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Transcript of Ad 9254
14-Bit, 150 MSPS, 1.8 V Analog-to-Digital Converter
AD9254
Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved.
FEATURES 1.8 V analog supply operation 1.8 V to 3.3 V output supply SNR = 71.8 dBc (72.8 dBFS) to 70 MHz input SFDR = 84 dBc to 70 MHz input Low power: 430 mW @ 150 MSPS Differential input with 650 MHz bandwidth On-chip voltage reference and sample-and-hold amplifier DNL = ±0.4 LSB Flexible analog input: 1 V p-p to 2 V p-p range Offset binary, Gray code, or twos complement data format Clock duty cycle stabilizer Data output clock Serial port control
Built-in selectable digital test pattern generation Programmable clock and data alignment
APPLICATIONS Ultrasound equipment IF sampling in communications receivers
CDMA2000, WCDMA, TD-SCDMA, and WiMax Battery-powered instruments Hand-held scopemeters Low cost digital oscilloscopes
Macro, micro, and pico cell infrastructure
GENERAL DESCRIPTION
The AD9254 is a monolithic, single 1.8 V supply, 14-bit, 150 MSPS analog-to-digital converter (ADC), featuring a high performance sample-and-hold amplifier (SHA) and on-chip voltage reference. The product uses a multistage differential pipeline architecture with output error correction logic to provide 14-bit accuracy at 150 MSPS data rates and guarantees no missing codes over the full operating temperature range.
The wide bandwidth, truly differential SHA allows a variety of user-selectable input ranges and offsets, including single-ended applications. It is suitable for multiplexed systems that switch full-scale voltage levels in successive channels and for sampling single-channel inputs at frequencies well beyond the Nyquist rate. Combined with power and cost savings over previously available ADCs, the AD9254 is suitable for applications in communications, imaging, and medical ultrasound.
A differential clock input controls all internal conversion cycles. A duty cycle stabilizer (DCS) compensates for wide variations in the clock duty cycle while maintaining excellent overall ADC performance.
FUNCTIONAL BLOCK DIAGRAM DRVDDAVDD
AGND
0.5V
CLK– PDWN DRGND
OR
VIN+
VIN–
REFT
REFB
AD9254
VREF
SENSE
SHA
A/D
MDAC1
4 8
15
3
A/D8-STAGE1 1/2-BIT PIPELINE
REFSELECT
CLK+
CLOCKDUTY CYCLESTABILIZER
MODESELECT
CORRECTION LOGIC
OUTPUT BUFFERS DCO
SCLK/DFSSDIO/DCSCSB
D13 (MSB)
D0 (LSB)
0621
6-00
1
Figure 1.
The digital output data is presented in offset binary, Gray code, or twos complement formats. A data output clock (DCO) is provided to ensure proper latch timing with receiving logic.
The AD9254 is available in a 48-lead LFCSP_VQ and is specified over the industrial temperature range (−40°C to +85°C).
PRODUCT HIGHLIGHTS
1. The AD9254 operates from a single 1.8 V power supply and features a separate digital output driver supply to accommodate 1.8 V to 3.3 V logic families.
2. The patented SHA input maintains excellent performance for input frequencies up to 225 MHz.
3. The clock DCS maintains overall ADC performance over a wide range of clock pulse widths.
4. A standard serial port interface supports various product features and functions, such as data formatting (offset binary, twos complement, or Gray coding), enabling the clock DCS, power-down, and voltage reference mode.
5. The AD9254 is pin-compatible with the AD9233, allowing a simple migration from 12 bits to 14 bits.
AD9254
Rev. 0 | Page 2 of 40
TABLE OF CONTENTS Features .............................................................................................. 1
Applications....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
DC Specifications ......................................................................... 3
AC Specifications.......................................................................... 4
Digital Specifications ................................................................... 5
Switching Specifications .............................................................. 6
Timing Diagram ........................................................................... 6
Absolute Maximum Ratings............................................................ 7
Thermal Resistance ...................................................................... 7
ESD Caution.................................................................................. 7
Pin Configuration and Function Descriptions............................. 8
Equivalent Circuits ........................................................................... 9
Typical Performance Characteristics ........................................... 10
Theory of Operation ...................................................................... 14
Analog Input Considerations.................................................... 14
Differential Input Configurations ............................................ 15
Voltage Reference ....................................................................... 16
Clock Input Considerations ...................................................... 17
Jitter Considerations .................................................................. 19
Power Dissipation and Standby Mode..................................... 19
Digital Outputs ........................................................................... 20
Timing ......................................................................................... 20
Serial Port Interface (SPI).............................................................. 21
Configuration Using the SPI..................................................... 21
Hardware Interface..................................................................... 21
Configuration Without the SPI ................................................ 21
Memory Map .................................................................................. 22
Reading the Memory Map Register Table............................... 22
Memory Map Register Table..................................................... 23
Layout Considerations................................................................... 25
Power and Ground Recommendations ................................... 25
CML ............................................................................................. 25
RBIAS........................................................................................... 25
Reference Decoupling................................................................ 25
Evaluation Board ............................................................................ 26
Power Supplies ............................................................................ 26
Input Signals................................................................................ 26
Output Signals ............................................................................ 26
Default Operation and Jumper Selection Settings................. 27
Alternative Clock Configurations............................................ 27
Alternative Analog Input Drive Configuration...................... 27
Schematics ................................................................................... 29
Evaluation Board Layout........................................................... 34
Bill of Materials........................................................................... 37
Outline Dimensions ....................................................................... 40
Ordering Guide .......................................................................... 40
REVISION HISTORY
10/06—Revision 0: Initial Version
AD9254
Rev. 0 | Page 3 of 40
SPECIFICATIONS DC SPECIFICATIONS AVDD = 1.8 V; DRVDD = 2.5 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, DCS enabled, unless otherwise noted.
Table 1. AD9254BCPZ-150
Parameter Temperature Min Typ Max Unit
RESOLUTION Full 14 Bits ACCURACY
No Missing Codes Full Guaranteed Offset Error Full ±0.3 ±0.8 % FSR Gain Error Full ±0.6 ±4.5 % FSR Differential Nonlinearity (DNL)1 25°C ±0.4 LSB
Full ±1.0 LSB Integral Nonlinearity (INL)1 25°C ±1.5 LSB
Full ±5.0 LSB TEMPERATURE DRIFT
Offset Error Full ±15 ppm/°C Gain Error Full ±95 ppm/°C
INTERNAL VOLTAGE REFERENCE Output Voltage Error (1 V Mode) Full ±5 ±35 mV Load Regulation @ 1.0 mA Full 7 mV
INPUT REFERRED NOISE VREF = 1.0 V 25°C 1.3 LSB rms
ANALOG INPUT Input Span, VREF = 1.0 V Full 2 V p-p Input Capacitance2 Full 8 pF
REFERENCE INPUT RESISTANCE Full 6 kΩ POWER SUPPLIES
Supply Voltage AVDD Full 1.7 1.8 1.9 V DRVDD Full 1.7 2.5 3.6 V
Supply Current IAVDD1 Full 240 260 mA IDRVDD1(DRVDD = 1.8 V) Full 11 mA IDRVDD1 (DRVDD = 3.3 V) Full 23 mA
POWER CONSUMPTION DC Input Full 430 470 mW Sine Wave Input1 (DRVDD = 1.8 V) Full 450 mW Sine Wave Input1 (DRVDD = 3.3 V) Full 506 mW Standby Power3 Full 40 mW Power-Down Power Full 1.8 mW
1 Measured with a low input frequency, full-scale sine wave, with approximately 5 pF loading on each output bit. 2 Input capacitance refers to the effective capacitance between one differential input pin and AGND. Refer to Figure 4 for the equivalent analog input structure. 3 Standby power is measured with a dc input, the CLK pin inactive (set to AVDD or AGND).
AD9254
Rev. 0 | Page 4 of 40
AC SPECIFICATIONS AVDD = 1.8 V; DRVDD = 2.5 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, DCS enabled, unless otherwise noted.
Table 2. AD9254BCPZ-150
Parameter1 Temperature Min Typ Max Unit
SIGNAL-TO-NOISE-RATIO (SNR) fIN = 2.4 MHz 25°C 72.0 dBc fIN = 70 MHz 25°C 71.8 dBc Full 70.0 dBc fIN = 100 MHz 25°C 71.6 dBc fIN = 170 MHz 25°C 70.8 dBc
SIGNAL-TO-NOISE AND DISTORTION (SINAD) fIN = 2.4 MHz 25°C 71.7 dBc fIN = 70 MHz 25°C 71.0 dBc Full 69.0 dBc fIN = 100 MHz 25°C 70.6 dBc fIN = 170 MHz 25°C 69.8 dBc
EFFECTIVE NUMBER OF BITS (ENOB) fIN = 2.4 MHz 25°C 11.7 Bits
fIN = 70 MHz 25°C 11.7 Bits
fIN = 100 MHz 25°C 11.6 Bits
fIN = 170 MHz 25°C 11.5 Bits
WORST SECOND OR THIRD HARMONIC fIN = 2.4 MHz 25°C −90 dBc
fIN = 70 MHz 25°C −84 dBc
Full −74 dBc
fIN = 100 MHz 25°C −83 dBc
fIN = 170 MHz 25°C −80 dBc
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fIN = 2.4 MHz 25°C 90 dBc
fIN = 70 MHz 25°C 84 dBc
Full 74 dBc
fIN = 100 MHz 25°C 83 dBc
fIN = 170 MHz 25°C 80 dBc
WORST OTHER (HARMONIC OR SPUR) fIN = 2.4 MHz 25°C −93 dBc
fIN = 70 MHz 25°C −93 dBc
Full −85 dBc
fIN = 100 MHz 25°C −90 dBc
fIN = 170 MHz 25°C −90 dBc
TWO-TONE SFDR
fIN = 29 MHz (−7 dBFS ), 32 MHz (−7 dBFS ) 25°C 90 dBFS
fIN = 169 MHz (−7 dBFS ), 172 MHz (−7 dBFS ) 25°C 90 dBFS
ANALOG INPUT BANDWIDTH 25°C 650 MHz
1 See Application Note AN-835, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions.
AD9254
Rev. 0 | Page 5 of 40
DIGITAL SPECIFICATIONS AVDD = 1.8 V; DRVDD = 2.5 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, DCS enabled, unless otherwise noted.
Table 3. AD9254BCPZ-150
Parameter Temperature Min Typ Max Unit
DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−) Logic Compliance CMOS/LVDS/LVPECL Internal Common-Mode Bias Full 1.2 V Differential Input Voltage Full 0.2 6 V p-p Input Voltage Range Full AVDD − 0.3 AVDD + 1.6 V Input Common-Mode Range Full 1.1 AVDD V High Level Input Voltage (VIH) Full 1.2 3.6 V Low Level Input Voltage (VIL) Full 0 0.8 V High Level Input Current (IIH) Full −10 +10 μA Low Level Input Current (IIL) Full −10 +10 μA Input Resistance Full 8 10 12 kΩ Input Capacitance Full 4 pF
LOGIC INPUTS (SCLK/DFS, OEB, PWDN) High Level Input Voltage (VIH) Full 1.2 3.6 V Low Level Input Voltage (VIL) Full 0 0.8 V High Level Input Current (IIH) Full −50 −75 μA Low Level Input Current (IIL) Full −10 +10 μA Input Resistance Full 30 kΩ Input Capacitance Full 2 pF
LOGIC INPUTS (CSB) High Level Input Voltage (VIH) Full 1.2 3.6 V Low Level Input Voltage (VIL) Full 0 0.8 V High Level Input Current (IIH) Full −10 +10 μA Low Level Input Current (IIL) Full +40 +135 μA Input Resistance Full 26 kΩ Input Capacitance Full 2 pF
LOGIC INPUTS (SDIO/DCS) High Level Input Voltage (VIH) Full 1.2 DRVDD + 0.3 V Low Level Input Voltage (VIL) Full 0 0.8 V High Level Input Current (IIH) Full −10 +10 μA Low Level Input Current (IIL) Full +40 +130 μA Input Resistance Full 26 kΩ Input Capacitance Full 5 pF
DIGITAL OUTPUTS DRVDD = 3.3 V
High Level Output Voltage (VOH, IOH = 50 μA) Full 3.29 V High Level Output Voltage (VOH, IOH = 0.5 mA) Full 3.25 V Low Level Output Voltage (VOL, IOL = 1.6 mA) Full 0.2 V Low Level Output Voltage (VOL, IOL = 50 μA) Full 0.05 V
DRVDD = 1.8 V High Level Output Voltage (VOH, IOH = 50 μA) Full 1.79 V High Level Output Voltage (VOH, IOH = 0.5 mA) Full 1.75 V Low Level Output Voltage (VOL, IOL = 1.6 mA) Full 0.2 V Low Level Output Voltage (VOL, IOL = 50 μA) Full 0.05 V
AD9254
Rev. 0 | Page 6 of 40
SWITCHING SPECIFICATIONS AVDD = 1.8 V, DRVDD = 2.5 V, unless otherwise noted.
