9S6E8N9Q8A

Information

SURPASS hiT 7550 2.05

Technical Description (TED)

A42022-L5936-C51-1-7618

2 A42022-L5936-C51-1-7618

Technical Description (TED) InformationSURPASS hiT 7550 2.05

f Important Notice on Product SafetyElevated voltages are inevitably present at specific points in this electrical equipment. Some of thecircuit parts may also have elevated operating temperatures. Systems with forced ventilation haverotating items.

Non-observance of these conditions and the safety instructions can result in personal injury or in prop-erty damage.

The system complies with the standard EN 60950 / IEC 60950. All equipment connected has to complywith the applicable safety standards.

Mount the systems in areas with restricted access only. Only trained and qualified personnel mayinstall, operate, and maintain the systems.

The same text in German:

Wichtiger Hinweis zur Produktsicherheit

In elektrischen Anlagen stehen zwangsläufig bestimmte Schaltungsteile der Geräte unter Spannung.Einige Teile können auch eine hohe Betriebstemperatur aufweisen. Anlagen mit Zwangsbelüftunghaben drehende Teile.

Eine Nichtbeachtung dieser Situation und der Warnungshinweise kann zu Körperverletzungen undSachschäden führen.

Das System entspricht den Anforderungen der EN 60950 / IEC 60950. Angeschlossene Gerätemüssen die zutreffenden Sicherheitsbestimmungen erfüllen.

Die Anlagen dürfen nur in Betriebsstätten mit beschränktem Zutritt aufgebaut werden. Die Anlagendürfen nur durch geschultes und qualifiziertes Personal installiert, betrieben und gewartet werden.

Trademarks:

All designations used in this document can be trademarks, the use of which by third parties for theirown purposes could violate the rights of their owners.

Copyright (C) Siemens AG 2003

Issued by the Information and Communication Networks GroupHofmannstraße 51D-81359 München

Technical modifications possible.Technical specifications and features are binding only insofar asthey are specifically and expressly agreed upon in a written contract.

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InformationSURPASS hiT 7550 2.05


This document consists of a total of 178 pages. All pages are issue 1.

Contents

1 Notes on the SURPASS hiT 7550 2.05 Documentation . . . . . . . . . . . . . . . 111.1 Preliminary Remarks concerning this Release . . . . . . . . . . . . . . . . . . . . . . 111.2 Customer Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111.3 Complementary Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121.4 Symbols Used in the Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131.4.1 Symbol for Warnings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131.4.2 Symbols for Notes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131.4.3 Symbols for Menu Displays and Text Inputs. . . . . . . . . . . . . . . . . . . . . . . . 131.4.4 Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131.5 Notes on Licensed Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131.6 Form for your Ideas, Proposals and Corrections . . . . . . . . . . . . . . . . . . . . 14

2 System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172.2 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182.2.1 Network Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182.2.2 Compatibility with Existing Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182.3 SURPASS hiT 7550 2.05 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202.3.1 Transmission Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202.3.2 Optical Supervisory Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212.3.3 Optical Safety Mechanisms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232.3.3.1 Automatic Power Shutdown Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . 232.3.3.2 Automatic Power Reduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252.3.3.3 Additional APSD/APR Safety Mechanisms. . . . . . . . . . . . . . . . . . . . . . . . . 262.3.4 Optical Performance Monitoring & Control . . . . . . . . . . . . . . . . . . . . . . . . . 272.3.4.1 Optimal EDFA Gain Setting and Fast Gain Control . . . . . . . . . . . . . . . . . . 272.3.4.2 EDFA Output Power Control (Slow Gain Control) . . . . . . . . . . . . . . . . . . . 272.3.4.3 Power Equalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282.3.4.4 EAM4 Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282.3.4.5 Client Signal Ageing, Drop Control, Add Channel . . . . . . . . . . . . . . . . . . . 282.3.4.6 Constant Pump Current Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 292.3.4.7 Tilt Analyzer and Adjustable Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 292.3.4.8 ASE Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 302.3.4.9 Link Control Actions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 302.3.4.10 Channel Up- and Downgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332.3.4.11 Optical Layer Provisioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332.3.4.12 Optical Layer Supervision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332.3.4.13 Optical Performance Analyzer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 342.3.5 Optical Network Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 382.3.5.1 The Telecommunication Network Management System . . . . . . . . . . . . . . 382.3.5.2 Integrated Domain management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 392.3.6 Element Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 402.3.7 Connection to Network Management Systems. . . . . . . . . . . . . . . . . . . . . . 422.3.7.1 Information Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

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2.3.7.2 Communication Stacks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 432.3.7.3 Communication Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 442.3.8 EOW Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 472.3.9 User Data Channels (sV.11) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 482.3.10 Telemetry Interface (TIF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 492.3.11 Overview of System Benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

3 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 533.1 Frequency/Wavelength Bands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 533.1.1 “C” and “L” Wavelength Bands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 533.1.1.1 40 Blue Wavelengths in the C Band (Subbands C1/C2 and C5/C6) . . . . . . 543.1.1.2 40 Red Wavelengths in the C Band (Subbands C3/C4 and C7/C8) . . . . . . 553.1.1.3 40 Blue Wavelengths in the L Band (Subbands L1/L2 and L5/L6) . . . . . . . 553.1.1.4 40 Red Wavelengths in the L Band (Subbands L3/L4 and L7/L8) . . . . . . . . 573.1.2 Interleaver Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 573.2 Functional Overview of the NE Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 603.2.1 OTT(U) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 603.2.1.1 Optical Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 603.2.1.2 Four Stage Design from 1 to 160 Channels. . . . . . . . . . . . . . . . . . . . . . . . . 623.2.1.3 Multiplexer Modularity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633.2.1.4 Multiplexer Equipping. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 643.2.2 OLRU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 653.2.2.1 Optical Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 653.2.2.2 Scalability of DWDM Capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 663.2.2.3 Amplifier Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 673.2.2.4 Multi-Stage Amplifier Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 673.2.2.5 Amplifier Pump Modularity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 683.2.2.6 Raman Amplification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 693.2.3 OADM(U) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 713.2.3.1 Optical Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 713.2.3.2 Remotely Configurable 20% OADM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 733.2.3.3 Back-to-Back 100% OADM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 743.2.3.4 Connectivity Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763.2.3.5 OADM Cascadability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763.2.4 CCU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 773.2.5 OADM Ring Closure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 783.2.6 Networking with OADMU/OTTU. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 793.3 Functional Overview of the Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 803.3.1 Modules used for NEs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 803.3.2 MCU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 833.3.3 MIBS Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 843.3.4 SAB Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 853.3.5 SABM Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 863.3.6 OSCT Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 863.3.7 SMU2 Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 883.3.8 OPA Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 903.3.9 OLI Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 913.3.10 OLI PUMP Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

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3.3.11 RPUMP Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 963.3.12 OMD Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 963.3.13 OM/OD Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1003.3.14 CAD2 Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1023.3.15 EAM4C or EAM4L Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1033.3.16 OCA / OCAS / OCS Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1043.3.17 UDCM Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1063.4 Synchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1073.5 Control and Monitoring via the Element Manager. . . . . . . . . . . . . . . . . . . 1083.5.1 Access Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1083.5.2 User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1093.6 Control and Monitoring via Network Management System. . . . . . . . . . . . 110

4 Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1114.1 Racks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1114.1.1 Mechanical Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1114.1.2 Rack and Subrack Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1114.1.3 Connector Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1154.2 Subracks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1164.2.1 Subrack Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1164.2.2 DCM Trays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1204.3 Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1214.4 System Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1214.4.1 OTT Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1224.4.2 OLR Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1234.4.3 OADM Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1244.4.4 CCU Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1254.5 Display and Operating Elements on Equipment . . . . . . . . . . . . . . . . . . . . 1264.5.1 NE Alarm Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1264.5.2 SAB Boards and Subrack Address Setting. . . . . . . . . . . . . . . . . . . . . . . . 1264.5.3 Module Front Panel Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

5 Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1295.1 Fault Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1295.2 NE Software Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1325.3 Management PC Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

6 Commissioning, Operation and Maintenance . . . . . . . . . . . . . . . . . . . . . . 1356.1 Commissioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1356.2 Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1356.2.1 Operating and Display Elements of the Modules . . . . . . . . . . . . . . . . . . . 1356.2.2 Operation with an Operating Terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . 1356.3 Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

7 Technical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1377.1 Physical Layer Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1387.2 Rack/Subrack Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1397.2.1 Rack Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1397.2.2 Subrack Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140

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7.3 Technical Characteristics of Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1417.3.1 MCU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1417.3.2 MIBS Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1417.3.3 SAB/SABM Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1427.3.4 SMU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1427.3.5 OSCTUT and OSCTUI Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1427.3.6 OLI Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1437.3.7 PUMPA, PUMPB, and PUMPC Modules . . . . . . . . . . . . . . . . . . . . . . . . . . 1477.3.8 Raman Pump Modules (RPUMPC, RPUMPL and RPUMPUL) . . . . . . . . . 1487.3.9 OMDFxx and OMD2xx Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1497.3.10 OM20xx and OD20xx Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1507.3.11 CAD2 Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1507.3.12 EAM4 Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1517.3.13 OPA Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1517.3.14 OCA, OCAS, and OCS Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1527.3.15 UDCM Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1537.4 Rack/Subrack Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1567.5 Electrical Power Consumption of Modules. . . . . . . . . . . . . . . . . . . . . . . . . 1567.6 Electrical Power Consumption of Racks . . . . . . . . . . . . . . . . . . . . . . . . . . 1577.7 External Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1587.8 System Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1607.9 System Requirements for the Element Manager . . . . . . . . . . . . . . . . . . . . 160

8 Product Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163

10 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171

A42022-L5936-C51-1-7618 7



IllustrationsFig. 2.1 Basic Structure of the ’SUPRASS hiT 7550 2.05’ Optical Network

System. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Fig. 2.2 The Optical Supervisory Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Fig. 2.3 Typical C Band ’SURPASS hiT 7550 2.05’ DWDM Linkwith No Fibre Break . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Fig. 2.4 Typical C Band ’SURPASS hiT 7550 2.05’ DWDM Link with a Single FibreBreak between OLR and OADM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Fig. 2.5 Optical Performance Analyzer (OPA) in the OTTU, Monitoring Points . 35

Fig. 2.6 Optical Performance Analyzer (OPA) in the OADMU, Monitoring Points 36

Fig. 2.7 Optical Performance Analyzer (OPA) in the OLRU, Monitoring Points . 37

Fig. 2.8 Element Manager Main Window (Example: OTTU Network Element, Sub-rack 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Fig. 2.9 TNMS CT Graphical User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Fig. 2.10 Communication Interfaces and Controller Architectureof SURPASS hiT 7550 2.05. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Fig. 2.11 Synopsis of Applications, Communication Stacks and Interfaces . . . . . 45

Fig. 2.12 Information Model of the Physical Interfaces . . . . . . . . . . . . . . . . . . . . . 46

Fig. 3.1 SURPASS hiT 7550 2.05 Wavelength Plan. . . . . . . . . . . . . . . . . . . . . . 53

Fig. 3.2 ’SURPASS hiT 7550 2.05’ Wavelength Bands and Sub-Bands . . . . . . 59

Fig. 3.3 OTTU, Optical Path Structure for C Band(Upgradable to C+L Band). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

Fig. 3.4 Block Diagram of C Band ’SURPASS hiT 7550 2.05’Multiplexer Architecture Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Fig. 3.5 OLRU, Optical Path Structure for C Band . . . . . . . . . . . . . . . . . . . . . . . 65

Fig. 3.6 Two Fibre, SURPASS hiT 7550 2.05 C+L Band Amplifier Configuration 66

Fig. 3.7 Two Fibre SURPASS hiT 7550 2.05 StandaloneL Band Amplifier Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

Fig. 3.8 Stage EDFA Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Fig. 3.9 Two Fibre ’SURPASS hiT 7550 2.05’ C+L Band, Raman Amplifier Config-uration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Fig. 3.10 OADMU with CAD2x Modules, Optical Path for C Band Standalone . . 72

Fig. 3.11 Remotely Configurable CAD2 Optical Switch Modules . . . . . . . . . . . . . 73

Fig. 3.12 Back-to-Back 100% Configurable OADM (C Band Standalone, 50 GHz) .75

Fig. 3.13 Symmetrical and Asymmetrical OADM Architectures . . . . . . . . . . . . . . 76

Fig. 3.14 CCU: Principal System Environment of OCA and OC(A)S Modules . . . 77

Fig. 3.15 OADM Ring with two Back to Back Terminals (2xOTTU) . . . . . . . . . . . 78

Fig. 3.16 Network Configurations with Combinations of Network Elements . . . . . 79

Fig. 3.17 MCU Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Fig. 3.18 SAB and SABM Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

Fig. 3.19 OSCTU Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

Fig. 3.20 SMU2 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

Fig. 3.21 OPA Module, Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

Fig. 3.22 System Environment of OLI Modules . . . . . . . . . . . . . . . . . . . . . . . . . . 92

8 A42022-L5936-C51-1-7618


Fig. 3.23 OLI Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

Fig. 3.24 OLI PUMP Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Fig. 3.25 OMDFIC Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

Fig. 3.26 OMDFIL Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

Fig. 3.27 OMDFC Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

Fig. 3.28 OMDFL Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

Fig. 3.29 OMD2IC Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

Fig. 3.30 OMD2IL Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

Fig. 3.31 OM20 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

Fig. 3.32 OD20 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

Fig. 3.33 ODA20 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

Fig. 3.34 CAD2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

Fig. 3.35 EAM4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104

Fig. 3.36 OCA and OCAS Modules, Optical Path . . . . . . . . . . . . . . . . . . . . . . . . 104

Fig. 3.37 OCS Module, Optical Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Fig. 3.38 Timer Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

Fig. 4.1 Power Distribution within the Rack (Single Row Subrack) . . . . . . . . . . 112

Fig. 4.2 Power Distribution within the Rack (Double Row Subrack) . . . . . . . . . 113

Fig. 4.3 Power Distribution within the Subrack . . . . . . . . . . . . . . . . . . . . . . . . . 114

Fig. 4.4 SURPASS hiT 7550 2.05 Connector Panel (COPA), Front Access . . . 115

Fig. 4.5 COPA Power Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

Fig. 4.6 ANSI Single-Row Subrack (Front Access) . . . . . . . . . . . . . . . . . . . . . . 116

Fig. 4.7 ANSI Double-Row Subrack (Front Access) . . . . . . . . . . . . . . . . . . . . . 117

Fig. 4.8 ETSI Single-Row Subrack (Front Access) . . . . . . . . . . . . . . . . . . . . . . 118

Fig. 4.9 ETSI Double-Row Subrack (Front Access). . . . . . . . . . . . . . . . . . . . . . 119

Fig. 4.10 DCM Tray . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

Fig. 4.11 OTTU, C+L Bands, 160 Channels (Equipping Example) . . . . . . . . . . . 122

Fig. 4.12 OLRU, C+L Bands (Equipping Example) . . . . . . . . . . . . . . . . . . . . . . . 123

Fig. 4.13 OADMU, C+L Bands, 160 Channels, with Maximum ConfigurableAdd/Drop Capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

Fig. 4.14 CCU Equipping (Example: CCU Applied in a back-to-back 100% OADM).125

Fig. 4.15 NE Alarm Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

Fig. 4.16 Subrack Address Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

Fig. 5.1 Current Alarm List (Example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

Fig. 5.2 History Alarm List (Example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

Fig. 5.3 NE Software Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

A42022-L5936-C51-1-7618 9



TablesTab. 2.1 OSC Byte Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Tab. 2.2 Link Control Actions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Tab. 3.1 40 Blue Wavelengths in the "C" (Conventional) Band . . . . . . . . . . . . . . 54

Tab. 3.2 40 Red Wavelengths in the "C" (Conventional) Band . . . . . . . . . . . . . . 55

Tab. 3.3 40 Blue Wavelengths in the "L" (Long) Band. . . . . . . . . . . . . . . . . . . . . 55

Tab. 3.4 40 Red Wavelengths in the "L" (Long) Band . . . . . . . . . . . . . . . . . . . . . 57

Tab. 3.5 List of SURPASS hiT 7550 2.05 Multiplexer Modules . . . . . . . . . . . . . . 64

Tab. 3.6 Output Power for OLI Module with/without Pumps . . . . . . . . . . . . . . . . 69

Tab. 3.7 Plug-in Units for the SURPASS hiT 7550 System . . . . . . . . . . . . . . . . . 80

Tab. 7.1 Physical Layer Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

Tab. 7.2 ETSI Rack Dimensions According to ETS 300 . . . . . . . . . . . . . . . . . . 139

Tab. 7.3 ANSI Rack Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139

Tab. 7.4 Subrack Dimensions and Weight (Single Row Subrack) . . . . . . . . . . . 140

Tab. 7.5 Subrack Dimensions and Weight (Double Row Subrack) . . . . . . . . . . 140

Tab. 7.6 Mechanical Specifications for DCM Shelf . . . . . . . . . . . . . . . . . . . . . . 140

Tab. 7.7 MCU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

Tab. 7.8 MIBS Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

Tab. 7.9 SAB/SABM Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

Tab. 7.10 SMU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

Tab. 7.11 OSCT Module Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

Tab. 7.12 OLI Module Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143

Tab. 7.13 Specifications for OLI Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144

Tab. 7.14 PUMPA, PUMPB, and PUMPC Modules. . . . . . . . . . . . . . . . . . . . . . . 147

Tab. 7.15 Raman Pump Modules (RPUMPC, RPUMPL and RPUMPUL). . . . . . 148

Tab. 7.16 OMDFxx and OMD2xx Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149

Tab. 7.17 OM20xx and OD20xx Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150

Tab. 7.18 CAD2 Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150

Tab. 7.19 EAM4 Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

Tab. 7.20 OPA Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

Tab. 7.21 OCA, OCAS, and OCS Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152

Tab. 7.22 UDCM Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153

Tab. 7.23 Electrical Power Consumption of Modules . . . . . . . . . . . . . . . . . . . . . 156

Tab. 7.24 External Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158

Tab. 7.25 System Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 160

Tab. 7.26 EM System Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160

10 A42022-L5936-C51-1-7618


A42022-L5936-C51-1-7618 11



1 Notes on the SURPASS hiT 7550 2.05 Docu-mentationThe documentation of the Network Element SURPASS hiT 7550 2.05 comprises cus-tomer documentation (see 1.2) and complementary documentation (see 1.3). The doc-umentation is available in binders as well as on CD-ROM.

For system requirements to install the CD-ROMs on your computer (under Windowsor UNIX) see the file README.TXT in the root directory of the CD ROMs.

1.1 Preliminary Remarks concerning this Release

• Web based control of the network element SURPASS hiT 7550 2.05• TL1 control of the network elements SURPASS hiT 7550 2.05• OADM with 80 % or 50 % static/configurable add/drop capacity• TCP/IP and Dynamic routing (OSPF)

1.2 Customer DocumentationThe customer documentation is split into manuals and Online Help:• Technical Description (TED)

The Technical Description TED provides an overview of the application, perfor-mance features, interfaces and functions of the equipment. It also contains the mostimportant technical data.

• Installation and Test Manual (ITMN)The Installation and Test Manual ITMN contains instructions on how to install andtest the SURPASS hiT 7550 2.05 components. This includes mounting the subracksin the equipment racks, connecting and testing power cables, electrical cabling andplug-in card installation.The optical cabling and rack arrangement are described in a complementary docu-ment (see Cabling Plan, Chapter 1.3).The ITMN also deals with commissioning the operating terminal and the softwareand describes standard turn-up procedures.

• Operator Guidelines (OGL)The Operator Guidelines OGL provide information on how to operate, monitor andmaintain the SURPASS hiT 7550 2.05 via use of the Q3-based Element Managersoftware. The Element Manager (EM) is an easy-to-use Graphical User Interface(GUI) with extensive Online Help built in.

!You should not use the L-Band in the current release!

Please also NOTE carefully:Although sometimes mentioned in this documentation, the following features are notsupported/tested with the current release:

☞For detailed information on the Element Manager (EM) Graphical User In-terface (GUI) the Operator Guidelines OGL comprise an Appendix "PrintedHelp" containing the complete Online Help texts converted into printeddocumentation.

12 A42022-L5936-C51-1-7618


• Online HelpThe Online Help (Java based) provides information about the Element Manager win-dows used for the SURPASS hiT 7550 2.05. Complex procedures are explained asstep-by-step instructions, especially alarm signaling, evaluation of the alarm mes-sages, and performance management.There are several ways for obtaining help:=> Press F1 for getting help information related to the currently active window.=> Select Help > Contents from the main menu to open the main help window. Viathis window you can display the help’s table of contents and you can search for spe-cial topics using the “Find” or the “Index” tab.

1.3 Complementary DocumentationIn addition to the customer documentation given above further complementary docu-mentation set will be available partially on customer’s demand:

• Release NoteThis document identifies the specific version of the SURPASS hiT 7550 2.05 productand provides information on HW, SW, LCT/NCT components and the limitations ofthe release as well as important notes concerning the customer documentation.

• Cabling PlanThis document deals with the electrical and optical cabling of the subracks andracks, it illustrates the rack equipment of the several variants and contains block di-agrams and cabling lists.It may be obtained from the sales departments.Ordering number: S42022-L5020-A100-*-7633.

• DCN Rules for OSI/IP (on customer’s demand)This document describes the IP configuration for the SURPASS hiT 7550 2.05.It may be obtained from the sales departments.

• User Manual TNMS CT:The TNMS CT user manual describes the application, the installation, and the useof the TNMS Craft Terminal (CT), which offers integrated management for DWDMand SDH network elements together with central monitoring and configuration of anentire (small) network. The TNMS CT also contains the Element Manager softwareof the SURPASS hiT 7550 2.05, operated via a graphical user interface (GUI). Theconnection to the managed network element is established either via Ethernet or viaRS-232 communication channels (Q3 or QF).The TNMS CT user manual is supplied with the TNMS CT application itself.Ordering number for the CD-ROM: A42022-L5959-A10-*-76K5Ordering number for the manual (UMN): A42022-L5959-A53-*-7619.

• Field Test ProtocolsField Test Protocols specify the required values for system measurements and pro-vide space to enter the actual measured value to confirm successful installation.The current Field Test Protocols can be obtained from the sales departments.

iThe IP feature is currently not released.

A42022-L5936-C51-1-7618 13



1.4 Symbols Used in the Documentation

1.4.1 Symbol for Warnings

1.4.2 Symbols for Notes

1.4.3 Symbols for Menu Displays and Text InputsMenu options from pop-up menus or inputs to be made by the user (texts, commands)are displayed consecutively in their hierarchical sequence in pointed brackets:

<Menu> <Menu Item> <Submenu Item> <...> <GUI Window...> etc.

In the Online Help menu options to be made by the user are displayed consecutively intheir hierarchical sequence by arrows:

Menu → Menu Item → Submenu Item → ... → GUI Window... → etc.

1.4.4 TermsThe modules of the network element are also referred to as cards, plug-in units or slide-in units; in the English screen text, the designation “Card” is used in addition to the des-ignation “Module”. In this manual, the designation “Module” is used for the most part.There are also different namings as shelves and racks, subracks and subshelves, etc.

1.5 Notes on Licensed SoftwareThis documentation refers to software products which were taken over from other com-panies as licenses.

Should problems arise, you should contact Siemens AG as the licensee and not the rel-evant licenser.

In this documentation, the following designations of licensed products are mentioned:• UNIX (registered trademark of UNIX System Laboratories Inc.)• MS-Windows (identification of the Microsoft Corporation)

!This symbol identifies notes which, if ignored, can result in personal injury or in perma-nent damage to the equipment.

iThis symbol identified notes providing information which extends beyond the immediatecontext.

⇒ Denotes a point in the text which contains specific handling notes.

☞Cross reference to other chapters in this manual or cross reference to othermanuals.

Help Note on the online help system of the relevant application software concerned.

14 A42022-L5936-C51-1-7618


1.6 Form for your Ideas, Proposals and CorrectionsWe aim to provide clear, user-friendly documentation. To achieve this objective, yourpractical experience is very important. We appreciate your suggestions.

To offer you, the user, a cost-effective opportunity to identify weak points or requests fordocumentation, we have compiled a form for you on the next page. You can use it as amaster or as a printout in electronic documentation.

Please enter your ideas, proposals and corrections on the copy (enclose furtherpages, if required).

The following points are of particular importance to us:• Where are we offering too much or too little detail?• Where should more explanatory graphics be used?• Where is the description difficult to understand?• How can the basic structure of the description or the manual be improved?

Please forward your feedback as a letter, fax or E-Mail to our address given overleaf.

If you want a reply or need to discuss anything with us, please complete the “Sender”field in full.

Many thanks for your feedback!

A42022-L5936-C51-1-7618 15



To

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A42022-L5936-C51-1-7618 17



2 System OverviewThis chapter consists of the following sections:• Introduction• Applications• SURPASS hiT 7550 2.05 Features

2.1 IntroductionSiemens SURPASS hiT 7550 2.05 is the new generation of ultra-high performanceDWDM systems extending transport capacity into the Terabit/s region. It's high equip-ment density, modularity and flexibility make it one of the most compact and powerfulDWDM systems for today's and tomorrow's capacity requirements. High equipmentdensity ensures that a minimum of valuable rack space is consumed. Modularity resultsin simple, low-cost, incremental component additions/exchanges being all that is neces-sary for the user to upgrade his network to higher and higher capacities. Flexibility is builtinto the SURPASS hiT 7550 system via many features. For instance, SURPASS hiT7550 is able to accommodate a wide variety of ITU-compliant wavelength plans. Flexi-bility ensures successful, cost-efficient deployment in today’s typical multi-vendor envi-ronment, as well as in future all-optical transport networks that employ protectionswitching architectures and restoration capability within the photonic layer.

Advances in technologies such as narrow-band optics (50 GHz channel spacing),L Band broadband amplifiers, Raman amplification, and Enhanced Forward Error Cor-rection (EFEC) techniques, together with improvements in their economic feasibility pro-vide the foundation for Ultra-High Capacity (UHC) DWDM systems. Implementing themrepresents the logical evolution of the SURPASS hiT 7550 platform.

SURPASS hiT 7550 2.05 offers a scalable capacity of up to 160 channels at 10 Gbit/son a single fibre pair. Each fibre carries a maximum of 160 wavelengths, 80 in the CBand and another 80 in the L Band, that means 1.6 Tbit/s capacity per fibre and3.2 Tbit/s capacity per fibre pair. Further capacity enhancements can be provided by asystem upgrade to higher bit rates.

Operation in either the C Band or in the L Band is also available. A smooth upgrade pathexists from an 80 channel system, requiring only C Band components, to a 160 channelsystem, requiring the addition of the L Band wavelength spectrum. Standalone L bandsystems are particularly interesting for Dispersion Shifted Fibre (DSF) applications dueto the higher chromatic dispersion in the L band.

Fully integrated DWDM interworking with Siemens 10 Gbit/s SDH line systems is offeredto reduce the number of costly network components. Alternatively, in combination withthe SURPASS hiT 7540 (OCU), highly sophisticated transponder and consolidating mul-tiplexer solutions are provided to accommodate many different vendor and servicetypes, i. e. 2.5 Gbit/s/10 Gbit/s services, Internet Protocol (IP) services and Asynchro-nous Transfer Mode (ATM) services. The SURPASS hiT 7540 (OCU) can deliver up to32 bi-directional 10 Gbit/s or 64 bi-directional 2.5 Gbit/s channels per 7-foot rack (anddouble that amount assuming back-to-back racks in one rack) for efficient integrationonto the ’SURPASS hiT 7550 2.05’ DWDM backbone network. Thus SURPASS hiT7550 2.05 delivers substantial savings in floor space, operational costs (power con-sumption) and equipment procurement costs.

The powerful combination of SURPASS hiT 7550 2.05 and the SURPASS hiT 7540(OCU) provide the required optical networking building blocks for all applications.

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2.2 Applications

2.2.1 Network ApplicationsThe following four NE types are used in the SURPASS hiT 7550 2.05 transport platform:– ’SURPASS hiT 7550’ Optical Transport Terminal (OTT) for 160 channel DWDM ca-

pability– ’SURPASS hiT 7550’ Optical inLine Repeater (OLR), providing powerful inline am-

plification of 160 channels - up to 160 wavelengths per fibre in a unidirectional, two-fibre configuration (3.2 Tbit/s total bandwidth)

– ’SURPASS hiT 7550’ Optical Add/Drop Multiplexer (OADM) which permits the ex-traction and insertion of channels at intermediate line amplifier sites

– ’SURPASS hiT 7550’ Channel Connection Unit (CCU) to built static or dynamic passthrough or add/drop channel connections and thus to connect several OTTs andOADMs together.

Depending on the wavelength band(s) used for transmission, there are three possibleconfigurations for each NE type:– C band– C+L band– L band standalone

Possible NE configurations are shown in Fig. 4.11 through Fig. 4.14. For further details,refer also to Chapter "3.2 Functional Overview of the NE Types".

Fig. 2.1 shows the basic structure of the SURPASS hiT 7550 2.05 optical network sys-tem.

Fig. 2.1 Basic Structure of the ’SUPRASS hiT 7550 2.05’ Optical NetworkSystem

2.2.2 Compatibility with Existing SystemsThe ’SURPASS hiT 7550 2.05’ transport platform presents wide channel passbands forcompatibility with multiple vendors’ 10 Gbit/s terminal equipment. In addition, it is com-patible with the following Siemens solutions:– Siemens 2.5 Gbit/s line systems (SL16, SLR16, WTTR)– Siemens 10 Gbit/s SDH line systems (SL64)

up to 20% configurableadd/drop

OTT CCU OTT

100% OADM

OADM OTTOTT ORL

up to 100% add/drop orexpress channels

Terminal equipmentOCR10G or SIEMENS SDH

A42022-L5936-C51-1-7618 19



– SURPASS hiT 7540 (OCU) with the following modules:- 10 Gbit/s TDM multiplexing transponder (TEX) combining 4 x 2.5 Gbit/s signals

into one 10 Gbit/s signal- OCR 10 Gbit/s transponder

– SURPASS hiT 7540 c1.5 (former OCU c1.5): 2.5 Gbit/s transponder

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2.3 SURPASS hiT 7550 2.05 FeaturesThis section consists of the following subsections:• Transmission Functions• Optical Supervisory Channel• Optical Safety Mechanisms• Optical Performance Monitoring & Control• Optical Network Management• Element Manager• Connection to Network Management Systems• EOW Interface• User Data Channels (sV.11)• Telemetry Interface (TIF)• Overview of System Benefits

The following explanations to short terms would be useful for the understanding of somefeature descriptions:

ASEstands for (undesired) Amplified Spontaneous Emissions, they are generated in laserlight sources and laser pump modules.

OSARis the abbreviation of the Optical Signal-to-accumulated-ASE Ratio. It can be seen asthe optical signal power at the output of a particular NE (OTT Tx or OLRU or OTTU Rx)related to the "optical noise power" which has been accumulated up to this output.OSAR is an absolute value and is measured e. g. by means of the OPA module.

OSAARis the abbreviation of the Optical Signal-to-added-ASE Ratio. This calculated, relativevalue describes the degradation of OSAR along the optical link (between OTTU Tx andOTTU Rx).Preemphasis alignment is applied to equalize the OSAAR ratio of all express channels.

2.3.1 Transmission FunctionsThe SURPASS hiT 7550 system provides powerful and comprehensive control capabil-ities for all optical elements, ensuring optimized configuration at system start-up as wellas superior stability and transmission quality when the network reaches its full runningstate with live traffic. Some control decisions depend only on local conditions (within thesame NE), while others are based on extensive information exchanged among NEs. In-formation needed to control the optical path is communicated between NEs via the Op-tical Supervisory Channel (described below). Control capabilities include:– Control of NEs during initial system start-up; pump lasers off-state for safety, upload

and download of module information, initial equalization of transmit channel signalpower, stabilization of line and module parameters (e. g., EDFA gain and outputpower), and correction of transmit input powers to achieve optimum OSNR and pow-er distribution (pre-emphasis).

– After the network becomes fully operational, the system performs ongoing monitorduties for any required adjustments of the EDFAs (pump lasers, wavelength stability,output power, VOA and power tilt control, and automatic power shutdown).

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2.3.2 Optical Supervisory ChannelThe Siemens SURPASS hiT 7550 2.05 offers a 2 Mbit/s optical service channel to pro-vide communications between all SURPASS hiT 7550 NEs. This optical supervisorychannel supports all network management communication for the configuration, faultmanagement, performance monitoring, and software maintenance required to set upand maintain a DWDM system. The OSC provides both a 576 kbit/s DCCOo (OTS DCCOptical Transmission Section Data Communication Channel) and a 576 kbit/s DCCMo(OMS DCC Optical Multiplex Section Data Communication Channel). The DCCOo isterminated in every NE type, whereas the DCCMo only by the OTT and the OADM,much like the DCCm and DCCr in the SDH overhead.

The OSC is a bi-directional channel whereby the same wavelength of 1625 nm is usedfor both transmission directions, each on a separate fibre as shown in Fig. 2.2. TheOSC wavelength lies just outside the C Band of wavelengths, and is terminated at eachSURPASS hiT 7550 NE. Therefore, even in the rare occurrence of an amplifier failure,the OSC and hence all management communications remain intact.

Fig. 2.2 The Optical Supervisory Channel

The OSC channel is terminated on the Optical Supervisory Channel Termination CardUnidirectional (OSCTU). A major function of the OSCTU module is the digital processingof the bytes of the OSC (see also Tab. 2.1). The OSC is optically inserted into and ex-tracted from the main DWDM traffic signal by a filter module on the Optical Line Interface(OLI) module, and then is sent optically to the OSCTU module where it is electrically ter-minated for digital processing.

There are two variants of the OSCTU module, one for the terminal sites OTT called theOSCTUT, and one for the intermediate nodes OLR and OADM called the OSCTUI,which require two OSC terminations, one each for the line side 1 and the line side 2. TheOSCTU has other important functions other than just OSC byte processing (see alsoChapter 3.3.6).

Customer’sOSS Local

Craft Terminal(LCT)

NetworkCraft Terminal

(NCT)

Local (F)interface

OSS (Q)interface

OTTU OLRU OADMU

MCU MCU MCU

OSCTUT OSCTUI OSCTUI

OSC (1625 nm) OSC (1625 nm) OSC (1625 nm)

OSC (1625 nm) OSC (1625 nm) OSC (1625 nm)

with DCCOoand DCCMo

with DCCOoand DCCMo

with DCCOoand DCCMo

with DCCOoand DCCMo

with DCCOoand DCCMo

with DCCOoand DCCMo OTTU

MCU

OSCTUT

Ethe

rnet

(Q3)

Note: DCCOo is terminated at every NE. DCCMo is also terminated atevery NE except OLRU. DCCMo is passed through each OLRU.

