7th ACFA, H.J.Kim

Intermediate TrackerIntermediate Tracker

H. J. Kim, KNUH. J. Kim, KNU

2004/11/09 72004/11/09 7thth ACFA workshop ACFA workshop

1.1. IntroductionIntroduction2.2. Intermediate trackers/FTD for LCIntermediate trackers/FTD for LC3.3. Simulation study Simulation study 4.4. Outside Si-tracker optionOutside Si-tracker option5.5. Silicon strip R&D for the intermediate tracker Silicon strip R&D for the intermediate tracker 6.6. SummarySummary

7th ACFA, H.J.Kim

▣ Why VTX and tracking important?Why VTX and tracking important?

• recoil mass reconstruction - importance of tracking resolution

q qbar ( b bbar -> Vertex! )

7th ACFA, H.J.Kim

General view ofGeneral view of Three detector option Three detector option

GLD(Huge)

7th ACFA, H.J.Kim

*To improve1) the linking efficiency of a main track to the corresponding VTX hits,2) the reconstruction efficiency of low-momentum tracks and of particles which decay between the VTX and the Main tracking system3) the momentum resolution of tracks.

* * If the beam background is very severe, you If the beam background is very severe, you can turn off the HV of inner layers of TPC can turn off the HV of inner layers of TPC without serious performance losswithout serious performance loss

*Trigger and/or Time stamping capability

*Standalone tracking

Purpose of Intermediate Tracker

7th ACFA, H.J.Kim

7th ACFA, H.J.Kim

Silicon Tracking for SiD (Jaros’s talk)Silicon Tracking for SiD (Jaros’s talk)

Why silicon microstrips? SiD starting point Why silicon microstrips? SiD starting point Robust against beam haloRobust against beam halo showers showers

Thin, even for forward tracks.Thin, even for forward tracks. Won’t degrade ECAL Won’t degrade ECAL

Stable alignment and calibration.Stable alignment and calibration. No wandering T to D. No wandering T to D.

Excellent momentum resolution (Excellent momentum resolution (p/pp/p22~2 x 10~2 x 10-5-5))

7th ACFA, H.J.Kim

TESLA TESLA tracking systemtracking system

from TESLA TDR

cos()=.995

Magnetic field: 4 Tesla

7th ACFA, H.J.Kim

From Behnke’s talkFrom Behnke’s talk

7th ACFA, H.J.Kim

From Behnke’s talkFrom Behnke’s talk

7th ACFA, H.J.Kim

Typical “Typical “Large/Large/Huge” models under considerationHuge” models under consideration

SiVTX pixel(cold version)

HCAL(Pb(Fe)/scinti or digital)

W/Scinti ECAL

TPC(Jet chamber as option)

Si intermedi.-Trk

SC-coil

SiVTX pixel

Pb/scinti HCAL

Pb/Scinti ECAL

Jet chamber

Si intermedi.-Trk

SC-coil

“GLC” design (ACFA) “Large/Huge”

7th ACFA, H.J.Kim

• stand-alone tracking capability

▣ Intermediate Tracker Configuration

• 5 layers at r = 9 to 37 cm• angular coverage |cosΘ|<0.9• spatial resolution σ = 10 μm• thickness of a layer: 0.6% Xo

Huge detector concept:TPC: Rmin = 40 cm

Do not expect much changes in IT

7th ACFA, H.J.Kim

Intermediate Tracker DesignIntermediate Tracker Designfor GLCfor GLC - Double-sided silicon microstrip detectors- Double-sided silicon microstrip detectors i. excellent spatial resolution i. excellent spatial resolution ii. well-established technology ii. well-established technology

Layout of the IT surrounding the VTX.Layout of the IT surrounding the VTX.

- The distance between the last layer of VTX and the first layer of Trackeris - The distance between the last layer of VTX and the first layer of Trackeris about 39cm in Large detector design.about 39cm in Large detector design.

i. 5 layers of coaxial cylinders at 9, 16, 23, 30 and 37cmi. 5 layers of coaxial cylinders at 9, 16, 23, 30 and 37cmii. covers | |<0.90 coinciding with the region covered by VTXii. covers | |<0.90 coinciding with the region covered by VTXcos

7th ACFA, H.J.Kim

r = 10, 20, 30, 40 w/ std. design parameters

Momentum Resolution /Pt Pt .vs Pt( )

7th ACFA, H.J.Kim

Linking Efficiency

Linking efficiency is able to be measured by “Residual” which is defined as a precision from the difference of distance between the position of extrapolate track of main tracking & the hit position on IT or VTX layers

( )ext hitdrphi r

ext hitdz z z CDC

IT5

Figure. The definition of Residuals.