Table 4. AD9254BCPZ-150
Parameter1 Temperature Min Typ Max Unit
CLOCK INPUT PARAMETERS Conversion Rate, DCS Enabled Full 20 150 MSPS Conversion Rate, DCS Disabled Full 10 150 MSPS CLK Period Full 6.7 ns CLK Pulse Width High, DCS Enabled Full 2.0 3.3 4.7 ns CLK Pulse Width High, DCS Disabled Full 3.0 3.3 3.7 ns
DATA OUTPUT PARAMETERS Data Propagation Delay (tPD)2 Full 3.1 3.9 4.8 ns DCO Propagation Delay (tDCO) Full 4.4 ns Setup Time (tS) Full 1.9 2.9 ns Hold Time (tH) Full 3.0 3.8 ns Pipeline Delay (Latency) Full 12 Cycles Aperture Delay (tA) Full 0.8 ns Aperture Uncertainty (Jitter, tJ) Full 0.1 ps rms Wake-Up Time3 Full 350 μs
OUT-OF-RANGE RECOVERY TIME Full 3 Cycles SERIAL PORT INTERFACE4
SCLK Period (tCLK) Full 40 ns SCLK Pulse Width High Time (tHI) Full 16 ns SCLK Pulse Width Low Time (tLO) Full 16 ns SDIO to SCLK Setup Time (tDS) Full 5 ns SDIO to SCLK Hold Time (tDH) Full 2 ns CSB to SCLK Setup Time (tS) Full 5 ns CSB to SCLK Hold Time (tH) Full 2 ns
1 See Application Note AN-835, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions. 2 Output propagation delay is measured from CLK 50% transition to DATA 50% transition, with 5 pF load. 3 Wake-up time is dependent on the value of the decoupling capacitors, values shown with 0.1 μF capacitor across REFT and REFB. 4 See Figure 50 and the Serial Port Interface (SPI) section.
TIMING DIAGRAM
CLK+
DCO
DATA
N
N + 1 N + 2N + 3
N + 4
N + 5N + 6 N + 7
N + 8
N – 12 N – 11 N – 10 N – 9 N – 8 N – 7 N – 6 N – 5 N – 4N – 13
CLK–
tCLK
tPD
tS tH tDCO tCLK
tA
0621
6-00
2
Figure 2. Timing Diagram
AD9254
Rev. 0 | Page 7 of 40
ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Rating ELECTRICAL
AVDD to AGND −0.3 V to +2.0 V DRVDD to DGND −0.3 V to +3.9 V AGND to DGND −0.3 V to +0.3 V AVDD to DRVDD −3.9 V to +2.0 V D0 through D13 to DGND −0.3 V to DRVDD + 0.3 V DCO to DGND −0.3 V to DRVDD + 0.3 V OR to DGND −0.3 V to DRVDD + 0.3 V CLK+ to AGND −0.3 V to +3.9 V CLK− to AGND −0.3 V to +3.9 V VIN+ to AGND −0.3 V to AVDD + 0.2 V VIN− to AGND −0.3 V to AVDD + 0.2 V VREF to AGND −0.3 V to AVDD + 0.2 V SENSE to AGND −0.3 V to AVDD + 0.2 V REFT to AGND −0.3 V to AVDD + 0.2 V REFB to AGND −0.3 V to AVDD + 0.2 V SDIO/DCS to DGND −0.3 V to DRVDD + 0.3 V PDWN to AGND −0.3 V to +3.9 V CSB to AGND −0.3 V to +3.9 V SCLK/DFS to AGND −0.3 V to +3.9 V OEB to AGND −0.3 V to +3.9 V
ENVIRONMENTAL Storage Temperature Range –65°C to +125°C Operating Temperature Range –40°C to +85°C Lead Temperature (Soldering 10 Sec)
300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
THERMAL RESISTANCE The exposed paddle must be soldered to the ground plane for the LFCSP_VQ package. Soldering the exposed paddle to the customer board increases the reliability of the solder joints, maximizing the thermal capability of the package.
Table 6. Thermal Resistance Package Type θJA θJC Unit 48-lead LFCSP_VQ (CP-48-3) 26.4 2.4 °C/W
Typical θJA and θJC are specified for a 4-layer board in still air. Airflow increases heat dissipation, effectively reducing θJA. In addition, metal in direct contact with the package leads from metal traces and through holes, ground, and power planes, reduces the θJA.
ESD CAUTION
AD9254
Rev. 0 | Page 8 of 40
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
13 14 15 16 17 18 19 20 21 22 23 24
D12
D13
(MSB
)O
RD
RG
ND
DR
VDD
SDIO
/DC
SSC
LK/D
FSC
SBA
GN
DA
VDD
AG
ND
AVD
D
48 47 46 45 44 43 42 41 40 39 38 37
DR
VDD
DR
GN
DD
1D
0 (L
SB)
DC
OO
EBA
VDD
AG
ND
AVD
DC
LK–
CLK
+A
GN
D
123456789
101112
D2D3D4D5D6D7
DRGNDDRVDD
D8D9
D10D11
RBIASCMLAVDDAGNDVIN–VIN+AGNDREFTREFBVREFSENSE
35PDWN36
34333231302928272625
AD9254TOP VIEW
(Not to Scale)
PIN 1INDICATOR
0621
6-00
3
Figure 3. Pin Configuration
Table 7. Pin Function Description Pin No. Mnemonic Description 0, 21, 23, 29, 32, 37, 41
AGND Analog Ground. (Pin 0 is the exposed thermal pad on the bottom of the package.)
45, 46, 1 to 6, 9 to 14
D0 (LSB) to D13 (MSB) Data Output Bits.
7, 16, 47 DRGND Digital Output Ground. 8, 17, 48 DRVDD Digital Output Driver Supply (1.8 V to 3.3 V). 15 OR Out-of-Range Indicator. 18 SDIO/DCS Serial Port Interface (SPI) Data Input/Output (Serial Port Mode); Duty Cycle Stabilizer Select
(External Pin Mode). See Table 10. 19 SCLK/DFS Serial Port Interface Clock (Serial Port Mode); Data Format Select Pin (External Pin Mode). 20 CSB Serial Port Interface Chip Select (Active Low). See Table 10. 22, 24, 33, 40, 42 AVDD Analog Power Supply.
25 SENSE Reference Mode Selection. See Table 9. 26 VREF Voltage Reference Input/Output. 27 REFB Differential Reference (−). 28 REFT Differential Reference (+). 30 VIN+ Analog Input Pin (+). 31 VIN– Analog Input Pin (−). 34 CML Common-Mode Level Bias Output. 35 RBIAS External Bias Resistor Connection. A 10 kΩ resistor must be connected between this pin and
analog ground (AGND). 36 PDWN Power-Down Function Select. 38 CLK+ Clock Input (+). 39 CLK– Clock Input (−). 43 OEB Output Enable (Active Low). 44 DCO Data Clock Output.
AD9254
Rev. 0 | Page 9 of 40
EQUIVALENT CIRCUITS
VIN
0621
6-00
4
Figure 4. Equivalent Analog Input Circuit
1.2V10kΩ 10kΩ
CLK+ CLK–
AVDD
0621
6-00
5
Figure 5. Equivalent Clock Input Circuit
SDIO/DCS1kΩ
DRVDD
0621
6-00
6
Figure 6. Equivalent SDIO/DCS Input Circuit
DRVDD
DRGND
0621
6-00
7
Figure 7. Equivalent Digital Output Circuit
SCLK/DFSOEB
PDWN
1kΩ
30kΩ
0621
6-00
8
Figure 8. Equivalent SCLK/DFS, OEB, PDWN Input Circuit
CSB1kΩ26kΩ
AVDD
0621
6-00
9
Figure 9. Equivalent CSB Input Circuit
SENSE1kΩ
0621
6-01
0
Figure 10. Equivalent Sense Circuit
VREF
AVDD
6kΩ
0621
6-01
1
Figure 11. Equivalent VREF Circuit
AD9254
Rev. 0 | Page 10 of 40
TYPICAL PERFORMANCE CHARACTERISTICS AVDD = 1.8 V; DRVDD = 2.5 V; maximum sample rate, DCS enabled, 1 V internal reference; 2 V p-p differential input; AIN = −1.0 dBFS; 64k sample; TA = 25°C, unless otherwise noted.