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OSC bytes

0 to 31

Contents

0 – G.704 basic frame

– CRC- 4 multiframe

– Sa4 bit used for timing marker

– CRC- 4 checksum used for EXC, SD

– A bit: optical link RDI bit

– Sa7 bit used for APSD signaling

– Sa8 bit used for direction Id

1 to 9 DCCOo: data communication channel of the optical transport section layer, 576 kbit/s

10 to 18 DCCMo: data communication channel of the optical multiplex section layer, 576 kbit/s

19 E0: engineering order-wire channel, 64 kbit/s

In OTT: EOW channel (E0 or F0) is permanently connected to the EOW conference. If E0

is connected to the EOW conference, F0 can be used as data channel.

In OLR, OADM: EOW channels (E0 or F0) of both OSC (A and B) are permanently con-

nected to the EOW conference. If E0 of OSCA and OSCB are connected to the EOW con-

ference, F0 of OSCA and OSCB can be applied as user data channel (passed through or

connected to sV.11 interfaces).

20/21/22 Configurable 64 kbit/s OSC user data channel connection to one out of two sV.11

interfaces

F0: engineering order-wire channel and sV.11 channels;

NU1, NU2: user data channel

23 OTS trace identifier

24 to 26 OSC channel status information

27 to 30 Optical link control

31 CRC check for link control information

Tab. 2.1 OSC Byte Mapping

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2.3.3 Optical Safety MechanismsWith the high powers being emitted by today's optical amplifiers and pump light sourcesSiemens recognizes that safety to all users of DWDM equipment from harmful lightemission is an important issue.

The SURPASS hiT 7550 2.05 Erbium Doped Fibre Amplifiers (EDFA) produce poweroutputs of up to +23 dBm, which means they fit into Laser Class 3B (< +27 dBm or500 mW) according to relevant ETSI standards. The Raman pump output power alsohas a maximum of +27 dBm which means it is also placed into Laser Class 3B. For thisLaser Class there must be controlled access to rooms containing this equipment, and amechanism to reduce the output power to Class 1 levels (< +10 dBm or 10 mW) at allopen optical connectors.

Due to the implementation of reliable Automatic Power Shutdown (APSD) and Automat-ic Power Reduction (APR) algorithms, Siemens ensures that during normal equipmentoperation Laser Class 1 is achieved. This applies for normal running traffic, link set-up,fibre break or amplifier/laser defects. During fibre breaks, the shutdown of all high poweroutputs must be achieved within 3 s. With subrack covers equipped, as is standardequipment practice, Laser Class 1 is satisfied, as no light is expected to be emitted fromwithin the subrack. It also is not possible for the customer to disable the Automatic Pow-er Shutdown functionality for obvious safety reasons.

2.3.3.1 Automatic Power Shutdown ProcedureThere are several situations in which the amplifier pump lasers and the Raman pumplasers are shut down, the main being due to fibre breaks in the line between any twoSURPASS hiT 7550 2.05 NEs, be they OTTU, OLRU, or OADMU.

Each SURPASS hiT 7550 2.05 optical amplifier is equipped with the Automatic PowerShutdown (APSD) and automatic restart capability. If the input power of an amplifierdrops under a predefined power threshold, the pump lasers in one amplifier section areswitched off. They are restarted again if the input power reaches a certain minimumpower threshold for a certain time.

Fig. 2.3 shows a C Band ’SURPASS hiT 7550 2.05’ DWDM link with Siemens 10 Gbit/stransponders providing the individual channel traffic signals. In this scenario the line fi-bers are intact and a special bit in the OSC, the APSD bit is set to 0, or “o.k.”, in eachdirection of each link.

Fig. 2.3 Typical C Band ’SURPASS hiT 7550 2.05’ DWDM Linkwith No Fibre Break

If at any site with an OTT/OLR/OADM, there is a fibre break on the fibre carrying theincoming signal, then this line input will detect a loss of signal (LOS) of both the DWDMtraffic signal AND the Optical Supervisory Channel (OSC). In this case the fibre break

OCR10G OTT OTTOLR OADM OCR10GAPSD bit = 0

APSD bit = 0

Normal Operation

24 A42022-L5936-C51-1-7618


triggers the shutdown of the pump lasers of the inline amplifier (or preamplifier) in thesame direction AND of the inline amplifier (or booster amplifier) in the counter direction.Hence the traffic signal in this counter direction is shut down and at the same time, theAPSD bit in the OSC in this direction is set to “1” to indicate an “active APSD” which isthen received by the next neighbouring NE, as can be seen in Fig. 2.4 below as an ex-ample.

A loss of the OSC may mean one of the following: actual loss of OSC signal power, lossof the OSC clock or the APSD bit in the OSC overhead is active. The APSD bit is usedto indicate to the neighboring NE in the counter direction that an APSD has occurred inthis NE. The use of the APSD bit is also shown in Fig. 2.4. The OSC is never switchedoff as it is only Laser Class 1 which has no special safety requirements.

Fig. 2.4 Typical C Band ’SURPASS hiT 7550 2.05’ DWDM Link with a Single Fibre Break between OLR andOADM

To complete the full shutdown process of this optical section, the other connected NE inthe faulty section detects a loss of signal of the DWDM traffic and an active APSD bitwhich in turn triggers an APSD of it's inline amplifier in this signal direction, and in thecounter direction. Hence it is no longer possible that high power laser light is active any-where in this section.

As the APSD shutdown of one amplifier in a link leads to the successive loss of inputsignal (LOS) detection of all other amplifiers in the forward signal direction, the end ter-minal equipment at each end will eventually detect a LOS for it's individual channel sig-nal and perform an Automatic Laser Shutdown (ALS) in the reverse direction. Hence theshutdown of all individual channel transmitters is complete.

Note, that due to the individual implementation of APSD and ALS mechanisms in SUR-PASS hiT 7550, the Line Terminal Equipment is not required to have it's own ALS mech-anism to ensure safe optical levels in the SURPASS hiT 7550 domain. However, at theSURPASS hiT 7550 tributary interfaces, where optical channel power levels are Class1 only, individual channel ALS is still the responsibility of the end terminals.

Once the fibre break is repaired, and the OSC is detected again (with APSD bit set to 0as can be seen in Fig. 2.4), all of the amplifier pumps are able to be switched on. Thesynchronized Automatic Laser Restart (approx. 9 s laser on) at the 10 Gbit/s terminalequipment provides an input signal to the first booster amplifier in the OTT which is nowready for service, enabling all amplifiers in succession to begin carrying traffic again.

OCR10G OTT OTTOLR OADM OCR10GAPSD bit = 1

APSD bit = 0

APSDALS ALSAPSD

X

Single Fiber Break

14 53

2APSD bit = 0

APSD bit = 0

iThe fact that both the loss of the main traffic signal and the OSC signal is used to triggerthe automatic power shutdown of the signal in the opposite direction ensures that in thecase of a faulty OSC connection, there is no shutdown of a live and running main trafficsignal.

A42022-L5936-C51-1-7618 25



2.3.3.2 Automatic Power ReductionDemux surveillance takes place in OTT and OADM network elements. It includes thesupervision of all internal connections between the OLI preamplifier output and OD(A)resp. EAM4 module inputs. In case of fault, the automatic power reduction (APR) will actin order to keep the system running with limited power.

APR in the OTT

The APR becomes active if at least one subband connection between OLITP and OD(A)modules fails. If an OD(A) module receives no signal from the OLITP module, the OLITPmodule reduces the power to class 1M (APR).

If a signal is detected again at each OD(A) module, the OLITP module releases thispower reduction.

APR in the OADM

The EAM4 module supervises all subbands, including the subbands which are droppedvia OD(A) modules.

Every “active” OD(A) module sends an APR-telegram to its related EAM4 module incase a subband loss is raised or cleared. The EAM4 module collects the informationfrom the OD(A) modules and decides (based on the currently configured channel status)if APR has to be set or cleared.

On EAM4 modules, signals from monitor diodes for all four subbands are used to com-pare the power level of the relevant input with the channel status of the correspondingchannel group, as they are periodically reported by the OSCT module. If the measuredpower level for at least one channel group does not indicate light, where light is expectedaccording to the channel status (i.e. at least one of the 20 channels of one group hasthe channel state OK), then an APR command is sent from the EAM4 module to forcepower reduction at the corresponding OLI preamplifier module. APR is released, if themeasured input power corresponds to the expected channels again.

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2.3.3.3 Additional APSD/APR Safety MechanismsIt is not only breaks in the line fibre which result in the automatic power shutdown of theOLI pumps. Additional safety mechanisms are implemented in SURPASS hiT 7550 2.05to ensure that there is no way a user can become exposed to high power light energy.These extra APSD mechanisms are detailed in the list below.

OLI interstage APSD Each of the three amplifier stages sensing a LOS at it's inputwill go into APSD state and shutdown it's pump lasers indepen-dently. This results in the shutdown of the optical signal in theforward signal direction.

OLI interstage devicesurveillance

If the input power level at the input of the 3rd EDFA stage of anOLI module, where the DCM interstage device resides, de-creased below a certain threshold, then the output power of the2nd stage EDFA is reduced.

Raman Pumpsurveillance

The Raman pump will be switched off if no OSC is received(i. e. in case of LOS, LOF, EXC, APSD bit = 1 or OSC LOS).The Raman pump is switched on again, if it receives the 2 MHzspectral line from OSC and if the APSD signal from the OLImodule is cleared.

L Band amplifiersurveillance

OTTU: In the L band a missing signal at line preamplifierOLITPUL triggers APSD at the booster amplifier OLITBUL.OADMU: Like for OTTU but APSD is triggered for the OLITBULat the same NE side / other direction.OLRU: In the L band a missing signal at port 1 of the line am-plifier OLIIUL triggers APSD at the line amplifier OLIIUL. at thesame side / other direction.

The output cable of the L-band optical line amplifier is also op-tically monitored via a duplex cable. If connection is lost thecorresponding L-band amplifier is shut down.

OLI Pumpsurveillance

Similarly the connection between the OLI Pump modules andthe OLI modules is monitored electrically by an electrical cablewithin the optical cable, and the Pump A, B or C module is shutdown if the connection is open.

Demultiplexersurveillance

See Chapter 2.3.3.2.

OLI module EquipmentDefect

An equipment failure of the OLI module results in an APSD ofthe pump lasers on this module. In this case, no automatic re-start of the amplifiers is allowed and therefore not performed.After fault rectification a new link startup via software must beperformed.

A42022-L5936-C51-1-7618 27



2.3.4 Optical Performance Monitoring & ControlSURPASS hiT 7550 2.05 guarantees an exceptional level of signal performance, anEnd of Life (EOL) Bit Error Rate (BER) of 10-13 (“default”) or better for all optical chan-nels per optical link. To achieve this level of quality a certain Optical Signal to Noise Ra-tio (OSNR) must be met, which depends on whether Forward Error Correction(FEC/EFEC) techniques are required or not. SURPASS hiT 7550 2.05 implements nu-merous optical configuration, control and maintenance tools to facilitate the bring up ofan optical link, and the continued smooth operation of the link during it's life-cycle. Howexactly SURPASS hiT 7550 2.05 does this is described in the following sections:• Optimal EDFA Gain Setting and Fast Gain Control• EDFA Output Power Control (Slow Gain Control)• Power Equalization• EAM4 Adjustment• Client Signal Ageing, Drop Control, Add Channel• Constant Pump Current Control• Tilt Analyzer and Adjustable Filter• ASE Correction• Link Control Actions• Channel Up- and Downgrade• Optical Layer Provisioning• Optical Layer Supervision• Optical Performance Analyzer

2.3.4.1 Optimal EDFA Gain Setting and Fast Gain ControlEach amplifier (OLI) is designed to have an optimum gain flatness over the entire wave-length spectrum for a particular value of total amplifier gain. Note that the gain of an am-plifier (in dB) is just the difference between the total output power and the total inputpower of the amplifier. In order to keep the EDFAs operating at a particular optimum gainpoint, but meanwhile still being able to allow a wide range of span losses (up to 32 dBwithout Raman amplification, and up to 40 dB with Raman amplification), a Variable Op-tical Attenuator (VOA) between the first and second EDFA stage is used. By adjustingthis VOA, the overall optimum gain of the three EDFA stages can be set during link pro-visioning. Adjusting the VOA also effects the tilt setting (see Chapter 2.3.4.7).

A fast digital control loop is implemented to keep this gain value constant during any typeof overall system transient behavior. This ensures that even abrupt changes in input sig-nal power, such as caused by channel losses or return of one of the signal lasers, willnot cause optical surges in individual channels, on the contrary, the output power ofeach channel remains constant.

2.3.4.2 EDFA Output Power Control (Slow Gain Control)Based on the number of channels equipped in the DWDM system and the requiredEDFA output power per channel, the total output power of an EDFA can be determined.This total EDFA output power is kept constant via a slow output power control loop,to compensate for degradations or fluctuations in the fibre attenuation and for ageing oflaser sources (e. g. on the OCU equipment). Hence, the physical changes in fibre prop-erties over the years will have no influence on ongoing system performance.

If a change of the total EDFA input power is due to the addition or loss of channels, thenthe value change of for the number of equipped channels causes a re-calculation of the

28 A42022-L5936-C51-1-7618


expected total output power of the EDFA. The slow output power control loop will thenstart regulating the EDFA output power based on this new, calculated value.

2.3.4.3 Power EqualizationThe output power of the single channel signal transmitters is expected to vary fromchannel to channel by several dB, depending on manufacturer and individual variations.Signal power equalization (PEQ) is used to achieve nearly equal power values for allchannels at the beginning of the link (at the booster input of the OTT-Tx) for a definedpower distribution at link startup. This is initialized by an element manager command(power equalization) for the OTT-Tx.

The OSCT module requests– the mean per channel output power from the OLITB module– the mean insertion loss (depends on the use of interleavers in the optical path) of all

8 subbands together with the OM module of one band– all channel input powers from the OM modules of the respective band (C or L).

Then the OSCT calculates the optimum VOA values for all present channels to get aspectrum as flat as possible. The maximum allowed channel power deviation (gain tol-erance) is configurable by the operator.

2.3.4.4 EAM4 AdjustmentPower levels of subbands which are connected through the EAM4 modules are adjustedvia VOAs for equal power distribution. Subbands which are terminated on OD(A) mod-ules are not connected through the EAM4 (their EMA4 VOAs are set to minimum atten-uation).

This link control in the OADMU is done separately for C and L band and for each direc-tion and is started at the element manager either as– EAM4 automatic adjustment (measured by OPA and handed over to OSCT) or as– EAM4 manual adjustment (each four power measurements have to be done).

EAM4 adjustment can be started in linkstate running: the EAM4 module selects onesubband as reference and adjusts the EAM4 VOAs of the other subbands with respectto the value of the reference.

The adjustment can be performed for still empty subbands, but it has to be repeated ev-ery time a subband is populated with the first channel.

Every time an EAM4 adjustment was performed, a tilt correction cycle for this band anddirection must be started at OTT-Tx.

2.3.4.5 Client Signal Ageing, Drop Control, Add ChannelTo counteract the effect of ageing client transmitters so as to have no impact on the totalDWDM link performance, SURPASS hiT 7550 2.05 continuously monitors and adjuststhe input power of each individual channel at the SURPASS hiT 7550 2.05 multiplexers.The allowable customer input signal range is a reference value adjustable between+2 dBm and -8 dBm (defined by the Siemens planning tool) with a tolerance window of+/-4 dB (EOL). SURPASS hiT 7550 2.05 adjusts this value per channel by means ofVariable Optical Attenuators (VOAs) to get the optimum channel input power. Fluctua-tions in client signal input power are regulated via decreasing or increasing the VOA set-ting.

A42022-L5936-C51-1-7618 29



If the client signal does not meet the input range requirement this channel is excludedfrom transmission and an alarm is raised at the network management system. Likewise,if the VOA cannot be adjusted correctly to meet the optimum input channel power cal-culated by the system.

Client signal ageing is not only controlled at the OTTU terminal sites, but also at theOADMU add/drop interfaces. The VOAs at the Add Channel and Drop Channel inter-faces (CAD2) also perform signal ageing/drop control to reach a particular input power(see above) and output power (-8.8 dBm +/- 2.0 dB) window. Appropriate alarms are ac-tivated when the client signal powers do not meet the specified ranges.

Aging and drop control is performed every two minutes in the condition “linkstate run-ning”. During all channel affecting link control actions (i.e. preemphasis, add channel ad-just) the aging and drop control is stopped.

2.3.4.6 Constant Pump Current ControlThe output power of all laser pump sources is controlled by adjusting the respective biascurrent of each laser. All on board OLI pumps, and external OLI pumps(i. e. PUMPA/B/C), as well as Raman pumps have a constant pump current control cir-cuit to maintain the correct pump output power. Alarms are raised if these pump currentsreach certain dangerous thresholds, ensuring the safety of the system, and the early de-tection of faulty hardware.

The OLI pump currents are adjusted by the slow Output Power Control loop in order toslightly change the actual amplifier gain values due to slight fluctuations in span losses.The Raman pump currents however are always set to a fixed optimum value, hence aconstant output power of the Raman pumps is maintained.

2.3.4.7 Tilt Analyzer and Adjustable FilterThe OLI module includes an adjustable tilt filter (in the standard and extended moduleversions) which is used to compensate for tilts in channel powers caused by the Stimu-lated Raman Scattering (SRS) non-linear fibre effect, fibre spectral attenuation, DCFSRS tilt or DCF spectral attenuation. The tilt effect in the optical signal can be viewedwith an optical spectrum analyzer as a decreasing power tilt from channels of higher fre-quency (lower wavelength) to those of lower frequency (higher wavelength). The tilt filtercontrols the optical tilt locally (Gain Tilt Control, GTC), based on measurements of thechannel powers and channel distribution at the output of the OLI.

For all OLI module types a GTC pretilt may be entered, defined by the Siemens planningtool.

In the extended type OLI module, output parameter readings are done by a Gain TiltMonitor (GTM) on the module itself. The GTM continuously monitors the current opticalspectrum at the output of the extended type OLI modules. Changes in channel numbersor mean channel powers detected by the GTM require adjustments of the tilt filter. An-other way in which SURPASS hiT 7550 2.05 guarantees a flat output spectrum at theend of each optical link.

In basic type OLI modules tilt settings are performed via the VOA element, becausethere is no tilt filter control and no gain tilt monitor.

30 A42022-L5936-C51-1-7618


2.3.4.8 ASE CorrectionThe correction of the Amplified Spontaneous Emission (ASE) is the enhancement of therequired linear total output power. It is done by any OLI module in the optical path. How-ever, a reduction of the ASE correction is required, if the ASE accumulation in the opticalpath is interrupted (e.g. due to automatic power shutdown in the optical line preamplifierof the OADM).

The reduction of the ASE correction is processed for each EDFA band separately (bandspecific updates).

The accumulated ASE power is calculated by the Siemens tool and must be configuredfor each OLI module in the link. The correction value or the default value is transmitteddownstream via OSC.

2.3.4.9 Link Control ActionsThe Link Control of SURPASS hiT 7550 2.05 is a high sophisticated state machine.From each particular state the system may be switched in order to perform special taskswithin the link. For example when the link is in state "running" all amplifiers are workingand the link is carrying traffic. The user only via a link control action can initiate link statechanges. The possible link control action depends on the current link state. Some statechanges are temporarily (transition link state) and other states are statically (final linkstate).

This chapter describes all link control actions that can be initiated via the Network Man-agement System (NMS). It also describes the link state transitions, which belong to theseveral actions. For detailed description of how - and when to use the several link controlactions refer the chapter "standard commissioning procedures" of the ITMN.

Action Initial link state Transition link state Final link state

Forced prestart Running or prestart -- Prestart

Description

SW and HW is initiated and checked by self-tests. All lasers (excepted the OSC

lasers) are switched off.

CAUTION: This action will shut down any running link!


Power equalization Prestart Power equalization Prestart

Description

Input signal from all client lasers are equalized in terms of power. Each particular

channel power is adjusted by VOA on the multiplex side in order to achieve opti-

mum input power on the first amplifier input of the link.

Tab. 2.2 Link Control Actions

A42022-L5936-C51-1-7618 31




Link startup Prestart Startup Running

Description

It sequentially sets up all SURPASS hiT 7550 2.05 NEs in transmit direction. All

pump lasers are switched on and the EDFA target output power is set.

20% OADM:

While the link state "startup" the basic sub bands C3C4 are adjusted in terms of

power to reach optimum input power on the booster of the OADM. Attenuation of

all other sub bands is calculated relatively to these basic bands and adjusted ac-

cordingly. This procedure is only performed during the very first link startup. It is

required to run always a further "EAM4 Adjust" in order to re-adjust the sub bands

between each other with high accuracy.

NOTE: Once the sub bands on the OADM are being adjusted this particular proce-

dure for the 20% OADM is skipped automatically.


Preemphasis

(manual / automatic)

Running Preemphasis Running

Description

The individual channel power is adjusted in order to achieve an optimum and bal-

anced spectrum.

The process involves measuring power and OSAR at the begin and at the end of

the optical link (Tx and Rx side) with an Optical Spectrum Analyzer (OSA) or the

optional integrated Optical Performance Analyzer (OPA) of the SURPASS hiT

7550 2.05 system.

INFO: SURPASS hiT 7550 2.05 performs preemphasis adjustments only on "ex-

press" channels.

Manual preemphasis adjust:

Supported by manual measurements with OSA, OSAR and power measurement

have to be performed for each channel at the begin and at the end of the link. The

results have manually to be entered into the system via TMN/LCT.

Automatic preemphasis adjust:

The automatic adjust requires OPA modules at both sides of the link. Measure-

ments and the following adjustments are automatically performed by the system it-

self.

Depending on the measurement values the system automatically decides between

different adjustment algorithms:

Tab. 2.2 Link Control Actions (Cont.)

32 A42022-L5936-C51-1-7618


Preemphasis

(continued)

OSAAR Balance is performed if only the 100 GHz grid is populated with channels

and the measured OSAR values of all express channels are 26 dB or less. In this

case each particular channel is being adjusted in order to suffer the same amount

of OSAR within the link.

However the Tx Power Balance is performed if only the 100 GHz grid is populated

with channels and the measured OSAR values of all express channels are greater

than 26 dB. In this case the transmit spectrum is being adjusted to equal power

within all channels.

As soon as at least one channel is present within the 50 GHz grid only the

Power Interpolation is performed. All power values of the express channels within

the 50 GHz grid are adjusted by interpolating the channel power between their next

adjacent 100 GHz express neighbours.


Add channel adjust

(manual / auto)

Running Add channel adjust Running

Description

Channels which are added/dropped at an OTT or at an intermediate 20% OADM

are locally treated with the add channel adjust procedure at that NE where the

channel is being added. The adjustment procedure is based on the measured pow-

er spectrum at the transmitting amplifier.

Manual add channel adjust:

All channel powers of the transmit spectrum have to be measured with an external

OSA and the results have to be entered into the system via NMS/LCT.

Automatic add channel adjust:

All channel powers of the transmit spectrum are queried via the integrated Gain Tilt

Monitor (GTM) of the amplifier module and all add channels are automatically be-

ing adjusted. This procedure requires an extended type OLI module at the transmit

side since only the extended type OLI module is equipped with GTM.


Tilt adjust Running Preemphasis Running

Description

Gain and tilt values of each amplifier module will be measured and corrected to

achieve a correct and flat power spectrum at the input of the next following amplifier

within the link.

At the extended type OLI module the GTM provides power tilt data from the output

of the amplifier and sets the Gain Tilt Control (GTC) respectively the inline VOA be-

tween the first two EDFA stages.


A42022-L5936-C51-1-7618 33



2.3.4.10 Channel Up- and DowngradeIn the linkstate running single channels can be added to or removed from transmission.The channels can be added at OTT-Tx or OADM. In OTT-Tx, the attribute ’channel us-age’ must be different from 'unused' as precondition for channel upgrade.

Channels which are routed directly from OTT-Tx to OTT-Rx must be configured withchannel usage express at OTT-Tx. These channels are controlled from OTT-Tx via pre-emphasis.

Channels which can be added and / or dropped at an OADM are signalled as addDropchannels to OTT-Tx. These channels are controlled at their local add NE via add chan-nel adjustment.

2.3.4.11 Optical Layer ProvisioningA high degree of flexibility in the provisioning of optical parameters enables SURPASShiT 7550 2.05 to deliver the promised optical system performance and control in all cus-tomer network applications.

The following parameters are user provisionable via the network management system:– Required EDFA channel output power, depending on network dimensions, maxi-

mum number of channels, fibre type, use of FEC/EFEC, and use of Raman amplifi-ers

– Optical OMS path and optical channel OCh inventory information– Enabling and disabling of all pump lasers– Configuration of client Tx input channel powers via VOA adjustment– Configuration of Raman coefficient– Fibre attenuation spectral tilt and ASE power– Configurable alarm thresholds for signal degraded SD (at OLIP and OLII inputs),

input power too high PHF or too low PLF alarms (in receive direction for OM20 andCAD2 add-port, in transmit direction for ODA20 and CAD2 drop-port),OSC signal degrade

– Optical link management via commands such as: power equalization, optical linkstartup, preemphasis.

2.3.4.12 Optical Layer SupervisionSURPASS hiT 7550 2.05 also offers the possibility of requesting all the important opticalsystem parameters from the Network Management System at any time. With the inclu-sion of the Optical Performance Analyzer (OPA, see Chapter 2.3.4.13), full optical per-formance monitoring and recording of the DWDM signal parameters is offered.

Tilt adjust (continued) At the standard and the basic type OLI modules, the module itself calculates the tilt

settings from the RAMAN coefficient, from the fiber tilt parameters, and from the

current gain. It accordingly sets GTC (only standard type OLI module) and inline

VOA.

NOTE: There is no continuous tilt adjust within the amplifier modules. Tilt adjust

must always be initiated by user.


34 A42022-L5936-C51-1-7618


Without the OPA the following optical parameters are supervised:– Input power of each individual client channel– Current insertion loss of each channel input VOA– Output power of each individual client channel– Total input and output powers of each preamplifier, booster amplifier or inline ampli-

fier– Pump currents for all OLI pump sources (on board and external) and Raman pumps– OSC laser current for the OSC channel– Current number of actually equipped channels in each OLR/OTT/OADM, in each di-

rection– Current state of each amplifier's pump lasers, i. e. enabled/disabled– Optical OMS path and optical channel Och inventory information– Current value of tilt filter in each amplifier– Current actual signal tilt in each amplifier

2.3.4.13 Optical Performance AnalyzerSee Chapter 3.3.8 also.

The Optical Performance Analyzer (OPA) module is an integrated Optical Spectrum An-alyzer (OSA) card which can be slotted into the SURPASS hiT 7550 2.05 subrack likeany other module. The OPA offers full optical performance monitoring features, and iscomparable to SDH/SONET performance monitoring in terms of record handling. It en-ables the carrier to monitor the optical link to the highest level of detail and accuracy, tohelp in system maintenance and fault analysis.

As well as the performance monitoring capability, the OPA may be used for optimizingthe transmission of optical signals. It is used to automate the preemphasis procedure;for this OPA modules are required at both, the link start and the link end. OPA is alsoapplied to control the addition of channels at terminal and OADM sites.

When live traffic is running, the OPA samples several optical inputs and collects perfor-mance measurement data. The number of optical input scans depends on the NE type:

• At a SURPASS hiT 7550 2.05 terminal site (OTTU), the preamplifier output and thebooster amplifier output are measured (a total of 4 interfaces when both C and Lband amplifiers are considered).

A42022-L5936-C51-1-7618 35



Fig. 2.5 Optical Performance Analyzer (OPA) in the OTTU, Monitoring Points

LINE

OLITPC

OLITPUL

LINE

OLITBUL

OLITBC

OPA

MonL2MonC2MonC1MonL1

OTTU

36 A42022-L5936-C51-1-7618


• At an Optical Add/Drop Multiplexer site (OADMU), the preamplifier outputs and thebooster amplifier outputs are measured (a total of 8 interfaces when both C and Lband amplifiers, in both directions are considered). See Fig. 2.6.

Fig. 2.6 Optical Performance Analyzer (OPA) in the OADMU, Monitoring Points

LINE

OLITBC

OLITBULOLITPUL

LINE

OADMU

LINE

OLITBUL OLITPUL

OLITBC OLITPC

OPA

LINE

Side 1Side 2

OLITPC

MonL1MonC1

MonC2MonL2

MonC4MonL4

MonL3MonC3

A42022-L5936-C51-1-7618 37



• Four inputs are monitored in the OPA module at an Optical Line Repeater site(OLRU): the C band and the L band in both transmission directions (corresponds toa maximum of 320 channels) are monitored at the output of the optical inline ampli-fiers.OPA module and Raman amplifier use the same slot. Therefore only one of thesemay be equipped.

Fig. 2.7 Optical Performance Analyzer (OPA) in the OLRU, Monitoring Points

OPA is used to get optical performance information on a per channel basis.

Every 15 minutes (beginning on the hour) and every 24 hours, the following optical per-formance data is measured and recorded:– Minimum, average and maximum carrier power (dBm)– Minimum, average and maximum carrier OSNR– Minimum, average and maximum measured carrier frequency (GHz)– Measurement sample size: The number of samples used to compute each mini-

mum, average and maximum value– Loss of Light (LOL) count: The number of times a LOL is detected for this carrier

It is possible to request the following accumulated records:– The current and previous 15 minute performance management records– The current 24 hour summary as well as summaries for each of the 7 most recent

days– The most recent eight hours, where the values are specified in 15 minute interval

records, i. e. 32 x 15 minute records– Actual snapshots of measurement data, described above.

LINE

OLIIC

OLIIUL

OLRU

LINE

OLIIUL

OLIIC

Side 2OPAMonC1

MonL1

MonL2

MonC2

LINE

LINE

Side 1

38 A42022-L5936-C51-1-7618


2.3.5 Optical Network ManagementThe Siemens Optical Telecommunication Network Management System which servesit's complete Optical Telecommunication Product Portfolio, today and well into the fu-ture, is called TNMS (Telecommunication Network Management System). Being a trulyrecent development, the TNMS is able to offer state-of-the-art computer architectureand graphical user interface innovations.

2.3.5.1 The Telecommunication Network Management SystemThe Telecommunication Network Management System (TNMS) composed of TNMSCore and TNMS CDM (Cross Domain Manager) is the Siemens Management Solutiondesigned for the needs of metropolitan and regional transport networks as well as forlong distances within national or international networks. TNMS Core/CDM supportsPDH, SDH and DWDM NEs in core and backbone application scenarios as service lay-er, network layer, and element layer management with the TMN (TelecommunicationsManagement Network) Model. This system can be scaled within a wide range to givecustomized network management solutions. Special end-to-end connection manage-ment procedures with automatic and manual routing over the entire network allow quickservice provisioning and monitoring in a user-friendly way.

TNMS Core can be combined optionally with TNMS CDM to manage extremely largeSiemens networks. TNMS CDM is related to the Network Layer and Service Layer,whereas TNMS Core additionally supports the Element Layer.

Each TNMS Core can support several network servers with a maximum of about 1400SMA 1 equivalents and more. (SMA 1 equivalent means the performance of an SDHSTM-1 add/drop multiplexer.) A TNMS CDM can support up to 20 TNMS Core Servers.This hierarchical architecture leads to a flexible and scalable management system.

The TNMS Core/CDM supports the management of a large variety of Siemens DWDM,PDH and SDH equipment such as:– TransXpress Infinity MTS 1.1E and MTS-R2.03– SURPASS hiT 7550 2.05– SURPASS hiT 7540 (OCU) with TEX, and OCR– Siemens PDH Access equipment (e. g. FMX / CMX V2, SRA L)– Siemens SDH equipment; cross-connects (SXA/SXD), synchronous multiplexers

(SMA, SMA 1K, SMA 16), synchronous line equipment (SLT/D 16, SLR 16, SL64)– Siemens Radio NEs

The TNMS-Core/CDM system is designed to run on IBM compatible PCs onWindows 2000 Operating Systems (Microsoft Corporation).

A42022-L5936-C51-1-7618 39



2.3.5.2 Integrated Domain managementSiemens is an active member of the Telemanagement Forum (TMF), which consists ofa growing number of Telecommunication industry leaders who have defined a standardmulti-vendor NML/EML management interface, which is CORBA based. The work of theTMF is currently being integrated into ITU standardization activities in the area of opticaltelecommunication network management.

The TNMS-Multi-Vendor Management Platform (TNMS-MVM) extends the capability ofTNMS-Core/CDM to allow true Multi-Vendor interworking for Optical Telecommunica-tion Networks, by providing a standardized CORBA Interface. This enables the operatorto manage optical telecommunication network products from several suppliers, from thesame network management platform.

40 A42022-L5936-C51-1-7618


2.3.6 Element ManagerAs is standard for all Siemens Optical Networking Products, SURPASS hiT 7550 2.05comes with an Element Manager (EM). The EM as an application program is part of thesoftware packet for the TNMS Craft Terminal, designed to run on IBM compatible PCson Windows 2000 Operating Systems (Microsoft Corporation) which can either be usedfor local commissioning or maintenance operations just for one NE, or can be used forremote commissioning or maintenance operations of a relatively small DWDM network(approx. 50 NEs). A sample window of the SURPASS hiT 7550 2.05 Optical TerminalOTTU is shown in Fig. 2.8.

Fig. 2.8 Element Manager Main Window (Example: OTTU Network Element, Subrack 1)

Menu bar

Tool bar

Module View

Title bar

Message Area

Status bar

A42022-L5936-C51-1-7618 41



TNMS Craft Terminal

Using the EM application program for SURPASS hiT 7550 2.05 requires the TNMS CraftTerminal (TNMS CT). It is a transparent software platform for SDH and WDM networkelements and provides access to network elements via– a network interface: Q interface via 10BaseT Ethernet, supports the OSI protocol

(in a later release also the TCP/IP protocol) or via– a serial line interface: Q-F interface (RS232), supporting the TCP/IP protocol

(see Fig. 2.10 also).

TNMS CT offers two operation modes:– the Network Craft Terminal (NCT) mode: can be used for remote login, displays a

network view of all NEs, SDH and DWDM, and their current alarm status as shownin Fig. 2.9. Double-clicking on an NE item will open the EM application for the par-ticular NE (i. e. a window as shown in Fig. 2.8), and thus permits the network ele-ment to be operated and alarm lists to be displayed.

– the Local Craft Terminal (LCT) mode: serial line or Ethernet connection to NE(s). Upto three NE windows may be displayed at a time. To show alarms of an NE, an ele-ment manager session with this NE has to be started, selecting the option for serialconnection from the menu.

