A unique 3D Silicon Capacitor with outstanding ...meptec.org/Resources/11 - IPDIA.pdf ·...
Transcript of A unique 3D Silicon Capacitor with outstanding ...meptec.org/Resources/11 - IPDIA.pdf ·...
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Catherine Bunel
R&D Director
A unique 3D Silicon Capacitor with outstanding
performances in terms of DC leakage and reliability performances .
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Agenda
• Introduction
• Ipdia core technology
• Application overview
• The IPDIA 3D Silicon capacitor
– Performances
– Reliability
• Conclusion
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Introduction
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• Miniaturization is a key growth driver
• Reliability and performance are key
considerations for the Medical
• Need to provide cost effective
productsCustomers Satisfaction
Cost of solutions
Miniaturization
Performances
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Single IPD die
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A highly efficient way to integrate several passive components such as
resistors, capacitors,inductors, ESD diodes in a single die.
IPDIA Technology
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PICS process
Passive Integration Connecting Substrate
3D Capacitor
Silicon Substrate
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e
SC S0
Ipdia Core Technology
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Ipdia Core Technology
This Technology holds the world record
in performance with 250nF/mm² in production
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Wireless
Smart card
Medical
Sensor
8
e-metering
High Brightness LED protection
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Billions of Products using IPDIA
technology
Military avionic
Oil exploration
Automotive
Pacemaker
Brain
stimulation
Learning
pacing
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After, 1 component
49mm2, h=0.85mm
25 mm
7 mm
9
Before 2 active dies+ 100 components
PCB=600mm2, h= 2mm
PICS Amazing miniaturization
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25 mm
Band Filter
DC feeds
Transceiver
Rx balun
Tx balun
PA matching
Decoupling,
PLL filter
PA
Magnification
Zoom on SIP
in HVQFN56
7 mm
10
PICS Amazing miniaturization
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E-Pill , temperature sensor
WLP module including :
• 3 active dies flipped over an IPD Substrate
• 96 SMD components are integrated and
composed of RF capacitors, decoupling
capacitors, resistors, inductors, and PIN diode
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PICS Amazing miniaturization
Sen
so
r
µCTRL
TX
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6.4
5 m
m
8 m
m
14 mm
11.2 mm
112 mm²
72 mm²
1.6mm height
1.2mm height
SMD & PCB technology
PICS technology
Complete RF Module
– RF Transceiver
– XO
– SAW Filter
– 400MHz & 2.4GHz Matching network
with integrated coils
– Decoupling capacitances
Using PICS technology :
40 % area decrease !
25 % height decrease !
PICS Amazing miniaturization
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A breakthrough solution for:
1. High reliability Industries such as Medical, Avionics, Defense …etc.
2. High Temperature industries such as Oil and Gaz
Explorations, Geothermal energy …etc.
SILICON Capacitors as Pin to Pin replacement of
Ceramic and Tantalum Capacitors
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Capacitor array
Application PCB
480 m { 250 m
230 m
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Low Profile Silicon Capacitor (LPSC)
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Typical 100nF Capacitor Thickness
Volume comparison of 1206 Case size capacitors
6 Times smaller
More than 2 times smaller
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Oustanding performance for High
Temperature applications
For X7R 402 100nF capacitors the cumulated derating @ 200 C is -77%
For 3D Silicon capacitor , it is < 2%
Extreme stability
Exceptional low derating
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IPDIA 3D Silicon Capacitors
DC Voltage Stabilitytt
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IPDIA 3D Silicon Capacitors
Temperature stability
84.0
86.0
88.0
90.0
92.0
94.0
96.0
98.0
100.0
102.0
104.0
50 100 150 200 250 300
Temperature (°C)
Cp
(n
F)
PCM1PCM2PCM3PCM4PCM5
~50 ppm/ C[85-250 C]
100 nF , Capacitance Measurements @ 3V
On wafer 5 areas
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0.0E+00
5.0E-10
1.0E-09
1.5E-09
2.0E-09
2.5E-09
3.0E-09
3.5E-09
4.0E-09
4.5E-09
5.0E-09
0 20 40 60 80 100 120
Time (s)
Ip (
A)
Ip 85
Ip 200°C
Ip 250°C
Ip 275°C
Ip 300°C
I(120s) < 2 nA @ 300 C
DC leakage current (pA @ 3V) vs
Time & Temperature
C= 100nF I(120s) < 20pA @ 25 C
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DC leakage current (A) ,25°C
C= 12µF
100,0E-12
1,0E-9
10,0E-9
100,0E-9
1,0E-6
10,0E-6
100,0E-6
1,0E-3
10,0E-3
0 20 40 60 80 100 120
Leakag
e C
urr
en
t (A
)
Time (s)
IL(5v)
IL(3,6v)IL(120s) = 4 nA
IL(120s) = 55 nA
Ta capacitors
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Reliability
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0,00E+00
1,00E+00
2,00E+00
3,00E+00
4,00E+00
5,00E+00
6,00E+00
X7R Ta PICS0
50000
100000
150000
200000
250000
300000
350000
400000
450000
X7R Ta PICS
Failure In Time
Predicted MTTF ( yrs)
Maximum Operating Voltage @ 37 C
50% Operating Voltage @ 85 C
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Reliability
2
187
491
0
100
200
300
400
500
600
3D-Si Capacitor X7R Tantalum
Failu
re R
ate
'p
pm
'
Projected Failure Rate in 10 Years
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The 3D Capacitors have the
lowest Failure rate compared to
Tantalum & X7R capacitors
Only 2 Units failed on a
Million after 10 Years
operation time
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Conclusion
Passive integration technologies bring differentiation and
miniaturization
IPDIA 3D Silicon Capacitor has many advantages over the
other types of capacitors :
Very high stability .
Withstands temperature up to 300°C
Extremely low failure rate .No catastrophic failure .No burning test
needed.
Very Low leakage . By replacing Ta & MLCC capacitors with
Silicon Capacitors, Operating Time could be increased by more
than 30.
It’s also a smart way to reduce the application volume and increase
the IP protection level.
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We want to continue to make the
difference
Can’t do it alone as an SME…
IPDiA and its partners launched a 4 year cooperative R&D
program
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2427/09/2011
Thanks for your attention