0
–120
–100
–80
–60
–40
–20
0 18.75 37.50 56.25 75.00
AM
PLIT
UD
E (d
BFS
)
FREQUENCY (MHz)
150MSPS2.3MHz @ –1dBFSSNR = 72.0dBc (73.0dBFS)ENOB = 11.7 BITSSFDR = 90.0dBc
0621
6-01
2
Figure 12. AD9254 Single-Tone FFT with fIN = 2.3 MHz
0
–120
–100
–80
–60
–40
–20
0 18.75 37.50 56.25 75.00
AM
PLIT
UD
E (d
BFS
)
FREQUENCY (MHz)
150MSPS30.3MHz @ –1dBFSSNR = 71.9dBc (72.9dBFS)ENOB = 11.7 BITSSFDR = 88dBc
0621
6-01
3
Figure 13. AD9254 Single-Tone FFT with fIN = 30.3 MHz
0
–120
–100
–80
–60
–40
–20
0 18.75 37.50 56.25 75.00
AM
PLIT
UD
E (d
BFS
)
FREQUENCY (MHz)
150MSPS70.3MHz @ –1dBFSSNR = 71.8dBc (72.8dBFS)ENOB = 11.7 BITSSFDR = 84dBc
0621
6-01
4
Figure 14. AD9254 Single-Tone FFT with fIN = 70.3 MHz
0
–120
–100
–80
–60
–40
–20
0 18.75 37.50 56.25 75.00
AM
PLIT
UD
E (d
BFS
)
FREQUENCY (MHz)
150MSPS100.3MHz @ –1dBFSSNR = 71.6dBc (72.6dBFS)ENOB = 11.6 BITSSFDR = 83dBc
0621
6-01
5
Figure 15. AD9254 Single-Tone FFT with fIN = 100.3 MHz
0
–120
–100
–80
–60
–40
–20
0 18.75 37.50 56.25 75.00
AM
PLIT
UD
E (d
BFS
)
FREQUENCY (MHz)
150MSPS140.3MHz @ –1dBFSSNR = 71.5dBc (72.5dBFS)ENOB = 11.5 BITSSFDR = 81dBc
0621
6-01
6
Figure 16. AD9254 Single-Tone FFT with fIN = 140.3 MHz
0
–120
–100
–80
–60
–40
–20
0 18.75 37.50 56.25 75.00
AM
PLIT
UD
E (d
BFS
)
FREQUENCY (MHz)
150MSPS170.3MHz @ –1dBFSSNR = 70.8dBc (71.8dBFS)ENOB = 11.5 BITSSFDR = 80dBc
0621
6-01
7
Figure 17. AD9254 Single-Tone FFT with fIN = 170.3 MHz
AD9254
Rev. 0 | Page 11 of 40
0
–120
–100
–80
–60
–40
–20
0 18.75 37.50 56.25 75.00
AM
PLIT
UD
E (d
BFS
)
FREQUENCY (MHz)
150MSPS250.3MHz @ –1dBFSSNR = 69.3dBc (70.3dBFS)ENOB = 11.3 BITSSFDR = 79dBc
0621
6-01
8
Figure 18. AD9254 Single-Tone FFT with fIN = 250.3 MHz
0
–120
–100
–80
–60
–40
–20
0 18.75 37.50 56.25 75.00
AM
PLIT
UD
E (d
BFS
)
FREQUENCY (MHz)
150MSPSfIN1 = 29.1MHz @ –7dBFSfIN2 = 32.1MHz @ –7dBFSSFDR = 83.2dBc (90.2dBFS)WoIMD3 = –83.9dBc (–90.9dBFS)
0621
6-01
9
Figure 19. AD9254 Two-Tone FFT with fIN1 = 29.1 MHz, fIN2 = 32.1 MHz
90
85
80
75
70
65
600 435030025020015010050
SNR
/SFD
R (d
Bc)
INPUT FREQUENCY (MHz)00
SNR +25°C
SNR –40°C
SNR +85°C
SFDR +25°C
SFDR –40°C
SFDR +85°C
0621
6-02
0
Figure 20. AD9254 Single-Tone SNR/SFDR vs. Input Frequency (fIN) and
Temperature with 2 V p-p Full Scale
120
100
80
60
40
20
0–90 0–20 –10–30–40–50–60–70–80
SNR
/SFD
R (d
Bc
and
dBFS
)
INPUT AMPLITUDE (dBFS)
SNR (dBc)
85dBcREFERENCE LINE
SFDR (dBFS)
SFDR (dBc)
SNR (dBFS)
0621
6-02
1
Figure 21. AD9254 Single-Tone SNR/SFDR vs. Input Amplitude (AIN)
with fIN = 2.4 MHz
0
–20
–40
–60
–80
–100
–120–90 –78 –66 –54 –42 –30 –18 –6
SFD
R/W
OR
ST IM
D3
(dB
c an
d dB
FS)
INPUT AMPLITUDE (dBFS)
SFDR (–dBc)
SFDR (–dBFS)
WORST IMD3 (dBc)
WORST IMD3 (dBFS)
0621
6-02
2
Figure 22. AD9254 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN)
with fIN1 = 29.1 MHz, fIN2 = 32.1 MHz
90
85
80
75
70
65
600 435030025020015010050
SNR
/SFD
R (d
Bc)
INPUT FREQUENCY (MHz)00
SNR +25°C SNR –40°C
SNR +85°C
SFDR +25°CSFDR –40°C
SFDR +85°C
0621
6-02
3
Figure 23. AD9254 Single-Tone SNR/SFDR vs. Input Frequency (fIN) and
Temperature with 1 V p-p Full Scale
AD9254
Rev. 0 | Page 12 of 40
0
–120
–100
–80
–60
–40
–20
0 18.75 37.50 56.25 75.00
AM
PLIT
UD
E (d
BFS
)
FREQUENCY (MHz)
150MSPSfIN1 = 169.1MHz @ –7dBFSfIN2 = 172.1MHz @ –7dBFSSFDR = 83dBc (90dBFS)WoIMD3 = –83dBc (90dBFS)
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Figure 24. AD9254 Two-Tone FFT with fIN1 = 169.1 MHz, fIN2 = 172.1 MHz
95
90
85
80
75
70
6510 1501401301201101009080706050403020
SNR
/SFD
R (d
Bc)
CLOCK FREQUENCY (MSPS)
SFDR
SNR
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Figure 25. AD9254 Single-Tone SNR/SFDR vs. Clock Frequency (fCLK)
with fIN = 2.4 MHz
0
–20
–40
–60
–80
–100
–120–90 –78 –66 –54 –42 –30 –18 –6
SFD
R/W
OR
ST IM
D3
(dB
c an
d dB
FS)
INPUT AMPLITUDE (dBFS)
SFDR (–dBc)
SFDR (–dBFS)
WORST IMD3 (dBc)
WORST IMD3 (dBFS)
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Figure 26. AD9254 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN)
with fIN1 = 169.1 MHz, fIN2 = 172.11 MHz
2.0
–1.5
–1.0
–0.5
0
0.5
1.0
1.5
–2.00 163841433612288102408192614440962048
INL
ERR
OR
(LSB
)
OUTPUT CODE
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Figure 27. AD9254 INL with fIN = 10.3 MHz
12000
10000
8000
6000
4000
2000
0
NU
MB
ER O
F H
ITS
CODE
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N – 5 N – 4 N – 3 N – 2 N – 1 N N + 1 N + 2 N + 3 N + 4 N + 5
32768 SAMPLES1.25 LSB rms
Figure 28. AD9254 Grounded Input Histogram
0
–0.5
–1.0
–1.5
–2.0
–40 –20 0 20 40 60 80–2.5
ERR
OR
(%FS
)
TEMPERATURE (°C)
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GAIN ERROR
OFFSET ERROR
Figure 29. AD9254 Gain and Offset vs. Temperature
AD9254
Rev. 0 | Page 13 of 40
0.5
0.4
0.3
0.2
0.1
0
–0.1
–0.2
–0.3
–0.4
–0.50 163841433612288102408192614440962048
DN
L ER
RO
R (L
SB)
OTUPUT CODE
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Figure 30. AD9254 DNL with fIN = 10.3 MHz
AD9254
Rev. 0 | Page 14 of 40
THEORY OF OPERATION The AD9254 architecture consists of a front-end sample-and-hold amplifier (SHA) followed by a pipelined switched capacitor ADC. The quantized outputs from each stage are combined into a final 14-bit result in the digital correction logic. The pipeline architecture permits the first stage to operate on a new input sample, while the remaining stages operate on preceding samples. Sampling occurs on the rising edge of the clock.
Each stage of the pipeline, excluding the last, consists of a low resolution flash ADC connected to a switched capacitor DAC and interstage residue amplifier (MDAC). The residue amplifier magnifies the difference between the reconstructed DAC output and the flash input for the next stage in the pipeline. One bit of redundancy is used in each stage to facilitate digital correction of flash errors. The last stage consists only of a flash ADC.
The input stage contains a differential SHA that can be ac- or dc-coupled in differential or single-ended modes. The output staging block aligns the data, carries out the error correction, and passes the data to the output buffers. The output buffers are powered from a separate supply, allowing adjustment of the output voltage swing. During power-down, the output buffers go into a high impedance state.
ANALOG INPUT CONSIDERATIONS The analog input to the AD9254 is a differential switched capacitor SHA that has been designed for optimum performance while processing a differential input signal.
The clock signal alternately switches the SHA between sample mode and hold mode (see Figure 31). When the SHA is switched into sample mode, the signal source must be capable of charging the sample capacitors and settling within one-half of a clock cycle. A small resistor in series with each input can help reduce the peak transient current required from the output stage of the driving source.
A shunt capacitor can be placed across the inputs to provide dynamic charging currents. This passive network creates a low-pass filter at the ADC input; therefore, the precise values are dependent upon the application.
In IF undersampling applications, any shunt capacitors should be reduced. In combination with the driving source impedance, these capacitors would limit the input bandwidth. For more information, see Application Note AN-742, Frequency Domain Response of Switched-Capacitor ADCs; Application Note AN-827, A Resonant Approach to Interfacing Amplifiers to Switched-Capacitor ADCs; and the Analog Dialogue article, “Transformer-Coupled Front-End for Wideband A/D Converters.”
VIN+
VIN–
CPIN, PAR
CPIN, PAR
CS
CS
CH
CH
H
S
S
S
S
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Figure 31. Switched-Capacitor SHA Input
For best dynamic performance, the source impedances driving VIN+ and VIN− should match such that common-mode settling errors are symmetrical. These errors are reduced by the common-mode rejection of the ADC.
An internal differential reference buffer creates two reference voltages used to define the input span of the ADC core. The span of the ADC core is set by the buffer to be 2 × VREF. The reference voltages are not available to the user. Two bypass points, REFT and REFB, are brought out for decoupling to reduce the noise contributed by the internal reference buffer. It is recom-mended that REFT be decoupled to REFB by a 0.1 μF capacitor, as described in the Layout Considerations section.
Input Common Mode
The analog inputs of the AD9254 are not internally dc-biased. In ac-coupled applications, the user must provide this bias externally. Setting the device such that VCM = 0.55 × AVDD is recommended for optimum performance; however, the device functions over a wider range with reasonable performance (see Figure 30). An on-board common-mode voltage reference is included in the design and is available from the CML pin. Optimum performance is achieved when the common-mode voltage of the analog input is set by the CML pin voltage (typically 0.55 × AVDD). The CML pin must be decoupled to ground by a 0.1 μF capacitor, as described in the Layout Considerations section.
AD9254
Rev. 0 | Page 15 of 40
DIFFERENTIAL INPUT CONFIGURATIONS Optimum performance is achieved by driving the AD9254 in a differential input configuration. For baseband applications, the AD8138 differential driver provides excellent performance and a flexible interface to the ADC. The output common-mode voltage of the AD8138 is easily set with the CML pin of the AD9254 (see Figure 32), and the driver can be configured in a Sallen-Key filter topology to provide band limiting of the input signal.
AVDD
1V p-p 49.9Ω
523Ω0.1µF
R
R
C
499Ω
499Ω
499Ω
AD8138 AD9254
VIN+
VIN– CML
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Figure 32. Differential Input Configuration Using the AD8138
For baseband applications where SNR is a key parameter, differential transformer coupling is the recommended input configuration (see Figure 33). The CML voltage can be connected to the center tap of the secondary winding of the transformer to bias the analog input.
The signal characteristics must be considered when selecting a transformer. Most RF transformers saturate at frequencies below a few megahertz, and excessive signal power can cause core saturation, which leads to distortion.
2V p-p 49.9Ω
0.1µF
R
R
C AD9254
VIN+
VIN– CML
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Figure 33. Differential Transformer-Coupled Configuration
At input frequencies in the second Nyquist zone and above, the noise performance of most amplifiers is not adequate to achieve the true SNR performance of the AD9254. For applications where SNR is a key parameter, transformer coupling is the recommended input. For applications where SFDR is a key parameter, differential double balun coupling is the recom-mended input configuration (see Figure 35).
As an alternative to using a transformer-coupled input at frequencies in the second Nyquist zone, the AD8352 differential driver can be used (see Figure 36).
In any configuration, the value of the shunt capacitor, C, is dependent on the input frequency and source impedance and may need to be reduced or removed. Table 8 displays recom-mended values to set the RC network. However, these values are dependent on the input signal and should only be used as a starting guide.
Table 8. RC Network Recommended Values Frequency Range (MHz) R Series (Ω) C Differential (pF) 0 to 70 33 15 70 to 200 33 5 200 to 300 15 5 >300 15 Open
Single-Ended Input Configuration
Although not recommended, it is possible to operate the AD9254 in a single-ended input configuration, as long as the input voltage swing is within the AVDD supply. Single-ended operation can provide adequate performance in cost-sensitive applications.
In this configuration, SFDR and distortion performance degrade due to the large input common-mode swing. If the source impedances on each input are matched, there should be little effect on SNR performance. Figure 34 details a typical single-ended input configuration.
