 Transmitter - 120 Tx13- Third Port 13 Transmitter -50 Tx5+ Third Port 5 Transmitter + 121 Tx13+ Third Port 13 Transmitter +49 GND First Logic Ground 122 GND First Logic Ground48 Rx4- Third Port 4 Receiver - 123 Rx14- Third Port 14 Receiver -47 Rx4+ Third Port 4 Receiver + 124 Rx14+ Third Port 14 Receiver +46 GND First Logic Ground 125 GND First Logic Ground45 Tx4- Third Port 4 Transmitter - 126 Tx14- Third Port 14 Transmitter -44 Tx4+ Third Port 4 Transmitter + 127 Tx14+ Third Port 14 Transmitter +43 GND First Logic Ground 128 GND First Logic Ground42 PWR Carrier First Payload Power 129 Rx15- Third Port 15 Receiver -41 ENABLE# Carrier Second AMC Enable 130 Rx15+ Third Port 15 Receiver +40 GND First Logic Ground 131 GND First Logic Ground39 Rx3- Third Port 3 Receiver - 132 Tx15- Third Port 15 Transmitter -38 Rx3+ Third Port 3 Receiver + 133 Tx15+ Third Port 15 Transmitter +

Basic Side(Component Side 1)

Extended Side(Component Side 2)

FCLKA driver

TCLKB driver

TCLKA driver

AMC

Carrier

AMC

Carrier

AMC

Carrier

AMC

Carrier

Carrier

AMC

AMC

Carrier

AMC

Carrier

AMC

Carrier

AMC

Carrier

AMC

Carrier

AMC

Carrier

AMC


Table 6-1 AMC Module edge connector pin assignments (continued)

Note: Port 16 as defined in R1.0 of the AMC.0 specification (pins 135-136, 138-139) has been re-defined for use as TCLKC and TCLKD. As a result, there is no Port 16 defined for the Fabric Interface any longer. The R1.0 clock names have now changed: CLK1 is now TCLKA, CLK2 is now TCLKB, CLK3 is now FCLKA.

Pin No. Signal Driven by Mating Pin Function on the AMC Pin No. Signal Driven by Mating Pin Function on the AMC

Basic Side(Component Side 1)

Extended Side(Component Side 2)

GND Logic GroundPWR 12V Payload PowerMP 3.3V Managemnent Power

Fabric Interface differential signalClock Interface differential signal

Legend to the colors used in the signal mapping tables

37 GND First Logic Ground 134 GND First Logic Ground36 Tx3- Third Port 3 Transmitter - 135 TCLKC- Third Telecom Clock C -35 Tx3+ Third Port 3 Transmitter + 136 TCLKC+ Third Telecom Clock C +34 GND First Logic Ground 137 GND First Logic Ground33 Rx2- Third Port 2 Receiver - 138 TCLKD- Third Telecom Clock D -32 Rx2+ Third Port 2 Receiver + 139 TCLKD+ Third Telecom Clock D +31 GND First Logic Ground 140 GND First Logic Ground30 Tx2- Third Port 2 Transmitter - 141 Rx17- Third Port 17 Receiver -29 Tx2+ Third Port 2 Transmitter + 142 Rx17+ Third Port 17 Receiver +28 GND First Logic Ground 143 GND First Logic Ground27 PWR Carrier First Payload Power 144 Tx17- Third Port 17 Transmitter -26 GA2 Carrier Second Geographic Addr. 2 145 Tx17+ Third Port 17 Transmitter +25 GND First Logic Ground 146 GND First Logic Ground24 Rx1- Third Port 1 Receiver - 147 Rx18- Third Port 18 Receiver -23 Rx1+ Third Port 1 Receiver + 148 Rx18+ Third Port 18 Receiver +22 GND First Logic Ground 149 GND First Logic Ground21 Tx1- Third Port 1 Transmitter - 150 Tx18- Third Port 18 Transmitter -20 Tx1+ Third Port 1 Transmitter + 151 Tx18+ Third Port 18 Transmitter +19 GND First Logic Ground 152 GND First Logic Ground18 PWR Carrier First Payload Power 153 Rx19- Third Port 19 Receiver -17 GA1 Carrier Second Geographic Addr. 1 154 Rx19+ Third Port 19 Receiver +16 GND First Logic Ground 155 GND First Logic Ground15 Rx0- Third Port 0 Receiver - 156 Tx19- Third Port 19 Transmitter -14 Rx0+ Third Port 0 Receiver + 157 Tx19+ Third Port 19 Transmitter +13 GND First Logic Ground 158 GND First Logic Ground12 Tx0- Third Port 0 Transmitter - 159 Rx20- Third Port 20 Receiver -11 Tx0+ Third Port 0 Transmitter + 160 Rx20+ Third Port 20 Receiver +10 GND First Logic Ground 161 GND First Logic Ground9 PWR Carrier First Payload Power 162 Tx20- Third Port 20 Transmitter -8 RSRVD8 Second Reserved, not connected 163 Tx20+ Third Port 20 Transmitter +7 GND First Logic Ground 164 GND First Logic Ground6 RSRVD6 Second Reserved, not connected 165 TCK Carrier Second JTAG Test Clock Input5 GA0 Carrier Second Geographic Addr. 0 166 TMS Carrier Second JTAG Test Mode Select In4 MP Carrier First Management Power 167 TRST# Carrier Second JTAG Test Reset Input3 PS1# AMC Last Presence 1 168 TDO AMC Second JTAG Test Data Output2 PWR Carrier First Payload Power 169 TDI Carrier Second JTAG Test Data Input1 GND First Logic Ground 170 GND First Logic Ground

AMC

Carrier

AMC

Carrier

AMC

Carrier

AMC

TCLKC Driver

TCLKD Driver

Carrier

AMC

Carrier

AMC

Carrier

AMC

Carrier

AMC


6.1.3 AMC Carrier connector pin assignment for the B+ footprint¶ 18 This style of connector is required to support Extended (170 pin) connectivity for B+

Connectors.

Table 6-2 AMC Connector B+ footprint pin assignments

Pin Nr. Signal Pin Nr. Signal

Slot Layer B

Pin Nr. Signal Pin Nr. SignalB85 GND B86 GNDB84 MB_PWR B87 MB_Tx8-B83 MB_PS0# B88 MB_Tx8+B82 GND B89 GNDB81 MB_FCLKA- B90 MB_Rx8-B80 MB_FCLKA+ B91 MB_Rx8+B79 GND B92 GNDB78 MB_TCLKB- B93 MB_Tx9-B77 MB_TCLKB+ B94 MB_Tx9+B76 GND B95 GNDB75 MB_TCLKA- B96 MB_Rx9-B74 MB_TCLKA+ B97 MB_Rx9+B73 GND B98 GNDB72 MB_PWR B99 MB_Tx10-B71 MB_SDA_L B100 MB_Tx10+B70 GND B101 GNDB69 MB_Tx7- B102 MB_Rx10-B68 MB_Tx7+ B103 MB_Rx10+B67 GND B104 GNDB66 MB_Rx7- B105 MB_Tx11-B65 MB_Rx7+ B106 MB_Tx11+B64 GND B107 GNDB63 MB_Tx6- B108 MB_Rx11-B62 MB_Tx6+ B109 MB_Rx11+B61 GND B110 GNDB60 MB_Rx6- B111 MB_Tx12-B59 MB_Rx6+ B112 MB_Tx12+B58 GND B113 GNDB57 MB_PWR B114 MB_Rx12-B56 MB_SCL_L B115 MB_Rx12+B55 GND B116 GNDB54 MB_Tx5- B117 MB_Tx13-B53 MB_Tx5+ B118 MB_Tx13+B52 GND B119 GNDB51 MB_Rx5- B120 MB_Rx13-B50 MB_Rx5+ B121 MB_Rx13+B49 GND B122 GNDB48 MB_Tx4- B123 MB_Tx14-B47 MB_Tx4+ B124 MB_Tx14+B46 GND B125 GNDB45 MB_Rx4- B126 MB_Rx14-B44 MB_Rx4+ B127 MB_Rx14+B43 GND B128 GND

Slot Layer B

B42 MB_PWR B129 MB_Tx15-B41 MB_ENABLE# B130 MB_Tx15+B40 GND B131 GNDB39 MB_Tx3- B132 MB_Rx15-B38 MB_Tx3+ B133 MB_Rx15+B37 GND B134 GNDB36 MB_Rx3- B135 MB_TCLKC-B35 MB_Rx3+ B136 MB_TCLKC+B34 GND B137 GNDB33 MB_Tx2- B138 MB_TCLKD-B32 MB_Tx2+ B139 MB_TCLKD+B31 GND B140 GNDB30 MB_Rx2- B141 MB_Tx17-B29 MB_Rx2+ B142 MB_Tx17+B28 GND B143 GNDB27 MB_PWR B144 MB_Rx17-B26 MB_GA2 B145 MB_Rx17+B25 GND B146 GNDB24 MB_Tx1- B147 MB_Tx18-B23 MB_Tx1+ B148 MB_Tx18+B22 GND B149 GNDB21 MB_Rx1- B150 MB_Rx18-B20 MB_Rx1+ B151 MB_Rx18+B19 GND B152 GNDB18 MB_PWR B153 MB_Tx19-B17 MB_GA1 B154 MB_Tx19+B16 GND B155 GNDB15 MB_Tx0- B156 MB_Rx19-B14 MB_Tx0+ B157 MB_Rx19+B13 GND B158 GNDB12 MB_Rx0- B159 MB_Tx20-B11 MB_Rx0+ B160 MB_Tx20+B10 GND B161 GNDB9 MB_PWR B162 MB_Rx20-B8 MB_RSRVD8 B163 MB_Rx20+B7 GND B164 GNDB6 MB_RSRVD6 B165 MB_TCKB5 MB_GA0 B166 MB_TMSB4 MB_MP B167 MB_TRST#B3 MB_PS1# B168 MB_TDOB2 MB_PWR B169 MB_TDIB1 GND B170 GND


6.1.4 AMC Carrier connector pin assignment for the AB footprint¶ 19 This style of connector is required to support Basic (85 pin) connectivity for AB Connectors.

Table 6-3 AMC Connector AB footprint pin assignments

Pin Nr. SignalA85 GNDA84 MA_PWRA83 MA_PS0#A82 GNDA81 MA_FCLKA-A80 MA_FCLKA+A79 GNDA78 MA_TCLKB-A77 MA_TCLKB+A76 GNDA75 MA_TCLKA-A74 MA_TCLKA+A73 GNDA72 MA_PWRA71 MA_SDA_LA70 GNDA69 MA_Tx7-A68 MA_Tx7+A67 GNDA66 MA_Rx7-A65 MA_Rx7+A64 GNDA63 MA_Tx6-A62 MA_Tx6+A61 GNDA60 MA_Rx6-A59 MA_Rx6+A58 GNDA57 MA_PWRA56 MA_SCL_LA55 GNDA54 MA_Tx5-A53 MA_Tx5+A52 GNDA51 MA_Rx5-A50 MA_Rx5+A49 GNDA48 MA_Tx4-A47 MA_Tx4+A46 GNDA45 MA_Rx4-A44 MA_Rx4+A43 GND

Slot Layer A

A42 MA_PWRA41 MA_ENABLE#A40 GNDA39 MA_Tx3-A38 MA_Tx3+A37 GNDA36 MA_Rx3-A35 MA_Rx3+A34 GNDA33 MA_Tx2-A32 MA_Tx2+A31 GNDA30 MA_Rx2-A29 MA_Rx2+A28 GNDA27 MA_PWRA26 MA_GA2A25 GNDA24 MA_Tx1-A23 MA_Tx1+A22 GNDA21 MA_Rx1-A20 MA_Rx1+A19 GNDA18 MA_PWRA17 MA_GA1A16 GNDA15 MA_Tx0-A14 MA_Tx0+A13 GNDA12 MA_Rx0-A11 MA_Rx0+A10 GNDA9 MA_PWRA8 MA_RSRVD8A7 GNDA6 MA_RSRVD6A5 MA_GA0A4 MA_MPA3 MA_PS1#A2 MA_PWRA1 GND

Pin Nr. Signal

Slot Layer APin Nr. Signal

B85 GNDB84 MB_PWRB83 MB_PS0#B82 GNDB81 MB_FCLKA-B80 MB_FCLKA+B79 GNDB78 MB_TCLKB-B77 MB_TCLKB+B76 GNDB75 MB_TCLKA-B74 MB_TCLKA+B73 GNDB72 MB_PWRB71 MB_SDA_LB70 GNDB69 MB_Tx7-B68 MB_Tx7+B67 GNDB66 MB_Rx7-B65 MB_Rx7+B64 GNDB63 MB_Tx6-B62 MB_Tx6+B61 GNDB60 MB_Rx6-B59 MB_Rx6+B58 GNDB57 MB_PWRB56 MB_SCL_LB55 GNDB54 MB_Tx5-B53 MB_Tx5+B52 GNDB51 MB_Rx5-B50 MB_Rx5+B49 GNDB48 MB_Tx4-B47 MB_Tx4+B46 GNDB45 MB_Rx4-B44 MB_Rx4+B43 GND

Slot Layer B

B42 MB_PWRB41 MB_ENABLE#B40 GNDB39 MB_Tx3-B38 MB_Tx3+B37 GNDB36 MB_Rx3-B35 MB_Rx3+B34 GNDB33 MB_Tx2-B32 MB_Tx2+B31 GNDB30 MB_Rx2-B29 MB_Rx2+B28 GNDB27 MB_PWRB26 MB_GA2B25 GNDB24 MB_Tx1-B23 MB_Tx1+B22 GNDB21 MB_Rx1-B20 MB_Rx1+B19 GNDB18 MB_PWRB17 MB_GA1B16 GNDB15 MB_Tx0-B14 MB_Tx0+B13 GNDB12 MB_Rx0-B11 MB_Rx0+B10 GNDB9 MB_PWRB8 MB_RSRVD8B7 GNDB6 MB_RSRVD6B5 MB_GA0B4 MB_MPB3 MB_PS1#B2 MB_PWRB1 GND

Pin Nr. Signal

Slot Layer B


6.1.5 AMC Carrier connector pin assignment for the A+B+ footprint¶ 20 This style of connector is required to support Extended connectivity for A+B+ Connectors.

Table 6-4 AMC Connector A+B+ footprint pin assignments

Pin Nr. Signal Pin Nr. Signal Pin Nr. Signal Pin Nr. SignalA85 GND A86 GND B85 GND B86 GNDA84 MA_PWR A87 MA_Tx8- B84 MB_PWR B87 MB_Tx8-A83 MA_PS0# A88 MA_Tx8+ B83 MB_PS0# B88 MB_Tx8+A82 GND A89 GND B82 GND B89 GNDA81 MA_FCLKA- A90 MA_Rx8- B81 MB_FCLKA- B90 MB_Rx8-A80 MA_FCLKA+ A91 MA_Rx8+ B80 MB_FCLKA+ B91 MB_Rx8+A79 GND A92 GND B79 GND B92 GNDA78 MA_TCLKB- A93 MA_Tx9- B78 MB_TCLKB- B93 MB_Tx9-A77 MA_TCLKB+ A94 MA_Tx9+ B77 MB_TCLKB+ B94 MB_Tx9+A76 GND A95 GND B76 GND B95 GNDA75 MA_TCLKA- A96 MA_Rx9- B75 MB_TCLKA- B96 MB_Rx9-A74 MA_TCLKA+ A97 MA_Rx9+ B74 MB_TCLKA+ B97 MB_Rx9+A73 GND A98 GND B73 GND B98 GNDA72 MA_PWR A99 MA_Tx10- B72 MB_PWR B99 MB_Tx10-A71 MA_SDA_L A100 MA_Tx10+ B71 MB_SDA_L B100 MB_Tx10+A70 GND A101 GND B70 GND B101 GNDA69 MA_Tx7- A102 MA_Rx10- B69 MB_Tx7- B102 MB_Rx10-A68 MA_Tx7+ A103 MA_Rx10+ B68 MB_Tx7+ B103 MB_Rx10+A67 GND A104 GND B67 GND B104 GNDA66 MA_Rx7- A105 MA_Tx11- B66 MB_Rx7- B105 MB_Tx11-A65 MA_Rx7+ A106 MA_Tx11+ B65 MB_Rx7+ B106 MB_Tx11+A64 GND A107 GND B64 GND B107 GNDA63 MA_Tx6- A108 MA_Rx11- B63 MB_Tx6- B108 MB_Rx11-A62 MA_Tx6+ A109 MA_Rx11+ B62 MB_Tx6+ B109 MB_Rx11+A61 GND A110 GND B61 GND B110 GNDA60 MA_Rx6- A111 MA_Tx12- B60 MB_Rx6- B111 MB_Tx12-A59 MA_Rx6+ A112 MA_Tx12+ B59 MB_Rx6+ B112 MB_Tx12+A58 GND A113 GND B58 GND B113 GNDA57 MA_PWR A114 MA_Rx12- B57 MB_PWR B114 MB_Rx12-A56 MA_SCL_L A115 MA_Rx12+ B56 MB_SCL_L B115 MB_Rx12+A55 GND A116 GND B55 GND B116 GNDA54 MA_Tx5- A117 MA_Tx13- B54 MB_Tx5- B117 MB_Tx13-A53 MA_Tx5+ A118 MA_Tx13+ B53 MB_Tx5+ B118 MB_Tx13+A52 GND A119 GND B52 GND B119 GNDA51 MA_Rx5- A120 MA_Rx13- B51 MB_Rx5- B120 MB_Rx13-A50 MA_Rx5+ A121 MA_Rx13+ B50 MB_Rx5+ B121 MB_Rx13+A49 GND A122 GND B49 GND B122 GNDA48 MA_Tx4- A123 MA_Tx14- B48 MB_Tx4- B123 MB_Tx14-A47 MA_Tx4+ A124 MA_Tx14+ B47 MB_Tx4+ B124 MB_Tx14+A46 GND A125 GND B46 GND B125 GNDA45 MA_Rx4- A126 MA_Rx14- B45 MB_Rx4- B126 MB_Rx14-A44 MA_Rx4+ A127 MA_Rx14+ B44 MB_Rx4+ B127 MB_Rx14+A43 GND A128 GND B43 GND B128 GNDA42 MA_PWR A129 MA_Tx15- B42 MB_PWR B129 MB_Tx15-A41 MA_ENABLE# A130 MA_Tx15+ B41 MB_ENABLE# B130 MB_Tx15+A40 GND A131 GND B40 GND B131 GND

Slot Layer A Slot Layer B


Table 6-4. AMC Connector A+B+ footprint pin assignments (continued)

Pin Nr. Signal Pin Nr. Signal Pin Nr. Signal Pin Nr. Signal

Slot Layer A Slot Layer B

A39 MA_Tx3- A132 MA_Rx15- B39 MB_Tx3- B132 MB_Rx15-A38 MA_Tx3+ A133 MA_Rx15+ B38 MB_Tx3+ B133 MB_Rx15+A37 GND A134 GND B37 GND B134 GNDA36 MA_Rx3- A135 MA_TCLKC- B36 MB_Rx3- B135 MB_TCLKC-A35 MA_Rx3+ A136 MA_TCLKC+ B35 MB_Rx3+ B136 MB_TCLKC+A34 GND A137 GND B34 GND B137 GNDA33 MA_Tx2- A138 MA_TCLKD- B33 MB_Tx2- B138 MB_TCLKD-A32 MA_Tx2+ A139 MA_TCLKD+ B32 MB_Tx2+ B139 MB_TCLKD+A31 GND A140 GND B31 GND B140 GNDA30 MA_Rx2- A141 MA_Tx17- B30 MB_Rx2- B141 MB_Tx17-A29 MA_Rx2+ A142 MA_Tx17+ B29 MB_Rx2+ B142 MB_Tx17+A28 GND A143 GND B28 GND B143 GNDA27 MA_PWR A144 MA_Rx17- B27 MB_PWR B144 MB_Rx17-A26 MA_GA2 A145 MA_Rx17+ B26 MB_GA2 B145 MB_Rx17+A25 GND A146 GND B25 GND B146 GNDA24 MA_Tx1- A147 MA_Tx18- B24 MB_Tx1- B147 MB_Tx18-A23 MA_Tx1+ A148 MA_Tx18+ B23 MB_Tx1+ B148 MB_Tx18+A22 GND A149 GND B22 GND B149 GNDA21 MA_Rx1- A150 MA_Rx18- B21 MB_Rx1- B150 MB_Rx18-A20 MA_Rx1+ A151 MA_Rx18+ B20 MB_Rx1+ B151 MB_Rx18+A19 GND A152 GND B19 GND B152 GNDA18 MA_PWR A153 MA_Tx19- B18 MB_PWR B153 MB_Tx19-A17 MA_GA1 A154 MA_Tx19+ B17 MB_GA1 B154 MB_Tx19+A16 GND A155 GND B16 GND B155 GNDA15 MA_Tx0- A156 MA_Rx19- B15 MB_Tx0- B156 MB_Rx19-A14 MA_Tx0+ A157 MA_Rx19+ B14 MB_Tx0+ B157 MB_Rx19+A13 GND A158 GND B13 GND B158 GNDA12 MA_Rx0- A159 MA_Tx20- B12 MB_Rx0- B159 MB_Tx20-A11 MA_Rx0+ A160 MA_Tx20+ B11 MB_Rx0+ B160 MB_Tx20+A10 GND A161 GND B10 GND B161 GNDA9 MA_PWR A162 MA_Rx20- B9 MB_PWR B162 MB_Rx20-A8 MA_RSRVD8 A163 MA_Rx20+ B8 MB_RSRVD8 B163 MB_Rx20+A7 GND A164 GND B7 GND B164 GNDA6 MA_RSRVD6 A165 MB_TCK B6 MB_RSRVD6 B165 MB_TCKA5 MA_GA0 A166 MB_TMS B5 MB_GA0 B166 MB_TMSA4 MA_MP A167 MB_TRST# B4 MB_MP B167 MB_TRST#A3 MA_PS1# A168 MB_TDO B3 MB_PS1# B168 MB_TDOA2 MA_PWR A169 MB_TDI B2 MB_PWR B169 MB_TDIA1 GND A170 GND B1 GND B170 GND


6.2 Fabric Interface¶ 21 The Fabric Interface comprises up to 20 Ports providing point-to-point connectivity for

Module-to-Carrier and Module-to-Module implementations. The Fabric Interface can be used in a variety of ways by AMCs and AMC Carrier Boards to meet the needs of many applications. There are two usage models:

• Transport types covered by the AMC subsidiary specifications, i.e., Ethernet, PCI-Express, etc.

• Vendor-specific mappings named within this specification as General Purpose Input/ Output. GPIO still adheres to the Fabric Interface electrical specifications.

