48-pin ATmega809/1609/3209/4809 – The...

82
ATmega809/1609/3209/4809 – 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The ATmega809/1609/3209/4809 microcontrollers of the megaAVR ® 0-series are using the AVR ® processor with hardware multiplier, running at up to 20 MHz, with a wide range of Flash sizes up to 48 KB, up to 6 KB of SRAM, and 256 bytes of EEPROM in 28-, 32-, 40-, or 48-pin package. The series uses the latest technologies from Microchip with a flexible and low-power architecture including Event System and SleepWalking, accurate analog features and advanced peripherals. The devices described here offer Flash sizes from 8 KB to 48 KB in a 48-pin package. Features AVR ® CPU Single-cycle I/O access Two-level interrupt controller Two-cycle hardware multiplier Memories Up to 48 KB In-system self-programmable Flash memory 256B EEPROM Up to 6 KB SRAM Write/Erase endurance: Flash 10,000 cycles EEPROM 100,000 cycles Data retention: 40 Years at 55°C System Power-on Reset (POR) circuit Brown-out Detector (BOD) Clock options: 16/20 MHz low-power internal oscillator 32.768 kHz Ultra Low-Power (ULP) internal oscillator 32.768 kHz external crystal oscillator External clock input Single pin Unified Program Debug Interface (UPDI) Three sleep modes: Idle with all peripherals running for immediate wake-up Standby Configurable operation of selected peripherals © 2019 Microchip Technology Inc. Preliminary Datasheet DS40002016B-page 1

Transcript of 48-pin ATmega809/1609/3209/4809 – The...

Page 1: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

ATmega809160932094809 ndash48-pin

48-pin Data Sheet ndash megaAVRreg 0-series

Introduction

The ATmega809160932094809 microcontrollers of the megaAVRreg 0-series are using the AVRreg

processor with hardware multiplier running at up to 20 MHz with a wide range of Flash sizes up to 48KB up to 6 KB of SRAM and 256 bytes of EEPROM in 28- 32- 40- or 48-pin package The series usesthe latest technologies from Microchip with a flexible and low-power architecture including Event Systemand SleepWalking accurate analog features and advanced peripherals

The devices described here offer Flash sizes from 8 KB to 48 KB in a 48-pin package

Features

bull AVRreg CPUndash Single-cycle IO accessndash Two-level interrupt controllerndash Two-cycle hardware multiplier

bull Memoriesndash Up to 48 KB In-system self-programmable Flash memoryndash 256B EEPROMndash Up to 6 KB SRAMndash WriteErase endurance

bull Flash 10000 cyclesbull EEPROM 100000 cycles

ndash Data retention 40 Years at 55degCbull System

ndash Power-on Reset (POR) circuitndash Brown-out Detector (BOD)ndash Clock options

bull 1620 MHz low-power internal oscillatorbull 32768 kHz Ultra Low-Power (ULP) internal oscillatorbull 32768 kHz external crystal oscillatorbull External clock input

ndash Single pin Unified Program Debug Interface (UPDI)ndash Three sleep modes

bull Idle with all peripherals running for immediate wake-upbull Standby

ndash Configurable operation of selected peripherals

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 1

ndash SleepWalking peripheralsbull Power-Down with limited wake-up functionality

bull Peripheralsndash One 16-bit TimerCounter type A (TCA) with a dedicated period register and three compare

channelsndash Four 16-bit TimerCounter type B with input capture (TCB)ndash One 16-bit Real-Time Counter (RTC) running from an external crystal or an internal RC oscillatorndash Four USART with fractional baud rate generator auto-baud and start-of-frame detectionndash Masterslave Serial Peripheral Interface (SPI)ndash Dual mode MasterSlave TWI with dual address match

bull Standard mode (Sm 100 kHz)bull Fast mode (Fm 400 kHz)bull Fast mode plus (Fm+ 1 MHz)

ndash Event System for CPU independent and predictable inter-peripheral signalingndash Configurable Custom Logic (CCL) with up to four programmable Look-up Tables (LUT)ndash One Analog Comparator (AC) with a scalable reference inputndash One 10-bit 150 ksps Analog to Digital Converter (ADC)ndash Five selectable internal voltage references 055V 11V 15V 25V and 43Vndash CRC code memory scan hardware

bull Optional automatic scan before code execution is allowedndash Watchdog Timer (WDT) with Window mode with separate on-chip oscillatorndash External interrupt on all general purpose pins

bull IO and Packagesndash 41 programmable IO linesndash 48-pin UQFN 6x6 and TQFP 7x7

bull Temperature Range -40degC to 125degCbull Speed Grades -40degC to 105degC

ndash 0-5 MHz 18V ndash 55Vndash 0-10 MHz 27V ndash 55Vndash 0-20 MHz 45V ndash 55V

bull Speed Grades -40degC to 125degCndash 0-8 MHz 27V - 55Vndash 0-16 MHz 45V - 55V

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 2

Table of Contents

Introduction1

Features 1

1 Block Diagram 5

2 Pinout 621 48-pin UQFNTQFP6

3 IO Multiplexing and Considerations731 Multiplexed Signals 7

4 Electrical Characteristics 941 Disclaimer942 Absolute Maximum Ratings 943 General Operating Ratings 944 Power Considerations 1145 Power Consumption 1146 Peripherals Power Consumption1347 BOD and POR Characteristics1448 External Reset Characteristics1549 Oscillators and Clocks15410 IO Pin Characteristics17411 USART 19412 SPI20413 TWI21414 VREF23415 ADC25416 AC 28417 UPDI Timing 29418 Programming Time30

5 Typical Characteristics3151 Power Consumption3152 GPIO 3953 VREF Characteristics4654 BOD Characteristics4855 ADC Characteristics5156 AC Characteristics6157 OSC20M Characteristics6358 OSCULP32K Characteristics 65

6 Ordering Information67

7 Online Package Drawings 68

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 3

8 Package Drawings6981 48-Pin TQFP 6982 48-Pin UQFN73

9 Conventions7791 Memory Size and Type7792 Frequency and Time77

10 Data Sheet Revision History78101 RevB - 03201978102 Rev A - 02201878

The Microchip Web Site 79

Customer Change Notification Service79

Customer Support 79

Product Identification System80

Microchip Devices Code Protection Feature 80

Legal Notice80

Trademarks 81

Quality Management System Certified by DNV81

Worldwide Sales and Service82

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 4

1 Block Diagram

INOUT

DATABUS

Clock Generation

BUS Matrix

CPU

USARTn

SPIn

TWIn

CCL

ACn

ADCn

TCAn

TCBn

WOn

RXDTXDXCK

XDIR

MISOMOSISCK

SS

SDA (master)SCL (master)

PORTS

EVSYS

SystemManagement

SLPCTRL

RSTCTRL

CLKCTRL

EVENT

ROUTING

NETWORK

DATABUS

UPDICRC

SRAM

NVMCTRL

Flash

EEPROM

OSC20M

OSC32K

XOSC32K

References

BODVLM

POR

Bandgap

WDT

RTC

CPUINT

M M

S

MS

S

OCD

UPDI

RST

TOSC2

TOSC1

S

EXTCLK

LUTn-OUT

WO

CLKOUT

PAnPBnPCnPDnPEnPFn

RESET

SDA (slave)SCL (slave)

GPIOR

AINPnAINNn

OUT

AINn

EVOUTx

VREFA

LUTn-INn

Detectors

ATmega809160932094809 ndash 48-pinBlock Diagram

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 5

2 Pinout

21 48-pin UQFNTQFP

1

2

3

4

44 43 42 41 40 39 385

6

7

8

9

10

11

33

32

31

30

29

28

27

26

25

2423

37

36

35

34

12

13 14 15 16 17 18 19 20 21 22

45464748

GN

D

VD

DPA5

PA6

PA7

PC0

PC1

PC

4

PC

5

PD

2

PD

3

PD6

PD7

PB0

PD

0

PD

1

PC

3

PA2

PA3

PB1

PB2

PB3

PE1

PE2

PE0

PE3

PC2

GN

D

VD

D

PF2

PF3

PF0 (TOSC1)

PF1 (TOSC2)

PF4

PD5

PC

6

PC

7

UPD

I

PF5

PF6

PA1

PA4

PD

4

PB4

PB5

GND

AVDD

PA0

(EXT

CLK

)

GPIO on VDD power domain

GPIO on AVDD power domain

Clock crystal

Programming debugInput supply

Ground

TWI

Analog functions

Digital functions only

Power Functionality

ATmega809160932094809 ndash 48-pinPinout

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 6

3 IO Multiplexing and Considerations

31 Multiplexed SignalsUQFN48TQFP48

Pin name (12) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn

44 PA0 EXTCLK 0TxD 0-WO0 0-IN0

45 PA1 0RxD 0-WO1 0-IN1

46 PA2 TWI 0XCK SDA(MS) 0-WO2 0-WO EVOUTA 0-IN2

47 PA3 TWI 0XDIR SCL(MS) 0-WO3 1-WO 0-OUT

48 PA4 0TxD(3) MOSI 0-WO4

1 PA5 0RxD(3) MISO 0-WO5

2 PA6 0XCK(3) SCK 0-OUT(3)

3 PA7 CLKOUT OUT 0XDIR(3) SS EVOUTA(3)

4 PB0 3TxD 0-WO0(3)

5 PB1 3RxD 0-WO1(3)

6 PB2 3XCK 0-WO2(3) EVOUTB

7 PB3 3XDIR 0-WO3(3)

8 PB4 3TxD(3) 0-WO4(3) 2-WO(3)

9 PB5 3RxD(3) 0-WO5(3) 3-WO

10 PC0 1TxD MOSI(3) 0-WO0(3) 2-WO 1-IN0

11 PC1 1RxD MISO(3) 0-WO1(3) 3-WO(3) 1-IN1

12 PC2 TWI 1XCK SCK(3) SDA(MS)(3) 0-WO2(3) EVOUTC 1-IN2

13 PC3 TWI 1XDIR SS(3) SCL(MS)(3) 0-WO3(3) 1-OUT

14 VDD

15 GND

16 PC4 1TxD(3) 0-WO4(3)

17 PC5 1RxD(3) 0-WO5(3)

18 PC6 1XCK(3) 1-OUT(3)

19 PC7 1XDIR(3) EVOUTC(3)

20 PD0 AIN0 0-WO0(3) 2-IN0

21 PD1 AIN1 P3 0-WO1(3) 2-IN1

22 PD2 AIN2 P0 0-WO2(3) EVOUTD 2-IN2

23 PD3 AIN3 N0 0-WO3(3) 2-OUT

24 PD4 AIN4 P1 0-WO4(3)

25 PD5 AIN5 N1 0-WO5(3)

26 PD6 AIN6 P2 2-OUT(3)

27 PD7 VREFA AIN7 N2 EVOUTD(3)

28 AVDD

29 GND

30 PE0 AIN8 MOSI(3) 0-WO0(3)

31 PE1 AIN9 MISO(3) 0-WO1(3)

32 PE2 AIN10 SCK(3) 0-WO2(3) EVOUTE

33 PE3 AIN11 SS(3) 0-WO3(3)

34 PF0 TOSC1 2TxD 0-WO0(3) 3-IN0

35 PF1 TOSC2 2RxD 0-WO1(3) 3-IN1

36 PF2 TWI AIN12 2XCK SDA(S)(3) 0-WO2(3) EVOUTF 3-IN2

37 PF3 TWI AIN13 2XDIR SCL(S)(3) 0-WO3(3) 3-OUT

ATmega809160932094809 ndash 48-pinIO Multiplexing and Considerations

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 7

continued

UQFN48TQFP48

Pin name (12) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn

38 PF4 AIN14 2TxD(3) 0-WO4(3) 0-WO(3)

39 PF5 AIN15 2RxD(3) 0-WO5(3) 1-WO(3)

40 PF6 RESET 2XCK(3) 3-OUT(3)

41 UPDI

42 VDD

43 GND

Note 1 Pin names are of type Pxn with x being the PORT instance (ABC ) and n the pin number

Notation for signals is PORTx_PINn All pins can be used as event input2 All pins can be used for external interrupt where pins Px2 and Px6 of each port have full

asynchronous detection3 Alternate pin positions For selecting the alternate positions refer to the PORTMUX documentation

ATmega809160932094809 ndash 48-pinIO Multiplexing and Considerations

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 8

4 Electrical Characteristics

41 DisclaimerAll typical values are measured at T = 25degC and VDD = 3V unless otherwise specified All minimum andmaximum values are valid across operating temperature and voltage unless otherwise specified

Typical values given should be considered for design guidance only and actual part variation aroundthese values is expected

42 Absolute Maximum RatingsStresses beyond those listed in this section may cause permanent damage to the device This is a stressrating only and functional operation of the device at these or other conditions beyond those indicated inthe operational sections of this specification is not implied Exposure to absolute maximum ratingconditions for extended periods may affect device reliability

Table 4-1 Absolute Maximum Ratings

Symbol Description Conditions Min Max UnitVDD Power Supply Voltage -05 6 VIVDD Current into a VDD pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAIGND Current out of a GND pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAVPIN Pin voltage with respect to GND -05 VDD+05 VIPIN IO pin sinksource current -40 40 mAIc1

(1) IO pin injection current except for the RESET pin VpinltGND-06V or55VltVpinle61V49VltVDDle55V

-1 1 mA

Ic2(1) IO pin injection current except for the RESET pin VpinltGND-06V or

Vpinle55VVDDle49V

-15 15 mA

Tstorage Storage temperature -65 150 degC

Note 1 ndash If VPIN is lower than GND-06V then a current limiting resistor is required The negative DC

injection current limiting resistor is calculated as R = (GND-06V ndash Vpin)ICnndash If VPIN is greater than VDD+06V then a current limiting resistor is required The positive DC

injection current limiting resistor is calculated as R = (Vpin-(VDD+06))ICn

43 General Operating RatingsThe device must operate within the ratings listed in this section in order for all other electricalcharacteristics and typical characteristics of the device to be valid

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 9

Table 4-2 General Operating Conditions

Symbol Description Condition Min Max Unit

VDD Operating Supply Voltage 18(1) 55 V

TA Operating temperature range -40 125 degC

Note 1 Operation is guaranteed down to 18V or VBOD with BODLEVEL0 whichever is lower

Table 4-3 Operating Voltage and Frequency

Symbol Description Condition Min Max Unit

fCLK_CPU Nominal operating system clock frequency VDD=[18 55]VTA=[-40 105]degC(1)(4)

0 5 MHz

VDD=[27 55]VTA=[-40 105]degC(2)(4)

0 10

VDD=[45 55]VTA=[-40 105]degC(3)(4)

0 20

VDD=[27 55]VTA=[-40 125]degC(2)

0 8

VDD=[45 55]VTA=[-40 125]degC(2)

0 16

Note 1 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL02 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL23 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL74 These specifications do not apply to automotive range parts (-VAO)

The maximum CPU clock frequency depends on VDD As shown in the figure below the MaximumFrequency vs VDD is linear between 18V lt VDD lt 27V and 27V lt VDD lt 45V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 10

Figure 4-1 Maximum Frequency vs VDD for [-40 105]degC

5MHz

10MHz

20MHz

18V 55V27V 45V

Safe Operating Area

44 Power Considerations

The average die junction temperature TJ (in degC) is given from the formula

TJ = TA+PD RθJA

where PD is the total power dissipation

The total thermal resistance of a package (RθJA) can be separated into two components RθJC and RθCArepresenting the barrier to heat flow from the semiconductor junction to the package (case) surface (RθJC)and from the case to the outside ambient air (RθCA) These terms are related by the equation

RθJA = RθJC + RθCA

RθJC is device related and cannot be influenced by the user However RθCA is user dependent and canbe minimized by thermal management techniques such as heat sinks ambient air cooling and thermalconvection Thus good thermal management on the part of the user can significantly reduce RθCA so thatRθJA approximately equals RθJC