1V p-p
R
R
C
49.9Ω 0.1µF
10µF
10µF 0.1µF
AVDD
1kΩ
1kΩ
1kΩ
1kΩ
AD9254
AVDD
VIN+
VIN–
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Figure 34. Single-Ended Input Configuration
AD9254
Rev. 0 | Page 16 of 40
AD9254
R0.1µF0.1µF2V p-p VIN+
VIN– CML
C
R0.1µF
S0.1µF25Ω
25Ω
SPA P
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9
Figure 35. Differential Double Balun Input Configuration
AD9254AD8352
0Ω
R
0Ω
CDRD RG
0.1µF
0.1µF
0.1µF
VIN+
VIN– CML
C
0.1µF
0.1µF
1612
345
11
R0.1µF
0.1µF
10
8, 13
14
VCC
200Ω
200Ω
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Figure 36. Differential Input Configuration Using the AD8352
Table 9. Reference Configuration Summary
Selected Mode SENSE Voltage Resulting VREF (V) Resulting Differential Span (V p-p)
External Reference AVDD N/A 2 × external reference Internal Fixed Reference VREF 0.5 1.0 Programmable Reference 0.2 V to VREF
⎟⎠⎞
⎜⎝⎛ +×
1215.0
RR
(see Figure 38) 2 × VREF
Internal Fixed Reference AGND to 0.2 V 1.0 2.0
VOLTAGE REFERENCE A stable and accurate voltage reference is built into the AD9254. The input range is adjustable by varying the reference voltage applied to the AD9254, using either the internal reference or an externally applied reference voltage. The input span of the ADC tracks reference voltage changes linearly. The various reference modes are summarized in the following sections. The Reference Decoupling section describes the best practices and require-ments for PCB layout of the reference.
Internal Reference Connection
A comparator within the AD9254 detects the potential at the SENSE pin and configures the reference into four possible states, as summarized in Table 9. If SENSE is grounded, the reference amplifier switch is connected to the internal resistor divider (see Figure 37), setting VREF to 1 V.
Connecting the SENSE pin to VREF switches the reference amplifier input to the SENSE pin, completing the loop and providing a 0.5 V reference output. If a resistor divider is connected external to the chip, as shown in Figure 38, the switch sets to the SENSE pin. This puts the reference amplifier in a noninverting mode with the VREF output defined as
⎟⎠⎞
⎜⎝⎛ +=
R1R2
VREF 15.0
If the SENSE pin is connected to AVDD, the reference amplifier is disabled, and an external reference voltage can be applied to the VREF pin (see the External Reference Operation section).
The input range of the ADC always equals twice the voltage at the reference pin for either an internal or an external reference.
AD9254
Rev. 0 | Page 17 of 40
VREF
SENSE
0.5V
AD9254
REFT
REFB
SELECTLOGIC
0.1µF
0.1µF0.1µF
VIN–
VIN+ ADCCORE
––
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Figure 37. Internal Reference Configuration
VREF
SENSE
0.5V
AD9254
VIN–
VIN+
REFT
REFB
SELECTLOGIC
0.1µF0.1µF R2
R1
0.1µF
ADCCORE
––
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Figure 38. Programmable Reference Configuration
If the internal reference of the AD9254 is used to drive multiple converters to improve gain matching, the loading of the reference by the other converters must be considered. Figure 39 depicts how the internal reference voltage is affected by loading.
0
–1.250 2.0
LOAD CURRENT (mA)
REF
EREN
CE
VOLT
AG
E ER
RO
R (%
)
–0.25
–0.50
–0.75
–1.00
0.5 1.0 1.5
VREF = 0.5V
VREF = 1V
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Figure 39. VREF Accuracy vs. Load
External Reference Operation
The use of an external reference may be necessary to enhance the gain accuracy of the ADC or improve thermal drift characteristics. Figure 40 shows the typical drift characteristics of the internal reference in both 1 V and 0.5 V modes.
–40 –20
10
0
TEMPERATURE (°C)
REF
EREN
CE
VOLT
AG
E ER
RO
R (m
V)
8
6
4
2
800 20 40 60
VREF = 1V
VREF = 0.5V
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Figure 40. Typical VREF Drift
When the SENSE pin is tied to AVDD, the internal reference is disabled, allowing the use of an external reference. An internal resistor divider loads the external reference with an equivalent 6 kΩ load (see Figure 11). In addition, an internal buffer generates the positive and negative full-scale references for the ADC core. Therefore, the external reference must be limited to a maximum of 1 V.
CLOCK INPUT CONSIDERATIONS For optimum performance, the AD9254 sample clock inputs (CLK+ and CLK−) should be clocked with a differential signal. The signal is typically ac-coupled into the CLK+ pin and the CLK− pin via a transformer or capacitors. These pins are biased internally (see Figure 5) and require no external bias.
Clock Input Options
The AD9254 has a very flexible clock input structure. The clock input can be a CMOS, LVDS, LVPECL, or sine wave signal. Regardless of the type of signal used, the jitter of the clock source is of the most concern, as described in the Jitter Considerations section.
Figure 41 shows one preferred method for clocking the AD9254. A low jitter clock source is converted from single-ended to a differential signal using an RF transformer. The back-to-back Schottky diodes across the transformer secondary limit clock excursions into the AD9254 to approximately 0.8 V p-p differential. This helps prevent the large voltage swings of the clock from feeding through to other portions of the AD9254, while preserving the fast rise and fall times of the signal, which are critical to a low jitter performance.
AD9254
Rev. 0 | Page 18 of 40
0.1µF
0.1µF
0.1µF0.1µF
SCHOTTKYDIODES:HMS2812
CLOCKINPUT
50Ω 100Ω
CLK–
CLK+ADC
AD9254
MINI-CIRCUITSADT1–1WT, 1:1Z
XFMR
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Figure 41. Transformer Coupled Differential Clock
If a low jitter clock source is not available, another option is to ac-couple a differential PECL signal to the sample clock input pins as shown in Figure 42. The AD9510/AD9511/AD9512/ AD9513/AD9514/AD9515 family of clock drivers offers excellent jitter performance.
100Ω0.1µF
0.1µF0.1µF
0.1µF
240Ω240Ω
AD951xPECL DRIVER
50Ω1 50Ω1CLK
CLK
150Ω RESISTORS ARE OPTIONAL.
CLK–
CLK+
ADCAD9254
CLOCKINPUT
CLOCKINPUT
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Figure 42. Differential PECL Sample Clock
A third option is to ac-couple a differential LVDS signal to the sample clock input pins, as shown in Figure 43. The AD9510/ AD9511/AD9512/AD9513/AD9514/AD9515 family of clock drivers offers excellent jitter performance.
100Ω0.1µF
0.1µF0.1µF
0.1µF
50Ω1
AD951xLVDS DRIVER
50Ω1CLK
CLK
150Ω RESISTORS ARE OPTIONAL.
CLK–
CLK+
CLOCKINPUT
CLOCKINPUT
ADCAD9254
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Figure 43. Differential LVDS Sample Clock
In some applications, it is acceptable to drive the sample clock inputs with a single-ended CMOS signal. In such applications, directly drive CLK+ from a CMOS gate, while bypassing the CLK− pin to ground using a 0.1 μF capacitor in parallel with a 39 kΩ resistor (see Figure 44). CLK+ can be directly driven from a CMOS gate. This input is designed to withstand input voltages up to 3.6 V, making the selection of the drive logic voltage very flexible. When driving CLK+ with a 1.8 V CMOS signal, biasing the CLK− pin with a 0.1 μF capacitor in parallel with a 39 kΩ resistor (see Figure 44) is required. The 39 kΩ resistor is not required when driving CLK+ with a 3.3 V CMOS signal (see Figure 45).
OPTIONAL100Ω 0.1µF
0.1µF
0.1µF
39kΩ
AD951xCMOS DRIVER
50Ω1
150Ω RESISTOR IS OPTIONAL.
CLK–
CLK+
ADCAD9254
VCC
1kΩ
1kΩ
CLOCKINPUT
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Figure 44. Single-Ended 1.8 V CMOS Sample Clock
150Ω RESISTOR IS OPTIONAL.
OPTIONAL100Ω 0.1µF
0.1µF
0.1µF
VCC
AD951xCMOS DRIVER
50Ω1
CLK–
CLK+
ADCAD9254
1kΩ
1kΩ
CLOCKINPUT
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Figure 45. Single-Ended 3.3 V CMOS Sample Clock
Clock Duty Cycle
Typical high speed ADCs use both clock edges to generate a variety of internal timing signals. As a result, these ADCs may be sensitive to clock duty cycle. Commonly, a ±5% tolerance is required on the clock duty cycle to maintain dynamic performance characteristics.
The AD9254 contains a duty cycle stabilizer (DCS) that retimes the nonsampling, or falling edge, providing an internal clock signal with a nominal 50% duty cycle. This allows a wide range of clock input duty cycles without affecting the performance of the AD9254. Noise and distortion performance are nearly flat for a wide range of duty cycles when the DCS is on, as shown in Figure 28.
Jitter in the rising edge of the input is still of paramount concern and is not reduced by the internal stabilization circuit. The duty cycle control loop does not function for clock rates less than 20 MHz nominally. The loop has a time constant associated with it that needs to be considered in applications where the clock rate can change dynamically. This requires a wait time of 1.5 μs to 5 μs after a dynamic clock frequency increase (or decrease) before the DCS loop is relocked to the input signal. During the time period the loop is not locked, the DCS loop is bypassed, and the internal device timing is dependent on the duty cycle of the input clock signal. In such an application, it may be appropriate to disable the duty cycle stabilizer. In all other applications, enabling the DCS circuit is recommended to maximize ac performance.
AD9254
Rev. 0 | Page 19 of 40
The DCS can be enabled or disabled by setting the SDIO/DCS pin when operating in the external pin mode (see Table 10), or via the SPI, as described in Table 13.
Table 10. Mode Selection (External Pin Mode) Voltage at Pin SCLK/DFS SDIO/DCS AGND Binary (default) DCS disabled AVDD Twos complement DCS enabled
(default)
JITTER CONSIDERATIONS High speed, high resolution ADCs are sensitive to the quality of the clock input. The degradation in SNR at a given input frequency (fIN) due to jitter (tJ) is calculated as follows:
SNR = −20 log (2π × fIN × tJ)
In the equation, the rms aperture jitter represents the root mean square of all jitter sources, which include the clock input, analog input signal, and ADC aperture jitter specification. IF under-sampling applications are particularly sensitive to jitter, as shown in Figure 46.
75
70
65
60
55
50
45
401 10 100 1000
SNR
(dB
c)
INPUT FREQUENCY (MHz)
3.00ps
0.05ps
MEASUREDPERFORMANCE
0.20ps
0.5ps
1.0ps
1.50ps
2.00ps2.50ps
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Figure 46. SNR vs. Input Frequency and Jitter
Treat the clock input as an analog signal in cases where aperture jitter can affect the dynamic range of the AD9254. Power supplies for clock drivers should be separated from the ADC output driver supplies to avoid modulating the clock signal with digital noise. The power supplies should also not be shared with analog input circuits, such as buffers, to avoid the clock modulating onto the input signal or vice versa. Low jitter, crystal-controlled oscil-lators make the best clock sources. If the clock is generated from another type of source (by gating, dividing, or other methods), it should be retimed by the original clock at the last step.
Refer to Application Notes AN-501, Aperture Uncertainty and ADC System Performance; and AN-756, Sampled Systems and the Effects of Clock Phase Noise and Jitter, for more in-depth information about jitter performance as it relates to ADCs.
POWER DISSIPATION AND STANDBY MODE The power dissipated by the AD9254 is proportional to its sample rate (see Figure 47). The digital power dissipation is determined primarily by the strength of the digital drivers and the load on each output bit. Maximum DRVDD current (IDRVDD) can be calculated as
Nf
CVI CLKLOADDRVDDDRVDD ×××=
2
where N is the number of output bits, 14 in the AD9254.
This maximum current occurs when every output bit switches on every clock cycle, that is, a full-scale square wave at the Nyquist frequency, fCLK/2. In practice, the DRVDD current is established by the average number of output bits switching, which is determined by the sample rate and the characteristics of the analog input signal. Reducing the capacitive load presented to the output drivers can minimize digital power consumption. The data in Figure 47 was taken under the same operating conditions as the data for the Typical Performance Characteristics section, with a 5 pF load on each output driver.