¶ 22 Signal Integrity requirements are directly associated with a given transport protocol and rate of operation. Therefore it is the responsibility of the AMC subsidiary specifications to precisely detail the signal integrity requirements for both the Modules and Carrier Boards in order to ensure vendor interoperability.

Requirements

REQ 6.65 Modules and Carriers shall only implement AMC signals according to Table 6-1, “AMC Module Card-edge Interface contact assignments” through Table 6-4, “AMC Connector A+B+ footprint pin assignments.”

REQ 6.66 Modules and Carriers may implement a subset of these signals as defined elsewhere in this chapter.

REQ 6.1b AMC subsidiary specifications shall define the Port mapping requirements for the AMC Modules and AMC Slots.

REQ 6.2b AMC Modules and Carriers may support any subset of the Fabric Interface Ports. Note that some Fabric Interface Ports and Clock Interfaces are only supported on the Extended Connector.

REQ 6.67 AMC Modules and Carriers’ AMC Slots that connect to the Fabric Interface should comply with the applicable AMC.x subsidiary specification.

REQ 6.68 Custom connections to the Fabric Interface may be implemented.

REQ 6.69 The Link Descriptor used for Electronic Keying purposes for each connection shall be supported regardless of whether the interconnect is part of a subsidiary specification or a custom connection.

REQ 6.4 Unused Fabric Interface Ports may be left unterminated on the AMC Module and Carrier.

REQ 6.5b The use and value of coupling capacitors and resistive terminations on AMC Modules and Carriers are protocol dependent and shall be specified in the respective AMC subsidiary specifications.

REQ 6.11 The Carrier and Module Fabric Interface differential pair impedances shall be 100 Ω ± 10%.

REQ 6.12 Fabric Interface Ports should be LVDS compliant.

REQ 6.14bThe current load for signals of the Fabric Interface shall not exceed 100mA.

REQ 6.70 If matching delays are required among the Fabric Interface Ports of Extended Connectors, then differential pair traces of the Basic Side or the Extended Side shall be


routed with an additional trace length to compensate the delay skew which is specified by the Connector vendor according to Section 7.4.5, “Propagation characteristics.”

6.2.1 Fabric Interface electrical requirements for LVDS¶ 23 Independent of Electronic Keying (E-Keying), the receiver hardware must not be damaged

during inadvertent interconnects of incompatible interfaces; therefore, the following requirements have to be followed. Figure 6-2 shows one mode of operation where two Modules are directly connected. The example shows the case where optional receive interface capacitors are used.

Figure 6-2 Channel test points – Module to Module routing model example

¶ 24 Figure 6-3 shows the second mode of operation where the AMC Module Fabric Interface differential pair terminates on the AMC Carrier. The example shows the case where optional receive interface capacitors are used. Use and placement of capacitors is dictated by subsidiary specifications.

AMC Module

AMC Connectors

Tx Rx

TP-1(BGA Pads) TP-4

(BGA Pads)

AMC ModuleAMC Carrier

Rx Tx

TP-4(BGA Pads)

TP-1(BGA Pads)


Figure 6-3 Channel test points – Module to Carrier routing model example

Requirements

REQ 6.71 Maximum peak-to-peak differential voltage at the transmitter test point TP-1 (see Figure 6-2, “Channel test points – Module to Module routing model example”) shall not exceed 1600 mV.

REQ 6.72 The receiver shall withstand at test point TP-4 (see Figure 6-2, “Channel test points – Module to Module routing model example”) at least 1600 mV peak-to-peak differential voltage without adverse impact to long-term reliability. This shall apply whether or not the receiver hardware is powered.

REQ 6.6b LVDS Drivers connected to Port Tx signals should support Enable/Disable of the driver under control of the Carrier IPMC.

REQ 6.7b LVDS Drivers connected to Port Tx signals should power up in a disabled state and remain in that state until enabled by the Carrier IPMC.

REQ 6.8 When disabled, transmitters shall be high impedance.

REQ 6.9b During AMC Payload resets, LVDS Drivers connected to Port Tx signals that are in a disabled state should remain disabled and those that are enabled should remain enabled on the Module and on the Carrier.

REQ 6.10bThe Carrier shall not directly connect Fabric Interface signals of an AMC Slot to the AdvancedTCA Zone 2 connector as signal integrity degradation becomes an issue.

REQ 6.73 A simple Carrier board design may use physical layer regenerators as the only component between the AdvancedMC Module and the PICMG3.0 backplane, provided that the IPMC ensures a match between the independent Backplane and AMC Module E-Keying processes. If a signal regenerator is used to connect the AMC Module to the PICMG 3.0 Backplane and the two independent E-Keying processes do not match protocols, the IPMC shall ensure the AMC Module is isolated from the Backplane.

AMC Module

AMC Connector

Tx

TP-1TP-4

AMC Carrier

Rx

Rx

TP-4TP-1

Tx


REQ 6.13 Fabric Interface Ports which are not LVDS compliant shall comply to the requirements in Section 6.2.2, “Fabric Interface electrical requirements for non-LVDS.”

REQ 6.74 A point to point connection of one AMC Port to another AMC Port on the Carrier shall be implemented so that the following connections are routed:

Tx+ to Rx+

Tx- to Rx-

Rx+ to Tx+

Rx- to Tx-

6.2.2 Fabric Interface electrical requirements for non-LVDS¶ 25 Due to the fine pitch of the connector and the 0.1 mm isolation distances between conductive

areas in the connector area, the voltage range of the signaling needs to be restricted. The potential difference between adjacent connection areas is limited accordingly by the following requirements:

Requirements

REQ 6.15 The signals of the Fabric Interface shall not exceed ± 15 V referenced to Logic Ground.

REQ 6.16 Carrier shall disable (set to high impedance) the non-LVDS signals of the Fabric Interface when the Module is removed and also only enable Ports for which E-Keying has identified a match of the protocols.

REQ 6.17 The Module shall disable the non-LVDS signals of the Fabric Interface when the Payload Power (PWR) is off and also only enable ports for which E-Keying has identified a match of the protocols.

REQ 6.18bThe Carrier and Module shall ensure that any external connections forwarded to a Port of the AMC Connector meet the voltage and E-Keying requirements defined above.

6.3 AMC Clock Interface¶ 26 The AMC specification provides two types of clocks, Telecom Clocks and a Fabric

Reference Clock. A total of five clocks are provided - four Telecom Clocks and one Fabric Reference Clock. The support for these clocks is optional and dependent on the application and Fabric used. Linkage between ATCA and AMC clock usage is provided as guidance. The AMC specification defines recommended usages of the clocks to maximize vendor interoperability. These are just recommendations and designers are provided flexibility in the implementation and usage of the clocks. At this time, the AMC specification provides guidance for Telecom Clock usage in SONET/SDH and PDH applications. It is envisioned that future versions of this specification or subsidiary specifications will provide guidance for other applications such as WiMax and synchronous ethernet. Fabric clocks are only required for some interfaces, such as PCI Express (AMC.1). They are not connected for other fabric types. Table 6-5, “AMC Telecom Clock usage” and Table 6-6, “AMC Fabric Clock usage” provide a list of the AMC clocks and preferred usage.


Table 6-5 AMC Telecom Clock usage

Table 6-6 AMC Fabric Clock usage

¶ 27 The term “AMC Clocks” refers to the collective set of Telecom and Fabric Clocks.

Requirements

REQ 6.75 Modules and Carriers should implement AMC Clocks according to Table 6-5, “AMC Telecom Clock usage” and Table 6-6, “AMC Fabric Clock usage.”

REQ 6.76 AMC Modules and Carriers may support any subset of the AMC Clock Interfaces.

6.3.1 AMC Clock architecture¶ 28 Each AMC clock is implemented as a differential pair that connects to each AMC Module

Slot through the AMC Connector pins. AMC Modules can implement a connection to any number of Telecom and Fabric Clock Interfaces.

¶ 29 The AMC Module specification provides support for a half-duplex (bi-directional) point-to-point M-LVDS clocking scheme. A 100 Ω line-termination is required on both ends of the transmission line. Figure 6-4 shows the point-to-point M-LVDS approach. In this case the Carrier based clock distribution device is responsible for receiving the incoming clock from either an AMC Module or an external source and then providing multiple versions of the received clock to the other subscribed entities.

Clock Name Contacts Direction

TCLKA 74/75 In to Module

TCLKB 77/78 Out from Module

TCLKC 135/136 In to Module

TCLKD 138/139 Out from Module

Clock Name Contacts Direction

FCLKA 80/81 In to Module


Figure 6-4 Point-to-point M-LVDS clocking scheme

¶ 30 Telecom Clock distribution is typically implemented on a Carrier using buffers or muxes to connect each AMC Site to an on-Carrier Clock bus, however, it may be implemented using a Radial Clock buffer, or some other implementations, such as MicroTCA.

¶ 31 The following figures show examples of how clocking could be implemented on AMC Modules and Carriers. These examples are for illustrative purposes only.

100Ω

100Ω

100Ω

100Ω

100Ω

100 Ω

Carrier-based Clock distribution device

AMC Module AMC Module AMC Module

Any artwork not routed through a pin is considered a stub

Any artwork after the termination is considered a stub

Ideal routing with terminations last and 0 stub lengths on

MLVDS devices


Figure 6-5 Example Clock generator circuit

Figure 6-6 Example master Clock generator AMC

ClockEngine

Oscillator(Stratum 3/3E

OCXO)

T1/E1LIU/Framer

Ref_3

Ref_2

Ref_4

Ref_1

T1/E1LIU/Framer

Out_2

Out_1

CPUCore

Base (FE/GbE)

Fabric (1GbE)

T1/E1LIU/Framer

T1/E1LIU/Framer

Line Clock 1

Line Clock 2

BITS 2

BITS 1

19.44MHz/8KHz/2.048MHz/1.544MHz

BITS 1 Repeater

BITS 2 Repeateror Monitor Output

FPGAOr

Vendor Silicon

8KHz/2.048MHz/1.544MHz/8KHz

ClockEngine

Oscillator

T1/E1LIU/Framer

T1/E1LIU/Framer

CPUCore

T1/E1LIU/Framer

T1/E1LIU/Framer

FPGAOr

Vendor Silicon

TCLKA

TCLKC

TCLKB

TCLKD

Base

Fabric

Faceplateor

RTM I/O

Direct connectionsTo BITS clock

ApplicationDependent

MCG AMC

Faceplateor

RTM I/O


Figure 6-7 Example line synchronous AMC Module

Figure 6-8 Example Carrier Telecom Clock implementation

TCLKA

TCLKC

TCLKB

Layer 1 I/F

Line CardAMC

Rx ClockRecovery

Tx ClockGeneration

Line CardFront-endFunction

(e.g. Framer)

PayloadFunction

FabricI/F

BaseI/F

MMC

AMCConnector

Front Panelor

RTM I/O

Fabric

IPMI

Base

ATC

A C

LK3A

ATC

A C

LK3B

TCLK

A

TCLK

C

TCLK

D

TCLK

B

ATC

A C

LK1A

ATC

A C

LK1B

ATC

A C

LK2A

ATC

A C

LK2B

AMC CarrierClock Engines

SMCOsc.

ATC

A C

LK3A

ATC

A C

LK3B

ATC

A C

LK1A

ATC

A C

LK1B

ATC

A C

LK2A

ATC

A C

LK2B

8KHzDPLL

19.44MHzDPLL

TCLK

B

TCLK

C

TCLK

A

I/O AMCMCGAMC

MutuallyExclusive

Pairs

ATCA Backplane Conn.

AMC Conn.AMC Conn.

AMCCarrierBoard

These clock signals are actually common on the board side of the connector.They are drawn as shown for simplicity, and only the 3 standard clock pairs are needed.

Both drivers activesimultaneously


Requirements

REQ 6.20bThe Telecom Clock Interface signals shall be driven by M-LVDS drivers whether from the Carrier or from the Module.

REQ 6.21bThe Telecom Clocks shall support M-LVDS EIA/TIA-899 receiver types: Type-1 (with receiver hysteresis) or Type-2 are both acceptable.

REQ 6.24bThe Carrier and Module differential pair impedances of the AMC Clock pair shall be 100 Ω ± 10%.

REQ 6.25bIf an AMC Clock is connected on a Module, a 100 Ω ± 5% termination network shall be provided on the AMC Module for that clock.

REQ 6.26bIf an AMC Clock is connected on a Carrier, a 100 Ω ± 5% termination network shall be provided on the Carrier for that clock.

REQ 6.27bPer Figure 6-4, “Point-to-point M-LVDS clocking scheme” the routing and placement of the M-LVDS devices and termination should be as close to the ideal configuration. The total accumulated length of all stubs, in non-ideal cases, shall be less than 1.00 inches.

REQ 6.77 The difference in length of the traces forming the clock differential pair on a Carrier shall not exceed 1 mm.

REQ 6.78 The difference in length of the traces forming the clock differential pair on a Module shall not exceed 1 mm.

REQ 6.28bTelecom Clock drivers shall present high impedance and shall default to a high-impedance state unless enabled under system management control.

REQ 6.30bEach Telecom Clock driver shall be capable of being high-impedance under software control.

REQ 6.31bAt power-up M-LVDS AMC Clock drivers shall default to a high-impedance state.

REQ 6.34bThe routing of the AMC Clocks shall support independently buffered connections to each AMC site.

REQ 6.36bIt is the responsibility of the Carrier to distribute the AMC Clocks with the necessary synchronicity per the intended application. The AMC is responsible for phase management referenced from the AMC connector pins. Both the AMC and the Carrier should minimize phase accumulation to maximize the usefulness of a general design.

6.3.2 AMC Clock electrical interface

¶ 32 The five AMC Clocks must use Multipoint Low-Voltage Differential Signaling (M-LVDS) as specified in TIA/EIA-899. Table 6-7, “Min/Max M-LVDS voltage ranges” shows the input and output ranges for M-LVDS. Refer to EIA/TIA-899 for details.

¶ 33 EIA/TIA-899 specifies two receiver types: Type-1 and Type-2. Both receiver types can be used equally for the AMC Clock implementation. Selecting a Type-1 or Type-2 receiver essentially comes down to performance considerations.

Table 6-7 Min/Max M-LVDS voltage ranges

Input RangeMin/Max

Output Common ModeMin/Max

Output AmplitudeMin/Max

M-LVDS –1.4/3.8 V 0.3/2.1 V 0.480/0.650 V


¶ 34 Type-1 receivers must offer built in receiver hysteresis to avoid unwanted oscillation of the buffer output in the absence of a receiver input signal. The hysteresis also prevents noise on the input to create glitches on the M-LVDS output buffer. Type-1 receivers offers the best switching performance (lowest jitter). Generally, Type-1 receivers with input hysteresis are the best choice for the system and are highly recommended for clock rates equal or higher than 20 MHz.

¶ 35 Type-2 receivers incorporate an input offset threshold of 100 mV. This blocks input noise from passing through the buffer. Unfortunately, this offset introduces a duty cycle error proportional to the input signal rise time. At higher clock rates this duty cycle error may not be neglectable and Type-1 receivers become recommended. Type-2 receivers offer a failover feature; in case the input clock is lost, the Type-2 receiver output will signal a static LOW.

6.3.3 Telecom Clock Interface¶ 36 This section defines the Telecom Clock Interface requirements to ensure interoperability

between the AMC Module and the Carrier that may be supplied by different vendors. Subsections are provided with guidance for Telecom Clock usage in specific applications.

6.3.3.1 SONET/ SDH/ PDH line cards and applications

¶ 37 Many telecommunications applications using the AdvancedTCA and Advanced Mezzanine Card architectures need to interface to external networks that require strict timing relationships between multiple interfaces and the external network, such as SONET/ SDH/ PDH networks. Such Interfaces typically require the AMC Module to receive frame and bit rate clocks from the Carrier, also to transmit a bit rate clock to the Carrier. This section defines a profile for AMC-based SONET applications. This profile covers AMC-based SONET Line Cards, AMC-based System Timing Modules, and an AMC Carrier AdvancedTCA Board.

¶ 38 The Telecom Clock Interface provides four differential pairs for clock distribution to enable applications that require the exchange of synchronous timing information among Modules and consequently multiple boards in a Shelf. This allows Modules to source clock(s) to the system in the case where it provides a Network Interface function, or conversely to receive timing information from another Carrier Board or Module within the system. The four Telecom Clock signals are TCLKA, TCLKB, TCLKC, and TCLKD, each supported by a differential pair.

¶ 39 Table 6-8, “Telecom Clock details - SONET/ SDH/ PDH Line Cards” defines the preferred frequencies for the Telecom clocks used in SONET/ SDH/ PDH profiles. The minimum quality requirements of the clocks are defined based on usage of the clock and how that usage model fits within the Stratum clocking hierarchy. The Telecom Clocking architecture

Table 6-8 Telecom Clock details - SONET/ SDH/ PDH Line Cards

Clock Name Contacts Frequency Direction Analog in ATCA spec

TCLKA 74/75 19.44MHz, 8kHz In to Module ATCA CLK2

TCLKB 77/78 8kHz, 1.544MHz, 2.048MHz, or 19.44MHz

Out from Module ATCA CLK3

TCLKC 135/136 8KHz In to Module ATCA CLK1

TCLKD 138/139 Out from Module


defined here allows for redundant clocking as well as for non-redundant clocking architectures. Redundant clock inputs to the Module can be provided on TCLKA/TCLKC and outputs from the Module on TCLKB/TCLKD. When using redundant clocks, only one clock frequency will be available. It is expected that the designer be able to synthesize the missing clock from the one provided.

Note: Caution should be used in deriving 8KHz from a higher frequency clock as there will be no phase coherence at that lower rate.

¶ 40 TCLKA is intended to be an 19.44 MHz system clock. This clock is a common reference frequency for interfaces to SONET/ SDH/ PDH networks (i.e., STM-1/OC-3 rate divided by eight). TCLKA is an input to a Module. This clock is a Stratum 3 or 3E, or SONET Minimum Clock (SMC) hardware quality and should be traceable to a Stratum 1 PRS (Primary Reference Source) while in the tracking state.

¶ 41 TCLKB is a recovered line clock output from the Module and can be used to provide a timing reference to the Carrier. There are no hardware quality requirements for this clock, however it should be traceable to a Stratum 1 PRS while in the tracking state for distribution to the ATCA CLK3 signals.

¶ 42 TCLKC is intended to be used as an 8 kHz system clock, or frame pulse. This frequency is the fundamental frequency used for all digital telephony transmission systems. This clock is a Stratum 3 or 3E, or SONET Minimum Clock (SMC) hardware quality and should be traceable to a Stratum 1 PRS while in the tracking state.

¶ 43 TCLKD is an 8KHz recovered line clock output from the Module and can be used to provide timing references to the Carrier. There are no hardware quality requirements for this clock, however it should be traceable to a Stratum 1 PRS while in the tracking state for distribution to the ATCA CLK3 signals.

¶ 44 These requirements apply to the outputs of the clock sources that drive the clock so that receivers can use these signals properly. This specification does not attempt to address other characteristics of the Telecom Clock sources, such as lock characteristics, input tolerance, reference qualification, transfer characteristics, or operating modes.

Requirements

REQ 6.79 For AMC-based SONET/ SDH/ PDH line cards, the following requirements shall apply for Carriers and Modules:

REQ 6.79.1 For a SONET/ SDH/ PDH line card, TCLKA input shall be a 19.44MHz clock.

REQ 6.79.2 For a Carrier supporting a SONET/ SDH/ PDH line card, the Carrier shall provide a 19.44MHz clock on TCLKA.

REQ 6.79.3 The duty cycle for the 19.44MHz clock should be 50% +/- 10%.

REQ 6.79.4 For a Carrier supporting a SONET/SDH/ PDH line card, the Carrier shall provide an 8kHz clock or frame-pulse on TCLKC.

REQ 6.79.5 The duty cycle for the 8kHz clock may vary but the rising edge shall occur at regular 125 µs intervals.

REQ 6.79.6 TCLKA and TCLKC shall meet or exceed the performance requirements of a SONET Minimum Clock (SMC) (per ANSI T1.105.09-1996). These requirements define clock sources with ±20 ppm free-run frequency accuracy, limited jitter attenuation, and controlled reference switching with holdover.


REQ 6.79.7 TCLKA and TCLKC should meet the performance requirements of a Stratum 3 or 3E clock (per Telcordia GR-1244-CORE) or a SDH Equipment Clock Option I or II (per ITU-T G.813). These requirements define jitter attenuated clock sources with ± 4.6 ppm free-run frequency accuracy and controlled reference switching with holdover.

REQ 6.79.8 The jitter and wander characteristics of TCLKA and TCLKC shall permit SONET/SDH/ PDH outputs to meet the relevant jitter, wander, holdover, and other performance specifications detailed in Telcordia GR-253-CORE (SONET), or ITU-T G.813 (SDH) while in the tracking mode. (NOTE: this implies a jitter and wander budget distributed across all the clocks in the system in order to achieve the requisite performance specifications at the optical interfaces).

REQ 6.79.9 For a SONET/SDH/ PDH line card which outputs a reference clock on TCLKB derived from an external network interface, TCLKB shall be either 8kHz or the native frequency of the line-interface. The frequency shall be one of the frequencies allowed by PICMG 3.0 for CLK3: 19.44MHz (SONET/ SDH/ PDH), 1.544MHz (T1), 2.048MHz (E1), and 8kHz.

REQ 6.79.10 For a SONET/SDH/ PDH line card, the rising edge of TCLKB shall occur at a regular interval and shall have a high time of at least 45 ns.

REQ 6.79.11 For a SONET/SDH/ PDH line card which outputs a reference clock on TCLKD derived from an external network interface, TCLKD shall be either 8kHz or the native frequency of the line-interface. The frequency shall be one of the frequencies allowed by PICMG 3.0 for CLK3: 19.44MHz (SONET/SDH/ PDH), 1.544MHz (T1), 2.048MHz (E1), and 8kHz.

REQ 6.79.12 For a SONET/SDH/ PDH line card, the rising edge of TCLKD shall occur at a regular interval and shall have a high time of at least 45 ns.

REQ 6.79.13 For a SONET/SDH/ PDH line card which outputs a reference clock on TCLKB or TCLKD derived from an external network interface, TCLKB and TCLKD shall meet the requirements for traceability to a Stratum 1 PRS.

REQ 6.79.14 Carriers which map the three AdvancedTCA defined clocks (CLK1A/ CLK1B, CLK2A/ CLK2B, and CLK3A/ CLK3B) to the AMC clocks (TCLKC, TCLKA, and TCLKB) should maintain the relationship defined in Table 6-8, “Telecom Clock details - SONET/ SDH/ PDH Line Cards.”

