A Comprehensive Overview on Today`s Ceramic … · EMPC Rimini June 15 – 18 2009 Franz Bechtold,...

EMPC Rimini June 15 – 18 2009 Franz Bechtold, VIA electronic GmbH, Hermsdorfwww.via-electronic.de

A Comprehensive Overview on Today`s Ceramic Stubstrate T echnologies

17th European Microelectronics and Packaging Conference

„ A Comprehensive Overview on Today`s CeramicStubstrate Technologies“

Rimini, 16.06.2009 Franz Bechtold

VIA electronic GmbH, Hermsdorf

www.via-electronic.de



• Introduction

• Ceramic Substrates as Fired

• Multilayer Substrates HTCC and LTCC

• Ceramic Substrates between Silicon and PCB

• Market for Hybrid Circuits

• Applications Fields for Ceramic Based Hybrid Integrated Circuits

• Materials, Board and Technology Providers

• Perspectives and Challanges

• Conclusion and Acknowledgement

Content



Introduction

Thickfilm Alumina Substrates

ZrO2 Stabilised Alumina Substrates

Aluminum Nitride Substrates

Direct Bonded Copper Substrates

Thickfilm Technology

HTCC Technology

LTCC Technology



Ceramic Substrates As Fired

ZrO2 stabilised Al2O3 Substrate AlN substrates

Thermomechanical stability

Flexural strength

Elasticity.

Cabable for DBC

low thickness

Thermal Conductivity

Si matched TCE

Capable for Thickfilm

Capable for DBC

Courtesy of Ceramtec



Ceramic Substrates As Fired

Standard Substrates, extruded and dry pressed devices

Ceramic tubes for heater elements, dry pressed alumina pressure sensor membranes and micro cooler components are applied in special applications in harsh environment.

Courtesy of Ceramtec



Multilayer Substrats HTCC and LTCC

HTCC

Material Systems not available

High temperature ceramics with refratory metal inks

Full system capability achieved by Ni/Au Plating

Cofire and postfired resistors not possible proprietary material

LTCC

Low temperature material systems with noble metal conductor inks available.

(DuPont, Heraeus, Ferro, ESL, CeramTec)

High material complexity with full system capability including resistors

SME Foundries on the open Market (MSE, Selmic, C-Mac and VIA)

Captive materials and processes inside big entities (Bosch, Epcos)

Proprietary Materials and processes in big enterprises

Tape blanking

Via punching

Via filling

conductor printing

Stacking

Lamination

scribing/cerving

Burnout, Cofiring

Singulation



Multilayer Substrats HTCC and LTCC

HTCC

Thermal Conductivity 20W/m*K

Mechanical strength 400 MPa/mm

Brazing strength > 50 N/mm2

Condctor resistivity inside >10 mOhm/sq

Good RF Performance

Integrated resistors not possible

LTCC

Thermal conductivty 3 W/m*K

Mechanical Strenght 200 MPa/mm2 Brazing strength > 30 N/mm2

Conductor resistivity <5 mOhm/sq

Very good RF Performance

Integrated resistors possible



Ceramic Substrates between Silicon and PCB

Typical NRE Costs :

•1.000€ for PCB•5.000 € for thickfilm board•10.000 to 15.000 € for HTCC and LTCC •Up to 250.000 € ASICS.

Typical Material Content (per 150cm2):

• almost pure silicon for Asics, • low priced plastics together with a few glass fibres and 5g of Cu for PCB • expensive green ceramic sheets and about 3g of noble metals for

conductors and resistors in the case of LTCC • and a few less expensive Alumina sheets together with about 3g of

refractory metals for the conductor.




132614101,0100.000 Panels

163216121,510.000Panels

204020152,01000 panels

SiliconLTCCHTCCThickfilm

PCB

Table 1: Average Material costs in €

200262650,50100.000 Panels

300323291,0010.000Panels

5004040151,501000 panels

SiliconLTCC

HTCCThickfilm

PCB

Table 2: Average Process cost




2135240151,50100.000 Panels

3166448212,5010.000Panels

5208060303,501000 panels

Silicon

LTCC

HTCC

Thickfilm

PCB

Table 4: Total costs at different volumes

0,360,350,270,600.06100.000 Panels

0,570,440,330,860,1010.000Panels

1,280,630,471,400,181000 panels

Silicon

LTCC

HTCC

Thickfilm

PCB

Table 5: Total cost per circuit60.000k15000k15.000k2.500k2.500k100.000

Panels

6.000k1.500k1.500k250k250k10.000Panels

600k150k150k25k25k1000 panels

SiliconLTCCHTCCThickfilmPCB

Table 6: Minimum number of circuits to be realised(yield losses not included)




1252030,1Thermal ConductivityIn W/m*K (RT to 400°C)

100350210-Flexural strength In Mpa

37660290

TCE z < tgTCE z > tg

37616Thermal Coefficient of Expansion(TCE) x,y

-15>4040Break down voltageIn V/µm

106>1012>1012>1011Volume resistivityIn Ohm*m (RT)

