NDK EUROPE Ltd.

Crystal Bridge to the Future

Nihon Demp Kogyo was founded in April, 1948   7 Factories Japan(4), Malaysia(2), China(1)   3 Design Centers Japan   19 Sales Sites Japan(3), Asia(8), Europe(4), USA(4)

Produces   Synthetic Quartz   Crystal Resonators   Oscillators TCXO, VCXO, OCXO, ....   SAW filters   Etc....

Company Profile

Usage of Quartz - NDK Product range

11.7%

10.8%

10.5%

9.0%

6.3% 5.1% 3.2% 3.0%

3.0%

3.0%

34.3%

  CS&A analysis (crystal units and crystal oscillators only) shows that the global crystal market is worthy of JPY344Billion (US$3.3Billion).

others

Estimate

NDK Ranking in World’s Market

E...

K1...

T...

K2...

M...(V..) S... M...

H1...

H2...

What is Crystal Resonator (Xtal) ?

1880 The piezoelectric effect was discovered by brothers Pierre Curie and Jacques Curie at the Laboratory of Mineralogy at the Sorbonne. 1922 Oscillation circuit using Crystal unit was developed and practical application were established. (Controlling a frequency in a vacuum tube, first crystal oscillator – W.G. Cady) 1953 Found method to grow synthetic crystal using hydrothermal synthesis method. Presently, the crystal blank (material) used in industrial is 100% grown by synthetic crystal. (synthetic crystal has less unwanted inclusion compare to natural crystal)

Synthetic CrystalNatural Crystal

History of crystal unit

 The piezoelectric effect is defined by pressure applied on crystal quartz which generates voltage and reverse : voltage applied though a crystal unit will produce mechanical vibration.   Oscillation does not just happen in

crystal units, it will continuously oscillate . We get stabilized oscillation frequency by connecting crystal units with appropriate oscillation circuit. (Crystal units is passive component.)

Piezoelectric effect

X

Depending on the cutting angles of the quartz crystal results varies vibration modes. At-cut is featured that points on the curve are kept close to room temp. and is widely used because of its good frequency stability under environmental changes.

Theoretical Frequency – Temperature Curves of Various Cuts

Name for Different Cutting Angles 1. “AT cut” is very popular cutting for electronics application , Frequency is MHz range. 2. “+2oX cut” is 32.768kHz for tuning fork.

+2X

Typical Cuts and Temperature Characteristic

Y

Z

Thickness Shear Mode

Vibration modes

AT-Cut is Thickness Shear mode, you can see how to vibrate !

Crystal wafer (Blank)

Crystal wafer (Blank) : Simulation by the finite element method

t = 1670 / F t: Thickness (mm) , 1670:AT-Cut Constant F: Frequency (kHz) EX : Frequency: 20MHz(20,000kHz) t = 1670 / 20000 = 0.0835 (mm) = 83.5 (µm)

X’

Y’ Z’

AT-cut (Thickness share vibration)

t

Oscillation frequency and calculation

For Crystal design, NDK use High technology simulation tool and decide adequate design.

For example, using above simulation, we can study the optimum dimension or structure that gives the minimum stress during vibration. (blue = less displacement red = more displacement )

Tuning fork ! (32.768kHz))

Vibration modes

How crystal material is made ?

Growing synthetic quartz crystals from material (lascas) by using hydrothermal method.

Natural crystals (lascas) are placed in an autoclave(high-temperature and high-pressure vessel) in order to grow crystals by hydrothermal method.

Purpose

Method

Principle of synthetic quartz growing Lascas are dissolved under high temperature and high pressure in autoclave and then precipitated on seed crystals to grow into larger crystals. This method is referred to as hydrothermal method. Period needed for growth of synthetic quartz crystal is approximately 1 to 6 months depending on application.(Normally approx. 1.5 months)

Quality of synthetic quartz crystals Quality of synthetic quartz crystals is evaluated and controlled by monitoring infrared absorption coefficient (α), inclusion density and etch channel density according to IEC standards.

Synthetic crystal growth

How crystal oscillator works and recommendations like oscillator margin check

1.This is a typical circuit for fundamental crystal oscillator by using C-MOS inverters.

2.Unbuffered inverter is used as an analog amplifier with resistor Rf.

3.Characteristics are optimized with capacitor C and resistor Rd. (Preparation of circuit pattern for Rd is recommended.)

