A Unique System Concept to Improve the Accuracy of … Parameter Analyzer** Keithley 4200 or Agilent...
Transcript of A Unique System Concept to Improve the Accuracy of … Parameter Analyzer** Keithley 4200 or Agilent...
A Unique System Concept A Unique System Concept to Improve the Accuracy to Improve the Accuracy
of Waferof Wafer --Level Level FlickerFlicker --Noise CharacterizationNoise Characterization
Andrej Rumiantsev, Stojan Kanev
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 2
Content
Motivation
Challenges for 1/f Measurements
New Probe System Concept
Verification Results
Conclusion
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 3
• Parameter extraction and statistical analysis are based on Accurateon-wafer measurement results:– DC (IV/CV) parameter– RF (S-) parameter– Low frequency noise (1/f)
• SUSS has to provide an invisible1 test environment to reach the best possible measurement Accuracy
1 Below the accuracy of the measurement instruments
SUSS Motivation
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 4
Measurement Accuracy means:• more efficient model extraction
• faster turnaround of the device models• less design iterations
• faster time-to-market• better return on investment (ROI)
� SUSS helps you1 to make more money1 With the best possible measurement accuracy
Our motivation is your motivation
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 5
Content
Motivation
Challenges for 1/f Measurements
New Probe System Concept
Verification Results
Conclusion
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 6
The ability to accurately characterize noise becomes a
fundamental requirement for design modeling!
Challenges for 1/f Measurements
• Noise is an unavoidable consequence of semiconductor
technology
• Since devices are becoming smaller and smaller, flicker noise
becomes more important
• Its impact on circuit performance is significantsignificant in today's low-
voltage, high performance, mixed signal, RF, deep submicron
designs
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 7
Challenges for 1/f Measurements
Passive system,Efficient shielding
�Manual prober�Expensive EMI-
shielded room
Accuracy Productivity
Big amount of data
�Automated system
vs.
New technologies do not allow compromises
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 8
Content
Motivation
Challenges for 1/f Measurements
New Probe System Concept
Verification Results
Conclusion
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 9
New Probe System Concept
Available 1/f Instrumentation:
• ProPlus solution w. 9812B and
NoisePro software*
• Solution based on SR SR570
(current) pre-amplifier and Agilent
IC-CAP**
*[NoisePro], ** [Blaum 2001]
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 10
New Probe System Concept
The benefits of the new concept:
1. Eliminates the need for the expensive EMI-shielded room
2. Improves measurement accuracy
3. Increases productivity
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 11
1. Expensive EMI-Shielded Room
Faraday cage for the DUT and all sensitive system components
���� Improved shielding efficiency
FaradayCageNo mechanical
feed-throughs
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 12
2. Measurement Accuracy
• Convert automated system into electrically passive manual station:
– Turn off motors during the measurement circle
– Lock the chuck position
• Improved grounding to avoid ground loops
���� Minimized AC noise Picture: [Blaum, 2001]
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
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2. Measurement Accuracy (cont.)
• The use of special ultra low-noise cables• Reduced cable length
���� Optimized cabling
D
BG
S
PreAmpCritical
Signal Paths
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 14
3. Productivity
• Automated measurement and parameter extraction– Integration with industry standard measurement
and modeling software
• Measurement at different temperatures– Automated thermal management
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 15
EMI Shielding: ProbeShield
1. Pre-Amplifier ”inside” the EMI-shielded environment2. Shortest possible low-noise triaxial cables for the Drain
& Gate connection
SD GB
EMC2 Guard™
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 16
• Shortest possible low noise cables for the low-pass filter• RF pad design is recommended
SR570 Pre-Amplifier ProbeShield “inside“ (battery driven): The same EMC2 Guard Option � different cables
EMC2 Guard™
EMI Shielding: ProbeShield
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 17
Fully grounded probes are obligationFully grounded probes are obligationGround connecting close to the DUTGround connecting close to the DUT
Ultra low noise triaxial cables (part of EMCUltra low noise triaxial cables (part of EMC 22Guard)Guard)
DrainDrain
GateGate
Cabling : A Close Look
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 18
Content
Motivation
Challenges for 1/f Measurements
New Probe System Concept
Verification Results
Conclusion
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 19
EMI-Shielded Effectiveness
• EMI-certified test room
• Rohde & Schwarz EMI analyzer
• Measurements for different conditions:
– Front
– Rear
– Side
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 20
EMI-shielded effectiveness � >25dB from 1kHz to 70kHz
Reference measurement Front measurement (1) Side measurement (2) Rear measurement (3)
EMI-Shielded Effectiveness (cont.)