The power dissipation curve is negatively sloped as ambient temperature increase The maximum powerdissipation is therefore at minimum ambient temperature while the highest junction temperature occurs atthe maximum ambient temperature

Table 4-4 Power Dissipation and Junction Temperature vs Temperature

Package TA Range RθJA (degCW) PD (W) Typical TJ - TA(degC) Typical

UQFN48 -40degC to 125degC 10

TQFP48 -40degC to 125degC 10

45 Power ConsumptionThe values are measured power consumption under the following conditions except where noted

bull VDD=3Vbull TA=25degCbull OSC20M used as system clock source except where otherwise specified

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 11

bull System power consumption measured with peripherals disabled and IO ports driven low with inputsdisabled

Table 4-5 Power Consumption in Active and Idle Mode

Mode Description Condition Typ Max Unit

Active Active power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 85 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 43 - mA

VDD=3V 23 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 22 - mA

VDD=3V 12 - mA

VDD=2V 075 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 164 - microA

VDD=3V 90 - microA

VDD=2V 60 - microA

Idle Idle power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 28 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 14 - mA

VDD=3V 08 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 07 - mA

VDD=3V 04 - mA

VDD=2V 025 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 56 - microA

VDD=3V 28 - microA

VDD=2V 18 - microA

Table 4-6 Power Consumption in Power-Down Standby and Reset Mode

Mode Description Condition Typ25degC

Max85degC(1)

Max125degC

Unit

Standby Standby powerconsumption

RTC running at 1024kHz from externalXOSC32K (CL=75pF)

VDD=3V 07 - - microA

RTC running at 1024kHz from internalOSCULP32K

VDD=3V 07 60 160 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 12

continuedMode Description Condition Typ

25degCMax85degC(1)

Max125degC

Unit

PowerDownStandby

Power downStandby powerconsumption are thesame when allperipherals arestopped

All peripheralsstopped

VDD=3V 01 50 150 microA

Reset Reset powerconsumption

RESET line pulled low VDD=3V 100 - - microA

Note 1 These parameters are for design guidance only and are not tested

46 Peripherals Power ConsumptionThe table below can be used to calculate the additional current consumption for the different IOperipherals in the various operating modes

Some peripherals will request the clock to be enabled when operating in STANDBY See the peripheralchapter for further information

Operating conditionsbull VDD=3Vbull T=25degCbull OSC20M at 1 MHz used as system clock source except where otherwise specifiedbull In Idle Sleep mode except where otherwise specified

Table 4-7 Peripherals Power Consumption

Peripheral Conditions Typ(1) Unit

BOD Continuous 19 microA

Sampling 1 kHz 12

TCA 16-bit count 1 MHz 130 microA

TCB 16-bit count 1 MHz 74 microA

RTC 16-bit count OSCULP32K 12 microA

WDT (including OSCULP32K) 07 microA

OSC20M 130 microA

AC Fast Mode(2) 92 microA

Low-Power Mode(2) 45 microA

ADC(3) 50 ksps 330 microA

100 ksps 340 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 13

continuedPeripheral Conditions Typ(1) Unit

XOSC32K CL=75 pF 05 microA

OSCULP32K 04 microA

USART Enable 9600 Baud 130 microA

SPI (Master) Enable 100 kHz 21 microA

TWI (Master) Enable 100 kHz 240 microA

TWI (Slave) Enable 100 kHz 170 microA

Flash programming Erase Operation 15 mA

Write Operation 30

Note 1 Current consumption of the module only To calculate the total internal power consumption of the

microcontroller add this value to the base power consumption given in ldquoPower Consumptionrdquosection in electrical characteristics

2 CPU in Standby mode3 Average power consumption with ADC active in Free-Running mode

47 BOD and POR CharacteristicsTable 4-8 Power Supply Characteristics

Symbol Description Condition Min Typ Max Unit

SRON(1) Power-on Slope - - 100(2) Vms

Note 1 For design guidance only and not tested in production2 A slope faster than the maximum rating can trigger a reset of the device if changing the voltage

level after an initial power-up

Table 4-9 Power-on Reset (POR) Characteristics

Symbol Description Condition Min Typ Max Unit

VPOR POR threshold voltage on VDDfalling

VDD fallsrises at 05Vms or slower 08(1) - 16(1) V

POR threshold voltage on VDDrising

14(1) - 18

Note 1 For design guidance only and not tested in production

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 14

Table 4-10 Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min Typ Max Unit

VBOD BOD detection level (fallingrising)

BODLEVEL0 17 18 20 V

BODLEVEL2 24 26 29

BODLEVEL7 39 43 45

VHYS Hysteresis BODLEVEL0 - 25 - mV

BODLEVEL2 - 40 -

BODLEVEL7 - 80 -

tBOD Detection time Continuous - 7 - micros

Sampled 1 kHz - 1 - ms

Sampled 125 Hz - 8 -

tstartup Start-up time Time from enable to ready - 40 - micros

VINT Interrupt level 0 Percentage above the selectedBOD level

- 4 -

Interrupt level 1 - 13 -

Interrupt level 2 - 25 -

48 External Reset CharacteristicsTable 4-11 External Reset Characteristics

Mode Description Condition Min Typ Max Unit

VVIH_RST Input Voltage for RESET 07timesVDD - VDD+02 V

VVIL_RST Input Low Voltage for RESET -02 - 03timesVDD

tMIN_RST Minimum pulse width on RESET pin(1) - - 25 micros

Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note 1 These parameters are for design guidance only and are not production tested

49 Oscillators and ClocksOperating conditions

bull VDD=3V except where specified otherwise

Table 4-12 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25degC 30V 16 MHz

FREQSEL=1 20

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 15

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 2: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

ndash SleepWalking peripheralsbull Power-Down with limited wake-up functionality

bull Peripheralsndash One 16-bit TimerCounter type A (TCA) with a dedicated period register and three compare

channelsndash Four 16-bit TimerCounter type B with input capture (TCB)ndash One 16-bit Real-Time Counter (RTC) running from an external crystal or an internal RC oscillatorndash Four USART with fractional baud rate generator auto-baud and start-of-frame detectionndash Masterslave Serial Peripheral Interface (SPI)ndash Dual mode MasterSlave TWI with dual address match

bull Standard mode (Sm 100 kHz)bull Fast mode (Fm 400 kHz)bull Fast mode plus (Fm+ 1 MHz)

ndash Event System for CPU independent and predictable inter-peripheral signalingndash Configurable Custom Logic (CCL) with up to four programmable Look-up Tables (LUT)ndash One Analog Comparator (AC) with a scalable reference inputndash One 10-bit 150 ksps Analog to Digital Converter (ADC)ndash Five selectable internal voltage references 055V 11V 15V 25V and 43Vndash CRC code memory scan hardware

bull Optional automatic scan before code execution is allowedndash Watchdog Timer (WDT) with Window mode with separate on-chip oscillatorndash External interrupt on all general purpose pins

bull IO and Packagesndash 41 programmable IO linesndash 48-pin UQFN 6x6 and TQFP 7x7

bull Temperature Range -40degC to 125degCbull Speed Grades -40degC to 105degC

ndash 0-5 MHz 18V ndash 55Vndash 0-10 MHz 27V ndash 55Vndash 0-20 MHz 45V ndash 55V

bull Speed Grades -40degC to 125degCndash 0-8 MHz 27V - 55Vndash 0-16 MHz 45V - 55V

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 2

Table of Contents

Introduction1

Features 1

1 Block Diagram 5

2 Pinout 621 48-pin UQFNTQFP6

3 IO Multiplexing and Considerations731 Multiplexed Signals 7

4 Electrical Characteristics 941 Disclaimer942 Absolute Maximum Ratings 943 General Operating Ratings 944 Power Considerations 1145 Power Consumption 1146 Peripherals Power Consumption1347 BOD and POR Characteristics1448 External Reset Characteristics1549 Oscillators and Clocks15410 IO Pin Characteristics17411 USART 19412 SPI20413 TWI21414 VREF23415 ADC25416 AC 28417 UPDI Timing 29418 Programming Time30

5 Typical Characteristics3151 Power Consumption3152 GPIO 3953 VREF Characteristics4654 BOD Characteristics4855 ADC Characteristics5156 AC Characteristics6157 OSC20M Characteristics6358 OSCULP32K Characteristics 65

6 Ordering Information67

7 Online Package Drawings 68

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 3

8 Package Drawings6981 48-Pin TQFP 6982 48-Pin UQFN73

9 Conventions7791 Memory Size and Type7792 Frequency and Time77

10 Data Sheet Revision History78101 RevB - 03201978102 Rev A - 02201878

The Microchip Web Site 79

Customer Change Notification Service79

Customer Support 79

Product Identification System80

Microchip Devices Code Protection Feature 80

Legal Notice80

Trademarks 81

Quality Management System Certified by DNV81

Worldwide Sales and Service82

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 4

1 Block Diagram

INOUT

DATABUS

Clock Generation

BUS Matrix

CPU

USARTn

SPIn

TWIn

CCL

ACn

ADCn

TCAn

TCBn

WOn

RXDTXDXCK

XDIR

MISOMOSISCK

SS

SDA (master)SCL (master)

PORTS

EVSYS

SystemManagement

SLPCTRL

RSTCTRL

CLKCTRL

EVENT

ROUTING

NETWORK

DATABUS

UPDICRC

SRAM

NVMCTRL

Flash

EEPROM

OSC20M

OSC32K

XOSC32K

References

BODVLM

POR

Bandgap

WDT

RTC

CPUINT

M M

S

MS

S

OCD

UPDI

RST

TOSC2

TOSC1

S

EXTCLK

LUTn-OUT

WO

CLKOUT

PAnPBnPCnPDnPEnPFn

RESET

SDA (slave)SCL (slave)

GPIOR

AINPnAINNn

OUT

AINn

EVOUTx

VREFA

LUTn-INn

Detectors

ATmega809160932094809 ndash 48-pinBlock Diagram

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 5

2 Pinout

21 48-pin UQFNTQFP

1

2

3

4

44 43 42 41 40 39 385

6

7

8

9

10

11

33

32

31

30

29

28

27

26

25

2423

37

36

35

34

12

13 14 15 16 17 18 19 20 21 22

45464748

GN

D

VD

DPA5

PA6

PA7

PC0

PC1

PC

4

PC

5

PD

2

PD

3

PD6

PD7

PB0

PD

0

PD

1

PC

3

PA2

PA3

PB1

PB2

PB3

PE1

PE2

PE0

PE3

PC2

GN

D

VD

D

PF2

PF3

PF0 (TOSC1)

PF1 (TOSC2)

PF4

PD5

PC

6

PC

7

UPD

I

PF5

PF6

PA1

PA4

PD

4

PB4

PB5

GND

AVDD

PA0

(EXT

CLK

)

GPIO on VDD power domain

GPIO on AVDD power domain

Clock crystal

Programming debugInput supply

Ground

TWI

Analog functions

Digital functions only

Power Functionality

ATmega809160932094809 ndash 48-pinPinout

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 6

3 IO Multiplexing and Considerations

31 Multiplexed SignalsUQFN48TQFP48

Pin name (12) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn

44 PA0 EXTCLK 0TxD 0-WO0 0-IN0

45 PA1 0RxD 0-WO1 0-IN1

46 PA2 TWI 0XCK SDA(MS) 0-WO2 0-WO EVOUTA 0-IN2

47 PA3 TWI 0XDIR SCL(MS) 0-WO3 1-WO 0-OUT

48 PA4 0TxD(3) MOSI 0-WO4

1 PA5 0RxD(3) MISO 0-WO5

2 PA6 0XCK(3) SCK 0-OUT(3)

3 PA7 CLKOUT OUT 0XDIR(3) SS EVOUTA(3)

4 PB0 3TxD 0-WO0(3)

5 PB1 3RxD 0-WO1(3)

6 PB2 3XCK 0-WO2(3) EVOUTB

7 PB3 3XDIR 0-WO3(3)

8 PB4 3TxD(3) 0-WO4(3) 2-WO(3)

9 PB5 3RxD(3) 0-WO5(3) 3-WO

10 PC0 1TxD MOSI(3) 0-WO0(3) 2-WO 1-IN0

11 PC1 1RxD MISO(3) 0-WO1(3) 3-WO(3) 1-IN1

12 PC2 TWI 1XCK SCK(3) SDA(MS)(3) 0-WO2(3) EVOUTC 1-IN2

13 PC3 TWI 1XDIR SS(3) SCL(MS)(3) 0-WO3(3) 1-OUT

14 VDD

15 GND

16 PC4 1TxD(3) 0-WO4(3)

17 PC5 1RxD(3) 0-WO5(3)

18 PC6 1XCK(3) 1-OUT(3)

19 PC7 1XDIR(3) EVOUTC(3)

20 PD0 AIN0 0-WO0(3) 2-IN0

21 PD1 AIN1 P3 0-WO1(3) 2-IN1

22 PD2 AIN2 P0 0-WO2(3) EVOUTD 2-IN2

23 PD3 AIN3 N0 0-WO3(3) 2-OUT

24 PD4 AIN4 P1 0-WO4(3)

25 PD5 AIN5 N1 0-WO5(3)

26 PD6 AIN6 P2 2-OUT(3)

27 PD7 VREFA AIN7 N2 EVOUTD(3)

28 AVDD

29 GND

30 PE0 AIN8 MOSI(3) 0-WO0(3)

31 PE1 AIN9 MISO(3) 0-WO1(3)

32 PE2 AIN10 SCK(3) 0-WO2(3) EVOUTE

33 PE3 AIN11 SS(3) 0-WO3(3)

34 PF0 TOSC1 2TxD 0-WO0(3) 3-IN0

35 PF1 TOSC2 2RxD 0-WO1(3) 3-IN1

36 PF2 TWI AIN12 2XCK SDA(S)(3) 0-WO2(3) EVOUTF 3-IN2

37 PF3 TWI AIN13 2XDIR SCL(S)(3) 0-WO3(3) 3-OUT

ATmega809160932094809 ndash 48-pinIO Multiplexing and Considerations

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 7

continued

UQFN48TQFP48

Pin name (12) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn

38 PF4 AIN14 2TxD(3) 0-WO4(3) 0-WO(3)

39 PF5 AIN15 2RxD(3) 0-WO5(3) 1-WO(3)

40 PF6 RESET 2XCK(3) 3-OUT(3)

41 UPDI

42 VDD

43 GND

Note 1 Pin names are of type Pxn with x being the PORT instance (ABC ) and n the pin number

Notation for signals is PORTx_PINn All pins can be used as event input2 All pins can be used for external interrupt where pins Px2 and Px6 of each port have full

asynchronous detection3 Alternate pin positions For selecting the alternate positions refer to the PORTMUX documentation

ATmega809160932094809 ndash 48-pinIO Multiplexing and Considerations

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 8

4 Electrical Characteristics

41 DisclaimerAll typical values are measured at T = 25degC and VDD = 3V unless otherwise specified All minimum andmaximum values are valid across operating temperature and voltage unless otherwise specified

Typical values given should be considered for design guidance only and actual part variation aroundthese values is expected

42 Absolute Maximum RatingsStresses beyond those listed in this section may cause permanent damage to the device This is a stressrating only and functional operation of the device at these or other conditions beyond those indicated inthe operational sections of this specification is not implied Exposure to absolute maximum ratingconditions for extended periods may affect device reliability

Table 4-1 Absolute Maximum Ratings

Symbol Description Conditions Min Max UnitVDD Power Supply Voltage -05 6 VIVDD Current into a VDD pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAIGND Current out of a GND pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAVPIN Pin voltage with respect to GND -05 VDD+05 VIPIN IO pin sinksource current -40 40 mAIc1

(1) IO pin injection current except for the RESET pin VpinltGND-06V or55VltVpinle61V49VltVDDle55V