With Ethernet connection the LCT or NCT may display up to 150 NE icons.

The NCT mode offers several additional functions to the LCT mode (e. g. fault manage-ment).

NCT and LCT modes need separate licenses and installations.

Fig. 2.9 TNMS CT Graphical User Interface

Working Area

MinimizedWindows

Menu bar

Tool bar

Status bar

Network View

42 A42022-L5936-C51-1-7618


2.3.7 Connection to Network Management SystemsSURPASS hiT 7550 2.05 provides control via Q3 interface. It supports the Q3 informa-tion model, which describes the behavior between interface partners like OSS and anNE. The Q3 information model uses specific management application protocols, namelyCMISE/CMIP (OSI protocols), which allow communication between the Network Man-agement System (NMS) and an NE, via the implemented communication stacks. This isexplained more detailed in the following subsections:• Information Models• Communication Stacks• Communication Interfaces

See also Chapter 3.6.

2.3.7.1 Information ModelsThe information model is the behavior description of a system. It shows the existing en-tities, how they interact and how to control them. Information models are described informal languages. Between interface partners (like OSS and NE) they can be regardedas communication treaty. The information models use specific management applicationprotocols which have to be bidirectionally transported via communication stacks from aOSS to the NE and back. There exist several application protocols:

Q3-CMIP

The Q3 information model is based on ITU recommendations X.721 and M.3100. Thecorresponding service and application protocol is CMISE/CMIP (ITU X.710/X.711). It al-lows connection of the NE to an OSI Q3-CMISE compliant Telecommunication Manage-ment System (OSS). The OSS may be provided by the customer.

Also the Network Control Terminal (NCT) can manage the NE via Q3-CMIP. The NCTis a Windows PC running an application program which can be used for commissioningand maintenance operations.The NCT PC can act as a simple Element Manager forsmall clusters of NE units.

The Q3-CMIP implementation of the NE operates on top of an OSI upper-layer stack(Marben stack) providing e. g. association/presentation and session services. Alterna-tive lower transport layers are possible.

TL1

Web Terminal

iTL1 application is not supported in the current release.

iThe Web terminal is not supported in the current release.

A42022-L5936-C51-1-7618 43



2.3.7.2 Communication Stacks

OSI Stack (Marben OSIAM Stack)

The Marben OSIAM stack provides the OSI/ISO upper layers (session, presentation,ACSE) and access to/from the application (CMIP agent). The upper OSI layers can ei-ther use transport class 4 (TP4) services based on CLNP with ES-IS and IS-IS as therouting protocols or transport class 0 (TP0) services based on the TCP/IP stack (with IPto NSAP address mapping).

For routing purposes of CLNP packets the ES-IS (for end system and router detection)and IS-IS (for dynamic route detection and update) are used. Routing takes place overthe Ethernet and DCC interfaces, if so configured.

TCP/IP Stack

The TCP/IP stack for the NE is delivered with a real time operating system of the NE andcan be used directly by telnet and http or indirectly by the OSI stack by means ofRFC1006. For routing purposes either static route configuration or dynamic routing arepossible. End system (host) detection is accomplished by the ARP protocol for Ethernet.For dynamic routing, route detection and the update of the OSPF (continuous evaluationof route parameters) is used. Routing takes place over the Ethernet and DCC interfaces,if so configured.

Stack Management (MCF)

The communication stacks of the NE are called message communication function(MCF) in ITU terminology. Certain configuration and performance parameters of thecommunication stacks are modeled in Q3 and can thus be managed.

For the OSI part these are parameters concerning the layers 2 (DCC, MAC), 3 (NSAP,ES-IS, IS-IS) and 4 (TP4), for the TCP/IP part they are concerning IP (address, routingtables), TCP (connection table) and OSPF (basic parameter set). The Q3 informationmodel of the TCP/IP stack parameters is aligned to the corresponding SNMP specifica-tions as far as possible.

iIP stack and dynamic routing in IP (OSPF) are not supported in the current release.

44 A42022-L5936-C51-1-7618


2.3.7.3 Communication Interfaces

Fig. 2.10 Communication Interfaces and Controller Architectureof SURPASS hiT 7550 2.05

SURPASS hiT 7550 2.05 uses a two-level control hierarchy (see Fig. 2.10):– A high level system controller, which serves as gateway for the system, implements

the MCF function, the Q3 stacks and the Q3 agent. It performs the complete pro-cessing of the Q3 object model and supports the central system functions.

– A low-level card controller (LCC) on each active card which performs the necessaryon-card functions. In extension subracks, a shelf management unit (SMU) – as asimple LCC – provides limited supervision for the subrack. Passive cards(e. g. OMDxx, SAB(M), MIBS, UDCM modules) do not have an LCC, they areequipped with an EEPROM with inventory data stored on it.

TMN Control Synopsis

Fig. 2.11 shows a condensed view of the supported stack profiles. In the following sub-sections an overview of the communication stack profiles supported at the communica-tion interfaces is given.

In Fig. 2.11 a complete overview of the stack profiles is given. In Fig. 2.12 an overviewis given, which information models (interface dialects) are supported at which physicalinterface. The complete stack profiles for the interfaces are shown in the following sub-sections describing the physical interfaces.

PCB_2

LCC

supervisor/DCC

EEPROM

passivecards

LCC

card

LCC

card

LCC

SMU

LCC

card

LCC

SMU

main subrackextension subrackEOW, sV.11

dry loop contacts

power

SPI SPI

DCC

CAN-bus

PCB_1

AUI/10baseT 10baseTHigh Level System Controller

Rack AlarmsQ-FRS 232

on NEAP

Ethernet

NCT/LCT

Q3

onCOPA

Q3

OSS

A42022-L5936-C51-1-7618 45



Fig. 2.11 Synopsis of Applications, Communication Stacks and Interfaces

CMIP agent (DSET)application

Transport TP4

CLNPTCP/IP socket interface

IP

RFC1006 accessTCP

ACSE

Presentation

Session

Transport TP0

ES-IS IS-ISrouting

Static and/or OSPFrouting

TL1

agent

telnetTCP

Web/Javaagent

httpTCP

OtherIP

applic.

debug

SMTP

UDP

driver driverdriver

Ethernet access

LAPD access

EthernetNI

DCCNetwork Interface (NI)

with PPP framing

PPPNI

dual mode

ETHERNET

dual mode(streams multiplex)

DCC (HDLC)

IP modeasynchronous PPP

RS-232

LAPD

streamsdriver

46 A42022-L5936-C51-1-7618


Fig. 2.12 Information Model of the Physical Interfaces

Ethernet (B3) Interface

See Fig. 2.10 and Fig. 2.12.

The Ethernet interface provides for management purposes control of the NE by multipleQ3 managers (e. g. an OSS and an NCT) and the above mentioned application proto-cols. The Ethernet interface is provided via 10BaseT. The 10BaseT interface providesa point-to-point connection usually to a hub/switch, which in turn realizes the logicalbroadcast network topology.

OSI layer 3 protocol (CLNP, ES-IS and IS-IS) and IP packets can be distinguished bythe use of different frame types with a dual mode driver.

Extension Ethernet Interface

An additional Ethernet interface is provided (10BaseT or 100BaseT; the HW supportsboth). It is located at the Network Element Alarm Panel (NEAP).

RS-232/V.24 (F) Interface


The F-interface provides for management control of the NE from a PC-based Local CraftTerminal (LCT) using a simple point to point (PPP) RS-232/V.24 interface. PPP servesas the data link (layer 2) protocol and is directly being used by the TCP/IP stack. Besides

Q3, CMIP (CLNP, OSI)Q3, CMIP (TCP/IP)

Q3, CMIP (CLNP, OSI)Q3, CMIP (TCP/IP)

Q3, CMIP (TCP/IP over PPP)

DCC (OSC)

B3

(10B

aseT

,Eth

erne

t)F

(RS

-232

/V.2

4)

TL1 (TCP/IP)

TL1 (TCP/IP)

TL1 (TCP/IP)

SURPASS hiT7550 2.05

LCT

TNMS orNCT

SURPASS hiT7550 2.05

NE NE

iThat because of compatibility to existing OSI networks a switch in DCC exists to decidewhether only OSI, OSI and TCP/IP or only TCP/IP packages are transported. Depend-ing on that switch the according packages can be transported and routed in the DCC.

iFor the current release the extension ethernet interface is not activated.

A42022-L5936-C51-1-7618 47



the IP based applications (TL1, Web Terminal) Q3-CMIP management is possible viaRFC1006. Control of remote NEs however is not possible, as data packets from this in-terface are not routed.

DCC Interfaces


The data communication channels (DCC) are HDLC type serial channels embedded inthe fiber optical signal(s) used for TMN purposes and separate from the payload. Thesupervisory channel SC provides a number of independent serial interfaces for thetransmission of DCC bytes. Four DCC channels are supported by the NE: 2 DCCRo and2 DCCMo.

The data link protocol (layer 2) is LAPD (in unacknowledged mode) for OSI layer 3 pro-tocols (CLNP, ES-IS and IS-IS). IP packets are framed according to PPP. No other fea-tures of PPP are used. With a dual mode driver the packets can be distinguished andhanded over to the corresponding stack. The mode of operation (inactive, OSI only, IPonly, OSI and IP combined) can be specified by management and should be in accor-dance with the mode of the NE at the remote end of the DCC line.

Routing

In a communication network an NE does not only has to care for the information ad-dressed to himself but also has to forward information. For this so called Routing twoprotocols are supported depending on the transport protocol that is supported in theused stack profile. For OSI-stack the ES-IS, IS-IS protocol is used. For TCP/IP stack theOSPF protocol is used, see Fig. 2.11.

It is not possible to route packages between these 2 protocols, i. e. not gateway func-tionality is provided. E. g. it is not possible to receive IP packages on Ethernet and routethem as OSI packages to 7 layer OSI DCC.

However it is possible to route OSI packages via ES-IS, IS-IS from Ethernet to DCC andvice versa as well as it is possible to route IP packages via OSPF from Ethernet to DCCand vice versa. Of course it is possible to “terminate” routing by providing packages toupper-layers of Network Element itself (OSI or IP packages).

2.3.8 EOW InterfaceThe engineering orderwire (EOW) interface can be used to make a telephone connec-tion or conference from one NE to other NEs via handset.

The realized interfaces on the OSCTU module are:– two external 4-wire-interfaces or– one external 4-wire-interface and one 4-wire-interface for the handset with selective

call

The first external 4-wire-interface resp. the 4-wire-interface for the handset can only beused alternatively and not at the same time (4-wire interface #1 is permanently used forthe handset).

4- wire interconnection is possible via a distance of up to 10 m to other NEs. So it is pos-sible to use only one handset in a location with more than one NE and to have telephoneconnections between these systems.

iThe current release supports OSI stack routing.

48 A42022-L5936-C51-1-7618


The EOW channel is mapped to the frame of the optical supervisory channel via the E0-or F0-byte (selected via SW). Coding/decoding the EOW channel is configurable for A-law (ETSI) or µ-law (ANSI).

When the handset is "off hook" or the speech control detects an incoming speech signalon the 4-wire-interface, the E0/F0 bytes are connected to the EOW interface inside theOSCTU module.

A 400 Hz ring tone generator and a dual tone multi frequency (DTMF) dialling receiverare permanently connected to the EOW conference.

The DTMF receiver is always reading both direction lines and the handset interface fora DTMF-signal. The DTMF generator is part of the handset.

A whistler is applied to indicate the conference status.

Support is provided for– collective call– group call– selective call via a configurable 3-digit (each digit = 0 to 9) telephone number; only

selective calls activate an audible tone generator.

In protection DWDM links, a ring manager in one of the OTTs is used to prevent EOWloops. It will only become active for a protection event.

See also technical data in the Chapter "7.7 External Interfaces".

2.3.9 User Data Channels (sV.11)These channels are used for bidirectional sV.11 (s= similar) connections between NEsup to a distance of about 1000 meters.

There are two sV.11 interfaces with a data rate of 64 kbit/s on each OSCTU module (pernetwork element). Each interface can be configured to access one of the optical servicechannel (OSC) bytes F0 or NU1 or NU2. In the OTT these bytes are terminated, in theOLR and OADM they are terminated or passed through (from OSC B to OSC A, mean-ing from side 1 to side 2).

In OTT a user data channel of OSC A can be connected to sV.11 #1 or sV.11#2. In OLRand OADM a user data channel of OSC A and/or OSC B can be connected to sV.11 #1or sV.11#2 or can be passed through.

Codirectional Tx timing (data out, clock out) and contra directional Rx timing (data in,clock out) is applied, both derived from Tx of the optical service channel clock A.


iThe complete EOW-IF is enabled or disabled by configuration. Disabled means allE0/F0 bytes are passed through, no access is possible. Normally OLR and OADM passthrough the E0/F0 bytes and OTT terminates them.

A42022-L5936-C51-1-7618 49



2.3.10 Telemetry Interface (TIF)TIF input monitors and output relay contacts are intended to be used for traditional user-defined “housekeeping” purposes.

For example, the inputs (sensors) are usually configured to activate upon the occur-rence of particular events at the site (fire alarm, over-temperature alarm, door-openalarm, etc.). A TIF input supervises the (negative) input voltage against ground. Activa-tion of an input is reported by the NE as an alarm.

Similarly, the outputs (actors) are normally employed to provide remote control of vari-ous devices at the site. A TIF output is realized with a relay contact switching betweenTIF output and TIF common. Such an (intentional) issued open/close command to anoutput is not considered an alarm.

An inactive TIF output is open (high impedance state), an active output is shorted to TIFcommon (low impedance state).

TIF circuits must be powered by circuits that meet SELV (Safety Extra Low Voltage) lim-its according to Standards UL 1950, VDE 0100-410, and DIN EN 60950.


☞For further information, see the Operator Guidelines (OGL) and the Online Help.

50 A42022-L5936-C51-1-7618


2.3.11 Overview of System BenefitsThe SURPASS hiT 7550 2.05 system provides the following benefits:

Maximum Fibre Utilization Transport capacities of up to 1.6 Tbit/s (160 x 10 Gbit/s)per fibre, upgradeable in a further release to higher bitrates, make SURPASS hiT 7550 2.05 a leader in ultra highcapacity systems.

Extended Reach Ultra-high performance optical amplifiers, optional Ramanamplification and Forward Error Correction (FEC) as wellas Enhanced Forward Error Correction (EFEC) for highestavailable span performance values. Future releases mov-ing into Ultra Long Haul (ULH) dimensions of thousands ofkilometers of pure optical transmission.

Modularity From 1 (2 for light EDFA) to 80 channels for C band (andin a later release: additionally from 2 to 80 channels forL band), in 20 channel increments, minimizes initial invest-ment costs.

Lower Network Costs High system performance reduces the number of costlyelectrical regenerator sites and optical amplifier sites.

Scalability Everything in SURPASS hiT 7550 is scalable, from the op-tical amplifier performance (via external pump modules),scalable multiplexer/demultiplexer concept, to the re-quired number of terminal or add/drop channels.

Compactness High equipment density results in the most compactDWDM solution including all interfaces. Up to 640 Gbit/s ina single 7-foot bay (assuming each 16 transponders10 Gbit/s in 2+2 subracks of back-to-back racks) usingspace-efficient wavelength transponders.

Simplified Network Design Reduced amount of equipment and module variants re-quired reduces support and maintenance costs.

Sophisticated OpticalControl

SURPASS hiT 7550 2.05 employs numerous techniquesto ensure the quality of the end signal; dynamic gain andoutput power control to adjust for gain and power fluctua-tions, spectral gain control to adjust for gain tilt variations(particularly Raman Gain Tilt variations), end-to-end pre-emphasis for fine tuning of channel OSNR and power vari-ations, integrated ASE filter, gain flattening filter and tilt-able filter, to name but just a few.

Fibre Type Flexibility Suitable for operation with all major fibre types, i. e. SSMF,NZDSF and DSF. Integrated dispersion compensation tai-lored for each fibre's requirements.On special request: Standalone L Band application de-signed specifically for DSF networks.

A42022-L5936-C51-1-7618 51



OADM Flexibility Sophisticated SURPASS hiT 7550 2.05 OADM solutionswith remote add/drop configurability up to 100%. Solutionsare tailored according to customers current and foresee-able traffic requirements at a particular site and are scal-able from 1 to 32 add/drop channels (in the 20% OADM)or from 1 to 160 add/drop channels (in the 100% OADMfor C+L band).

Service Flexibility Almost all services are supported by SURPASS hiT 75502.05 and the SURPASS hiT 7540 (OCU) due to the inher-ent transparency of the DWDM system and the transpar-ency built-in to the transponders. Therefore a carrier isflexible to meet all customer requirements, be it SDH/SO-NET or IP/ATM based services.

Integrated Solutions Fully integrated DWDM solutions in conjunction with:−

−−

-

Siemens 2.5 Gbit/s SDH line systems (SL16, SLR16,WTTR)Siemens 10 Gbit/s SDH line systems (SL64),10 Gbit/s TDM 'thin' multiplexing transponder (TEX)cards, which combine 4 x 2.5 Gbit/s signals into one10 Gbit/s signal, thereby increasing fibre optimization.The TEX module is housed and managed within thesubrack of SURPASS hiT 7540 (OCU)Sycamore OEM Cross Connect SN16000

Multi-vendor Solutions Via the SURPASS hiT 7540 (OCU) 10 Gbit/s transponder,your legacy 10 Gbit/s terminal equipment can be inter-faced to SURPASS hiT 7550 2.05. The 10 Gbit/s tran-sponder transmitting lasers are wavelength tunable forreduced spare log.

Optical PerformanceAnalyzer

Built-in enhanced optical monitoring capability.

Survivability Against fibre or equipment outages is possible with theOSN Optical Channel Protection Unit (OCP) which pro-vides 1+1 optical protection switching per channel.

Network Management As with all Siemens optical networking products,SURPASS hiT 7550 2.05 is managed via the TransportNetwork Management System (TNMS), using the latest inarchitecture technology for the most advanced networkmanagement solution. For maintenance and small to me-dium network purposes each product may also be man-aged via Element Manager (EM).

Evolution The SURPASS hiT 7550 2.05 platform is already 'futureproof' for next generation ultra-high capacity networks,and is set to expand with Ultra Long Haul (ULH) capability.

52 A42022-L5936-C51-1-7618


A42022-L5936-C51-1-7618 53



3 FunctionalityThis chapter describes the SURPASS hiT 7550 2.05 functionality. The chapter consistsof the following sections:• Frequency/Wavelength Bands• Functional Overview of the NE Types• Functional Overview of the Modules• Synchronization• Control and Monitoring via the Element Manager• Control and Monitoring via Network Management System

3.1 Frequency/Wavelength Bands

3.1.1 “C” and “L” Wavelength BandsThe SURPASS hiT 7550 2.05 system uses a maximum of 160 wavelengths, divided intogroups (see Fig. 3.1 and Fig. 3.2). Half of the wavelengths (i. e., 80 of them) are in the"C" (Conventional) band. The other 80 are in the "L" (Long) band.

Fig. 3.1 SURPASS hiT 7550 2.05 Wavelength Plan

As shown in Tab. 3.1 and Tab. 3.2, the "C" band consists of:– 40 "Blue" (shorter) wavelengths, spaced at 50 GHz– an unused gap of approximately 4 nm– 40 "Red" (longer) wavelengths, also spaced at 50 GHz.

Similarly (see Tab. 3.3 and Tab. 3.4), the "L" band consists of:– 40 "Blue" (shorter) wavelengths, spaced at 50 GHz– an unused gap of approximately 4 nm– 40 "Red" (longer) wavelengths, also spaced at 50 GHz.

Note:The last column in Tab. 3.1 to Tab. 3.4 shows the wavelength upgrade order. This isthe order to be considered if new channels are to be added to the C band (or L band) in

iRemember: although described below the current release makes no use of the L band!

C2 C3 C4 L1 L2 L3 L4

C6 C7 C8 L5 L6 L7 L8

C band L band

C1

C5

C

190.9 THz1570.41 nm

186.5 THz1607.46 nm

LC12

C56

C34

C78

L12

L56

L34

L78

196.1 THz1528.77 nm

191.7 THz1563.86 nm

54 A42022-L5936-C51-1-7618


case no 100% OADMs are used. Else the upgrade sequence also depends on the trafficmatrix including add/drop channels.

3.1.1.1 40 Blue Wavelengths in the C Band (Subbands C1/C2 and C5/C6)

Frequency

(THz)

Wavelength

(nm)

Sub-band Channel Number Add/Drop Channel Upgrade

Order in C band

196.10 1528.77 C1 1 40196.05 1529.16 C5 2 80196.00 1529.55 C1 3 39195.95 1529.94 C5 4 79195.90 1530.33 C1 5 38195.85 1530.72 C5 6 78195.80 1531.11 C1 7 CAD2C1C1 37195.75 1531.50 C5 8 CAD2C5C5 77195.70 1531.89 C1 9 36195.65 1532.29 C5 10 76195.60 1532.68 C1 11 35195.55 1533.07 C5 12 75195.50 1533.46 C1 13 CAD2C1C1 34195.45 1533.85 C5 14 CAD2C5C5 74195.40 1534.25 C1 15 33195.35 1534.64 C5 16 73195.30 1535.03 C1 17 32195.25 1535.43 C5 18 72195.20 1535.82 C1 19 CAD2C1C2 31195.15 1536.21 C5 20 CAD2C5C6 71195.10 1536.61 C2 21 CAD2BC2C2 30195.05 1537.00 C6 22 CAD2BC6C6 70195.00 1537.39 C2 23 CAD2BC2C2 29194.95 1537.79 C6 24 CAD2BC6C6 69194.90 1538.18 C2 25 CAD2C1C2 28194.85 1538.58 C6 26 CAD2C5C6 68194.80 1538.97 C2 27 27194.75 1539.37 C6 28 67194.70 1539.76 C2 29 23194.65 1540.16 C6 30 66194.60 1540.55 C2 31 CAD2C2C2 25194.55 1540.95 C6 32 CAD2C6C6 65194.50 1541.35 C2 33 22194.45 1541.74 C6 34 62194.40 1542.14 C2 35 24194.35 1542.54 C6 36 64194.30 1542.93 C2 37 CAD2C2C2 26194.25 1543.33 C6 38 CAD2C6C6 63194.20 1543.73 C2 39 21194.15 1544.12 C6 40 61194.10 1544.52 sub-band limit194.05 1544.92 not used194.00 1545.32 not used193.95 1545.72 not used193.90 1546.12 not used193.85 1546.51 not used193.80 1546.91 not used193.75 1547.31 not used193.70 1547.71 sub-band limit

Tab. 3.1 40 Blue Wavelengths in the "C" (Conventional) Band

A42022-L5936-C51-1-7618 55



3.1.1.2 40 Red Wavelengths in the C Band (Subbands C3/C4 and C7/C8)

3.1.1.3 40 Blue Wavelengths in the L Band (Subbands L1/L2 and L5/L6)

Frequency

(THz)

Wavelength

(nm)


Order in C band

193.65 1548.11 C7 41 41193.60 1548.51 C3 42 1193.55 1548.91 C7 43 CAD2C7C7 44193.50 1549.31 C3 44 CAD2C3C3 4193.45 1549.71 C7 45 45193.40 1550.11 C3 46 5193.35 1550.51 C7 47 43193.30 1550.91 C3 48 3193.25 1551.32 C7 49 CAD2C7C7 46193.20 1551.72 C3 50 CAD2C3C3 6193.15 1552.12 C7 51 47193.10 1552.52 C3 52 7193.05 1552.92 C7 53 48193.00 1553.33 C3 54 8192.95 1553.73 C7 55 CAD2C7C8 49192.90 1554.13 C3 56 CAD2C3C4 9192.85 1554.53 C7 57 CAD2BC7C7 50192.80 1554.94 C3 58 CAD2BC3C3 10192.75 1555.34 C7 59 CAD2BC7C7 51192.70 1555.74 C3 60 CAD2BC3C3 11192.65 1556.15 C8 61 CAD2C7C8 52192.60 1556.55 C4 62 CAD2C3C4 12192.55 1556.96 C8 63 53192.50 1557.36 C4 64 13192.45 1557.76 C8 65 54192.40 1558.17 C4 66 14192.35 1558.57 C8 67 CAD2C8C8 55192.30 1558.98 C4 68 CAD2C4C4 15192.25 1559.39 C8 69 56192.20 1559.79 C4 70 16192.15 1560.20 C8 71 57192.10 1560.60 C4 72 17192.05 1561.01 C8 73 CAD2C8C8 58192.00 1561.42 C4 74 CAD2C4C4 18191.95 1561.82 C8 75 59191.90 1562.23 C4 76 19191.85 1562.64 C8 77 42191.80 1563.04 C4 78 2191.75 1563.45 C8 79 60191.70 1563.86 C4 80 20

Tab. 3.2 40 Red Wavelengths in the "C" (Conventional) Band

Frequency

(THz)

Wavelength

(nm)


Order in L band

190.90 1570.41 L1 81 20190.85 1570.82 L5 82 60190.80 1571.24 L1 83 2190.75 1571.65 L5 84 42

Tab. 3.3 40 Blue Wavelengths in the "L" (Long) Band

56 A42022-L5936-C51-1-7618


190.70 1572.06 L1 85 19190.65 1572.47 L5 86 59190.60 1572.88 L1 87 CAD2L1L1 18190.55 1573.30 L5 88 CAD2L5L5 58190.50 1573.71 L1 89 17190.45 1574.12 L5 90 57190.40 1574.54 L1 91 16190.35 1574.95 L5 92 56190.30 1575.36 L1 93 CAD2L1L1 15190.25 1575.78 L5 94 CAD2L5L5 55190.20 1576.19 L1 95 14190.15 1576.61 L5 96 54190.10 1577.02 L1 97 13190.05 1577.44 L5 98 53190.00 1577.85 L1 99 CAD2L1L2 12189.95 1578.27 L5 100 CAD2L5L6 52189.90 1578.68 L2 101 CAD2BL2L2 11189.85 1579.10 L6 102 CAD2BL6L6 51189.80 1579.51 L2 103 CAD2BL2L2 10189.75 1579.93 L6 104 CAD2BL6L6 50189.70 1580.35 L2 105 CAD2L1L2 9189.65 1580.76 L6 106 CAD2L5L6 49189.60 1581.18 L2 107 8189.55 1581.60 L6 108 48189.50 1582.01 L2 109 7189.45 1582.43 L6 110 47189.40 1582.85 L2 111 CAD2L2L2 6189.35 1583.27 L6 112 CAD2L6L6 46189.30 1583.69 L2 113 3189.25 1584.10 L6 114 43189.20 1584.52 L2 115 5189.15 1584.94 L6 116 45189.10 1585.36 L2 117 CAD2L2L2 4189.05 1585.78 L6 118 CAD2L6L6 44189.00 1586.20 L2 119 1188.95 1586.62 L6 120 41188.90 1587.04 sub-band limit188.85 1587.46 not used188.80 1587.88 not used188.75 1588.30 not used188.70 1588.72 not used188.65 1589.14 not used188.60 1589.56 not used188.55 1589.99 not used188.50 1590.41 sub-band limit

Frequency

(THz)

Wavelength

(nm)


Order in L band

Tab. 3.3 40 Blue Wavelengths in the "L" (Long) Band (Cont.)

A42022-L5936-C51-1-7618 57



3.1.1.4 40 Red Wavelengths in the L Band (Subbands L3/L4 and L7/L8)

3.1.2 Interleaver DevicesEach wavelength band (Blue C band, Red C band, Blue L band and Red L band) con-sists of 40 channels spaced at 50 GHz. In the demux direction, an interleaver separatesa 40-channel band into two 20-channel bands, each with 100 GHz spacing(see Fig. 3.2). In other words, the interleaver separates all the "even numbered" chan-nels and places them on one fiber and all the "odd numbered" channels and places themon another fiber. Now, the wavelengths are far enough apart (100 GHz) to use thin-filmfilter devices to completely demultiplex these 20-channel sub-bands into the individual

Frequency

(THz)

Wavelength

(nm)


Order in L band

188.45 1590.83 L7 121 61188.40 1591.25 L3 122 21188.35 1591.67 L7 123 CAD2L7L7 63188.30 1592.10 L3 124 CAD2L3L3 26188.25 1592.52 L7 125 64188.20 1592.94 L3 126 24188.15 1593.37 L7 127 62188.10 1593.79 L3 128 22188.05 1594.21 L7 129 CAD2L7L7 65188.00 1594.64 L3 130 CAD2L3L3 25187.95 1595.06 L7 131 66187.90 1595.49 L3 132 23187.85 1595.91 L7 133 67187.80 1596.34 L3 134 27187.75 1596.76 L7 135 CAD2L7L8 68187.70 1597.19 L3 136 CAD2L3L4 28187.65 1597.61 L7 137 CAD2BL7L7 69187.60 1598.04 L3 138 CAD2BL3L3 29187.55 1598.46 L7 139 CAD2BL7L7 70187.50 1598.89 L3 140 CAD2BL3L3 30187.45 1599.32 L8 141 CAD2L7L8 71187.40 1599.74 L4 142 CAD2L3L4 31187.35 1600.17 L8 143 72187.30 1600.60 L4 144 32187.25 1601.02 L8 145 73187.20 1601.45 L4 146 33187.15 1601.88 L8 147 CAD2L8L8 74187.10 1602.31 L4 148 CAD2L4L4 34187.05 1602.74 L8 149 75187.00 1603.16 L4 150 35186.95 1603.59 L8 151 76186.90 1604.02 L4 152 36186.85 1604.45 L8 153 CAD2L8L8 77186.80 1604.88 L4 154 CAD2L4L4 37186.75 1605.31 L8 155 78186.70 1605.74 L4 156 38186.65 1606.17 L8 157 79186.60 1606.60 L4 158 39186.55 1607.03 L8 159 80186.50 1607.46 L4 160 40

Tab. 3.4 40 Red Wavelengths in the "L" (Long) Band

58 A42022-L5936-C51-1-7618


wavelengths. This is achieved by the various "OD20" plug-in cards (OD20C1C2,OD20C3C4, OD20L1L2, etc.)

Everything operates in reverse for the mux direction. Individual wavelengths spaced at100 GHz are input to the proper OM20 plug-in cards, each of which mux together up to20 wavelengths, and places them all on one fiber. Two such fibers (each carrying 20wavelengths at 100 GHz spacing) are routed to an interleaver. The interleaver "weavestogether" these wavelengths, placing all 40 wavelengths (with 50 GHz spacing) onto onefiber.

The interleavers make use of Mach-Zehnder interferometer technology. In this design,an unequal fiber path length between two 3 dB couplers creates the interference. Bycarefully controlling the path length difference, the channel spacing can be set to the de-sired value. Because of the all-fiber design, this technology has very low loss, low dis-persion, and small polarization-dependent effects.

A42022-L5936-C51-1-7618 59



Fig. 3.2 ’SURPASS hiT 7550 2.05’ Wavelength Bands and Sub-Bands

"C" (Conventional) Band1528.77 nm to 1563.86 nm196.10 THz to 191.70 THz

"L" (Long) Band1570.41 nm to 1607.46 nm190.90 THz to 186.50 THz

1528.77nm

1570.41nm

1544.13nm

1586.62nm

1548.11nm

1590.83nm

1563.86nm

1607.46nm

40 Blue C band wavelengthsspaced at 50 GHz

40 Blue L band wavelengthsspaced at 50 GHz

40 Red C band wavelengthsspaced at 50 GHz

40 Red L band wavelengthsspaced at 50 GHz

gap gapgap

The 80 C band wavelengthsare in two groups of 40:the "Blue" C band andthe "Red" C band, both

spaced at 50 GHz.

The 80 L band wavelengthsare in two groups of 40:the "Blue" L band andthe "Red" L band, both

spaced at 50 GHz.

The 40 Blue C bandwavelengths consistof 4 sub-bands, eachat 100 GHz spacing.

The 40 Blue L bandwavelengths consistof 4 sub-bands, eachat 100 GHz spacing.

The 40 Red C bandwavelengths consistof 4 sub-bands, eachat 100 GHz spacing.

The 40 Red L bandwavelengths consistof 4 sub-bands, eachat 100 GHz spacing.

C1 L1C3 L3

C5 L5C7 L7

C2 L2C4 L4

C6 L6C8 L8

C1,C

2,C5,and

C6

C3,C

4,C7,and

C8

L3,L4,L7,andL8

L1,L2,L5,andL6

sub-bands

sub-bands

sub-bands

sub-bands

50/100 GHzInterleaver




The transition from 100-GHz spaced sub-bands to 50-GHz spaced sub-bands (and vice-versa) isaccomplished via Interleaver devices.

C1

/C2

L1/L2

C3

/C4

L3/L4

C5

/C6

L5/L6

C7

/C8

L7/L8

60 A42022-L5936-C51-1-7618


3.2 Functional Overview of the NE TypesThere are four SURPASS hiT 7550 2.05 NE types:– SURPASS hiT 7550 2.05 Optical Transport Terminal Unidirectional (OTTU) for

160 channel DWDM capability; all channels are multiplexed or demultiplexed andpreemphasis is terminated at OTTU

– SURPASS hiT 7550 2.05 Optical inLine Repeater Unidirectional (OLRU), provid-ing powerful inline amplification of 160 channels - up to 160 per wavelength per fibrein a unidirectional, two-fibre configuration (3.2 Tbit/s total bandwidth)

– SURPASS hiT 7550 2.05 Optical Add/Drop Multiplexer Unidirectional (OADMU)which permits the extraction and insertion of channels at intermediate line amplifiersites.

– SURPASS hiT 7550 2.05 Channel Connection Unit (CCU), an NE with amplifi-er/switch modules OCA/OCAS (C band only), and pure switch modules OCS for in-terconnection (express channel or add/drop of traffic)

3.2.1 OTT(U)The choice and structure of the optical multiplexing technology for the ’SURPASS hiT7550 2.05’ Optical Transport Terminal Unidirectional (OTTU) takes several factors intoconsideration, such as the channel granularity requirements, the reliability of the tech-nology, modularity and subsequent upgradability, and the ability of supporting the useof subband dispersion compensation schemes.

SURPASS hiT 7550 2.05 supports 160 wavelengths of the 50 GHz ITU-T G.692 wave-length grid.

3.2.1.1 Optical PathAs an example Fig. 3.3 shows the optical path through the OTTU (C band, upgradableto C+L band).

The OTTU uses OM / OD20 modules, subband filters and interleavers.For standalone C band OTTU simply replace OLITBC by OLITBNC, OLITPC by OLIT-PNC modules. For standalone L band OTTU replace all C band modules by respectiveL band types and omit upgrade section.