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500
480
460
440
420
400
380
360
340
320
300
300
250
200
150
100
50
00 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
POW
ER (m
W)
CU
RR
ENT
(mA
)
CLOCK FREQUENCY (MHz)
POWER
I (AVDD)
I (DRVDD)
Figure 47. AD9254 Power and Current vs. Clock Frequency fIN = 30 MHz
Power-Down Mode By asserting the PDWN pin high, the AD9254 is placed in power-down mode. In this state, the ADC typically dissipates 1.8 mW. During power-down, the output drivers are placed in a high impedance state. Reasserting the PDWN pin low returns the AD9254 to its normal operational mode. This pin is both 1.8 V and 3.3 V tolerant.
Low power dissipation in power-down mode is achieved by shutting down the reference, reference buffer, biasing networks, and clock. The decoupling capacitors on REFT and REFB are discharged when entering power-down mode and then must be recharged when returning to normal operation. As a result, the wake-up time is related to the time spent in power-down mode; and shorter power-down cycles result in proportionally shorter wake-up times. With the recommended 0.1 μF decoupling capaci-tors on REFT and REFB, it takes approximately 0.25 ms to fully discharge the reference buffer decoupling capacitors and 0.35 ms to restore full operation.
AD9254
Rev. 0 | Page 20 of 40
Standby Mode
When using the SPI port interface, the user can place the ADC in power-down or standby modes. Standby mode allows the user to keep the internal reference circuitry powered when faster wake-up times are required (see the Memory Map section).
DIGITAL OUTPUTS The AD9254 output drivers can be configured to interface with 1.8 V to 3.3 V logic families by matching DRVDD to the digital supply of the interfaced logic. The output drivers are sized to provide sufficient output current to drive a wide variety of logic families. However, large drive currents tend to cause current glitches on the supplies that may affect converter performance. Applications requiring the ADC to drive large capacitive loads or large fan-outs may require external buffers or latches.
The output data format can be selected for either offset binary or twos complement by setting the SCLK/DFS pin when operat-ing in the external pin mode (see Table 10). As detailed in the Interfacing to High Speed ADCs via SPI user manual, the data format can be selected for either offset binary, twos complement, or Gray code when using the SPI control.
Out-of-Range (OR) Condition
An out-of-range condition exists when the analog input voltage is beyond the input range of the ADC. OR is a digital output that is updated along with the data output corresponding to the particular sampled input voltage. Thus, OR has the same pipeline latency as the digital data.
100
001
OR DATA OUTPUTSOR
+FS – 1 LSB
+FS – 1/2 LSB+FS–FS
–FS + 1/2 LSB
–FS – 1/2 LSB
111111111111
111111111111
111111111110
000000000000
111111
000000
000000000000
000100000000
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Figure 48. OR Relation to Input Voltage and Output Data
OR is low when the analog input voltage is within the analog input range and high when the analog input voltage exceeds the input range, as shown in Figure 48. OR remains high until the analog input returns to within the input range and another conversion is completed.
By logically AND’ing the OR bit with the MSB and its complement, overrange high or underrange low conditions can be detected. Table 11 is a truth table for the overrange/underrange circuit in Figure 49, which uses NAND gates.
MSB
OR
MSB
OVER = 1
UNDER = 1
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Figure 49. Overrange/Underrange Logic
Table 11. Overrange/Underrange Truth Table OR MSB Analog Input Is: 0 0 Within range 0 1 Within range 1 0 Underrange 1 1 Overrange
Digital Output Enable Function (OEB)
The AD9254 has three-state ability. If the OEB pin is low, the output data drivers are enabled. If the OEB pin is high, the output data drivers are placed in a high impedance state. This is not intended for rapid access to the data bus. Note that OEB is referenced to the digital supplies (DRVDD) and should not exceed that supply voltage.
TIMING The lowest typical conversion rate of the AD9254 is 10 MSPS. At clock rates below 10 MSPS, dynamic performance can degrade.
The AD9254 provides latched data outputs with a pipeline delay of twelve clock cycles. Data outputs are available one propaga-tion delay (tPD) after the rising edge of the clock signal.
The length of the output data lines and the loads placed on them should be minimized to reduce transients within the AD9254. These transients can degrade the dynamic performance of the converter.
Data Clock Output (DCO)
The AD9254 also provides data clock output (DCO) intended for capturing the data in an external register. The data outputs are valid on the rising edge of DCO, unless the DCO clock polarity has been changed via the SPI. See Figure 2 for a graphical timing description.
Table 12. Output Data Format
Input (V) Condition (V) Binary Output Mode Twos Complement Mode Gray Code Mode (SPI Accessible) OR
VIN+ – VIN– < –VREF – 0.5 LSB 00 0000 0000 0000 10 0000 0000 0000 11 0000 0000 0000 1 VIN+ – VIN– = –VREF 00 0000 0000 0000 10 0000 0000 0000 11 0000 0000 0000 0 VIN+ – VIN– = 0 10 0000 0000 0000 00 0000 0000 0000 00 0000 0000 0000 0 VIN+ – VIN– = +VREF – 1.0 LSB 11 1111 1111 1111 01 1111 1111 1111 10 0000 0000 0000 0 VIN+ – VIN– > +VREF – 0.5 LSB 11 1111 1111 1111 01 1111 1111 1111 10 0000 0000 0000 1
AD9254
Rev. 0 | Page 21 of 40
SERIAL PORT INTERFACE (SPI) The AD9254 serial port interface (SPI) allows the user to configure the converter for specific functions or operations through a structured register space provided inside the ADC. This provides the user added flexibility and customization depending on the application. Addresses are accessed via the serial port and may be written to or read from via the port. Memory is organized into bytes that are further divided into fields, as documented in the Memory Map section. For detailed operational information, see the Interfacing to High Speed ADCs via SPI user manual.
CONFIGURATION USING THE SPI As summarized in Table 13, three pins define the SPI of this ADC. The SCLK/DFS pin synchronizes the read and write data presented to the ADC. The SDIO/DCS dual-purpose pin allows data to be sent to and read from the internal ADC memory map registers. The CSB pin is an active low control that enables or disables the read and write cycles.
Table 13. Serial Port Interface Pins Pin Name Function SCLK/DFS SCLK (serial clock) is the serial shift clock in. SCLK
synchronizes serial interface reads and writes. SDIO/DCS SDIO (serial data input/output) is a dual-purpose
pin. The typical role for this pin is an input and output, depending on the instruction being sent and the relative position in the timing frame.
CSB CSB (chip select bar) is an active-low control that gates the read and write cycles.
The falling edge of the CSB in conjunction with the rising edge of the SCLK determines the start of the framing. Figure 50 and Table 14 provide examples of the serial timing and its definitions.
Other modes involving the CSB are available. The CSB can be held low indefinitely to permanently enable the device (this is called streaming). The CSB can stall high between bytes to allow for additional external timing. When CSB is tied high, SPI functions are placed in a high impedance mode. This mode turns on any SPI pin secondary functions.
During an instruction phase, a 16-bit instruction is transmitted. Data follows the instruction phase and the length is determined by the W0 bit and the W1 bit. All data is composed of 8-bit words. The first bit of each individual byte of serial data indicates whether a read or write command is issued. This allows the serial data input/output (SDIO) pin to change direction from an input to an output.
In addition to word length, the instruction phase determines if the serial frame is a read or write operation, allowing the serial port to be used to both program the chip as well as read the contents of the on-chip memory. If the instruction is a readback operation, performing a readback causes the serial data input/output (SDIO) pin to change direction from an input to an output at the appropriate point in the serial frame.
Data can be sent in MSB- or in LSB-first mode. MSB first is the default on power-up and can be changed via the configuration register. For more information, see the Interfacing to High Speed ADCs via SPI user manual.
Table 14. SPI Timing Diagram Specifications Name Description tDS Setup time between data and rising edge of SCLK tDH Hold time between data and rising edge of SCLK tCLK Period of the clock tS Setup time between CSB and SCLK tH Hold time between CSB and SCLK tHI Minimum period that SCLK should be in a logic
high state tLO Minimum period that SCLK should be in a logic
low state
HARDWARE INTERFACE The pins described in Table 13 comprise the physical interface between the user’s programming device and the serial port of the AD9254. The SCLK and CSB pins function as inputs when using the SPI interface. The SDIO pin is bidirectional, functioning as an input during write phases and as an output during readback.
The SPI interface is flexible enough to be controlled by either PROM or PIC microcontrollers. This provides the user with the ability to use an alternate method to program the ADC. One method is described in detail in Application Note AN-812, Microcontroller-Based Serial Port Interface Boot Circuit.
When the SPI interface is not used, some pins serve a dual function. When strapped to AVDD or ground during device power on, the pins are associated with a specific function.
CONFIGURATION WITHOUT THE SPI In applications that do not interface to the SPI control registers, the SDIO/DCS and SCLK/DFS pins serve as stand-alone CMOS-compatible control pins. When the device is powered up, it is assumed that the user intends to use the pins as static control lines for the output data format and duty cycle stabilizer (see Table 10). In this mode, the CSB chip select should be connected to AVDD, which disables the serial port interface. For more information, see the Interfacing to High Speed ADCs via SPI user manual.
AD9254
Rev. 0 | Page 22 of 40
MEMORY MAP READING THE MEMORY MAP REGISTER TABLE Each row in the memory map register table has eight address locations. The memory map is roughly divided into three sections: the chip configuration registers map (Address 0x00 to Address 0x02), the device index and transfer registers map (Address 0xFF), and the ADC functions map (Address 0x08 to Address 0x18).
Table 15 displays the register address number in hexadecimal in the first column. The last column displays the default value for each hexadecimal address. The Bit 7 (MSB) column is the start of the default hexadecimal value given. For example, Hexadecimal Address 0x14, output_phase, has a hexadecimal default value of 0x00. This means Bit 3 = 0, Bit 2 = 0, Bit 1 = 1, and Bit 0 = 1 or 0011 in binary. This setting is the default output clock or DCO phase adjust option. The default value adjusts the DCO phase 90° relative to the nominal DCO edge and 180° relative to the data edge. For more information on this function, consult the Interfacing to High Speed ADCs via SPI user manual.
Open Locations
Locations marked as open are currently not supported for this device. When required, these locations should be written with 0s. Writing to these locations is required only when part of an address location is open (for example, Address 0x14). If the entire address location is open (Address 0x13), then the address location does not need to be written.
Default Values
Coming out of reset, critical registers are loaded with default values. The default values for the registers are shown in Table 15.
Logic Levels
An explanation of two registers follows:
• “Bit is set” is synonymous with “Bit is set to Logic 1” or “Writing Logic 1 for the bit.”
• “Clear a bit” is synonymous with “Bit is set to Logic 0” or “Writing Logic 0 for the bit.”
SPI-Accessible Features
A list of features accessible via the SPI and a brief description of what the user can do with these features follows. These features are described in detail in the Interfacing to High Speed ADCs via SPI user manual.
• Modes: Set either power-down or standby mode.
• Clock: Access the DCS via the SPI.
• Offset: Digitally adjust the converter offset.
• Test I/O: Set test modes to have known data on output bits.
• Output Mode: Setup outputs, vary the strength of the output drivers.
• Output Phase: Set the output clock polarity.
• VREF: Set the reference voltage.
DON’T CARE
DON’T CAREDON’T CARE
DON’T CARE
SDIO
SCLK
CSB
tS tDH
tHI tCLK
tLO
tDS tH
R/W W1 W0 A12 A11 A10 A9 A8 A7 D5 D4 D3 D2 D1 D0
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4
Figure 50. Serial Port Interface Timing Diagram
AD9254
Rev. 0 | Page 23 of 40
MEMORY MAP REGISTER TABLE Table 15. Memory Map Register
Addr. (Hex) Parameter Name
Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1
Bit 0 (LSB)
Default Value (Hex)
Default Notes/ Comments
Chip Configuration Registers
00 chip_port_config 0 LSB first 0 = Off (Default) 1 = On
Soft reset 0 = Off (Default) 1 = On
1 1 Soft reset 0 = Off (Default) 1 = On
LSB first 0 = Off (Default) 1 = On
0 0x18 The nibbles should be mirrored. See the Interfacing to High Speed ADCs via SPI user manual.