7th ACFA, H.J.Kim

Residuals for a single pion

Residuals vs. generation energy for a single pion

For a single pion, a linking efficiency with IT+VTX is improved by ~20 % compared to that with VTX only.

7th ACFA, H.J.Kim

Why Si Tracker ?Why Si Tracker ? (Sugimoto’s tal (Sugimoto’s talk)k)

• 5x105x10-5-5 does not satisfy the design does not satisfy the design criteria if the beam energy spread is criteria if the beam energy spread is 0.1%0.1%

• The performance goal should be 2x10The performance goal should be 2x10-5-5

• How? How?

Outside Outside Si Tracker for a Si Tracker for a HugeHuge Detector ???Detector ???

7th ACFA, H.J.Kim

The Detector ModelThe Detector Model

• Si Vertex DetectorSi Vertex Detector– 5 layers, t=705 layers, t=70m, m, =3=3mm– coscos< 1 (non-realistic)< 1 (non-realistic)

• Si Inner TrackerSi Inner Tracker– 3 layers (12, 24, 36 cm), t=3003 layers (12, 24, 36 cm), t=300m, m, =7=7mm– coscos <1 (non-realistic) <1 (non-realistic)

• TPCTPC– 40cm < R < 200cm, Z<235cm40cm < R < 200cm, Z<235cm– Ar gas, 220 samples, Ar gas, 220 samples, =150=150mm

• Si Outer TrackerSi Outer Tracker– R=205cm(barrel)/Z=250cm(EC), R=205cm(barrel)/Z=250cm(EC), =7=7mm

• Momentum resolution is calculated following Momentum resolution is calculated following Gluckstern’s methodGluckstern’s method– No sophisticated method such as Kalman filter is usedNo sophisticated method such as Kalman filter is used

7th ACFA, H.J.Kim

PerformancePerformance

Pt (GeV/c)

Pt/Pt2

7th ACFA, H.J.Kim

PerformancePerformance

cos

P/P2 (M.S. not included)

FTD?

7th ACFA, H.J.Kim

▣ Silicon sensor R&D Silicon sensor R&D <- Details by B.G.Cheon<- Details by B.G.Cheon

Metal 1 and metal 2 contact (VIA) Metal 1 and metal 2 contact (VIA)

n+ ohmic n+ ohmic sideside

p+ p+ junction junction

sideside

11stst metal metal

22ndnd metal readout line metal readout line

• double sided silicon strip• tree metal process- implant strips in ohmic side are orthogonal to those in junction side-readout strips in junction side have the same direction as that of ohmic side

Front Side: - brown: implanted n+ - blue: p-stop - sky blue: SiO2 - gray: Al for readout

Back Side: - blue: implanted p+ - first gray: 1st metal - sky blue: SiO2 - vertical gray: VIA - second gray: 2nd metal

7th ACFA, H.J.Kim

512ch 100um pitch sensor Without hour glass

512ch 100um pitch sensorWith hour glass

1cm PIN Diode

For SDD R&D

PIN Diode array

16ch 100um pitch sensor

16ch 100um pitch SSD

32ch 100um pitch sensor

64ch 100um pitch sensor

▣ MASK Design : P SideMASK Design : P Side

7th ACFA, H.J.Kim

▣ Silicon Sensor

n+ implantedp-stop in atoll

via in hourglassreadout pad in staggering

guard ring

p+ implanted readout strip

N side P side

7th ACFA, H.J.Kim

▣ Measurements

7th ACFA, H.J.Kim

0 20 40 60 80 100 120

1E-8

1E-7

1E-6

Leak

age

curr

ent (

A)

Reverse bias voltage(V)

LOT4_1_T1 LOT4_4_T1 LOT4_4_T3

These aredisappearedafter insulatingwafer edges

▣ Measurements of the sensor

7th ACFA, H.J.Kim

▣ Sensor Readout

FADC

Control Signal

DSSD

RC chip

VA-TA

FPGA

USB2DAQ

7th ACFA, H.J.Kim

USB2 with 25Mhz 12bit FADC for Readout USB2 with 25Mhz 12bit FADC for Readout R&DR&D

FX2 FADCCPLD

Flash RAMSRAM

31 FPGA I/O for R&D

trigger

input

7th ACFA, H.J.Kim

Radiation hardness beamtest with protonRadiation hardness beamtest with proton

•Radiation damage problem -> Signal reduction -> Noise increase -> Depletion voltage increase -> Sensor damage