>20>20>203Guaranteed Life time in years

SiHTCCLTCCPCBTable 7: Technicalcharacteristics

Technical Performance




<10-8<10-8<10-8>10-3Hermeticity in Torr

000<0,3Water absorptionIn %

L, R, CL L, R, CLIntegration of Passive components

2200200200Line pitch

--

0,00040,001

0,0020,005

0,0250,020

Loss Tangent 1MHzLoss Tnangent 10GHz

12,0-

9,89,0

7,857.83

4,7-

Dielectric Const. 1MHzDielectric Const. 10GHz

<30<15<5<1Conductor ResistanceIn mOhm/square

SiHTCCLTCCPCBTable 7: Technicalcharacteristics

Technical Performance



Market for Hybrid Circuits

Market for Hybrids, ZVEI Yearly Report 2008, Handbuc h der Leiterplattentechnik,2003

European market: 1.200 Bn €

Regional distribution:

Germany 48%

France 14%

UK 14%

Benelux 9%

Italy 5%

Scandinavia 5%

Others 5%

Distribution to Market sections:

Automotive: 40%

Telecom: 30%

Industrial: 15%

Military, Avionic: 10%,

others: 5%

.

Technology Distribution:

Thick film with 38%

LTCC with 36,5%

DCB 21%

Thin film 4,5%

The captive market is about 2/3 of the total market



Application Fields for Alumina Based Hybrids

•Robustness •aggressive environment•hot oil

•high degree of miniaturisation •printed resistors on top of the dielectric •high reliability in harsh envionment

Oil sensorDual Inline Hybrid Circuit for power stations

Courtesy of Siegert electronicCourtesy of Siegert electronic




•Robustness •Matched TCE Component/Sustrate

•Chip on Board •High Power, high Currency •Thick wire, thick Silver

Yarn tension sensor pricnipleSmart Power Gear Controll Unit

Courtesy of Micro HybridCourtesy of Siegert electronic




•Thickfilm integrated Sonsor•Electronic close to the sensor

•Long term stable Youngs Modulus •Stress free packed pressuer sensor

Sensor System, Open FrameYarn tension sensor system

Courtesy of Micro HybridCourtesy of Micro-Hybrid



Application Fields for Aluminum Nitride Based Hybrids

•Up to 1600 V and 24 A•200W/m*K•Glop top, silicone and plastic package

•high power Dissipation •high heat conductivity•Low cost sealing

H-Bridge Hybrid Circuit, Open FrameH-Bridge Hybrid Circuit

Courtesy of Lust HybridCourtesy of Lust Hybrid




•On ZrO2 stabilized 0,25mm Alumina•On Aluminum Nitride•Double sided, Cu Vias•Excellent thermal properties

•Silicon Matched TCE 3ppm•260x15x7mm size•Low weight

Direct bonded Copper 100 to 300µmSatellite CCD Camera Board

Courtesy of Electrovac Curamik:Courtesy of Anceram



• 300µm Cu lines and integrated heat sinks• 180 W/m*K thermal conductivity•Double sided, Cu Via technology• low cost 250mm ZrO2 stabilised Alumina

Hermetically sealed DBC on AlN

Courtesy of Electrovac Curamik:




HTCC Applications

• Hermeticity• Robustness•High density 40µm internal lines•Very small outline

• miniaturisation, reliability•15 layers, 20.000 vias •75µ lines and vias

Tosa/Rosa Fibre optic transmissions Aerospace Multichip Module 50x50mm

Courtesy of Egide:Courtesy of MDBA-France and Egide



LTCC Material System Background

5,66,47,04,55,8α [ppm K-1](25-300°C)

TCE

≤ 0,4≤ 0,4≤ 0,3≤1,41- 20 GHz

AgAgAgAgConductor

Insertion loss [dB inch -1]

< 2< 2<1520-40 GHz

≤ 2151-20 GHz

≤ 1≤ 4< 2< 1< 2≤ 1 GHz

Dielektric losses tan δδδδ [10-3]

4,65,97,4-20-40 GHz

9,17,4-1-20 GHz

9,14,75,97,57,4≤ 1 GHz

Permittivity εεεε

CT 2000Heraeus

41110ESL

A6Ferro

943DuPont

951DuPont

Commercial LTCC materials



LTCC Material System Background

20E = 7Inductor, capac.

Co/postMetallisation

1 (tr.)10 to 10MOhm

ResistorpostfireRuO2-Bi2O3

5010 to 10kOhm

ResistorBuriedRuO2-Bi2O3

30Not qualifiedResistorCofireRuO2-Bi2O3

InsulatorPostfireDielectric glass

Solder stopCofireDielectric glass

203/30 mOhmWire/solderPostfireAg, AgPd

203/30 mOhmWire/solderpostfireAu, AuPtPd

203/30/3 mOhm

Wire/solder/bond

cofireAg/AgPd/Au

203/30 mOhmWire/soldercofireAg/AgPd

203/30 mOhmWire/soldercofireAu/AuPt

Tol.%propertiesFunctionProcessMaterial

Table 9: Material System 951 DuPont



High Volume LTCC Applications

• Robustness•Under the Hood•Close to the working unit

• miniaturisation, reliability, Costs•-40/+155°C•50g

ABS/ESP8 Controller Gear Car Controll (source: W.C. Heraeus)