Oscillation Circuit

Crystal oscillator circuit for Microcontroller

Rf

Rd

C C

C - MOS Inverter OSC Buffer

1. An oscillator frequency is determined by load capacitance.

2. Negative resistance is a capability that circuit let oscillate crystal unit.

3. Drive level is the power consumption at crystal units.

RL

R−

CL

DL

Load Capacitance

Negative Resistance

Crystal Unit

Oscillation CircuitDrive Level

Oscillation Circuit

Basic Characteristics of Crystal Oscillation Circuit

Mismatching between chipset and crystal… Mismatching: Low Negative Resistance Large Frequency Deviation / Shift High Drive Level

User may have possibility of non oscillation of the crystal because of low negative resistance.

We have seen such troubles caused.

Matching Service

Importance of Matching between Chipset and Crystal Unit

Evaluation Items

1. Negative Resistance -R To avoid “No Oscillation”

2. Drive Level DL For stable frequency

3. Frequency / Frequency Deviation dF/F To avoid function error

Matching Service

When frequency is shifted in customer side, it means that CL of oscillation circuit board does not correspond with CL of crystal unit. There are 2 kinds of ways to match CL of oscillation circuit board and CL of crystal units. 1)  Adjust Cin/Cout of oscillation circuit board to match CL of crystal units. 2)  Change CL of crystal units to match CL of oscillation circuit board.

R1 L1 C1

-R CL

C0

PCB

Crystal unit

IC

Crystal unit equivalent circuit

Simple oscillation circuit model ( PCB )

CLcircuit = CLcrystal

Measurement

Frequency Adjustment

Cout

XoutXinGND VDD

CinCs1 Cs2

Cs0

CsCoutCinCoutCinCL +

+

×=

},,{ 210 CsCsCsCs =

Oscillation Circuit Load

Freq

uenc

y D

evia

tion

dF/

F[pp

m]

Circuit CL=6pF

Circuit CL=10pF

Crystal Spec CL=10pF

Measurement

Frequency Adjustment

Load Capacitance CL[pF] (Circuit Capacitance)

Freq

uenc

y D

evia

tion

dF/

F[pp

m]

Crystal Spec CL=10pF

Crystal Spec CL=6pF

Circuit CL=6pF

Measurement

Frequency Adjustment

Oscillation Circuit Load

Cout

XoutXinGND VDD

CinCs1 Cs2

Cs0

CsCoutCinCoutCinCL +

+

×=

},,{ 210 CsCsCsCs =

Spectrum analyzer Crystal unit

Circuit

 1. Set the variable resistance as large value to stop oscillation.

 2. Reduce resistance value a little by little and watch the spectrum analyzer.

 3. Find a the point for oscillation start and confirm the resistance value.   * Negative Resistance = Variable Resistance + Crystal Impedance

Measurement

How to Measure Negative Resistance

-Rcir CL

C0

Equivalent circuit for crystal unit

Oscillation circuit

R1 L1 C1

In order to get stable oscillation, negative resistance(-R) value is very important. NDK propose suitable circuit parameter to get sufficient negative resistance target value which is based on experience. (We have more than 50,000 matching reports)

Rcir > RLRcir = Negative resistance RL = Crystal resistance wt load cap

Model 20MHz 30MHz

NX8045GB 400 300

NX5032GA 600 400

NX3225SA 700 600

Measurement

Unit: ohm

How to Improve Oscillation Margin

Crystal Units presentation

0.1

1

10

2006 2008 2010 2012 2014 2016 2018 2020

Prod

uct v

olum

e [m

m3]

Year

RF Crystal unit, Seam weld

NX2016SA 2.0x1.6x0.5

NX1612SA 1.6x1.2x0.35

NX1210AB 1.2x1.0x0.3

NX1008AA 1.0x0.8x0.3

New !

Road map for Crystal unit

Typical Specifications

NX1008A

NX1210AB

NX1612SA

Freq. Range 32~104 MHz 26~104 MHz 24~104 MHz

Freq. Tolerance (+25±3°C) Max. ±10ppm Max. ±10ppm Max. ±10ppm

Temp. Characteristics (with reference to +25°C)

Max. ±12ppm CI 32M 150Ω

40M 100Ω 48M 60Ω

Max. ±12ppm Max. ±10ppm

Operating Temp. Range -30 to +85°C -30 to +85°C -20 to +70°C

Storage Temp. Range -40 to +85°C -40 to +85°C -40 to +85°C

Drive Level 10μW (Max. 200μW)

10μW (Max. 200μW)

10μW (Max. 200μW)

Under Development

Crystal Units (AT-cut)

H: Max. 0.3mm H: Max. 0.35mmH: Max. 0.3mm

NX1210AB is a small and low profile crystal unit. It’s suitable for short range wireless communications (ex. WiFi, Bluetooth, NFC) on wearable equipment.