• Radiation damage Measurement -> 30-50MeV Cyclotron proton, neutron beam irradiation (Korean cancer center hospital, Seoul, Korea) -> Leakage current measurement -> Capacitance measurement -> Signal measurement

• Processing improvement -> Radiation damage characteristics study -> Radiation hardness improvement

7th ACFA, H.J.Kim

IIntermediatentermediate TTracker R&D Activities in racker R&D Activities in KoreaKorea

√ linking and reconstruction efficiency (Fast Simulation) √ track momentum resolution (Full Simulation) √ DSSD simulation/design/fabrication Electronics(RC chip, VA1TA, FADC), DAQ √ S/N ratio measurement and beam test

- Kyungpook National University - Korea University - Seoul National University - Chunnam National University - Sungkyunkwan University

Sensor designProcess chart

KNU / SNU

Simulation(process and device)

KNU/SKKU

DAQ/Electronics/Test

KNU/KU/CNU

Sensor

7th ACFA, H.J.Kim

SummarySummary

• Intermediate Tracker is necessary to improve momentum rIntermediate Tracker is necessary to improve momentum resolution and track linking efficiencyesolution and track linking efficiency

• TPC+Si Tracker System in GLD including SOT TPC+Si Tracker System in GLD including SOT will satisfy the original design criteria even will satisfy the original design criteria even for for Eb=0.1% in wide angular range (|cosEb=0.1% in wide angular range (|cos||<0.9). <0.9).

• Double (single) side silicon strip sensor R&D is ongoing in Double (single) side silicon strip sensor R&D is ongoing in KoreaKorea

7th ACFA, H.J.Kim

Study issueStudy issue

• Intermediate tracker geometry optimization Intermediate tracker geometry optimization

• FTD geometry optimizationFTD geometry optimization • Double side vs Single side strip senorDouble side vs Single side strip senor

• Intermediate tracker trigger?Intermediate tracker trigger?

• Time stamping (Separation of bunches)Time stamping (Separation of bunches)

• Radiation hardness Radiation hardness

• Mechanical structureMechanical structure

7th ACFA, H.J.Kim

Backup slide

7th ACFA, H.J.Kim

▣ Cleaning Room

7th ACFA, H.J.Kim

512ch 50um pitch sensor

1cm PIN Diode

For SDD R&D

64ch 50um pitch sensor

32ch 50um pitch sensor

16ch 50um pitch sensor

Backside of SSD

PIN Diode array

▣ MASK Design : N MASK Design : N SideSide

7th ACFA, H.J.Kim

Radiation damage by n, p and Radiation damage by n, p and ee

7th ACFA, H.J.Kim

• Require good σrΦ and σz

• Reasonable (moderate) cost

TypeType σσrrΦΦ σσzz

MSGCMSGC

+GEM+GEM

3030μμ 3030μμmm Fast SignalFast Signal

SSDSSD 10 10 μμmm 20 20 μμmm

Straw ChamberStraw Chamber 50 50 μμmm 1mm1mm

Fiber TrackerFiber Tracker 50 50 μμmm 1mm1mm Fast SignalFast Signal

Inner DCInner DC 80 80 μμmm 1mm1mm

▣ Intermediate Tracker Option

7th ACFA, H.J.Kim

Pt/PtPt/Pt2 2 : Measurement Term: Measurement Term

SiDSiD GLDGLD((SiSi=7=7m)m)

GLDGLD((SiSi=10=10m)m)

TESLATESLA((SiSi=10=10m)m)

TESLATESLA((SiSi=7=7m)m)

TPCTPC 1.2x101.2x10-4-4 1.2x101.2x10-4-4 1.5x101.5x10-4-4 1.5x101.5x10-4-4

VTX+TPCVTX+TPC 4.6x104.6x10-5-5 4.6x104.6x10-5-5 5.2x105.2x10-5-5 5.2x105.2x10-5-5

VTX+SIT+TPCVTX+SIT+TPC 2.9x102.9x10-5-5 3.4x103.4x10-5-5 4.1x104.1x10-5-5 3.5x103.5x10-5-5

VTX+SIT+TPC+SVTX+SIT+TPC+SOTOT

1.9x101.9x10-5-5 2.3x102.3x10-5-5 2.6x102.6x10-5-5 2.2x102.2x10-5-5

VTX+SIT+SOTVTX+SIT+SOT 2.1x102.1x10-5-5 2.4x102.4x10-5-5 3.2x103.2x10-5-5 3.7x103.7x10-5-5 2.8x102.8x10-5-5

VTX=3m in all cases