The preamplifier OLITP may be supported by Pump A/B/C modules or alternatively byRPUMP modules.

If an Optical Performance Analyzer module OPA (not shown in Fig. 3.3) is applied (onlyone of these, OPA or RPUMP module may be equipped), up to four monitoring inputsare used: in transmit direction (after the booster), 80 channels in C band (and 80 chan-nels in L band) are connected to a 3 dB coupler input into the OPA. In receive directionalso 80 channels in C Band (and 80 channels in L band) after the preamplifier are con-nected to a 3 dB coupler input into the OPA. One OPA monitors 320 channels, to getoptical performance information on a per channel basis.

An OSCTUT module terminates and processes the OSC.

i“Unidirectional” in the NE type description, e. g. OLRU, refers to the fact that two fibresare used for the optical transmission between SURPASS hiT 7550 2.05 NEs. One fibrecarries the signals of one direction, and the other fibre carries the signals for the counterdirection, hence allowing the transmission of several (up to 160) bi-directional channelsover two fibres. This nomenclature is used to distinguish the system from other DWDMsystems which transmit both signal directions on one optical fibre.

A42022-L5936-C51-1-7618 61



Configurable channel input power ranges enable the interconnection of OTTUs from de-mux (ODA) to mux via OCA or OCAS modules in between (see also 3.2.3.3).

Fig. 3.3 OTTU, Optical Path Structure for C Band(Upgradable to C+L Band)

Mux

/Dem

uxO

M20

x/O

D20

xIn

terle

aver

OM

D2I

CC

band

red/

blue

filte

rO

MD

FIC

Opt

ical

line

ampl

ifier

mod

ules

OLI

TP

C+

OLI

TB

C,

with

sev

eral

pum

p m

odul

es,

disp

ersi

on c

ompe

nsat

ion

mod

ules

UD

CM

and

opt.

serv

ice

chan

nel m

odul

e O

SC

TU

T

62 A42022-L5936-C51-1-7618


3.2.1.2 Four Stage Design from 1 to 160 ChannelsThe multiplexing architecture supported by SURPASS hiT 7550 2.05 is based on bandseparation filters, frequency interleavers, and dielectric multiplexer/demultiplexer filters.The four stages of demultiplexing a 160 channel DWDM signal into 160 individual clientsignals are described as follows and represented graphically in Fig. 3.4.

1. A C/L Band separation filter is used to split the co-directional C and L Band wave-lengths into two separate C and L wavelength bands. Each of these bands consistsof 80 channels with 50 GHz spacing.

2. Red/Blue band separation filters are used to split the C Band in half (for simplificationonly the C Band is looked at). For example, the 80 Channel C Band wavelengths aresplit into the C-Red Band and C-Blue Band, each with 40 wavelengths.

3. A 50 GHz period device called an interleaver is required per Red/Blue C Band. Theinterleaver has two sub-band outputs, and every second wavelength is filtered to thefirst sub-band output, the remaining wavelengths to the second sub-band output.This has the effect of doubling the wavelength frequency, so all wavelengths are nowspaced at 100 GHz. Each sub-band consists of 20 wavelengths with 100 GHz spac-ing, and the pair of sub-bands is frequency shifted by 50 GHz. Note that in theC Band this results in 4 sub-bands of 20 channels, two blue and two red bands.

4. Finally, a 100 GHz dielectric filter separates the 20 channel sub-band into the indi-vidual 20 channels. This stable technology was chosen to provide the lowest costper channel.

A42022-L5936-C51-1-7618 63



Fig. 3.4 Block Diagram of C Band ’SURPASS hiT 7550 2.05’Multiplexer Architecture Scheme

The same concept applies in the reverse direction when multiplexing one channel intoa 160 channel DWDM signal. If only either the C Band or the L Band have been imple-mented, there is a maximum capacity of 80 channels, and the C/L Band filter stage canbe bypassed. It is also possible to eliminate the need for the third multiplexing stage, theinterleaver devices, if only 100 GHz spacing is required, a substantial cost saving.

3.2.1.3 Multiplexer ModularityThe multiplexing architecture described above and the hardware components which im-plement this architecture lend itself to modularity benefits, which allow the customer tooptimize his equipping requirements. In summary:– The decision for a maximum number of 40 or 80 channels per C or L Band. For 40

channels only, the optical interleaver devices are not necessary, reducing equipmentcosts and enabling longer optical transmission distances.

– The decision for a maximum number of 80 or 160 channels for combined C & L Bandapplications. For 80 channels only (40 + 40, C & L combined applications), the opti-

C+L bands

at 50 GHzC

L

inte

rle

aver

C-b

and

red

/blu

efi

lter

inte

rlea

ver

40 Blue C band channels

80ch

ann

els

C-b

and

80ch

ann

els

L-b

and

20 Blue C-band channels

20 Red C-band channels

20 Blue C-band channels



spaced at 50 GHz

spaced at 100 GHz

spaced at 100 GHz

spaced at 100 GHz

spaced at 100 GHz

spaced at 50 GHz

spac

edat

50G

Hz

spac

eda

t50

GH

z

Stage 1C band / L band

Filter

Stage 2Blue / Red

Filter

Stage 3Interleavers

Stage 4100 GHz

DielectricMux/Demux

Mu

x/D

em

ux

Mu

x/D

em

ux

Mu

x/D

em

ux

Mu

x/D

em

ux

Ch1 - 20

Ch21 - 40

Ch41 - 60

Ch61 - 80

Same 4-stage structure for L-band mux/demux.L-band channels are numbered 81 - 160.

64 A42022-L5936-C51-1-7618


cal interleaver devices are not necessary, reducing equipment costs and enablinglonger optical transmission distances.

– For every 20 channels, a new 20 channel multiplexer/demultiplexer pair is required.– The access points between the red/blue filters and the interleaver devices allow a

sophisticated dispersion compensation concept, including sub-band filters andslope varying filters, to improve system performance.

3.2.1.4 Multiplexer EquippingThe following modules are required to implement the multiplexer architecture describedin the previous sub-sections. The first stage of demultiplexing (last stage of multiplex-ing), the C/L Band separation filters, are found on the optical amplifier modules (OLI)and are hence not represented in Tab. 3.5 below.

Module Name Stage 2 Stage 3 Stage 4

C/L Band Filters Red/Blue Band Interleav-

ers

20 channel Sub-Band

Dielectric Filters

OMDFIC 1 x C-Blue/Red, red reflect-

ing type, &

1 x C-Blue/Red, blue reflect-

ing type

2 x C-Red interleavers -

OMDFIL 1 x L-Blue/Red, red reflecting

type, &

1 x L-Blue/Red, blue reflect-

ing type

2 x L-Blue interleavers -

OMDFC 1 x C-Blue/Red, red reflect-

ing type, &

1 x C-Blue/Red, blue reflect-

ing type

- -

OMDFL 1 x L-Blue/Red, red reflecting

type, &

1 x L-Blue/Red, blue reflect-

ing type

- -

OMD2IC - 2 x C-Blue interleavers -

OMD2IL - 2 x L-Red interleavers -

OM20 - - 20 channel Multiplexer

OD20 - - 20 channel Demultiplexer

ODA20 - - 20 channel Demultiplexer

with VOAs at each output

Tab. 3.5 List of SURPASS hiT 7550 2.05 Multiplexer Modules

A42022-L5936-C51-1-7618 65



3.2.2 OLRUThe Siemens Optical inLine Repeater Unidirectional (OLRU) allows extended reachDWDM solutions on 10 Gbit/s transmission systems, removing the need for costly mul-tiple signal electrical regenerator sites. The optical amplification is provided via ErbiumDoped Fibre Amplifier (EDFA) technology. SURPASS hiT 7550 2.05 utilizes broadbandEDFAs in the C (Conventional) and L (Long) Band of wavelengths, whereby 160 chan-nels are simultaneously, optically amplified, pushing optical transmission distances upto 1000 km and allowing higher bit rates of individual wavelengths.

OLRU boosts the channel power, adjusts the power tilt and compensates for dispersion.

3.2.2.1 Optical PathAs an example Fig. 3.5 shows the C band version (upgradable to C+L band) of theOLRU. Each of the two directions has an optical line amplifier (OLI module) for theC Band. The OLI modules may have pump A/B/C modules. Raman pump modules maybe used in front of the OLI inputs to extend transmission distances.

If an Optical Performance Analyzer module OPA (not shown in Fig. 3.5) is applied, upto four monitoring inputs are used in the OPA module: the C Band (and the L Band) inboth transmission directions (corresponds to a total of 320 channels) are monitored atthe output of the optical line amplifier. OPA is used to get optical performance informa-tion on a per channel basis.

Fig. 3.5 OLRU, Optical Path Structure for C Band

iOPA module and Raman amplifier module RPUMP use the same slot. Therefore onlyone of these may be equipped.

Optical line amplifier modules OLITIC,with several pump modules,

dispersion compensation modules UDCMand opt. service channel module OSCTUI

66 A42022-L5936-C51-1-7618


An OSCTUI module terminates and processes the OSC on line side 1 and line side 2 ofthe OLRU.

The C Band standalone OLRU originates from this figure by replacing OLIIC modulesby OLIINC modules and omitting the L Band upgrade section. The L Band standaloneOLRU originates from this figure by replacing all C Band modules by the respectiveL Band modules and omitting the upgrade section.

3.2.2.2 Scalability of DWDM CapacitySURPASS hiT 7550 2.05 transmits from 1 up to 160 wavelengths over a single physicalfibre, using a 50 GHz frequency spacing between the individual 'colored' carriers. Boththe C Band (1528 to 1564 nm) and the L Band (1570 to 1607nm) wavelengths are usedin both transmission directions, combining their capacity of 80 channels per band.Hence the total capacity is up to 160 bi-directional channels over 1 fibre pair, or 2 x1.6 TBit/s. The C and L Band wavelengths are optically amplified by separate C and LBand EDFAs.

Fig. 3.6 Two Fibre, SURPASS hiT 7550 2.05 C+L Band Amplifier Configuration

Operation in either the C or in the L Band only is also possible, in which case only theEDFAs required for the particular Band of operation are necessary. A smooth upgradefrom an 80 Channel C Band only DWDM system to a 160 Channel C+L Band system isenabled via the addition of the Upgrade L Band EDFA modules to the existing C BandEDFA modules, as can be seen in Fig. 3.6. This upgrade strategy allows a minimuminitial investment in infrastructure, by allowing the carrier to begin with an 80 Channel CBand only DWDM system, with the assurance of a non-traffic interrupting upgrade to160 Channels with the addition of the L Band amplifier modules.

MU

X C

DE

MU

X C

DE

MU

X L

MU

X C

MU

X L

MU

X L

OLITBC OLITBCOLIIC OLITPC

CAD2OLITBUL OLITBULOLIIUL OLITPUL

A AA AB BBC CC

A AA AB BBC CC

PUMPS PUMPSPUMPS PUMP


DCM DCMDCM DCM

DCM DCMDCM DCM

OTT

OLITPC

OLITPUL

A

A

PUMP

PUMP

DCM

DCM

OLR OADMfixed

add/drop

fixedadd/drop

Configurableadd/drop


DE

MU

X C

DE

MU

X L

OTT

MU

X C

DE

MU

X C

DE

MU

X L

MU

X C

MU

X L

MU

X L

OLITBCOLITBCOLIIC OLITPC

CAD2 OLITBULOLITBULOLIIUL OLITPUL

AA A A BB B CC C

AA A A BB B CC C

PUMPSPUMPS PUMPS PUMP


DCMDCMDCM DCM

DCMDCMDCM DCM

OLITPC

OLITPUL

A

A

PUMP

PUMP

DCM

DCM

DE

MU

X C

DE

MU

X L

one direction

other direction

A42022-L5936-C51-1-7618 67



A Standalone L Band DWDM system, as shown in Fig. 3.7, is scalable up to 80 Chan-nels and is recommended for networks with a Dispersion Shifted Fibre (ITU-T Recom-mendation. G.653) base already implemented.

Fig. 3.7 Two Fibre SURPASS hiT 7550 2.05 StandaloneL Band Amplifier Configuration

3.2.2.3 Amplifier VariantsAll EDFAs are located on the Optical Line Interface (OLI) module. Whereby several vari-ants of the OLI module exist to satisfy the different requirements for booster amplifica-tion, inline amplification and preamplification, the basic OLI module design for allvariants uses two different EDFAs (see Chapter 3.3.9).

The main differentiators of the OLI card variants are:– Whether they amplify the optical C Band (C), the optical L Band only (L), or the op-

tical L Band as an upgrade in combination with a C Band system (UL)– Whether they are optimized for operation as either a Terminal Booster (TB), Terminal

Preamplifier (TP) or Inline amplifier (I). Such optimization factors include the powerranges of the optical interfaces and the Automatic Power Shutdown (APSD) thresh-old levels and behavior.

– Depending on the given span lengths and tilt correction requirements there are threedifferent OLI categories: basic, standard, and extended (see Chapter 3.3.9 also).

For illustration, an OLIIC module is the inline amplifier module for the C Band which isnormally equipped in an OLR NE, and an OLITBUL is the booster amplifier module forthe L Band which is found in the OTTU of a C+L Band system. Fig. 3.6 and Fig. 3.7show the usage of the different OLI modules.

3.2.2.4 Multi-Stage Amplifier DesignThe EDFA optical module itself is a three-stage optical amplifier. The mid-stage accesspoints between each EDFA section, as illustrated in Fig. 3.8, allow the addition of inlineoptical components to enhance the performance of the amplification process as well asthe overall network performance. As the attenuation incurred by these mid-stage opticalcomponents is already calculated in the optical link budget, the SURPASS hiT 75502.05 is ready to handle today's and tomorrow's optical networking requirements.

MUX

L

DEM

UX L

MUX

L

OLITBL OLITBLOLIIL OLITPL

A AA AB BBC CCPUMPS PUMPSPUMPS PUMP

DCM DCMDCM DCM

OTT

OLITPL

APUMP

DCM

OLR OADM fixedadd/drop


DEM

UX L

OTT

MUX

L

DEM

UX L

MUX

L

OLITBLOLITBLOLIIL OLITPL

CAD2

AA A A BB B CC CPUMPSPUMPS PUMPS PUMP

DCMDCMDCM DCM

OLITPL

APUMP

DCM

DEM

UX L

one direction

other direction

68 A42022-L5936-C51-1-7618


The first EDFA stage is optimized for amplification of a low power signal and thereforefor low noise amplification. A flat spectral gain is ensured via a gain flattening filter whichis integrated in this first EDFA stage.

Between the first and the second EDFA stages, the first mid-stage access point, devicesfor spectral control of the system are included, such as a Variable Optical Attenuator(VOA) for setting the optimum EDFA gain operating point and a Pre-Tilt compensationfilter to reduce Raman Tilt.

The second EDFA stage provides moderate optical amplification so that the output sig-nal level is appropriate for interconnection to a dispersion compensating module (DCM)situated in the second mid-stage access point.

The third and final EDFA stage is optimized to maximize the amplification of the signalto be sent out on the line.

Fig. 3.8 Stage EDFA Design

3.2.2.5 Amplifier Pump ModularityTo account for the wide variety of optical conditions in backbone networks, such as var-ied span lengths, fibre types, fibre attenuations, chromatic dispersion coefficients, andnon-linear effects, SURPASS hiT 7550 2.05 offers a modular amplifier pump implemen-tation. By varying the number of pump modules equipped, the total output power of theOLI modules can be adjusted to suit the exact network requirements. Each amplifierpumps' current and output power is precisely regulated via hardware and software con-trol loops implemented on the OLI module, which determine the total output power of theoptical amplifier.

Several pump modules are equipped on the OLI module itself, whereas extra pumpmodules (external pumps are not applicable on basic type OLI modules), providingmuch higher total amplifier output powers, may be added via additional plug-in PUMPmodules.

Input

DCF

Output

Stage 2Stage 1 Stage 3

variable opticalattenuator

dynamic tiltadjustment

InterstageDevice

Gain Tilt Monitor (GTM)

ExternalPUMPA card

Connector

ExternalPUMPB card

ExternalPUMPC card

OLI

1)1) 1) 1)

1) ... not applicable for basic type OLI modules2) ... only applicable for extended type OLI modules

2)

Gain Tilt Control(GTC)

A42022-L5936-C51-1-7618 69



The following maximum total output power is available at the OLI module:

The maximum total output power of the OLI module alone is +17 dBm. With the additionof the plug-in unit PumpA, this can be increased to +20 dBm. By adding two extra unitsPumpB and PumpC, a maximum total amplifier output power of +23 dBm can bereached. This means, that with 80 channels maximum per EDFA (remember the C Bandand L Band EDFAs are separate), we can achieve a maximum channel output power ofapproximately +4 dBm per channel. If only 40 channels maximum are equipped perEDFA (i. e. for only 100 GHz channel spacing), then the maximum channel output powercan be increased to +7 dBm, which means even longer optical DWDM links are possi-ble.

The pump modules are suitable for both C Band or L Band optical amplifiers, as well asfor booster amplifiers, preamplifiers or inline amplifiers.

3.2.2.6 Raman AmplificationIn order to extend the distances between inline amplifier sites and the total optical trans-mission reach, SURPASS hiT 7550 2.05 employs one of the sophisticated technologiesavailable for optical amplification, namely Raman amplification. Optical amplifier spac-ings of up to 40 dB are possible with Raman amplification.

The basis of Raman amplification is the energy scattering effect called Stimulated Ra-man Scattering (SRS), a non-linear effect inherent to the fibre itself. SRS involves atransfer of power from a signal at a higher frequency (lower wavelength) to one at a low-er frequency (higher wavelength), due to inelastic collisions in the fibre medium. It canbe used for optical amplification, in which the higher frequency light serves as a pumpsource, amplifying the lower frequency wave carrying the actual traffic signal to be am-plified. Although this is a very broadband process, the approximate required separationbetween the signal wavelength and the Raman pump wavelength for optimal Ramanamplification can be calculated, hence the required pump wavelengths can be deter-mined.

The Raman amplification process occurs at the end of an optical span in SURPASS hiT7550 2.05. When the signal is at it's weakest, it is given renewed energy via the pumplight being inserted at the end of the hop in the reverse direction. Hence only in the lastfew kilometers of a span does the real Raman amplification take place. This is knownas contra-directional Raman pumping, as the Raman pump light is travelling in the op-posite direction to the actual traffic signal.

SURPASS hiT 7550 2.05 employs three different Raman pump modules. There is onemodule for the C Band (RPUMPC), one for the L Band in case of a C+L Band system

Configuration:OLI module

Max. total output powerof the OLI module (approx.)

without pump modules + 17 dBm

PumpA added + 20 dBm

PumpA+PumpB added + 22 dBm

PumpA+PumpB+PumpCadded

+ 23 dBm

Tab. 3.6 Output Power for OLI Module with/without Pumps

70 A42022-L5936-C51-1-7618


(RPUMPUL) and one for a Standalone L Band system (RPUMPL). Just as it is possibleto upgrade a C Band only system with the L Band amplifiers, it is also possible to up-grade a C Band only with Raman system with the L Band amplifiers and L Band Ramanpumps. This is a non-service interrupting upgrade. However, upgrading a C or L Bandsystem to include Raman pumps is traffic interrupting, and therefore when required, Ra-man pumps must be inserted at the receiving line interface from the beginning. The ex-act placement of the Raman pumps is shown in the C+L Band system in Fig. 3.9.

An additional Raman pump module can be inserted at the input of each inline preampli-fier (and – in case of OTTU network elements – terminal preamplifier) to realize a Ra-man amplification.

Fig. 3.9 Two Fibre ’SURPASS hiT 7550 2.05’ C+L Band, Raman Amplifier Configuration

Raman amplification has several significant implications for DWDM systems. It allowsthe spacing between optical amplifiers to be increased, or alternatively allows the sameamplifier spacing to be achieved with lower per channel EDFA output powers. Reducingthe per channel EDFA output powers allows an increase in the total number of opticalspans.

Raman amplifiers are preferable applied to bridge single extra long spans.

Note: Raman pump modules are not applicable with basic type OLI modules.

MUX

C

DEM

UX C

DEM

UX L

MUX

CM

UX L

MUX

L

OLITBC OLITBCOLIIC OLITPCRPUMPC RPUMPC RPUMPC

CAD2

RPUMPUL RPUMPUL RPUMPUL

OLITBUL OLITBULOLIIUL OLITPUL

A AA AB BBC CC

A AA AB BBC CC



DCM DCMDCM DCM

DCM DCMDCM DCM

OTT

OLITPC

OLITPUL

A

A

PUMP

PUMP

DCM

DCM

OLR OADM fixedadd/drop

fixedadd/drop



DEM

UX C

DEM

UX L

OTT

MUX

C

DEM

UX C

DEM

UX L

MUX

CM

UX L

MUX

L

OLITBCOLITBCOLIIC OLITPCRPUMPC RPUMPCRPUMPC

CAD2

RPUMPUL RPUMPULRPUMPUL

OLITBULOLITBULOLIIUL OLITPUL

AA A A BB B CC C

AA A A BB B CC C



DCMDCMDCM DCM

DCMDCMDCM DCM

OLITPC

OLITPUL

A

A

PUMP

PUMP

DCM

DCM

DEM

UX C

DEM

UX L

one direction

other direction

A42022-L5936-C51-1-7618 71



3.2.3 OADM(U)Siemens has developed a unique solution for its Optical Add/Drop Multiplexer Unidirec-tional (OADMU), for the addition and termination of optical signals at intermediate opti-cal amplifier sites, by providing several implementation options. Therefore carriers havethe flexibility to choose the option which best suits their network requirements.

The options are scalable to allow the adding/dropping of one to n number of channels,where “n” depends on the option chosen and can be as much as 100% of the total linecapacity. For an 80 channel C system this translates to 80 channels which can be opti-cally and cost-effectively terminated at intermediate sites. All channels which are notadded/dropped at an OADM site are passed through unaffected.

OADM may statically or dynamically add/drop channels, can through connect or termi-nate subbands, and compensates dispersion.

In case that preemphasis termination is needed for performance reasons, it is recom-mended to use a back-to-back OTT configuration with single channel through connec-tion.

There are two different types of OADM network elements in the current release:• Remotely Configurable 20% OADM (see Chapter 3.2.3.2): realized with CAD2 mod-

ules, 20% of the channels can be added/dropped and they are configurable, the oth-ers are express channels (details are defined during system planning)

• Back-to-Back 100% OADM (see Chapter 3.2.3.3): all channels can be added ordropped via two OTTs with a channel connection unit CCU in between

3.2.3.1 Optical PathFig. 3.10 gives one example of an OADM configuration. It shows the optical path of theconfigurable OADM with CAD switchable add/drop modules, a configuration for C bandstandalone operation at 50 GHz channel spacing. Side 1 is equipped with a raman pumpmodule in front of the line preamplifier module OLITPNC, side 2 is equipped with pumpA, B, and C modules for the booster amplifier modules OLITBNC.

The Optical Multiplexer/Demultiplexer modules OMDFIC and OMD2IC contain the bandfilters for separation of the blue and red sub-bands (within the C band) and the interleav-ers to get a 100 GHz grid (required for the subsequent channel add/drop) from the given50 GHz channel spacing.

Modules EAM4 are used for power equalizing of the four subbands.

An OSCTUI module terminates and processes the OSC on each side of the OADM.

With the OPA module the C band is monitored on line sides (two line sides for interme-diate NEs like OLR and OADM) in both transmission directions, to get optical perfor-mance information on a per channel basis for the incoming and outgoing channels (4measuring ports).

iAdditional OADM configurations with static add/drop channels or a mixture of dynami-cally configurable and static add/drop channels would be deliverable on customer’s re-quest only.

iFigures on a greater variety of OADM configurations are given in the Installation andTest Manual ITMN.

72 A42022-L5936-C51-1-7618


Fig. 3.10 OADMU with CAD2x Modules, Optical Path for C Band Standalone

A42022-L5936-C51-1-7618 73



3.2.3.2 Remotely Configurable 20% OADM(See Fig. 3.10 also).

It is possible in each of the 20 channel sub-bands to drop up to 20% of the maximumtraffic capacity, i. e. up to 4 channels via two serially cascaded optical switch modulesnamed CAD2. Each of these 4 channels may be remotely configured as an “add/drop”channel or to a “through state” via the network management system. The CAD2 moduleis responsible for the extraction of two wavelengths and insertion of the same two wave-lengths being transmitted in one direction, as seen in Fig. 3.11. Therefore two CAD2modules are required for bidirectional channel operation, and it is assumed that all chan-nels are bidirectional. Two wavelengths must be chosen during the network planningand design stage from a total of 8 wavelengths (actually four pre-assigned wavelengthpairs) per sub-band, which means a total of 32 CAD2 modules in total (four CAD2 vari-ants per sub-band x 8 sub-bands). It is also possible that only one wavelength of the twois actually equipped, and the second wavelength can be equipped later. For a detaileddescription of these modules, refer to Chapter "3.3 Functional Overview of the Mod-ules".

Fig. 3.11 Remotely Configurable CAD2 Optical Switch Modules

Configuration changes such as the remote re-configuration of individual channels from“through state” to “add/drop” or vice versa, are non-traffic interrupting. This means a net-work operator can already prepare for a change in traffic topology by passing through awavelength originally, and later configuring the same wavelength to be added/droppedat this OADM site.

An upgrade port on the CAD2 module also allows a plug and play upgrade from 2 to 4channel add/drop per sub-band, with the addition of a second CAD2 module in serieswith the first. E. g. un upgrading CAD2 module could be plugged into a neighbouringslot. As traffic requirements grow, it is possible to add remotely configurable add/dropchannels to a currently unequipped sub-band without disturbing the traffic in the othersub-bands.

In terms of total configurable add/drop capacity, it is possible to drop 16 wavelengthsfrom the C Band (i. e. 16 from 80) and 16 wavelengths from the L Band, which makes atotal of 32 wavelengths from 160. Only two single row subracks are required to house

CAD2

CAD2

λ1 - λ20 λ1 - λ20

λ1 λ1λ 2 λ2

fromEAM4module

74 A42022-L5936-C51-1-7618


the CAD2 modules required for 16 bi-directional add/drop channels in either the C or theL wavelength band.

Power adjustment in the relevant subband is done automatically with the VOAs in theEAM4 module.

Sub-band channels, where CAD2 modules are equipped, but whose wavelengths do notcorrespond to those of the particular CAD2 modules, i. e. the “add/drop” channel wave-lengths, are referred to as “express” channels. Sub-bands where no add/drop require-ments currently exist, and where no CAD2 modules are equipped, are directlyconnected from east to west and vice versa.

Remark: for 20% OADM operation of RPUMP and PUMPA,B,C modules is not possiblein both directions, only RPUMP+PUMPA modules in one direction and RPUMP + PUM-PA,B,C modules in the opposite direction.

3.2.3.3 Back-to-Back 100% OADM(see Fig. 3.12)

Back-to-back 100% OADM is applied for add/drop nodes with high required flexibilityand add/drop capacity. It is also called optical network node ONN and offers 100% ac-cess to all used channels with absolutely free selection between path-through andadd/drop, where full remote control is possible and no manual work has to be done lo-cally.

This type of OADM consists of three network elements:It is realized as two back-to-back terminals (2 network elements OTT) with full demulti-plexing and multiplexing and a channel connection unit (network element CCU, seeChapter 3.2.4 also) with single channel EDFAs in between.

The OTTs contain the OLI amplifier modules and the demultiplexer/multiplexer units, thenetwork element CCU with single channel amplifier modules OCA without switches orOCAS with remotely configurable switches. In the back-to-back 100% OADM demulti-plexer modules from the ODA (with VOAs) type are required.

The add/drop function is remotely configurable on these channel amplifier/switch mod-ules OCAS/OCS of the CCU.

Use of single channel amplifier in CCU is provided for 50 GHz systems.

Instead of these OCA(S) modules in the CCU, also OCR transponders in a network el-ement SURPASS hiT 7540 could be connected to the OM20/OD20 modules of theOTTs.

Due to the 8 subracks limit for CCU, a maximum of 7 x 9 + 8 = 71 OCAS modules canbe equipped in one CCU network element, each module connecting 2 channels per di-rection. Thus a maximum of 71 x 2 = 142 bidirectional channels can remotely be config-ured in one CCU. For a larger number of remotely configurable channels an additionalnetwork element CCU is required.

As an example, Fig. 3.12 shows a back-to-back 100% configurable OADM for C bandstandalone operation with 50 GHz channel spacing. Combinations of demultiplexer/mul-tiplexer modules ODA20/OM20 and filter/interleaver modules are needed in the OTTs.Equipping with demultiplexer/multiplexer modules is mandatory for all used subbands.

A42022-L5936-C51-1-7618 75



Fig. 3.12 Back-to-Back 100% Configurable OADM (C Band Standalone, 50 GHz)

Not

e 1)

Not

e 1)

:A

s sh

own

for

subb

ands

C3C

4, th

e re

mai

ning

sub

band

s ar

e al

so fe

d vi

a O

CA

(S)

mod

ules

.

76 A42022-L5936-C51-1-7618


Between demultiplexer and multiplexer modules of both OTTs, channels may be treatedas required:– connected via CCU, using amplifier/switching modules OCAS (for configurable

add/drop channels, as shown in Fig. 3.12) or OCA (amplifier modules)or

– used as fixed add/drop channels (via interfaces of the modules ODA20/OM20 in theOTTs).

Regardless of their designation as add/drop or express, all channels have to be multi-plexed/demultiplexed.

Every OTT terminates the respective link of the SURPASS hiT 7550 2.05 and thus pre-emphasis is terminated in this type of OADM.

Single channel amplifiers (OCA/OCAS modules) cope with polarization dependent loss(PDL) and enable intermediate preemphasis in a ultra-long-haul path.

3.2.3.4 Connectivity OptionsAlthough the optical Add/Drop hardware modules, whether fixed or remotely config-urable are symmetrical in nature, there is no requirement for symmetrical add/drop traf-fic connectivity. Asymmetrical architectures are also supported. For example, thefollowing OADM topologies are supported (see Fig. 3.13).

Fig. 3.13 Symmetrical and Asymmetrical OADM Architectures

3.2.3.5 OADM CascadabilityThe limit to the number of OADMs which can be cascaded in a SURPASS hiT 7550 2.05DWDM network depends on the following factors: the applied FEC code, the wavelengthspacing, the required total EOL capacity and the number of the same wavelength CAD2modules in series (details are defined during system planning).

number of wavelengths = X



number of wavelengths is<X or >X

OADMU

OADMU

OLRU

OLRU

# of added/droppedwavelengths




=

=

through channels

through channels

Asymmetric OADM Add/Drop

Symmetric OADM Add/Drop

A42022-L5936-C51-1-7618 77



3.2.4 CCUThe channel connection unit (CCU) network element is applied to amplify single chan-nels and/or to switch them between 2 locations (add/drop or pass through with 2x 1:2switches). It houses the amplifier modules OCAC, the amplifier/switch modules OCASCand the switch modules OCS, controlled by one MCU module in the main subrack andby an SMU module in any additional CCU subrack. Each CCU subrack also contains anSAB module with bus termination resistors. CCU can support OCAC, OCAL, OCASC,OCASL and OCS modules in any mix.

The OSCTUT module in the CCU main subrack provides shelf management (like theSMU module) and TIF functions. It also supports (reduced) alarming (e. g. module prob-lem and TIF alarms). TIF interfaces are specified like those of the remaining NE (OTT,OLR, OADM). The CCU also uses the same connector panel COPA.

With CCU network elements, several OTTs and OADMs can be connected together. Ei-ther static connections can be built with OCA (optical channel amplifier) or dynamicadd/drop connections can remotely be built with OCAS (optical channel amplifier withintegrated switch) or OCS (optical channel switch). With CCU this tasks can be used inback-to-back 100% OADM also (see Fig. 3.14).

Fig. 3.14 CCU: Principal System Environment of OCA and OC(A)S Modules

OTTU and OADMU can be combined optionally with CCU network elements for trans-parent through connection of optical channels. In the CCU single channel amplifiersOCA or OCAS are required for this.

iL-Band amplifiers OCAL and OCASL are not available in the current release.The switch module OSC is not tested for this release.

OC(A)S

50/50

C

OCAoutin

drop add

dropadd

DeMux Mux

Opticallineinterface

Opticallineinterface

Dispersioncompensation

outin

CCU

Attenuator/Dispersioncompensation

78 A42022-L5936-C51-1-7618


A maximum of eight subracks with up to 71 OC(A) (S) modules may be controlled byone MCU module. This results in 142 possible bidirectional channels.

Single row subracks are used for better cooling of the uncooled pump lasers of OCA(S).

3.2.5 OADM Ring Closure(see Fig. 3.15)

OADM rings are attractive for medium distance Core and regional applications.

In OADM ring configurations (without 3R regeneration at a terminal) you must avoid it toconnect lasers in a loop. There has to be at least one discontinuity/interruption in theoptical path for every wavelength.

The ring closure without 3 R regeneration of express channels at a point is achieved asfollows: The signals must be demultiplexed and re multiplexed at one point in the ringwith two OTTs: The interconnection of express channels is done via OCA modules(equipped in a CCU network element) . The two OTTs are set back to back against eachother. The interconnection between the two OTTs may also be established via OCASamplifier/switch modules for remotely configurable OADM function. No optical-electri-cal-optical (oeo) conversion is needed for this.

The terminal preamplifier OLITP gets 3 PUMP modules to achieve high channel powersat the output of the demultiplexer.

The OTT at the Tx side is configured via the element manager for a lower input powerthreshold. In case of ring closure the OTT accepts input powers at the OM20 moduledown to -10 dBm. In this way signals can be directly interconnected between demux out-put of one OTT and mux input of the second OTT.

Fig. 3.15 OADM Ring with two Back to Back Terminals (2xOTTU)

The maximum ring circumference depends on the channel count due to the optical per-formance penalty at the two back to back OTTs.

In case of larger ring diameter, a ring can be built with two times two back to back OTTsplaced at different locations. In this case the ring consists of 2 links and in each link 2

OLITP

321

UDCM

OTTU

Only one band and one direction shown

OMDF

ODA20ODA20PUMP A

PUMP B

PUMP C

OLITB

321

attenuator /

OTTU

OMDF

OM20 OM20PUMP A

PUMP B

PUMP C

patch cord connections

20 % add/drop

OADMU

20 % add/drop

OADMU

UDCM

(in the current release:connections only viaOCA or OCAS modules)

A42022-L5936-C51-1-7618 79



express channels have to be present for link startup and preemphasis. No end to endexpress traffic is going around the complete ring and the performance will increase, dueto distributed preemphasis.