REQ 6.80 For a Carrier designed to provide backwards-compatible support for SONET/SDH/ PDH line cards designed to AMC.0 R1.0, which provided an allowance to receive the 8kHz Clock on TCLKA, the Carrier should provide the capability of providing either a 19.44MHz or 8kHz Clock on TCLKA. The configuration of such a clocking system should be provisioned through Clock E-Keying.


6.3.3.2 SONET/ SDH/ PDH System Timing Modules

¶ 45 Table 6-9 defines the preferred frequencies for the Telecom clocks used in SONET/SDH/ PDH profiles. The minimum quality requirements of the clocks are defined based on usage of the clock and how that usage model fits within the Stratum clocking hierarchy. The Telecom Clocking architecture defined here allows for redundant clocking as well as for non-redundant clocking architectures. Redundant clock inputs to the Module can be provided on TCLKA/TCLKC and outputs from the Module on TCLKB/TCLKD. When using redundant clocks, only one clock frequency will be available. It is expected that the designer be able to synthesize the missing clock from the one provided.

Requirements

REQ 6.81 For AMC-based System Timing Modules, the following requirements shall apply for Carriers and Modules:

REQ 6.81.1 For a SONET/SDH/ PDH System Timing Module, the Module shall receive redundant inputs of the same frequency (limited to 8kHz, 1.544MHz, 2.048MHz, and 19.44MHz) on both TCLKA and TCLKC.

REQ 6.81.2 A System Timing Module shall have a minimum hardware quality level of Stratum 3, and preferably should be Stratum 3E.

REQ 6.81.3 A System Timing Module shall support 3 modes of operation: freerunning (natural frequency of the undisciplined Stratum 3/3E oscillator), holdover (last known good frequency of the disciplined Stratum 3/3E oscillator after all input signals have been lost), and tracking (the clock is phase-locked to one of the redundant inputs and its output is a Stratum 1 traceable signal). Additional modes may be supported.

REQ 6.81.4 For a SONET/SDH/ PDH System Timing Module, the Module shall receive a Clock on TCLKA. The expected frequencies shall be the frequencies allowed by PICMG 3.0 for CLK3: 19.44MHz (SONET/SDH/ PDH), 1.544MHz (T1), 2.048MHz (E1), and 8kHz.

REQ 6.81.5 For a SONET/SDH System Timing Module, the Module shall provide a 19.44MHz Clock on TCLKB. Its jitter and wander characteristics shall permit SONET/SDH/ PDH outputs to meet the relevant jitter, wander, holdover, and other performance specifications detailed in Telcordia GR-253-CORE (SONET), or ITUT G.813 (SDH) while in tracking mode. (NOTE: this implies a jitter and wander budget distributed across all the clocks in the system in order to achieve the requisite performance specifications at the optical interfaces).

REQ 6.81.6 For a SONET/SDH/ PDH System Timing Module, the Module shall receive a Clock on TCLKC. The expected frequency shall be the frequency allowed by

Table 6-9 Telecom Clock details - SONET/ SDH/ PDH System Timing Modules

Clock Name Contacts Frequency Direction Analog in ATCA spec

TCLKA 74/75 8kHz, 1.544MHz, 2.048MHz, or 19.44MHz

In to Module ATCA CLK3A

TCLKB 77/78 19.44MHz Out from Module ATCA CLK2

TCLKC 135/136User selectable (19.44MHz/2.048MHz/1.544MHz/8KHz)

In to Module ATCA CLK3B

TCLKD 138/139 8KHz Out from Module ATCA CLK1


PICMG 3.0 for CLK3: 19.44MHz (SONET/SDH), 1.544MHz (T1), 2.048MHz (E1), and 8kHz.

REQ 6.81.7 For a SONET/SDH/ PDH System Timing Module, the Module shall provide an 8kHz clock on TCLKD. Its jitter and wander characteristics shall permit SONET/SDH/ PDH outputs to meet the relevant jitter, wander, holdover, and other performance specifications detailed in Telcordia GR-253-CORE (SONET), or ITU-T G.813 (SDH) while in tracking mode. (NOTE: this implies a jitter and wander budget distributed across all the clocks in the system in order to achieve the requisite performance specifications at the optical interfaces).

REQ 6.81.8 A System Timing Module should support redundant external electrical interfaces (T1/E1) for connection directly to a BITS clock or GPS receiver.

REQ 6.81.9 A System Timing Module should support two external electrical interfaces (T1/E1) for providing Clock references to other equipment (e.g. to a BITS clock, to a test set, to another Shelf or system).

REQ 6.81.10 The external electrical interfaces for a System Timing Module may be either faceplate accessible, or RTM accessible via the Extended Options Region of the AMC Connector

REQ 6.81.11 One of the two System Timing Module external outputs should be designated as a monitor (test) output for connection to Clock performance monitoring test sets. The second output should be a derived timing signal for distribution of the Clock to other nodes or equipment. The monitor output may be used as a second clock distribution signal if it is not required for monitoring.

REQ 6.82 For a Carrier supporting a SONET/SDH/ PDH System Timing Module, the Carrier shall provide a clock on TCLKA. The frequency shall be one of the frequencies allowed by PICMG 3.0 for CLK3: 19.44MHz (SONET/SDH/ PDH), 1.544MHz (T1), 2.048MHz (E1), and 8kHz. The Carrier should provide TCLKA to the Modules directly from ATCA CLK3A, or electrically derived from ATCA CLK3A. TCLKA shall meet the requirements for traceability to a Stratum 1 PRS.

REQ 6.83 For a Carrier supporting a SONET/SDH/ PDH System Timing Module, the Carrier shall provide a clock on TCLKC. The frequency shall be one of the frequencies allowed by PICMG 3.0 for CLK3: 19.44MHz (SONET/SDH/ PDH), 1.544MHz (T1), 2.048MHz (E1), and 8kHz. The Carrier should provide TCLKC to the Modules directly from ATCA CLK3B, or electrically derived from ATCA CLK3B. TCLKC shall be traceable to a Stratum 1 PRS.

REQ 6.84 For a Carrier supporting a SONET/SDH/ PDH System Timing Module, the Carrier shall receive the 19.44MHz clock on TCLKB.

REQ 6.85 For a Carrier supporting a SONET/SDH/ PDH System Timing Module, the Carrier should output TCLKB to ATCA CLK2[A:B].

REQ 6.86 For a Carrier supporting a SONET/SDH/ PDH System Timing Module, the Carrier may provide electrical buffers for TCLKB, so long as the output clock still meets the quality requirements.

REQ 6.87 For a Carrier supporting a SONET/SDH/ PDH System Timing Module, the Carrier shall receive the 8kHz clock on TCLKD.

REQ 6.88 For a Carrier supporting a SONET/SDH/ PDH System Timing Module, the Carrier should output TCLKD to ATCA CLK1[A:B].


REQ 6.89 For a Carrier supporting a SONET/SDH/ PDH System Timing Module, the Carrier may provide electrical buffers for TCLKD, so long as the output clock still meets the quality requirements.

6.3.4 Fabric Clock¶ 46 The high speed serial signaling interfaces are originally specified for cable interfaces and

work without the need for external clocking. However variants defined for on-board interfacing may derive advantages from the use of a common Fabric clock among the participants.

¶ 47 An important example for this is PCI Express, which is a high speed serial interconnect specified as a local, on-board interconnect and for the connection of I/O cards. Unlike other high speed serial interconnects, PCI Express is specified to operate also in a spread spectrum mode. If the spread spectrum mode is used, the jitter requirements of the PCI Express Specification can be fulfilled only if the connected participants are clocked by a common clock source carrying the spread spectrum modulation.

Requirements

REQ 6.37bIf data transfer protocols used on the Fabric Interface require a common clocking support, then FCLKA shall be used for this purpose. The relevant subsidiary specification shall define requirements for such usage.

6.4 JTAG Interface¶ 48 JTAG IEEE 1149.1 Test Access Port (TAP) support is provided on the AMC Connector. This

provides an industry standard method of performing manufacturing test and verification and is critical to the test of today's complex products that are often making extensive use of BGA device packages. The JTAG Interface enables a variety of cost-effective, structural test and programming solutions for devices, boards, and systems applicable across all phases of product development, manufacturing, installation, servicing and repair with minimal incremental Materials Only Cost (MOC). The optional JTAG support is provided via the Extended Side of the AMC Connector, which is available in the B+ or A+B+ Connectors.

¶ 49 The Module can support JTAG as required by the vendor. The Carrier can provide JTAG chain support for Modules and must allow the chain to be kept intact in the absence of an empty Module Bay. If it supports JTAG, the Module must function correctly on a non-JTAG supporting Carrier by providing applicable pullup/pulldown resistors. See Table 6-10.

¶ 50 Buffering of the JTAG signal distribution is prescribed both on the Carrier and on the Module for the support of high test clock rates and for reliable functionality of the JTAG test in non-AdvancedTCA environments.

¶ 51 Table 6-10 shows the required signals for the JTAG Interface.


Table 6-10 JTAG signals

Requirements

REQ 6.38 AMC Modules should support the JTAG Interface.

REQ 6.39 A JTAG supporting AMC Module shall operate on an AMC Carrier Board which does not support JTAG.

REQ 6.40 The JTAG Interface shall be compliant to the IEEE 1149.1 specification.

REQ 6.41 The signaling voltage for the JTAG Interface shall be 3.3 V.

REQ 6.42 JTAG supporting AMC Modules shall provide a 10 KΩ pulldown for TCK to Logic Ground.

REQ 6.43 JTAG supporting AMC Modules shall provide a 10 KΩ pullup for TMS to 3.3V derived from the Payload Power.

REQ 6.44 JTAG supporting AMC Modules shall provide a 10 KΩ pulldown to Logic Ground for TRST#.

REQ 6.45 JTAG supporting AMC Modules shall provide a 10 KΩ pull up for TDI to 3.3V derived from the Payload Power.

REQ 6.46 Carriers may support the JTAG Interface provided by the Extended AMC Connector model.

REQ 6.47 If the JTAG chain is supported, the AMC Carrier shall provide a mechanism for JTAG chain selection where only a subset of the possible AMC Modules have been populated or are targeted for a given JTAG operation.

REQ 6.48 If a Carrier supports JTAG testing, the Carrier shall provide the complete TDI, TDO, TRST#, TMS, and TCK JTAG signal set to the AMC Module Interface.

REQ 6.49 If a Carrier supports JTAG testing, then it shall provide individual drivers of TCK, TMS, TDI, and TRST# to each AMC Connector. 8 mA or better driving capability shall be provided. A source terminated series resistor, which is sized according to the output characteristics of the driver, shall be applied to the TCK, TMS, and TDI signals (e.g., typically 33Ω for LVCMOS buffer technology and 47Ω for LVTTL buffer technology).

REQ 6.50 JTAG supporting AMC Modules shall provide signal buffering for TCK, TMS, TRST#, and TDI. The signal length from the Connector to the buffer shall not exceed 100 mm.

REQ 6.51 JTAG supporting AMC Modules shall provide an individual driver for TDO with a series terminating resistor at the driver as required by the driving buffer output characteristics.

Signal Direction Purpose

TCK From AMC Carrier to Module Test Clock

TMS From AMC Carrier to Module Test Mode Select

TRST# From AMC Carrier to Module Test Reset (active low)

TDI From AMC Carrier to Module Test Data In

TDO From AMC Module to Carrier Test Data Out


REQ 6.52 If a Carrier supports JTAG testing, then it shall provide signal buffering for TDO with corresponding 10K pull up resistor to the 3.3V derived from the Payload Power on the input.

REQ 6.53 If a Carrier supports JTAG testing, then it shall provide a scan chain selection mechanism to support independent testing of the AMC Modules.

REQ 6.54 The Module shall provide level shift control of the JTAG signals toward components which are not 3.3V interface compliant.

REQ 6.55 The Module shall provide appropriate gating of the JTAG signals toward components which could be damaged if a signal potential is applied when not or only partially powered.

REQ 6.90 A Carrier with JTAG test capability shall support a mix of JTAG and non-JTAG supporting Modules. Full JTAG testing of supported AMC Modules and the scan chains shall not be disrupted by the presence of a Module without JTAG support or a removed Module.

REQ 6.91 A Module not supporting JTAG shall operate on an AMC Carrier Board that does support JTAG.

6.5 System integration guidelines

¶ 52 The design flexibility offered by the Fabric Interface requires some guidelines to ensure proper interoperability between compatible AMC Modules and their Carrier Boards. The following sections describe the minimum compatibility requirements for Carrier Boards and Modules to ensure interoperability.

¶ 53 The AMC Electronic Keying mechanism will confirm compatible connections exist prior to interface drivers being enabled. This ensures incompatible Module/Carrier combinations do not damage one another; however, interoperability of compatible boards can only be obtained when they are installed correctly. The AMC subsidiary specifications detail the Fabric Interface usage specific requirements to ensure interoperability.


6.6 AMC Carrier fabric topologies¶ 54 The AMC Connector provides up to 20 Ports of Fabric Interface connectivity. This gives the

flexibility to support a variety of fabric topologies. The following sections describe two fabric topologies that are expected to cover many of the application requirements and can be supported with AMC Carrier applications.

¶ 55 Supporting multiple fabrics and/or topologies within a single system environment can be advantageous both for:

• Communications applications that require high speed, low latency data-plane interconnects.

• Control-plane interconnects with less stringent latency and jitter requirements.

6.6.1 Fundamental routing models¶ 56 There are fundamentally two AMC Carrier routing models that can be adopted, these being

the centralized AMC switch model and the Module to Module direct connectivity model. The connectivity of the Module to the AMC Carrier AdvancedTCA Board's Zone 2 Connector is typically implemented via the AMC Carrier provided switch element as this allows the coupling of the non-redundant local signals to the redundant network on the Backplane. Figure 6-9 and Figure 6-10 show how direct AMC Module connectivity to the AdvancedTCA Zone 3 for rear I/O support could be supported.

6.6.1.1 Centralized AMC Carrier switch model

¶ 57 The general purpose AMC Carrier will likely implement a centralized fabric specific switch. This allows point-to-point connectivity to be achieved from each Module to each and every other Module as well as connectivity into the AdvancedTCA Zone 2 Fabric Interface.

Figure 6-9 Centralized switch model


6.6.1.2 Module-to-Module direct connectivity model

¶ 58 It is allowed and supported to establish direct connection on a Carrier between a Port of one AMC Slot and a Port of another AMC Slot. This can help in developing optimized solutions.

¶ 59 If the interconnect between two AMC Modules is based on LVDS, then it is required to make a cross-over on the Carrier between the transmit and receive pairs for each connected Port. This ensures that the transmit connections of one AMC are connected to the receive connections of the other AMC.

¶ 60 The AMC Ports might carry protocols other than those based on directed signal pairs. In this case the pin mapping of the Ports involved in such a protocol lose their logical association to the Tx, Rx pin assignments of this specification. If Modules are interconnected via this type of an interface, then for the Ports involved in the assignment of this interface the Carrier has to implement a pin to pin parallel interconnect without any crossover.

Figure 6-10 Module-to-Module direct connectivity

6.7 Guidance for AMC.0 subsidiary specifications¶ 61 This section provides guidance for assignment of ports in AMC.0 subsidiary specifications,

so as to encourage interoperability and flexibility.

¶ 62 Three primary regions are defined for AMC Ports as illustrated in Figure 6-11: Common Options, Fat Pipes, and Extended Options. A fourth category “AMC Clocks”, is provided for reference purposes only and is already well-defined in Section 6.3.1, “AMC Clock architecture.”


Figure 6-11 AMC Port mapping regions

¶ 63 AMC Connector regions have been defined with the following goals in mind:

1. Optimize Port assignments for the Basic Connector.

2. Eliminate the redundant definition of common options that would be applicable across multiple subsidiary specifications. (i.e. Common Options will be defined only once and then referenced by other subsidiary specifications.)

3. Define availability of four Fat Pipe ports on the Basic Connector, with additional ports available on the Extended Connector. Devices requiring higher throughput would utilize the additional Fat Pipe ports provided by the Extended Connector rather than compromise interoperability goals by extending Fabric I/O into the Common Options region.

4. Enable flexibility in combining multiple protocols defined from any of the three AMC Connector regions, as long as the ports are mutually exclusive.The industry is encouraged to combine non-conflicting ports from any subsidiary specification and from any of the three AMC Connector regions. Subsidiary specifications are encouraged to consider the Port mappings of existing subsidiary specifications which are intended to be implemented in combined configurations and to assign their Links to Ports which are left unused by the respective already existing subsidiary specifications.

¶ 64 The following subsections explain each of these regions.

86

Clocks


TCLKBFCLKA

0123456789101112131415

TCLKC/D17181920

TCLKA

Fat Pipes Region


Basic

Co

nn

ect

or

Ex

ten

ded

Co

nn

ect

or

86

Clocks


TCLKBFCLKA

0123456789101112131415

TCLKC/D

17181920

TCLKA

Fat Pipes Region


Basic

Co

nn

ect

or

Ex

ten

ded

Co

nn

ect

or


6.7.1 Fat Pipes Region¶ 65 The Fat Pipes Region is defined to support data path connections such as PCI Express,

Advanced Switching, Ethernet and Serial RapidIO. A “Fat Pipe” is a data transmission circuit or network that is capable of carrying large amounts of data without significantly degrading the speed of transmission.

¶ 66 The Fat Pipes Region includes a total of 8 Ports using Ports 4-11, with 4 of those Ports defined on the Basic Side and the remaining 4 on the Extended Side of the Connector. The Extended Connector is needed only when more than 4 ports are needed for Fat Pipes.

Requirements

REQ 6.56bFor interfaces in the Fat Pipes Region, the Ports 4-7 and/or the Ports 8-11 should be assigned in increasing order.

REQ 6.59bFor interfaces beyond Port 11, Lane assignment beyond the Fat Pipes Region should continue with Ports 12-15 and 17-20 of the Extended Options Region in increasing order.

6.7.2 Common options region¶ 67 The Common Options region is defined to support essential interfaces that are common

across multiple Fat Pipe implementations. The intent is to define each common interface once and allow it to be used in conjunction with other Fat Pipe interfaces or used independently. This helps to ensure a standardized approach of common options across multiple Fat Pipe subsidiary specifications. The Common Options Region is defined as Ports 0-3 to ensure their availability on a Basic Connector. Ideal candidates for this region include storage (e.g., SAS, SATA and FC) and Control Path interfaces.

Requirements

REQ 6.60 Storage and Control interfaces should be defined using Ports 0-3.

REQ 6.61 When additional Ports beyond Ports 0–3 are needed for Storage and Control interfaces, they should be defined in the Extended Options region, in increasing order starting from Port 12.

6.7.3 Extended options region¶ 68 The Extended Options Region is loosely defined but recommend for use for RTM (Rear

Transition Module) support. It is also recommended for use as an extension of both the Common Options and Fat Pipes Regions, when additional Ports are needed.

Note: Port 16 from the R1.0 spec has now been re-defined for clock use and is no longer generally available for RTM usage.

Requirements

REQ 6.62bRTM definition should use Ports 20-17 and 15-12, in descending order starting from Port 20.


6.7.3.1 Non-LVDS interface guidance

¶ 69 Support for non-LVDS interfaces could require most, if not all, of the pin assignments of an AMC Connector. However, as a general rule, definition of non-LVDS interfaces are encouraged to first be defined in the Extended Options Region.

Requirements

REQ 6.63bNon-LVDS interfaces should be defined in descending order, starting from Port 20.

REQ 6.92 APS interfaces for inter-AMC SONET protection switching should be defined at Port 12.

6.7.4 Naming conventions¶ 70 General guidelines are provided to standardize AMC naming conventions for two primary

reasons: First, to define how to refer to Modules/Carriers supporting multiple subsidiary specifications; Second, to define how to refer to multiple configuration types within a single subsidiary specification. The naming conventions simply provide a shorthand approach for referring to subsidiary specifications and should not be confused with any claims of interoperability. Abbreviated “Type” designations are to be defined in AMC subsidiary specifications.

6.7.4.1 General naming guidelines

1. “Fat Pipe” Types are specified with a numeric designation when multiple options are defined within a single subsidiary specification. For example:

a. PCI Express defines x1, x2, x4 and x8 Link definitions. Therefore, these may be referred to as Type 1, Type 2, Type 4, and Type 8, respectively.

b. If an Ethernet subsidiary specification defined two separate 4 Port Links, these may be referred to as Type 1 (supports 1 Link) and Type 2 (supports 2 Links).

c. If a SPI-4.2 subsidiary specification were defined, only one Link would be possible on an AMC Connector. In this case, a Type designation is not needed.

2. “Common Option” Types are specified/abbreviated with a letter designation. For example, the following letters are options for anticipated interfaces in this region:

a. Type E = Gigabit Ethernet (example of multiple Links; E1 = 1 Link; E2 = 2 Links)

b. Type P = PCI Express Control Port

c. Type F = Fibre Channel

d. Type S = SATA (example of multiple Links; S1 = 1 Link; S2 = 2 Links)

e. Type A = SAS

f. Type R = RapidIO

3. If the interface supported is a single “Fat Pipe” or single “Common Option” interface, then the full specification is referenced. For example:

a. AMC.1 is defined for PCI Express and Advanced Switching in the Fat Pipe region. Therefore, a PCI Express x4 Link would be referred to as AMC.1 Type 4.


b. AMC.2 is defined for GbE in the Common Options Region. Therefore, a single GbE Link would be referred to as AMC.2 Type E (or simply AMC.2) and two GbE Links would be referred to as AMC.2 Type E2.

4. If a “Fat Pipe” Type is combined with a “Common Option” Type then the combined Type = AMC. [Fat Pipe spec #] Type[# of Fat Pipe type] + [letter of the General Option type]. See Table 6-11 for examples.

Table 6-11 General naming guideline examples

Note: When multiple specifications are combined within the Common Options region, the full interface for each interface should be stated. For example, if both GbE and Fibre Channel were defined on an AMC Module, the Module would be referred to as: AMC.2 Type E and AMC.3 Type F (or simply, AMC Type EF).

Note: Individual dot specifications describe how Modules are referred to when implemented with that interconnect technology.

AMC Slot on Carrier Board

Translated MeansModule Types Supported

Fat Pipes + General Options

AMC.1 Type 4SAMC.1 Type 4 = x4 PCI Express or AS

+ S = SATAAMC.1 Type 4 AMC.3 Type S AMC.1 Type 4S

AMC.1 Type 8EFAMC.1 Type 8 = x8 PCI Express or AS

+ E = 1 GbE F = Fibre Channel

AMC.1 Type 8 AMC.2 Type EAMC.3 Type FAMC Type EF AMC.1 Type 8EAMC.1 Type 8FAMC.1 Type 8EF


AMC Connector 7

7.1 General information¶ 1 This section specifies the family of AMC Connectors that supports the AMC usage models

and their mechanical outline as specified in Section 2, “Mechanical.” It includes general Connector information as well as the interfaces to the AMC Module PCBs and to the Carrier Boards, and a functional contact list.