Nominal frequency [ MHz ]

Type

NX3225SA

NX2520SA

NX2016SA

NX1612SA

NX1210AB

NX1008AA

10 20 30 40 50 60 70 80 90 100 110

12 to 60 MHz

New !

40 to 150 MHz

12 to 80 MHz

40 to 150 MHz

104 to 150

104 to 150

104 to 150

32 to104 MHz

104 to 150Under development

24to 104 MHz

24 to 104 MHz

26 to 104 MHz

Fundamental 3rd overtone

Using photolithography technics under NX1210 package

Applicable freq. range for crystal unit

Market Situation and Trend IoT

SIGFOX LoRa Bluetooth BLE Zigbee NFC WiFi LTE/5G

Major Application

Sensor Network Smart Grid

Remote Monitoring

PC Smartphone

Tablet Wearable device

Sensor Network HEMS

IC Card Pairing

PC Smartphone

Tablet Camera

Mobile Phone bending Machine

Car

NDK Products

Xtal 2520 2016 1612

Xtal 2520 2016 1612 1210

Xtal 3225 2520 2016

Xtal 2520 2016 1612

Xtal 3225 2520 2016 1612

Thermistor 2016 1612 or

TCXO

Frequency (MHz)

24.305/32 40/48/50

55.232/133 12/16/19.2/20

24/26/32/48/64 16/24/26

27/32/40/48 13.56/27.12 20/26/30/37.4 38.4/40/48/54

80/96/119

19.2/26 38.4/76.8 96/104

Tolerance ±10ppm Bluetooth: Overall±20ppm

BLE:

Overall±40ppm

±10ppm Over all ±50-80ppm ±10ppm ±10ppm

Temp. Character

±10ppm ±12ppm±15ppm

±10-15ppm -20 +70

(Max 125 )

±10ppm ±10ppm

-20 +70 -30 +85 Temperature

-20 +70 -30 +85 -40 +85

-40 +85 (For Industrial Use, Maximum: +125 )

Aging ±1ppm per 10year

±1ppm per 10year

±1ppm/per year ±1ppm/per year ±1ppm/per year

NX3215SANX2012SANX1610SA

Comparison of SMD Tuning Fork (32.768 kHz)

NX2012SA Mass Production Area of base 48 reduction Volume 66 reduction (Relative to NX3215SA) NX1610SA

Mass Production Area of base 66 reduction Volume 79 reduction

(Relative to NX3215SA)

Rice grain

Tuning Fork – Temperature curve

-420

-370

-320

-270

-220

-170

-120

-70

-20

-55 -35 -15 5 25 45 65 85 105 125

Freq

Dev

(ppm

)

Temp. (°C)

Max. -0.04ppm/°c² Typ. -0.035ppm/°c²

32.768 kHz Crystal with Low ESR

NDK propose Tunning Forks (32.768 kHz) crsytals with Low ESR (Equivalent Serial Resistor) This allows lower current consumption, or volume reduction.

Normal version "SA"

Low ESR Version "SE"

Typical +25°C

Max. -40/+85

Typical +25°C

Max. -40/+85

NX3215 37 kΩ 60 kΩ 20 kΩ 40 kΩ

NX2012 55 kΩ 80 kΩ 35 kΩ 50 kΩ

NX1610 60 kΩ 90 kΩ 50 kΩ 60 kΩ

Newly-introduced products for IoT & mobile market : Crystal Unit

AT Cut Wafer

Chip

Blank design applied photolithography technics

0

10

20

30

40

50

60

70

80

90

100

NX0806__ NX1006AA NX1210AB NX3225SA

Are

a (m

m2 )

Crystal model

Package area ratio

94% more reduced!Ref.

•  Blank design is applied the photolithography technics, then actualize the ultra compact crystal unit under high precision processing.

•  Photolitho. Blank can inspect as wafer level, it can minimize the loss in the assembly process.

•  It has the good electrical performance because photolitho. process minimize the affect of contamination.

Actual image

Ultra compact and thin crystal unit

Newly-introduced product for for IoT & mobile market : Crystal with Thermistor (TSX)

TSX external view TSX cross section view

Cross section plane Lid

Blank

Thermistor

Base

The TSX is unique crystal unit which is mounted the temperature sensing device along with the crystal blank. It calls “Temperature Sensing X’tal”, briefly calls “TSX” NDK adopts 1 room type TSX.

What is TSX ?