3.2.6 Networking with OADMU/OTTU(see Fig. 3.16)

Due to the flexible network element architecture of OADMU/OTTU and CCU it is possi-ble to generate meshed network architectures without the need of optical-electrical-op-tical (oeo) conversion.

Fig. 3.16 Network Configurations with Combinations of Network Elements

By combining the network elements, a static network node of grade n can be built with-out restrictions. As the OCAS module integrates only 2:1 switches, a service can be dy-namically switched only between 2 ports, e.g. line1/local add/drop or line1/line2 orline1/line3.

SURPASS hiT 7550 2.05 planning SW and control SW supports a quasi-static mesh op-tical network consisting of defined links, which are limited by OTTUs for optical link con-trol. The optical wavelength path can continue at the OTTU, so the OTTU does notterminate the optical channel.

20 % add/drop

OADMU

OTTU

line1 line1

local fix/flexible

add/drop

CCU(OCAS)

line2

20 % add/drop

OADMUline1 line1

local fix/flexibleadd/drop

CCU

(OCAS)

20 % add/drop

OADMUline2 line2

OTTUline3

Note: only unidirectional traffic configuration shown!

80 A42022-L5936-C51-1-7618


3.3 Functional Overview of the Modules

3.3.1 Modules used for NEsThe next table lists features and functions of the various SURPASS hiT 7550 modules.

Module

Name

NE Type Features/Remarks

MCU All NE Types The Main Control Unit is the central control element of the SURPASS hiT

7550 system which provides interfaces to the Local/Network Craft Terminal

and a Q3 interface to the customers network management system. The

MCU is responsible for fault, configuration, performance, and security man-

agement. The MCU requires 1 slot.

MIBS All NE Types The Management Information Base (Small) module stores all persistent

management data handled by the MCU. The MIBS requires 1 slot in com-

bination with the SAB.

SAB All NE Types The Subrack Address Board only consists of bus termination resistors. The

SAB requires 1 slot in combination with the MIBS.

SABM All NE Types The SABM includes a CAN bus repeater. It is only used in OADM NEs. At

an OADM, the SABM replaces the SAB in the Subrack that contains the

MCU. The SABM requires 1 slot in combination with the MIBS.

OSCTUT OTTU Optical Supervisory Channel Termination module Terminal, is required in

each OTTU to terminate and process the OSC. The OSCTUT modules re-

quire 2 slots.

OSCTUI OLRU

&

OADMU

Optical Supervisory Channel Termination module Inline, is required in each

OLRU and OADMU to terminate and process the OSC on each side of the

NE. The OSCTUI modules require 2 slots.

SMU2 All NE Types The Supervisory Management Unit is equipped in all subracks without an

OSCTU and performs a subset of OSCTU functions such as card present

management. The SMU2 modules require 1 slot.

OPA OTTU

& OADMU

& OLRU

Optical Performance Analyzer is used to provide detailed optical perfor-

mance information on a per channel basis, i. e. channel power, OSNR and

wavelength can be measured and recorded. The OPA module requires 3

slots.

Preamplifier:

OLITPC

OLITPL

OLITPUL

OLITPNC

(standard or

extended ver-

sion)

OTTU Rx

&

OADMU

Optical Line Interface Terminal Preamplifier.

“TP” type OLIs are equipped in the terminal sites (OTTU and OADMU).

They contain a preamplifier for one band in one direction.

Type C/L refers to the wavelength band used, where:

- OLITPL is used in standalone L band systems,

- OLIPTNC is used in standalone C band systems,

- OLITPUL (together with OLITPC) is used in C+L band systems and

- OLISTPNC is used for short span standalone C band systems (with basic

version of amplifier).

The output power of the OLITPC/L/UL and OLISTPNC is normally +19

dBm (+19.5 dBm for OLITPNC), but can be increased via the OLI pump

modules described below. All OLI modules require 3 slots.

Preamplifier:

OLISTPNC

(basic ver-

sion)

OTTU Rx

Tab. 3.7 Plug-in Units for the SURPASS hiT 7550 System

A42022-L5936-C51-1-7618 81



Booster am-

plifier:

OLITBC

OLITBL

OLITBUL

OLITBNC

(standard or

extended ver-

sion)

OTTU Tx

&

OADMU

Optical Line Interface Terminal Booster.

“TB” type OLIs are equipped in the terminal sites (OTTU and OADMU).

They contain a booster amplifier for one band in one direction.


- OLITBL is used in standalone L band systems,

- OLITBNC is used in standalone C band systems,

- OLITBUL (together with OLITBC) is used in C+L band systems and

- OLISTBNC is used for short span standalone C band systems (with basic


The output power of the OLITBC/L/UL is normally +17 dBm (+18 dBm for

OLITBNC and OLISTBNC), but can be increased via the OLI pump mod-

ules described below. All OLI modules require 3 slots.

Booster am-

plifier:

OLISTBNC

(basic ver-

sion)

OTTU Tx

&

OADMU Tx

Inline amplifi-

er:

OLIIC

OLIIL

OLIIUL

OLIINC

(standard or

extended ver-

sion)

OLRU

&

OADMU

Optical Line Interface Inline.

“I” type OLIs are equipped in the inline amplifier sites (OLRU). They contain

an inline amplifier for one band in one direction.


- OLIIL is used in standalone L band systems,

- OLIINC is used in standalone C band systems,

- OLIIUL (together with OLIIC) is used in C+L band system and

- OLISINC is used for short span standalone C band systems (with basic


The output power of the OLIIC/L/UL is normally +17 dBm (+18 dBm for

OLIINC and OLISINC), but can be increased via the OLI pump modules de-

scribed below. All OLI modules require 3 slots.

Inline amplifi-

er:

OLISINC

(basic ver-

sion)

OLRU

&

OADMU Tx

PUMPA All NE Types The PUMPA module is an OLI pump module which is used to increase the

optical output power of an OLI amplifier to +20dBm. The PumpA requires

1 slot.

PUMPA

PUMPB

PUMPC

All NE Types The PUMPA/PUMPB/PUMPC consists of 3 OLI pump modules which are

used to increase the optical output power of an OLI amplifier:

to +20 dBm for PUMPA, to +22 dBm for PUMPA+PUMPB, to +23 dBm for

PUMPA+PUMPB+PUMPC.

The PUMPA/PUMPB/PUMPC modules require 3 slots.

R-PUMPC

R_PUMPL

R-PUMPUL

All NE Types Raman pump for C/L/UL band.

Optional Raman pump modules can be installed to provide Raman ampli-

fication. C/L refers to the wavelength band used, where RPUMPL is used

in standalone L band systems and RPUMPUL is used in C+L band sys-

tems. All Raman pump modules require 2 slots.

OM20/ OD20 OTTU

&

OADMU

The Optical Multiplexer/Demultiplexer units perform the optical multiplex-

ing/ demultiplexing of 20 channels according to the C and L subband based

scheme. The optical power levels of all inputs and outputs are monitored.

The OM20 also contains a VOA at each individual channel input. All

OM/OD20 modules require 4 slots.

Tab. 3.7 Plug-in Units for the SURPASS hiT 7550 System (Cont.)

82 A42022-L5936-C51-1-7618


ODA20 OTTU

&

OADMU

The Optical Demultiplexer (with VOA) units perform the optical demultiplex-

ing of 20 channels according to the C and L sub-band based scheme. The

optical power levels of all inputs and outputs are monitored. The ODA20

also contains a VOA at each individual channel output. All ODA20 modules

require 4 slots.

OMDFIC /

OMDFIL

OTTU

&

OADMU

The OMDFIX modules contain the band filters for the separation of the blue

and red subbands within the C and L band. They also include the C-red and

L-blue band frequency interleavers to achieve a 100 GHz frequency sepa-

ration among the carriers from the incoming 50 GHz signal, and vice-versa.

The OMDFIX modules require 2 slots.

OMDFC/

OMDFL

OTTU

&

OADMU

The OMDFX modules contain only the band filters for the separation of the

blue and red subbands within the C and L band. Hence, only 100GHz spac-

ing of wavelengths is supported. The OMFX modules require 2 slots.

OMD2IC/

OMD2IL

OTTU

&

OADMU

The OMD2IX modules contain additional frequency interleavers in the C-

blue and L-red bands to achieve a 100 GHz frequency separation among

the carriers from the incoming 50 GHz signal, and vice-versa. Together

with the OMDFIC & OMDFIL the entire C & L band is supported for 50 GHz

wavelength spacing. The OMD2IX modules require 2 slots.

CAD2xxxx(B) OADMU The CAD2 module is used to drop/insert wavelengths from/into the aggre-

gate signals in one direction. It is possible to remotely configure the 2 wave-

lengths as either add/drop or through channels. Up to two modules can be

used per OADMU subband in each direction. The CAD2xxxx(B) modules

require 2 slots.

EAM4C

EAM4L

OADMU The power equalizing module contains 4 VOAs, one for each of the 4 sub-

bands. The EAM4x modules require 2 slots.

OCAC/

OCASC/

OCS

CCU The OCxx Optical Channel Amplifier Module is used to configure single ex-

press or add/drop channels in a channel connection unit CCU.

OCAC: four amplifiers (C band) enable four express channels.

OCASC: four amplifiers (C band) with each an optical switch at their inputs

and outputs allow either express or add/drop channel configuration.

OCS: like OCASC but without amplifiers and for both bands (C, L)

UDCMC/Lxxx All NE Types Unidirectional Dispersion Compensation Modules with slope compensating

DCFs for the C or L band for SSMF.

UDCMCxxxA All NE Types Unidirectional Dispersion Compensation Modules with normal compensat-

ing DCFs for the C band.

UDCMC/L

xxxN

All NE Types Unidirectional Dispersion Compensation Modules with slope compensating

DCFs for the C or L band for NZDSF(+) fibre and TWRS slope compensa-

tion.

UDCMC

xxxP


DCFs for the C band for NZDSF(-) or DSF fibre.

UDCMC

xxxH


DCFs for the C or L band for NZDSF(+) fibre and LEAF slope compensa-

tion.

Tab. 3.7 Plug-in Units for the SURPASS hiT 7550 System (Cont.)

A42022-L5936-C51-1-7618 83



3.3.2 MCU ModuleThe Main Control Unit (MCU) provides the central monitoring and control functions forthe system (SEMF function). It also performs the Management Communication Function(MCF), i. e. handling the information for the F, Q and ECC communication interfaces.Internal control is performed via the PCB (Peripheral Control Bus) which consists of twoasynchronous serial busses connecting the MCU to all modules which have their ownLocal Card Controller (LCC). A second bus system called the CAN Bus (a common se-rial bus communication protocol) is an asynchronous serial bus used for very fast inter-card communications for time-critical operations such as optical link control.

Using these interfaces, the MCU performs the following functions:– Fault Management

Monitors all system alarms and extends their states to the network managementsystem and the rack alarm bus. It also extends the information to the Local/NetworkCraft Terminal.

– Performance ManagementOn request, it sends all optical performance management information to the networkmanagement system and the Local/Network Craft Terminal.

– Configuration ManagementConfigures the system to either default settings or to settings passed to it from thenetwork management system or the Local/Network Craft Terminal.

– Security ManagementControls the individual access via the network management system or the Lo-cal/Network Craft Terminal to particular NE functions via a hierarchical security man-agement user ID and password concept.

– Equipment ManagementMonitors the actual and required subrack equipping.

– Communication ManagementImplements the Management Communication Function (MCF) so that communica-tion to all NEs from the Network Management system is possible.

– Software ManagementResponsible for all software downloads, uploads, and software integrity.

– Real Time ManagementControls the real time clock

– Providing Bw7R or NEALI shelf and rack alarm outputs– NE alarms LEDs control (major/minor, for communication and equipment alarms)

The MCU requires the space of one slot in the SURPASS hiT 7550 2.05 subrack, andis also responsible for detecting the presence of the MIBS and SAB in the same subrack.

Fig. 3.17 shows the MCU block diagram.

84 A42022-L5936-C51-1-7618


Fig. 3.17 MCU Block Diagram

3.3.3 MIBS ModuleThe Management Information Base Small (MIBS) module accommodates up to32 Mbyte of FEPROM required for the persistent storage of all configurable parametershandled by the MCU.

The MIBS itself contains all data visible and changeable via a Q3 interface. A subset ofthe MIBS, the NE-VCDB (Variable Configurable Database) contains the total variableconfiguration parameters of an NE. Only the NE-VCDB is persistently stored on theMIBS module, as a backup version of the master stored on the MCU in external SRAM.Hence, if an MCU happens to fail, a replacement can be made without losing the entirecontents of the MIBS. The contents of the MIBS also survive a power failure or 'cold-start' of the NE.

TDMA1(MCC1)

MII(FCC1)

MPC8260

STD

Com

mun

icat

ion

SPI

RESET

Debug/JTAG

COP

UART(SCC2)

Ethernet1

MII(FCC3)

Ethernet2

Terminal1(Modem)

UART(SMC1) Terminal2

SPI

TDM1

TDMB1(MCC1) TDM2

Port

Pin

reservedComm

Cor

e C

omm

unic

atio

n St

ruct

ure

SDRAM

Flash EPROM

MIBS Cardup to 32 MByte

PowerPC 60x Bus

EDI

RTC

66 MHz

OnboardPowerSupply

NUBAT2

P3V3

ULED

NUBAT1

Port

Pins

128 MByte

32 MByte each bank

1 Bank

2 Banks

32 kByte NVRAM

Latch_Mux /Data_Mux

MPC755Backside Cache

1 MByte200 MHz

TDMD2(MCC2)

TDMC2(MCC2)

TDM4

TDM3

FPGA Adaption

CLK driver

32 MHz20ppm

IDMA1/2

HW

Con

fig

PLD

NUBAT1,2,3,4Supervision

4

NUBAT4

NUBAT3

P1V8FPP2V5FPP2V0PCP2V5PQP12V0P5V0

NUBATSupervision

64

835ppm

64

ICE connectorsfor debug purpose MICTOR

16

16

17

FPRE_L

internal signalsand MIBS

66 MHz to 8260,755,SDRAM ..

32 MHz to FPGAs

8

2

HDLC(SCC3) Serial 1

HDLC(SCC4) Serial 2

MII(FCC2) MII

A42022-L5936-C51-1-7618 85



One MIBS module is required per NE, and is fitted into the extreme bottom right slot ofthe subrack equipped with the MCU. These are implemented as replaceable units toease their repair in case of malfunction. Replacement of the MIBS does not cause anyinterruption to the traffic being carried over this particular NE.

The MCU is responsible for the module detection of the passive MIBS module. TheMIBS does not contain an EEPROM for Card Inventory Management information.

3.3.4 SAB ModuleThe Subrack Address (SAB) Module is named so because it previously held the subrackaddress information for each subrack so that it could be uniquely identified for inter-sub-rack data communications between the many subracks of an NE. This function hasmoved to the NE Alarm Panel (NEAP), however the SAB is still required as it containsseveral bus termination resistors required for inter-subrack data communications.

One SAB module is required per single row subrack, and one per double row subrack,and is fitted into the extreme bottom right slot of each row of each subrack. The SABmodules are implemented as replaceable units to ease their repair in case of malfunc-tion.

The OSCTU or SMU2 modules, via the Serial Peripheral Interface (SPI) Bus, are re-sponsible for the module detection of the passive SAB module. The SAB does not con-tain an EEPROM for Card Inventory Management information.

Fig. 3.18 shows the SAB/SABM block diagram.

Fig. 3.18 SAB and SABM Block Diagram

PCBTHROUGH-

CONNECTIONOR

TERMINATION

CONTROL

CANTERMINATION

andREPETITION *)

* SABM only

PWR

PCB1

PCB2

MPUPROUT

CAN1

CAN2

PWR_BUS

ULED

86 A42022-L5936-C51-1-7618


3.3.5 SABM ModuleThe SABM (see Fig. 3.18) includes an additional CAN bus repeater/amplifier. It is onlyused in the main subrack (the subrack that contains the MCU) of the OADM NEs. Here,the SABM replaces the SAB. The SABM requires one slot in combination with the MIBS.

3.3.6 OSCT ModuleThe Optical Supervisory Channel Termination (OSCT) module is an active module (i. e.it has it's own local module controller) and is mainly responsible for the optical and elec-trical termination of the 2 Mbit/s Optical Supervisory Channel (OSC) which is transmittedon a separate wavelength to the main payload traffic.

Other than OSC byte processing the OSCTU is responsible for providing the electricalinterfaces for the V.11 user channels, the EOW 4-wire interfaces, TIF alarm contacts,T3in clock input, SPI bus connection to passive modules, LED control, FAN control andsupervision, inventory management and clock synchronization. The electrical interfacesare found either on the connector panel (COPA), the NE alarm panel (NEAP), or on theOSCTU module itself (i. e. for module LEDs), all accessible via the front of the NE.

Fig. 3.19 shows the OSCT block diagram.

A42022-L5936-C51-1-7618 87



Fig. 3.19 OSCTU Block Diagram

OS

CC

2

CP

S

OSCTU

SPI-DISPI-DOSPI-CO

FAN-AS#1-2

FE

PWR-BUS

ULED

ALCOM

PWFNC

SP

I

FAN-PR#1-2

24

LCC

PS

U

PC

BC

AN

_BU

SS

MA

MPUFAIL+

12-12+

5

+3,4/+

1,8-5

TE

C_A

TE

C_B

SDI

OMD-AS#1-4

LAM

PT

ES

T

CA-PRS

UB

RA

DR

#1-3

SLO

TA

DR

#1-5

AD

FAN-LAMP#1-2

SPI-ADR#1-5

Fail

Status

TX-I-out__A

_BT

X-

Poti

AUX

PU

BA

T

NU

BA

T1

NU

BA

T2

SLO

OP

1

SLO

OP

2

NU

BA

T3

NU

BA

T4

DC

CM

T0

V11-1

V11-2

EO

W

DTMFW

T15

MIN

BA

BA

TIF-IN

4

INO

UT

INO

UT

TIFCOM_o

416

SYNC

V11-1DO

V11-1CO

V11-1DI

DCC1DODCC1DI

DCC2DIDCC2DO

DCC12CO

DCC3DODCC3DI

DCC4DIDCC4DO

DCC34CO

SIC

OF

I

A

D

V11-1CO

V11-2DO

V11-2CO

V11-2DI

V11-2CO

IoutP

oti

OW_LP

HSOW1

OW2

DC

CO

TIF

RX

F

RX

F

PLL

_BT

2T

3PLL_A

A_TX

B_TX

APSD_B

APSD_A

APSD_B

APSD_A

T3IN

Tosc_B

Tosc_A

Z

16251625

16251625

TX

TX

IoutP

otiB_RX

A_RX

TIFCOM_i

SU

RPA

SS

hiT 7550

88 A42022-L5936-C51-1-7618


A comprehensive list of OSCTU functions including those just stated is given in the fol-lowing:– Provides a T3in clock input interface for incoming 2048 kHz for OSC synchronization

and real-time clock synchronization. Note that no 1.5 Mbit/s or 2 Mbit/s clocks areimplemented because no complete SSM is required for OSC synchronization

– Provides all cross connections from terminated OSC bytes to the electrical interfac-es, or cross connections for bytes which are to be passed through the NE untermi-nated

– User configurable clock priorities via software for T3in & the T2 internal clock– Implements a timing marker byte to prevent OSC timing loops– User configurable EOW 4-wire electrical interface properties via software for ETSI

or ANSI customer requirements– User-configurable EOW channel encoding/decoding law of the 4-wire interfaces via

software to A-law (ETSI) or µ-law (ANSI)– The EOW supports 3-digit selective calling, group or collective calling– EOW Ring Manager function: enables selection of one OTT as a ring manager to

allow ring EOW configurations for protection purposes– User-configurable Telemetry Interfaces (TIF) providing 4 outputs (actors) and 16 in-

puts (sensors) per OSCTU module– Supervision of FAN units, i. e. activation of FAN alarms– Controlling the LED display on the Network Element Alarm Panel (NEAP) for the

FAN and EOW functions– Controlling the LED display on the OSCTU module itself, red (alarm) and green (ac-

tive) LEDs– Detection and reporting of all OSC alarms, such as LOS/LOF, SD, RDI, & EXC– Module present monitoring of the FANs, UDCMs and SAB modules. The module

present monitoring of all other modules is performed by the SMU2 or the MCU,whichever is present in each subrack

– Providing an SPI (Synchronous Peripheral Interface) for communication to passivemodules in the same subrack (i. e. OMDFx, OMDFIx, OMD2Ix) and UDCMs

– Storage and retrieval of module inventory data management on EEPROMs in OSC-TU and in other passive modules in the same subrack, and to UDCMs

– Power feeding to other passive modules in the same subrack, and to UDCMs.

3.3.7 SMU2 ModuleThe Subrack Management Unit (SMU2) is an active module (i. e. it has it's own localmodule controller) and is equipped in all subracks except for the main subrack contain-ing the OSCTU, and performs a subset of the OSCTU functions. These include FANcontrol and supervision, module present monitoring of modules within the subrack,SMU2 LED control, user-configurable TIF providing 4 outputs and 16 inputs, and NEalarms LED control (minor/major equipment alarms).

The SMU2 implements an SPI Bus connection to the passive modules in the same sub-rack which feeds a power supply to these passive modules and enables the retrieval ofinventory data stored on EEPROMs in these modules.

Fig. 3.20 shows the SMU2 block diagram.

A42022-L5936-C51-1-7618 89



Fig. 3.20 SMU2 Block Diagram

OS

CC

2

CP

S

SMU2

SPI-DISPI-DOSPI-CO

FAN-AS#1-2

FE

PWR-BUS

ULED

ALCOM

PWFNC

SP

I

FAN-PR#1-2

24

LCC

PS

U

PC

BC

AN

_BU

SS

MA

+12

-12+5

+3,4/+

1,8-5

TE

C_A

TE

C_B

SDI

OMD-AS#1-4

LAM

PT

ES

T

CA-PRS

UB

RA

DR

#1-3

SLO

TA

DR

#1-5

FAN-LAMP#1-2

SPI-ADR#1-5

Fail

Status

AUX

PU

BA

T

NU

BA

T1

NU

BA

T2

SLO

OP

1

SLO

OP

2

NU

BA

T3

NU

BA

T4

TIF-IN

4TIFCOM_o

416

TIF

TIFCOM_i

90 A42022-L5936-C51-1-7618


3.3.8 OPA Module(see Fig. 3.21)

The Optical Performance Analyzer module (OPA) is used for optimizing the transmis-sion of optical signals and for monitoring the performance of the optical signals in aDWDM environment.

Main functions of the OPA module:• Measures the optical signal power, wavelength and OSAR of carriers• Manages the measurement of the correct optical input signal for the respective op-

tical link state and network element type• Participates in preemphasis setting and power optimization• Allows to display a scan spectrum, i. e. for each of up to eight scan ports (at OLI

module outputs) and for a selectable frequency range, the laser power values arepresented in regular steps over the frequency at the element manager screen (OPAmodule serves as spectrum analyzer)

• Monitores internal power and OSA failures and reports them• Runs automatic performance measurements of supervised optical carriers• Generates channel and carrier alarms for all supervised optical carriers• Calibrates (in a special factory mode) optical power loss through optical switches

and couplers and stores calibrated data on the module EEPROM

The OPA module consists of a module mounted Optical Spectrum Analyzer (OSA) withadditional logic added to control and support the OSA within the SURPASS hiT 75502.05 system.

Fig. 3.21 OPA Module, Block Diagram

OPA is available either as four or eight channel version: so it has up to eight externaloptical inputs, MonC1 to MonC4 for the C band and MonL1 to MonL4 for the L band.

2:1Opticalswitch

2:1Opticalswitch

2:1Opticalswitch

OSA(Optical Spectrum

Analyzer)

Slot addressbus

LCC(Local module controller)

4 channelversion

18.432 MHz clock,for RS232 rates

Power supply(OSA) 12 V

Lamp test

PCB bus

CAN bus

RS232115.200 bps

ULED

SDI port“Debug”

LED

red

green

TTL opticalswitchcontrol

SIPACconnector

4/8opticalinputs

OPA

C/L splitter

MonC1

MonL4

A42022-L5936-C51-1-7618 91



Pairs of inputs e.g. MonC1 and MonL1 are coupled via a C&L band filter into one opticalswitch input (pair 1 to input 1 and so on). In case of the 4 channel version only the inputsMonC1, MonC2, MonL1 and MonL2 are valid.

A 4:1 switch at the optical inputs is implemented as cascaded three times 2:1 switchesand four C/L splitters.

The OPA behavior is controlled by message transfer via PCB bus and CAN bus. Themessages on the PCB bus generally control configuration and management, whereasthe messages over the CAN bus control the operation, especially during optical link star-tup. The OPA also sends asynchronous notification messages containing performancedata and alarms to the master controller of the PCB bus (MCU module).

Behaviour of the OPA module at several optical link states:• During Pre-start state (the startup), the OPA does not monitor optical links.• When preemphasis is adjusted, the OPA performs continuous high resolution mea-

surements of OSAR and power values for the link. When the data is requested, theOPA hands over the measured optical parameters (power and OSAR) to the OSCTmodule via CAN bus. During preemphasis setting phase, no alarming and no per-formance monitoring takes place for the inputs.

• In the running state (and enabled supervision for carriers on an input), which is thenormal operational state of optical links, OPA actively monitors the power levels andsignal-to-noise ratios of the supervised carriers. It also reports alarms if any of themeasured values is outside specified thresholds, and sends performance reports tothe MCU module every 15 minutes.

3.3.9 OLI ModulesThe Optical Line Interface (OLI) modules are active modules (i. e. they have their ownlocal module controller) whose primary function is the optical amplification and controlof the main DWDM traffic signal.

Fig. 3.22 shows the system environment of OLI modules.

92 A42022-L5936-C51-1-7618


Fig. 3.22 System Environment of OLI Modules

An unidirectional C- or L-band EDFA amplifier is the central element of every OLI mod-ule. OLI module variants can provide additionally C- and L-band splitters to combine aC-band OLI module with an upgrade L-band amplifier.

In every configuration the OSC channels are tapped off by the main module and are con-nected to the associated OSCT/SMU2 module.

There are three general types of OLI modules:• a cost optimized basic type (in standalone C Band systems only) for short spans up

to 90 km and transmission lengths of up to 800 km (for regional and long-haul appli-cations);no external pumps and no Raman pump can be used with a basic type OLI, i. e. theoutput power is restricted to about +18 dBm

• a standard type for medium span lengths• an extended type for longer spans

A mix of basic, standard, and extended type OLI modules is possible on transmissionlinks.

Different OLI module types are available (see Tab. 3.7) according to the application inthe network element:• for C or L or L+C band• either as preamplifier (at the receive side of the optical path) or booster (at the trans-

mit side of the optical path) or inline (in regenerators along the route) amplifier type• as basic or standard or extended type

Fig. 3.23 shows the OLI module basic block diagram.

OLI-C BandEDFA

Subsystem

OLIxC

ext.Pump(s)

ext.Pump(s)

OLIx(U)LOLI-L Band

EDFASubsystem

OSCT Card

RamanPump

C/L-Comb.

OSC-Split

C/L-Split

OSC-Comb.

RamanPump

Standalone L-Bandor booster only

Standalone L-Bandor preamp. only

From line or MUX To line or DEMUX

A42022-L5936-C51-1-7618 93



Fig. 3.23 OLI Block Diagram

The EDFA gain block provides the basic optical function. It is a scalable broadband op-tical amplifier.

VO

AG

TC

DC

M

GT

M

ED

FA

1E

DF

A2

ED

FA

3E

DF

A 4

ED

FA

5E

DF

A 6

LCC

DS

P

P-L

DP

-LD

P-L

DP

-LD

P-L

DP

D

ED

FA

PU

MP

C

P-L

D

PU

MP

B

P-L

D

PU

MP

A

P-L

D

OLI

PD

PD

PD

PD

PD

PD

94 A42022-L5936-C51-1-7618


Each standard or extended type OLI module has the identical high-performance 3-stageEDFA for C band or L band with gain control and output power control for any of the 3stages. A basic type OLI module has a cost-effective 3-stage C-band EDFA with gaincontrol and output power control.

The EDFA control is provided by the control of pump power and the current of the differ-ent amplifier sections. The signal and pump powers of the different stages can be mon-itored by internal photodiodes.

The OLI module is equipped with six on-board pump lasers (only two in the basic typeOLI) which enables a maximum total optical output power of approximately +17 dBm to+ 19 dBm. For higher output powers, external OLI PUMP modules (Pump A, B, and C)are required (not applicable for the basic type OLI), getting a maximum output power of+ 24.5 dBm.

A variable optical attenuator (VOA) allows the operation of the EDFA at different gainsrespectively gain tilts with optimum noise figure.

With the extended type OLI module, a gain tilt monitor (GTM) measures the actual gaintilt at the output of the OLI. A gain tilt control (GTC) compensates the spectral tilt inducedby the EDFA itself, by the Raman pumps, or by Raman crosstalk. For this no continuouspretilt control applies, the tilt data (generated by the Transplan tool) are to be enteredmanually into the element manager.

In the standard type OLI module, the GTC is used again to set predefined (fixed) tiltvalues, but there is no GTM circuitry.

The basic type OLI has no GTM and no GTC; there a pretilt correction is done via VOA.

The basic OLI type is used in the C band only as inline, terminal booster amplifier, andterminal preamplifier. It will preferably be found in shorter spans. The standard and ex-tended type OLI are applied in the C and/or L band as inline, terminal booster amplifier,and terminal preamplifier. All this three OLI types are applied in the OTT, OLR, andOADM network elements.

The extended type OLI module with its GTM facility allows to display an OLI scan spec-trum; i. e. for a selectable frequency range, the laser power values (gain tilt) behind thethird OLI amplifier stage may be presented in regular steps over the frequency at the el-ement manger screen (spectrum analyzer functionality).

Each OLI module also contains an on-board EEPROM to store module inventory datawhich can be requested by the network management system.

3.3.10 OLI PUMP ModulesThe OLI PUMP modules are used to increase the output power of the preamplifier,booster amplifier and inline amplifiers on the various OLI modules. This modularity isnecessary to support the large span loss range available with SURPASS hiT 7550 2.05,the different fibre types, and the large range of channel numbers supported. The OLIPUMP modules are active modules, which means they are equipped with their own localmodule controller (LCC).

Fig. 3.24 shows the OLI PUMP module’s block diagram.

A42022-L5936-C51-1-7618 95



Fig. 3.24 OLI PUMP Block Diagram

There are three OLI PUMP modules which each require one slot, namely PUMPA,PUMPB and PUMPC. Three configurations are supported, the PUMPA module alone, acombination of PUMPA and PUMPB as well as a combination of PUMPA, PUMPB andPUMPC. For typical OLI output power values see Tab. 3.6.

In order to provide this, each PUMP module is equipped with two laser diodes where thepump signal wavelengths for PUMPA, PUMPB and PUMPC are 1480 nm, 1495 nm and1465 nm respectively. The signals from the two laser diodes on each PUMP module arecombined together into one pump laser signal via a polarization beam combiner. Thenone signal is sent to the OLI via an optical/electrical cable. On the OLI module itself,which can receive inputs from up to three PUMP modules, the signals are combined viaa WDM multiplexer.

The electrical connection is important as it is used to determine whether the high opticalpower connection from the PUMP module to the OLI is closed. If not, the PUMP modulepower is automatically shut down.

The PUMP modules contain Peltier controlling elements and temperature sensors,which trigger an appropriate alarm if the temperature exceeds the programmed thresh-olds.

Each OLI PUMP module also contains an on-board EEPROM to store module inventorydata which can be requested by the network management system.

For C and L wavelength bands, the same PUMP modules are used.

PSU

PolarisationCombiner

PUMP A

PUMP_OUTl1,2,3

PowerSupervision

Temp. Reg. and

Supervision

Temp. Reg. and

Supervision

PumpLaser 1l1,2,3

PumpLaser 2l1,2,3

LCC

PUMP BPUMP C

96 A42022-L5936-C51-1-7618


3.3.11 RPUMP ModulesThe Raman PUMP (RPUMP) modules are utilized to increase the number of spans, orto increase the length of the spans, or to improve the performance of a particular net-work.

The Raman PUMP modules are active modules, which means they contain a local mod-ule controller. They require two slots in the SURPASS hiT 7550 2.05 subrack.

The RPUMPC for the C Band contains 4 or 5 laser diodes with various wavelengths be-tween 1409 nm and 1466 nm. Each of these laser diode signals is combined togetherbefore one signal is sent to the OLI via an optical/electrical cable.

Likewise, the L Band RPUMP required for C+L Band systems, RPUMPUL, contains 3or 4 laser diodes with the following wavelengths; 1482 nm, 1497 nm and 1513 nm. Theoutput of the RPUMPUL is sent to the RPUMPC module via an optical twin cable. Thisis then combined with the pump laser signals generated on the RPUMPC module. Fora Standalone L Band system the RPUMPL module utilizes two extra laser diodes withwavelengths 1452 nm and 1466 nm.

This connection is important as it is used to determine whether the high optical powerconnection from the RPUMPUL module to the RPUMPC module, or the RPUMPC/Lmodule to the OLI is closed. If not, the Raman Pump module power is automatically shutdown.

Each Raman PUMP module also contains an on-board EEPROM to store module inven-tory data which can be requested by the network management system.

3.3.12 OMD ModulesThe Optical Multiplexer/Demultiplexer (OMD) modules consist of the OMDFIC, OMD-FIL, OMDFC, OMDFL, OMD2IC and OMD2IL. All these modules have no separate, lo-cal module controller. They are managed via the OSCTU or SMU2 modules via the SPIBus, which means Card present information and Card Inventory Management informa-tion (stored on an EEPROM on each module) can be requested at all times.

The OMD modules contain the subband filter and interleaver optical components nec-essary for the 160 channel multiplexing/demultiplexing structure.

The C and L filters are used to separate the wavelengths into C-red/C-blue and L-red/L-blue subbands using standard optical reflecting filter technology.

The C and L subband interleavers are used to convert a set of wavelengths with 50 GHzspacing to two sets of wavelengths with 100 GHz spacing and vice versa, so that finalindividual channel demultiplexing/multiplexing can be performed with a 100 GHz wave-length grid. The interleavers make use of Mach-Zehnder interferometer technology. Inthis design, an unequal fiber path length between two 3 dB couplers creates the inter-ference. By carefully controlling the path length difference, the channel spacing can beset to the desired value. Because of the all-fiber design, this technology has very lowloss, low dispersion, and small polarization-dependent effects.

The temperature and power alarms for the OMD are supervised by the OSCTU or SMU2equipped in the same subrack.