-1 1 mA

Ic2(1) IO pin injection current except for the RESET pin VpinltGND-06V or

Vpinle55VVDDle49V

-15 15 mA

Tstorage Storage temperature -65 150 degC

Note 1 ndash If VPIN is lower than GND-06V then a current limiting resistor is required The negative DC

injection current limiting resistor is calculated as R = (GND-06V ndash Vpin)ICnndash If VPIN is greater than VDD+06V then a current limiting resistor is required The positive DC

injection current limiting resistor is calculated as R = (Vpin-(VDD+06))ICn

43 General Operating RatingsThe device must operate within the ratings listed in this section in order for all other electricalcharacteristics and typical characteristics of the device to be valid

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 9

Table 4-2 General Operating Conditions

Symbol Description Condition Min Max Unit

VDD Operating Supply Voltage 18(1) 55 V

TA Operating temperature range -40 125 degC

Note 1 Operation is guaranteed down to 18V or VBOD with BODLEVEL0 whichever is lower

Table 4-3 Operating Voltage and Frequency

Symbol Description Condition Min Max Unit

fCLK_CPU Nominal operating system clock frequency VDD=[18 55]VTA=[-40 105]degC(1)(4)

0 5 MHz

VDD=[27 55]VTA=[-40 105]degC(2)(4)

0 10

VDD=[45 55]VTA=[-40 105]degC(3)(4)

0 20

VDD=[27 55]VTA=[-40 125]degC(2)

0 8

VDD=[45 55]VTA=[-40 125]degC(2)

0 16

Note 1 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL02 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL23 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL74 These specifications do not apply to automotive range parts (-VAO)

The maximum CPU clock frequency depends on VDD As shown in the figure below the MaximumFrequency vs VDD is linear between 18V lt VDD lt 27V and 27V lt VDD lt 45V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 10

Figure 4-1 Maximum Frequency vs VDD for [-40 105]degC

5MHz

10MHz

20MHz

18V 55V27V 45V

Safe Operating Area

44 Power Considerations

The average die junction temperature TJ (in degC) is given from the formula

TJ = TA+PD RθJA

where PD is the total power dissipation

The total thermal resistance of a package (RθJA) can be separated into two components RθJC and RθCArepresenting the barrier to heat flow from the semiconductor junction to the package (case) surface (RθJC)and from the case to the outside ambient air (RθCA) These terms are related by the equation

RθJA = RθJC + RθCA

RθJC is device related and cannot be influenced by the user However RθCA is user dependent and canbe minimized by thermal management techniques such as heat sinks ambient air cooling and thermalconvection Thus good thermal management on the part of the user can significantly reduce RθCA so thatRθJA approximately equals RθJC

The power dissipation curve is negatively sloped as ambient temperature increase The maximum powerdissipation is therefore at minimum ambient temperature while the highest junction temperature occurs atthe maximum ambient temperature

Table 4-4 Power Dissipation and Junction Temperature vs Temperature

Package TA Range RθJA (degCW) PD (W) Typical TJ - TA(degC) Typical

UQFN48 -40degC to 125degC 10

TQFP48 -40degC to 125degC 10

45 Power ConsumptionThe values are measured power consumption under the following conditions except where noted

bull VDD=3Vbull TA=25degCbull OSC20M used as system clock source except where otherwise specified

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 11

bull System power consumption measured with peripherals disabled and IO ports driven low with inputsdisabled

Table 4-5 Power Consumption in Active and Idle Mode

Mode Description Condition Typ Max Unit

Active Active power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 85 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 43 - mA

VDD=3V 23 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 22 - mA

VDD=3V 12 - mA

VDD=2V 075 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 164 - microA

VDD=3V 90 - microA

VDD=2V 60 - microA

Idle Idle power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 28 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 14 - mA

VDD=3V 08 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 07 - mA

VDD=3V 04 - mA

VDD=2V 025 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 56 - microA

VDD=3V 28 - microA

VDD=2V 18 - microA

Table 4-6 Power Consumption in Power-Down Standby and Reset Mode

Mode Description Condition Typ25degC

Max85degC(1)

Max125degC

Unit

Standby Standby powerconsumption

RTC running at 1024kHz from externalXOSC32K (CL=75pF)

VDD=3V 07 - - microA

RTC running at 1024kHz from internalOSCULP32K

VDD=3V 07 60 160 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 12

continuedMode Description Condition Typ

25degCMax85degC(1)

Max125degC

Unit

PowerDownStandby

Power downStandby powerconsumption are thesame when allperipherals arestopped

All peripheralsstopped

VDD=3V 01 50 150 microA

Reset Reset powerconsumption

RESET line pulled low VDD=3V 100 - - microA

Note 1 These parameters are for design guidance only and are not tested

46 Peripherals Power ConsumptionThe table below can be used to calculate the additional current consumption for the different IOperipherals in the various operating modes

Some peripherals will request the clock to be enabled when operating in STANDBY See the peripheralchapter for further information

Operating conditionsbull VDD=3Vbull T=25degCbull OSC20M at 1 MHz used as system clock source except where otherwise specifiedbull In Idle Sleep mode except where otherwise specified

Table 4-7 Peripherals Power Consumption

Peripheral Conditions Typ(1) Unit

BOD Continuous 19 microA

Sampling 1 kHz 12

TCA 16-bit count 1 MHz 130 microA

TCB 16-bit count 1 MHz 74 microA

RTC 16-bit count OSCULP32K 12 microA

WDT (including OSCULP32K) 07 microA

OSC20M 130 microA

AC Fast Mode(2) 92 microA

Low-Power Mode(2) 45 microA

ADC(3) 50 ksps 330 microA

100 ksps 340 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 13

continuedPeripheral Conditions Typ(1) Unit

XOSC32K CL=75 pF 05 microA

OSCULP32K 04 microA

USART Enable 9600 Baud 130 microA

SPI (Master) Enable 100 kHz 21 microA

TWI (Master) Enable 100 kHz 240 microA

TWI (Slave) Enable 100 kHz 170 microA

Flash programming Erase Operation 15 mA

Write Operation 30

Note 1 Current consumption of the module only To calculate the total internal power consumption of the

microcontroller add this value to the base power consumption given in ldquoPower Consumptionrdquosection in electrical characteristics

2 CPU in Standby mode3 Average power consumption with ADC active in Free-Running mode

47 BOD and POR CharacteristicsTable 4-8 Power Supply Characteristics

Symbol Description Condition Min Typ Max Unit

SRON(1) Power-on Slope - - 100(2) Vms

Note 1 For design guidance only and not tested in production2 A slope faster than the maximum rating can trigger a reset of the device if changing the voltage

level after an initial power-up

Table 4-9 Power-on Reset (POR) Characteristics

Symbol Description Condition Min Typ Max Unit

VPOR POR threshold voltage on VDDfalling

VDD fallsrises at 05Vms or slower 08(1) - 16(1) V

POR threshold voltage on VDDrising

14(1) - 18

Note 1 For design guidance only and not tested in production

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 14

Table 4-10 Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min Typ Max Unit

VBOD BOD detection level (fallingrising)

BODLEVEL0 17 18 20 V

BODLEVEL2 24 26 29

BODLEVEL7 39 43 45

VHYS Hysteresis BODLEVEL0 - 25 - mV

BODLEVEL2 - 40 -

BODLEVEL7 - 80 -

tBOD Detection time Continuous - 7 - micros

Sampled 1 kHz - 1 - ms

Sampled 125 Hz - 8 -

tstartup Start-up time Time from enable to ready - 40 - micros

VINT Interrupt level 0 Percentage above the selectedBOD level

- 4 -

Interrupt level 1 - 13 -

Interrupt level 2 - 25 -

48 External Reset CharacteristicsTable 4-11 External Reset Characteristics

Mode Description Condition Min Typ Max Unit

VVIH_RST Input Voltage for RESET 07timesVDD - VDD+02 V

VVIL_RST Input Low Voltage for RESET -02 - 03timesVDD

tMIN_RST Minimum pulse width on RESET pin(1) - - 25 micros

Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note 1 These parameters are for design guidance only and are not production tested

49 Oscillators and ClocksOperating conditions

bull VDD=3V except where specified otherwise

Table 4-12 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25degC 30V 16 MHz

FREQSEL=1 20

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 15

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 3: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Table of Contents

Introduction1

Features 1

1 Block Diagram 5

2 Pinout 621 48-pin UQFNTQFP6

3 IO Multiplexing and Considerations731 Multiplexed Signals 7

4 Electrical Characteristics 941 Disclaimer942 Absolute Maximum Ratings 943 General Operating Ratings 944 Power Considerations 1145 Power Consumption 1146 Peripherals Power Consumption1347 BOD and POR Characteristics1448 External Reset Characteristics1549 Oscillators and Clocks15410 IO Pin Characteristics17411 USART 19412 SPI20413 TWI21414 VREF23415 ADC25416 AC 28417 UPDI Timing 29418 Programming Time30

5 Typical Characteristics3151 Power Consumption3152 GPIO 3953 VREF Characteristics4654 BOD Characteristics4855 ADC Characteristics5156 AC Characteristics6157 OSC20M Characteristics6358 OSCULP32K Characteristics 65

6 Ordering Information67

7 Online Package Drawings 68

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 3

8 Package Drawings6981 48-Pin TQFP 6982 48-Pin UQFN73

9 Conventions7791 Memory Size and Type7792 Frequency and Time77

10 Data Sheet Revision History78101 RevB - 03201978102 Rev A - 02201878

The Microchip Web Site 79

Customer Change Notification Service79

Customer Support 79

Product Identification System80

Microchip Devices Code Protection Feature 80

Legal Notice80

Trademarks 81

Quality Management System Certified by DNV81

Worldwide Sales and Service82

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 4

1 Block Diagram

INOUT

DATABUS

Clock Generation

BUS Matrix

CPU

USARTn

SPIn

TWIn

CCL

ACn

ADCn

TCAn

TCBn

WOn

RXDTXDXCK

XDIR

MISOMOSISCK

SS

SDA (master)SCL (master)

PORTS

EVSYS

SystemManagement

SLPCTRL

RSTCTRL

CLKCTRL

EVENT

ROUTING

NETWORK

DATABUS

UPDICRC

SRAM

NVMCTRL

Flash

EEPROM

OSC20M

OSC32K

XOSC32K

References

BODVLM

POR

Bandgap

WDT

RTC

CPUINT

M M

S

MS

S

OCD

UPDI

RST

TOSC2

TOSC1

S

EXTCLK

LUTn-OUT

WO

CLKOUT

PAnPBnPCnPDnPEnPFn

RESET

SDA (slave)SCL (slave)

GPIOR

AINPnAINNn

OUT

AINn

EVOUTx

VREFA

LUTn-INn

Detectors

ATmega809160932094809 ndash 48-pinBlock Diagram

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 5

2 Pinout

21 48-pin UQFNTQFP

1

2

3

4

44 43 42 41 40 39 385

6

7

8

9

10

11

33

32

31

30

29

28

27

26

25

2423

37

36

35

34

12

13 14 15 16 17 18 19 20 21 22

45464748

GN

D

VD

DPA5

PA6

PA7

PC0

PC1

PC

4

PC

5

PD

2

PD

3

PD6

PD7

PB0

PD

0

PD

1

PC

3

PA2

PA3

PB1

PB2

PB3

PE1

PE2

PE0

PE3

PC2

GN

D

VD

D

PF2

PF3

PF0 (TOSC1)

PF1 (TOSC2)

PF4

PD5

PC

6

PC

7

UPD

I

PF5

PF6

PA1

PA4

PD

4

PB4

PB5

GND

AVDD

PA0

(EXT

CLK

)

GPIO on VDD power domain

GPIO on AVDD power domain

Clock crystal

Programming debugInput supply

Ground

TWI

Analog functions

Digital functions only

Power Functionality

ATmega809160932094809 ndash 48-pinPinout

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 6

3 IO Multiplexing and Considerations

31 Multiplexed SignalsUQFN48TQFP48

Pin name (12) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn

44 PA0 EXTCLK 0TxD 0-WO0 0-IN0

45 PA1 0RxD 0-WO1 0-IN1

46 PA2 TWI 0XCK SDA(MS) 0-WO2 0-WO EVOUTA 0-IN2

47 PA3 TWI 0XDIR SCL(MS) 0-WO3 1-WO 0-OUT

48 PA4 0TxD(3) MOSI 0-WO4

1 PA5 0RxD(3) MISO 0-WO5

2 PA6 0XCK(3) SCK 0-OUT(3)

3 PA7 CLKOUT OUT 0XDIR(3) SS EVOUTA(3)

4 PB0 3TxD 0-WO0(3)

5 PB1 3RxD 0-WO1(3)

6 PB2 3XCK 0-WO2(3) EVOUTB

7 PB3 3XDIR 0-WO3(3)

8 PB4 3TxD(3) 0-WO4(3) 2-WO(3)

9 PB5 3RxD(3) 0-WO5(3) 3-WO

10 PC0 1TxD MOSI(3) 0-WO0(3) 2-WO 1-IN0

11 PC1 1RxD MISO(3) 0-WO1(3) 3-WO(3) 1-IN1

12 PC2 TWI 1XCK SCK(3) SDA(MS)(3) 0-WO2(3) EVOUTC 1-IN2

13 PC3 TWI 1XDIR SS(3) SCL(MS)(3) 0-WO3(3) 1-OUT

14 VDD

15 GND

16 PC4 1TxD(3) 0-WO4(3)

17 PC5 1RxD(3) 0-WO5(3)

18 PC6 1XCK(3) 1-OUT(3)

19 PC7 1XDIR(3) EVOUTC(3)

20 PD0 AIN0 0-WO0(3) 2-IN0

21 PD1 AIN1 P3 0-WO1(3) 2-IN1

22 PD2 AIN2 P0 0-WO2(3) EVOUTD 2-IN2

23 PD3 AIN3 N0 0-WO3(3) 2-OUT

24 PD4 AIN4 P1 0-WO4(3)

25 PD5 AIN5 N1 0-WO5(3)

26 PD6 AIN6 P2 2-OUT(3)

27 PD7 VREFA AIN7 N2 EVOUTD(3)

28 AVDD

29 GND

30 PE0 AIN8 MOSI(3) 0-WO0(3)

31 PE1 AIN9 MISO(3) 0-WO1(3)

32 PE2 AIN10 SCK(3) 0-WO2(3) EVOUTE

33 PE3 AIN11 SS(3) 0-WO3(3)

34 PF0 TOSC1 2TxD 0-WO0(3) 3-IN0

35 PF1 TOSC2 2RxD 0-WO1(3) 3-IN1

36 PF2 TWI AIN12 2XCK SDA(S)(3) 0-WO2(3) EVOUTF 3-IN2

37 PF3 TWI AIN13 2XDIR SCL(S)(3) 0-WO3(3) 3-OUT

ATmega809160932094809 ndash 48-pinIO Multiplexing and Considerations

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 7

continued

UQFN48TQFP48

Pin name (12) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn

38 PF4 AIN14 2TxD(3) 0-WO4(3) 0-WO(3)

39 PF5 AIN15 2RxD(3) 0-WO5(3) 1-WO(3)

40 PF6 RESET 2XCK(3) 3-OUT(3)

41 UPDI

42 VDD

43 GND

Note 1 Pin names are of type Pxn with x being the PORT instance (ABC ) and n the pin number

Notation for signals is PORTx_PINn All pins can be used as event input2 All pins can be used for external interrupt where pins Px2 and Px6 of each port have full

asynchronous detection3 Alternate pin positions For selecting the alternate positions refer to the PORTMUX documentation

ATmega809160932094809 ndash 48-pinIO Multiplexing and Considerations

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 8

4 Electrical Characteristics

41 DisclaimerAll typical values are measured at T = 25degC and VDD = 3V unless otherwise specified All minimum andmaximum values are valid across operating temperature and voltage unless otherwise specified

Typical values given should be considered for design guidance only and actual part variation aroundthese values is expected

42 Absolute Maximum RatingsStresses beyond those listed in this section may cause permanent damage to the device This is a stressrating only and functional operation of the device at these or other conditions beyond those indicated inthe operational sections of this specification is not implied Exposure to absolute maximum ratingconditions for extended periods may affect device reliability

