Additive Manufacturing for high tech systems

Denis Loncke

4/12/2013| Veldhoven

Co-author Sjoerd Donders

Additive Manufacturing for high tech systems

December 4, 2013

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Key to Moore’s Law: Making smaller transistors

December 4, 2013

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The first integrated circuit on

silicon, on a wafer the size of

a fingernail (Fairchild Semiconductor, 1959)

Today: More than a

billion transistors on

the same area (Intel, 2012)

Transistor length has

shrunk by a million

Like a photo enlarger of old,

lithography forms the image of

chip patterns on a wafer

Lithography is critical for shrinking transistors

December 4, 2013

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Photolithography – how an ASML system works

December 4, 2013

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How does a modern chip look like A modern chip has more than just one layer

December 4, 2013

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The manufacturing loop

December 4, 2013

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Exposure

Developing

Etching

Ion implantation Stripping

Deposition

Photoresist coating

Keeping up with Moore’s Law requires constant

technology upgrades: Continuous shrink December 4, 2013

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* Note: Process development 1.5 ~ 2 years in advance

Trick:

10

100

Reso

luti

on /

half

pitc

h, "S

hrin

k" [n

m]

6

2002 2004 2006 2008 2010 2012 2014 2016 2018 2020

Year of Production start *

DRAM 13.9%

200

XT:1400

XT:1700i

AT:1200

XT:1900i

NXT:1950i

20

30

40

50 60

80

NXE:3100

NXE:3300B

NXT:1960Bi

Feb-2012

2

3 4

NXT:1970Ci

Reso

luti

on

/ h

alf

pit

ch

, “S

hri

nk” [

nm

]

NAND 17% Logic 14.1%

Keeping up with Moore’s Law requires constant

technology upgrades: Improved productivity December 4, 2013

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Year of introduction

0

40

80

120

160

200

Th

roughput

[WP

H]

1985 1990 1995 2000 2005 2010 2015

300mm

200 150

450mm?

Drivers in semiconductor Litho industry Pushing the ASML system to the limit

December 4, 2013

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• Shrink – reduces lithography costs

• Productivity – increases efficiency of lithography systems

precision, thermal stability, dynamics

lightweight, increased design & functionality density

Impact on system design Public

December 4, 2013

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Actuation

Position

measurement

Position

control 𝑓𝐵𝑊

Mass (m)

T stability

Stiffness (k)

Point of

interest POI

(𝑒𝑟𝑟𝑜𝑟𝑃𝐶)

Thermal

disturbance

Td

Mechanical

disturbance

Fd

𝑓𝐵𝑊~ 𝑓𝑛 =1

2𝜋

𝑘

𝑚

𝑒𝑟𝑟𝑜𝑟𝑃𝐶

𝐹𝑑=

1

0.5. 𝑚. (2𝜋𝑓𝐵𝑊)2 s,v,a,j

𝐹𝑎𝑐𝑡 = 𝑚. 𝑎

Fd

Td

System drivers:

• Precision

• Productivity

Influenced by:

• Disturbance forces

• Dynamics

• Temperature variations

Requiring:

• Reduction of disturbances

• Light & stiff design

• Thermal control

Contribution of AM: reduction of disturbances Freedom of design and manufacturing to eliminate flow induced disturbance

forces

Public

December 4, 2013

Slide 13

PEEK Conventional

machined part Titanium

Additive manufactured part

90% disturbance

force reduction by

flow optimization

Sharp corners

and transitions

Smooth corners

and transitions

Public

December 4, 2013

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Contribution of AM : improved thermal control Freedom of design and manufacturing to integrate cooling for improved

thermal control

Efficient cooling

• Cooling channels close to heat source

• Maximal contact area of coolant

Additional benefit

• Integration of parts

• Increased robustness

• Reduced lead-time and cost

Contribution of AM : lightweight & stiff design Freedom of design and manufacturing to optimise weight and functionality Public