Fig. 3.25 to Fig. 3.30 show the block diagrams of the particular modules. The abbrevi-ations used in the figures have the following meaning:

A42022-L5936-C51-1-7618 97



Fig. 3.25 OMDFIC Block Diagram

1C/1L 1st C band terminal/L band terminal on board (MUX)2C/2L 2nd C band terminal/L band terminal on board (DEMUX)1C3478 1st C band terminal on board for groups C3, C4, C7, C82C1256f 2nd C band terminal (filter side) on board for groups C1, C2, C5, C61C1256i 1st C band terminal (interleaver side) on board for groups C1, C2, C5, C62C1256i 2nd C band terminal (interleaver side) on board for groups C1, C2, C5, C6C12 terminal for C band groups C1 and C2

OMDFIC

1C

2C

1C1256

1C34

1C78

2C1256

2C34

2C78

1C3478f1C3478i

2C3478f2C3478i

C b

and

filte

rre

d/bl

uere

d re

flect

ing

C b

and

filte

rre

d/bl

uebl

ue r

efle

ctin

g

C b

and

inte

rleav

erC

ban

din

terle

aver

MUX

DEMUX

98 A42022-L5936-C51-1-7618


Fig. 3.26 OMDFIL Block Diagram

Fig. 3.27 OMDFC Block Diagram

OMDFIL

1L

2L

1L3478

1L12

1L56

2L3478

2L12

2L56

1L1256f1L1256i

2L1256f2L1256i

L ba

nd fi

lter

red/

blue

red

refle

ctin

g

L ba

nd fi

lter

red/

blue

blue

ref

lect

ing

L ba

ndin

terle

aver

L ba

ndin

terle

aver

DEMUX

MUX

OMDFC

1C

1C3478

1C1256

2C

2C3478

2C1256

C b

and

filte

rre

d/bl

uere

d re

flect

ing

C b

and

filte

rre

d/bl

uere

d re

flect

ing

DEMUX

MUX

A42022-L5936-C51-1-7618 99



Fig. 3.28 OMDFL Block Diagram

Fig. 3.29 OMD2IC Block Diagram

Fig. 3.30 OMD2IL Block Diagram

OMDFL

1L

1L3478

1L1256

2L

2L3478

2L1256

L ba

nd fi

lter

red/

blue

red

refle

ctin

g

L ba

nd fi

lter

red/

blue

red

refle

ctin

g

DEMUX

MUX

OMD2IC

1C1256

1C12

1C56

2C1256

2C12

2C56

C b

and

inte

rleav

erC

ban

din

terle

aver

DEMUX

MUX

OMD2IL

1L3478

1L34

1L78

2L3478

2L34

2L78

L ba

ndin

terle

aver

L ba

ndin

terle

aver

DEMUX

MUX

100 A42022-L5936-C51-1-7618


3.3.13 OM/OD ModulesThe Optical Multiplexer/Optical Demultiplexer (OM20/OD20) modules are active mod-ules (i. e. they have their own local module controller) and are equipped in the OTTUand OADMU NEs to perform fixed 20 channel optical multiplexing and demultiplexing.The ODA20 is a variant of the OD20 with optical outputs adjustable in power.

There are 8 OM20 modules (4 per C and L Band), 8 OD20 modules and 8 ODA20 mod-ules, which vary only in the wavelengths supported by the 100 GHz dielectric filters im-plemented in each module. Each OM20 module has 2 dielectric filters, which multiplex10 channels separately and then two groups of 10 channels together to form one 20channel DWDM signal.

Each OM20 channel input has a VOA implemented to control the power of this client in-put channel. The stepper motor controlled VOA wiper settings may be software con-trolled via the network management system.

Each ODA20 channel output has a VOA implemented to control the power of this clientoutput channel. The stepper motor controlled VOA wiper settings may be software con-trolled via the network management system.

A sophisticated calibration procedure for the VOA elements is implemented in SUR-PASS hiT 7550 2.05 to ensure the accuracy of network setup.

For optical power monitoring, monitor diodes are placed at each OM20 channel input,at the OD(A)20 input and at each OD(A)20 channel output so that channel powers canbe monitored at the DWDM boundary inputs and outputs of the SURPASS hiT 75502.05 DWDM system via the network management system, as well as the total DWDMinput power before the final demultiplexing stage.

The input channel “ageing/drop control” is implemented in the OM20 and ODA20 mod-ules. For each input channel of an OM20 the actual power after the VOA is comparedwith the required value, and if a given tolerance level is exceeded for more than a pre-defined integration time (2 min.) then the attenuation is adjusted back to the requestedvalue. If it cannot be reached, because the VOA has to regulate beyond its lowest orhighest possible attenuation, then the Power Low Failure (PLF) or the Power High Fail-ure (PHF) communication alarm for that channel will be raised. The VOA at each outputof the ODA20 is monitored similarly.

The OD(A)20 also plays a role in Optical Laser Safety. The input power of the OD(A)20is measured and if it is < -15 dBm it activates an APSD which shuts down the precedingOLI preamplifier pump lasers.

Each OM20 and OD(A)20 module also contains an on-board EEPROM to store moduleinventory data which can be requested by the network management system.

Fig. 3.31 to Fig. 3.33 show the block diagrams of the module groups OM20, OD20 andODA20.

A42022-L5936-C51-1-7618 101



Fig. 3.31 OM20 Block Diagram

Fig. 3.32 OD20 Block Diagram

Mux

1

2

3

4

5

6

7

8

910

Mux

1

2

3

4

5

6

7

8

910

5:95

VOA

MD in

MxOut

5:95

VOA

MD in

1

2

3

4

567

89

10

MxIn 1

MxIn 2

MxIn 3

MxIn 4

MxIn 5

MxIn 6

MxIn 7MxIn 8

MxIn 9MxIn 10

11

12

13

14

151617

1819

20

MxIn 11

MxIn 12

MxIn 13

MxIn 14

MxIn 15

MxIn 16

MxIn 17MxIn 18

MxIn 19MxIn 20

Dem

ux

1

2

3

4

5

6

7

8

910

5:95

P3

P1 P2

MDAPSD

DxIn

Dem

ux

1

2

3

4

5

6

7

8

910

5:95

P3

P2

MD out

P1

5:95

P3

P2

MD out

P1

1

2

3

4

56

7

8

9

10

11

12

13

14

1516

17

18

19

20

DxOut 1

DxOut 2

DxOut 3DxOut 4

DxOut 5

DxOut 6

DxOut 7

DxOut 8

DxOut 9

DxOut 10

DxOut 11

DxOut 12

DxOut 13

DxOut 14

DxOut 15

DxOut 16

DxOut 17

DxOut 18

DxOut 19

DxOut 20

102 A42022-L5936-C51-1-7618


Fig. 3.33 ODA20 Block Diagram

3.3.14 CAD2 ModulesThe Channel Add/Drop (CAD2) module is an active module (i. e. it has it's own localmodule controller) and is equipped in OADMU NEs to perform remotely configurablechannel add/drop functions.

The CAD2 module consists of a set of add/drop WDM filters to either add/drop a wave-length into/from an optical 16nm band with 20 optical wavelengths and 100 GHz. Twowavelengths can be added and dropped per CAD2 module in one direction. Each Addchannel input has a VOA implemented to control the power of this Add channel. The re-quired input power of the Add channel is calculated with the help of the OPA, or interpo-lated from the other channel power values if no OPA is equipped. Each Drop channeloutput has a VOA implemented to control the output power so that it is within the allow-able range of the client's receiver. The stepper motor controlled VOA wiper settings maybe software controlled via the network management system.

Add channel and drop channel “ageing control” is implemented in the CAD2 modules.For each input and output channel the actual power after the VOA is compared with therequired value, and if certain tolerance level is exceeded for more than a predefined in-tegration time (2 min.) then the attenuation is adjusted back to the requested value. If itcannot be reached, because the VOA has to regulate beyond its lowest or highest pos-sible attenuation, then the Power Low Failure (PLF) or the Power High Failure (PHF)communication alarm for that channel will be raised.

Dem

ux

1

2

3

4

5

6

7

8

910

5:95

P3

P1 P2

MDAPSD

DxIn

Dem

ux

1

2

3

4

5

6

7

8

910

1

2

3

4

56

7

8

9

10

11

12

13

14

1516

17

18

19

20

DxOut 1

DxOut 2

DxOut 3DxOut 4

DxOut 5

DxOut 6

DxOut 7

DxOut 8

DxOut 9

DxOut 10

DxOut 11

DxOut 12

DxOut 13

DxOut 14

DxOut 15

DxOut 16

DxOut 17

DxOut 18

DxOut 19

DxOut 20

5:95

VOA

MD in

5:95

VOA

MD in

A42022-L5936-C51-1-7618 103



The wavelengths used for channel selection take into account the following optical prop-erties, the nearest neighbour of an add/drop channel is always a through channel to fa-cilitate add channel power adjustment, and there is a spacing of 2 channels betweenevery 2 add/drop channels (i. e. 300 GHz) to minimize the impact of imperfect throughchannel filter shapes. There is one group of CAD2s and one additional group of CAD2B.

Each CAD2 module also contains an on-board EEPROM to store module inventory datawhich can be requested by the network management system.

Fig. 3.34 shows the CAD2 block diagram.

Fig. 3.34 CAD2 Block Diagram

3.3.15 EAM4C or EAM4L ModulesThe EAM4x basically is a smaller subset of the CAD2 module and is therefore also anactive module with it's own local module controller. It is equipped only in OADMU NEsand is required to equalize the sum channel powers of the four interleaved 20 channelsub-bands of the C or L band.

The EAM4x consists only of four Variable Optical Attenuators (VOAs), one for each sub-band. Hence two EAM4x modules are required per band (C or L), for each direction,making a total of 4 EAM4x modules for a C+L OADMU. In the EAM4 module the inputpower of each of the four channel groups is measured and checked against the expect-ed value. If there is no correspondency, an automatic power reduction command is sentto the relevant OLI preamplifier module.

Each EAM4x module also contains an on-board EEPROM to store module inventorydata which can be requested by the network management system.

Fig. 3.35 shows the EAM4 block diagram.

VOA

VOA

VOAVOA

filterIn

Out

Drop f1

fixedattenuator

upgrade port fornext A/D-card

2x2

2x2

1x2 1x2

notch-filter

synchronized

UpInUpOut

f2through channel

express channels

Drop f2 Add f1 Add f2

104 A42022-L5936-C51-1-7618


Fig. 3.35 EAM4 Block Diagram

3.3.16 OCA / OCAS / OCS Modules(See Fig. 3.36 and Fig. 3.37)

Optical Channel Amplifier modules allow to configure either express channel connec-tions or single add/drop channels in channel connection unit (CCU) network elements.They can be applied together with OADMs and back-to-back OTTs.

There are the following basic variants:• Modules with four single (C band) channel amplifiers only (OCAC)• Modules with four single (C band) channel amplifiers and additional optical switches

(OCASC)• Modules with optical switches only (OCS, for C and L band)

Fig. 3.36 OCA and OCAS Modules, Optical Path

VOA1

VOA3

Outx1x2

Outx5x6

Inx1x2

Inx5x6

f1,3,..39

f 2,4,..40

(20 ch.)

VOA2

VOA4

Outx3x4

Outx7x8

Inx3x4

Inx7x8

f50,52,..88

f51,53,..89

OCA

Fwd1 OUTFwd1 IN

Back1 OUTBack1 IN

Fwd2 OUTFwd2 IN

Back2 OUTBack2 IN

OCAS

Fwd1 OUT

Fwd1 Add

Back1 OUT

Back1 Add

Fwd2 OUT

Fwd2 Add

Back2 OUT

Back2 Add

Fwd1 IN

Fwd1 Drop

Back1 IN

Back1 Drop

Fwd2 IN

Fwd2 Drop

Back2 IN

Back2 Drop

Switch in Add-Drop position

Switch in Express position

A42022-L5936-C51-1-7618 105



Fig. 3.37 OCS Module, Optical Path

OCAx modules (x= C stands for C band and, for later releases, x= L for L band) arechannelized amplifiers without switching function. The basic optical function is providedby an EDFA module consisting of 4 internal gain blocks. Amplifiers for 2 channels in di-rection 1 -> 2 are denominated Fwd1 and Fwd2, amplifiers for 2 channels in direction2 -> 1 are denominated Back1 and Back2.

The EDFAs are controlled individually by the pump current control for the 4 different sin-gle channel amplifiers. The optical input and output power of each single channel ampli-fier are monitored and automatic output power control is done. An automatic over-temperature shutdown is provided for each pump laser. The output power of each am-plifier is individually controllable via the element manager and may be calibrated to theaccording connector.

OCASx modules contain channelized amplifiers (like the OCA modules) with switchingfunction. The modules provide amplifiers for 2 channels per direction: for channels in di-rection 1 -> 2 they are denominated Fwd1 and Fwd2, for channels in direction 2 -> 1they are denominated Back1 and Back2.

There is also one dual 2 x 1 optical switch (a drop switch at the input and an add switchat the output) for configurable add/drop traffic in each channel. Both optical switcheswithin the dual switch operate simultaneously, i. e. switches for the add/drop functional-ity always operate synchronously.

Power monitoring of the amplifier is only reporting power information in case of theswitch being configured for express channel. Otherwise the amplifier is shut down.

For the current release no L band OCA/OCAS module is available.

OCS

Fwd1 OUT

Fwd1 Add

Back1 OUT

Back1 Add

Fwd2 OUT

Fwd2 Add

Back2 OUT

Back2 Add

Fwd1 IN

Fwd1 Drop

Back1 IN

Back1 Drop

Fwd2 IN

Fwd2 Drop

Back2 IN

Back2 Drop

Switch in Express position

Switch in Add-Drop position

106 A42022-L5936-C51-1-7618


For OCS modules, only switches and no EDFAs are present. An OCS module has only4x 2x 1:2 switches and offers cheap dynamic add/drop. For each channel there is a dropswitch at the input and an add switch at the output. Channels in direction 1 -> 2 are de-nominated Fwd1 and Fwd2, channels in direction 2 -> 1 are denominated Back1 andBack2.

The same HW/optics can be used in C- and L-band.

OCA, OCAS, and OCS modules are equipped in the CCU subrack.

3.3.17 UDCM ModulesUnidirectional Dispersion Compensation Modules (UDCMs) are an important part of theSURPASS hiT 7550 2.05 system, without these it would be impossible to transmit aDWDM signal many hundreds of kilometers. UDCMs are primarily used to counteractthe chromatic dispersion which a signal undergoes as it travels through a section of op-tical fibre. This chromatic dispersion has the effect of 'spreading' the signal spectrum somuch that the inter-symbol interference no longer allows an accurate determination of asingle 'one' bit or a single 'zero' bit. The UDCMs contain Dispersion Compensating Fibre(DCF), which are just spools of fibre which contain the opposite dispersion characteris-tics of the fibre used for signal transmission, hence “compressing” the signal for betteroptical performance.

Naturally, the type of DCF depends on which wavelength band and type of fibre is beingused for transmission, which is why several types of UDCMs are required for accurateDCM management. UDCMs for SSMF C band & L band, NZDSF(+) C band & L band,NZDSF(-) and DSF are defined.

The strategy for choosing UDCMs, or DCM strategy, is highly system dependent and isinfluenced by the optical performance limiting effect. For lower channel DWDM systems,with larger channel spacings, i. e. a system with 100 GHz channel spacing, this limitingeffect was SPM (Self Phase Modulation), which lead to a DCM strategy where all of thedispersion along the link was compensated with DCMs (full inline compensation) leavinga high residual dispersion at the end of the link for SPM optimization.

For extensive channel systems with smaller channel spacings such as SURPASS hiT7550 2.05, the 160 channel system with 50 GHz spacing, SPM is no longer the limitingeffect, rather Cross Phase Modulation (XPM) and Raman crosstalk, therefore the calcu-lation of the residual dispersion is different.

UDCMs are passive modules placed in all NE types (excepted CCU), i. e. OTTU, OLRUand OADMU. They are normally located in the optical path between the 2nd and 3rdstages of each optical amplifier, as here the insertion loss of the UDCM can be compen-sated for by the amplifier design. However, it is also possible to perform subband dis-persion compensation, for example, using different UDCMs for the C-red and C-bluebands in each NE type.

The UDCMs are physically stored in their own UDCM trays at the bottom of the rack,and are visible via the network management system. As passive modules they are man-aged via the OSCTU or SMU2 modules via the SPI Bus, which means module presentinformation and module Inventory Management information (stored on an EEPROM oneach UDCM) can be requested at all times. Up to a maximum of 4 UDCMs fit into oneUDCM tray, each in their own slot.

A42022-L5936-C51-1-7618 107



3.4 SynchronizationIn all NEs, the OSCT module provides the master system clock (T0), which is used tosynchronize the real-time clock on the MCU module for greater accuracy. The accuracyof the clock is 4.6 ppm. The OSCT sends clock data to the MCU every 15 minutes.

All clocks in a SURPASS hiT 7550 system are synchronized via the Supervisory Chan-nel. The MCU's clock is equipped with a battery back-up in case of power failure or tem-porary MCU module removal.

Additionally, an external clock can be used to get a maximum of accuracy. The clocksignal (T3) is fed in via the EOW1/T3in pin connector on the Connector Panel (COPA)of the subrack.

If this external signal fails, a T3LOS alarm is propagated.

Fig. 3.38 Timer Configuration

same direction

OLR/OADMOTT(Master)

OTT

T3 Input

If the T3 signal fails, the internal clock (T2) will be used instead.A priority list is used to control the switchover.

counter direction

108 A42022-L5936-C51-1-7618


3.5 Control and Monitoring via the Element ManagerThe Element Manager (EM) enables the user to perform a wide variety of OAM&P (Op-eration, Administration, Maintenance, and Provisioning) tasks. These include:– Equipment Management– Fault Management– Configuration Management– Performance Management– Security Management

This chapter consists of the following sections:• Access Check• User Interface

3.5.1 Access CheckWhenever you start the TNMS CT application, a login dialog appears requiring:– User name: You are assigned a user name by your administrator– Password: Use your personal password. When you log on for the first time, you do

not need a password.

The access to TNMS CT is regulated by five user classes. Users can be assigned to theuser classes. The set of functionality available to a given user class is fixed an cannotbe changed.

The following five user classes for TNMS CT are defined having different privileges:• 0: Supervision• 1: Maintenance• 2: Operation• 3: Configuration• 4: Administrator

Furthermore the element manager uses the following security levels to control the ac-cess rights for the different LCT functions:• Normal user administration: user classes 0 to 10.

Via the user administration the customer can configure the different access levels.Some functions are restricted in this security level and can only be accessed via anadditional login.

• Service staff: this highest security class can only be reached via a key combinationand an additional password. This class is used by Siemens personnel only.

iThe system requirements for the element manager are described in chapter7.9.

A42022-L5936-C51-1-7618 109



3.5.2 User Interface

If you’re familiar with Microsoft® Windows, you can use the Element Manager EM. Com-mon tasks such as moving, re-sizing, minimizing, and closing windows, manipulatingpull-down menus and dialog boxes, as well as the use of the primary and secondarymouse buttons all work exactly as in Microsoft® Windows.

EM Screen

The EM screen structure consists of the following basic levels:

iDetailed information on the user interface can be found in the Operator Guidelines OGLand in the Online Help.

Network Element(Main) Window

When you establish a session with a particular SURPASS hiT7550 NE, you will be presented with its Network Element Win-dow, which functions as the root screen from which all otherEM windows for that NE are accessible. Several listings (e.g.alarm listings) are obtainable directly from this window; they re-flect the NE as a whole.

Module View From the Network Element Window, you must navigate to theModule View to subsequently configure various parameters orto request detailed information on the NE and modules. TheModule View represents the subracks and all modules in theirassigned slots.OR

Traffic View From the Network Element Window, you may also navigate tothe traffic view, which gives an overview of the network ele-ment's general optical path structure and of the involved mod-ules. Additionally, the traffic view displays informationconcerning the modules.

NE, Subrack, andModule Details

A large amount of information is obtainable by navigating to thevarious EM detail screens. Information pertaining to the NE asa whole or individual modules can be requested. This includescomprehensive Configuration, Security, Alarm, Software, andDatabase details, as well as Traffic Performance measure-ments (both in numeric and graphical form).

110 A42022-L5936-C51-1-7618


3.6 Control and Monitoring via Network Management System(See also Chapter 2.3.7)

SURPASS hiT features advanced network management capabilities. Each network ele-ment in a SURPASS hiT network contains one Main Control Unit (MCU) module. MCUsare the major control element in the system. At the local level, each MCU communicateswith the other modules in its network element and supports the gathering and reportingof traditional local telemetry (major and minor audible/visual alarms, – 60 Vdc power fail,Alarm Cut-off, Lamp Test, etc.). It also provides an interface for connecting theTNMS CT element manager (Local Craft Terminal, LCT). At the system-wide level, theMCU provides a full Q3 interface to connect the SURPASS hiT system to the customer’sQ3-CMISE compliant TMN system. Access can be through the TNMS CT element man-ager (Network Control Terminal, NCT) or direct from the customer’s OSS.

The MCU serves as the gateway between the SURPASS hiT system and the NetworkManagement System. The MCU provides a full Q3-CMISE interface for connection ofthe SURPASS hiT system to the customer’s Operational Support System (OSS) and theQF interface for connection of PC-based local element managers (Local Craft Termi-nals). MCU software implements all activities related to:

Equipment Management Performance ManagementSoftware Management Real Time ManagementFault Management Security ManagementConfiguration Management Message Control Function

A42022-L5936-C51-1-7618 111



4 HardwareThis chapter describes the SURPASS hiT 7550 2.05 hardware. It consists of the follow-ing sections:• Racks• Subracks• Modules• System Equipment• Display and Operating Elements on Equipment

4.1 RacksThe SURPASS hiT 7550 2.05 is a highly modular system in which easy to install mod-ules are housed in single-row or double-row equipment subracks that mount in commonANSI racks or ETSI racks optimized for optical and electrical cabling.

Beside the power distribution panel (PDP) on top of the rack, up to three single row sub-racks or one single row subrack and one double row subrack can be mounted in onerack. The PDP contains at least six fuses/power breakers (15/16 A and 20 A, see Chap-ter 4.1.2) for working and the same for spare power supply.

4.1.1 Mechanical LayoutExamples of the mechanical equipment layout for OTT, OLR, OADM, and CCU areshown in Fig. 4.11 through Fig. 4.14. For further details concerning the rack dimen-sions, refer to Chapter "7.2 Rack/Subrack Mechanical Data".

4.1.2 Rack and Subrack Power SupplyThe rack is operated by a AC/DC station converter and a battery 48/60V, positivegrounded. Voltage range is between -40.5 Vdc to -75 Vdc (nominal voltage -48/-60 Vdc).

At the rack power distribution panel PDP, each power line input is distributed over twocircuit breakers (20 A fuse for an OADM double row subrack equipped with OLI mod-ules, 15/16 A fuse for all other subracks) to the input connectors and terminal blocks ofthe subrack.

All power lines have an input noise filter before the distribution on the backplane in thesubrack. The noise filters are for an extra low level of re-injected noise on the DC powerdistribution in accordance with the relevant standards ETS 300 132-2 [ETS-60], EN55022 [ETS-154] and ETS 300386-1.

Rack, subrack and modules are grounded by multiple mechanical and electrical connec-tions to the planar shelf (protection earth).

Fig. 4.1 shows the power supply within the rack with single row subracks. Fig. 4.2shows the power supply within the rack with double row subracks. Fig. 4.3 representsthe power supply within the subrack.

112 A42022-L5936-C51-1-7618


Fig. 4.1 Power Distribution within the Rack (Single Row Subrack)

Station Power SupplyAC/DC and Batteries

positive grounded

INPUT A INPUT B

Distribution PanelRack Top

Circuit Breakers / Fuses

Connector

LF Filter

UBAT1 UBAT4

SubrackDistribution

FAN2

FAN1

NU

BA

T1

PU

BA

T1/3

slot

s

Subrack Backplane

Rack

Planar shelf / Protection Earth

slot 1 ... 10

UBAT2 UBAT3N

UB

AT3

NU

BA

T2

PU

BA

T2/4

NU

BA

T4

slot

s

slot

s

slot

s

slot 11 ... 19

A42022-L5936-C51-1-7618 113



Fig. 4.2 Power Distribution within the Rack (Double Row Subrack)

Station Power SupplyAC/DC and Batteries

positive grounded

INPUT A INPUT B

Distribution PanelRack Top

Circuit Breakers / Fuses

Connector

LF Filter

UBAT1 UBAT4

SubrackDistribution

FAN2

FAN1

NU

BA

T1

PU

BA

T1/3

slot

s

Subrack Backplane

Rack

Planar shelf / Protection Earth

UBAT2 UBAT3

NU

BA

T3

NU

BA

T2

PU

BA

T2/4

NU

BA

T4

slot

s

slot

s

slot

supper rowslot 11 ... 19

upper rowslot 1 ... 10

slot

s

slot

s

slot

s

slot

slower rowslot 11 ... 19

lower rowslot 1 ... 10

NU

BA

T1

PU

BA

T1/3

NU

BA

T3

NU

BA

T2

PU

BA

T2/4

NU

BA

T4

114 A42022-L5936-C51-1-7618


Fig. 4.3 Power Distribution within the Subrack

UBAT1

LF-Filter

UBAT2

SU

UBAT

UC

+12V

+3,3V

+5V

SU

MCU

ULED +4,7V

SUFault LED

SLOOP 2SLOOP 1

MCUCard in slot 19

Subrack

1)

UC n

UC 2UC 1

UBAT

UC

SU

LCCULED +4,7V

SUFault LED

SLOOP 2SLOOP 1

Card in slot 11 ... 18

SAB(M)

PowerBus+5V

*) also slot 19

*)

NEAP+S

UBAT3 UBAT4

Fan unit 1

NUBAT4NUBAT2PUBAT

NUBAT1NUBAT3PUBAT

Shelf Alarm

+S -S

Fan unit 2

1)

UC n

UC 2UC 1

UBAT

UC

SU

LCCULED +4,7V

SUFault LED

SLOOP 2SLOOP 1

Card in slot 1 ... 10

*)

ULED

-BUS

NUBA

T4NU

BAT2

PUBA

T

1) CAD2,EAM4,OM/OD,OPA,OSCT,PUMP,RPUMP,OLI,OCA/OCAS//OCS,PQM

NUBA

T1NU

BAT3

PUBA

T

Powe

r Bus

+5V

SU = SupervisionUC = Operating voltage

+S/-S = Signaling voltage UBAT = Battery voltage (supply voltage)LT = Lamp test

A42022-L5936-C51-1-7618 115



4.1.3 Connector PanelAll connections like the power supply, signaling data and so on from the subrack to therack, to other subracks or to further equipment are terminated on the connector panelCOPA (see Fig. 4.4). The panel is placed on the subrack lower front side.

Fig. 4.4 SURPASS hiT 7550 2.05 Connector Panel (COPA), Front Access

There is a variety of connectors on the COPA. Most of them are used only on the sub-rack that contains the OSCT module in each NE.

COPA Power Connectors

ANSI subracks with front access COPA and all ETSI subracks have four 3W3 type pow-er connectors labeled as UBAT1, UBAT2, UBAT3 and UBAT4.

Fig. 4.5 COPA Power Connectors

... The connectors 10BT_0, 10BT_M2, and 10BT/100BT are currently not in use!

-48/-60 Vdc

116 A42022-L5936-C51-1-7618


4.2 SubracksThis section consists of the following subsections:• Subrack Mounting• DCM Trays

4.2.1 Subrack MountingThe SURPASS hiT 7550 2.05 uses single-row and double-row equipment subracks.Both subrack types used in ANSI and ETSI markets are shown in Fig. 4.6 to Fig. 4.9.For further details concerning the rack dimensions, refer to Chapter "7.2 Rack/SubrackMechanical Data".

Fig. 4.6 ANSI Single-Row Subrack (Front Access)

A42022-L5936-C51-1-7618 117



Fig. 4.7 ANSI Double-Row Subrack (Front Access)

118 A42022-L5936-C51-1-7618


Fig. 4.8 ETSI Single-Row Subrack (Front Access)

A42022-L5936-C51-1-7618 119



Fig. 4.9 ETSI Double-Row Subrack (Front Access)

120 A42022-L5936-C51-1-7618


4.2.2 DCM TraysIn order to fit the UDCMs within the rack, DCM shelves are installed in the bottom or thetop of the rack. In a 2 HU shelf four UDCMs can be mounted.

Fig. 4.10 shows the DCM tray.

Fig. 4.10 DCM Tray

A42022-L5936-C51-1-7618 121



4.3 ModulesModules are described in detail in the following sections:• "3.3 Functional Overview of the Modules" describes the module functionality.• "4.4 System Equipment" describes the arrangement of modules in the rack/subrack.

4.4 System EquipmentFor the example configurations as shown in Fig. 4.11 through Fig. 4.14, the maximumnumber of OLI pump cards (PUMPA, PUMPB, PUMPC) was assumed for the equipping.For some configurations Raman pumps and the OPA card were included to demon-strate the possible equipping options. Actual configurations may of course require fewerOLI pump cards, Raman pump cards and OPA cards.

This section consists of the following subsections:• OTT Equipment• OLR Equipment• OADM Equipment• CCU Equipment

Chapters 4.4.1 to 4.4.3 each represent only one example for NE equipping.

The listed power consumption values in Fig. 4.11, Fig. 4.12, and Fig. 4.13 aretotal maximum power values.

In a completely equipped subrack/rack you will get the total maximum power as 90 per-cent from the maximum value (because not all modules consume the maximum powerat the same time).

☞For description of the NE functionality, refer to Chapter "3.2 Functional Over-view of the NE Types".For description of the module functionality, refer to Chapter "3.3 FunctionalOverview of the Modules".

iFor equipping details see Installation and Test Manual ITMN.

122 A42022-L5936-C51-1-7618


4.4.1 OTT Equipment

Fig. 4.11 OTTU, C+L Bands, 160 Channels (Equipping Example)

Shown:ETSI2200mmx600mmx300mmracksTotal Power Consumption: 1564 W

Rack 1: 828 W Rack 2: 736 W

Rack powerpanel

Double-rowsubrack forL-bandmux/demux

Single-row sub-rack for L-bandamplifiers

Electrical connec-tor panel (on eachsubrack)

Tray for passivedispersion com-pensators

Double-rowsubrack forC-bandmux/demux

Single-row sub-rack for C-bandamplifiers andnetwork elementcontroller

A42022-L5936-C51-1-7618 123



4.4.2 OLR Equipment

Fig. 4.12 OLRU, C+L Bands (Equipping Example)

Shown: ETSI 2200mm x 600mm x 300mm rackTotal Power Consumption: 1545 W

Single-row subrack(address "2")for L-band amplifiers

Single-row subrack(address "1")for C-band amplifiersand network elementcontroller

Tray for passivedispersion com-pensators

124 A42022-L5936-C51-1-7618


4.4.3 OADM Equipment

Fig. 4.13 OADMU, C+L Bands, 160 Channels, with Maximum Configurable Add/Drop Capacity

Total Power Consumption: 2542 WRack 1: 1103 W Rack 2: 300 W Rack 3: 1139 W

2CAD2C4C4

CA

D2C

4C4

CA

D2C

3C3

CA

D2C

3C3

CA

D2C

2C2

CA

D2C

2C2

CA

D2C

1C1

CA

D2C

1C1

SM

US

AB3 C

AD

2C8C

8

SM

US

AB

CA

D2C

7C7

CA

D2C

7C7

CA

D2C

6C6

CA

D2C

6C6

CA

D2C

5C5

CA

D2C

5C5

CA

D2C

8C8

cL

6 CA

D2L

4L4

CA

D2L

4L4

OM

D2I

L

CA

D2L

3L3

CA

D2L

3L3

CA

D2L

2L2

CA

D2L

2L2

CA

D2L

1L1

CA

D2L

1L1

SM

US

AB

5 SM

US

AB

OLI

TP

UL

OLI

TB

UL

OM

DF

ILE

AM

4L

OM

D2I

L

PU

MP

A

PU

MP

A

PU

MP

CP

UM

PB 7CAD2L7L7 C

AD

2L7L

7

CA

D2L

6L6

CA

D2L

6L6

CA

D2L

8L8

CA

D2L

8L8

CA

D2L

5L5

CA

D2L

5L5

SM

US

AB 1 SM

US

AB

OLI

TP

C

OLI

TB

C

OM

DF

ICE

AM

4CE

AM

4CO

MD

2IC

PU

MP

A

PU

MP

A

PU

MP

CP

UM

PB

4OLI

TB

UL

OLI

TP

UL

OM

DF

ILE

AM

4L

SM

U

PU

MP

A

PU

MP

A

SA

B

PU

MP

BP

UM

PC 0 O

SC

TU

I

OLI

TB

C

OLI

TP

C

OM

DF

IC

OP

A

MC

U

PU

MP

A

PU

MP

A

SA

BM

IB

PU

MP

BP

UM

PC

OM

D2I

C

A42022-L5936-C51-1-7618 125



4.4.4 CCU Equipment

Fig. 4.14 CCU Equipping (Example: CCU Applied in a back-to-back 100% OADM)

Fig. 4.14 shows the CCU network element in a typical application, combined with twoback-to-back OTT network elements.

cable compartment

PDP

OC

AS

2

OC

AS

4

OC

AS

6

OC

AS

8

OC

AS

10

su

bra

ck 4

cable compartment

PDP

OS

CT

UT

18

OC

AS

16

OC

AS

2

OC

AS

4

OC

AS

6

OC

AS

8

OC

AS

10

OC

AS

12

OC

AS

14

su

bra

ck 0

cable compartment

PDP

OC

AS

18

OC

AS

16

OC

AS

2

OC

AS

4

OC

AS

6

OC

AS

8

OC

AS

10

OC

AS

12

OC

AS

14su

bra

ck 2

cable compartment

PDP

OC

AS

18

OC

AS

16

OC

AS

2

OC

AS

4

OC

AS

6

OC

AS

8

OC

AS

10

OC

AS

12

OC

AS

14

su

bra

ck 1

cable compartment

PDP

OC

AS

18

OC

AS

16

OC

AS

2

OC

AS

4

OC

AS

6

OC

AS

8

OC

AS

10

OC

AS

12

OC

AS

14

su

bra

ck 3

Network element CCU

cable compartment

PDP

su

bra

ck 1

RP

um

pC

2

OP

A *

5

PU

MP

B

6

PU

MP

A

7

OL

I T

PC

10

OL

I T

BC

13

PU

MP

A

14

PU

MP

B

15

PU

MP

C

16

OS

CT

UT

18

4x UDCM

cable compartment

su

bra

ck 2

su

bra

ck 3

OM

20

C1

C2

1 OM

20

C3

C4

5 OD

20

C1

C2

9 OD

20

C3

C4

13

OM

DF

IC

18

OM

20

C5

C6

1 OM

20

C7

C8

5 OD

20

C5

C6

9 OD

20

C7

C8

13

OM

D2

IC

18

Network element OTT #2

PU

MP

C *

5

cable compartment

PDP

su

bra

ck 1

RP

um

pC

2

OP

A *

5

PU

MP

B

6

PU

MP

A

7

OL

I T

PC

10

OL

I T

BC

13

PU

MP

A

14

PU

MP

B

15

PU

MP

C

16

OS

CT

UT

18

4x UDCM

cable compartment

su

bra

ck 2

su

bra

ck 3

OM

20

C1

C2

1 OM

20

C3

C4

5 OD

20

C1

C2

9 OD

20

C3

C4

13

OM

DF

IC

18

OM

20

C5

C6

1 OM

20

C7

C8

5 OD

20

C5

C6

9 OD

20

C7

C8

13

OM

D2

IC

18

Network element OTT #1

PU

MP

C *

5

MIBSSAB

MCU

MIBSSAB

MCU

SMU S

AB

SMU S

AB

SMU S

AB

SMU S

AB

SAB

SMU

SAB

SMU

SAB

SMU

SAB

SMU

MIBSSAB

MCU

126 A42022-L5936-C51-1-7618


The subrack of the CCU network element may be equipped with the following modules:• MCU/SMU• SAB• OCA/OCAS/OCS

4.5 Display and Operating Elements on EquipmentThis section consists of the following subsections:• NE Alarm Panel• SAB Boards and Subrack Address Setting• Module Front Panel Features

4.5.1 NE Alarm PanelAlarms of the subrack are indicated on the NE Alarm Panel (NEAP, see Fig. 4.15). TheNEAP contains a small board and is installed above the fan unit slots of the subrack. Itcontains the indication LEDs as Power On (4x green), major equipment alarm (red), mi-nor equipment alarm (yellow), major communication alarm (red), minor communicationalarm (yellow) and ACO (Alarm Cut-Off) (blue). In addition for control, one button (black)for lamp test (to switch on all LEDs via cards) and one (blue) for ACO (to acknowledgeindicated alarms) are fitted.