Table 4-1 Absolute Maximum Ratings

Symbol Description Conditions Min Max UnitVDD Power Supply Voltage -05 6 VIVDD Current into a VDD pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAIGND Current out of a GND pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAVPIN Pin voltage with respect to GND -05 VDD+05 VIPIN IO pin sinksource current -40 40 mAIc1

(1) IO pin injection current except for the RESET pin VpinltGND-06V or55VltVpinle61V49VltVDDle55V

-1 1 mA

Ic2(1) IO pin injection current except for the RESET pin VpinltGND-06V or

Vpinle55VVDDle49V

-15 15 mA

Tstorage Storage temperature -65 150 degC

Note 1 ndash If VPIN is lower than GND-06V then a current limiting resistor is required The negative DC

injection current limiting resistor is calculated as R = (GND-06V ndash Vpin)ICnndash If VPIN is greater than VDD+06V then a current limiting resistor is required The positive DC

injection current limiting resistor is calculated as R = (Vpin-(VDD+06))ICn

43 General Operating RatingsThe device must operate within the ratings listed in this section in order for all other electricalcharacteristics and typical characteristics of the device to be valid

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 9

Table 4-2 General Operating Conditions

Symbol Description Condition Min Max Unit

VDD Operating Supply Voltage 18(1) 55 V

TA Operating temperature range -40 125 degC

Note 1 Operation is guaranteed down to 18V or VBOD with BODLEVEL0 whichever is lower

Table 4-3 Operating Voltage and Frequency

Symbol Description Condition Min Max Unit

fCLK_CPU Nominal operating system clock frequency VDD=[18 55]VTA=[-40 105]degC(1)(4)

0 5 MHz

VDD=[27 55]VTA=[-40 105]degC(2)(4)

0 10

VDD=[45 55]VTA=[-40 105]degC(3)(4)

0 20

VDD=[27 55]VTA=[-40 125]degC(2)

0 8

VDD=[45 55]VTA=[-40 125]degC(2)

0 16

Note 1 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL02 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL23 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL74 These specifications do not apply to automotive range parts (-VAO)

The maximum CPU clock frequency depends on VDD As shown in the figure below the MaximumFrequency vs VDD is linear between 18V lt VDD lt 27V and 27V lt VDD lt 45V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 10

Figure 4-1 Maximum Frequency vs VDD for [-40 105]degC

5MHz

10MHz

20MHz

18V 55V27V 45V

Safe Operating Area

44 Power Considerations

The average die junction temperature TJ (in degC) is given from the formula

TJ = TA+PD RθJA

where PD is the total power dissipation

The total thermal resistance of a package (RθJA) can be separated into two components RθJC and RθCArepresenting the barrier to heat flow from the semiconductor junction to the package (case) surface (RθJC)and from the case to the outside ambient air (RθCA) These terms are related by the equation

RθJA = RθJC + RθCA

RθJC is device related and cannot be influenced by the user However RθCA is user dependent and canbe minimized by thermal management techniques such as heat sinks ambient air cooling and thermalconvection Thus good thermal management on the part of the user can significantly reduce RθCA so thatRθJA approximately equals RθJC

The power dissipation curve is negatively sloped as ambient temperature increase The maximum powerdissipation is therefore at minimum ambient temperature while the highest junction temperature occurs atthe maximum ambient temperature

Table 4-4 Power Dissipation and Junction Temperature vs Temperature

Package TA Range RθJA (degCW) PD (W) Typical TJ - TA(degC) Typical

UQFN48 -40degC to 125degC 10

TQFP48 -40degC to 125degC 10

45 Power ConsumptionThe values are measured power consumption under the following conditions except where noted

bull VDD=3Vbull TA=25degCbull OSC20M used as system clock source except where otherwise specified

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 11

bull System power consumption measured with peripherals disabled and IO ports driven low with inputsdisabled

Table 4-5 Power Consumption in Active and Idle Mode

Mode Description Condition Typ Max Unit

Active Active power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 85 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 43 - mA

VDD=3V 23 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 22 - mA

VDD=3V 12 - mA

VDD=2V 075 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 164 - microA

VDD=3V 90 - microA

VDD=2V 60 - microA

Idle Idle power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 28 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 14 - mA

VDD=3V 08 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 07 - mA

VDD=3V 04 - mA

VDD=2V 025 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 56 - microA

VDD=3V 28 - microA

VDD=2V 18 - microA

Table 4-6 Power Consumption in Power-Down Standby and Reset Mode

Mode Description Condition Typ25degC

Max85degC(1)

Max125degC

Unit

Standby Standby powerconsumption

RTC running at 1024kHz from externalXOSC32K (CL=75pF)

VDD=3V 07 - - microA

RTC running at 1024kHz from internalOSCULP32K

VDD=3V 07 60 160 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 12

continuedMode Description Condition Typ

25degCMax85degC(1)

Max125degC

Unit

PowerDownStandby

Power downStandby powerconsumption are thesame when allperipherals arestopped

All peripheralsstopped

VDD=3V 01 50 150 microA

Reset Reset powerconsumption

RESET line pulled low VDD=3V 100 - - microA

Note 1 These parameters are for design guidance only and are not tested

46 Peripherals Power ConsumptionThe table below can be used to calculate the additional current consumption for the different IOperipherals in the various operating modes

Some peripherals will request the clock to be enabled when operating in STANDBY See the peripheralchapter for further information

Operating conditionsbull VDD=3Vbull T=25degCbull OSC20M at 1 MHz used as system clock source except where otherwise specifiedbull In Idle Sleep mode except where otherwise specified

Table 4-7 Peripherals Power Consumption

Peripheral Conditions Typ(1) Unit

BOD Continuous 19 microA

Sampling 1 kHz 12

TCA 16-bit count 1 MHz 130 microA

TCB 16-bit count 1 MHz 74 microA

RTC 16-bit count OSCULP32K 12 microA

WDT (including OSCULP32K) 07 microA

OSC20M 130 microA

AC Fast Mode(2) 92 microA

Low-Power Mode(2) 45 microA

ADC(3) 50 ksps 330 microA

100 ksps 340 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 13

continuedPeripheral Conditions Typ(1) Unit

XOSC32K CL=75 pF 05 microA

OSCULP32K 04 microA

USART Enable 9600 Baud 130 microA

SPI (Master) Enable 100 kHz 21 microA

TWI (Master) Enable 100 kHz 240 microA

TWI (Slave) Enable 100 kHz 170 microA

Flash programming Erase Operation 15 mA

Write Operation 30

Note 1 Current consumption of the module only To calculate the total internal power consumption of the

microcontroller add this value to the base power consumption given in ldquoPower Consumptionrdquosection in electrical characteristics

2 CPU in Standby mode3 Average power consumption with ADC active in Free-Running mode

47 BOD and POR CharacteristicsTable 4-8 Power Supply Characteristics

Symbol Description Condition Min Typ Max Unit

SRON(1) Power-on Slope - - 100(2) Vms

Note 1 For design guidance only and not tested in production2 A slope faster than the maximum rating can trigger a reset of the device if changing the voltage

level after an initial power-up

Table 4-9 Power-on Reset (POR) Characteristics

Symbol Description Condition Min Typ Max Unit

VPOR POR threshold voltage on VDDfalling

VDD fallsrises at 05Vms or slower 08(1) - 16(1) V

POR threshold voltage on VDDrising

14(1) - 18

Note 1 For design guidance only and not tested in production

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 14

Table 4-10 Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min Typ Max Unit

VBOD BOD detection level (fallingrising)

BODLEVEL0 17 18 20 V

BODLEVEL2 24 26 29

BODLEVEL7 39 43 45

VHYS Hysteresis BODLEVEL0 - 25 - mV

BODLEVEL2 - 40 -

BODLEVEL7 - 80 -

tBOD Detection time Continuous - 7 - micros

Sampled 1 kHz - 1 - ms

Sampled 125 Hz - 8 -

tstartup Start-up time Time from enable to ready - 40 - micros

VINT Interrupt level 0 Percentage above the selectedBOD level

- 4 -

Interrupt level 1 - 13 -

Interrupt level 2 - 25 -

48 External Reset CharacteristicsTable 4-11 External Reset Characteristics

Mode Description Condition Min Typ Max Unit

VVIH_RST Input Voltage for RESET 07timesVDD - VDD+02 V

VVIL_RST Input Low Voltage for RESET -02 - 03timesVDD

tMIN_RST Minimum pulse width on RESET pin(1) - - 25 micros

Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note 1 These parameters are for design guidance only and are not production tested

49 Oscillators and ClocksOperating conditions

bull VDD=3V except where specified otherwise

Table 4-12 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25degC 30V 16 MHz

FREQSEL=1 20

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 15

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 4: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

8 Package Drawings6981 48-Pin TQFP 6982 48-Pin UQFN73

9 Conventions7791 Memory Size and Type7792 Frequency and Time77

10 Data Sheet Revision History78101 RevB - 03201978102 Rev A - 02201878

The Microchip Web Site 79

Customer Change Notification Service79

Customer Support 79

Product Identification System80

Microchip Devices Code Protection Feature 80

Legal Notice80

Trademarks 81

Quality Management System Certified by DNV81

Worldwide Sales and Service82

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 4

1 Block Diagram

INOUT

DATABUS

Clock Generation

BUS Matrix

CPU

USARTn

SPIn

TWIn

CCL

ACn

ADCn

TCAn

TCBn

WOn

RXDTXDXCK

XDIR

MISOMOSISCK

SS

SDA (master)SCL (master)

PORTS

EVSYS

SystemManagement

SLPCTRL

RSTCTRL

CLKCTRL

EVENT

ROUTING

NETWORK

DATABUS

UPDICRC

SRAM

NVMCTRL

Flash

EEPROM

OSC20M

OSC32K

XOSC32K

References

BODVLM

POR

Bandgap

WDT

RTC

CPUINT

M M

S

MS

S

OCD

UPDI

RST

TOSC2

TOSC1

S

EXTCLK

LUTn-OUT

WO

CLKOUT

PAnPBnPCnPDnPEnPFn

RESET

SDA (slave)SCL (slave)

GPIOR

AINPnAINNn

OUT

AINn

EVOUTx

VREFA

LUTn-INn

Detectors

ATmega809160932094809 ndash 48-pinBlock Diagram

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 5

2 Pinout

21 48-pin UQFNTQFP

1

2

3

4

44 43 42 41 40 39 385

6

7

8

9

10

11

33

32

31

30

29

28

27

26

25

2423

37

36

35

34

12

13 14 15 16 17 18 19 20 21 22

45464748

GN

D

VD

DPA5

PA6

PA7

PC0

PC1

PC

4

PC

5

PD

2

PD

3

PD6

PD7

PB0

PD

0

PD

1

PC

3

PA2

PA3

PB1

PB2

PB3

PE1

PE2

PE0

PE3

PC2

GN

D

VD

D

PF2

PF3

PF0 (TOSC1)

PF1 (TOSC2)

PF4

PD5

PC

6

PC

7

UPD

I

PF5

PF6

PA1

PA4

PD

4

PB4

PB5

GND

AVDD

PA0

(EXT

CLK

)

GPIO on VDD power domain

GPIO on AVDD power domain

Clock crystal

Programming debugInput supply

Ground

TWI

Analog functions

Digital functions only

Power Functionality

ATmega809160932094809 ndash 48-pinPinout

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 6

3 IO Multiplexing and Considerations

31 Multiplexed SignalsUQFN48TQFP48

Pin name (12) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn

44 PA0 EXTCLK 0TxD 0-WO0 0-IN0

45 PA1 0RxD 0-WO1 0-IN1

46 PA2 TWI 0XCK SDA(MS) 0-WO2 0-WO EVOUTA 0-IN2

47 PA3 TWI 0XDIR SCL(MS) 0-WO3 1-WO 0-OUT

48 PA4 0TxD(3) MOSI 0-WO4

1 PA5 0RxD(3) MISO 0-WO5

2 PA6 0XCK(3) SCK 0-OUT(3)

3 PA7 CLKOUT OUT 0XDIR(3) SS EVOUTA(3)

4 PB0 3TxD 0-WO0(3)

5 PB1 3RxD 0-WO1(3)

6 PB2 3XCK 0-WO2(3) EVOUTB

7 PB3 3XDIR 0-WO3(3)

8 PB4 3TxD(3) 0-WO4(3) 2-WO(3)

9 PB5 3RxD(3) 0-WO5(3) 3-WO

10 PC0 1TxD MOSI(3) 0-WO0(3) 2-WO 1-IN0

11 PC1 1RxD MISO(3) 0-WO1(3) 3-WO(3) 1-IN1

12 PC2 TWI 1XCK SCK(3) SDA(MS)(3) 0-WO2(3) EVOUTC 1-IN2

13 PC3 TWI 1XDIR SS(3) SCL(MS)(3) 0-WO3(3) 1-OUT

14 VDD

15 GND

16 PC4 1TxD(3) 0-WO4(3)

17 PC5 1RxD(3) 0-WO5(3)

18 PC6 1XCK(3) 1-OUT(3)

19 PC7 1XDIR(3) EVOUTC(3)

20 PD0 AIN0 0-WO0(3) 2-IN0

21 PD1 AIN1 P3 0-WO1(3) 2-IN1

22 PD2 AIN2 P0 0-WO2(3) EVOUTD 2-IN2

23 PD3 AIN3 N0 0-WO3(3) 2-OUT

24 PD4 AIN4 P1 0-WO4(3)

25 PD5 AIN5 N1 0-WO5(3)

26 PD6 AIN6 P2 2-OUT(3)

27 PD7 VREFA AIN7 N2 EVOUTD(3)

28 AVDD

29 GND

30 PE0 AIN8 MOSI(3) 0-WO0(3)

31 PE1 AIN9 MISO(3) 0-WO1(3)

32 PE2 AIN10 SCK(3) 0-WO2(3) EVOUTE

33 PE3 AIN11 SS(3) 0-WO3(3)

34 PF0 TOSC1 2TxD 0-WO0(3) 3-IN0

35 PF1 TOSC2 2RxD 0-WO1(3) 3-IN1

36 PF2 TWI AIN12 2XCK SDA(S)(3) 0-WO2(3) EVOUTF 3-IN2

37 PF3 TWI AIN13 2XDIR SCL(S)(3) 0-WO3(3) 3-OUT

ATmega809160932094809 ndash 48-pinIO Multiplexing and Considerations

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 7

continued

UQFN48TQFP48

Pin name (12) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn

38 PF4 AIN14 2TxD(3) 0-WO4(3) 0-WO(3)

39 PF5 AIN15 2RxD(3) 0-WO5(3) 1-WO(3)

40 PF6 RESET 2XCK(3) 3-OUT(3)

41 UPDI

42 VDD

43 GND

Note 1 Pin names are of type Pxn with x being the PORT instance (ABC ) and n the pin number

Notation for signals is PORTx_PINn All pins can be used as event input2 All pins can be used for external interrupt where pins Px2 and Px6 of each port have full

asynchronous detection3 Alternate pin positions For selecting the alternate positions refer to the PORTMUX documentation

ATmega809160932094809 ndash 48-pinIO Multiplexing and Considerations

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 8

4 Electrical Characteristics

41 DisclaimerAll typical values are measured at T = 25degC and VDD = 3V unless otherwise specified All minimum andmaximum values are valid across operating temperature and voltage unless otherwise specified

Typical values given should be considered for design guidance only and actual part variation aroundthese values is expected

42 Absolute Maximum RatingsStresses beyond those listed in this section may cause permanent damage to the device This is a stressrating only and functional operation of the device at these or other conditions beyond those indicated inthe operational sections of this specification is not implied Exposure to absolute maximum ratingconditions for extended periods may affect device reliability