¶ 2 For the qualification and reliability assessment, the appropriate operational conditions of the AMC Connectors are defined as follows:

Requirements

REQ 7.1b AMC Connector manufacturers shall comply with Performance Level 4, System Quality Requirements III, and Quality Level III according GR-1217-CORE.

REQ 7.2b AMC Connector manufacturers shall state the Performance Level, the System Quality Requirements, Level, and the Quality Level according GR-1217-CORE of their products within their documentation.

¶ 3 The AMC Connector is a single-part Z-Pluggable Connector. It contains groups of contacts for power, for general purpose connections, and for very high speed transmissions.

¶ 4 The general contact pitch is 0.75mm at the Module side and at the Carrier side.

¶ 5 The AMC Connector makes pluggable card edge connections to the contact fingers on the AMC Module PCB and by either solderless compression or other methods to either connections to the conductive pads or other conductive features on the Carrier Board. If required, it can be mounted on the Carrier by means of two screws through the Carrier Board onto a steel Connector Brace.

¶ 6 The AMC Connectors also support non-ATCA applications.

Requirements

REQ 7.3b The design of the AMC Connectors shall be suitable for lead free manufacturing processes (and free of other hazardous substances from the RoHS guidelines).

REQ 7.4 The interconnection technology of the AMC Connectors shall be suitable for lead free applications.


7.1.1 AMC Connector options¶ 7 The Basic Connector only connects to contact fingers on Component Side 1 of the AMC

Module PCB, called the Basic Side of the AMC Module interface.

¶ 8 The Extended Connector connects to contact fingers on both sides of the AMC Module PCB. The contacts on Component Side 2 are called the Extended Side of the AMC Module Interface.

¶ 9 Compared to the Extended Connector, the Basic Connector can provide a cost advantage for the Connector and can save real estate on the Carrier Board.

¶ 10 AMC Connector contact definitions have been made such that the indispensable connections are implemented in the Basic Side in order to be available in the AMC Basic Connectors and the AMC Extended Connectors. Connections for additional differential pair signals have been implemented in the Extended Side, so they are only available in the AMC Extended Connectors.

Note: JTAG, TCLKC, and TCLKD are only available with AMC Extended Connectors.

¶ 11 The functional contact lists in Table 7-1 and Table 7-2 outline the general usage. The various AMC Connector styles are summarized in Table 7-3.

¶ 12 The Basic Connectors have been designated as B and AB, while the Extended Connectors have been designated as B+ and A+B+.

¶ 13 Included in this version of the specification are three new Connector types, in addition to the compression Connector; compliant pin, surface mount, and plated through hole. The compression Connector mechanical drawings have been updated in Figure 7-3, Figure 7-4, Figure 7-5, Figure 7-7, Figure 7-8, Figure 7-10, and Figure 7-11 and new “black box” mechanical drawings have been added for mechanical dimensioning for these new Connectors in Figure 7-6, Figure 7-9, and Figure 7-12.

Table 7-1 Functional contact list: Basic Side

Requirements

REQ 7.5 All AMC Connector styles shall contain all the contacts to connect to Component Side 1 of the AMC Modules.

REQ 7.6 AMC Connector styles B+ and A+B+ shall contain all contacts to connect to both sides of the AMC Modules.

Basic Side (AMC Module Component Side 1)

Power 2, 9, 18, 27, 42, 57, 72, 84

Ground 1, 7, 10, 13, 16, 19, 22, 25, 28, 31, 34, 37, 40, 43, 46, 49, 52, 55, 58, 61, 64, 67, 70, 73, 76, 79, 82, 85

General purpose 3, 4, 5, 6, 8, 17, 26, 41, 56, 71, 83

Differential pairs 11/12, 14/15, 20/21, 23/24, 29/30, 32/33, 35/36, 38/39, 44/45, 47/48, 50/51, 53/54, 59/60, 62/63, 65/66, 68/69, 74/75, 77/78, 80/81


REQ 7.7 The AMC Connectors shall not provide any electrically conductive features toward the Module PCB or the Carrier Board except for the defined contacts to the defined contact pads.

REQ 7.8 Basic and Extended Connectors shall follow the functional contact lists as given in Table 7-1.

REQ 7.87 The Connector contact surface roughness should not exceed Ra = 0.2µm.

Table 7-2 Functional contact list: Extended Side

Requirements

REQ 7.9 Extended Connectors shall follow the functional contact lists as given in Table 7-2. Basic Connectors shall leave these extended contacts unconnected.

7.1.2 Family of AMC Connector styles¶ 14 The AMC Connector family consists of four different Connector styles, with three different

housings.

Table 7-3 Number of contacts in the fixed Connector

Extended Side (AMC Module Component Side 2)

Power None

Ground 86, 89, 92, 95, 98, 101, 104, 107, 110, 113, 116, 119, 122, 125, 128, 131, 134, 137, 140, 143, 146, 149, 152, 155, 158, 161, 164, 170

General purpose 165, 166, 167, 168, 169

Differential pairs87/88, 90/91, 93/94, 96/97, 99/100, 102/103, 105/106, 108/109, 111/112, 114/115, 117/118, 120/121, 123/124, 126/127, 129/130, 132/133, 135/136, 138/139, 141/142, 144/145, 147/148, 150/151, 153/154, 156/157, 159/160, 162/163

Connector Style

Interface to AMC Module

Number of Module

Slots

Number of contact positions to Carrier

Number of contact rows on Carrier

Differential pairs

General purpose contacts

Power contacts

Ground contacts

B Basic 1 85 1 19 11 8 28

B+ Extended 1 170 2 45 16 8 56

AB Basic 2 170 2 38 22 16 56

A+B+ Extended 2 340 4 90 32 16 112


Figure 7-1 Overview of AMC Connector housings

¶ 15 On a Dual Slot Cutaway Carrier Board two layers of Compact AMC Modules can be used. AMC Connectors AB and A+B+ provide the interconnections between both AMC Module layers and the Cutaway Carrier Board.

¶ 16 On a Conventional Carrier Board (no cut-out), only AMC Module Layer B can be used. AMC Connectors B and B+ provide the connections between Module Layer B and the Conventional Carrier Board.

¶ 17 The AMC Connector housing contains features to facilitate the assembly of the AMC Carrier Component Covers.

¶ 18 On Component Side 1 and Component Side 2 (top and bottom), the housings have posts to align the AMC Carrier Component Covers. At their extremities they contain recesses for the passage of the Component Cover mounting screws. Their overall height keeps the Component Covers at the right distance, independently of the Carrier Board thickness.

Requirements

REQ 7.10 Each of the four AMC Connector styles shall contain exactly the number of contacts for the specified purposes.

REQ 7.74 The AMC Connector styles shall provide Side 1 component cover plate alignment posts.

REQ 7.75 The AMC Connector styles may include Carrier alignment post (see Figure 7-3, front view), integral side stand offs for controlling the height and position of the side 2 component cover plates, or passages for recessed hold-down screws (see Figure 7-1).

REQ 7.12 The lead-in chamfers of the plug-in Slots of the AMC Connector shall be able to correct a maximum misalignment of the AMC Module PCB of ± 1mm in the height and width directions, taking the lead-in features of the AMC Module PCB into account.

Side 2 Component Integral side stand offRecessed passage

for hold-down screw

Side 1 cover plate alignment posts


7.1.3 Contact protection mechanism (optional)¶ 19 The AMC Connector may contain an optional feature to protect the contact beams from

damage during insertion over the card edge. The Contact Protection Mechanism prevents the contacts from scraping over the milled chamfers, where potentially exposed copper layers and glass fibers cause wear and eventual contamination to the contact surface.

¶ 20 A mechanical device hovers the contacts over the AMC Module PCB edge, and lets them land on auxiliary pads in front of the actual contact pads. The contact lifting and landing sequence does not reduce the function of the contact staging. See Section 2, “Mechanical.”

¶ 21 The Connector bodies equipped with the optional Contact Protection Mechanism have optional protrusions on both ends of the Connector Slot.

Figure 7-2 Overview of Connector housings with optional protrusions

Requirements

REQ 7.13b The AMC Connector may be equipped with a Contact Protection Mechanism which uses optional protrusions on both ends of the Connector Slot to lift the contacts over the milled edge of the AMC Module PCB.

REQ 7.14b When used, AMC Connector styles equipped with the Contact Protection Mechanism shall not extend beyond the specified envelope for the optional protrusion, according to the drawings in Figure 7-3, Figure 7-6, Figure 7-7, Figure 7-9, Figure 7-10, and Figure 7-12.

REQ 7.15b When used, the Contact Protection Mechanism shall guarantee that during the insertion of the Module PCB, all connections to the contact pads on both sides of the Module PCB have the specified characteristics, except for the area within 1.5mm from the edge of the Module PCB (datum J).

Style A+B+

Style AB

Style B/B+


7.2 Dimensions¶ 22 Original dimensions are in millimeters and all dimensions on the drawings and tables are in

millimeters. The decimal point is used instead of the decimal comma.

¶ 23 All drawings are shown in third angle projection.

¶ 24 This section specifies only the dimensions of the AMC Connectors. The footprints on the Carrier Board and the contact fingers on the AMC Module PCB are specified in Section 2, “Mechanical” of this specification.

¶ 25 Datum J in the Connector has changed to datum J1. The location of the datum has changed from the compression Connector Carrier aligning post to the back wall of the Card Slot.

Requirements

REQ 7.16 Dimensions and tolerances in the drawings in Figures 7-3 through 7-14 shall be observed.

REQ 7.17 The shape of the parts may deviate from the one given in the drawings, as long as the specified dimensions are not affected and the intended functionality is provided.

REQ 7.76 On side 1 of the Carrier, solder masks shall not be permitted in the Carrier Connector Keepout Area, per the manufacturer’s data sheet.

REQ 7.77 Components shall not be allowed on side 2 of the Carrier where manufacturers’ Connector data sheets indicate interference with Connector features.

REQ 7.78 Connector manufacturers shall specify with Connector documentation the mechanical location on the Carrier with respect to J1 and L1 of the Connector. In addition this documentation shall also locate pin 1 of each Connector with respect to Datum E of the Carrier Board and Datum L1 of the Connector.

REQ 7.88 Connector mounting holes, Carrier alignment post holes, and Side 2 component cover support holes shall be non-plated through holes without copper pads.


7.2.1 Dimensions of AMC Connectors style B and style B+Figure 7-3 Overall dimensions of AMC compression Connector style B and style B+

2x

7.00

2x

2.10

0.75 x 84 = 63.00

3.50

±0.1

0

0.75

65.15 ±0.05

2.90

0.10

3.90

71.50

74.80 ±0.052 x 2.40 ±0.03

Integral Side 2Component CoverStandoffs (Optional)


Module BComtact 1

Module BComtact 170

Carrier Alignment Post Carrier Alignment Post

0.1 P1 L1

0.3 J1

0.1 L1

1.45

-

±0.0

521

.85

±0.1

013

.60

x45

1.70

x45

0.80

5.80

±0.0

5

0.00

0.10

min

.15

.00

0.65

-0.1

00.

00

OptionalProtrusion

Integral Side 2 Component Cover Standoffs(Optional)

M

M

M

2 x 2.65 min.

±0.05

75.00

2.252 x R2x

4.70

min

.

Optional Protrusion Optional ProtrusionCenter Line of Contact Points

Contact Points 0.1 S

0.1 L1 J1

0.00 J1L1

S J1

10.60 max.

max.7.10 max.6.60

±0.081.90

min.

All

Aro

und

min

.1.

00

All Around1.00

13.1

0m

ax.

OptionalProtrusion


(J1 to Carrier Alignment Post Center)

Carrier Alignment Posts

0.1 P1 J1

M1

F1

P1

J1


Requirements

REQ 7.19 In order to ensure the intended functionality and compatibility under all possible mating circumstances, the design of AMC Connector styles B and B+ shall take all potential effects into account of the dimensions of the AMC Module PCB interfaces and board guiding features specified in Section 2, “Mechanical.”

Figure 7-4 View on the compression mounted bottom of AMC Connector style B

0.75

(Carrier Alignment Posts)

0.75

0.75

1.20

+0.01

85 Contact Points

0.032 x 1.44 -

0.04 F1 J1 L1

(Different shape and dimensions allowedto ensure better connector positionningand performance)

M

M

65.00

S

2 x

70.30

L1J1

6.45

min.

±0.05

2.65

63.0084 x 0.75 =

2 x

0.05 F1

0.1


Figure 7-5 View on the compression mounted bottom of AMC Connector style B+

Requirements

REQ 7.20 In order to ensure the intended functionality and compatibility under all possible mounting circumstances, the design of the compression contacts of AMC Connector styles B and B+ shall take all potential effects into account of the dimensions of the Carrier Board interface specified in Section 2, “Mechanical.”

0.750.75

5.00

5.00

170 Contact Points

1.20

(Carrier Alignment Posts)4 x 1.44 ±0.02

0.75

1.20

0.04 F1 J1 L1


M

M

2 x

2 x

2.65

65.00

63.0084 x 0.75 =

2 x

70.30

min.

6.45 ±0.05S

J1 L10.05 F1

0.1


Figure 7-6 Overall dimensions of AMC general Connector definition style B and B+


7.2.2 Dimensions of AMC Connector style ABFigure 7-7 Overall dimensions of compression mounted AMC Connector style AB

2x

7.00

12.1

03.

50±0

.10

0.75 x 84 = 63.000.75

2.87

5

17.9

5

2.90

10.10

10.60 max.

71.50

M

0.1 L1

0.05 L1

0.00 J1

M

M2 x

75.00

2.65 min.

±0.054.502 x2x

4.70

min

.

Optional Protrusion Optional ProtrusionCenter Line of Contact Points

Contact Points

0.1 S

0.1 L1 J1

S

J1

max.

1.00

max.7.10

max.16.60

±0.081.90

±0.081.90

5.80

All

Aro

und

min

.1.

00

All Aroundmin. (D

raw

n2.

50)

5.80

max

.

OptionalProtrusion


Two Surfaces

(J1 to Carrier Alignment Post Center)

CarrierAlignment Posts

0.1 P1 J1

0.1 F1 J1

0.1 F1

M1

M2

J1

F1

P1

M

2.40 ±0.03

±0.0574.80

±0.0565.15

2 x65.15 ±0.05



Slot B

Slot A

Module BComtact 1

Module AComtact 1

0.1 P1 L1

0.3 J10.00 J1

L1

1.45

-

±0.0

521

.85

x45

0.80

x45

1.70

5.80

±0.0

5 0.00

0.10

min

.15

.00

±0.1

013

.60

0.65

-1.0

00.

00

OptionalProtrusion

Integral Side 2 ComponentCover Standoffs (Optional)


Requirements

REQ 7.21 In order to ensure the intended functionality and compatibility under all possible mating circumstances, the design of AMC Connector style AB shall take all potential effects into account of the dimensions of the AMC Module PCB interfaces and board guiding features specified in Section 2, “Mechanical.”

Figure 7-8 View on compression mounted bottom of AMC Connector style AB

1.20

1.20

0.03

5.00


0.750.75

5.00

+0.01

170 Contact Points

0.75

4 x 1.44 -

0.04 F1 J1 L1


M

M

2 x

S

2.65

65.00L1J1 2 x

70.30

min.

6.45 ±0.05

63.0084 x 0.75 =

2 x

0.05 F1

0.1


Requirements

REQ 7.22 In order to ensure the intended functionality and compatibility under all possible mounting circumstances, the design of the compression contacts of AMC Connector style AB shall take all potential effects into account of the dimensions of the Carrier Board interface specified in Section 2, “Mechanical.”


Figure 7-9 Overall dimensions of AMC general Connector definition style AB


7.2.3 Dimensions of AMC Connector style A+B+Figure 7-10 Overall dimensions of compression mounted AMC Connector style A+B+

71.50

2x

7.00

17.1

0

0.753.50

±0.1

0

0.75 x 84 = 63.00

2.87

5

17.9

5

2.90

10.10

10.60 max.

M

65.15 ±0.05

±0.0565.15

±0.0574.80

2.40 ±0.03



Slot B

Slot A

Module BComtact 1

Module AComtact 1

Module BComtact 170

Module AComtact 170

0.1 P1 L1

0.3 J10.00 J1

L1

M

Two Surfaces

0.05 L1

0.00 J1

0.1 L1

1.45

-

±0.0

521

.85

x45

0.80

x45

1.70

5.80

±0.0

5

0.00

0.10

±0.1

013

.60

min

.15

.00

0.65

-0.1

00.

00

OptionalProtrusion

Integral Side 2 ComponentCover Standoffs (Optional)

M

M2 x

75.00

2.65 min.

±0.054.502 x

2x

4.70

min

.

Optional ProtrusionOptional Protrusion Center Line of Contact Points

Contact Points

0.1 S

0.1 L1 F1 J1

J1

S

max.

1.00

max.7.10

max.26.60

±0.081.90

±0.081.90 5.80

All

Aro

und

min

.1.

00

All Aroundmin.

(D

raw

n2.

50)

5.80

max

.

OptionalProtrusion

Integral Side 2Component CoverStandoffs (Optional)(J1 to Carrier Alignment Post Center)

CarrierAlignmentPosts

0.1 P1 J1

0.1 F1 J1

0.1 F1

M1

M2

J1

F1

P1


Requirements

REQ 7.23 In order to ensure the intended functionality and compatibility under all possible mating circumstances, the design of AMC Connector style A+B+ shall take all potential effects into account of the dimensions of the AMC Module PCB interfaces and board guiding features specified in Section 2, “Mechanical.”

Figure 7-11 View on compression mounted bottom of AMC Connector style A+B+

1.20

0.75

0.750.75

5.00

5.00

0.03

1.20

1.20


5.00

5.00

5.00

5.00

+0.01

340 Contact Points

1.20

8 x 1.44 -

0.04 F1 J1 L1


M

M

2 x

S

2.65

65.00

L1J1

4 x

70.30

min.

6.45 ±0.05

63.0084 x 0.75 =

2 x

0.05 F1

0.1


Requirements

REQ 7.24 In order to ensure the intended functionality and compatibility under all possible mounting circumstances, the design of the compression contacts of AMC Connector style A+B+ shall take all potential effects into account of the dimensions of the Carrier Board interface specified in Section 2, “Mechanical.”


Figure 7-12 Overall dimensions of AMC general Connector definition style A+B+


7.2.4 Compression Connector braces for the Carrier Board¶ 26 The compression connections to the Carrier Board exert a high pressure on the Carrier Board.

In order to prevent the Carrier Board from bending, a Connector Brace is mounted on Component Side 2 of the Carrier Board.

Requirements

REQ 7.25a If required, on Component Side 2 of the Carrier Board, opposite the AMC Connector, a Connector Brace shall be mounted to exert a homogeneously spread force of at least 0.5N per contact, to compensate for the compression force and prevent the Carrier Board from bending after time and temperature exposure.

REQ 7.26 The Connector Brace should be bowed before being mounted, in order to build up a sufficiently high force when being tightened to the surface of the Carrier Board.

REQ 7.27 During assembly on the Carrier Board, the mounting screws of the AMC Connector shall tighten the Connector Brace to the board.

REQ 7.28a If required, the Connector Brace shall be equipped with an insulating foil of at least 0.5mm thick, to keep the Connector Brace at a distance from potential high-speed traces on Component Side 2 of the Carrier Board.

REQ 7.29a If required, the specification of the screws for the Connector Brace shall be provided by each Connector vendor.

Figure 7-13 Connector brace plate for compression mounted AMC Connectors style B, B+ and AB


Figure 7-14 Connector brace plate for compression mounted AMC Connector style A+B+

7.2.5 Compression mount Connector Carrier board layout¶ 27 The recommended PCB pad layout for the B/B+, AB, and A+B+ connectors is shown in the

figures below.


Figure 7-15 B/ B+ Compression Connector PCB pad layout

1.20

0.10

7.00 0.27.50 0.2

75.0

0 65.0

0

70.3

0

84x

0.75

=63

.00

B1 B170 (This row should beomited for connector style B)

B86 (This row should beomited for connector style B)

B85

Within this area:No soldermask allowed on side 1No components allowed on side 2

L1

±0.02 (Pads)

0.86

(Holes for optional standoff)±0.057.00

(Holes for mounting screw)±0.052.70

(Holes for locator pin)

5.00

2.00

±0.021.62

(Pads)±0.030.86

(Pads)±0.03

0.75

(84

x)

0.53

6.90 (Hole center)

ConnectorDatum

0.1 L1 J1

0.1 L1 J1

0.1 L1 J1

0.1 L1

0.1 J1

0.1 J1

J1


Figure 7-16 AB Compression Connector PCB pad layout

1.20

10.10

17.00 ±0.2

65.0

0

75.0

0

70.3

0

84x

0.75

=63

.00

A85

A1 B1

B85

Connector Datum


L1

0.86

3.105.00

2.00

±0.03 (Pads)

(Holes for optional standoff)±0.057.00

(Holes for mounting screw)±0.052.70

(Holes for locator pin)±0.02

0.75

(84

x)

1.62

(Pads)±0.020.53 0.86 ±0.03 (Pads)

Connector Datum

0.1 L1 J1

0.1 L1 J1

0.1 L1 J1

0.1 L1

0.1 J1

0.1 J1

J1


Figure 7-17 A+B+ Compression Connector PCB pad layout

1.20

10.10

27.00 ±0.2

65.0

0

75.0

0

70.3

0

84x

0.75

=63

.00

A85 A86 B85 B86

A1 A170 B1 B170

Connector Datum


L1

±0.02

3.10

5.00

(Pads)

15.00

7.00

3 x (5.0) =

0.86 ±0.03

standoff)(Holes for optional

±0.05(Holes for mounting screw)

±0.052.70

(Holes hor locator pin)±0.021.62

(Pads)±0.030.86

(Pads)

7.00

0.53

(84

x)0.

75

Connector Datum

0.1 L1 J10.1 L1 J1

0.1 L1 J1

0.1 J1

0.1 J1

0.1 L1

J1


Requirements

REQ 7.89 Carriers using compression-mounted AMC connectors shall utilize the PCB pad footprint shown in Figure 7-15, Figure 7-16, or Figure 7-17, depending on whether B/B+, AB, or A+B+ connectors are used.

7.2.6 PCB plating for compression ConnectorsRequirements

REQ 7.90 Carrier AMC contacts shall be 0.1 micrometers minimum gold over 1.27 micrometers minimum nickel including exposed traces not covered by solder mask underneath the Connector.

7.3 Electrical characteristicsRequirements

REQ 7.30 If not otherwise stated, the electrical parameters are given as minimum or maximum values, and may be different depending on the used layer (e.g., for Basic or Extended Side in style A or B). For more details, compare vendor specifications.