The LEDs on it are visible and connectors are contactable even if the subrack front coveris mounted.

All rack alarms are derived from the supervision unit MCU of the subrack. The signalseffect visible and audible alarms on top of the rack. All subrack alarms are connected bycable to the power distribution and alarm panel PDP or other equipment on the top ofthe rack.

At the NEAP front side, there also is a rotary switch for setting the subrack addresses(see Fig. 4.16).

On the right half of the NEAP there are located three connectors:– Ethernet interface 10/100BT– Serial interface F-IF– Handset connector

Fig. 4.15 NE Alarm Panel

4.5.2 SAB Boards and Subrack Address SettingThe following applies for the Subrack Address Board (SAB) and the subrack addresssetting:– Every subrack (single-row subrack and double-row subrack) is equipped with one

SAB. The SAB provides necessary information for the PCB/CAN bus.– At OADM NEs, the SABM board is needed because of the potentially large number

of subracks required. At an OADM, the SABM replaces the SAB in the subrack thatcontains the MCU. This subrack should always be placed in the middle of the sub-rack chain.

– All subracks in an OTT or OLR are always equipped with an SAB.

A42022-L5936-C51-1-7618 127



– Subrack addresses are set via a small rotary switch that is placed at the NEAP (seeFig. 4.16). This switch has 8 positions (switch is marked by the numbers 0 to 7).

– In a double-row subrack, the address of the lower row is always an even number.The address of the upper row is equal to the lower row address increased by 1. So,it always is an odd number.

Fig. 4.16 Subrack Address Setting

4.5.3 Module Front Panel FeaturesEach module includes the following features:– Large top and bottom insertion/extraction aids that allow the module to be easily in-

stalled and removed from the SURPASS hiT 7550 subrack. A latching mechanismensures a positive lock.

– Green OK LED and red Fault LED.– Debug port (for use by authorized personnel only). This port is used at active mod-

ules only.– The front panel on OM/OD, OLI, PUMP, RPUMP, OCA, and OCAS modules also

shows the warning symbols for laser radiation (for examples, refer to the Chapter"Protective Measures" of the Installation and Test Manual ITMN).

☞For details on how to perform the subrack addressing, refer to the ITMN.

128 A42022-L5936-C51-1-7618


A42022-L5936-C51-1-7618 129



5 SoftwareThis chapter consists of the following sections:• Fault Management• NE Software Management• Management PC Software

5.1 Fault Management

Current Alarm List

Fig. 5.1 shows an example of a Current Alarm List. This window displays all alarms thatare currently active in the NE. Alarms that have cleared are automatically purged fromthis list. The Current Alarm List features the following:

Also, note that by clicking the mouse on any of the column headings, it is possible tochange the order in which the alarms are listed. For example, click on the “Severity”header to toggle between listing the alarms in most-to-least severe order and vice versa.

Checkboxes to select which alarm severities are listed. You maychoose to list any or all of the following: Critical alarms,Major alarms, Minor alarms or Warnings. You may alsochoose to list Acknowledged alarms, Unacknowledgedalarms, or both. To acknowledge an alarm, right-click on itand choose “Acknowledge” or use the Fault pull-downmenu to acknowledge all listed alarms at once.

Counters that display the current number of each type of alarm (Crit-ical, Major, Minor, and Warning). These are read-onlyfields.

Alarm List This is the actual listing of details for each Current Alarm.For each alarm, the following is listed (from left to right):

Severity Icon This is a colored circle that allows you to quickly identifythe severity of listed alarms. Red = Critical, Orange = Ma-jor, Yellow = Minor and Blue = Warning. A blue box sur-rounding any colored circle indicates that the alarm isunacknowledged

Object The name of the SURPASS hiT 7550 2.05 component re-porting the alarm. This can be the name of a module, or asystem entity such as “Monitoring Point” or “ExternalAlarm”.

Location The location of the Object reporting the alarm, i.e. themodule name, slot number, and/or port number.

Alarm The actual alarm event. Since there is limited space on theAlarm List, abbreviations are used for the alarm events.

Severity The severity level associated with the event (Critical, Ma-jor, Minor, or Warning).

State “Acknowledged” or “Unacknowledged”. To acknowledgean alarm, select it and right-click the mouse. Or use theFault pull-down menu to Acknowledge all alarms at once.

130 A42022-L5936-C51-1-7618


Fig. 5.1 Current Alarm List (Example)

Select which alarms you want to display.Select any or all of the following:

These show the total number of each typeof alarm appearing in the Current Alarm List.These are read-only fields.

Checkboxes

Severity Icons

Details Listed for Each Alarm

Counters

CriticalMajorMinorWarningAcknowledgedUnacknowledged

AlarmListarea

Red =Orange =Yellow =

Blue =

CriticalMajorMinorWarning

A blue box around the iconindicates that the alarm

is unacknowledged.

Object

Location

Alarm

Severity

State

Name of the component reporting the alarm. This canbe the name of a module or an entity such as atransmit or receive interface.

Location of the Object reporting the alarm; modulename, slot number, port number.

The actual alarm event. They are highly abbreviated inthis window.For detailed explanation of all alarms, refer to the OnlineHelp.

Critical, Major, Minor, or Warning.

Acknowledged or Unacknowledged. To acknowledge analarm, right-click on it, or use the Fault pull-down menuto acknowledge all alarms at once.

Click on any of the columnheadings to change the orderin which alarms are listed.

A42022-L5936-C51-1-7618 131



History Alarm List

Fig. 5.2 shows an example of a History Alarm List. This window displays a history logof all alarms that have been reported by this NE since the EM session was established.The History Alarm List is basically the same as the Current Alarm List described abovewith the following exceptions:– Cleared Alarms are listed in the History List, but not in the Current List.– Date and time stamps are listed for each alarm in the History List.

You may specify the maximum number of entries in this list via the Option Settings dia-log box.

Fig. 5.2 History Alarm List (Example)

Select which alarms you want to display. Choicesare the same as for the "Current Alarm" listings.

Checkboxes

Details Listed for Each AlarmThe details listed for each alarm are the same as those for the "Current Alarm"listings (see previous Figure) with the following differences:

Alarms that have cleared are listed.

Time and date the alarm was reported are listed.

Click on any column heading tochange the order in which alarmsare listed.

Click this button toclear the contentsof the History TCA List.

You may specify the maximum number of Alarms listed in this window via the Option Settings dialog box.

132 A42022-L5936-C51-1-7618


5.2 NE Software ManagementThe MCU holds two complete versions of the APS (Application Program System) soft-ware for all modules in its NE, the “Active” APS and the “Inactive” APS. If a new APSversion needs to be downloaded to the MCU, it is first stored as the “Inactive” version,then swapped to become the “Active”. This way, the original APS is recoverable if thenew APS proves unstable. The APS contains one software image of each module. Soft-ware version numbers for all modules are obtainable from the Active APS.

Fig. 5.3 NE Software Management

The “Software Management” window provides a means to check the compatibility of theActive APS (Application Program System) with installed modules and to download anew APS if desired.

A42022-L5936-C51-1-7618 133



5.3 Management PC Software’SURPASS hiT 7550’ local craft terminal: the network management software for Win-dows 2000 platforms is supplied on one compact disk.’SURPASS hiT 7550’ network craft terminal: the network management software for Win-dows 2000 platforms is supplied on a separate compact disk. Each CD includes the fol-lowing components:– SURPASS hiT 7550 2.x Element Manager software– Siemens ’TNMS CT’ Local Craft Terminal (LCT) / Network Craft Terminal (NCT) soft-

ware– TMN-DCP OSI Stacks.

134 A42022-L5936-C51-1-7618


A42022-L5936-C51-1-7618 135



6 Commissioning, Operation and MaintenanceThis chapter consists of the following sections:• Commissioning• Operation• Maintenance

6.1 CommissioningThe SURPASS hiT 7550 2.05 has to be configured on initial commissioning. For thispurpose, a Local Craft Terminal (LCT) has to be connected to the LCT interface at theCOPA front side. The craft terminal offers a graphical, menu-driven Element Manager(EM) user interface.

6.2 Operation

6.2.1 Operating and Display Elements of the Modules

LED Displays of the Modules

For assistance in maintenance work, there are a red fault LED and a green service sta-tus LED on the front of every module. For some modules the red LED has some specialmeanings (see Online Help).

Operating Elements of the Modules

No hardware settings have to be made on the printed circuit boards of the modules. Themodules are configured by software commands of the EM user interface (or from a net-work management system) when commissioning or in case of later changes.

6.2.2 Operation with an Operating TerminalFor local or remote control and monitoring of the SURPASS hiT 7550 2.05 by means ofthe EM user interface, the ’TNMS CT’ LCT/NCT software also must be installed andconnected on the PC. The EM application communicates with the MCU module of theSURPASS hiT 7550 2.05 equipment using the gateways provided by the TNMS CT soft-ware.

iDetailed information for commissioning of equipment and the operating terminals canbe found in the Installation and Test Manual ITMN.

iOperation of SURPASS hiT 7550 2.05 equipment is explained in detail in the OperatorGuidelines OGL and in the Online Help.

iModule configuration by software is explained in the Operator Guidelines OGL.

iFor local control/monitoring a PC only with ’TNMS CT’ LCT software installed must per-manently be allocated to the local NE.

136 A42022-L5936-C51-1-7618


6.3 Maintenance

The alarm and maintenance concept of the system provides sufficient alarm informationto localize and clear the fault at module level. The equipment has been designed in sucha way that no regular settings are required.

Maintenance measures (e. g. fault localizing) can be carried out locally or under remotecontrol using the EM user interface and the ’TNMS CT’ LCT/NCT software.

iMaintenance of SURPASS hiT 7550 2.05 equipment is described in the OperatorGuidelines OGL and in the Online Help.

A42022-L5936-C51-1-7618 137



7 Technical DataThis chapter describes the most important SURPASS hiT 7550 2.05 technical parame-ters. The chapter consists of the following sections:• Physical Layer Parameters• Rack/Subrack Mechanical Data• Technical Characteristics of Modules• Rack/Subrack Power Supply• Electrical Power Consumption of Modules• Electrical Power Consumption of Racks• External Interfaces• System Environmental Specifications• System Requirements for the Element Manager

138 A42022-L5936-C51-1-7618


7.1 Physical Layer Parameters

General information

Maximum number of channels 160

Bit rate/line coding of optical tributary signals 10 Gbit/s NRZ

Maximum bit error ratio user configurable 10-12 to 10-16 ; typ. 10-13

Supported fibre types SSMF, DSF, NZDSF according to G.652, G.653

and G.655

DMC (Dispersion Managed Cable)

Wavelength Grid compliant to ITU-T G.692

Interface at point MPI-SM

Maximum mean channel output power 11.0 dBm (depending on channel count)

Minimum mean channel output power -5.0 dBm (depending on channel count)

Maximum mean total output power of each wave-

length band (C or L)

depends on the type of optical line amplifier used; refer

to the technical characteristics of the OLI modules in

Tab. 7.13

Central frequency compliant to ITU-T G.692

Channel spacing 50 GHz for 80 channels per C or L band

100 GHz for 40 channels per C or L band

Maximum central frequency deviation 2.5 GHz for 50 GHz channel spacing

10 GHz for 100 GHz channel spacing

Minimum channel extinction ratio 10 dB

Optical path (single span) from point MPI-SM to MPI-RM

Maximum attenuation 40 dB using Raman pumps

Minimum attenuation 15 dB

Minimum optical return loss for 1 span: –17 dB w/o Raman, –20 dB with Raman

for 10 spans: –25 dB w/o Raman, –26 dB with Raman

for 30 spans: –29.7 dB w/o Raman, –30.7 dB with Ra-

man

Maximum discrete reflectance for 1 span: –20 dB w/o Raman, –23 dB with Raman

for 10 spans: –27 dB w/o Raman, –29 dB with Raman

for 30 spans: –31.7 dB w/o Raman, –33.7 dB with Ra-

man

Maximum differential group delay 40 ps for 1 dB OSAR penalty

Interface at point MPI-RM

Maximum mean channel input power -15 dBm (depending on channel count)

Minimum mean channel input power -26 dBm (depending on channel count)

Maximum mean total input power +2.0 dBm

Maximum channel power difference 12 dB

Maximum optical path penalty for n spans 1.8 dB + √n 0.5 dB

Maximum receiver reflectance –27 dB

Tab. 7.1 Physical Layer Parameters

A42022-L5936-C51-1-7618 139



Meaning of the above mentioned reference points:MPI-SM: a multichannel reference point on the optical fibre just after the output opticalconnector of the NE transport interfaceMPI-RM: a multichannel reference point on the optical fibre just after the input opticalconnector of the NE transport interface

7.2 Rack/Subrack Mechanical Data

7.2.1 Rack Mechanical DataInfinity MTS uses standard ANSI racks or ETSI racks (see Tab. 7.2 and Tab. 7.3) opti-mized for electrical and optical cabling.

Parameter Dimension

Height 2200 mm

Height (usable) 2050 mm

Width 600 mm

Usable width between rack uprights 500 mm

Depth 300 mm

Depth (usable) 280 mm

Weight of the unequipped ETSI subrack about 59 kg

Tab. 7.2 ETSI Rack Dimensions According to ETS 300

Parameter Dimension (mm) Dimension (ft/HU)

Height 2134

2286

2438

7 ft

7 1/2 ft1)

8 ft1)

Height (usable) 1867

2045

2178

42 HU2) (7 ft rack)

46 HU (7 1/2 ft rack)

49 HU (8 ft rack)

Width 660 2 ft, 2 inch

Usable width between rack uprights 546 21.5 inch

Depth 305 12 inch

1) In some customer applications 7 1/2 ft and 8 ft high racks are used

2) 1 HU = 1 3/4 inch = 44.45 mm

Tab. 7.3 ANSI Rack Dimensions

140 A42022-L5936-C51-1-7618


7.2.2 Subrack Mechanical Data

Parameter ETSI ANSI

Overall height (including cable compartment) 578 mm 578 mm

Overall width with flanges 533 mm 583 mm

Overall width without flanges 500 mm 500 mm

Mounting center distance 515 mm 566.7 mm

Mounting depth (front) 125 mm 125 mm

Rack spacing 600 mm 578 mm

Weight of the unequipped single-row subrack 19 kg

Tab. 7.4 Subrack Dimensions and Weight (Single Row Subrack)

Parameter ETSI ANSI

Overall height (including cable compartment) 968 mm 968 mm

Overall width with flanges 533 mm 583 mm

Overall width without flanges 500 mm 500 mm

Mounting center distance 515 mm 566.7 mm

Mounting depth (front) 125 mm 125 mm

Rack spacing 975 mm 978 mm

Weight of the unequipped double-row subrack about 26 kg

Tab. 7.5 Subrack Dimensions and Weight (Double Row Subrack)

Parameter ETSI ANSI

Height (rack spacing) 100 mm 88.9 mm

Height 88 mm 88 mm

Width (overall) 533 mm 583 mm

Width between mounting holes 515 mm 567 mm

Depth (max.) 280 mm 280 mm

Weight of the empty DCM shelf about 5 kg

Tab. 7.6 Mechanical Specifications for DCM Shelf

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7.3 Technical Characteristics of ModulesThe following modules are described in this section:• MCU Module• MIBS Module• SAB/SABM Module• SMU Module• OSCTUT and OSCTUI Modules• OLI Modules• PUMPA, PUMPB, and PUMPC Modules• Raman Pump Modules (RPUMPC, RPUMPL and RPUMPUL)• OMDFxx and OMD2xx Modules• OM20xx and OD20xx Modules• CAD2 Modules• EAM4 Module• OPA Module• OCA, OCAS, and OCS Modules• UDCM Modules

7.3.1 MCU Module

7.3.2 MIBS Module

Used at: One MCU in main shelf of each SURPASS hiT 7550 2.05 NE

Module dimensions 25 mm wide x 265 mm high x 235 mm deep

(0.98 inch wide x 10.43 inch high x 9.25 inch deep)

Slots used 1

Weight 2.0 kg

Power consumption (see Chapter 7.5)

Front panel fibre connectors None

Front panel LEDs OK (green) and FAULT (red)

OSS interfaces Q3 over TCP/IP (RFC1006) / 7-layer OSI Stack / Q-F Stack

Office alarm outputs Major audible/visual and Minor audible/visual Form C relays. Pow-

er Fail Form B relay. All relays are 100 mA maximum.

In addition, each shelf features an Alarm Cut-off (ACO) button,

Lamp Test button, and Fan Unit Failure LEDs.

Tab. 7.7 MCU Module

Used at: One MIB in main shelf of each SURPASS hiT 7550 2.05 NE

Module dimensions 7.5 mm wide x 50 mm high x 235 mm deep


Slots used 1 (in combination with one SAB or SAB-M module)

Weight 0.05 kg

Tab. 7.8 MIBS Module

142 A42022-L5936-C51-1-7618


7.3.3 SAB/SABM Module

7.3.4 SMU Module

7.3.5 OSCTUT and OSCTUI Modules

FEPROM storage capacity 32 MByte


Tab. 7.8 MIBS Module (Cont.)

Used at: One SAB in each subrack

Module dimensions 7.5 mm wide x 90 mm high x 235 mm deep


Slots used 1 (may be combined with one MIB module)

Weight SAB: 0.03 kg, SAB-M: 0.06 kg

Power consumption SAB/SABM (see Chapter 7.5)

SABM: this module hosts an additional CAN bus amplifier/repeater and replaces the SAB module in the

main controller (MCU) subrack in OADM NEs.

Tab. 7.9 SAB/SABM Module

Used at: One in each subrack row of all SURPASS hiT 7550 2.05 NEs ex-

cept for main subracks containing the OSCTU



Slots used 1

Weight 0.8 kg


Tab. 7.10 SMU Module

OSCT Module Types

OSCTUT OSCT, Unidirectional, for use at Terminal NEs (OTT)

OSCTUI OSCT, Unidirectional, for use at In-line NEs (OLR, OADM)

Specifications

Used at: all SURPASS hiT 7550 2.05 NEs (exact type as appropriate)

Module Dimensions 50 mm wide x 265 mm high x 235 mm deep


Slots used 2

Weight 1.7 kg


Tab. 7.11 OSCT Module Types

A42022-L5936-C51-1-7618 143



7.3.6 OLI Modules

Front panel fibre connectors 2 LC/PC for OSCTUT modules

4 LC/PC for OSCTUI modules

Front panel LED’s OK (green) and Fault (red)

External interfaces 2 V.11 for customer 64 kbit/s channels

2 4-wire Voice Engineering Orderwire (EOW)

16 housekeeping inputs and 4 outputs

EOW implementation 2x4-wire interfaces (#1 and #2, 64 kbit/s PCM with A or µ law) with

access via connector panel,

4-wire interface #1 can also be used for the DTMF handset;

4-wire interface #2 is used for an EOW connection to another NE

at the same site.

Laser Class Class 1

OSC Capacity 2 Mbit/s

OSCT Module Optical Characteristics

OSC Wavelength 1625 8 nm

Tx Output Power Range 0.0 dBm .. -3.0 dBm (typical: -1.0 dBm)

Rx Input Power Range -15 dBm .. -50 dBm

EOL Span Loss Range 15.0 dB .. 40.0 dB at 1550 nm (47 dB at 1625 nm)

Line Coding CMI

Tab. 7.11 OSCT Module Types (Cont.)

OLI Module Classification

According to the Special Tasks

Basic type amplifier

OLIS TP/ I /TB

A cost-effective amplifier type with reduced tilt setting facilities.

Used in short links (lengths of 500 to 800 km) with only a low num-

ber of spans or in longer links combined together with extended or

standard type OLIs.

Standard type amplifier

OLI TP/ I /TB

A high performance amplifier with gain tilt control facility.

Extended type amplifier

OLI TP/ I /TB with GTM

A high performance amplifier with extended gain tilt monitoring

(GTM) and controlling facilities. Used for bridging a larger number

of spans in a link.

According to the Application

OLI (S)TP Terminal Preamplifier. Used at terminal sites for amplifying the in-

coming line signal before it is fed into the demultiplexing stage.

OLI (S)I Inline Amplifier. Used at in-line sites for optical regeneration of the

signal.

OLI (S)TB Terminal Booster. Used at terminal sites for amplifying the outgo-

ing line signal.

According to the Used Wavelength Band

Tab. 7.12 OLI Module Classification

144 A42022-L5936-C51-1-7618


OLITPC

OLIIC

OLITBC

C band. This amplifier module operates in the

C band and can be upgraded with an OLI-UL module for additional

support of the L band. Available in versions with and w/o GTM.

OLITPUL

OLIIUL

OLITBUL

Upgrade L band. This amplifier module operates in the L band.

This upgrade module is used for combined C+L-band applications.

Available in versions with and w/o GTM.

OLITPL

OLIIL

OLITBL

L band. This amplifier module operates in the L band. It is specifi-

cally designed for standalone L-band applications where C band

operation is not required. Available in versions with and w/o GTM.

OLITPNC

OLITBNC

OLIINC

C band. This amplifier module operates in the C band. It is specif-

ically designed for standalone C-band applications where L-band

operation is not required. It offers higher span performance due to

the removal of the C/L band splitters, which results in lower inser-

tion loss. Available in versions with and w/o GTM.

OLISTPNC

OLISTBNC

OLISINC

C band, using basic type OLI module. This amplifier module oper-

ates in the C band and cannot be upgraded to C+L band operation.

It consists of performance optimized amplifiers.

Specifications for All Types of OLI Modules

Used at: All NEs (exact type as applicable).

Basic type OLI currently only available in OTTU and OLRU.

Overall dimensions 75 mm wide x 265 mm high x 235 mm deep


Slots used 3

Weight 4.0 kg (3.8 kg for basic type OLI)

Electrical power consumption (see Chapter 7.5)

Front panel fibre connectors 3 pigtails with E2000/HRL for connection of pump modules

2 duplex LC/PC for L-C-Band amplifier interconnection

2 LC/PC for optical signal monitoring

2 LC/PC for line-in and line-out fibre connections

1 LC/PC for the OSC

at OLII (inline amplifier) stations one additional LC/PC

connector for the OSC is provided

Front panel LED’s OK (green) and FAULT (red)

Maximum output power 24 dBm per C/L band (depends on OLI type)

Laser class Class 1 with APSD

Automatic power shut-down (APSD)

level

–28.0 +/ – 2.0 dB

Maximum return loss at LC connec-

tors

30 dB for booster input

35 dB for line input and output

Pump leakage <0 dBm (<1.0 mW)

Multichannel gain variation/difference 1.0 dB (C band)

1.0 dB (L band)

1.6 dB (C band only) with basic type OLI module

Tab. 7.13 Specifications for OLI Modules

Tab. 7.12 OLI Module Classification (Cont.)

A42022-L5936-C51-1-7618 145



Multichannel gain tilt 0.7 dB/dB (C band) (this tilt is compensated with internal tilt filters)

1.0 dB/dB (L band) (this tilt is compensated with internal tilt filters)

0.7 dB/dB (C band only) with basic type OLI module

(this is compensated by EDFA pretilt + GTC pretilt)

Specifications for Specific Types of OLI Modules

OLITBC / OLIIC

Maximum total mean output power 17.5 dBm in standard configuration

20.5 dBm with optional PUMPA module

22.3 dBm with optional PUMPA and PUMPB module

23.5 dBm with optional PUMPA, PUMPB and

PUMPC module

Per channel mean output power range -5.0 dBm <= Pout <= +11.0 dBm

(depending on channel count)

Required per channel mean output power range

(40 channels)

-2.0 dBm <= Pout <= +7.0 dBm

Per channel mean input power range -26.0 dBm <= Popt <= -14.0 dBm for OLITBC


-26.0 dBm <= Popt <= -15.0 dBm for OLIIC


OLITPC / OLITPL / OLITPUL / OLITPNC


22.0 dBm with optional PUMPA module at OTTU Rx

or 21.3 dBm with optional PUMPA module at

OADMU




(40 channels)

-1.0 dBm <= Pout <= +3.0 dBm

Per channel mean input power range -26.0 dBm <= Popt <= -15.0 dBm


OLITBL / OLIIL / OLITBNC / OLIINC





PUMPC module




(40 channels)

-2.0 dBm <= Pout <= +7.0 dBm

Per channel mean input power range -26.0 dBm <= Popt <= -14.0 dBm for OLITBL/

OLITBNC (depending on channel count)

-26.0 dBm <= Popt <= -15.0 dBm for OLIIL/OLIINC


Tab. 7.13 Specifications for OLI Modules (Cont.)

146 A42022-L5936-C51-1-7618


OLITBUL / OLIIUL





PUMPC module

Per channel mean output power range -5.0 dBm <= Pout <= +11.0 dBm at C-band line out-

put (depending on channel count)


(40 channels)

-2.0 dBm <= Pout <= +7.0 dBm



OLISTBNC / OLISINC

Maximum total mean output power 18.0 dBm

Per channel mean output power range -5.0 dBm <= Pout <= +5.0 dBm (at OLI line output,

depending on channel count)


(40 channels)

-2.0 dBm <= Pout <= +2.0 dBm

Per channel mean input power range -26.0 dBm <= Popt <= -14.0 dBm for OLISTBNC


-26.0 dBm <= Popt <= -15.0 dBm for OLISINC


OLISTPNC

Maximum total mean output power 18.5 dBm

Per channel mean output power range -5.0 dBm <= Pout <= +5.5 dBm (at OLI line output,

depending on channel count)


(40 channels)

-2.0 dBm <= Pout <= +2.5 dBm



Tab. 7.13 Specifications for OLI Modules (Cont.)

A42022-L5936-C51-1-7618 147



7.3.7 PUMPA, PUMPB, and PUMPC Modules

Specifications

Used at: optional at any SURPASS hiT 7550 2.05 NE



Slots used 1

Weight 1.15 kg


Optical connector type E2000 angled. Connector is located inside the module

(behind front panel)


On-board laser diodes PUMPA: two 1480 nm laser diodes

PUMPB: two 1495 nm laser diodes

PUMPC: two 1465 nm laser diodes

Maximum optical output power 450 mWatt (26.5 dBm)


Tab. 7.14 PUMPA, PUMPB, and PUMPC Modules

iFor use of pump modules with different OLI module variants and the corresponding totaloutput power of the OLI modules refer to Chapter 7.3.6.

148 A42022-L5936-C51-1-7618


7.3.8 Raman Pump Modules (RPUMPC, RPUMPL and RPUMPUL)

Specifications

Used at: optional at any SURPASS hiT 7550 2.05 NE



Slots used 2

Weight 2 kg


Front panel fibre connectors RPumpC: 2 LC/PC and 1 Duplex LC/PC

RPumpL: 2 LC/PC

RPumpUL: 1 Duplex LC/PC


Maximum optical output power < 27 dBm (< 500 mW)


Raman Pump Module Types

RPUMPC "Raman Pump, C band". Raman pump for C-band wavelengths.

RPUMPUL "Raman Pump, Upgrade L band". Raman pump that can be used

only in combination with the RPUMPC module for a system that

uses both the C band and L band.

RPUMPL "Raman Pump, L band". Raman pump to be used with systems

that will be L band only.

Tab. 7.15 Raman Pump Modules (RPUMPC, RPUMPL and RPUMPUL)

A42022-L5936-C51-1-7618 149



7.3.9 OMDFxx and OMD2xx Modules

Used at: OTTU (100% OADM) and OADMU NEs



Slots used 2

Weight OMDFI C/L: 1.8 kg

OMD2I C/L: 1.8 kg

OMDF C/L: 1.5 kg


Front panel fibre connectors OMDFIC: 12 LC/PC

OMDFIL: 12 LC/PC

OMDFC: 6 LC/PC

OMDFL: 6 LC/PC

OMD2IC: 6 LC/PC

OMD2IL: 6 LC/PC

Front panel LED’s none

Maximum return loss with LC connec-

tors

35 dB

Bandwidth (1 dB) 16 GHz

Even-odd channel isolation 25 dB

Active temperature controlled over -5˚C .. +65˚C (not for OMDFC/L)

Tab. 7.16 OMDFxx and OMD2xx Modules

150 A42022-L5936-C51-1-7618


7.3.10 OM20xx and OD20xx Modules

7.3.11 CAD2 Modules

Used at: OTTU (100% OADM) and OADMU NEs

Module dimensions 100 mm wide x 265 mm high x 235mm deep


Slots used 4

Weight OD20xx 3.1 kg

Weight OM/ODA20xx 4.1 kg


Front panel fibre connectors 24 LC PC

Front panel LED’s none

Input power range for OM20xx adjustable between:

- 8 dBm (+/ - 4.5 dBm) to +2 dBm (+/ - 4.5 dBm)

Output power range for OD/ODA20xx - 14 dBm to - 2.0 dBm per channel

Maximum return loss at LC connector 35 dB


Adjacent channel isolation 22 dB

Non-adjacent channel isolation 40 dB

Temperature stability range -5˚C .. +65˚C via passive compensation

Tab. 7.17 OM20xx and OD20xx Modules

Used at: OADMU NEs



Slots used 2

Weight 1.5 kg


Front panel fibre connectors 8 LC/PC


Add-channel input power range 0 dBm +/ - 4.5 dB

Drop-channel output power range - 12.0 dBm to - 6.0 dBm


Adjacent channel isolation 22 dB

Non-adjacent channel isolation 36 dB

Switching time < 15 ms

Maximum return loss at LC connector 41.0 dB

Temperature stability The given parameters are valid for the whole operating tempera-

ture range of 0˚C ... 65 ˚C

Tab. 7.18 CAD2 Modules

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7.3.12 EAM4 Module

7.3.13 OPA Module

Used at: OADMU NEs



Slots used 2

Weight 1.0 kg




Temperature stability range 0 ˚C to 65 ˚C


Tab. 7.19 EAM4 Module

Used at: optional at OTTU (100% OADM), OADMU and OLRU NEs



Slots used 3

Weight 3 kg



Temperature stability range - 5˚C to +70 ˚C

OSNR measurement range 8 dB to 28 dB

Resolution bandwidth 0.1 nm

Measurement grid 100 GHz

Tab. 7.20 OPA Module

152 A42022-L5936-C51-1-7618


7.3.14 OCA, OCAS, and OCS Modules

Used at: CCU NEs together with OTTU (100% OADM) and OADMU

Module types OCAC, OCAL: module with four single channel amplifiers for C/L

band

OCASC, OCASL: module with four single channel amplifiers and

with optical switches for C/L band

OCS: module with optical switches only (for C and L band)

L band modules are not available in the current release.



Slots used 2

Weight OCA, OCAS: 3.0 kg

OCS: 1.7 kg


Front panel fibre connectors LC/APC connectors

Front panel LED’s OK (green) and FAULT/LOS alarm (red)

Amplifiers (EDFAs) OCAC/OCAL/OCASC/OCASL: four single channel amplifiers

Add-channel input power range adjustable between:

- 8 dBm (+/ - 4.5 dBm) to +2 dBm (+/ - 4.5 dBm)

Drop-channel output power range - 12.0 dBm to - 6.0 dBm

Switching time < 15 ms


Mean input power range –15.0 to –3.0 dBm (OCA, OCAS)

Mean output power range OCA: +3 to +8 dBm, typical +7.5 dBm

OCAS: -3 to + 2 dBm


Optical switches OCS/OCASC/OCASL: two 2:1 switches per channel (four chan-

nels) for add/drop or express traffic

Temperature stability OCS: - 5˚C to +70 ˚C

OCA, OCAS: 0˚C to +50˚C

Tab. 7.21 OCA, OCAS, and OCS Modules

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7.3.15 UDCM Modules

Specifications

Shelf size (UDCM tray) 583 mm wide x 88.2 mm high x 300.3 mm deep

(23 inches wide x 3.5 inches high x 11.8 inches deep)

UDCM dimensions (up to 4 fit into a

UDCM Tray)

268 mm wide x 40.8 mm high x 294 mm deep

10.5 inches wide x 1.6 inches high x 11.6 inches deep

Weight UDCM, depending on type:

10 km to 80 km: 3.15 kg + n x 0.12 kg (“n” for each 10 km = 1 ... 8);

90 km to 120 km: 3.7 kg + n x 0.12 kg (“n” for each 10 km = 9 ... 12)

UDCM tray: 5.0 kg


Maximum return loss without LC con-

nector (Rayleigh backscatter)

27 dB

UDCMC (C band) Unidirectional Dispersion Compensation Modules with Slope Compensation

for SSMF

Type Average Dispersion at 1550 nm

UDCMC-10 -170 ps/nm

UDCMC-20 -340 ps/nm

UDCMC-30 -510 ps/nm

UDCMC-40 -680 ps/nm

UDCMC-50 -850 ps/nm

UDCMC-60 -1020 ps/nm







Relative dispersion slope RDS = 0.0035 / nm

UDCMCA (C band) Unidirectional Dispersion Compensation Modules

for SSMF


UDCMC-10A -170 ps/nm









Tab. 7.22 UDCM Modules

154 A42022-L5936-C51-1-7618





UDCML (L band) Unidirectional Dispersion Compensation Modules with Slope Compensation

for SSMF


UDCML-10 -187 ps/nm

UDCML-20 -374 ps/nm

UDCML-30 -561ps/nm

UDCML-40 -748 ps/nm

UDCML-50 -935 ps/nm

UDCML-60 -1122 ps/nm








UDCMCP (C band) Unidirectional Dispersion Compensation Modules for NZDSF and DSF with Pos-

itive Slope Compensation


UDCMC-48P 48 ps/nm

UDCMC-80P 80 ps/nm

UDCMC-128P 128 ps/nm




UDCMCN (C band) Unidirectional Dispersion Compensation Modules with Slope Compensation for

NZDSF+ (Truewave RS)


UDCMC-170N -170 ps/nm









Tab. 7.22 UDCM Modules (Cont.)