Table 4-1 Absolute Maximum Ratings

Symbol Description Conditions Min Max UnitVDD Power Supply Voltage -05 6 VIVDD Current into a VDD pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAIGND Current out of a GND pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAVPIN Pin voltage with respect to GND -05 VDD+05 VIPIN IO pin sinksource current -40 40 mAIc1

(1) IO pin injection current except for the RESET pin VpinltGND-06V or55VltVpinle61V49VltVDDle55V

-1 1 mA

Ic2(1) IO pin injection current except for the RESET pin VpinltGND-06V or

Vpinle55VVDDle49V

-15 15 mA

Tstorage Storage temperature -65 150 degC

Note 1 ndash If VPIN is lower than GND-06V then a current limiting resistor is required The negative DC

injection current limiting resistor is calculated as R = (GND-06V ndash Vpin)ICnndash If VPIN is greater than VDD+06V then a current limiting resistor is required The positive DC

injection current limiting resistor is calculated as R = (Vpin-(VDD+06))ICn

43 General Operating RatingsThe device must operate within the ratings listed in this section in order for all other electricalcharacteristics and typical characteristics of the device to be valid

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 9

Table 4-2 General Operating Conditions

Symbol Description Condition Min Max Unit

VDD Operating Supply Voltage 18(1) 55 V

TA Operating temperature range -40 125 degC

Note 1 Operation is guaranteed down to 18V or VBOD with BODLEVEL0 whichever is lower

Table 4-3 Operating Voltage and Frequency

Symbol Description Condition Min Max Unit

fCLK_CPU Nominal operating system clock frequency VDD=[18 55]VTA=[-40 105]degC(1)(4)

0 5 MHz

VDD=[27 55]VTA=[-40 105]degC(2)(4)

0 10

VDD=[45 55]VTA=[-40 105]degC(3)(4)

0 20

VDD=[27 55]VTA=[-40 125]degC(2)

0 8

VDD=[45 55]VTA=[-40 125]degC(2)

0 16

Note 1 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL02 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL23 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL74 These specifications do not apply to automotive range parts (-VAO)

The maximum CPU clock frequency depends on VDD As shown in the figure below the MaximumFrequency vs VDD is linear between 18V lt VDD lt 27V and 27V lt VDD lt 45V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 10

Figure 4-1 Maximum Frequency vs VDD for [-40 105]degC

5MHz

10MHz

20MHz

18V 55V27V 45V

Safe Operating Area

44 Power Considerations

The average die junction temperature TJ (in degC) is given from the formula

TJ = TA+PD RθJA

where PD is the total power dissipation

The total thermal resistance of a package (RθJA) can be separated into two components RθJC and RθCArepresenting the barrier to heat flow from the semiconductor junction to the package (case) surface (RθJC)and from the case to the outside ambient air (RθCA) These terms are related by the equation

RθJA = RθJC + RθCA

RθJC is device related and cannot be influenced by the user However RθCA is user dependent and canbe minimized by thermal management techniques such as heat sinks ambient air cooling and thermalconvection Thus good thermal management on the part of the user can significantly reduce RθCA so thatRθJA approximately equals RθJC

The power dissipation curve is negatively sloped as ambient temperature increase The maximum powerdissipation is therefore at minimum ambient temperature while the highest junction temperature occurs atthe maximum ambient temperature

Table 4-4 Power Dissipation and Junction Temperature vs Temperature

Package TA Range RθJA (degCW) PD (W) Typical TJ - TA(degC) Typical

UQFN48 -40degC to 125degC 10

TQFP48 -40degC to 125degC 10

45 Power ConsumptionThe values are measured power consumption under the following conditions except where noted

bull VDD=3Vbull TA=25degCbull OSC20M used as system clock source except where otherwise specified

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 11

bull System power consumption measured with peripherals disabled and IO ports driven low with inputsdisabled

Table 4-5 Power Consumption in Active and Idle Mode

Mode Description Condition Typ Max Unit

Active Active power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 85 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 43 - mA

VDD=3V 23 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 22 - mA

VDD=3V 12 - mA

VDD=2V 075 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 164 - microA

VDD=3V 90 - microA

VDD=2V 60 - microA

Idle Idle power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 28 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 14 - mA

VDD=3V 08 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 07 - mA

VDD=3V 04 - mA

VDD=2V 025 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 56 - microA

VDD=3V 28 - microA

VDD=2V 18 - microA

Table 4-6 Power Consumption in Power-Down Standby and Reset Mode

Mode Description Condition Typ25degC

Max85degC(1)

Max125degC

Unit

Standby Standby powerconsumption

RTC running at 1024kHz from externalXOSC32K (CL=75pF)

VDD=3V 07 - - microA

RTC running at 1024kHz from internalOSCULP32K

VDD=3V 07 60 160 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 12

continuedMode Description Condition Typ

25degCMax85degC(1)

Max125degC

Unit

PowerDownStandby

Power downStandby powerconsumption are thesame when allperipherals arestopped

All peripheralsstopped

VDD=3V 01 50 150 microA

Reset Reset powerconsumption

RESET line pulled low VDD=3V 100 - - microA

Note 1 These parameters are for design guidance only and are not tested

46 Peripherals Power ConsumptionThe table below can be used to calculate the additional current consumption for the different IOperipherals in the various operating modes

Some peripherals will request the clock to be enabled when operating in STANDBY See the peripheralchapter for further information

Operating conditionsbull VDD=3Vbull T=25degCbull OSC20M at 1 MHz used as system clock source except where otherwise specifiedbull In Idle Sleep mode except where otherwise specified

Table 4-7 Peripherals Power Consumption

Peripheral Conditions Typ(1) Unit

BOD Continuous 19 microA

Sampling 1 kHz 12

TCA 16-bit count 1 MHz 130 microA

TCB 16-bit count 1 MHz 74 microA

RTC 16-bit count OSCULP32K 12 microA

WDT (including OSCULP32K) 07 microA

OSC20M 130 microA

AC Fast Mode(2) 92 microA

Low-Power Mode(2) 45 microA

ADC(3) 50 ksps 330 microA

100 ksps 340 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 13

continuedPeripheral Conditions Typ(1) Unit

XOSC32K CL=75 pF 05 microA

OSCULP32K 04 microA

USART Enable 9600 Baud 130 microA

SPI (Master) Enable 100 kHz 21 microA

TWI (Master) Enable 100 kHz 240 microA

TWI (Slave) Enable 100 kHz 170 microA

Flash programming Erase Operation 15 mA

Write Operation 30

Note 1 Current consumption of the module only To calculate the total internal power consumption of the

microcontroller add this value to the base power consumption given in ldquoPower Consumptionrdquosection in electrical characteristics

2 CPU in Standby mode3 Average power consumption with ADC active in Free-Running mode

47 BOD and POR CharacteristicsTable 4-8 Power Supply Characteristics

Symbol Description Condition Min Typ Max Unit

SRON(1) Power-on Slope - - 100(2) Vms

Note 1 For design guidance only and not tested in production2 A slope faster than the maximum rating can trigger a reset of the device if changing the voltage

level after an initial power-up

Table 4-9 Power-on Reset (POR) Characteristics

Symbol Description Condition Min Typ Max Unit

VPOR POR threshold voltage on VDDfalling

VDD fallsrises at 05Vms or slower 08(1) - 16(1) V

POR threshold voltage on VDDrising

14(1) - 18

Note 1 For design guidance only and not tested in production

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 14

Table 4-10 Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min Typ Max Unit

VBOD BOD detection level (fallingrising)

BODLEVEL0 17 18 20 V

BODLEVEL2 24 26 29

BODLEVEL7 39 43 45

VHYS Hysteresis BODLEVEL0 - 25 - mV

BODLEVEL2 - 40 -

BODLEVEL7 - 80 -

tBOD Detection time Continuous - 7 - micros

Sampled 1 kHz - 1 - ms

Sampled 125 Hz - 8 -

tstartup Start-up time Time from enable to ready - 40 - micros

VINT Interrupt level 0 Percentage above the selectedBOD level

- 4 -

Interrupt level 1 - 13 -

Interrupt level 2 - 25 -

48 External Reset CharacteristicsTable 4-11 External Reset Characteristics

Mode Description Condition Min Typ Max Unit

VVIH_RST Input Voltage for RESET 07timesVDD - VDD+02 V

VVIL_RST Input Low Voltage for RESET -02 - 03timesVDD

tMIN_RST Minimum pulse width on RESET pin(1) - - 25 micros

Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note 1 These parameters are for design guidance only and are not production tested

49 Oscillators and ClocksOperating conditions

bull VDD=3V except where specified otherwise

Table 4-12 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25degC 30V 16 MHz

FREQSEL=1 20

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 15

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 5: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

1 Block Diagram

INOUT

DATABUS

Clock Generation

BUS Matrix

CPU

USARTn

SPIn

TWIn

CCL

ACn

ADCn

TCAn

TCBn

WOn

RXDTXDXCK

XDIR

MISOMOSISCK

SS

SDA (master)SCL (master)

PORTS

EVSYS

SystemManagement

SLPCTRL

RSTCTRL

CLKCTRL

EVENT

ROUTING

NETWORK

DATABUS

UPDICRC

SRAM

NVMCTRL

Flash

EEPROM

OSC20M

OSC32K

XOSC32K

References

BODVLM

POR

Bandgap

WDT

RTC

CPUINT

M M

S

MS

S

OCD

UPDI

RST

TOSC2

TOSC1

S

EXTCLK

LUTn-OUT

WO

CLKOUT

PAnPBnPCnPDnPEnPFn

RESET

SDA (slave)SCL (slave)

GPIOR

AINPnAINNn

OUT

AINn

EVOUTx

VREFA

LUTn-INn

Detectors

ATmega809160932094809 ndash 48-pinBlock Diagram

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 5

2 Pinout

21 48-pin UQFNTQFP

1

2

3

4

44 43 42 41 40 39 385

6

7

8

9

10

11

33

32

31

30

29

28

27

26

25

2423

37

36

35

34

12

13 14 15 16 17 18 19 20 21 22

45464748

GN

D

VD

DPA5

PA6

PA7

PC0

PC1

PC

4

PC

5

PD

2

PD

3

PD6

PD7

PB0

PD

0

PD

1

PC

3

PA2

PA3

PB1

PB2

PB3

PE1

PE2

PE0

PE3

PC2

GN

D

VD

D

PF2

PF3

PF0 (TOSC1)

PF1 (TOSC2)

PF4

PD5

PC

6

PC

7

UPD

I

PF5

PF6

PA1

PA4

PD

4

PB4

PB5

GND

AVDD

PA0

(EXT

CLK

)

GPIO on VDD power domain

GPIO on AVDD power domain

Clock crystal

Programming debugInput supply

Ground

TWI

Analog functions

Digital functions only

Power Functionality

ATmega809160932094809 ndash 48-pinPinout

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 6

3 IO Multiplexing and Considerations

31 Multiplexed SignalsUQFN48TQFP48

Pin name (12) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn

44 PA0 EXTCLK 0TxD 0-WO0 0-IN0

45 PA1 0RxD 0-WO1 0-IN1

46 PA2 TWI 0XCK SDA(MS) 0-WO2 0-WO EVOUTA 0-IN2

47 PA3 TWI 0XDIR SCL(MS) 0-WO3 1-WO 0-OUT

48 PA4 0TxD(3) MOSI 0-WO4

1 PA5 0RxD(3) MISO 0-WO5

2 PA6 0XCK(3) SCK 0-OUT(3)

3 PA7 CLKOUT OUT 0XDIR(3) SS EVOUTA(3)

4 PB0 3TxD 0-WO0(3)

5 PB1 3RxD 0-WO1(3)

6 PB2 3XCK 0-WO2(3) EVOUTB

7 PB3 3XDIR 0-WO3(3)

8 PB4 3TxD(3) 0-WO4(3) 2-WO(3)

9 PB5 3RxD(3) 0-WO5(3) 3-WO

10 PC0 1TxD MOSI(3) 0-WO0(3) 2-WO 1-IN0

11 PC1 1RxD MISO(3) 0-WO1(3) 3-WO(3) 1-IN1

12 PC2 TWI 1XCK SCK(3) SDA(MS)(3) 0-WO2(3) EVOUTC 1-IN2

13 PC3 TWI 1XDIR SS(3) SCL(MS)(3) 0-WO3(3) 1-OUT

14 VDD

15 GND

16 PC4 1TxD(3) 0-WO4(3)

17 PC5 1RxD(3) 0-WO5(3)

18 PC6 1XCK(3) 1-OUT(3)

19 PC7 1XDIR(3) EVOUTC(3)

20 PD0 AIN0 0-WO0(3) 2-IN0

21 PD1 AIN1 P3 0-WO1(3) 2-IN1

22 PD2 AIN2 P0 0-WO2(3) EVOUTD 2-IN2

23 PD3 AIN3 N0 0-WO3(3) 2-OUT

24 PD4 AIN4 P1 0-WO4(3)

25 PD5 AIN5 N1 0-WO5(3)

26 PD6 AIN6 P2 2-OUT(3)

27 PD7 VREFA AIN7 N2 EVOUTD(3)

28 AVDD

29 GND

30 PE0 AIN8 MOSI(3) 0-WO0(3)

31 PE1 AIN9 MISO(3) 0-WO1(3)

32 PE2 AIN10 SCK(3) 0-WO2(3) EVOUTE

33 PE3 AIN11 SS(3) 0-WO3(3)

34 PF0 TOSC1 2TxD 0-WO0(3) 3-IN0

35 PF1 TOSC2 2RxD 0-WO1(3) 3-IN1

36 PF2 TWI AIN12 2XCK SDA(S)(3) 0-WO2(3) EVOUTF 3-IN2

37 PF3 TWI AIN13 2XDIR SCL(S)(3) 0-WO3(3) 3-OUT

ATmega809160932094809 ndash 48-pinIO Multiplexing and Considerations

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 7

continued

UQFN48TQFP48

Pin name (12) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn

38 PF4 AIN14 2TxD(3) 0-WO4(3) 0-WO(3)

39 PF5 AIN15 2RxD(3) 0-WO5(3) 1-WO(3)

40 PF6 RESET 2XCK(3) 3-OUT(3)

41 UPDI

42 VDD

43 GND

Note 1 Pin names are of type Pxn with x being the PORT instance (ABC ) and n the pin number

Notation for signals is PORTx_PINn All pins can be used as event input2 All pins can be used for external interrupt where pins Px2 and Px6 of each port have full

asynchronous detection3 Alternate pin positions For selecting the alternate positions refer to the PORTMUX documentation

ATmega809160932094809 ndash 48-pinIO Multiplexing and Considerations

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 8

4 Electrical Characteristics

41 DisclaimerAll typical values are measured at T = 25degC and VDD = 3V unless otherwise specified All minimum andmaximum values are valid across operating temperature and voltage unless otherwise specified

Typical values given should be considered for design guidance only and actual part variation aroundthese values is expected

42 Absolute Maximum RatingsStresses beyond those listed in this section may cause permanent damage to the device This is a stressrating only and functional operation of the device at these or other conditions beyond those indicated inthe operational sections of this specification is not implied Exposure to absolute maximum ratingconditions for extended periods may affect device reliability

Table 4-1 Absolute Maximum Ratings

Symbol Description Conditions Min Max UnitVDD Power Supply Voltage -05 6 VIVDD Current into a VDD pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAIGND Current out of a GND pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAVPIN Pin voltage with respect to GND -05 VDD+05 VIPIN IO pin sinksource current -40 40 mAIc1

(1) IO pin injection current except for the RESET pin VpinltGND-06V or55VltVpinle61V49VltVDDle55V

-1 1 mA

Ic2(1) IO pin injection current except for the RESET pin VpinltGND-06V or

Vpinle55VVDDle49V

-15 15 mA

Tstorage Storage temperature -65 150 degC

Note 1 ndash If VPIN is lower than GND-06V then a current limiting resistor is required The negative DC

injection current limiting resistor is calculated as R = (GND-06V ndash Vpin)ICnndash If VPIN is greater than VDD+06V then a current limiting resistor is required The positive DC

injection current limiting resistor is calculated as R = (Vpin-(VDD+06))ICn

43 General Operating RatingsThe device must operate within the ratings listed in this section in order for all other electricalcharacteristics and typical characteristics of the device to be valid