December 4, 2013

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AM design Flow optimized

Conventional

design

Ti 35x21x21 6g

Ti 170x170x15

200g

Ti 52,3x18,3x13 11g

PC 223,5x116,5x40

Ti 170x170x15

100g

Public

December 4, 2013

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Additive Manufacturing for high tech systems

Additive Manufacturing for high tech systems

Public

December 4, 2013

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Additive Manufacturing for high tech systems Roadmap alignment and CFT2.0 program

December 4, 2013

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Basic research Industrial

development

Equipment

development (B2B)

Industrial application

and supplying

TNO / ECN Additive

Industries Academia

Brainport

Industries

Kennis Kunde kassa

• Materials

• Processes

• Modelling

• Design tools

• Industrialization and

supplying to end-

customers

• Redesign

• Prototyping on

existing equipment

• Bèta equipment

• Materials

• Machines (Alfa

equipment)

• Processes

AM-SMART

STW

Polymers / Metals

/ Ceramics Addlab (AI & BI)

Shared AM facility

End

Users

(OEMs)

HT SMEs

Dem

and a

rtic

ula

tion

Source: 130703 CFT2 0 AMT oems.pptx Brainport Industries Roadmap alignment

AM roadmap alignment for the high tech industrie Participants

December 4, 2013

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Additive Manufacturing for high tech systems AM roadmap alignment goal and status

December 4, 2013

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Goal:

Definition and execution of a joint research program

on additive manufacturing technology to enable the

production of future parts.

Status:

• Agreement on the consolidated AM technology

roadmap

• Definition of workgroups for the definition of

research programs

Public

OEM Topology Large

Metals Small

Metals Plastics Ceramics Hybrids

ASML x x x x x x

DAF x x x

Eesa x x

FEI x x x x

Fokker x x x x

OCE x x x x

Philips Consumer x

Philips Healthcare x x x x x

Philips Healthcare x x x x x

Philips Lighting x x x x x

Philips PiNS x x x x

Philips Research x x x x x

Sulzer x x

Thales Cryogenics x x

Research

Cranfield x x

ECN x x x

KULeuven x x x

NLR x x x

Sirris x x x

TNO x x x x x

TUD x x

VITO x x x x

Materials

BASF x

DSM/chemelot x x

Sabic x x x

Additive Manufacturing for high tech systems ASML AM roadmaps consolidated roadmap

December 4, 2013

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December 4, 2013

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• Materials

Ti grade 5, 316L, Al T7075, Al T6082, Invar,

Inconel, Mo, Ta, W, T800MarM509,

Hardmetals, Cu, Au, Ag, solder

• Small parts (<5000cm3) driven by

- precision

- feature size

- freedom of design

• Large parts (>1m) driven by

- buy to fly ratio = cost

• Common drivers

- material quality consistency and surface finish

- resolution +/- 0.05 mm (large parts) to 0.02 mm (small parts)

Public

Additive Manufacturing for high tech systems Consolidated roadmap metals

December 4, 2013

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Powder bed based (SLM)

• High level of complexity

• Low deposition rates

• Small parts

• High part costs

• Quality and flaw issues

Wire Arc based (WAAM)

• High deposition rates

• Low part costs

• Large Parts

• Hybrid products

• Low level of complexity

• Post processing

Blown powder based (3d cladding)

• Medium deposition rates

• Large parts

• Thin walls

• Hybrid products

• Medium level of complexity

Source: Vito Source: Cranfield

Additive Manufacturing for high tech systems Possibilities for metal additive manufacturing

December 4, 2013

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Powder bed based (SLM)

• High level of complexity

• Low deposition rates

• Small parts

• High part costs

• Quality and flaw issues

Wire Arc based (WAAM)

• High deposition rates

• Low part costs

• Large Parts

• Hybrid products

• Low level of complexity

• Post processing

Blown powder based (3d cladding)

• Medium deposition rates

• Large parts

• Thin walls

• Hybrid products

• Medium level of complexity

Source: Vito Source: Cranfield

Additive Manufacturing for high tech systems Possibilities for metal additive manufacturing