A42022-L5936-C51-1-7618 155



UDCMLN (L band) Unidirectional Dispersion Compensation Modules with Slope Compensation for

NZDSF+ (Truewave RS) and DSF


UDCML-170N -170 ps/nm












UDCMCH (C band) Unidirectional Dispersion Compensation Modules with Slope Compensation for

NZDSF+ (LEAF & Freelight)


UDCMC170H -170 ps/nm







UDCMLH (L band) Unidirectional Dispersion Compensation Modules with Slope Compensation for

NZDSF+ (LEAF & Freelight) and DSF


UDCML170H -170 ps/nm












Tab. 7.22 UDCM Modules (Cont.)

156 A42022-L5936-C51-1-7618


7.4 Rack/Subrack Power Supply

7.5 Electrical Power Consumption of Modules

Nominal supply voltage –48/–60 Vdc

positive grounded

Supply voltage range –40.5 Vdc to –75 Vdc

Each two circuit breakers/fuses (at PDP) for:

– OADM double-row subrack equipped with OLI modules

– all other subracks

20 A

15/16 A

Module Electrical power consumption

typical maximum

CAD2 3.6 W 5.3 W

EAM4 3.6 W 5.3 W

Fan Box 25 W 50 W

MCUB 15 W 25 W

MIBS 1 W 1 W

OD20 3.6 W 5.3 W

OM20 3.6 W 5.3 W

OLI Modules 65 W

(40 W for basic type OLI)

120 W

(75 W for basic type OLI)

OMDFI C/L 10.6 W 24 W

OMDI C/L 10.6 W 24 W

OMDF C/L 0.2 W 0.2 W

OPA 25 W 31 W

OSCTUI/OSCTUT 10 W 18 W

PUMPA 25 W 45 W

PUMPB 25 W 45 W

PUMPC 25 W 45 W

RPUMPC 85 W 110 W

RPUMPL 85 W 110 W

RPUMPUL 55 W 70 W

OCA, OCAS 21 W 26 W (C band)

35 W (L band)

OCS 16 W 18 W

SAB 0.5 W 0.5 W

SABM 1 W 1 W

SMU2 7 W 12 W

UDCM 0.2 W 0.2 W

Tab. 7.23 Electrical Power Consumption of Modules

A42022-L5936-C51-1-7618 157



7.6 Electrical Power Consumption of RacksFor details on the electrical power consumption of fully-populated racks, refer toFig. 4.11 to Fig. 4.13.

158 A42022-L5936-C51-1-7618


7.7 External Interfaces

Optical Line Interface

Connector LC/PC

Mean channel output power - 5 dBm .. +11 dBm

Mean channel input power - 26 dBm .. - 15 dBm

OSC output power range - 2.0 dBm .. - 5.0 dBm

OSC input power range - 15 dBm .. - 50.0 dBm

Optical Tributary Interface

Connector LC/PC

Input power adjustable between:

- 8 dBm (+/ - 4.5 dBm) to +2 dBm (+/ - 4.5 dBm)

Wavelength stabilization for 10 Gbit/s 2.5 GHz for 50 GHz channel spacing

10 GHz for 100 GHz channel spacing

Required extinction ratio 10 dB

Required receiver dynamic range - 14 dBm .. – 2dBm

T3 Clock Interface

Connector D-SUB 9

Compliant to G.703 (10.98)

Frequency 2048 kHz 4.6 ppm

Impedance 75 Ohms coaxial pair

120 Ohms symmetrical pair

Peak voltage 0.75 to 1.5 Vop at 75 Ohms

1.0 to 1.9 Vop at 120 Ohms

User Data Channels (sV.11)

Data channel similar to ITU-T V.11

Number of available bi-directional

channels

2

Connector 2 D-SUB 9 pin connectors

Bit rate 64 kbit/s

Input impedance 150 Ohms +/– 10% balanced

Max.imum load resístance 150 Ohms balanced

Output voltage (line a to b) 2 to 5 V (at Ri = 150 Ohms)

Input voltage (line a to b) 0.3 to 6 V

Used overhead bytes F0, NU1, NU2

Engineering Orderwire

Realization 4-wire interface and handset

Transmission range 300 to 3400 Hz

Dialing:

– method

– transmit level

– receive level

DTMF

– 14 to – 9 dBm0

– 30 to 0 dBm0

Tab. 7.24 External Interfaces

A42022-L5936-C51-1-7618 159



Modulation method PCM, A / µ-law

Bit rate 64 kbit/s

Input/output impedance

– handset

– 4-wire interface

600 / 150 Ohms balanced

600 / 600 Ohms balanced

Input level – 4/ – 10/ 0 dBr (settable via SW)

Output level – 4/ + 7/ – 12 dBr (settable via SW)

Connector Western plug (handset) and D-SUB 9 pin (4-wire interface)

Used overhead bytes E0, F0

Telemetry Interface (TIF)

Telemetry inputs (sensors)

Number of inputs available per sub-

rack

16

Input voltage range – 75 V to 0 Vdc (SELV) / central office battery supply (TNV-2)

Voltage range for active state – 3 V .. 0 V

Voltage range for inactive state – 75 V .. – 10 V

Input current (input connected to

ground)

1 to 3 mA

Telemetry outputs (actors)

Number of outputs available per sub-

rack

4

Output voltage range 0 V to +/– 75 Vdc (SELV) / central office battery supply (TNV-2)

Maximum current (active) 200 mA

Maximum impedance active state 16 Ohms

Maximum impedance inactive state 100 kOhms

Connector D-SUB 25

NEAP

User Interface 2 Major alarm LED’s (Communication and Equipment)

2 Minor alarm LED’s (Communication and Equipment)

1 Acknowledge LED

1 Acknowledge button

1 Lamp test button

4 Power on LED’s

1 EOW conference LED

Connector Handset connector

LCT Interface

Connector 1 10 BaseT connector (Q interface)

1 RS-232 9 pin D-SUB connector (F interface)

Tab. 7.24 External Interfaces (Cont.)

160 A42022-L5936-C51-1-7618


7.8 System Environmental Specifications

7.9 System Requirements for the Element ManagerThe computer onto which this software is installed must have the following attributes. Asalways, PCs operating at faster speeds are recommended for better performance.

Operating range:

– according to ETSI standard 300 019

class 3.1E –5˚ to +45˚ C (temperature of air flowing into the subracks)

– according to Bellcore GR 63 +5 to +40˚ C; short term: +5 to +50˚ C

– exceptions for the OCA/OCAS mod-

ules in the CCU network element

–5 to +48˚ C at an air flow of >1m/s

(–5 to +55˚ C for a maximum of 96 contiguous hours during a max-

imum of 15 days a year and at an air flow of >1m/s)

Storage range:

– according to ETSI standard 300 019

class 1.2 –25˚ to +55˚ C

– according to Bellcore GR 63 –40˚ to +70˚ C during a maximum of 72 hours

Humidity 5% to 90%

Altitude -100 m to 4000 m

Environmental standards ETS 300 019 and Bellcore GR63

EMC standards EN 300 386-2 - V1.1.3 (1997-12)

Safety standard EN 60950 (according to most actual and valid issue)

FCC Part 15, Subpart J, Class A

ESD per GR-1089

Tab. 7.25 System Environmental Specifications

CPU Pentium IV 1.8 GHz

Memory 1 GB

Hard Disk Drive 30 GB

Monitor Color monitor 21” recommended

LAN Ethernet card, 2x 3COM (3C982-TXM)

Operating System Windows® 2000

Tab. 7.26 EM System Requirements

A42022-L5936-C51-1-7618 161



8 Product OverviewAn overview of the main components used for SURPASS hiT 7550 2.05 is providedin the ITMN.

162 A42022-L5936-C51-1-7618


A42022-L5936-C51-1-7618 163



9 Abbreviations10BaseT Q3/Ethernet Interface

AC/DC Converter

ACO Alarm Cut-Off

ACSE Application Control Service Element

ALS Automatic Laser Shutdown

ANSI American National Standard

APR Automatic Power Reduction

APR Automatic power reduction

APS Application Program System

APSD Automatic Power Shutdown

ASCII American Standard Code for Information In-terchange

ASE Amplified Spontaneous Emission

ATM Asynchronous Transfer Mode

AUX Auxiliary Channel

BSD Berkely Software/Standard Distribution

Bw7R Narrow-Rack Style 7R

CAD2 Channel Add/Drop module 2 wavelengths

CAN Controller Area Network

CCU Channel Connection Unit

CDM Cross Domain Manager

CLK Clock

CLNP Connectionless Network Layer Protocol(G.784)

CMI Code Mark Inversion

CMIP Common Management Information Proto-col

CMISE Common Management Information ServiceElement

CMX Cross Multiplexer

COPA Connector Panel (rear or front access)

CORBA Common Object Request Brocker Architec-ture

CPS Card-Present-Sense

CPU Central Processing Unit

DCC Data Communication Channel

DCC-M Data Multiplex Channel-Multiplex Section

DCCMo Data Communication Channel Multiplex(OMS DCC)

DCCOo Data Communication Channel Optical (OTSDCC)

164 A42022-L5936-C51-1-7618


DCC-R Data Multiplex Channel-Regenerator Sec-tion

DCF Dispersion Compensating Fibre

DCM Dispersion Compensation Module

DCN Data Communication Network

DEMUX Demultiplexer

DSF Dispersion Shifted Fibre

DSP Digital Signal Processor

D-SUB Sub-Miniature Connector

DTMF Dual Tone Multi Frequency

DWDM Dense Wavelength Division Multiplex

EAM4 Equalizing Module

ECC Embedded Communication Channel

EDFA Erbium Doped Fiber Amplifier

EDI Electronic Data Interface

EEPROM Electrical Erasable Programmable Read-Only Memory

EFEC Enhanced Forward Error Correction

EM Element Manager

EMC Electromagnetic Compatibility

EML Element Management Layer

EN Enable European Standard

EOW Engineering Order Wire

ESD Electrostatic Discharge

ES-IS Enhanced Signaling and Interworking Sub-system

ETS European Telecommunication Standard

ETSI European Telecommunication StandardsInstitute

EXC Excessive Bit Error Ratio

Ext External Alarm

F Standardized Interface for Connection ofthe Operating Terminal

FAN Fiber Access Network

FCC Federal Communications Commission(USA)

FE Functional Unit

FEC Forward Error Correction

FEPROM Flash Erasable Programmable Read-OnlyMemory

FMX Flexible Multiplexer

FPGA Field Programmable Gate Array

GTC Gain Tilt Control

A42022-L5936-C51-1-7618 165



GTM Gain Tilt Monitor

GUI Graphical User Interface

HDLC High-Level Data Link Control/Procedure

HRL High Return Loss (Connector Type)

HU Height Unit

HW Hardware

I Inline amplifier

IP Internet Protocol

IS-IS Integrated system for fulfilling the infrastruc-ture requirements of fiber optics systems

ISO International Standards Organization

ITMN Installation and Test Manual

ITU International Telecommunication Union

ITU-T Telecommunication Standardization Sectorof ITU

LAPD Link Access Point Discriminator

LCC Local Card Controller

LCT Local Craft Terminal

LDAP Lightweight Directory Access Protocol

LEAF Large Effective Area Fiber

LED Light Emitting Diode

LF Loop Filter

LOF Loss Of Frame (G.783)

LOL Loss Of Light

LOS Loss Of Signal

MAC Media Access Control

MCF Message Communication Function

MCU Main Control Unit

MD Monitor Diode

MIBS Management Information Base (Small)

MPI-RM Multi-Point-Interface-Receiver Module

MPI-SM Multi-Point-Interface-Synchronous Multi-plexer

MTS Multiwavelength Transport System

MUX Multiplexer

MVM Multi-Vendor Management

NCT Network Craft Terminal

NE Network Element

NEALI Network Element Alarm Interface

NEAP Network Element Alarm Panel

NI Network Interface

NML Network Management Layer

166 A42022-L5936-C51-1-7618


NRZ Non Return to Zero

NSAP Network Service Access Point

NUBAT Battery Voltage (negative)

NZDSF Non Zero Dispersion Shifted Fibre

Och Optical channel

OCP Optical Channel Protection

OCR Optical Channel Repeater

OCR10G Optical Channel Repeater 10 Gbit/s

OCU Optical Channel Unit

OD Optical Demultiplexer

OD20 Optical Demultiplexer 20 channels

OGL Operator Guidelines

OLI Optical Line Interface

OM20 Optical Multiplexer 20 channels

OMD Optical Multiplexer/Demultiplexer

OMS Optical Multiplex Section

OSC Optical Supervisory Channel

OSCT Optical Supervisory Channel TerminationCard

OSI Open System Interconnection (G.784)

OSIAM Open System Interconnection Access Man-ager

OSIAM OSI Protocol Stack API Message

OSN Optical Service Node

OSNR Optical Signal/Noise Ratio

OSPF Open Shortest Path First

OSS Operational Support System (e. g. TNMS)

OTS Optical Transmission Section

PCB Peripheral Control Bus

PD Photo Diode

PDH Plesiochronous Digital Hierarchy (G.783)

PDP Power Distribution Panel

PHF Power High Failure

P-LD Photo-Laser Diode

PLF Power Low Failure

PLL Phase Locked Loop

Pout Output Power , , , , ,PPP Point-to-Point Protocol

pSOS provably Secure Operating System

PSU Power Supply Unit

PUBAT Battery Voltage (positive)

PWR Power

A42022-L5936-C51-1-7618 167



Q Interface to a Telecommunication Manage-ment Network

Q3 Q-Interface acc. to Info-Model

RAM Random-Access Memory

RDI Remote Defect Indicator

RDS Relative Dispersion Slope

RFC Request For Commands

RPUMP Raman PUMP

RS Regenerator Section

Rx Receive Data

RX Receiver

SAB Subrack Address Board

SABM Subrack Address Board Modificated

SC Supervisory Channel

SD Signal Degrade (G.782)

SDH Synchronous Digital Hierarchy

SDRAM Synchronous Dynamic Random AccessMemory

SEMF Synchronous Equipment ManagementFunction

SIPAC Siemens Packaging System

SL16 Synchronous Fiber-Optic System for STM-16 Signals

SL64 Synchronous Fiber-Optic System for STM-64 Signals

SLR Synchronous Line Regenerator

SLR16 Synchronous Line Regenerator STM-16

SLT Synchronous Line Terminal

SMA Synchronous Multiplexer Access

SMTP Simple Mail Transfer Protocol

SMU Supervisory Management Unit

SNMP Simple Network Management ProtocolCMIP

SONET Synchronous Optical Network (uses Ameri-can Standard)

SPI Serial Peripheral Interface

SPM Self Phase Modulation

SRA Synchronous Radio Access

SRAM Static RAM

SRS Stimulated Raman Scattering

SSM Synchronization Status Message

SSMF Standard Single Mode Fibre

STM-1 Synchronous Transport Module Level 1

168 A42022-L5936-C51-1-7618


SURPASS hiT 7540Optical Channel Unit (OCU)

SURPASS hiT 7550 2.05Long Haul /

SURPASS hiT 7550Long Haul /

SURPASS hiTSiemens Next Generation Network Solutionfor Optics

SURPASS Brandname for the Siemens Next Genera-tion carrier networking solutions

SW Software

SXA Siemens SDH Synchronous Cross Connect- VC-12

SXD Siemens SDH Synchronous Cross Connect- VC-4

t.b.d. to be defined

T0 System Clock

T2 Internal Clock Reference Signal

T3 Input for External Clock Reference Signal

TB Terminal Booster

TCP/IP Transmission Control Protocol/Internet Pro-tocol

TDM Terminal Digital Multiplexer

TED Technical Description

TempP Temperature Problem

TEX Ten Gigabit Multiplexer

TIF Telemetry Interface

TMF Telemanagement Forum

TMN Telecommunications Management Network

TMN-DCP Telecommunications Management Net-work-Data Communication Protocol

TMNS Transport Network Management System

TMNS-MVM TMNS-Multi-Vendor Management

TNMS CT TNMS Craft Terminal

TP Terminal Preamplifier

TP Termination Point

TP0 Transport class 0

Tx Transmit Data

TX Transmitter

UBAT Battery Voltage

UDCM Unidirectional Dispersion CompensationModule

UDP User Datagram Protocol

UHC Ultra-High Capacity

UL Underwrites Laboratory

A42022-L5936-C51-1-7618 169



ULED Feeding Bus for Card LEDs

ULH Ultra Long Haul

UNIX Trademark of UNIX System Laboratories In-corporated

VCDB Variable Configurable Data Block

VOA Variable Optical Attenuator

WDM Wavelength Division Multiplexing

WTTR Regenerative Transponder

XPM Cross Phase Modulation

170 A42022-L5936-C51-1-7618


A42022-L5936-C51-1-7618 171



10 IndexSymbols"C" (Conventional) band 53"even numbered" channels 57"L" (Long) band 53(APSD) threshold levels and behavior 67“Active” APS 132“Inactive” APS 132“Inactive” version 132“Unidirectional” 60’TNMS CT’ LCT/NCT software 136’TNMS CT’ Local Craft Terminal (LCT) 133

Numerics100 GHz spacing 58100BaseT 4610BaseT 4616 bi-directional add/drop channels 7416 wavelengths from the C Band 7316 wavelengths from the L Band 73160 channel DWDM signal 62, 632 Mbit/s Optical Supervisory Channel (OSC) 8620 optical wavelengths 1023 dB coupler 603 dB couplers 58, 963W3 1154 sub-bands 6248/60V 11150 GHz spacing 58

Aabbreviations used in the figures 96AC/DC station converter 111access to/from the application 43according to PPP 47accuracy of the clock 107ACO (Alarm Cut-Off) (blue) 126ACSE 43active modules 100Add Channel 29Add channel and drop channel “ageing control” 102add/drop 73add/drop WDM filters 102addition and termination of optical signals 71additional Ethernet interface 46Additional safety mechanisms 26adjustable tilt filter 29ageing control 100alarm and maintenance concept 136alarm information 136alarm panel PDP 126Alarms 129Alarms of the subrack 126

allowable customer input signal range 28amplification process 67ANSI 88, 116ANSI racks 111, 139ANSI subracks 115APS (Application Program System) software 132APSD bit 24ARP protocol for Ethernet 43Asymmetrical architectures 76asynchronous serial busses 83Asynchronous Transfer Mode (ATM) services 17attributes 160automatic and manual routing 38Automatic Laser Restart 24Automatic Laser Shutdown (ALS) 24Automatic Power Reduction (APR) 23Automatic Power Shutdown (APSD) 23, 67

Bbackbone networks 68basic OLI module design 67battery 48/60V 111bi-directional channel operation 73Bit Error Rate (BER) of 10-13 27Blue C band 57booster amplification 67booster amplifier output 34, 36broadband EDFAs 65Bw7R 83

CC (Conventional) 65C and L Band amplifiers 34, 36C and L Band EDFAs 66C Band 53C Band and L Band EDFAs 69C/L Band separation filter 62CAD2 73, 102CAD2 block diagram 103CAN Bus 83CAN bus repeater/amplifier 86card detection 85Card Inventory Management information 85Card present information 96carrier OSNR 37carrier power 37cascaded 76CD 133central monitoring 83change in traffic topology 73Channel Add/Drop (CAD2) module 102channel distribution 29

172 A42022-L5936-C51-1-7618


channel powers 29channel spacing 58chromatic dispersion 106chromatic dispersion coefficients 68Class 1 levels 23Cleared Alarms 131Client signal ageing 29client signals 62client’s receiver 102CLNP 43clock signal (T3) 107clock synchronization 86CMIP agent 43CMISE/CMIP (ITU X.710/X.711) 42commissioning 135commissioning and maintenance operations 42communication interfaces 44communication network 47communication stack profiles supported 44communication stacks 43Compact Disk 133compatibility to existing OSI networks 46compensate for tilts 29complementary documentation 11configuration and performance parameters 43Configuration Management 108connector panel COPA 115constant pump current control 29control element 110control functions 83COPA 86, 107COPA front side 135CORBA based 39CORBA Interface 39craft terminal 135Cross Phase Modulation (XPM) 106Current Alarm List 129currently unequipped sub-band 73customer documentation 11

DData Communication Channel 21data link (layer 2) protocol 46Date and time stamps 131DC power distribution 111DCC interfaces 43DCF spectral attenuation 29DCF SRS tilt 29DCM management 106DCM shelves 120Debug port 127demultiplexing 64dielectric multiplexer/demultiplexer filters 62Dispersion Compensating Fibre (DCF) 106Dispersion Shifted Fibre 67

double-row 111, 116Drop Channel 29DSF 106DWDM link performance 28DWDM signal parameters 33DWDM solutions on 10 Gbit/s transmission

systems 65DWDM system 27dynamic routing 43

EEAM4x 103ECC communication interfaces 83EDFA 27EEPROMs 88effect of ageing client transmitters 28electrical and optical cabling 139electrical interfaces 86electrical power consumption 157element layer management 38Element Manager (EM) 40, 108Element Manager (EM) user interface 135Element Manager software 133EM 109EM application program 41EM Screen Tree 109EM session 131EM user interface 135, 136End of Life (EOL) 27end system 43end terminal equipment 24energy scattering effect 69EOL capacity 76EOW 88EOW 4-wire interfaces 86Equipment Management 108Erbium Doped Fibre Amplifier (EDFA) technology 65ES-IS 43Ethernet and DCC interfaces 43Ethernet interface 46ETS 300386-1 111EN 55022 111ETS 300 132-2 111ETSI 88, 116ETSI rack 139express 73external clock 107external OLI pumps 29extra APSD mechanisms 26extra pump modules 68extreme bottom right slot 85

FFAN alarms 88

A42022-L5936-C51-1-7618 173



FAN control and supervision 86FAN units 88Fault LED 127Fault Management 108fibre attenuations 68fibre break 23fibre spectral attenuation 29fibre types 68F-interface 46first booster amplifier 24first EDFA stage 68first sub-band output 62flat output spectrum 29Forward Error Correction (FEC) 27frequency interleavers 62front panel on OM/OD, OLI, PUMP and RPUMP

modules 127fully-populated racks 157functionality 53

GGain Tilt Monitor (GTM) 29gateway functionality 47

Hhigher frequency (lower wavelength) 69History Alarm List 131history log 131http 43hub/switch 46

Iindication LEDs 126individual wavelengths 57inelastic collisions 69information addressed 47information model 42information models (interface dialects) 44infrastructure 66initial commissioning 135inline amplification 67input noise filter 111insertion/extraction aids 127integration time (15 min.) 100inter-card communications 83interference 58interferometer technology 58interleaver 57, 62interleavers 58intermediate optical amplifier sites 71Internet Protocol (IP) services 17inter-subrack data communications 85inter-symbol interference 106inventory management 86

IP (address, routing tables) 43IP based applications (TL1, Web Terminal) 47IP packages on Ethernet 47IP packets 47IP to NSAP address mapping 43IS-IS 43ITU terminology 43ITU-T G.692 wavelength grid 60ITU-T Recommendation. G.653 67

LL (Long) Band 65L Band 53L Band (1570 to 1607nm) 66lamp test 126LAPD (in unacknowledged mode) 47large span loss range 94Laser Class 3B 23latching mechanism 127layers 2 (DCC, MAC) 43LCT 133, 135LCT interface 135LCT Network Management software 133LED control 86LEDs 86list of OSCTU functions 88live traffic 34local card controller 86Local Card Controller (LCC) 83local commissioning 40local or remote control and monitoring 135logical broadcast network topology 46loss of input signal (LOS) 24Loss of Light (LOL) count 37loss of the OSC 24low dispersion 58low loss 58low noise 68low power 68lower frequency (higher wavelength) 69lowest cost per channel 62

MMach-Zehnder 58Main Control Unit (MCU) 83main DWDM traffic signal 91main subrack 86main traffic signal 24Maintenance measures 136maintenance operations 40major communication alarm (red) 126major equipment alarm (red) 126Management Communication Function (MCF) 83Marben 43

174 A42022-L5936-C51-1-7618


master system clock (T0) 107MCU 132MCU module 135MCU’s clock 107measured carrier frequency (GHz) 37mechanical equipment layout 111menu-driven 135message communication function (MCF) 43MIBS 83mid-stage access points 67minor communication alarm (yellow) 126minor equipment alarm (yellow) 126mode of operation (inactive, OSI only, IP only, OSI

and IP combined) 47module 127Modules 121monitor diodes 100multiple Q3 managers 46multiplexing architecture 63, 64

NNCT 133NCT Network Management software 133NCT PC 42NE Alarm Panel 126NE Alarm Panel (NEAP) 85NE alarms LED control (minor/major equipment

alarms) 88NEALI 83NEAP 86, 126NEAP front side 126Network Control Terminal (NCT) 42Network Craft Terminal (NCT) 133Network Element Alarm Panel (NEAP) 46network layer 38network management capabilities 110Network Management System (NMS) 42network planning 73new APS 132noise filters 111nominal voltage 111non-linear effects 68non-linear fibre effect 29non-traffic interrupting 73non-traffic interrupting upgrade 66NZDSF(-) 106

OOADM double row subrack 111OADMU add/drop interfaces 29OADMU NEs 102OAM&P 108OD20 58ODA20 100

OK LED 127OLI 91OLI card 92OLI interstage APSD 26OLI interstage device surveillance 26OLI module 92OLI module basic block diagram 92OLI modules 91, 111OLI preamplifier pump lasers 100OLI pump cards (PUMPA, PUMPB, PUMPC) 121OLI pump currents 29OLI PUMP modules 94OLIIC module 67OLITBUL 67OLR 126OLR NE 67OM20 58OM20/OD20 100OMD 96OMD2IC 96OMD2IL 96OMDFC 96OMDFIC 96OMDFIL 96OMDFL 96on board OLI pumps 29on-board EEPROM 94, 100OPA 37, 65OPA card 121Optical Add/Drop Multiplexer (OADM) 18, 71Optical Add/Drop Multiplexer site (OADMU) 36Optical Add/Drop Multiplexer Unidirectional

(OADMU) 60optical amplifier modules (OLI) 64Optical inLine Repeater (OLR) 18, 65Optical inLine Repeater Unidirectional (OLRU) 60Optical Laser Safety 100Optical Line Interface (OLI) module 21Optical Line Interface (OLI) modules 91optical link budget 67optical link control 83Optical Multiplexer/Demultiplexer (OMD) modules 96Optical Multiplexer/Optical Demultiplexer

(OM20/OD20) modules 100optical parameters 33optical path 60optical path through the OADM 71Optical Performance Analyzer 33Optical Performance Analyzer (OPA) 34optical power monitoring 100Optical Signal to Noise Ratio (OSNR) 27optical spectrum analyzer 29Optical Spectrum Analyzer (OSA) 34Optical Supervisory Channel 20optical supervisory channel 21

A42022-L5936-C51-1-7618 175



Optical Supervisory Channel Termination (OSCT)module 86

Optical Supervisory Channel Termination Card Unidi-rectional (OSCTU) 21

optical system performance and control 33Optical Terminal OTT 40optical transmission 60optical transmission distances 65Optical Transport Terminal (OTT) 18, 60optical/electrical cable 95optimum gain flatness 27optimum gain point 27Option Settings dialog box 131OSC 86OSC byte 86OSC clock 24OSC signal power 24OSCT 86OSCT block diagram 86OSCT module 107, 115OSCTU 85, 86, 96OSI layer 3 protocol (CLNP, ES-IS and IS-IS) and IP

packets 46OSI layer 3 protocols (CLNP, ES-IS and IS-IS) 47OSI or IP packages 47OSI packages to 7 layer OSI DCC 47OSI packages via ES-IS 47OSI part 43OSI Q3-CMISE 42OSI stack by means of RFC1006 43OSI/ISO upper layers 43OSIAM stack 43OSPF 43OSPF (basic parameter set) 43OSPF from Ethernet to DCC 47OSPF protocol 47OSS 42OTT 60, 126OTT of a C+L Band system 67overall network performance 67

Ppath length difference 58PCB (Peripheral Control Bus) 83PCB/CAN bus 126PC-based Local Craft Terminal (LCT) 46PDP 111, 126Peltier controlling elements 95Performance Management 108physical interface 44planar shelf 111plug-in cards 58polarization-dependent effects 58possible equipping options 121power connectors 115

power distribution 126power line input 111power lines 111Power Low Failure (PLF) 100, 102Power On (4x green) 126power outputs 23power supply 111, 115PPP 46preamplification 67preamplifier output 34, 36Presentation 43Pre-Tilt compensation filter 68protection earth 111pull-down menus 109PUMP 95pump modules 68PUMPA 95PumpB 69PumpC 69

QQ3 information model 42Q3 information model of the TCP/IP stack

parameters 43Q3-CMIP 42Q3-CMIP management 47Q3-CMISE interface 110

RRack 111rack alarms 126rack dimensions 116rack power distribution panel PDP 111rack with double row subracks 111rack with single row subracks 111Raman amplification 27, 69Raman crosstalk 106Raman PUMP (RPUMP) modules 96Raman pump currents 29Raman pump output power 23Raman pump wavelength 69Raman pumps 29, 121Raman Tilt 68real time operating system 43real-time clock 107Red C band 57Red/Blue band separation filters 62Red/Blue C Band 62relevant standards 111remote commissioning or maintenance operations 40remote control 136remote end of the DCC line 47remote NEs 47remotely configurable add/drop channels 73

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remotely configured as an “add/drop” 73replaceable units 85required EDFA output power 27required total EOL capacity 76requirements for the element manager 108respective bias current of each laser 29reverse direction 63RFC1006 47rotary switch 126route packages 47router detection 43Routing 43, 47routing protocols 43Routing two protocols 47RPUMP 96RS-232/V.24 interface 46

SSAB 83, 85, 126SABM 86, 126SDH/SONET performance monitoring 34second EDFA stage 68Security Management 108SELVSafety Extra Low Voltage 159SEMF function 83separation filters 62Serial Peripheral Interface (SPI) Bus 85service and application protocol 42service layer 38service provisioning and monitoring 38Session 43shelf and rack alarm outputs 83Shutdown functionality 23Siemens ’TNMS CT’ 133Siemens 10 Gbit/s SDH line systems 17Siemens Management Solution 38signal performance 27signaling data 115simple point to point RS-232/V.24 interface 46single-row 111, 116site OTT/OLR/OADM 23SMU2 85, 88, 96SMU2 block diagram 88SNMP specifications 43software 160software commands 135software image 132span losses 27spectral control 68SPI (Synchronous Peripheral Interface) 88SPI bus connection 86SPM (Self Phase Modulation) 106SPM optimization 106SRS 69SSMF 106

stable technology 62stack profiles 44Standalone L Band DWDM system 67Standalone L Band system (RPUMPL) 70standard multi-vendor NML/EML management

interface 39standards 111static route configuration 43Stimulated Raman Scattering (SRS) 29, 69sub-bands 57subrack 111, 127Subrack Address (SAB) Module 85Subrack Address Board (SAB) 126subrack address information 85subrack address setting 126subrack addresses 126subrack alarms 126subrack front cover 126Subrack Management Unit (SMU2) 88subrack types 116subracks 111supervision unit MCU 126Supervisory Channel 107support several network servers 38supported stack profiles 44SURPASS hiT 7550 2.05 17SURPASS hiT 7550 functionality 53SURPASS hiT 7550 modules 80SURPASS hiT 7550 NE types 60SURPASS hiT 7550 technical parameters 137symmetrical add/drop 76system environment of OLI modules 91

TT3in clock input 86T3LOS alarm 107TCP (connection table) 43TCP/IP part 43TCP/IP stack 47TCP/IP stack for the NE 43Telecommunication Management System (OSS) 42Telemanagement Forum (TMF) 39telnet 43temperature sensors 95Terminal Booster (TB) 67Terminal Preamplifier (TP) 67thin-film filter devices 57third and final EDFA stage 68three different Raman pump modules 69three-stage optical amplifier 67TIF alarm contacts 86tilt effect 29tilt filter 29tiltl 29time-critical operations 83

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TMN-DCP OSI Stacks 133TNMS (Transport Network Management System) 38TNMS-CDM (Cross Domain Manager) 38TNMS-Core 38TNMS-Core/CDM support 38TNMS-Multi-Vendor Management Platform 39total amplifier gain 27total capacity 66total DWDM link performance 28total EDFA output power 27total input power 27total number of optical spans 70total output power 27transmission directions 66transport class 0 (TP0) services 43transport class 4 (TP4) services 43transport protocol 47transported and routed in the DCC 46two protocols 47two sub-band outputs 62

UUBAT1 115UBAT2 115UBAT3 115UBAT4 115UDCM tray 106UDCMs 88, 106UDCMs within the rack 120Unidirectional Dispersion Compensation Modules

(UDCMs) 106upgrade from an 80 Channel C Band 66Upgrade L Band EDFA 66upgrade path 17upgrade strategy 66upper OSI layers 43upper-layers of Network Element 47used stack profile 47User name 108

VV.11 86V.24 interface 46Variable Optical Attenuator (VOA) 27, 68variants of the OLI module 67varied span lengths 68visible and audible alarms 126VOA 100, 102Voltage range 111

Wwavelengths 53WDM multiplexer 95Windows NT platforms 133

Windows PC 42

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