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 9

Table 4-2 General Operating Conditions

Symbol Description Condition Min Max Unit

VDD Operating Supply Voltage 18(1) 55 V

TA Operating temperature range -40 125 degC

Note 1 Operation is guaranteed down to 18V or VBOD with BODLEVEL0 whichever is lower

Table 4-3 Operating Voltage and Frequency

Symbol Description Condition Min Max Unit

fCLK_CPU Nominal operating system clock frequency VDD=[18 55]VTA=[-40 105]degC(1)(4)

0 5 MHz

VDD=[27 55]VTA=[-40 105]degC(2)(4)

0 10

VDD=[45 55]VTA=[-40 105]degC(3)(4)

0 20

VDD=[27 55]VTA=[-40 125]degC(2)

0 8

VDD=[45 55]VTA=[-40 125]degC(2)

0 16

Note 1 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL02 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL23 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL74 These specifications do not apply to automotive range parts (-VAO)

The maximum CPU clock frequency depends on VDD As shown in the figure below the MaximumFrequency vs VDD is linear between 18V lt VDD lt 27V and 27V lt VDD lt 45V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 10

Figure 4-1 Maximum Frequency vs VDD for [-40 105]degC

5MHz

10MHz

20MHz

18V 55V27V 45V

Safe Operating Area

44 Power Considerations

The average die junction temperature TJ (in degC) is given from the formula

TJ = TA+PD RθJA

where PD is the total power dissipation

The total thermal resistance of a package (RθJA) can be separated into two components RθJC and RθCArepresenting the barrier to heat flow from the semiconductor junction to the package (case) surface (RθJC)and from the case to the outside ambient air (RθCA) These terms are related by the equation

RθJA = RθJC + RθCA

RθJC is device related and cannot be influenced by the user However RθCA is user dependent and canbe minimized by thermal management techniques such as heat sinks ambient air cooling and thermalconvection Thus good thermal management on the part of the user can significantly reduce RθCA so thatRθJA approximately equals RθJC

The power dissipation curve is negatively sloped as ambient temperature increase The maximum powerdissipation is therefore at minimum ambient temperature while the highest junction temperature occurs atthe maximum ambient temperature

Table 4-4 Power Dissipation and Junction Temperature vs Temperature

Package TA Range RθJA (degCW) PD (W) Typical TJ - TA(degC) Typical

UQFN48 -40degC to 125degC 10

TQFP48 -40degC to 125degC 10

45 Power ConsumptionThe values are measured power consumption under the following conditions except where noted

bull VDD=3Vbull TA=25degCbull OSC20M used as system clock source except where otherwise specified

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 11

bull System power consumption measured with peripherals disabled and IO ports driven low with inputsdisabled

Table 4-5 Power Consumption in Active and Idle Mode

Mode Description Condition Typ Max Unit

Active Active power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 85 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 43 - mA

VDD=3V 23 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 22 - mA

VDD=3V 12 - mA

VDD=2V 075 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 164 - microA

VDD=3V 90 - microA

VDD=2V 60 - microA

Idle Idle power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 28 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 14 - mA

VDD=3V 08 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 07 - mA

VDD=3V 04 - mA

VDD=2V 025 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 56 - microA

VDD=3V 28 - microA

VDD=2V 18 - microA

Table 4-6 Power Consumption in Power-Down Standby and Reset Mode

Mode Description Condition Typ25degC

Max85degC(1)

Max125degC

Unit

Standby Standby powerconsumption

RTC running at 1024kHz from externalXOSC32K (CL=75pF)

VDD=3V 07 - - microA

RTC running at 1024kHz from internalOSCULP32K

VDD=3V 07 60 160 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 12

continuedMode Description Condition Typ

25degCMax85degC(1)

Max125degC

Unit

PowerDownStandby

Power downStandby powerconsumption are thesame when allperipherals arestopped

All peripheralsstopped

VDD=3V 01 50 150 microA

Reset Reset powerconsumption

RESET line pulled low VDD=3V 100 - - microA

Note 1 These parameters are for design guidance only and are not tested

46 Peripherals Power ConsumptionThe table below can be used to calculate the additional current consumption for the different IOperipherals in the various operating modes

Some peripherals will request the clock to be enabled when operating in STANDBY See the peripheralchapter for further information

Operating conditionsbull VDD=3Vbull T=25degCbull OSC20M at 1 MHz used as system clock source except where otherwise specifiedbull In Idle Sleep mode except where otherwise specified

Table 4-7 Peripherals Power Consumption

Peripheral Conditions Typ(1) Unit

BOD Continuous 19 microA

Sampling 1 kHz 12

TCA 16-bit count 1 MHz 130 microA

TCB 16-bit count 1 MHz 74 microA

RTC 16-bit count OSCULP32K 12 microA

WDT (including OSCULP32K) 07 microA

OSC20M 130 microA

AC Fast Mode(2) 92 microA

Low-Power Mode(2) 45 microA

ADC(3) 50 ksps 330 microA

100 ksps 340 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 13

continuedPeripheral Conditions Typ(1) Unit

XOSC32K CL=75 pF 05 microA

OSCULP32K 04 microA

USART Enable 9600 Baud 130 microA

SPI (Master) Enable 100 kHz 21 microA

TWI (Master) Enable 100 kHz 240 microA

TWI (Slave) Enable 100 kHz 170 microA

Flash programming Erase Operation 15 mA

Write Operation 30

Note 1 Current consumption of the module only To calculate the total internal power consumption of the

microcontroller add this value to the base power consumption given in ldquoPower Consumptionrdquosection in electrical characteristics

2 CPU in Standby mode3 Average power consumption with ADC active in Free-Running mode

47 BOD and POR CharacteristicsTable 4-8 Power Supply Characteristics

Symbol Description Condition Min Typ Max Unit

SRON(1) Power-on Slope - - 100(2) Vms

Note 1 For design guidance only and not tested in production2 A slope faster than the maximum rating can trigger a reset of the device if changing the voltage

level after an initial power-up

Table 4-9 Power-on Reset (POR) Characteristics

Symbol Description Condition Min Typ Max Unit

VPOR POR threshold voltage on VDDfalling

VDD fallsrises at 05Vms or slower 08(1) - 16(1) V

POR threshold voltage on VDDrising

14(1) - 18

Note 1 For design guidance only and not tested in production

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 14

Table 4-10 Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min Typ Max Unit

VBOD BOD detection level (fallingrising)

BODLEVEL0 17 18 20 V

BODLEVEL2 24 26 29

BODLEVEL7 39 43 45

VHYS Hysteresis BODLEVEL0 - 25 - mV

BODLEVEL2 - 40 -

BODLEVEL7 - 80 -

tBOD Detection time Continuous - 7 - micros

Sampled 1 kHz - 1 - ms

Sampled 125 Hz - 8 -

tstartup Start-up time Time from enable to ready - 40 - micros

VINT Interrupt level 0 Percentage above the selectedBOD level

- 4 -

Interrupt level 1 - 13 -

Interrupt level 2 - 25 -

48 External Reset CharacteristicsTable 4-11 External Reset Characteristics

Mode Description Condition Min Typ Max Unit

VVIH_RST Input Voltage for RESET 07timesVDD - VDD+02 V

VVIL_RST Input Low Voltage for RESET -02 - 03timesVDD

tMIN_RST Minimum pulse width on RESET pin(1) - - 25 micros

Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note 1 These parameters are for design guidance only and are not production tested

49 Oscillators and ClocksOperating conditions

bull VDD=3V except where specified otherwise

Table 4-12 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25degC 30V 16 MHz

FREQSEL=1 20

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 15

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 6: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

2 Pinout

21 48-pin UQFNTQFP

1

2

3

4

44 43 42 41 40 39 385

6

7

8

9

10

11

33

32

31

30

29

28

27

26

25

2423

37

36

35

34

12

13 14 15 16 17 18 19 20 21 22

45464748

GN

D

VD

DPA5

PA6

PA7

PC0

PC1

PC

4

PC

5

PD

2

PD

3

PD6

PD7

PB0

PD

0

PD

1

PC

3

PA2

PA3

PB1

PB2

PB3

PE1

PE2

PE0

PE3

PC2

GN

D

VD

D

PF2

PF3

PF0 (TOSC1)

PF1 (TOSC2)

PF4

PD5

PC

6

PC

7

UPD

I

PF5

PF6

PA1

PA4

PD

4

PB4

PB5

GND

AVDD

PA0

(EXT

CLK

)

GPIO on VDD power domain

GPIO on AVDD power domain

Clock crystal

Programming debugInput supply

Ground

TWI

Analog functions

Digital functions only

Power Functionality

ATmega809160932094809 ndash 48-pinPinout

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 6

3 IO Multiplexing and Considerations

31 Multiplexed SignalsUQFN48TQFP48

Pin name (12) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn

44 PA0 EXTCLK 0TxD 0-WO0 0-IN0

45 PA1 0RxD 0-WO1 0-IN1

46 PA2 TWI 0XCK SDA(MS) 0-WO2 0-WO EVOUTA 0-IN2

47 PA3 TWI 0XDIR SCL(MS) 0-WO3 1-WO 0-OUT

48 PA4 0TxD(3) MOSI 0-WO4

1 PA5 0RxD(3) MISO 0-WO5

2 PA6 0XCK(3) SCK 0-OUT(3)

3 PA7 CLKOUT OUT 0XDIR(3) SS EVOUTA(3)

4 PB0 3TxD 0-WO0(3)

5 PB1 3RxD 0-WO1(3)

6 PB2 3XCK 0-WO2(3) EVOUTB

7 PB3 3XDIR 0-WO3(3)

8 PB4 3TxD(3) 0-WO4(3) 2-WO(3)

9 PB5 3RxD(3) 0-WO5(3) 3-WO

10 PC0 1TxD MOSI(3) 0-WO0(3) 2-WO 1-IN0

11 PC1 1RxD MISO(3) 0-WO1(3) 3-WO(3) 1-IN1

12 PC2 TWI 1XCK SCK(3) SDA(MS)(3) 0-WO2(3) EVOUTC 1-IN2

13 PC3 TWI 1XDIR SS(3) SCL(MS)(3) 0-WO3(3) 1-OUT

14 VDD

15 GND

16 PC4 1TxD(3) 0-WO4(3)

17 PC5 1RxD(3) 0-WO5(3)

18 PC6 1XCK(3) 1-OUT(3)

19 PC7 1XDIR(3) EVOUTC(3)

20 PD0 AIN0 0-WO0(3) 2-IN0

21 PD1 AIN1 P3 0-WO1(3) 2-IN1

22 PD2 AIN2 P0 0-WO2(3) EVOUTD 2-IN2

23 PD3 AIN3 N0 0-WO3(3) 2-OUT

24 PD4 AIN4 P1 0-WO4(3)

25 PD5 AIN5 N1 0-WO5(3)

26 PD6 AIN6 P2 2-OUT(3)

27 PD7 VREFA AIN7 N2 EVOUTD(3)

28 AVDD

29 GND

30 PE0 AIN8 MOSI(3) 0-WO0(3)

31 PE1 AIN9 MISO(3) 0-WO1(3)

32 PE2 AIN10 SCK(3) 0-WO2(3) EVOUTE

33 PE3 AIN11 SS(3) 0-WO3(3)

34 PF0 TOSC1 2TxD 0-WO0(3) 3-IN0

35 PF1 TOSC2 2RxD 0-WO1(3) 3-IN1

36 PF2 TWI AIN12 2XCK SDA(S)(3) 0-WO2(3) EVOUTF 3-IN2

37 PF3 TWI AIN13 2XDIR SCL(S)(3) 0-WO3(3) 3-OUT

ATmega809160932094809 ndash 48-pinIO Multiplexing and Considerations

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 7

continued

UQFN48TQFP48

Pin name (12) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn

38 PF4 AIN14 2TxD(3) 0-WO4(3) 0-WO(3)

39 PF5 AIN15 2RxD(3) 0-WO5(3) 1-WO(3)

40 PF6 RESET 2XCK(3) 3-OUT(3)

41 UPDI

42 VDD

43 GND

Note 1 Pin names are of type Pxn with x being the PORT instance (ABC ) and n the pin number

Notation for signals is PORTx_PINn All pins can be used as event input2 All pins can be used for external interrupt where pins Px2 and Px6 of each port have full

asynchronous detection3 Alternate pin positions For selecting the alternate positions refer to the PORTMUX documentation

ATmega809160932094809 ndash 48-pinIO Multiplexing and Considerations

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 8

4 Electrical Characteristics

41 DisclaimerAll typical values are measured at T = 25degC and VDD = 3V unless otherwise specified All minimum andmaximum values are valid across operating temperature and voltage unless otherwise specified

Typical values given should be considered for design guidance only and actual part variation aroundthese values is expected

42 Absolute Maximum RatingsStresses beyond those listed in this section may cause permanent damage to the device This is a stressrating only and functional operation of the device at these or other conditions beyond those indicated inthe operational sections of this specification is not implied Exposure to absolute maximum ratingconditions for extended periods may affect device reliability

Table 4-1 Absolute Maximum Ratings

Symbol Description Conditions Min Max UnitVDD Power Supply Voltage -05 6 VIVDD Current into a VDD pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAIGND Current out of a GND pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAVPIN Pin voltage with respect to GND -05 VDD+05 VIPIN IO pin sinksource current -40 40 mAIc1

(1) IO pin injection current except for the RESET pin VpinltGND-06V or55VltVpinle61V49VltVDDle55V

-1 1 mA

Ic2(1) IO pin injection current except for the RESET pin VpinltGND-06V or

Vpinle55VVDDle49V

-15 15 mA

Tstorage Storage temperature -65 150 degC

Note 1 ndash If VPIN is lower than GND-06V then a current limiting resistor is required The negative DC

injection current limiting resistor is calculated as R = (GND-06V ndash Vpin)ICnndash If VPIN is greater than VDD+06V then a current limiting resistor is required The positive DC

injection current limiting resistor is calculated as R = (Vpin-(VDD+06))ICn

43 General Operating RatingsThe device must operate within the ratings listed in this section in order for all other electricalcharacteristics and typical characteristics of the device to be valid

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 9

Table 4-2 General Operating Conditions

Symbol Description Condition Min Max Unit

VDD Operating Supply Voltage 18(1) 55 V

TA Operating temperature range -40 125 degC

Note 1 Operation is guaranteed down to 18V or VBOD with BODLEVEL0 whichever is lower

Table 4-3 Operating Voltage and Frequency

Symbol Description Condition Min Max Unit

fCLK_CPU Nominal operating system clock frequency VDD=[18 55]VTA=[-40 105]degC(1)(4)

0 5 MHz

VDD=[27 55]VTA=[-40 105]degC(2)(4)

0 10

VDD=[45 55]VTA=[-40 105]degC(3)(4)

0 20

VDD=[27 55]VTA=[-40 125]degC(2)

0 8

VDD=[45 55]VTA=[-40 125]degC(2)

0 16

Note 1 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL02 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL23 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL74 These specifications do not apply to automotive range parts (-VAO)

The maximum CPU clock frequency depends on VDD As shown in the figure below the MaximumFrequency vs VDD is linear between 18V lt VDD lt 27V and 27V lt VDD lt 45V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 10

Figure 4-1 Maximum Frequency vs VDD for [-40 105]degC

5MHz

10MHz

20MHz

18V 55V27V 45V

Safe Operating Area

44 Power Considerations

The average die junction temperature TJ (in degC) is given from the formula

TJ = TA+PD RθJA

where PD is the total power dissipation

The total thermal resistance of a package (RθJA) can be separated into two components RθJC and RθCArepresenting the barrier to heat flow from the semiconductor junction to the package (case) surface (RθJC)and from the case to the outside ambient air (RθCA) These terms are related by the equation