December 4, 2013

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+ =

• Reduction of machining cost for large Ti Parts reduce buy to fly ratio

• Function integration less connections reliability improvement

large Ti parts (~50 dm3)

function integration monolithic part

Additive Manufacturing for high tech systems Cost reduction and function integration in metal AM

Additive Manufacturing for high tech systems Consolidated roadmap plastics

December 4, 2013

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High tech plastics

- PEEK, PEI, POM, PA12, PFA, PC

- ABS, PBT, PMMA, Viton, teflon, ECTFE, PVDF

Driven by needed properties

- mechanical properties, porosity, flammability,

outgassing, ageing, thermal properties,

optical properties

Quality level comparable with SLA process

- surface, porosity, topology

Needed resolution - +/- 0.05 mm

Public

Additive Manufacturing for high tech systems Restrictions for plastics

December 4, 2013

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FDM:

+ thermoplastics, ># structural materials, flammability certified materials

- Design freedom, material cost

SLA:

+ thermoset plastics, design freedom, porosity

- Ageing, brittleness, color changing, flammability certified materials

SLS:

+ high tech plastics, design freedom

- porosity, surface quality, material cost, flammability certified materials

Public

New technology is needed that combines the

advantages of available processes and design freedom

Additive Manufacturing for high tech systems Consolidated roadmap ceramics

December 4, 2013

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Materials like

Al2O3, ZrO2, SiC, SiSiC, Si3N4, AlN, SiSiC,

Cordierite, Zerodur

Size:

Small parts from 4x4x8cm to large parts

from 1x1x0.2m

Needed resolution +/-0.05mm (large parts) to 0.01mm small parts

Processes are relative new and still under development

Public

Additive Manufacturing for high tech systems Consolidated roadmap ceramics

December 4, 2013

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• VAT polymerization

• Current printable size is still small but has freedom of design

• Lamination process

• limits the design freedom but suitable for larger parts

Public

Additive Manufacturing for high tech systems Consolidated roadmap hybrids

December 4, 2013

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• Functional hybrid materials

• Mechanical inserts

• Graded transitions

• Thermal and electrical isolation

• Tailored electrical conductivity/capacity & EMC shielding

• Integrated light guides and sensors

• Materials

• Polymer - Polymer, Polymer - Metal

• Ceramic - Ceramic, Ceramic – Metal

• Metal - Metal

• For the hybrid materials the sizes and resolution is the same as for the pure materials.

Public

Additive Manufacturing for high tech systems Consolidated roadmap design & process tooling

December 4, 2013

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File interchangeability

Public

Design optimization

tools (point cloud)

CAD/CAE tools

(parametric)

print tools

(stacked layer)

3D

design

file

Additive Manufacturing for high tech systems Consolidated roadmap design & process tooling: optimization example

December 4, 2013

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1. Define problem:

2. Discretize and parameterize material distribution

3. Optimize material distribution for best performance

- Objective? Constraints? - Domain? Boundary conditions? - Loadcases?

4. Evaluate / fine-tune result (postprocessing, shape optimization)

Load

Maximize stiffness Use only 50% material

i

Source: Fred van Keulen (TUD)

Additive Manufacturing for high tech systems 3D Topology optimization translated to a ASML part

December 4, 2013

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• Optimization methodology improves performance • Organic shapes can not be conventional machined • Can a human handle / improve these complex shapes?

Load case definition: • Volume claim • Actuator position • Load Cases • Optimization parameters

Optimized result Freeform Organic design

1 day Processing time

?

Additive Manufacturing for high tech systems

Public

December 4, 2013

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Additive Manufacturing for high tech systems Shaping the future

December 4, 2013

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> 30 parts in production is a good start but further attention is needed on

• Particle cleanliness

• Surface finish & porosity

• Consistency of materials & process

• Definition of quality verification

and geometric accuracy

• Part size

• Materials & processes

• Design tools

Public

Thank you for your attention

Denis Loncke, Sjoerd Donders