REQ 7.79 Subsets of ground contacts may be connected together within the AMC Connector without limitations. This includes the allowance of interconnects between ground contacts of Slot A and Slot B within the Connector.

REQ 7.69 The AMC Connector shall not short any electrical contacts when Modules are not installed.

7.3.1 Creepage and Clearance distancesCondition: IEC 60 664-1

Table 7-4 Creepage and Clearance distances

Requirements

REQ 7.34 Under the conditions stated in Table 7-4, all Creepage and Clearance distances between all conductors inside the AMC Connector shall be 0.1 mm minimum.

REQ 7.35 Ground shall be isolated from external conductive elements of the Connector other than the Module and Carrier electrical contacts.

Differential pairs General purpose Power section

Between signal and signal 0.1 mm min. 0.1 mm min. 0.1 mm min.

Between signal and ground 0.1 mm min. 0.1 mm min. 0.1 mm min.


REQ 7.36a Connectors shall provide a minimum of 100 V insulation between Logic Ground and any element that might be attached to the outside of the Connector such as the Component Side 2 cover.

7.3.2 Voltage proofConditions: IEC 60512-2, Test 4a

Standard atmospheric conditionsMated and unmated Module PCBWiring arrangement according to Section 7.6.2.2, “Arrangement for insulation resistance measurement and voltage proofing.”

Table 7-5 Rated insulation voltages

Requirements

REQ 7.37 Under the conditions stated in Table 7-5, all insulation voltages between all conductors inside the AMC Connector shall be 80 V r.m.s. minimum.

Insulation voltage Pollution degree

Diff. pair signal to signal 80 V r.m.s. 1 (inside Connector)

Diff. pair signal to ground 80 V r.m.s. 1 (inside Connector)

Gen. purpose signal to signal 80 V r.m.s. 1 (inside Connector)

Gen. purpose signal to ground 80 V r.m.s. 1 (inside Connector)

Power to power 80 V r.m.s. 1 (inside Connector)

Power to ground 80 V r.m.s. 1 (inside Connector)


7.3.3 Current carrying capacity¶ 28 The individual pin current rating is determined by IEC 60512-3. This value is not greater

than 80% of the current that produced a 30 degree Centigrade temperature rise anywhere on or within the Connector. NEBS GR-1217 Core R5-83 also requires an additional 75% derating to be applied if multiple pins are used in parallel, as is done for Payload Power on AMC.

Conditions: IEC 60512-3, Test 5bAll conductors loaded, using power conductor tracks on PCBStandard atmospheric conditionsDerating curve = 80% of measured current carrying capacityWiring arrangement according to Section 7.6.2.3, “Arrangement for current car-rying capacity proofing.”

Figure 7-18 Derating curve for individual Connector contacts

Requirements

REQ 7.38 Under the conditions stated in Figure 7-18, all differential pair conductors inside the AMC Connector shall be able to carry 0.1 A minimum.

REQ 7.39a Under the conditions stated in Figure 7-18, all general purpose and ground conductors inside the AMC Connector shall be able to carry 0.3 A minimum.

REQ 7.40a Under the conditions stated in Figure 7-18, all power conductors identified in Table 7-1 inside the AMC Connector shall have a minimum rated current carrying capacity of 1.52 A per IEC 60512-3.

REQ 7.41 Connector design shall ensure that no contact exceeds its current rating due to current balancing caused by variations in contact resistance.

REQ 7.42 The Connector specification shall include an analysis of cascaded power pin failure that insures that single power pin failure does not result in catastrophic current overloading of the remaining contacts.

Cur

rent

100%

80%

Rated current capabilityper IEC 60512-3

Actual measured current capability

Ambient temperature100°C70°C

Rated current capability when used in parallel perNEBS GR-1217 Core R5-83

75% of rated of IEC 60512-3 current capability when used

in parallel


7.3.4 Line resistanceConditions: IEC 60512-2, Test 2a

Standard atmospheric conditionsMated Module PCBConnecting points as specified Section 7.6.2.1, “Arrangement for contact resis-tance and disturbance measurement.”

Table 7-6 Maximum line resistances

Requirements

REQ 7.43a The line resistance of the various conductors shall not exceed the values given in Table 7-6.

REQ 7.44 Power conductors shall not be connected together within the AMC Connector.

REQ 7.45 Some groups of power conductors may be used in parallel for high current.

REQ 7.46 In order to avoid excessive current in the lower resistance lines, the difference in line resistance between conductors belonging to the same group of power conductors shall not exceed ± 20% of the average line resistance in the group during all test sequences.

Maximum initial line resistance

Maximum change in relation to initial value

Differential pair conductors 375 mΩ 15 mΩ

Ground conductors 60 mΩ 15 mΩ

General purpose conductors 90 mΩ 15 mΩ

Power conductors 90 mΩ 15 mΩ


7.3.5 Insulation resistanceConditions: IEC 60512-2, Test 3a

Standard atmospheric conditionsMethod B; see arrangement in Table 7-7.Mated Module PCBTest voltage 80V r.m.s.

Table 7-7 Minimum insulation resistances

Requirements

REQ 7.47 Under the conditions stated in Table 7-7, the minimum initial insulation resistance between groups of conductors as defined in Table 7-7 shall be 100 MΩ.

REQ 7.48b After applying the moisture tests specified in test sequences A and C, the minimum insulation resistance shall not drop below 10 MΩ.

7.3.6 InductanceRequirements

REQ 7.49 The line inductance of the power conductors inside the AMC Connector shall be 50 nH maximum.

¶ 29 Dynamic behavior for other conductors is controlled under Section 7.4, “High-speed characteristics.”

7.3.7 Engagement under electrical loadRequirements

REQ 7.50 All connections shall tolerate a powered engagement with an ohmic load of 5 V with a maximum current of 0.2 A, without degradation of the Connector performance.

Arrangement Initial value

After moisture

Differential pair conductor/conductor 5 left to 5 adjacent right conductors 100 MΩ 10 MΩ

Differential pair conductor/ground 5 conductors to ground 100 MΩ 10 MΩ

General purpose conductor/conductor 2 conductors to 2 adjacent conductors 100 MΩ 10 MΩ

Power conductor/ground 2 conductors to ground 100 MΩ 10 MΩ


7.4 High-speed characteristicsRequirements

REQ 7.51 If not otherwise stated, the signal integrity parameters are given as minimum or maximum values, and may be different depending on the used layer (e.g., for Basic or Extended Side in Slot A or B). For more details, compare vendor specifications.

7.4.1 Differential impedanceConditions: IEC 60512-23, Test 23d

Test method BSpecimen environment impedance = 100 Ω differentialThe test will use a signal source with a rise time of 25 ps (20 to 80%) or fasterAdjacent lines terminated at both ends

Requirements

REQ 7.53a Under the conditions stated above, the differential impedance peak values of the AMC Connector including traces and contact pads on the test boards for signal integrity validation should stay within a tolerance band of 100 Ω ± 10 Ω.

Figure 7-19 Typical impedance profile, including connections (example for guidance only)

Time

Impedance


7.4.2 Differential return lossConditions: IEC 60512-25-5, Test 25e

Method A time domainSpecimen environment impedance = 100 Ω differentialAdjacent lines terminated at both ends

Requirements

REQ 7.54a Under the conditions stated above, the differential loss profile of the AMC Connector including traces and contact pads on the test boards for signal integrity validation should be less than -20 dB at 5 GHz, less than -13dB at 8GHz, and less than -8 dB at 18 GHz.

Figure 7-20 Typical return loss profile, including connections (example for guidance only)

7.4.3 Differential attenuationConditions: IEC 60512-25, Test 25b

Specimen environment impedance = 100 Ω differentialAdjacent lines terminated at both ends

Requirements

REQ 7.55a Under the conditions stated above, the differential attenuation profile of the AMC Connector including traces and contact pads on the test boards for signal integrity validation should be greater than -1 dB at 8 GHz, greater than -2 dB at 12 GHz, and greater than -4 dB at 18 GHz.

Frequency

Return Loss (Mag)


Figure 7-21 Typical attenuation profile, including connections (example for guidance only)

7.4.4 Differential pair cross talkConditions: IEC 60512-25, Test 25a

Method A time domainSpecimen environment impedance = 100 Ω differentialThe test will use a signal source with a rise time of 25ps (20 to 80%) or fasterAdjacent lines terminated at both ends

Requirements

REQ 7.56a Under the conditions stated above, the differential cross talk amplitude induced at the far end to a differential pair by two driven adjacent differential pairs in the AMC Connector, including traces and contact pads on the test boards for signal integrity validation, should be less than 2%.

REQ 7.57a Under the conditions stated above, the differential cross talk amplitude induced at the far end to a differential pair on the Extended Side by an opposite differential pair on the Basic Side in the AMC Connector, including traces and contact pads on the test boards for signal integrity validation, should be less than 2%.

7.4.5 Propagation characteristics¶ 30 The propagation characteristics are measured in transmission lines including traces and

contact pads on the test boards for signal integrity validation (see also Section 7.6.2.4, “Arrangement for signal integrity validation”).

¶ 31 The propagation delay difference between the Basic Side contacts and the Extended Side contacts is to be specified by the Connector manufacturer and the difference must be compensated by Carrier Board designers for differential pairs which require a matched delay.

Frequency

Insertion Loss (Mag)


Figure 7-22 Propagation delay

Requirements

REQ 7.58a The propagation delay skew within each differential pair shall be specified by the Connector manufacturer.

REQ 7.59a The propagation delay skew between differential pairs belonging to the same side of the Module interface shall be specified by the Connector manufacturer.

REQ 7.80 The skew value shall grant that all signal pairs of a Connector Side are within a +/- 5 ps tolerance band.

REQ 7.81 Connector manufacturers shall specify differential propagation delay from the Basic Side to the Extended Side with worst case tolerances for plus style Connectors.

+/- 5 pstolerance band

ManufacturerSpecified

+/- 5 pstolerance band

Average propagation delayon Extended side

Average propagation delayon Basic side


7.5 Mechanical characteristicsRequirements

REQ 7.62 If not otherwise stated, the mechanical parameters are given as minimum or maximum values, and may be different depending on the Connector Slot used (e.g., for Basic or Extended Side in styles A or B). For more details, compare vendor specifications.

7.5.1 Mechanical operationConditions: IEC 60512-5, Test 9a

Standard atmospheric conditionsSpeed of operations: 10 mm per s maximum, rest 5s (unmated)

Requirements

REQ 7.64a The AMC Connector shall withstand 200 mating cycles without damage that would impair normal operation.

REQ 7.91 The AMC Connector on the Carrier Board should allow contact lubrication according to requirement R5-66 as specified in Telcordia GR-1217-CORE (part of NEBS compliance).

7.5.2 Engaging and separating forcesConditions: IEC 60512-7, Test 13a

Standard atmospheric conditionsRate of engagement and separation: 10mm per s maximum

Table 7-8 Engaging and separating forces

Requirements

REQ 7.65a Under the conditions stated above, the force needed to engage an AMC Module PCB in the AMC Connector shall not exceed the values given in Table 7-8.

REQ 7.66a Under the conditions stated above, the force needed to disengage an AMC Module PCB from an AMC Connector shall not exceed the values given in Table 7-8.

REQ 7.67a Under the conditions stated above, the AMC Connector shall withstand a maximum engaging force of 204 N, by which the edge of the AMC Module PCB bottoms in the Slot of the Connector, without damage that would impair normal operation.

Mating sides Single-sided Double-sided

Maximum engaging force 100 N 100 N

Maximum separating force 65 N 65 N

Maximum bottoming force 204 N 204 N


7.5.3 Gauge retention forceConditions: IEC 512-8, Test 16e

Sizing gauge thickness = 1.76 mm ± 0.01 mmThickness of retention force gauge = 1.44 mm ± 0.01 mm Weight of retention force gauge per contact = 15 grams

Requirements

REQ 7.68 Under the conditions stated above, the AMC Connector shall be able to retain the specified gauge.

7.5.4 Vibration (sinusoidal)Conditions: IEC 60512-4, Test 6d

NEBS - GR-63-COREStandard atmospheric conditionsMated Module PCBThe specimen must be installed in a suitable fixture according to Section 7.6.2.5, “Arrangement for dynamic stress tests.”

Table 7-9 Vibration

Requirements

REQ 7.70 Under the conditions stated above, and with the vibration severity applied as specified in Table 7-9, there shall be no contact disturbance longer than 1 μs.

7.5.5 ShockConditions: IEC 60512-4, Test 6c

NEBS - GR-63-COREStandard atmospheric conditionsMated plug-in cardThe specimen must be installed in a suitable fixture according to Section 7.6.2.5, “Arrangement for dynamic stress tests.”

Severity

10 Hz to 500 Hz with an amplitude of 0.35 mm or an acceleration of 50 m/s2

eight sweepings in each direction, duration 3x8 h/axis, in three axes (32 sweepings in each direction)


Table 7-10 Shock

Requirements

REQ 7.71 Under the conditions stated above, and with the shock severity applied as specified in Table 7-10, there shall be no contact disturbance longer than 1 μs.

7.5.6 Retention of AMC Connector on Carrier BoardConditions: IEC 60512-8, Test 8a, “Static load transverse”

Standard atmospheric conditionsMounted Connector, no additional fixation to Carrier Component CoversThe load must be applied to the Module B slot, same direction with the Module insertion direction. surface.Force 204 N, once from the front and once from the back side of the Connector.

Requirements

REQ 7.72a Under the conditions stated above, there shall be no permanent distortion or damage that would impair normal operation of the Connector.

7.5.7 Compression connection - remounting operationConditions: Mounted Connector

Standard atmospheric conditionsUse three times the same Connector and the same Connector location on the same Carrier Board

Requirements

REQ 7.73b After successfully mounting and connecting the AMC Connector, it shall be possible to perform at least 2 additional remounting operations (3 total mountings) without damaging the AMC Carrier Board in a way that would impair normal operation.

7.5.8 Termination-specific testing¶ 32 Terminations other than Compression must be tested according to the corresponding

international standard. Remounting only needs to be tested when it is part of this standard, thus solder terminations will not be tested for remounting.

Conditions: Table 7-11, “Termination-specific conditions”

Severity

Shock acceleration 300 m/s2, duration of impact 11 ms Three shocks in two directions/axis, in three axes (18 shocks in total)


Table 7-11 Termination-specific conditions

Requirements

REQ 7.82b Each termination type shall successfully pass its corresponding test according to Table 7-11, “Termination-specific conditions.”

7.6 Test schedule

7.6.1 Specimens¶ 33 Unless otherwise specified, mated sets of AMC Connectors and test boards are tested

together. Care must be taken to keep the particular combinations of Connectors and test boards together during the complete test sequence, i.e. when unmating or unmounting is necessary for a certain test, the same Connectors and test boards as before must be mated for the subsequent tests.

• For the test groups P to E, a set of one mounted Connector on one Carrier test board and one Module test PCB is called a “specimen”. These test groups are described in Section 7.7, “Test schedule tables.”

• Four different sets of Carrier test board + Module test PCB are used to perform the specific test sequences as described in Table 7-13, “Allocation of the test specimens.”

— Set 1 = general purpose (including contact resistance and contact disturbance measurements)

— Set 2 = insulation resistance and voltage proof testing

— Set 3 = current carrying capacity testing

— Set 4 = signal integrity measurements

¶ 34 As far as board space and number of measuring points permit, specific set-ups may be combined into one layout.

• The test sequence is applicable to all AMC Connector styles.

• Unless otherwise specified 25 contacts in every row of the Connector are used for measurements.

• The number of specimen for the full test schedule is listed below.

Termination Severity or condition of test Test according to

Press-Fit / Compliant Pin Test Group A + B (including remounting) IEC 60352-5

SMTSolderability test for single surface mount contacts to be used with reflow solder process

IEC 60068-2-69

Pin in holeSolderability test for single through hole contacts to be used either with reflow- or wave solder process

IEC 60068-2-54


• The required 35 Connectors must be randomly sampled from the production line.

Table 7-12 Number of specimen for the full test sequence

Table 7-13 Allocation of the test specimens

7.6.2 Test and measurement arrangements

7.6.2.1 Arrangement for contact resistance and disturbance measurement

Figure 7-23 Arrangement for contact resistance measurement in Set 1

Test groups All P A B C D E

Number of specimen 35 1+24+4 4 4+4 4+4+4 4+2 4

Specimen Test sets Preliminary test phases

Specific test phases Remarks

p1 - P1

a1 to a4 Set 1 P2 to P4 A2 to A6

b1 to b4 Set 1 P2 to P4 B2 to B8

b5 to b8 Set 1 P2 to P3 B2 to B5 + B8

c1 to c4 Set 1 P2 to P4 C2 to C5 + C8

c5 to c8 Set 1 P2 to P3 C2 to C4 + C8

c9 to c12 Set 2 P2-P3 + P5-P6 C2-C2 + C4 to C8 No contact resistance

d1 to d4 Set 1 P2 to P4 D2 + D3 to D5

d5 and d6 Set 3 D2 + D5 No contact resistance

e1 to e4 Set 4 E2 to E7

Current source

Voltage Meter

Conductor under test

Via Hole

Buried line


Figure 7-24 Arrangement for contact disturbance measurement in Set 1

7.6.2.2 Arrangement for insulation resistance measurement and voltage proofing

Figure 7-25 Layout of test boards Set 2

Connector under test

Module test PCB

Carrier test board

Daisy chain of power, general purpose and differential pair contacts

Discontinuity test Equipment

V2

V1

Ground

The Carrier test board contains no traces


Table 7-14 Wiring arrangement for insulation resistance and voltage proofing

7.6.2.3 Arrangement for current carrying capacity proofing

Figure 7-26 Layout of test boards Set 3

Test Connection of Test Voltage

Diff. Pair signal to signal V1 - V2

Diff. Pair signal to GND V1 - GND and V2 - GND

Gen. Purpose signal to signal V1 - V2

Gen. Purpose signal to GND V1 - GND and V2 - GND

Power to power V1 - V2

Power to GND V1 - GND and V2 - GND

I2 = 1 A (power)

I3 = 0.3 A (general purpose)

I1 = 0.1 A (differential pair)


Figure 7-27 Placement of temperature probes

7.6.2.4 Arrangement for signal integrity validation

¶ 35 Figure 7-28 and Figure 7-29 are examples of how test boards can be made.

Requirements

REQ 7.85 Connector vendors shall provide documentation of the design of the test fixture.

REQ 7.86 The test fixture boards shall not use back drilling to reduce crosstalk or impedance discontinuities.

Temperature Probing Point On the module contact

On the transmission line

On the carrier contact


Figure 7-28 Layout of the Carrier test board for set 4

Note: The test board provides calibration lines to allow for the de-embedding of the test fixture from the interconnection under test.

For B and B+

For AB

For A+B+


Figure 7-29 Layout of the Module test PCB for set 4

Note: The test PCB provides calibration lines to allow the de-embedding of the test fixture from the interconnection under test.


7.6.2.5 Arrangement for dynamic stress tests

Condition: IEC 60512-4, Tests 6c and 6d

Figure 7-30 Fixture for dynamic stress tests

¶ 36 The fixture is a totally rigid metal construction, which holds the Connector and the test PCB and test board firmly together. Vibration and shock must only affect the connecting elements.

7.7 Test schedule tables¶ 37 For all test sequences, the requirements must comply with the characteristics specified in

Section 7.3, “Electrical characteristics” through Section 7.5, “Mechanical characteristics.”

¶ 38 The tests and measurements must be conducted using test boards according to the layouts specified in Section 7.6, “Test schedule.”

Full Size Bay

Host/CarrierPCB

AMC Connector

EMI Gasket

Weight per Section 2.2

C of PCB depth

100 max

A

A

View A:A

C

Max per component envelope

Max component envelope

Fixture


7.7.1 Group P - PreliminaryTable 7-15 Group P - Preliminary testing sequence

¶ 39 Specimens a1 through d4 must be allocated to the subsequent test phases according to Table 7-13, “Allocation of the test specimens.”

Test phase IEC 60512

Measurement to be

performedIEC

60512 Requirements

Title Specimen Severity or condition of test Title Test No.

P1 General examination p1 Unmounted fixed Connectors Visual

examination 1a No defect that would impair normal operation.

Connector interface Footprint on Carrier Board Interface dimensions of plug-in card Creepage and clearance distances

Examination of dimensions and mass

1bThe dimensions must comply with those specified in Section 7.2, “Dimensions.”

P2

Mechanical tests on contacts and terminations

a1-a4b1-b8c1-c12d1-d4

See Section 7.5.3, “Gauge retention force”

Gauge retention force

16e

P3Mechanical operating tests

a1-a4b1-b8c1-c12d1-d4

Speed = 10 mm/s max. Plug-in card insertion and extraction

Engaging and separating forces

13aMax. engaging force = 100 NMax. separating force = 65 N

P4

Electrical continuity and contact resistance tests

a1-a4b1-b4c1-c4d1-d4

Max. voltage = 20 mV in open circuit Max. current = 100 mA

Contact resistance 2a

Diff. pair conductors = 375 mΩ max.Gen. purpose conductors = 90 mΩ max. Power conductors = 90 mΩ max. Ground planes = 60 mΩ max.

P5 Insulation tests c9-c12

Test voltage 500 V d.c. Method B Mated Module PCB

Insulation resistance 3a

100 MΩ min. between differential pair conductors mutually and between ground 100 MΩ min. between general purpose conductors mutually and between ground 100 MΩ min. between power conductors mutually and between ground

P6 Voltage stress tests c9-c12

Method B Mated plug-in cards, Test voltage 80V r.m.s. between differential pair conductors mutually and ground. Test voltage 80 V r.m.s. between general purpose conductors mutually and ground. Test voltage 80 V r.m.s. between power conductors mutually and ground

Voltage proof 4a No breakdown or flashover.


at

7.7.2 Group A - Mixed Flowing GasTable 7-16 Group A - Mixed flowing gas testing sequence

Test phase Title Speci

menSeverity or condition of test

Measurement to be performed

IEC 60512 Test (Unless otherwise specified)

Requirements

A1 Mechanical operation a1-a4

Speed = 10 mm/s max. Rest 5 s (unmated) Initial 100 operations

Pre-wear 9a

a1-a4Max. voltage = 20 mV in open circuit Max. current = 100 mA


Change in relation to initial values Diff. pair conductors = 15 mΩ max. Gen. purpose conductors = 15 mΩ max. Power conductors = 15 mΩ max. Ground planes = 15 mΩ max.

A2Remounting operation Compression

a1-a4

See Section 7.5.7, “Compression connection - remounting operation”

After three remounting operations, using the same connector on the same location on the same Carrier Board, there must be no damage thwould impair normal operation.