RθJA = RθJC + RθCA

RθJC is device related and cannot be influenced by the user However RθCA is user dependent and canbe minimized by thermal management techniques such as heat sinks ambient air cooling and thermalconvection Thus good thermal management on the part of the user can significantly reduce RθCA so thatRθJA approximately equals RθJC

The power dissipation curve is negatively sloped as ambient temperature increase The maximum powerdissipation is therefore at minimum ambient temperature while the highest junction temperature occurs atthe maximum ambient temperature

Table 4-4 Power Dissipation and Junction Temperature vs Temperature

Package TA Range RθJA (degCW) PD (W) Typical TJ - TA(degC) Typical

UQFN48 -40degC to 125degC 10

TQFP48 -40degC to 125degC 10

45 Power ConsumptionThe values are measured power consumption under the following conditions except where noted

bull VDD=3Vbull TA=25degCbull OSC20M used as system clock source except where otherwise specified

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 11

bull System power consumption measured with peripherals disabled and IO ports driven low with inputsdisabled

Table 4-5 Power Consumption in Active and Idle Mode

Mode Description Condition Typ Max Unit

Active Active power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 85 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 43 - mA

VDD=3V 23 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 22 - mA

VDD=3V 12 - mA

VDD=2V 075 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 164 - microA

VDD=3V 90 - microA

VDD=2V 60 - microA

Idle Idle power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 28 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 14 - mA

VDD=3V 08 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 07 - mA

VDD=3V 04 - mA

VDD=2V 025 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 56 - microA

VDD=3V 28 - microA

VDD=2V 18 - microA

Table 4-6 Power Consumption in Power-Down Standby and Reset Mode

Mode Description Condition Typ25degC

Max85degC(1)

Max125degC

Unit

Standby Standby powerconsumption

RTC running at 1024kHz from externalXOSC32K (CL=75pF)

VDD=3V 07 - - microA

RTC running at 1024kHz from internalOSCULP32K

VDD=3V 07 60 160 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 12

continuedMode Description Condition Typ

25degCMax85degC(1)

Max125degC

Unit

PowerDownStandby

Power downStandby powerconsumption are thesame when allperipherals arestopped

All peripheralsstopped

VDD=3V 01 50 150 microA

Reset Reset powerconsumption

RESET line pulled low VDD=3V 100 - - microA

Note 1 These parameters are for design guidance only and are not tested

46 Peripherals Power ConsumptionThe table below can be used to calculate the additional current consumption for the different IOperipherals in the various operating modes

Some peripherals will request the clock to be enabled when operating in STANDBY See the peripheralchapter for further information

Operating conditionsbull VDD=3Vbull T=25degCbull OSC20M at 1 MHz used as system clock source except where otherwise specifiedbull In Idle Sleep mode except where otherwise specified

Table 4-7 Peripherals Power Consumption

Peripheral Conditions Typ(1) Unit

BOD Continuous 19 microA

Sampling 1 kHz 12

TCA 16-bit count 1 MHz 130 microA

TCB 16-bit count 1 MHz 74 microA

RTC 16-bit count OSCULP32K 12 microA

WDT (including OSCULP32K) 07 microA

OSC20M 130 microA

AC Fast Mode(2) 92 microA

Low-Power Mode(2) 45 microA

ADC(3) 50 ksps 330 microA

100 ksps 340 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 13

continuedPeripheral Conditions Typ(1) Unit

XOSC32K CL=75 pF 05 microA

OSCULP32K 04 microA

USART Enable 9600 Baud 130 microA

SPI (Master) Enable 100 kHz 21 microA

TWI (Master) Enable 100 kHz 240 microA

TWI (Slave) Enable 100 kHz 170 microA

Flash programming Erase Operation 15 mA

Write Operation 30

Note 1 Current consumption of the module only To calculate the total internal power consumption of the

microcontroller add this value to the base power consumption given in ldquoPower Consumptionrdquosection in electrical characteristics

2 CPU in Standby mode3 Average power consumption with ADC active in Free-Running mode

47 BOD and POR CharacteristicsTable 4-8 Power Supply Characteristics

Symbol Description Condition Min Typ Max Unit

SRON(1) Power-on Slope - - 100(2) Vms

Note 1 For design guidance only and not tested in production2 A slope faster than the maximum rating can trigger a reset of the device if changing the voltage

level after an initial power-up

Table 4-9 Power-on Reset (POR) Characteristics

Symbol Description Condition Min Typ Max Unit

VPOR POR threshold voltage on VDDfalling

VDD fallsrises at 05Vms or slower 08(1) - 16(1) V

POR threshold voltage on VDDrising

14(1) - 18

Note 1 For design guidance only and not tested in production

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 14

Table 4-10 Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min Typ Max Unit

VBOD BOD detection level (fallingrising)

BODLEVEL0 17 18 20 V

BODLEVEL2 24 26 29

BODLEVEL7 39 43 45

VHYS Hysteresis BODLEVEL0 - 25 - mV

BODLEVEL2 - 40 -

BODLEVEL7 - 80 -

tBOD Detection time Continuous - 7 - micros

Sampled 1 kHz - 1 - ms

Sampled 125 Hz - 8 -

tstartup Start-up time Time from enable to ready - 40 - micros

VINT Interrupt level 0 Percentage above the selectedBOD level

- 4 -

Interrupt level 1 - 13 -

Interrupt level 2 - 25 -

48 External Reset CharacteristicsTable 4-11 External Reset Characteristics

Mode Description Condition Min Typ Max Unit

VVIH_RST Input Voltage for RESET 07timesVDD - VDD+02 V

VVIL_RST Input Low Voltage for RESET -02 - 03timesVDD

tMIN_RST Minimum pulse width on RESET pin(1) - - 25 micros

Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note 1 These parameters are for design guidance only and are not production tested

49 Oscillators and ClocksOperating conditions

bull VDD=3V except where specified otherwise

Table 4-12 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25degC 30V 16 MHz

FREQSEL=1 20

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 15

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 7: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

3 IO Multiplexing and Considerations

31 Multiplexed SignalsUQFN48TQFP48

Pin name (12) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn

44 PA0 EXTCLK 0TxD 0-WO0 0-IN0

45 PA1 0RxD 0-WO1 0-IN1

46 PA2 TWI 0XCK SDA(MS) 0-WO2 0-WO EVOUTA 0-IN2

47 PA3 TWI 0XDIR SCL(MS) 0-WO3 1-WO 0-OUT

48 PA4 0TxD(3) MOSI 0-WO4

1 PA5 0RxD(3) MISO 0-WO5

2 PA6 0XCK(3) SCK 0-OUT(3)

3 PA7 CLKOUT OUT 0XDIR(3) SS EVOUTA(3)

4 PB0 3TxD 0-WO0(3)

5 PB1 3RxD 0-WO1(3)

6 PB2 3XCK 0-WO2(3) EVOUTB

7 PB3 3XDIR 0-WO3(3)

8 PB4 3TxD(3) 0-WO4(3) 2-WO(3)

9 PB5 3RxD(3) 0-WO5(3) 3-WO

10 PC0 1TxD MOSI(3) 0-WO0(3) 2-WO 1-IN0

11 PC1 1RxD MISO(3) 0-WO1(3) 3-WO(3) 1-IN1

12 PC2 TWI 1XCK SCK(3) SDA(MS)(3) 0-WO2(3) EVOUTC 1-IN2

13 PC3 TWI 1XDIR SS(3) SCL(MS)(3) 0-WO3(3) 1-OUT

14 VDD

15 GND

16 PC4 1TxD(3) 0-WO4(3)

17 PC5 1RxD(3) 0-WO5(3)

18 PC6 1XCK(3) 1-OUT(3)

19 PC7 1XDIR(3) EVOUTC(3)

20 PD0 AIN0 0-WO0(3) 2-IN0

21 PD1 AIN1 P3 0-WO1(3) 2-IN1

22 PD2 AIN2 P0 0-WO2(3) EVOUTD 2-IN2

23 PD3 AIN3 N0 0-WO3(3) 2-OUT

24 PD4 AIN4 P1 0-WO4(3)

25 PD5 AIN5 N1 0-WO5(3)

26 PD6 AIN6 P2 2-OUT(3)

27 PD7 VREFA AIN7 N2 EVOUTD(3)

28 AVDD

29 GND

30 PE0 AIN8 MOSI(3) 0-WO0(3)

31 PE1 AIN9 MISO(3) 0-WO1(3)

32 PE2 AIN10 SCK(3) 0-WO2(3) EVOUTE

33 PE3 AIN11 SS(3) 0-WO3(3)

34 PF0 TOSC1 2TxD 0-WO0(3) 3-IN0

35 PF1 TOSC2 2RxD 0-WO1(3) 3-IN1

36 PF2 TWI AIN12 2XCK SDA(S)(3) 0-WO2(3) EVOUTF 3-IN2

37 PF3 TWI AIN13 2XDIR SCL(S)(3) 0-WO3(3) 3-OUT

ATmega809160932094809 ndash 48-pinIO Multiplexing and Considerations

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 7

continued

UQFN48TQFP48

Pin name (12) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn

38 PF4 AIN14 2TxD(3) 0-WO4(3) 0-WO(3)

39 PF5 AIN15 2RxD(3) 0-WO5(3) 1-WO(3)

40 PF6 RESET 2XCK(3) 3-OUT(3)

41 UPDI

42 VDD

43 GND

Note 1 Pin names are of type Pxn with x being the PORT instance (ABC ) and n the pin number

Notation for signals is PORTx_PINn All pins can be used as event input2 All pins can be used for external interrupt where pins Px2 and Px6 of each port have full

asynchronous detection3 Alternate pin positions For selecting the alternate positions refer to the PORTMUX documentation

ATmega809160932094809 ndash 48-pinIO Multiplexing and Considerations

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 8

4 Electrical Characteristics

41 DisclaimerAll typical values are measured at T = 25degC and VDD = 3V unless otherwise specified All minimum andmaximum values are valid across operating temperature and voltage unless otherwise specified

Typical values given should be considered for design guidance only and actual part variation aroundthese values is expected

42 Absolute Maximum RatingsStresses beyond those listed in this section may cause permanent damage to the device This is a stressrating only and functional operation of the device at these or other conditions beyond those indicated inthe operational sections of this specification is not implied Exposure to absolute maximum ratingconditions for extended periods may affect device reliability

Table 4-1 Absolute Maximum Ratings

Symbol Description Conditions Min Max UnitVDD Power Supply Voltage -05 6 VIVDD Current into a VDD pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAIGND Current out of a GND pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAVPIN Pin voltage with respect to GND -05 VDD+05 VIPIN IO pin sinksource current -40 40 mAIc1

(1) IO pin injection current except for the RESET pin VpinltGND-06V or55VltVpinle61V49VltVDDle55V

-1 1 mA

Ic2(1) IO pin injection current except for the RESET pin VpinltGND-06V or

Vpinle55VVDDle49V

-15 15 mA

Tstorage Storage temperature -65 150 degC

Note 1 ndash If VPIN is lower than GND-06V then a current limiting resistor is required The negative DC

injection current limiting resistor is calculated as R = (GND-06V ndash Vpin)ICnndash If VPIN is greater than VDD+06V then a current limiting resistor is required The positive DC

injection current limiting resistor is calculated as R = (Vpin-(VDD+06))ICn

43 General Operating RatingsThe device must operate within the ratings listed in this section in order for all other electricalcharacteristics and typical characteristics of the device to be valid

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 9

Table 4-2 General Operating Conditions

Symbol Description Condition Min Max Unit

VDD Operating Supply Voltage 18(1) 55 V

TA Operating temperature range -40 125 degC

Note 1 Operation is guaranteed down to 18V or VBOD with BODLEVEL0 whichever is lower

Table 4-3 Operating Voltage and Frequency

Symbol Description Condition Min Max Unit

fCLK_CPU Nominal operating system clock frequency VDD=[18 55]VTA=[-40 105]degC(1)(4)

0 5 MHz

VDD=[27 55]VTA=[-40 105]degC(2)(4)

0 10

VDD=[45 55]VTA=[-40 105]degC(3)(4)

0 20

VDD=[27 55]VTA=[-40 125]degC(2)

0 8

VDD=[45 55]VTA=[-40 125]degC(2)

0 16

Note 1 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL02 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL23 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL74 These specifications do not apply to automotive range parts (-VAO)

The maximum CPU clock frequency depends on VDD As shown in the figure below the MaximumFrequency vs VDD is linear between 18V lt VDD lt 27V and 27V lt VDD lt 45V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 10

Figure 4-1 Maximum Frequency vs VDD for [-40 105]degC

5MHz

10MHz

20MHz

18V 55V27V 45V

Safe Operating Area

44 Power Considerations

The average die junction temperature TJ (in degC) is given from the formula

TJ = TA+PD RθJA

where PD is the total power dissipation

The total thermal resistance of a package (RθJA) can be separated into two components RθJC and RθCArepresenting the barrier to heat flow from the semiconductor junction to the package (case) surface (RθJC)and from the case to the outside ambient air (RθCA) These terms are related by the equation

RθJA = RθJC + RθCA

RθJC is device related and cannot be influenced by the user However RθCA is user dependent and canbe minimized by thermal management techniques such as heat sinks ambient air cooling and thermalconvection Thus good thermal management on the part of the user can significantly reduce RθCA so thatRθJA approximately equals RθJC

The power dissipation curve is negatively sloped as ambient temperature increase The maximum powerdissipation is therefore at minimum ambient temperature while the highest junction temperature occurs atthe maximum ambient temperature

Table 4-4 Power Dissipation and Junction Temperature vs Temperature

Package TA Range RθJA (degCW) PD (W) Typical TJ - TA(degC) Typical

UQFN48 -40degC to 125degC 10

TQFP48 -40degC to 125degC 10

45 Power ConsumptionThe values are measured power consumption under the following conditions except where noted

bull VDD=3Vbull TA=25degCbull OSC20M used as system clock source except where otherwise specified

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 11

bull System power consumption measured with peripherals disabled and IO ports driven low with inputsdisabled

Table 4-5 Power Consumption in Active and Idle Mode

Mode Description Condition Typ Max Unit

Active Active power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 85 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 43 - mA

VDD=3V 23 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 22 - mA

VDD=3V 12 - mA

VDD=2V 075 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 164 - microA

VDD=3V 90 - microA

VDD=2V 60 - microA

Idle Idle power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 28 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 14 - mA

VDD=3V 08 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 07 - mA

VDD=3V 04 - mA

VDD=2V 025 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 56 - microA

VDD=3V 28 - microA

VDD=2V 18 - microA

Table 4-6 Power Consumption in Power-Down Standby and Reset Mode

Mode Description Condition Typ25degC

Max85degC(1)

Max125degC

Unit

Standby Standby powerconsumption

RTC running at 1024kHz from externalXOSC32K (CL=75pF)

VDD=3V 07 - - microA

RTC running at 1024kHz from internalOSCULP32K

VDD=3V 07 60 160 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 12

continuedMode Description Condition Typ

25degCMax85degC(1)

Max125degC

Unit

PowerDownStandby

Power downStandby powerconsumption are thesame when allperipherals arestopped

All peripheralsstopped

VDD=3V 01 50 150 microA

Reset Reset powerconsumption

RESET line pulled low VDD=3V 100 - - microA

Note 1 These parameters are for design guidance only and are not tested

46 Peripherals Power ConsumptionThe table below can be used to calculate the additional current consumption for the different IOperipherals in the various operating modes

Some peripherals will request the clock to be enabled when operating in STANDBY See the peripheralchapter for further information

Operating conditionsbull VDD=3Vbull T=25degCbull OSC20M at 1 MHz used as system clock source except where otherwise specifiedbull In Idle Sleep mode except where otherwise specified