Controlling Crystal frequency over temperature becomes general need when searching compromise between TCXO (±0.5ppm over -40/+105oC) and stand-alone crystal (±12ppm over -40/+85oC).

Regarding crystal unit with thermistor, there are two type constructions. One is “1 room type”, another one is “H type”. NDK adopts “1 room type”.

1 room type (The reason which we choose this structure) Thermistor is included inside of ceramic package.

There is no risk of short circuit between thermistor and crystal’s pads, also no damage to thermistor.

Back side terminal can be large.   (Shock assuagement by solder) There is no possibility of risk re-melting solder when mount on PCB.

1room

H type

NDK’s advantage for TSX

0.1

1

10

2006 2008 2010 2012 2014 2016 2018 2020

Prod

uct v

olum

e [m

m3]

Year

Crystal with thermistor

NX2520SG 2.5x2.0x1.0

NX2016SF 2.0x1.6x0.65

NX1612SB 1.6x1.2x0.45

NX1210AC 1.2x1.0x0.50

Under development

NX1008** 1.0x0.8x0.50

not started yet

New !

Road map for Crystal unit w/ Thermistor (TSX)

NX1210A() H: Max. 0.45mm

NX1612SB H: Max. 0.45mm

NX2016SF H: Max.0.65mm

NX2016SD H: Max. 0.8mm

Nominal Freq. Range 38.4 to 76.8MHz 19.2 to 52MHz Inflection temp. point at

+XX°C(76.8M) at

+29°C(38.4M) at

+32°C(19.2M) Freq. Tolerance ±10ppm Temp. Characteristics ±12ppm (with reference to +30°C) Operating Temp. Range -30 to +85°C Equivalent Series Resistance

Max. 80Ω (38.4 to

76.8MHz)

Max. 60Ω (38.4 to

76.8MHz)

Max. 80Ω (19.2 to 24MHz)

Max. 60Ω (24 to 38.4MHz)

Drive Level 10μW Load Capacitance 7pF Thermistor Size 0.6x0.3x0.15(max.)mm 0.6x0.3x0.15(typ.)mm

TSX (Crystal Unit with Thermistor)

Under Development

TCXOs

TCXO’s circuit (typical)

3.Temperature Characteristics

0

5

10

Year

Volume (mm3) Now available Coming soon!

2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

NT3225S ■Small ■Freq:10~40MHz

NT2520S ■Ultra small ■Freq:13~52MHz

NT2016SA ■Ultra small ■Freq:13~52MHz

NT2016SB ■E/D Function ■Freq:13~52MHz

NT2016SC ■Dual output ■Freq:13~52MHz

NT2016SD ■Temp. senser output ■Freq:13~52MHz

NT1612AB ■Ultra small ■Freq:13~52MHz

(2003)

2017 2018

(NT1210xx) ■Ultra small

TCXO Roadmap on miniaturization (Package size)

Technical road map

Now

-

�

New Products Ultra Small Size TCXO

PAD No. Connection

#1 NC or GND(ground recommended)

#2 GND#3 OUTPUT#4 VCC

 

 

 

 

 

°

PAD No. Connection

#1 NC or GND(ground recommended)

#2 GND#3 OUTPUT#4 VCC

High Stability and Wide Temperature TCXO(NT2016SE)

Low G sensitivity

(Oscillator)

High stability (+/-0.5ppm@

-40/+125deg.C TCXO )

Low voltage (1.2vTCXO/SPXO)

Small size (1210TCXO) (0806Xtal)

Wide temp. (-40+125deg.C Oscillator)

(-40/+150deg.C Xtal)

Next technical

Target

Future technologies

NDK Automotive Quality

Automotive Quality Level

 Reliability � X’tal�AEC-Q200

� OSC�AEC-Q200 and Q100

High Stability

High Reliability

 Temperature Range � X’tal�-40 to +150 ℃

� OSC�-40 to +125 ℃

  Design/Production ���� Dedicated production line

for automotive application���� � OSC with High glade IC

 Inspection Standard � Special inspection for automotive products � OSC Temperature Test of all products. � Special inspection on all TCXO products for automotive. �� 1) Temperature Slope �� 2) Short term stability

NDK’s High-Q Synthetic Quartz Crystal makes NDK’s high stability and high accuracy products. High-� =

Infrared value 3million Min.

Market share of automotive crystal products

A WW result > 50%� For�Fuji�Chimera Research Institue, Inc.

��Comprehensive Study of In–Vehicle Electronic Devices & Components 2018 Vol.2�

Thank you very much

for your attention.