A3 High Temper-ature Life

a1-a4

Mated Connectors Ambient temperature 105° C No electrical load Duration 300 h Recovery time 2 h

Temperature Life

EIA-364-17Test condition 4

a1-a4Max voltage = 20 mV in open circuit Max current = 100 mA



A4Corrosion, industrial atmosphere

a1-a4 Unmated Connector 5 days

Mixed flowing gas, controlled environment

EIA-364-65A

Class IIA





a1-a4 Unmated Connector 5 days


EIA-364-65A

Class IIA




a1-a4 Mated Connector 5 days


EIA-364-65A

Class IIA




a1-a4 Mated Connector 5 days


EIA-364-65A

Class IIA




a1-a4

Disturb Module PCB slightly from Connector, and then reseat. According to GR-1217- CORE, Section 9.1.3.3, Item 7

Minute disturbance

GR-1217- CORE, Section 9.1.3.3, Item 7




Table 7-16 Group A - Mixed flowing gas testing sequence (Continued)





Requirements


A5 Mechanical operation a1-a4

Speed = 10 mm/s max. Rest 5 s (unmated) Remaining 100 operations

Post-wear 9a




A6 General examination a1-a4 Unmated and

unmounted ConnectorsVisual examination 1a No defect that would impair normal

operation.

Table 7-16 Group A - Mixed flowing gas testing sequence (Continued)





Requirements


,

r

.

.

.

.

7.7.3 Group B - Mechanical endurance and DustTable 7-17 Group B - Mechanical endurance and dust testing sequence

Test phase Title Spec

imenSeverity or condition of test



Requirements

B1Remounting operation- Compression

b1-b4b5-b8


After three remounting operationsusing the same connector on the same location on the same CarrieBoard, there must be no damage that would impair normal operation

B2 Mechanical operation

b1-b4b5-b8


Pre-wear 9a

b1-b4Max. voltage = 20 mV in open circuit Max. current = 100 mA


Change in relation to initial valuesDiff. pair conductors = 15 mΩ maxGen. purpose conductors = 15 mΩmax. Power conductors = 15 mΩ max. Ground planes = 15 mΩ max.

B3 Dust

b1-b4b5-b8

Unmated and mounted Connectors + Module PCB's Benign dust concentration of 300 g/m3 of chamber volume, flow rate = 300 m/s and an exposure time of 1 h. According to GR-1217-CORE, Sections 9.1.1.1 and 9.1.1.2

Dust exposure

EIA-364-91




B4 Vibrationb1-b4b5-b8

Mounted in fixture according to Section 7.6.2.5, “Arrangement for dynamic stress tests” Frequency 10 Hz to 500 Hz Amplitude 0.35 mm or 50 m/s² Full duration 3 x 8 h in three axes (32 sweepings in each direction)

Monitored vibration 6d No contact disturbance longer than

1 µs

B4 Vibration b1-b4Max. voltage = 20 mV in open circuit Max. current = 100 mA




.

.

7.7.4 Group C - Thermal shock and moisture

B5 Shockb1-b4b5-b8

Mounted in fixture according to Section 7.6.2.5, “Arrangement for dynamic stress tests” Shock acceleration 300 m/s² Duration of impact 11 ms Three shocks in two directions along 3 axes (18 shocks total)

Monitored mechanical shock

6c No contact disturbance longer than1 µs




B6 Mechanical operation b1-b4

Speed = 10 mm/s max. Rest 5 s (unmated) Remaining 100 operations

Post-wearEIA-364Test 09




B7Mechanical operating tests

b1-b4Speed = 10 mm/s max.Plug-in card insertion and extraction



B8 Retention b1-b4Push the front edge of the Module PCB at 204 N for 1 minute

Visual examination 8b

No damage to the Connector andthe mounting area to the Carrier Board.

B9 General examination

b1-b4b5-b8

Unmated and unmounted Connectors

Visual examination 1a No damage that would impair

normal operation.

Table 7-17 Group B - Mechanical endurance and dust testing sequence (Continued)

Test phase Title Spec

imenSeverity or condition of test



Requirements


Tp

Table 7-18 Group C - Thermal shock and moisture testing sequence

est hase Title Speci




Requirements

C1Remounting operation-Compression

c1-c4c5-c8

c9-c12


After three remounting operations, using the same connector on the same location on the same Carrier Board, there must be no damage that would impair normal operation.

C2 Mechanical operation

c1-c4c5-c8

c9-c12


Pre-wear 9a

c1-c4Max. voltage = 20 mV in open circuit Max. current = 100 mA



C3 Dustc1-c4c5-c8

Unmated and mounted Connectors + Module PCB's Benign dust concentration of 300 g/m3 of chamber volume, flow rate = 300 m/s and an exposure time of 1 h. According to GR-1217-CORE, Sections 9.1.1.1 and 9.1.1.2

Dust exposure

EIA-364-91




C4 Thermal shock

c1-c4c5-c8

c9-c12

Five cycles of alternating high and low temperature. 30 minutes dwell at each extreme, with a max. transfer time of 5 s between extremes - 55 °C to 85 °C

Monitored thermal shock

EIA-364-35C Duration of disturbance = 1 µs max.





Tp

C5 Damp heat, cyclic

c1-c4c9-c12

Mated ConnectorsThermal cycling between 25 °C and 65 °C with 80% to 98% relative humidity50 cycles, duration 500 hAccording to GR-1217-CORE, Section 6.3.4, R6-64

Temperature/ Humidity cycling

EIA-364-31BMethod

III




C6 Insulation tests c9-c12

Test voltage 500 V d.c. Method BMated plug-in cards

Insulation resistance 3a

10 MΩ min. between differential pair conductors mutually and between ground 10 MΩ min. between general purpose conductors mutually and between ground 10 MΩ min. between power conductors mutually and between ground

C7 Voltage stress tests c9-c12

Method B Mated plug-in cards, Test voltage 80 V r.m.s. between differential pair conductors mutually and ground. Test voltage 80 V r.m.s. between general purpose conductors mutually and ground. Test voltage 80 V r.m.s. between power conductors mutually and ground

Voltage proof 4a No breakdown or flashover

C8 General examination

c1-c4c5-c8

c9-c12


Visual examination 1a No defect that would impair normal

operation.

Table 7-18 Group C - Thermal shock and moisture testing sequence (Continued)





Requirements


Tp

7.7.5 Group D - High temperature and electrical loadTable 7-19 Group D - High temperature and electrical load testing sequence





Requirements

D1High Tem-perature Life

d1-d4

Mated Connectors Ambient temperature 105 °C No electrical load Duration 1000 h Recovery time 2 h According to GR-1217-CORE, Sections 6.3.2 R6-51

Temperature Life

EIA-364-17

Test condition 4

d1-d4Max voltage = 20 mV in open circuit Max current = 100 mA



D2Electrical load and temperature

d5-d6

Mated Connectors Electrical load of 0.1 A per diff. pair conductor, 0.3 A per general purpose conductor, 1.52 A per power conductor All lines driven simultaneously Ambient temperature 70 °C Wire gauge thermo-element = 0.12 mm² max.

Current carrying capacity

EIA-364-70A

Temperature inside the Connector must not exceed 100° C.

D3 Static load transverse d1-d4

See Section 7.5.6, “Retention of AMC Connector on Carrier Board”


normal operation.

D4

Mechanical operating tests

d1-d4Speed = 10 mm/s max.Plug-in card insertion and extraction



D5General examination

d1-d4d5-d6



normal operation.


Tespha

E

,

r

n

E

E

Eles

E o r

t

E

7.7.6 Group E - Signal integrity validationTable 7-20 Group E - High-speed performance testing sequence

t se Title Specimen Severity or condition of

testMeasurement to be performed


Requirements

1Remounting operation-Compression

e1-e4See Section 7.5.7, “Compression connection - remounting operation”

After three remounting operationsusing the same connector on the same location on the same CarrieBoard, there shall be no damage that would impair normal operatio

2 Mechanical operation e1-e4

Speed = 10 mm/s max. Rest 5 s (unmated) 100 operations

9a

3 Damp heat, steady state e1-e4

No electrical load Polarizing voltage 60 V d.c. 40 °C, 93% relative humidity, 10 days

11c

4

Transmission line reflections in the time domain

e1-e4

Test method B Test PCB layout see Section 7.6.2.4 Measured step rise time 25 ps max. throughout interconnection Environment impedance 100 differential 8 differential pair lines per specimen

Differential impedance 23d

Target values Peak values 100 Ω ± 10 Ω including contact pads and via ho

5 Cross talk e1-e4

Test method A time domain Test PCB board layout see Section 7.6.2.4 Measured step rise time 25 ps max. throughout interconnection Environment impedance 100 Ω differential Near end and far end cross talk between two adjacent differential pairs Simultaneous cross talk with two surrounding driven pairs

Cross talk ratio 25a

Target values Near end and far end cross talk between adjacent pairs < 2% (far end) between one quiet pair and twsurrounding driven pairs < 2% (faend) between facing lines on component side 1 and componenside 2 < 1% (far end)

6 Attenuation e1-e4

Test PCB board layout see Section 7.6.2.4 Environment impedance 100 Ω differential Frequency range 0 to 20 GHz 4 differential per specimen. This applies to traces and not to the pads.

Attenuation 25b

Target values Attenuation: > -1 dB at 8 GHz > -2 dB at 12 GHz > -4 dB at 18 GHz


E

Tespha

7 Return loss e1-e4

Test PCB board layout see Section 7.6.2.4 Environment impedance 100 Ω differential Frequency range 0 to 20 GHz 4 differential per specimen

Return loss 25e

Target values Return loss: < -20 dB at 5GHz < -13 dB at 8 GHz < - 8 dB at 18 GHz

Table 7-20 Group E - High-speed performance testing sequence (Continued)

t se Title Specimen Severity or condition of

testMeasurement to be performed


Requirements


AMC mating conditions A

A.1 Purpose¶ 1 The purpose of this appendix is to define reliable mechanical mating conditions between the

AMC Module PCB and the AMC Connector.

¶ 2 In particular the unhindered alignment in height and width direction will avoid excessive stress on the Connector and its contacts.

¶ 3 The enforced seating of the AMC Module PCB on the bottom of the Connector Slot must assure a reliable contact overlap between the shortest contact fingers and the Connector contacts.

A.2 Alignment conditions

A.2.1 Alignment in width direction (parallel to the plane of the Module PCB)¶ 4 Dimensions are derived for a Single Width PCB in a Conventional Bay with a B/B+

Connector; other Module and Bay sizes can be calculated in a similar fashion.

A.2.1.1 Nominal width dimensions

Table A-1 Nominal width dimensions

Dimension Value Defining figure

AMC Module pitch 75 Figure 2-34

Card Guide Slot width 74 Figure 2-34

Module PCB width 73.5 Figure 2-4

Module PCB Card-edge Interface width 65 Figure 2-4

Connector Slot width 65.15 Figure 7-6

PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 A-1

A.2.1.2 Alignment of the Module PCB to the Connector

¶ 5 Free alignment in width - Module PCB Card-edge Interface does not interfere with Connector Slot.

Conditions: Maximum material condition of PCB; Minimum material condition of ConnectorMaximum misalignment of Card Guides and Datum L1

Table A-2 Free alignment in width gap analysis

A.2.1.3 Minimum overlap between Module PCB and Card Guide rail

Conditions: Maximum Card Guide Slot width;Minimum Module PCB width, Minimum Card Guide Rail height

Table A-3 Module PCB/Card Guide rail overlap gap analysis

A.2.1.4 Area for non-insulated components

¶ 6 Component envelope does not interfere with Card Guide rails.

Note: The Component Keepout zone excludes all components, test points, vias, traces protected by solder mask, solder pads, and other features which can form a mechanical impediment or provide an electrical conduction to the Card Guide.


Minimum Connector Slot width to Datum L1 +32.55 Figure 7-6

Minimum Datum L1 to Card Guide Slot width +36.90 Figure 2-34

Maximum Module PCB width to Datum L -36.85 Figure 2-4

Maximum Datum L Module to PCB Card-edge Interface width -32.55 Figure 2-4

Minimum gap + 0.5 Calculated


Minimum Module PCB width -73.4 Figure 2-4

Maximum Card Guide Slot width +74.2 Figure 2-34

Minimum Card Guide Slot rail height -1.5 Figure 2-34

Minimum gap (Overlap) - 0.7 Calculated

A-2 PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

Conditions: Minimum Card Guide Slot width;Maximum Card Guide rail height, Maximum Module PCB width

Table A-4 Gap analysis 1- Minimum component's gap from either Card Guide rail

Table A-5 Gap analysis 2- Component envelope fits between Card Guide rails

A.2.1.5 Inclination in width direction

¶ 7 When the Module PCB is fully inserted into the Connector, any angular misalignment in width direction will cause a difference in mating depth between the two edges of the interconnection area.

¶ 8 The short contact overlap of the last mating contact fingers will only assure a reliable contact to the Connector when the inclination in mated condition is limited by the Card Guides.

¶ 9 Presence pins are located on opposite ends of the Module PCB Card-edge Interface and are the contacts that are of concern when the Module PCB is inclined.

Conditions: Maximum Card Guide Slot width; Minimum Module PCB width;Minimum Card Guide/Strut depth, Maximum Connector Slot width; PCB contacts lower front edge of Card Guide/Strut and upper edge of Connector Slot

Note: The inclined insertion condition is identical for Single and Double Modules.


Minimum Component Keepout zone +1.70 Figure 2-4

Maximum Card Guide rail height -1.65 Figure 2-34

Minimum gap +0.05 Calculated


Minimum distance between rails +70.5 Figure 2-35

Maximum Module PCB width -73.6 Figure 2-4

Minimum Component Keepout zone (both edges) +3.4 Figure 2-4

Minimum total gap +0.3 Calculated


Figure A-1 Insertion depth difference due to inclined insertion


A.2.2 Alignment in height direction (perpendicular to the plane of the Module PCB)

A.2.2.1 Nominal height dimensions (for both slots)

Table A-6 Nominal height dimensions

A.2.2.2 Free alignment in height direction (both slots)

¶ 10 Free alignment in height - Module PCB Card-edge Interface does not interfere with Connector Slot. This is for the case of no bow and twist of the Module PCB Card-edge Interface, interference is allowed if due to bow and twist of the Module PCB Card-edge Interface.

Conditions: Maximum Module PCB thickness;Minimum Connector Slot height, Minimum Card Guide Slot height with maximum misalignment to Datum M

Table A-7 Free alignment in height gap analysis

A.3 Mating depth conditions¶ 11 Table 2-7, “Card-edge Interface mating distances” and Table 2-15, “Carrier AdvancedTCA

Board Card Guide/Strut tabulated dimensions for Figure 2-46 and Figure 2-47” describe the mating dimensions and sequence in the depth direction.


Module PCB thickness 1.6 Figure 2-4

Connector Slot height 1.9 Figure 7-6

Card Guide Slot height 2.0 Figure 2-34


Minimum Card Guide rail to datum M1 +0.9 Figure 2-33

Minimum Datum M1 to Connector Slot +0.91 Figure 7-6

Maximum Module PCB thickness -1.76 Figure 2-4

Minimum gap +0.05 Calculated


Signal integrity analysis and guidelines B

¶ 8 This section discusses the signal integrity analyses performed for AMC transmitter/receiver configurations. It is intended to show that the AMC estimated channel lengths will yield acceptable performance at 2.5 Gbps and 5 Gbps. Although the simulation work is based on PCI-Express models, it is expected that the basic tenants will also apply to other link technologies such as RIO and Ethernet. AMC.x subsidiary specifications provide details for any variations that are specific to the subject link technology.

¶ 9 These simulations characterize PCI Express serial Link performance using the Intel Grantsdale IBIS models for 2.5 Gbps (first generation), and a PCI Express compatible HSPICE model for 5 Gbps (second generation). The IBIS/HSPICE models were supplied with nominal, fast and slow silicon process tolerances. Tolerances for interconnect parameters (differential impedances, trace widths, voltage and temperature) were also modeled as part of the simulation effort. The Module and Carrier were assumed to be standard FR4 with a loss tangent of 0.021.

¶ 10 Two cases of simulations were performed. In the first case, a series of simulations model the serial Link between the Module PCB and the Carrier Board. In the second case, the set of simulations model the serial Link between two Module PCBs communicating through the Carrier Board. These simulations do not attempt to encompass the characteristics of all PCI Express buffers/receivers. Rather, the intent is to confirm that the longest estimated Link lengths were clearly achievable -- with adequate margins - at 2.5, 3.125, and 5 Gbps.

B.1 Modeling parameters¶ 11 Table B- 1 below describes the assumptions/parameters used to model both Module to

Carrier as well as Module to Module configurations.

PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 B-1

Table B-1 Modeling parameters

B.2 De-emphasis¶ 12 De-emphasis was implemented in the Grantsdale IBIS file. De-emphasis will increase the

high frequency content of the waveform to compensate for losses through the Link.

B.3 Representative eye patterns¶ 13 All circuit traces included frequency dependent losses and were modeled by converting the

output from RLGC, a 2D field solver, to an H-SPICE compatible “.RLC” file format. The pulse pattern consists of 27 PRBS data. The data pattern was repeated several times for each simulation. The resulting receiver waveform data was then plotted as an “eye diagram” from which the minimum eye openings and peak deterministic jitter were measured. Eye masks per the PCI Express specification were overlaid on each 2.5 Gbps receiver input plot. At 5 Gbps, the particular device eye mask was used.

B.4 Discussion of results and recommendations¶ 14 Even though the minimum acceptable eye amplitude based on PCIEx specification is 175

mV, a margin of 150-200 mV is recommended over the minimum due to the broad assumptions made for simulation purposes. Several test cases that were run for trace length of 28cms indicated that there is adequate margin for both the configurations; Module to Carrier as well as Module to Carrier to Module. These test cases indicated that the capacitor location is not critical for both 2.5 Gbps as well as 5 Gbps. However, the requirement for PCI Express and Advanced Switching calls for the capacitors to be placed close to the transmitter. Further, several test cases were run for trace length of 46cms. For these cases, the available margin with respect to the eye mask started shrinking which indicates that, the additional 18cms of 0.1mm wide trace, combined with two AMC Connector interfaces, had a significant impact at 5Gbps. Hence, it is strongly recommended that the trace lengths exceeding 28cms for both cases; Module-to-Module and Module-to-Carrier needs to be verified for performance using simulation.

Parameter Description

Module and Carrier Materials FR4

Dielectric constant (εR) 4.0

Loss Tangent (tan δ) 0.021

Trace details 0.1mm ± 0.125 mm, 0.5 oz. Copper

AMC Connector Model HARTING

Capacitors 0.01 μF in 0603 package

Silicon Process Nominal, Fast, Slow

B-2 PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

¶ 15 The following figure shows adequate margin for trace length of 28cms for the Module to Carrier simulation case at 5 Gbps.

Figure B-1 Module to Carrier with trace length of 28cms at 5 Gbps

Adequate Margin

PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 B-3

Figure B-2 Module to Carrier to Module with trace length of 46cms at 5 Gbps

Worst case jitter margin unacceptable

B-4 PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

Regulatory standards C

¶ 1 The following regulatory requirements are likely to be necessary for central office and telecommunication markets. It is recommended that AMC equipment should comply with these and future regulatory requirements to enhance compatibility and to ease system integration.

C.1 All equipment¶ 2 All equipment should meet the most recently adopted versions of the following regulatory

compliance requirements. In general, these requirements are harmonized standards with similar requirements applied worldwide; however, countries or regions declare deviations to these standards to account for conditions not included in the base standard. Evaluations should be completed for each market in which the product will be deployed. As examples, the requirements for Europe and North America are listed below. A regulatory compliance specialist should determine the appropriate requirements for the regions in which the product will be marketed.

C.1.1 Safety (North America and Europe)¶ 3 The requirements for safety are intended to provide a level of protection for personnel and

property for ITE (Information Technology Equipment) products. These standards account for normal and abnormal conditions such as likely fault conditions, pollution, overvoltages, and general operating environment. The standards intend to reduce the likelihood of injury in some categories: electric shock, energy hazards, fire, heat, mechanical hazards, and radiation. These requirements are all based on the international standard IEC 60950-1, and include UL 60950-1 and EN 60950-1.

Note: There are national standards and individual country deviations to the international standard.

C.1.2 Electromagnetic compatibility (North America and Europe)¶ 4 The EMC (Electromagnetic Compatibility) standards test for excessive emissions that might

interfere and affect the operation of other electronic equipment. These standards are also intended to ensure that ITE products have a minimum level of immunity to electromagnetic interference that would degrade the functionality or performance of the equipment. These outside electrical influences include factors such as ESD (Electrical Discharges), RF energy from other nearby equipment, and supply voltage fluctuations. There are different classifications for the product depending on the intended use and location. All AMC equipment must at a minimum meet Class A limits of the following specifications/requirements:

• CISPR22

• CISPR24

PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 C-1

C.2 Equipment for use in telecommunications central offices¶ 5 Equipment intended for application within a telecommunications central office is required to

be evaluated to the relevant sections of the current revisions of the following additional standards. These standards are intended to demonstrate not only the safety of the design and compliance with regulatory requirements, but also sufficient reliability to ensure operation of critical systems under adverse conditions.

¶ 6 Portions of these specifications may be performed in place of similar requirements in Appendix C.1.

C.2.1 Safety¶ 7 Same as Appendix C.1.1 plus the following:

• Telcordia GR-1089-CORE, Electromagnetic Compatibility and Electrical Safety Generic Criteria for Network Telecommunication Equipment

C.2.2 Electromagnetic compatibility¶ 8 Same as Appendix C.1.2 plus the following:

• EN 300 386, Electro-Magnetic Compatibility (EMC) Requirements for Public Telecommunication Network Equipment; Electromagnetic Compatibility (EMC) Requirements

• Telcordia GR-1089-CORE, Electromagnetic Compatibility and Electrical Safety Generic Criteria for Network Telecommunication Equipment

C.2.3 Environmental requirements¶ 9 Environmental requirements specified in NEBS and ETSI standards provide a level of safety

and operability by testing for conditions such as heat and temperature, fire, earthquakes, acoustics, lightning, in addition to electrical safety, and EMC listed above. Environmental requirements are listed in the following:

• Telcordia GR-63-CORE, Network Equipment Building System (NEBS) Requirements - Physical Protection (USA)

• ETS 300 019 Environmental Conditions and Environmental Tests for Telecommunication Equipment (Europe)

C.2.3.1 NEBS–USA

¶ 10 NEBS is primarily a U.S. specification but is also consulted in other regions such as Canada and Japan. NEBS is also recognized by municipalities and regulatory agencies as a factor to determine if the product will provide safe and reliable operation.