01 chip_id 8-bit Chip ID Bits 7:0 (AD9254 = 0x00), (default)
Read only
Default is unique chip ID, different for each device.
02 chip_grade Open Open Open Open Child ID 0 = 150 MSPS
Open Open Open Read only
Child ID used to differentiate speed grades.
Device Index and Transfer Registers
FF device_update Open Open Open Open Open Open Open SW transfer
0x00 Synchronously transfers data from the master shift register to the slave.
Global ADC Functions
08 modes Open Open PDWN 0—Full 1—Standby
Open Open Internal power-down mode 000—normal (power-up) 001—full power-down 010—standby 011—normal (power-up) Note: External PDWN pin overrides this setting.
0x00 Determines various generic modes of chip operation. See the Power Dissipation and Standby Mode and the SPI-Accessible Features sections.
09 clock Open Open Open Open Open Open Open Duty cycle stabilizer 0—disabled 1— enabled
0x01 See the Clock Duty Cycle section and the SPI-Accessible Features section.
AD9254
Rev. 0 | Page 24 of 40
Addr. (Hex) Parameter Name
Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1
Bit 0 (LSB)
Default Value (Hex)
Default Notes/ Comments
Flexible ADC Functions
10 offset Digital Offset Adjust<5:0> 011111 011110 011101 … 000010 000001 000000 111111 111110 111101 ... 100001 100000
Offset in LSBs +31 +30 +29 +2 +1 0 (Default) 1 −2 −3 −31 −32
0x00 Adjustable for offset inherent in the converter. See SPI-Accessible Features section.
0D test_io PN23 0 = normal (Default) 1 = reset
PN9 0 = normal (Default) 1 = reset
Global Output Test Options 000—off 001—midscale short 010—+FS short 011—−FS short 100—checker board output 101—PN 23 sequence 110—PN 9 111—one/zero word toggle
0x00 See the Interfacing to High Speed ADCs via SPI user manual.
14 output_mode Output Driver Configuration 00 for DRVDD = 2.5 V to 3.3 V 10 for DRVDD = 1.8 V
Open Output Disable 1—disabled 0—enabled1
Open Output Data Invert 1 = invert
Data Format Select 00—offset binary (default) 01—twos complement 10—Gray Code
0x00 Configures the outputs and the format of the data.
16 output_phase
Output Clock Polarity 1 = inverted 0 = normal (Default)
Open Open Open Open Open Open Open 0x00 See the SPI-Accessible Features section.
18 VREF Internal Reference Resistor Divider 00—VREF = 1.25 V 01—VREF = 1.5 V 10—VREF = 1.75 V 11—VREF = 2.00 V (Default)
Open Open Open Open Open Open 0xC0 See the SPI-Accessible Features section.
1 External output enable (OEB) pin must be high.
AD9254
Rev. 0 | Page 25 of 40
LAYOUT CONSIDERATIONS POWER AND GROUND RECOMMENDATIONS When connecting power to the AD9254, it is recommended that two separate supplies be used: one for analog (AVDD, 1.8 V nominal) and one for digital (DRVDD, 1.8 V to 3.3 V nominal). If only a single 1.8 V supply is available, it is routed to AVDD first, then tapped off and isolated with a ferrite bead or filter choke with decoupling capacitors proceeding connection to DRVDD. The user can employ several different decoupling capacitors to cover both high and low frequencies. These should be located close to the point of entry at the PC board level and close to the parts with minimal trace length.
A single PC board ground plane is sufficient when using the AD9254. With proper decoupling and smart partitioning of analog, digital, and clock sections of the PC board, optimum performance is easily achieved.
Exposed Paddle Thermal Heat Slug Recommendations
It is required that the exposed paddle on the underside of the ADC be connected to analog ground (AGND) to achieve the best electrical and thermal performance of the AD9254. An exposed, continuous copper plane on the PCB should mate to the AD9254 exposed paddle, Pin 0. The copper plane should have several vias to achieve the lowest possible resistive thermal path for heat dissipation to flow through the bottom of the PCB. These vias should be solder-filled or plugged.
To maximize the coverage and adhesion between the ADC and PCB, partition the continuous plane by overlaying a silkscreen on the PCB into several uniform sections. This provides several tie points between the two during the reflow process. Using one continuous plane with no partitions guarantees only one tie point between the ADC and PCB. See Figure 51 for a PCB layout example. For detailed information on packaging and the PCB layout of chip scale packages, see Application Note AN-772, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package.
SILKSCREEN PARTITIONPIN 1 INDICATOR
0621
6-05
5
Figure 51. Typical PCB Layout
CML The CML pin should be decoupled to ground with a 0.1 μF capacitor, as shown in Figure 33.
RBIAS The AD9254 requires the user to place a 10 kΩ resistor between the RBIAS pin and ground. This resister sets the master current reference of the ADC core and should have at least a 1% tolerance.
REFERENCE DECOUPLING The VREF pin should be externally decoupled to ground with a low ESR 1.0 μF capacitor in parallel with a 0.1 μF ceramic low ESR capacitor. In all reference configurations, REFT and REFB are bypass points provided for reducing the noise contributed by the internal reference buffer. It is recommended that an external 0.1 μF ceramic capacitor be placed across REFT/REFB. While placement of this 0.1 μF capacitor is not required, the SNR performance degrades by approximately 0.1 dB without it. All reference decoupling capacitors should be placed as close to the ADC as possible with minimal trace lengths.
AD9254
Rev. 0 | Page 26 of 40
EVALUATION BOARD The AD9254 evaluation board provides all of the support circuitry required to operate the ADC in its various modes and configu-rations. The converter can be driven differentially through a double balun configuration (default) or through the AD8352 differential driver. The ADC can also be driven in a single-ended fashion. Separate power pins are provided to isolate the DUT from the AD8352 drive circuitry. Each input configuration can be selected by proper connection of various components (see Figure 53 to Figure 63). Figure 52 shows the typical bench characterization setup used to evaluate the ac performance of the AD9254.
It is critical that the signal sources used for the analog input and clock have very low phase noise (<1 ps rms jitter) to realize the optimum performance of the converter. Proper filtering of the analog input signal to remove harmonics and lower the integrated or broadband noise at the input is also necessary to achieve the specified noise performance.
See Figure 53 to Figure 57 for the complete schematics and layout diagrams that demonstrate the routing and grounding techniques that should be applied at the system level.
POWER SUPPLIES This evaluation board comes with a wall-mountable switching power supply that provides a 6 V, 2 A maximum output. Connect the supply to the rated 100 V ac to 240 V ac wall outlet at 47 Hz to 63 Hz. The other end is a 2.1 mm inner diameter jack that connects to the PCB at P500. Once on the PC board, the 6 V supply is fused and conditioned before connecting to five low dropout linear regulators that supply the proper bias to each of the various sections on the board.
When operating the evaluation board in a nondefault condition, L501, L503, L504, L508, and L509 can be removed to disconnect the switching power supply. This enables the user to individually bias each section of the board. Use P501 to connect a different supply for each section. At least one 1.8 V supply is needed with a 1 A current capability for AVDD_DUT and DRVDD_DUT; however, it is recommended that separate supplies be used for analog and digital. To operate the evaluation board using the AD8352 option, a separate 5.0 V supply (AMP_VDD) with a 1 A current capability is needed. To operate the evaluation board using the alternate SPI options, a separate 3.3 V analog supply is needed, in addition to the other supplies. The 3.3 V supply (AVDD_3.3V) should have a 1 A current capability as well. Solder Jumpers J501, J502, and J505 allow the user to combine these supplies (see Figure 57 for more details).
INPUT SIGNALS When connecting the clock and analog source, use clean signal generators with low phase noise, such as Rohde & Schwarz SMHU or Agilent HP8644 signal generators or the equivalent. Use one meter long, shielded, RG-58, 50 Ω coaxial cable for making connections to the evaluation board. Enter the desired frequency and amplitude for the ADC. Typically, most evaluation boards from Analog Devices, Inc. can accept a ~2.8 V p-p or 13 dBm sine wave input for the clock. When connecting the analog input source, it is recommended to use a multipole, narrow-band, band-pass filter with 50 Ω terminations. Analog Devices uses TTE®, Allen Avionics, and K&L® types of band-pass filters. Connect the filter directly to the evaluation board, if possible.
OUTPUT SIGNALS The parallel CMOS outputs interface directly with the Analog Devices standard single-channel FIFO data capture board (HSC-ADC-EVALB-SC). For more information on the FIFO boards and their optional settings, visit www.analog.com/FIFO.
ROHDE & SCHWARZ,SMHU,
2V p-p SIGNALSYNTHESIZER
ROHDE & SCHWARZ,SMHU,
2V p-p SIGNALSYNTHESIZER
BAND-PASSFILTER AIN
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14-BITPARALLEL
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0621
6-05
6
Figure 52. Evaluation Board Connection
AD9254
Rev. 0 | Page 27 of 40
DEFAULT OPERATION AND JUMPER SELECTION SETTINGS The following is a list of the default and optional settings or modes allowed on the AD9254 Rev. A evaluation board.
POWER
Connect the switching power supply that is supplied in the evaluation kit between a rated 100 V ac to 240 V ac wall outlet at 47 Hz to 63 Hz and P500.
VIN
The evaluation board is set up for a double balun configuration analog input with optimum 50 Ω impedance matching out to 70 MHz. For more bandwidth response, the differential capacitor across the analog inputs can be changed or removed (see Table 8). The common mode of the analog inputs is developed from the center tap of the transformer via the CML pin of the ADC (see the Analog Input Considerations section).
VREF
VREF is set to 1.0 V by tying the SENSE pin to ground via JP507 (Pin 1 and Pin 2). This causes the ADC to operate in 2.0 V p-p full-scale range. A separate external reference option is also included on the evaluation board. Connect JP507 between Pin 2 and Pin 3, connect JP501, and provide an external reference at E500. Proper use of the VREF options is detailed in the Voltage Reference section.
RBIAS
RBIAS requires a 10 kΩ resistor (R503) to ground and is used to set the ADC core bias current.
CLOCK
The default clock input circuitry is derived from a simple transformer-coupled circuit using a high bandwidth 1:1 impedance ratio transformer (T503) that adds a very low amount of jitter to the clock path. The clock input is 50 Ω terminated and ac-coupled to handle single-ended sine wave inputs. The transformer converts the single-ended input to a differential signal that is clipped before entering the ADC clock inputs.
PDWN
To enable the power-down feature, connect JP506, shorting the PDWN pin to AVDD.
CSB
The CSB pin is internally pulled-up, setting the chip into external pin mode, to ignore the SDIO and SCLK information. To connect the control of the CSB pin to the SPI circuitry on the evaluation board, connect JP1 Pin 1 and Pin 2. To set the chip into serial pin mode, and enable the SPI information on the SDIO and SCLK pins, tie JP1 low (connect Pin 2 and Pin 3) in the always enabled mode.
SCLK/DFS
If the SPI port is in external pin mode, the SCLK/DFS pin sets the data format of the outputs. If the pin is left floating, the pin is internally pulled down, setting the default condition to binary. Connecting JP2 Pin 2 and Pin 3 sets the format to twos comple-ment. If the SPI port is in serial pin mode, connecting JP2 Pin 1 and Pin 2 connects the SCLK pin to the on-board SPI circuitry (see the Serial Port Interface (SPI) section).
SDIO/DCS
If the SPI port is in external pin mode, the SDIO/DCS pin acts to set the duty cycle stabilizer. If the pin is left floating, the pin is internally pulled up, setting the default condition to DCS enabled. To disable the DCS, connect JP3 Pin 2 and Pin 3. If the SPI port is in serial pin mode, connecting JP3 Pin 1 and Pin 2 connects the SDIO pin to the on-board SPI circuitry (see the Serial Port Interface (SPI) section).