Courtesy of Bosch:Courtesy of Siemens-VDO




• Robustness•Under the Hood•Close to the working unit

• miniaturisation, reliability, Costs•-40/+155°C•50g

Transmision Controll Unit Steer by Wire

Courtesy of Bosch:Courtesy of Bosch




• miniaturisation•reliability, Costs• RF capability• K20/K8 Technology• passive integration

Front end for mobile phones

Courtesy of Epcos

Chip&Wire bondingFlip Chip

Surface MountingTechnology

Glob Top



Low Volume LTCC Applications

• Vaccum cmpatible• Spectroscopic neutral • Thermal management

• Reliability• Modularity• Flexibility

Fully integratedd X-Ray detector SystemCustomised LTCC Packages for Sensors

Courtesy of Ketek and VIACourtesy of VIA electronic



Low Volume LTCC Applications

• Miniaturisation• RF capabiltiy• Passive integrated RF components

T/R Modules (Source: Workshop MakroNano2006)

Courtesy of Ericsson



Materials Provider

Thickfilm inksLTCC material systems

DuPont

Thickfilm inksLTCC material systems

Heraeus

AlN substrates thinfilm/thickfilmActive brazed Copper

AnCeram

Al2O3 substrates 96%, 99%, Al2O3 ZrO2 stabilised, Al2O3 dry pressed and extruded parts AlNSubstrates thinfilm/thickfilm LTCC dielectric tapeLaserscribing and cuttingSingle sided cofired metallisation

CeramTec

Materials and servicesTable 10Supplier



Technology Provider

LTCCVIA electronic

ThinfilmSiegert TFT

ThickfilmSiegert Electronic

Thickfilm, LTCCSelmic

ThinfilmReinhardt Microtech

Thickfilm, ThinfilmRadeberger Hybridelektronik

Thickfilm, LTCCMicro System Engineering

ThickfilmMicro Circuit Engineering

ThickfilmMicro-Hybrid

ThickfilmMicrotel

ThickfilmMicrodul

ThickfilmLust

ThickfilmLewicki

ThickfilmHybrid Electronic

ThinfilmHightec

LTCCEpcos

HTCCEgide

Direct bonded Copper Curamik

Thickfilm, LTCCC-Mac

Thickfilm, ThinfilmAdvanced Microelectronics

ThickfilmAB Mikroelektronik

Technology servicesTechnology Provider



Perspectives and Challanges

High currency conductor, micro cooler, high temp.

High power/high complexity integration

Energy efficiency

no XY shrinkage, excellent planarity and accuracy

Integration of optical and electrical conductors

MOEMS Packaging

TCE matching of Ceramic to Si, no XY shrinkage

3D integration, hermeticity, Wafer level packaging

MEMS Packaging

New and adapted materials, new and adepted processe

3D interconnection, passive integration, thermal management

System in Package

Flatness, TCE matching of Ceramic to PCB,High pin count, QFP, LGA, BGA

Heterogeneous Integration

Chemical performanceBiocompatibilityFluidic interfaces

Lab on Chip, integrated fluidic, integrated reactors and sensors

Biotechnology, chemical sensors

Technical RequirementsChallangeOpportunity



R&D Roadmaps

Microsystems and sensors are constantly increasing and require new packaging solutions.R&D efforts are put into innovative

LTCC technology DBC high temperature thickfilm

. The R&D road maps for LTCC ceramic are dominated

cost improvements at process level(self constrained sintering, high resolution screen printing, micro vialaser drilling, wafer level packaging)

cost improvements at integration leve(new functional materials like high k, low k, high permeability and TCE graduation and cost improvements by combined technologies



R&D Roadmaps

Tungsten/Aluminumnitride Interface•Tape casting•Tungsten ink preparation• Cofiring

AlN Multilayer System development

Courtesy of Fraunhofer IKTS



Conclusion

Ceramic substrates provide economic and ecologic solutions at low, medium and high volumes for high reliability applications.

Increasing power and operating temperatures of the electronic devices needs well adjusted thermal properties of the ceramic board technology selected.

Increasing frequency of the electronic devices arrives to the request for passive integration of RF functions and thermal management



Acknowledgement

This presentation was supported by:

Dr. Knuth Baumgärtel, Micro-Hybrid, HermsdorfDr. Dieter Brunner, Anceram, Bindlach, Walter Distler, Siegert electronic, CadolzburgDr. Erwin Effenberger, ZVEI, FrankfurtDr. Marco Fritsch, Fraunhofer IKTS, DresdenThomas Heise, Ceramtec, Marktredwitz Dr. Sebastian Brunner, Epcos, DeutschlandsbergMichel. Massiot, Egide, BolleneChristina Modes, W.C. Heraeus, HanauWalter Röthlingshöfer, Bosch, ReutlingenDr. Jürgen Schulz-Harder, Electrovac Curamik, Ralf Stötter, Ketek, MünchenThomas. Walther, Lust Hybrid, Hermsdorf



Thanks for your Attention

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