¶ 11 Equipment intended for application within telecommunications central offices within the United States should comply with the NEBS criteria. The test requirements are specified in the following:

C-2 PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

• Telcordia GR-63, Network Equipment-Building System (NEBS) Requirements—Physical Protection

• Telcordia GR-1089, Electromagnetic Compatibility And Electrical Safety Generic Criteria For Network Telecommunication Equipment

• Telcordia SR-3580, NEBS Criteria Levels

• Telcordia GR-78, Generic Requirements for the Physical Design and Manufacture of Telecom Products & Equipment

Note: Contaminants testing to indoor levels may be accepted by most end-users. Confirmation should be sought with specific end-users.

¶ 12 The following are additional Telcordia requirements that must be considered:

• GR-474, Alarm and Control for Network Elements

• GR-2914, Human Factors Requirements for Equipment to Improve Network Integrity

• GR-3028, Thermal Management In Telecommunications Central Offices

• GR-1217, Generic Requirements for Separable Electrical Connectors Used in Telecommunications Hardware

C.2.3.2 ETSI–Europe

¶ 13 ETSI is a recognized European standards organization that also contributes to worldwide standardization for telecommunications and related areas. Their standards, although primarily used for the EU market, are used worldwide.

• ETS 300 019, Environmental conditions and environmental tests for telecommunication equipment (Europe)

• ETS 300 132, Equipment Engineering Power Supply Interface At The Input To Telecommunications Equipment (Europe)

• ETS 300 753, Acoustic Noise Emitted By Telecommunications Equipment (Europe)

• ETS 300 119, Environmental Conditions and Environmental Tests for Telecommunication Equipment

C.2.3.3 Additional customer-specific recommendations

¶ 14 The following additional specifications from individual Regional Bell Operating Companies contain company-specific modifications of these requirements. The latest version of each of these specifications should be considered in any NEBS test program.

• SBC Local Exchange Carrier Equipment Requirements #TP76200MP

• AT&T NEBS MILD #9069

• http://www.verizonnebs.com/car_cl.doc Document name: SIT-NEBS-TE.NPI.2000-010 Document name: Telecommunications Carrier NEBS Checklist

• QWEST document 77351, QWEST Engineering Standard-General Equipment Standards (this can be found at: http://www.qwest.com/techpub/)


http://www.verizonnebs.com/

http://www.qwest.com/techpub/

http://www.qwest.com/techpub/

C.2.4 Additional Considerations¶ 15 In addition Telcordia document FR-2063 Network Equipment-Building System NEBS

Family of Requirements should be reviewed to verify if there are additional requirements that will need to be met. In the USA, there are also requirements from Regional Bell Operating Companies (RBOCS: SBC, ATT, Verizon, Bell S) that should be reviewed. These requirements can be obtained from the RBOCS.

¶ 16 Modules and Carriers designed for outdoor environments can state compliance with any of the following Telcordia specifications: GR-63, GR-78, GR-357, GE-1089, and GR-1217 or with ETSI EN 300 019-1-3 regarding outdoor temperature operating capabilities.

C.3 Ecology standards¶ 17 The environmental impact of electronic components has been a focus area for many

countries in the past few years. It is suggested that as part of good design practice, AMC products should comply with the applicable ecologic requirements in the regions into which these products will be shipping. Some areas to consider are materials, batteries, energy requirements, packaging, noise emissions, and product take back.

¶ 18 Individual country and regional laws are also in place, such as the Japanese Law concerning the Rational Use of Energy. Other standards, requirements, and guidelines exist, and a regulatory compliance specialist should be consulted for details concerning regional requirements.

¶ 19 The following is a list of existing EU directives:

• (RoHS) DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)

• (WEEE) DIRECTIVE 2002/96/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on waste electrical and electronic equipment (WEEE)

• (EuP) DIRECTIVE 2005/32/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 6 July 2005 establishing a Framework for the settling of ecodesign requirements for energy-using products and amending Council Directive 92/42/EEC and Directives 96/57/EC and 2000/55/EC of the European Parliament and of the Council

C.4 Reliability/MTBF standards¶ 20 The following are some examples of reliability specifications:

• Telcordia GR-512, LSSGR Reliability Section 12

• GR-929, Reliability and Quality Measurements for Telecommunications Systems

• Telcordia SR-332, Reliability Prediction for Electronic Equipment

¶ 21 Consult a quality and reliability specialist for specific requirements.


UC

EU

C.5 Cross reference list¶ 22 The following information provides quick reference to specifications for the USA, Canada,

and the European Union and to the conditions that are tested in these specifications. This list is not comprehensive but is meant as an aid to understanding the preceding information in this chapter. A compliance specialist should be consulted to determine the correct specifications to use for the regions in which the product will be marketed.

Table C-1 Cross reference list

Note: The “UL 60950-1” document referenced above is alternately referred to as “CAN/CSA-C22.2 No. 60950-1.”

Heat and temp. Fire Earthquake Acoustics Lightning Electrical

safety Emissions Immunity Vibration

SA/anada

GR-63UL60950-1

GR-63 UL60950-1 GR-63 GR-63 GR-1089 GR-1089

UL 60950-1

GR-1089 ICES-003FCC CFR47 Part 15

GR-1089 GR-63

uropean nion

EN300 019 EN60950-1 EN60950-1 EN300 019 ETS300 753 EN55024 EN60950-1 EN55022

EN300 386EN55024 EN300 386 EN300 019


Module Handle designs D

¶ 23 AMC Module Handles can vary in shape, but not function. In all cases the functions performed by the Module Latch Mechanism are identical. All Module Handle designs must support the three position actuation process for Module Hot Swap insertion and extraction. All Module Handle designs comply with the requirements described in Section 2.2.5, “Module Handle” and Section 2.2.5.1, “Module Latch Mechanism.”

¶ 24 This appendix shows several Module Handle design concepts as examples of what is possible within the requirements called out in Section 2.2.5, “Module Handle.”

PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 D-1

D.1 Handle concept 1 - Original Handle design and variants

Figure D-1 Original AMC Module Handle

D-2 PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

¶ 25 The New Grip handle concept provides a curved surface that improves the amount of pull force over a standard rectangular style handle.

Figure D-2 New grip variant of Original Handle

D.2 Handle concept 2 - Pivot Handle• The Handle pivots around this shoulder screw and transmits the pulling forces to the

Face Plate

• Detent allows the Hot Swap Switch actions

• The Handle movement is limited by another shoulder screw at the opposite side providing a good gripe to pull and extract the Module


Figure D-3 Pivot handle in locked and unlocked positions

Locked position

Unlocked position


D.3 Handle concept 3 - Push, Pull• In the “Locked” position, the Handle has a low profile

• Push Handle for grasp to “pop-out” and deactivate the Hot Swap Switch

• Pull Handle to unlock, continue pulling to extract Module

Figure D-4 Push-Pull handle positions

Figure D-5 Push-Pull handle variations and details

3mm 3/4 hole for optional extraction via tool

Handle is 2mm proud

of protective collar

5mm protective collar surrounds handle

Integrated Blue LED

Handle could provide grip on both sides of handle shaft


Requirements Index E

REQ 2.1b 2-66REQ 2.2REQ 2.3b 2-69REQ 2.4b 2-69REQ 2.5REQ 2.6b .................................................................... 2-66REQ 2.7 .................................................................... 2-66REQ 2.8REQ 2.9REQ 2.10REQ 2.11REQ 2.12REQ 2.13b 2-7REQ 2.14b 2-45REQ 2.15b 2-45REQ 2.16b .................................................................... 2-45REQ 2.17b .................................................................... 2-45REQ 2.18 2-8REQ 2.19b .................................................................... 2-21REQ 2.20b .................................................................... 2-21REQ 2.21b 2-8REQ 2.22 2-8REQ 2.23b 2-11REQ 2.24b 2-16REQ 2.25b 2-16REQ 2.26b 2-16REQ 2.27b 2-46REQ 2.28b .................................................................... 2-16REQ 2.29b .................................................................... 2-17REQ 2.30 .................................................................... 2-17REQ 2.31b 2-22REQ 2.32b 2-23REQ 2.33b 2-25REQ 2.34REQ 2.35REQ 2.36REQ 2.37b .................................................................... 2-18REQ 2.38 .................................................................... 2-18REQ 2.39 .................................................................... 2-18REQ 2.40b .................................................................... 2-18REQ 2.41b .................................................................... 2-18REQ 2.42b 2-29REQ 2.43 2-29REQ 2.44b 2-29REQ 2.45b 2-29REQ 2.46b 2-31REQ 2.47 .................................................................... 2-31REQ 2.48b 2-32REQ 2.49b 2-32REQ 2.50 2-32REQ 2.51REQ 2.52 .................................................................... 2-32REQ 2.53REQ 2.54REQ 2.55b .................................................................... 2-36

REQ 2.56REQ 2.57b ..................................................................... 2-36REQ 2.58b ..................................................................... 2-36REQ 2.59b ..................................................................... 2-36REQ 2.60b ..................................................................... 2-39REQ 2.61REQ 2.62b ..................................................................... 2-39REQ 2.63b 2-39REQ 2.64b ..................................................................... 2-39REQ 2.65b ..................................................................... 2-36REQ 2.66b ..................................................................... 2-39REQ 2.67b ..................................................................... 2-39REQ 2.68b ..................................................................... 2-39REQ 2.69b ..................................................................... 2-42REQ 2.70b ..................................................................... 2-42REQ 2.71b ..................................................................... 2-42REQ 2.72b ..................................................................... 2-42REQ 2.73b ..................................................................... 2-42REQ 2.74REQ 2.75REQ 2.76 ..................................................................... 2-33REQ 2.77 ..................................................................... 2-33REQ 2.78b ..................................................................... 2-44REQ 2.79b ..................................................................... 2-44REQ 2.80b ..................................................................... 2-44REQ 2.81REQ 2.82b ..................................................................... 2-44REQ 2.83b ..................................................................... 2-44REQ 2.84aREQ 2.85aREQ 2.86REQ 2.87b 2-72REQ 2.88REQ 2.89b ..................................................................... 2-74REQ 2.90b ..................................................................... 2-74REQ 2.91REQ 2.92b ..................................................................... 2-63REQ 2.93b ..................................................................... 2-74REQ 2.94 ..................................................................... 2-74REQ 2.95 ..................................................................... 2-74REQ 2.96 ..................................................................... 2-74REQ 2.97 ..................................................................... 2-74REQ 2.98b ..................................................................... 2-81REQ 2.99b ..................................................................... 2-83REQ 2.100 2-88REQ 2.101b ..................................................................... 2-88REQ 2.102b ..................................................................... 2-92REQ 2.103b ..................................................................... 2-92REQ 2.104b ..................................................................... 2-92REQ 2.105b ..................................................................... 2-92REQ 2.106 ..................................................................... 2-92REQ 2.107b 2-83REQ 2.108b 2-83REQ 2.109 2-78REQ 2.110

PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006 E-1

REQ 2.111b 2-78REQ 2.112b .....................................................................2-78REQ 2.113 .....................................................................2-78REQ 2.114b .....................................................................2-78REQ 2.115REQ 2.116REQ 2.117b 2-46REQ 2.118b 2-46REQ 2.119 2-46REQ 2.120 2-46REQ 2.121 2-46REQ 2.122REQ 2.123 2-46REQ 2.124 .....................................................................2-75REQ 2.126 2-46REQ 2.127b .....................................................................2-46REQ 2.128 .....................................................................2-8REQ 2.129 .....................................................................2-8REQ 2.130 .....................................................................2-11REQ 2.131 .....................................................................2-14REQ 2.132 .....................................................................2-16REQ 2.133 .....................................................................2-16REQ 2.134 .....................................................................2-18REQ 2.135 .....................................................................2-21REQ 2.136 .....................................................................2-21REQ 2.137 .....................................................................2-21REQ 2.138 .....................................................................2-21REQ 2.139 .....................................................................2-21REQ 2.140 .....................................................................2-22REQ 2.141 .....................................................................2-24REQ 2.142 .....................................................................2-24REQ 2.143 .....................................................................2-26REQ 2.144 .....................................................................2-26REQ 2.145 .....................................................................2-26REQ 2.146 .....................................................................2-32REQ 2.147 .....................................................................2-32REQ 2.148 .....................................................................2-32REQ 2.149 .....................................................................2-32REQ 2.150 .....................................................................2-32REQ 2.151 .....................................................................2-32REQ 2.152 .....................................................................2-32REQ 2.153 .....................................................................2-32REQ 2.154 .....................................................................2-32REQ 2.155 .....................................................................2-34REQ 2.156 .....................................................................2-36REQ 2.157 .....................................................................2-36REQ 2.158 .....................................................................2-36REQ 2.159 .....................................................................2-36REQ 2.160 .....................................................................2-37REQ 2.161 .....................................................................2-39REQ 2.162 .....................................................................2-39REQ 2.163 .....................................................................2-39REQ 2.164 .....................................................................2-42REQ 2.165 .....................................................................2-44REQ 2.166 .....................................................................2-44REQ 2.167 .....................................................................2-44REQ 2.168 .....................................................................2-45REQ 2.169 .....................................................................2-45REQ 2.170 .....................................................................2-45REQ 2.171 .....................................................................2-45

REQ 2.172 .................................................................... 2-45REQ 2.173 .................................................................... 2-45REQ 2.174 .................................................................... 2-45REQ 2.175 .................................................................... 2-46REQ 2.176 .................................................................... 2-46REQ 2.177 .................................................................... 2-46REQ 2.178 .................................................................... 2-46REQ 2.179 .................................................................... 2-46REQ 2.180 .................................................................... 2-53REQ 2.181 .................................................................... 2-53REQ 2.182 .................................................................... 2-56REQ 2.183 .................................................................... 2-56REQ 2.184 .................................................................... 2-57REQ 2.185 .................................................................... 2-57REQ 2.186 .................................................................... 2-64REQ 2.187 .................................................................... 2-64REQ 2.188 .................................................................... 2-65REQ 2.189 .................................................................... 2-74REQ 2.190 .................................................................... 2-78REQ 2.191 .................................................................... 2-78REQ 2.192 .................................................................... 2-81REQ 2.193 .................................................................... 2-83REQ 2.194 .................................................................... 2-88REQ 2.195 .................................................................... 2-91REQ 3.1 .................................................................... 3-4REQ 3.2b .................................................................... 3-7REQ 3.3b .................................................................... 3-7REQ 3.4 .................................................................... 3-10REQ 3.5 .................................................................... 3-10REQ 3.6 .................................................................... 3-10REQ 3.7 .................................................................... 3-10REQ 3.8 .................................................................... 3-10REQ 3.9 .................................................................... 3-11REQ 3.10b .................................................................... 3-11REQ 3.11 .................................................................... 3-11REQ 3.12b .................................................................... 3-11REQ 3.13b .................................................................... 3-11REQ 3.14 .................................................................... 3-11REQ 3.15b .................................................................... 3-11REQ 3.16b .................................................................... 3-11REQ 3.17 .................................................................... 3-11REQ 3.18b .................................................................... 3-12REQ 3.19b .................................................................... 3-12REQ 3.20 .................................................................... 3-12REQ 3.21 .................................................................... 3-12REQ 3.22 .................................................................... 3-12REQ 3.23REQ 3.24b .................................................................... 3-14REQ 3.25 .................................................................... 3-14REQ 3.26REQ 3.27REQ 3.28b .................................................................... 3-14REQ 3.29 .................................................................... 3-14REQ 3.30 .................................................................... 3-14REQ 3.31 .................................................................... 3-14REQ 3.32 .................................................................... 3-14REQ 3.33b .................................................................... 3-14REQ 3.34 .................................................................... 3-14REQ 3.35 .................................................................... 3-15REQ 3.36 .................................................................... 3-13

E-2 PICMG Advanced Mezzanine Card AMC.0 Specification R2.0, November 15, 2006

REQ 3.37 .................................................................... 3-13REQ 3.38 .................................................................... 3-76REQ 3.39b .................................................................... 3-16REQ 3.40b .................................................................... 3-16REQ 3.41 .................................................................... 3-16REQ 3.42b .................................................................... 3-16REQ 3.43 .................................................................... 3-16REQ 3.44b .................................................................... 3-16REQ 3.45b .................................................................... 3-16REQ 3.46b .................................................................... 3-16REQ 3.47b .................................................................... 3-16REQ 3.48b .................................................................... 3-16REQ 3.49bREQ 3.50b .................................................................... 3-17REQ 3.51REQ 3.52b .................................................................... 3-26REQ 3.53b .................................................................... 3-26REQ 3.54 .................................................................... 3-26REQ 3.55 .................................................................... 3-26REQ 3.56 .................................................................... 3-26REQ 3.57 .................................................................... 3-26REQ 3.58b .................................................................... 3-27REQ 3.59b .................................................................... 3-27REQ 3.60 .................................................................... 3-27REQ 3.61 .................................................................... 3-27REQ 3.62b .................................................................... 3-27REQ 3.63 .................................................................... 3-27REQ 3.64 .................................................................... 3-28REQ 3.65 .................................................................... 3-28REQ 3.66 .................................................................... 3-28REQ 3.67b .................................................................... 3-28REQ 3.68 .................................................................... 3-28REQ 3.69 .................................................................... 3-28REQ 3.70b .................................................................... 3-28REQ 3.71 .................................................................... 3-28REQ 3.72b .................................................................... 3-28REQ 3.73 .................................................................... 3-29REQ 3.74 .................................................................... 3-29REQ 3.75 .................................................................... 3-32REQ 3.76b .................................................................... 3-34REQ 3.77b .................................................................... 3-34REQ 3.78b .................................................................... 3-34REQ 3.79REQ 3.80b .................................................................... 3-35REQ 3.81 .................................................................... 3-38REQ 3.82 .................................................................... 3-38REQ 3.83 .................................................................... 3-38REQ 3.84b .................................................................... 3-38REQ 3.85 .................................................................... 3-38REQ 3.86b .................................................................... 3-44REQ 3.87REQ 3.88 .................................................................... 3-44REQ 3.89 .................................................................... 3-44REQ 3.90 .................................................................... 3-44REQ 3.91 .................................................................... 3-45REQ 3.92 .................................................................... 3-45REQ 3.93 .................................................................... 3-45REQ 3.94 .................................................................... 3-45REQ 3.95 .................................................................... 3-45REQ 3.96b .................................................................... 3-53

REQ 3.97 ..................................................................... 3-53REQ 3.98 ..................................................................... 3-53REQ 3.99 ..................................................................... 3-53REQ 3.100b ..................................................................... 3-75REQ 3.101 ..................................................................... 3-75REQ 3.102b ..................................................................... 3-75REQ 3.103 ..................................................................... 3-75REQ 3.104 ..................................................................... 3-75REQ 3.105b ..................................................................... 3-75REQ 3.106 ..................................................................... 3-76REQ 3.107 ..................................................................... 3-77REQ 3.108 ..................................................................... 3-77REQ 3.109 ..................................................................... 3-77REQ 3.110 ..................................................................... 3-77REQ 3.111 ..................................................................... 3-77REQ 3.112 ..................................................................... 3-77REQ 3.113 ..................................................................... 3-77REQ 3.114b ..................................................................... 3-77REQ 3.115 ..................................................................... 3-77REQ 3.116 ..................................................................... 3-77REQ 3.117b ..................................................................... 3-77REQ 3.118 ..................................................................... 3-77REQ 3.119b ..................................................................... 3-77REQ 3.120 ..................................................................... 3-77REQ 3.121 ..................................................................... 3-77REQ 3.122 ..................................................................... 3-78REQ 3.123 ..................................................................... 3-78REQ 3.124b ..................................................................... 3-78REQ 3.125 ..................................................................... 3-78REQ 3.126b ..................................................................... 3-78REQ 3.127 ..................................................................... 3-78REQ 3.128 ..................................................................... 3-78REQ 3.129 ..................................................................... 3-78REQ 3.130b ..................................................................... 3-78REQ 3.131 ..................................................................... 3-78REQ 3.132 ..................................................................... 3-78REQ 3.133 ..................................................................... 3-80REQ 3.134 ..................................................................... 3-80REQ 3.135 ..................................................................... 3-80REQ 3.136b ..................................................................... 3-80REQ 3.137 ..................................................................... 3-80REQ 3.138 ..................................................................... 3-80REQ 3.139 ..................................................................... 3-80REQ 3.140 ..................................................................... 3-80REQ 3.141 ..................................................................... 3-80REQ 3.142 ..................................................................... 3-80REQ 3.143 ..................................................................... 3-80REQ 3.144 ..................................................................... 3-81REQ 3.145 ..................................................................... 3-81REQ 3.146 ..................................................................... 3-81REQ 3.147 ..................................................................... 3-81REQ 3.148 ..................................................................... 3-81REQ 3.149 ..................................................................... 3-85REQ 3.150 ..................................................................... 3-85REQ 3.151 ..................................................................... 3-85REQ 3.152b ..................................................................... 3-86REQ 3.153 ..................................................................... 3-14REQ 3.154 ..................................................................... 3-14REQ 3.155 ..................................................................... 3-16REQ 3.156 ..................................................................... 3-16


REQ 3.157 .....................................................................3-16REQ 3.158 .....................................................................3-27REQ 3.159 .....................................................................3-27REQ 3.160 .....................................................................3-27REQ 3.161 .....................................................................3-28REQ 3.162 .....................................................................3-29REQ 3.163 .....................................................................3-29REQ 3.164 .....................................................................3-35REQ 3.165 .....................................................................3-35REQ 3.166 .....................................................................3-35REQ 3.167 .....................................................................3-59REQ 3.168 .....................................................................3-59REQ 3.169 .....................................................................3-59REQ 3.170 .....................................................................3-59REQ 3.171 .....................................................................3-59REQ 3.172 .....................................................................3-66REQ 3.173 .....................................................................3-67REQ 3.174 .....................................................................3-67REQ 3.175 .....................................................................3-67REQ 3.176 .....................................................................3-67REQ 3.177 .....................................................................3-67REQ 3.178 .....................................................................3-67REQ 3.179 .....................................................................3-67REQ 3.180 .....................................................................3-67REQ 3.181 .....................................................................3-67REQ 3.182 .....................................................................3-73REQ 3.183 .....................................................................3-73REQ 3.184 .....................................................................3-74REQ 3.185 .....................................................................3-74REQ 3.186 .....................................................................3-74REQ 3.187 .....................................................................3-74REQ 3.188 .....................................................................3-74REQ 3.189 .....................................................................3-74REQ 3.190 .....................................................................3-74REQ 3.191 .....................................................................3-74REQ 3.192 .....................................................................3-74REQ 3.193 .....................................................................3-74REQ 3.194 .....................................................................3-75REQ 3.195 .....................................................................3-77REQ 3.196 .....................................................................3-78REQ 3.197 .....................................................................3-86REQ 3.198 .....................................................................3-86REQ 3.199 .....................................................................3-86REQ 4.1 .....................................................................4-5REQ 4.2 .....................................................................4-2REQ 4.3 .....................................................................4-2REQ 4.4b .....................................................................4-2REQ 4.5 .....................................................................4-3REQ 4.6b .....................................................................4-3REQ 4.7b .....................................................................4-3REQ 4.8REQ 4.9 .....................................................................4-3REQ 4.10REQ 4.11 .....................................................................4-3REQ 4.12 .....................................................................4-3REQ 4.13 .....................................................................4-4REQ 4.14 .....................................................................4-4REQ 4.15b .....................................................................4-4REQ 4.16b .....................................................................4-4REQ 4.17b .....................................................................4-4