ALTERNATIVE CLOCK CONFIGURATIONS A differential LVPECL clock can also be used to clock the ADC input using the AD9515 (U500). When using this drive option, the components listed in Table 16 need to be populated. Consult the AD9515 data sheet for further information.
To configure the analog input to drive the AD9515 instead of the default transformer option, the following components need to be added, removed, and/or changed.
1. Remove R507, R508, C532, and C533 in the default clock path.
2. Populate R505 with a 0 Ω resistor and C531 in the default clock path.
3. Populate R511, R512, R513, R515 to R524, U500, R580, R582, R583, R584, C536, C537, and R586.
If using an oscillator, two oscillator footprint options are also available (OSC500) to check the performance of the ADC. JP508 provides the user flexibility in using the enable pin, which is common on most oscillators. Populate OSC500, R575, R587, and R588 to use this option.
ALTERNATIVE ANALOG INPUT DRIVE CONFIGURATION This section provides a brief description of the alternative analog input drive configuration using the AD8352. When using this particular drive option, some components need to be populated, as listed in Table 16. For more details on the AD8352 differential driver, including how it works and its optional pin settings, consult the AD8352 data sheet.
AD9254
Rev. 0 | Page 28 of 40
To configure the analog input to drive the AD8352 instead of the default transformer option, the following components need to be added, removed, and/or changed:
1. Remove C1 and C2 in the default analog input path.
2. Populate R3 and R4 with 200 Ω resistors in the analog input path.
3. Populate the optional amplifier input path with all components except R594, R595, and C502.
Note that to terminate the input path, only one of the following components should be populated: R9, R592, or the combination of R590 and R591).
4. Populate C529 with a 5 pF capacitor in the analog input path.
Currently, R561 and R562 are populated with 0 Ω resistors to allow signal connection. This area allows the user to design a filter if additional requirements are necessary.
AD9254
Rev. 0 | Page 29 of 40
SCHEMATICS
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AD9254
Rev. 0 | Page 30 of 40
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0122
98
RP5
0222
81
22R
P500
710
22R
P502
611
22R
P502
512
22R
P502
413
22R
P502
314
22R
P502
215
22R
P502
116
22R
P502
611
22R
P501
512
22R
P501
413
22R
P501
314
22R
P501
215
22R
P501
116
22R
P501
45
RP5
0022
36
RP5
0022
27
RP5
0022
DN
I
R50
0
R04
02
DN
I
R50
1
R04
02
10K
R50
3
TP50
3
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20
J503
13
2JP3
13
2JP2
13
2JP1
34
31 34
12
32 33 39 40 41 42
5678
45
112425 26 27
1213161718192021
351523
29
1422
30
10
44
9
28 3836 46 47 4837 43
U51
0
JP50
2D
NI
0.1U
FC
556
JP50
6D
NI
13
2
JP50
7
DU
TAVD
D
JP50
0
DN
I
JP50
1
DN
I
VREF
CSB
_DU
T
E50
0
ES
NE
SF
ER
V_TX
E
DU
TAVD
D
DU
TAV
DD
D12
TP50
1D
13
DO
R
DU
TDR
VDD TP
502
D2
DU
TDR
VD
D
VREF
SEN
SE VIN
-
VIN
+
D0
DC
O
SCLK
_CH
A
SDO
_CH
A
CSB
1_C
HA
SDI_
CH
AFI
FOC
LK
FD10
FD11
FD12
FD13
D1
FIFO
CLK
FD0
FD1
FD2
FD3
FD4
FD5
FD6
FD7
FD8
FD9
FD10
FD11
FD12
FD13
FDO
R
4567891011121314151617181920212223
4746454443424140393837363534333231302928272624 123
25 48
U50
9
74VC
X162
24
D3
D4
D5
D6
D7
D8
D9
D10
D11
TP50
0
TP50
4
1.0U
FC
553
DU
TAVD
D
CLK
CLK
D1
D9
DO
R
D13
D12
D11
D10 D
8
D7
D6
D5
D4
D3
D2
D0
DC
O
VDL
FD8
FDO
R
FD0
FD1
FD2
FD4
FD5
FD6
FD7
FD9
FD3
CM
L
SCLK
_DTP
SDIO
_OD
M
0.1U
FC
554
0.1U
FC
555
0621
6-05
8
Figure 54. Evaluation Board Schematic, DUT, VREF, and Digital Output Interface
AD9254
Rev. 0 | Page 31 of 40
SMA
EDG
E
SMA
EDG
E
RC
0603
RC
0603
RC
0603
RC
0603
RC
0603
RC
0603
RC
0603
RC
0603
CC0402 CC0402
RC0402
RC0402
RC0402
CC0402 CC0402 CC0402
RC0402
RC0402
RC
0402
CC0402
RC060 3
RC
0603
RC
0603
CC0402
RC060 3
RC060 3
RC
0603
CC0402
RC
0603
RC
0603
RC
0603
RC
0603
RC
0603
RC
0603
Plac
e C
531,
R50
5=0.
CLK
/
CLK
XFM
R/A
D95
15C
lock
Circ
uitr
yA
D95
15 L
OG
IC S
ETU
P
21
DN
IR
511
21
DN
IR
510
OPT
_CLK
CLK
0R50
7
DN
I
0R50
8
AVD
D_3
P3V
S9
2 3 5
67891011121314151625
18192223
31
32
33
U50
0 AVD
D_3
P3V;
1,4,
17,2
0,21
,24,
26,2
9,30
AVD
D_3
P3V
AVD
D_3
P3V
CLK
OPT
_CLK
CLK
S1
31
2
JP50
8
S8S7S6S5S4S3S2
R51
40
DN
I
E501
R52
20
R52
30
R52
40
R51
90
R51
80
R52
00
R52
10
R51
60
R51
30
R51
50
R51
70
R52
60
DN
I
240
R58
3
0.1U
FC
537
DN
I
240
R58
4
0R50
913
2
D50
2H
SMS2
812
49.9
R50
5
DN
I49
.9R
5040.1U
FC
531
DN
I
10K
R58
8
R52
50
DN
I
0R50
6
1 2 3456
T503
0R51
2
0.1U
FC
530
100
R58
5
E502
0R57
5
DN
I
4.12
KR
586
R58
010
KR
581
DN
I
R57
6D
NI
0.1U
FC
535
DN
I
0.1U
FC
534
DN
I
0.1U
FC
536
DN
I
C51
1.1
UF
E503
100
R58
2
S9S10
R57
8D
NI
R57
9D
NI
DN
IR
577
0.1U
FC
532
0.1U
FC
533
S7S8
S5S6
S4S3
S1S2
S0
14 12 10
1 53 78
OSC
500
R52
70
DN
I
R53
10
DN
I
R53
00
DN
I
R52
90
DN
I
R52
80
DN
I
R53
40
DN
I
R53
30
DN
I
R53
20
DN
I
OPT
_CLK
S0
GN
D;3
,4,5
S502
GN
D;3
,4,5
S501
CLK
OPT
_CLK
To u
se A
D95
15 (O
PT _
CLK
), re
mov
e R
507,
R50
8, C
533,
C53
2.
10K
R58
7EN
AB
LED
ISA
BLE
RC
0402
DN
I
CB
3LV-
3C
VCC
OU
T
OE
GN
D
OE
GN
DO
UT
VCC
DN
I
DN
I
RC0402
DN
I
DN
I
RC0402
RC
0402
DN
I
NC
=27,
28
AD
9515
CLK
CLK
B
GN D
GND_PAD
OU
T0
OU
T0B
OU
T1
OU
T1B
RSET
S0S1
S10
S2S3S4S5S6S7S8S9
SYN
CB
VREF
DN
I
RC0402
DN
I
RC0402
DN
I
RC0402
DN
I
RC0402
DN
I
S10
RC
0603
RC
0603D
NI
DN
I
RC
0603D
NI
RC
0603D
NI
RC
0603D
NI
RC
0603D
NI
RC
0603D
NI
RC
0603D
NI
RC
0603D
NI
RC
0603D
NI
RC
0603D
NI
0621
6-05
9
Figure 55. Evaluation Board Schematic, DUT Clock Input
AD9254
Rev. 0 | Page 32 of 40
RC0603
RC0603
RC0603
RC
0603
RC
0603
RC0603
RC0603
RC0603
RC0603
RC0603
RC0603
RC0603
NC
7WZ0
7
A1
GN
DA
2
Y1VC
C Y2
NC
7WZ1
6
A1
GN
DA
2
Y1VC
C Y2
RC
0603
Opt
iona
l
+5V=
PRO
GR
AM
MIN
G O
NLY
=AM
PVD
DSP
I C
IRC
UIT
RY
GP0
PICVCC
GP1
For F
IFO
con
trol
led
port
, pop
ulat
e R
555,
R55
6, R
557.
Whe
n us
ing
PIC
SPI c
ontr
olle
d po
rt, p
opul
ate
R54
5, R
546,
R54
7.
REM
OVE
WH
EN U
SIN
G O
R P
RO
GR
AM
MIN
G P
IC (U
506)
Whe
n us
ing
PIC
SPI c
ontr
olle
d po
rt, r
emov
e R
555,
R55
6, R
557.
MCLR-GP3
+3.3
V=N
OR
MA
L O
PER
ATI
ON
=AV
DD
_3P3
V
1
10
23 45 67 89
J504
PIC
-HE
AD
ER
24
13
7 6 532
81 4
U50
6
R54
74.
7KD
NI
1 3256 4
U50
7
1 3256 4
U50
8
R54
810
K
R54
910
K
1KR55
2
SD
IO_O
DM
CSB
_DU
T
SC
LK_D
TP
R55
31K
R55
11K
R55
010
K
13
2
JP50
9
AV
DD
_3P
3V
R55
4 0
R54
64.
7KD
NI
4.7K
R54
5D
NI
C55
70.
1UF
12
R55
926
1
R55
84.
7K
21
D50
5 E50
4
R55
7 0R
556 0
R55
50
SDO_CHA
CSB1_CHA
SDI_CHA
SCLK_CHA
AV
DD
_3P
3VD
UTA
VD
D
DN
ID
NI
S1
DN
I
DN
I
DN
I
DN
I
DN
IH
EAD
ER U
P M
ALE
RC
0603
CC
0603
RC0603
DDVP
MA
V3P3_D
DVA
DN
I
PICVCC
GP1
GP0
MCLR-GP3
SOIC
8
GP5
GP4
GP0
GP2
GP1
VSS
VDD
MC
LR PIC
12F6
29
0621
6-06
0
Figure 56. Evaluation Board Schematic, SPI Circuitry
AD9254
Rev. 0 | Page 33 of 40
CC
0603
CC
0603
AC
ASE
LC12
10
CC
0603
CC
0603
CC
0603
AC
ASE
AC
ASE
AC
ASE
AC
ASE
CC
0603
CH
OK
E_C
OIL
DO
-214
AA
2AS2A
_REC
T
CC
0603
CC
0603
LC12
10
LC12
10
LC12
10
LC12
10
LC12
10
CC
0603
CC
0603
CC
0603
CC
0603
GND
1TU
PTU
OT
UP
NIO
UTP
UT4
LC12
10
LC12
10
CC
0402
CC
0402
CC
0402
CC
0402
CC
0402
CC
0402
CC
0402
CC
0402
LC12
10
GND
1TU
PTU
OT
UP
NIO
UTP
UT4
GND
1TU
PTU
OT
UP
NIO
UTP
UT4
LC12
10
GND
1TU
PTU
OT
UP
NIO
UTP
UT4
SMD
C11
0F
GND
1TU
PTU
OT
UP
NIO
UTP
UT4
P1 P2 P3 P4 P5 P6 P7 P8 P9 P10
CC
0603
CC
0603
Rem
ove
L501
,L50
3,L5
04,L
508,
L509
.To
use
opt
iona
l pow
er c
onne
ctio
n
OPT
ION
AL
POW
ER C
ON
NEC
TIO
N
Pow
er S
uppl
y In
put
6V,
2A m
axA
VDD
_3.3
V=3.