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 21
• SUSS PA300PS ProbeShield w. EMC2
Guard option • ProPlus solution• Chamber Noise• pMOS FET• SiGe HBT
Experimental Setup
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 22
System Configuration
♦ Noise floor ~10-24 A2/Hz
♦ 1 Hz…102.4 kHz (1MHz*)
SUSS PA300PS ProbeShield®Completely EMI Shielded Design
4x Triaxial or RF Probes
PC withPC withNOISEpro &ProberBenchSoftware
cabl
e co
nnec
tors
SMU’s
Noise Output
GPIB Bus
SD GB
LAN Interface to ProberBench Electronics
Dynamic Signal AnalyzerDynamic Signal Analyzer
Agilent 35670A or Stanford Research SR7809812B Noise Analyzer
Controller Unit
Pre-Amplifier (Amplifier / Filter) Unit
Semiconductor Parameter Analyzer**Semiconductor Parameter Analyzer**
Keithley 4200 or Agilent 4156x
DUT
* If use Agilent Vector Signal Analyzers 89610Aor 89410A
.dll
SUSS NOISEpro driver available
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 23
Chamber Noise Verification using NoisePro Test
< -120dB
Chamber Noise Verification
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 24
Verification with the DUT
• DUT type: pMOS FET
• Same bias conditions
• Same temperature conditions
• Old probe system configuration:– Preamplifier outside the EMI-shielded environment
• New probe system concept: – Preamplifier inside the ProbeShield EMC2
chamber
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 25
Verification with the DUT
Old system concept(PreAmp “outside”)
New system concept(PreAmp “inside”)
10-22
10-25
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 26
Verification with the DUT
• DUT type: SiGe HBT
• New probe system concept
• Different bias conditions
• Different temperature conditions
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 27
SUSS confidential TC =25°C (ON)
VCE = 1.5V
Bias 1 ���� IB = 40nA
Bias 2 ���� IB = 500nA
Bias 3 ���� IB = 8µA
10-20
Line
Verification with SiGe HBT
Under different biases
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 28
1.0e1 1.0e2 1.0e3 1.0e4 1.0e5Frequency (Hz)
1.0e-26
1.0e-25
1.0e-24
1.0e-23
1.0e-22
1.0e-21
1.0e-20
1.0e-19
1.0e-18
1.0e-17
1.0e-16
Sic
(A²/H
z)
1.0e1 1.0e2 1.0e3 1.0e4 1.0e5Frequency (Hz)
1.0e-311.0e-301.0e-291.0e-281.0e-271.0e-261.0e-251.0e-241.0e-231.0e-221.0e-211.0e-201.0e-191.0e-181.0e-17
Sib
(A²/H
z)
Ae/Ac/Ab/T=10/10/10/25
100°C 150°C
VCE = 1.5V Bias 1 ���� IB = 10nA
Bias 2 ���� IB = 40nA Bias 3 ���� IB = 400nA
Bias 4 ���� IB = 800nA Bias 5 ���� IB = 2µA
Bias 6 ���� IB = 20µA
Under different biases and temperatures
Verification with SiGe HBT
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 29
Content
Motivation
Challenges for 1/f Measurements
New Probe System Concept
Verification Results
Conclusion
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 30
Conclusion
New Probe System concept was introduced• EMC2 Guard
– Save investment costs
• Increased measurement accuracy– More efficient modeling extraction
• System automation for unattended test– Faster time to data
• Turn-key solution – Seamless integration of the industry standard
measurement and modeling solution (such as ProPlus)
A Unique System Concept to Improve the Accuracy of Wafer-Level Flicker-Noise Characterization
A. Rumiantsev, S. Kanev, MOS-AK 2008 31
References[1] M. Valenza, A. Hoffmann, D. Sodini, A. Laigle, F. Martinez, and D. Rigaud, "Overview of the impact of
downscaling technology on 1/f noise in p-MOSFETs to 90 nm," IEE Proc. Circuits, Dev. and Systems, vol. 151, no. 2, pp. 102-110, 2004.
[2] "NoisePro 1/f noise characterization and modeling system," Product Brochure, ProPlus Design Solutions, Inc., San Jose, CA, USA., 2007.
[3] G. M. Balim, M. G. Levina, and S. S. Smakhtin, "Nonequilibrium 1/f noise and hardware reliability," in Proc. 1st IEEE Int. Conf. Circuits Systems Communications, 2002, pp. 396-399.
[4] A. P. van der Wel, E. A. M. Klumperink, S. L. J. Gierkink, R. F. Wassenaar, and H. Wallinga, "MOSFET 1/f noise measurement under switched bias conditions," IEEE El. Dev. Lett., vol. 21, no. 1, pp. 43-46, 2000.
[5] A. K. Kirtania, M. B. Das, S. Chandrasekhar, L. M. Lunardi, G. J. Qua, R. A. Hamm, and L.-W. Yang, "Measurement and comparison of 1/f noise and g-r noise in silicon homojunction and III-V heterojunction bipolar transistors," IEEE Trans. El. Dev., vol. 43, no. 5, pp. 784-792, 1996.
[6] A. Blaum, O. Pilloud, G. Scalea, J. A. V. J. Victory, and F. A. S. F. Sischka, "A new robust on-wafer 1/f noise measurement and characterization system," in Proc. Int. Conf. Microelectronic Test Structures, 2001, pp. 125-130.
[7] "SR560 - DC to 1 MHz voltage preamplifier," Data Sheet, Stanford Research Systems, Inc., Sunnyvale, CA, USA.
[8] "SR570 - DC to 1 MHz current preamplifier," Data Sheet, Stanford Research Systems, Inc., Sunnyvale, CA, USA.
[9] "Model 4200-SCS. Semiconductor Characterization System," Product Brochure, Keithley Instruments, Inc., Cleveland, Ohio,USA, 2005.
[10] "SR780 - 100 kHz 2-channel dynamic signal analyzer," Data Sheet, Stanford Research Systems, Inc., Sunnyvale, CA, USA, 2006.
[11] “EMI/RFI Shielding Effectiveness of SUSS ProbeShield Technology,” Technical Brief, SUSS MicroTecTest Systems GmbH, Sacka near Dresden, Germany, 2006.