REQ 4.18b .................................................................... 4-4REQ 4.19 .................................................................... 4-4REQ 4.20b .................................................................... 4-5REQ 4.21 .................................................................... 4-5REQ 4.22b .................................................................... 4-5REQ 4.23b .................................................................... 4-5REQ 4.24b .................................................................... 4-5REQ 4.25 .................................................................... 4-7REQ 4.26b .................................................................... 4-7REQ 4.27b .................................................................... 4-7REQ 4.28b .................................................................... 4-7REQ 4.29 .................................................................... 4-7REQ 4.30 .................................................................... 4-7REQ 4.31REQ 4.32 .................................................................... 4-7REQ 4.33b .................................................................... 4-7REQ 4.34b .................................................................... 4-8REQ 4.35b .................................................................... 4-8REQ 4.36b .................................................................... 4-8REQ 4.37REQ 4.38 .................................................................. 4-2REQ 4.39 .................................................................... 4-2REQ 4.40 .................................................................... 4-3REQ 4.41 .................................................................... 4-3REQ 4.42 .................................................................... 4-5REQ 4.43 .................................................................... 4-5REQ 4.44 .................................................................... 4-7REQ 4.45 .................................................................... 4-9REQ 4.46 .................................................................... 4-10REQ 4.47 .................................................................... 4-10REQ 5.1REQ 5.2 .................................................................... 5-7REQ 5.3b .................................................................... 5-7REQ 5.4b .................................................................... 5-7REQ 5.5 .................................................................... 5-7REQ 5.6b .................................................................... 5-9REQ 5.7REQ 5.8 .................................................................... 5-9REQ 5.9REQ 5.10REQ 5.11REQ 5.12REQ 5.13REQ 5.14REQ 5.15 REQ 5.16REQ 5.17REQ 5.18REQ 5.19REQ 5.20REQ 5.21REQ 5.22REQ 5.23 .................................................................. 5-2REQ 5.24 .................................................................... 5-7REQ 5.25 .................................................................... 5-7REQ 5.26 .................................................................... 5-9REQ 5.27 .................................................................... 5-9REQ 5.28 .................................................................... 5-11REQ 5.29 .................................................................... 5-11REQ 5.30 .................................................................... 5-11


REQ 5.31 .................................................................... 5-11REQ 5.32 .................................................................... 5-11REQ 5.33 .................................................................... 5-11REQ 5.34 .................................................................... 5-11REQ 6.1b .................................................................... 6-10REQ 6.2b .................................................................... 6-10REQ 6.3REQ 6.4 .................................................................... 6-10REQ 6.5b .................................................................... 6-10REQ 6.6b .................................................................... 6-12REQ 6.7b .................................................................... 6-12REQ 6.8 .................................................................... 6-12REQ 6.9b .................................................................... 6-12REQ 6.10b .................................................................... 6-12REQ 6.11 .................................................................... 6-10REQ 6.12 .................................................................... 6-10REQ 6.13 .................................................................... 6-13REQ 6.14b .................................................................... 6-10REQ 6.15 .................................................................... 6-13REQ 6.16 .................................................................... 6-13REQ 6.17 .................................................................... 6-13REQ 6.18b .................................................................... 6-13REQ 6.19REQ 6.20b .................................................................... 6-18REQ 6.21b .................................................................... 6-18REQ 6.22REQ 6.23REQ 6.24b .................................................................... 6-18REQ 6.25b .................................................................... 6-18REQ 6.26b .................................................................... 6-18REQ 6.27b .................................................................... 6-18REQ 6.28b .................................................................... 6-18REQ 6.29REQ 6.30b .................................................................... 6-18REQ 6.31b .................................................................... 6-18REQ 6.32REQ 6.33REQ 6.34b .................................................................... 6-18REQ 6.35REQ 6.36b .................................................................... 6-18REQ 6.37b .................................................................... 6-24REQ 6.38 .................................................................... 6-25REQ 6.39 .................................................................... 6-25REQ 6.40 .................................................................... 6-25REQ 6.41 .................................................................... 6-25REQ 6.42 .................................................................... 6-25REQ 6.43 .................................................................... 6-25REQ 6.44 .................................................................... 6-25REQ 6.45 .................................................................... 6-25REQ 6.46 .................................................................... 6-25REQ 6.47 .................................................................... 6-25REQ 6.48 .................................................................... 6-25REQ 6.49 .................................................................... 6-25REQ 6.50 .................................................................... 6-25REQ 6.51 .................................................................... 6-25REQ 6.52 .................................................................... 6-26REQ 6.53 .................................................................... 6-26REQ 6.54 .................................................................... 6-26REQ 6.55 .................................................................... 6-26REQ 6.56b .................................................................... 6-30

REQ 6.57REQ 6.58REQ 6.59b ..................................................................... 6-30REQ 6.60 ..................................................................... 6-30REQ 6.61 ..................................................................... 6-30REQ 6.62b ..................................................................... 6-30REQ 6.63b ..................................................................... 6-31REQ 6.64 ..................................................................... 6-2REQ 6.65 ..................................................................... 6-10REQ 6.66 ..................................................................... 6-10REQ 6.67 ..................................................................... 6-10REQ 6.68 ..................................................................... 6-10REQ 6.69 ..................................................................... 6-10REQ 6.70 ..................................................................... 6-10REQ 6.71 ..................................................................... 6-12REQ 6.72 ..................................................................... 6-12REQ 6.73 ..................................................................... 6-12REQ 6.74 ..................................................................... 6-13REQ 6.75 ..................................................................... 6-14REQ 6.76 ..................................................................... 6-14REQ 6.77 ..................................................................... 6-18REQ 6.78 ..................................................................... 6-18REQ 6.79 ..................................................................... 6-20REQ 6.79.1 ..................................................................... 6-20REQ 6.79.2 ..................................................................... 6-20REQ 6.79.3 ..................................................................... 6-20REQ 6.79.4 ..................................................................... 6-20REQ 6.79.5 ..................................................................... 6-20REQ 6.79.6 ..................................................................... 6-20REQ 6.79.7 ..................................................................... 6-21REQ 6.79.8 ..................................................................... 6-21REQ 6.79.9 ..................................................................... 6-21REQ 6.79.10 .................................................................... 6-21REQ 6.79.11 .................................................................... 6-21REQ 6.79.12 .................................................................... 6-21REQ 6.79.13 .................................................................... 6-21REQ 6.79.14 .................................................................... 6-21REQ 6.80 ..................................................................... 6-21REQ 6.81 ..................................................................... 6-22REQ 6.81.1 ..................................................................... 6-22REQ 6.81.2 ..................................................................... 6-22REQ 6.81.3 ..................................................................... 6-22REQ 6.81.4 ..................................................................... 6-22REQ 6.81.5 ..................................................................... 6-22REQ 6.81.6 ..................................................................... 6-22REQ 6.81.7 ..................................................................... 6-23REQ 6.81.8 ..................................................................... 6-23REQ 6.81.9 ..................................................................... 6-23REQ 6.81.10 .................................................................... 6-23REQ 6.81.11 .................................................................... 6-23REQ 6.82 ..................................................................... 6-23REQ 6.83 ..................................................................... 6-23REQ 6.84 ..................................................................... 6-23REQ 6.85 ..................................................................... 6-23REQ 6.86 ..................................................................... 6-23REQ 6.87 ..................................................................... 6-23REQ 6.88 ..................................................................... 6-23REQ 6.89 ..................................................................... 6-24REQ 6.90 ..................................................................... 6-26REQ 6.91 ..................................................................... 6-26


REQ 6.92 .....................................................................6-31REQ 7.1b .....................................................................7-1REQ 7.2b .....................................................................7-1REQ 7.3b .....................................................................7-1REQ 7.4 .....................................................................7-1REQ 7.5 .....................................................................7-2REQ 7.6 .....................................................................7-2REQ 7.7 .....................................................................7-3REQ 7.8 .....................................................................7-3REQ 7.9 .....................................................................7-3REQ 7.10 .....................................................................7-4REQ 7.11REQ 7.12 .....................................................................7-4REQ 7.13b .....................................................................7-5REQ 7.14b .....................................................................7-5REQ 7.15b .....................................................................7-5REQ 7.16 .....................................................................7-6REQ 7.17 .....................................................................7-6REQ 7.18REQ 7.19 .....................................................................7-8REQ 7.20 .....................................................................7-9REQ 7.21 .....................................................................7-12REQ 7.22 .....................................................................7-13REQ 7.23 .....................................................................7-16REQ 7.24 .....................................................................7-17REQ 7.25a .....................................................................7-19REQ 7.26 .....................................................................7-19REQ 7.27 .....................................................................7-19REQ 7.28a .....................................................................7-19REQ 7.29a .....................................................................7-19REQ 7.30 .....................................................................7-24REQ 7.31REQ 7.32REQ 7.33REQ 7.34 .....................................................................7-24REQ 7.35 .....................................................................7-24REQ 7.36a .....................................................................7-25REQ 7.37 .....................................................................7-25REQ 7.38 .....................................................................7-26REQ 7.39a .....................................................................7-26REQ 7.40a .....................................................................7-26REQ 7.41 .....................................................................7-26REQ 7.42 .....................................................................7-26REQ 7.43a .....................................................................7-27REQ 7.44 .....................................................................7-27REQ 7.45 .....................................................................7-27REQ 7.46 .....................................................................7-27REQ 7.47 .....................................................................7-28REQ 7.48b .....................................................................7-28REQ 7.49 .....................................................................7-28REQ 7.50 .....................................................................7-28REQ 7.51 .....................................................................7-29REQ 7.52REQ 7.53a .....................................................................7-29REQ 7.54a .....................................................................7-30REQ 7.55a .....................................................................7-30REQ 7.56a .....................................................................7-31REQ 7.57a .....................................................................7-31REQ 7.58a .....................................................................7-32REQ 7.59a .....................................................................7-32

REQ 7.60REQ 7.61REQ 7.62 .................................................................... 7-33REQ 7.63REQ 7.64a .................................................................... 7-33REQ 7.65a .................................................................... 7-33REQ 7.66a .................................................................... 7-33REQ 7.67a .................................................................... 7-33REQ 7.68 .................................................................... 7-34REQ 7.69 .................................................................... 7-24REQ 7.70 .................................................................... 7-34REQ 7.71 .................................................................... 7-35REQ 7.72a .................................................................... 7-35REQ 7.73b .................................................................... 7-35REQ 7.74 .................................................................... 7-4REQ 7.75 .................................................................... 7-4REQ 7.76 .................................................................... 7-6REQ 7.77 .................................................................... 7-6REQ 7.78 .................................................................... 7-6REQ 7.79 .................................................................... 7-24REQ 7.80 .................................................................... 7-32REQ 7.81 .................................................................... 7-32REQ 7.82b .................................................................... 7-36REQ 7.83aREQ 7.84aREQ 7.85 .................................................................... 7-40REQ 7.86 .................................................................... 7-40REQ 7.87 .................................................................. 7-3REQ 7.88 .................................................................... 7-6REQ 7.89 .................................................................... 7-24REQ 7.90 .................................................................... 7-24REQ 7.91 .................................................................... 7-33

Requirements added since AMC.0 R1.0REQ 2.128 .................................................................... 2-8REQ 2.129 .................................................................... 2-8REQ 2.130 .................................................................... 2-11REQ 2.131 .................................................................... 2-14REQ 2.132 .................................................................... 2-16REQ 2.133 .................................................................... 2-16REQ 2.134 .................................................................... 2-18REQ 2.135 .................................................................... 2-21REQ 2.136 .................................................................... 2-21REQ 2.137 .................................................................... 2-21REQ 2.138 .................................................................... 2-21REQ 2.139 .................................................................... 2-21REQ 2.140 .................................................................... 2-22REQ 2.141 .................................................................... 2-24REQ 2.142 .................................................................... 2-24REQ 2.143 .................................................................... 2-26REQ 2.144 .................................................................... 2-26REQ 2.145 .................................................................... 2-26REQ 2.146 .................................................................... 2-32REQ 2.147 .................................................................... 2-32REQ 2.148 .................................................................... 2-32REQ 2.149 .................................................................... 2-32REQ 2.150 .................................................................... 2-32REQ 2.151 .................................................................... 2-32REQ 2.152 .................................................................... 2-32


REQ 2.153 .................................................................... 2-32REQ 2.154 .................................................................... 2-32REQ 2.155 .................................................................... 2-34REQ 2.156 .................................................................... 2-36REQ 2.157 .................................................................... 2-36REQ 2.158 .................................................................... 2-36REQ 2.159 .................................................................... 2-36REQ 2.160 .................................................................... 2-37REQ 2.161 .................................................................... 2-39REQ 2.162 .................................................................... 2-39REQ 2.163 .................................................................... 2-39REQ 2.164 .................................................................... 2-42REQ 2.165 .................................................................... 2-44REQ 2.166 .................................................................... 2-44REQ 2.167 .................................................................... 2-44REQ 2.168 .................................................................... 2-45REQ 2.169 .................................................................... 2-45REQ 2.170 .................................................................... 2-45REQ 2.171 .................................................................... 2-45REQ 2.172 .................................................................... 2-45REQ 2.173 .................................................................... 2-45REQ 2.174 .................................................................... 2-45REQ 2.175 .................................................................... 2-46REQ 2.176 .................................................................... 2-46REQ 2.177 .................................................................... 2-46REQ 2.178 .................................................................... 2-46REQ 2.179 .................................................................... 2-46REQ 2.180 .................................................................... 2-53REQ 2.181 .................................................................... 2-53REQ 2.182 .................................................................... 2-56REQ 2.183 .................................................................... 2-56REQ 2.184 .................................................................... 2-57REQ 2.185 .................................................................... 2-57REQ 2.186 .................................................................... 2-64REQ 2.187 .................................................................... 2-64REQ 2.188 .................................................................... 2-65REQ 2.189 .................................................................... 2-74REQ 2.190 .................................................................... 2-78REQ 2.191 .................................................................... 2-78REQ 2.192 .................................................................... 2-81REQ 2.193 .................................................................... 2-83REQ 2.194 .................................................................... 2-88REQ 2.195 .................................................................... 2-91REQ 3.153 ..................................................................... 3-14REQ 3.154 .................................................................... 3-14REQ 3.155 .................................................................... 3-16REQ 3.156 .................................................................... 3-16REQ 3.157 .................................................................... 3-16REQ 3.158 .................................................................... 3-27REQ 3.159 .................................................................... 3-27REQ 3.160 .................................................................... 3-27REQ 3.161 .................................................................... 3-28REQ 3.162 .................................................................... 3-29REQ 3.163 .................................................................... 3-29REQ 3.164 .................................................................... 3-35REQ 3.165 .................................................................... 3-35REQ 3.166 .................................................................... 3-35REQ 3.167 .................................................................... 3-59REQ 3.168 .................................................................... 3-59REQ 3.169 .................................................................... 3-59

REQ 3.170 ..................................................................... 3-59REQ 3.171 ..................................................................... 3-59REQ 3.172 ..................................................................... 3-66REQ 3.173 ..................................................................... 3-67REQ 3.174 ..................................................................... 3-67REQ 3.175 ..................................................................... 3-67REQ 3.176 ..................................................................... 3-67REQ 3.177 ..................................................................... 3-67REQ 3.178 ..................................................................... 3-67REQ 3.179 ..................................................................... 3-67REQ 3.180 ..................................................................... 3-67REQ 3.181 ..................................................................... 3-67REQ 3.182 ..................................................................... 3-73REQ 3.183 ..................................................................... 3-73REQ 3.184 ..................................................................... 3-74REQ 3.185 ..................................................................... 3-74REQ 3.186 ..................................................................... 3-74REQ 3.187 ..................................................................... 3-74REQ 3.188 ..................................................................... 3-74REQ 3.189 ..................................................................... 3-74REQ 3.190 ..................................................................... 3-74REQ 3.191 ..................................................................... 3-74REQ 3.192 ..................................................................... 3-74REQ 3.193 ..................................................................... 3-74REQ 3.194 ..................................................................... 3-75REQ 3.195 ..................................................................... 3-77REQ 3.196 ..................................................................... 3-78REQ 3.197 ..................................................................... 3-86REQ 3.198 ..................................................................... 3-86REQ 3.199 ..................................................................... 3-86REQ 4.38 .................................................................. 4-2REQ 4.39 ..................................................................... 4-2REQ 4.40 ..................................................................... 4-3REQ 4.41 ..................................................................... 4-3REQ 4.42 ..................................................................... 4-5REQ 4.43 ..................................................................... 4-5REQ 4.44 ..................................................................... 4-7REQ 4.45 ..................................................................... 4-9REQ 4.46 ..................................................................... 4-10REQ 4.47 ..................................................................... 4-10REQ 5.23 .................................................................. 5-2REQ 5.24 ..................................................................... 5-7REQ 5.25 ..................................................................... 5-7REQ 5.26 ..................................................................... 5-9REQ 5.27 ..................................................................... 5-9REQ 5.28 ..................................................................... 5-11REQ 5.29 ..................................................................... 5-11REQ 5.30 ..................................................................... 5-11REQ 5.31 ..................................................................... 5-11REQ 5.32 ..................................................................... 5-11REQ 5.33 ..................................................................... 5-11REQ 5.34 ..................................................................... 5-11REQ 6.64 ..................................................................... 6-2REQ 6.65 ..................................................................... 6-10REQ 6.66 ..................................................................... 6-10REQ 6.67 ..................................................................... 6-10REQ 6.68 ..................................................................... 6-10REQ 6.69 ..................................................................... 6-10REQ 6.70 ..................................................................... 6-10REQ 6.71 ..................................................................... 6-12


REQ 6.72 .....................................................................6-12REQ 6.73 .....................................................................6-12REQ 6.74 .....................................................................6-13REQ 6.75 .....................................................................6-14REQ 6.76 .....................................................................6-14REQ 6.77 .....................................................................6-18REQ 6.78 .....................................................................6-18REQ 6.79 .....................................................................6-20REQ 6.79.1 .....................................................................6-20REQ 6.79.2 .....................................................................6-20REQ 6.79.3 .....................................................................6-20REQ 6.79.4 .....................................................................6-20REQ 6.79.5 .....................................................................6-20REQ 6.79.6 .....................................................................6-20REQ 6.79.7 .....................................................................6-21REQ 6.79.8 .....................................................................6-21REQ 6.79.9 .....................................................................6-21REQ 6.79.10 ....................................................................6-21REQ 6.79.11 ....................................................................6-21REQ 6.79.12 ....................................................................6-21REQ 6.79.13 ....................................................................6-21REQ 6.79.14 ....................................................................6-21REQ 6.80 .....................................................................6-21REQ 6.81 .....................................................................6-22REQ 6.81.1 .....................................................................6-22REQ 6.81.2 .....................................................................6-22REQ 6.81.3 .....................................................................6-22REQ 6.81.4 .....................................................................6-22REQ 6.81.5 .....................................................................6-22REQ 6.81.6 .....................................................................6-22REQ 6.81.7 .....................................................................6-23REQ 6.81.8 .....................................................................6-23REQ 6.81.9 .....................................................................6-23REQ 6.81.10 ....................................................................6-23REQ 6.81.11 ....................................................................6-23REQ 6.82 .....................................................................6-23REQ 6.83 .....................................................................6-23REQ 6.84 .....................................................................6-23REQ 6.85 .....................................................................6-23REQ 6.86 .....................................................................6-23REQ 6.87 .....................................................................6-23REQ 6.88 .....................................................................6-23REQ 6.89 .....................................................................6-24REQ 6.90 .....................................................................6-26REQ 6.91 .....................................................................6-26REQ 6.92 .....................................................................6-31REQ 7.74 .....................................................................7-4REQ 7.75 .....................................................................7-4REQ 7.76 .....................................................................7-6REQ 7.77 .....................................................................7-6REQ 7.78 .....................................................................7-6REQ 7.79 .....................................................................7-24REQ 7.80 .....................................................................7-32REQ 7.81 .....................................................................7-32REQ 7.82b .....................................................................7-36REQ 7.83a ............................................................... DeletedREQ 7.84a DeletedREQ 7.85 .....................................................................7-40REQ 7.86 .....................................................................7-40REQ 7.87 ...................................................................7-3

REQ 7.88 .................................................................... 7-6REQ 7.89 .................................................................... 7-24REQ 7.90 .................................................................... 7-24REQ 7.91 .................................................................... 7-33

Requirements deleted since AMC.0 R1.0REQ 2.2REQ 2.5REQ 2.8REQ 2.9REQ 2.10REQ 2.11REQ 2.12REQ 2.34REQ 2.35REQ 2.36REQ 2.51REQ 2.53REQ 2.54REQ 2.56REQ 2.61REQ 2.74REQ 2.75REQ 2.81REQ 2.84aREQ 2.85aREQ 2.86REQ 2.88REQ 2.91REQ 2.110REQ 2.115REQ 2.116REQ 2.122REQ 2.125REQ 3.23 REQ 3.26REQ 3.27 REQ 3.49b REQ 3.51 REQ 3.79 REQ 3.87 REQ 4.8 REQ 4.10 REQ 4.31 REQ 4.37 REQ 5.1 REQ 5.7 REQ 5.9 REQ 5.10 REQ 5.11 REQ 5.12 REQ 5.13REQ 5.14 REQ 5.15 REQ 5.16 REQ 5.17 REQ 5.18 REQ 5.19 REQ 5.20 REQ 5.21


REQ 5.22 REQ 6.3 REQ 6.19 REQ 6.22 REQ 6.23 REQ 6.29 REQ 6.32 REQ 6.33 REQ 6.35 REQ 6.57 REQ 6.58 REQ 7.11 REQ 7.18

REQ 7.31 REQ 7.32 REQ 7.33 REQ 7.52 REQ 7.60 REQ 7.61 REQ 7.63 REQ 7.83a REQ 7.84a

Note: Requirements modified by ECN001 are marked with a revision a. Requirements modified by R2.0 are marked with a revision b.


Advanced Mezzanine Card Base Specification Advanced Mezzanine Card AMC.0 Specification R2.0,...

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Transcript of Advanced Mezzanine Card Base Specification Advanced Mezzanine Card AMC.0 Specification R2.0,...