3V
Con
nect
ed to
Gro
und
Mou
ntin
g H
oles
DU
TDR
VDD
=2.5
VD
UTA
VDD
=1.8
V
VDL=
3.3V
GR
OU
ND
TEST
PO
INTS
AVD
D_3
P3V
AVD
D_3
P3V
J505
DU
TDR
VD
DIN J5
02
DU
TAVD
DIN
VDLI
N
AVD
D_3
P3V
AVD
D_3
P3V
AVD
D_3
P3VI
N
AM
PVD
DIN
TP51
3
DU
TDR
VDD
DU
TAVD
D
0.1U
FC
599
C57
20.
1UF
R58
926
1
C52
710
UF
21
CR500
J501
TP510
1 2 3 4 5 6 7 8 9 10
P501
1
23
4
U50
2 AD
P333
9AK
C-1
.8
H50
1
TP50
6
VDL
DU
TDR
VDD
F500
42
3
1
AD
P333
9AK
C-3
.3U
505
10U
HL5
09
1UF
C51
3
1
23
4
U50
1 AD
P333
9AK
C-5
1
23
4
U50
4 AD
P333
9AK
C-3
.3L5
0810
UH
H50
3
H50
2
TP512
TP511
H50
0
TP509
C52
61U
F
1UF
C52
5
TP50
8
C54
60.
1UF
C54
50.
1UF
C54
40.
1UF
C54
30.
1UF
C54
20.
1UF
C54
00.
1UF
C53
90.
1UF
C53
80.
1UF
L507
10U
H
L506
10U
H
1
23
4
U50
3 AD
P333
9AK
C-2
.5
0.1U
FC
575
0.1U
FC
574
0.1U
FC
573
0.1U
FC
570
L505
10U
H
L504
10U
H
L503
10U
H
L502
10U
H
L501
10U
H
0.1U
FC
569
0.1U
FC
568
D50
4
34
FER
500
1
2
3
P500
D50
3
SH
OT_
REC
T3A D
O-2
14A
B
0.1U
FC
567
C52
41U
F
C52
31U
FC
522
1UF
C52
11U
FC
520
1UF
C51
91U
FC
518
1UF
C51
70.
1UF
1OU
F6.
3V
C55
2
C51
60.
1UF
1OU
F6.
3V
C55
1
C51
50.
1UF
1OU
F6.
3V
C55
0
C51
40.
1UF
1OU
F6.
3V
C54
9
0.1U
FC
566
0.1U
FC
565
0.1U
FC
564
L500
10U
H
C51
20.
1UF
1OU
F6.
3V
C54
8
TP50
7
TP50
5
C55
9
0.1U
F0.
1UF
C55
8
GN
D
GN
D
AM
PVD
DIN
PWR
_IN
AM
PVD
D
VDL
AM
PVD
D
GN
D
GN
D
GN
D
VDLI
NPW
R_I
N
PWR
_IN
PWR
_IN
DU
TAVD
DIN
DU
TDR
VDD
INPWR
_IN
PWR
_IN
DU
TAVD
D
AM
PVD
D=5
V
CO
N00
57.
5V P
OW
ER
2.5M
M J
AC
K
0621
6-06
1
Figure 57. Evaluation Board Schematic, Power Supply Inputs
AD9254
Rev. 0 | Page 34 of 40
EVALUATION BOARD LAYOUT
0621
6-06
2
Figure 58. Evaluation Board Layout, Primary Side
0621
6-06
3
Figure 59. Evaluation Board Layout, Secondary Side (Mirrored Image)
AD9254
Rev. 0 | Page 35 of 40
0621
6-06
4
Figure 60. Evaluation Board Layout, Ground Plane
0621
6-06
5
Figure 61. Evaluation Board Layout, Power Plane
AD9254
Rev. 0 | Page 36 of 40
0621
6-06
6
Figure 62. Evaluation Board Layout, Silkscreen Primary Side
0621
6-06
7
Figure 63. Evaluation Board Layout, Silkscreen Secondary Side (Mirrored Image)
AD9254
Rev. 0 | Page 37 of 40
BILL OF MATERIALS
Table 16. Evaluation Board Bill of Materials (BOM)
Item Qty. Omit (DNP) Reference Designator Device Package Description Supplier/Part Number
1 1 AD9246CE_REVA PCB PCB ADI 24 C1, C2, C509, C510, C511, C512,
C514, C515, C516, C517, C528, C530, C532, C533, C538, C539, C540, C542, C543, C544, C545, C546, C554, C555
2
12 C3, C500, C502, C503, C504, C505, C531, C534, C535, C536, C537, C557
Capacitor 0402 0.1 μF
3 1 C501 Capacitor 0402 0.3 pF
4 2 C4, C5 Resistor 0402 0 Ω
5 10 C513, C518, C519, C520, C521, C522, C523, C524, C525, C526
Capacitor 0402 1.0 μF
6 1 C527 Capacitor 1206 10 μF
7 1 C529 Capacitor 0402 20 pF
8 5 C548, C549, C550, C551, C552 Capacitor ACASE 10 μF
9 1 C553 Capacitor 0805 1.0 μF
10 15 C556, C558, C559, C564, C565, C566, C567, C568, C569, C570, C572, C573, C574, C575, C599
Capacitor 0603 0.1 μF
11 1 CR500 LED 0603 green Panasonic LNJ314G8TRA
1 D502 12 2 D500, D501
Diode SOT-23 30 V, 20 mA, dual Schottky
HSMS2812
13 1 D503 Diode DO-214AB 3 A, 30 V, SMC Micro Commercial Components SK33-TPMSCT-ND
14 1 D504 Diode DO-214AA 2 A, 50 V, SMC Micro Commercial Components S2A-TPMSTR-ND
15 1 D505 LED LN1461C AMB Amber LED
16 1 F500 Fuse 1210 6.0 V, 2.2 A trip current resettable fuse
Tyco, Raychem NANOSMDC110F-2
17 1 FER500 Choke 2020 Murata DLW5BSN191SQ2
18 1 J500 Jumper Solder jumper
19 3 J501, J502, J505 Jumper Solder jumper
20 1 J503 Connector 120 pin Male header Samtec TSW-140-08-G-T-RA
21 1 J504 Connector 10 pin Male, 2 × 5 Samtec
22 3 JP1, JP2, JP3 Jumper 3 pin Male, straight Samtec TSW-103-07-G-S
23 4 JP500, JP501, JP502, JP506 Jumper 2 pin Male, straight Samtec TSW-102-07-G-S
1 JP507 24
2 JP508, JP509
Jumper 3-pin jumper
Male, straight
Samtec TSW-103-07-G-S
25 10 L500, L501, L502, L503, L504, L505, L506, L507, L508, L509
Ferrite Bead 3.2 mm × 2.5 mm × 1.6 mm
Digikey P9811CT-ND
26 1 OSC500 Oscillator SMT 125 MHz or 105 MHz
CTS Reeves CB3LV-3C
27 1 P500 Connector PJ-102A DC power jack Digikey CP-102A-ND
AD9254
Rev. 0 | Page 38 of 40
Item Qty. Omit (DNP) Reference Designator Device Package Description Supplier/Part Number
28 1 P501 Connector 10 pin Male, straight PTMICRO10
29 6 R1, R6, R563, R565, R574, R577 Resistor 0402 DNI
5 R2, R5, R561, R562, R571 30
6 R10, R11, R12, R535, R536, R575
Resistor 0402 0 Ω
31 2 R3, R4 Resistor 0402 25 Ω
32 6 R7, R8, R9, R502, R510, R511 Resistor 0603 DNI
33 6 R500, R501, R576, R578, R579, R581
Resistor 0402 DNI
34 4 R503, R548, R549, R550 Resistor 0603 10 kΩ
1 R504 35
1 R505
Resistor 0603 49.9 Ω
9 R506, R508, R509, R512, R554, R555, R556, R557, R560
36
23 R507, R513, R514, R515, R516, R517, R518, R519, R520, R521, R522, R523, R524, R525, R526, R527, R528, R529, R530, R531, R532, R533, R534,
Resistor 0603 0 Ω
37 4 R545, R546, R547, R558 Resistor 0603 4.7 kΩ
38 3 R551, R552, R553 Resistor 0603 1 kΩ
39 1 R559 Resistor 0603 261 Ω
40 2 R566, R567 Resistor 0402 33 Ω
41 3 R582, R585, R598 Resistor 0402 100 Ω
42 2 R583, R584 Resistor 0402 240 Ω
43 1 R586 Resistor 0402 4.12 kΩ
44 3 R580, R587, R588 Resistor 0402 10 kΩ
45 1 R589 Resistor 0603 261 Ω
46 2 R590, R591 Resistor 0402 25 Ω
47 1 R592 Resistor 0402 DNI
48 2 R593, R596 Resistor 0402 0 Ω
49 2 R594, R595 Resistor 0402 10 kΩ
50 1 R597 Resistor 0402 4.3 kΩ
51 1 RP500 Resistor RCA74204 22 Ω
52 2 RP501, RP502 Resistor RCA74208 22 Ω
53 1 S1 Switch Momentary (normally open)
Panasonic EVQ-PLDA15
2 S500, S501 54
2 S502, S503
Connector SMAEDGE SMA edge right angle
55 2 S504, S505 Connector SMA200UP SMA RF 5-pin upright
2 T500, T501 56
1 T1
Transformer SM-22 M/A-Com ETC1-1-13
1 T503 57
1 T502
Transformer CD542 Mini-Circuits ADT1-1WT
58 1 U500 IC 32-pin LFCSP _VQ
Clock distribution
ADI AD9515BCPZ
59 1 U501 IC SOT-223 Voltage regulator
ADI ADP3339AKCZ-5
AD9254
Rev. 0 | Page 39 of 40
Item Qty. Omit (DNP) Reference Designator Device Package Description Supplier/Part Number
60 1 U502 IC SOT-223 Voltage regulator
ADI ADP3339AKCZ-1.8
61 1 U503 IC SOT-223 Voltage regulator
ADI ADP3339AKCZ-2.5
62 2 U504, U505 IC SOT-223 Voltage regulator
ADI ADP3339AKCZ-3.3
63 1 U506 IC 8-pin SOIC 8-bit microcontroller
Microchip PIC12F629
64 1 U507 IC SC70 Dual buffer Fairchild NC7WZ16
65 1 U508 IC SC70 Dual buffer Fairchild NC7WZ07
66 1 U509 IC 48-pin TSSOP
Buffer/line driver
Fairchild 74VCX162244
67 1 U510 DUT (AD9254)
48-pin LFCSP_VQ
ADC ADI AD9254BCPZ
68 1 U511 (or Z500) IC 16-pin LFCSP_VQ
Differential amplifier
ADI AD8352ACPZ
Total 128 107
AD9254
Rev. 0 | Page 40 of 40
OUTLINE DIMENSIONS
PIN 1INDICATOR
TOPVIEW
6.75BSC SQ
7.00BSC SQ
148
1213
3736
2425
4.254.10 SQ3.95
0.500.400.30
0.300.230.18
0.50 BSC
12° MAX
0.20 REF
0.80 MAX0.65 TYP
1.000.850.80
5.50REF
0.05 MAX0.02 NOM
0.60 MAX0.60 MAX PIN 1
INDICATOR
COPLANARITY0.08
SEATINGPLANE
0.25 MIN
EXPOSEDPAD
(BOTTOM VIEW)
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2 Figure 64. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
7 mm × 7 mm Body, Very Thin Quad (CP-48-3) Dimensions shown in millimeters
ORDERING GUIDE Model Temperature Range Package Description Package Option AD9254BCPZ-1501, 2 –40°C to +85°C 48-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-48-3 AD9254BCPZRL7–1501, 2 –40°C to +85°C 48-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-48-3 AD9254-150EBZ1 Evaluation Board
1 Z = Pb-free part. 2 It is required that the exposed paddle be soldered to the AGND plane to achieve the best electrical and thermal performance.
©2006 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06216-0-10/06(0)