Table 4-7 Peripherals Power Consumption

Peripheral Conditions Typ(1) Unit

BOD Continuous 19 microA

Sampling 1 kHz 12

TCA 16-bit count 1 MHz 130 microA

TCB 16-bit count 1 MHz 74 microA

RTC 16-bit count OSCULP32K 12 microA

WDT (including OSCULP32K) 07 microA

OSC20M 130 microA

AC Fast Mode(2) 92 microA

Low-Power Mode(2) 45 microA

ADC(3) 50 ksps 330 microA

100 ksps 340 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 13

continuedPeripheral Conditions Typ(1) Unit

XOSC32K CL=75 pF 05 microA

OSCULP32K 04 microA

USART Enable 9600 Baud 130 microA

SPI (Master) Enable 100 kHz 21 microA

TWI (Master) Enable 100 kHz 240 microA

TWI (Slave) Enable 100 kHz 170 microA

Flash programming Erase Operation 15 mA

Write Operation 30

Note 1 Current consumption of the module only To calculate the total internal power consumption of the

microcontroller add this value to the base power consumption given in ldquoPower Consumptionrdquosection in electrical characteristics

2 CPU in Standby mode3 Average power consumption with ADC active in Free-Running mode

47 BOD and POR CharacteristicsTable 4-8 Power Supply Characteristics

Symbol Description Condition Min Typ Max Unit

SRON(1) Power-on Slope - - 100(2) Vms

Note 1 For design guidance only and not tested in production2 A slope faster than the maximum rating can trigger a reset of the device if changing the voltage

level after an initial power-up

Table 4-9 Power-on Reset (POR) Characteristics

Symbol Description Condition Min Typ Max Unit

VPOR POR threshold voltage on VDDfalling

VDD fallsrises at 05Vms or slower 08(1) - 16(1) V

POR threshold voltage on VDDrising

14(1) - 18

Note 1 For design guidance only and not tested in production

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 14

Table 4-10 Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min Typ Max Unit

VBOD BOD detection level (fallingrising)

BODLEVEL0 17 18 20 V

BODLEVEL2 24 26 29

BODLEVEL7 39 43 45

VHYS Hysteresis BODLEVEL0 - 25 - mV

BODLEVEL2 - 40 -

BODLEVEL7 - 80 -

tBOD Detection time Continuous - 7 - micros

Sampled 1 kHz - 1 - ms

Sampled 125 Hz - 8 -

tstartup Start-up time Time from enable to ready - 40 - micros

VINT Interrupt level 0 Percentage above the selectedBOD level

- 4 -

Interrupt level 1 - 13 -

Interrupt level 2 - 25 -

48 External Reset CharacteristicsTable 4-11 External Reset Characteristics

Mode Description Condition Min Typ Max Unit

VVIH_RST Input Voltage for RESET 07timesVDD - VDD+02 V

VVIL_RST Input Low Voltage for RESET -02 - 03timesVDD

tMIN_RST Minimum pulse width on RESET pin(1) - - 25 micros

Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note 1 These parameters are for design guidance only and are not production tested

49 Oscillators and ClocksOperating conditions

bull VDD=3V except where specified otherwise

Table 4-12 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25degC 30V 16 MHz

FREQSEL=1 20

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 15

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 8: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

continued

UQFN48TQFP48

Pin name (12) Special ADC0 AC0 USARTn SPI0 TWI0 TCA0 TCBn EVSYS CCL-LUTn

38 PF4 AIN14 2TxD(3) 0-WO4(3) 0-WO(3)

39 PF5 AIN15 2RxD(3) 0-WO5(3) 1-WO(3)

40 PF6 RESET 2XCK(3) 3-OUT(3)

41 UPDI

42 VDD

43 GND

Note 1 Pin names are of type Pxn with x being the PORT instance (ABC ) and n the pin number

Notation for signals is PORTx_PINn All pins can be used as event input2 All pins can be used for external interrupt where pins Px2 and Px6 of each port have full

asynchronous detection3 Alternate pin positions For selecting the alternate positions refer to the PORTMUX documentation

ATmega809160932094809 ndash 48-pinIO Multiplexing and Considerations

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 8

4 Electrical Characteristics

41 DisclaimerAll typical values are measured at T = 25degC and VDD = 3V unless otherwise specified All minimum andmaximum values are valid across operating temperature and voltage unless otherwise specified

Typical values given should be considered for design guidance only and actual part variation aroundthese values is expected

42 Absolute Maximum RatingsStresses beyond those listed in this section may cause permanent damage to the device This is a stressrating only and functional operation of the device at these or other conditions beyond those indicated inthe operational sections of this specification is not implied Exposure to absolute maximum ratingconditions for extended periods may affect device reliability

Table 4-1 Absolute Maximum Ratings

Symbol Description Conditions Min Max UnitVDD Power Supply Voltage -05 6 VIVDD Current into a VDD pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAIGND Current out of a GND pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAVPIN Pin voltage with respect to GND -05 VDD+05 VIPIN IO pin sinksource current -40 40 mAIc1

(1) IO pin injection current except for the RESET pin VpinltGND-06V or55VltVpinle61V49VltVDDle55V

-1 1 mA

Ic2(1) IO pin injection current except for the RESET pin VpinltGND-06V or

Vpinle55VVDDle49V

-15 15 mA

Tstorage Storage temperature -65 150 degC

Note 1 ndash If VPIN is lower than GND-06V then a current limiting resistor is required The negative DC

injection current limiting resistor is calculated as R = (GND-06V ndash Vpin)ICnndash If VPIN is greater than VDD+06V then a current limiting resistor is required The positive DC

injection current limiting resistor is calculated as R = (Vpin-(VDD+06))ICn

43 General Operating RatingsThe device must operate within the ratings listed in this section in order for all other electricalcharacteristics and typical characteristics of the device to be valid

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 9

Table 4-2 General Operating Conditions

Symbol Description Condition Min Max Unit

VDD Operating Supply Voltage 18(1) 55 V

TA Operating temperature range -40 125 degC

Note 1 Operation is guaranteed down to 18V or VBOD with BODLEVEL0 whichever is lower

Table 4-3 Operating Voltage and Frequency

Symbol Description Condition Min Max Unit

fCLK_CPU Nominal operating system clock frequency VDD=[18 55]VTA=[-40 105]degC(1)(4)

0 5 MHz

VDD=[27 55]VTA=[-40 105]degC(2)(4)

0 10

VDD=[45 55]VTA=[-40 105]degC(3)(4)

0 20

VDD=[27 55]VTA=[-40 125]degC(2)

0 8

VDD=[45 55]VTA=[-40 125]degC(2)

0 16

Note 1 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL02 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL23 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL74 These specifications do not apply to automotive range parts (-VAO)

The maximum CPU clock frequency depends on VDD As shown in the figure below the MaximumFrequency vs VDD is linear between 18V lt VDD lt 27V and 27V lt VDD lt 45V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 10

Figure 4-1 Maximum Frequency vs VDD for [-40 105]degC

5MHz

10MHz

20MHz

18V 55V27V 45V

Safe Operating Area

44 Power Considerations

The average die junction temperature TJ (in degC) is given from the formula

TJ = TA+PD RθJA

where PD is the total power dissipation

The total thermal resistance of a package (RθJA) can be separated into two components RθJC and RθCArepresenting the barrier to heat flow from the semiconductor junction to the package (case) surface (RθJC)and from the case to the outside ambient air (RθCA) These terms are related by the equation

RθJA = RθJC + RθCA

RθJC is device related and cannot be influenced by the user However RθCA is user dependent and canbe minimized by thermal management techniques such as heat sinks ambient air cooling and thermalconvection Thus good thermal management on the part of the user can significantly reduce RθCA so thatRθJA approximately equals RθJC

The power dissipation curve is negatively sloped as ambient temperature increase The maximum powerdissipation is therefore at minimum ambient temperature while the highest junction temperature occurs atthe maximum ambient temperature

Table 4-4 Power Dissipation and Junction Temperature vs Temperature

Package TA Range RθJA (degCW) PD (W) Typical TJ - TA(degC) Typical

UQFN48 -40degC to 125degC 10

TQFP48 -40degC to 125degC 10

45 Power ConsumptionThe values are measured power consumption under the following conditions except where noted

bull VDD=3Vbull TA=25degCbull OSC20M used as system clock source except where otherwise specified

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 11

bull System power consumption measured with peripherals disabled and IO ports driven low with inputsdisabled

Table 4-5 Power Consumption in Active and Idle Mode

Mode Description Condition Typ Max Unit

Active Active power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 85 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 43 - mA

VDD=3V 23 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 22 - mA

VDD=3V 12 - mA

VDD=2V 075 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 164 - microA

VDD=3V 90 - microA

VDD=2V 60 - microA

Idle Idle power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 28 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 14 - mA

VDD=3V 08 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 07 - mA

VDD=3V 04 - mA

VDD=2V 025 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 56 - microA

VDD=3V 28 - microA

VDD=2V 18 - microA

Table 4-6 Power Consumption in Power-Down Standby and Reset Mode

Mode Description Condition Typ25degC

Max85degC(1)

Max125degC

Unit

Standby Standby powerconsumption

RTC running at 1024kHz from externalXOSC32K (CL=75pF)

VDD=3V 07 - - microA

RTC running at 1024kHz from internalOSCULP32K

VDD=3V 07 60 160 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 12

continuedMode Description Condition Typ

25degCMax85degC(1)

Max125degC

Unit

PowerDownStandby

Power downStandby powerconsumption are thesame when allperipherals arestopped

All peripheralsstopped

VDD=3V 01 50 150 microA

Reset Reset powerconsumption

RESET line pulled low VDD=3V 100 - - microA

Note 1 These parameters are for design guidance only and are not tested

46 Peripherals Power ConsumptionThe table below can be used to calculate the additional current consumption for the different IOperipherals in the various operating modes

Some peripherals will request the clock to be enabled when operating in STANDBY See the peripheralchapter for further information

Operating conditionsbull VDD=3Vbull T=25degCbull OSC20M at 1 MHz used as system clock source except where otherwise specifiedbull In Idle Sleep mode except where otherwise specified

Table 4-7 Peripherals Power Consumption

Peripheral Conditions Typ(1) Unit

BOD Continuous 19 microA

Sampling 1 kHz 12

TCA 16-bit count 1 MHz 130 microA

TCB 16-bit count 1 MHz 74 microA

RTC 16-bit count OSCULP32K 12 microA

WDT (including OSCULP32K) 07 microA

OSC20M 130 microA

AC Fast Mode(2) 92 microA

Low-Power Mode(2) 45 microA

ADC(3) 50 ksps 330 microA

100 ksps 340 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 13

continuedPeripheral Conditions Typ(1) Unit

XOSC32K CL=75 pF 05 microA

OSCULP32K 04 microA

USART Enable 9600 Baud 130 microA

SPI (Master) Enable 100 kHz 21 microA

TWI (Master) Enable 100 kHz 240 microA

TWI (Slave) Enable 100 kHz 170 microA

Flash programming Erase Operation 15 mA

Write Operation 30

Note 1 Current consumption of the module only To calculate the total internal power consumption of the

microcontroller add this value to the base power consumption given in ldquoPower Consumptionrdquosection in electrical characteristics

2 CPU in Standby mode3 Average power consumption with ADC active in Free-Running mode

47 BOD and POR CharacteristicsTable 4-8 Power Supply Characteristics

Symbol Description Condition Min Typ Max Unit

SRON(1) Power-on Slope - - 100(2) Vms

Note 1 For design guidance only and not tested in production2 A slope faster than the maximum rating can trigger a reset of the device if changing the voltage

level after an initial power-up

Table 4-9 Power-on Reset (POR) Characteristics

Symbol Description Condition Min Typ Max Unit

VPOR POR threshold voltage on VDDfalling

VDD fallsrises at 05Vms or slower 08(1) - 16(1) V

POR threshold voltage on VDDrising

14(1) - 18

Note 1 For design guidance only and not tested in production

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 14

Table 4-10 Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min Typ Max Unit

VBOD BOD detection level (fallingrising)

BODLEVEL0 17 18 20 V

BODLEVEL2 24 26 29

BODLEVEL7 39 43 45

VHYS Hysteresis BODLEVEL0 - 25 - mV

BODLEVEL2 - 40 -

BODLEVEL7 - 80 -

tBOD Detection time Continuous - 7 - micros

Sampled 1 kHz - 1 - ms

Sampled 125 Hz - 8 -

tstartup Start-up time Time from enable to ready - 40 - micros

VINT Interrupt level 0 Percentage above the selectedBOD level

- 4 -

Interrupt level 1 - 13 -

Interrupt level 2 - 25 -

48 External Reset CharacteristicsTable 4-11 External Reset Characteristics

Mode Description Condition Min Typ Max Unit

VVIH_RST Input Voltage for RESET 07timesVDD - VDD+02 V

VVIL_RST Input Low Voltage for RESET -02 - 03timesVDD

tMIN_RST Minimum pulse width on RESET pin(1) - - 25 micros

Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note 1 These parameters are for design guidance only and are not production tested

49 Oscillators and ClocksOperating conditions

bull VDD=3V except where specified otherwise

Table 4-12 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25degC 30V 16 MHz

FREQSEL=1 20

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 15

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 9: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

4 Electrical Characteristics

41 DisclaimerAll typical values are measured at T = 25degC and VDD = 3V unless otherwise specified All minimum andmaximum values are valid across operating temperature and voltage unless otherwise specified

Typical values given should be considered for design guidance only and actual part variation aroundthese values is expected

42 Absolute Maximum RatingsStresses beyond those listed in this section may cause permanent damage to the device This is a stressrating only and functional operation of the device at these or other conditions beyond those indicated inthe operational sections of this specification is not implied Exposure to absolute maximum ratingconditions for extended periods may affect device reliability

Table 4-1 Absolute Maximum Ratings

Symbol Description Conditions Min Max UnitVDD Power Supply Voltage -05 6 VIVDD Current into a VDD pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAIGND Current out of a GND pin TA=[-40 85]degC - 200 mA

TA=[85 125]degC - 100 mAVPIN Pin voltage with respect to GND -05 VDD+05 VIPIN IO pin sinksource current -40 40 mAIc1

(1) IO pin injection current except for the RESET pin VpinltGND-06V or55VltVpinle61V49VltVDDle55V

-1 1 mA

Ic2(1) IO pin injection current except for the RESET pin VpinltGND-06V or

Vpinle55VVDDle49V

-15 15 mA

Tstorage Storage temperature -65 150 degC

Note 1 ndash If VPIN is lower than GND-06V then a current limiting resistor is required The negative DC

injection current limiting resistor is calculated as R = (GND-06V ndash Vpin)ICnndash If VPIN is greater than VDD+06V then a current limiting resistor is required The positive DC

injection current limiting resistor is calculated as R = (Vpin-(VDD+06))ICn

43 General Operating RatingsThe device must operate within the ratings listed in this section in order for all other electricalcharacteristics and typical characteristics of the device to be valid

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 9

Table 4-2 General Operating Conditions

Symbol Description Condition Min Max Unit

VDD Operating Supply Voltage 18(1) 55 V

TA Operating temperature range -40 125 degC

Note 1 Operation is guaranteed down to 18V or VBOD with BODLEVEL0 whichever is lower

Table 4-3 Operating Voltage and Frequency

Symbol Description Condition Min Max Unit

fCLK_CPU Nominal operating system clock frequency VDD=[18 55]VTA=[-40 105]degC(1)(4)

0 5 MHz

VDD=[27 55]VTA=[-40 105]degC(2)(4)

0 10

VDD=[45 55]VTA=[-40 105]degC(3)(4)

0 20

VDD=[27 55]VTA=[-40 125]degC(2)

0 8

VDD=[45 55]VTA=[-40 125]degC(2)

0 16

Note 1 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL02 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL23 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL74 These specifications do not apply to automotive range parts (-VAO)

The maximum CPU clock frequency depends on VDD As shown in the figure below the MaximumFrequency vs VDD is linear between 18V lt VDD lt 27V and 27V lt VDD lt 45V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 10

Figure 4-1 Maximum Frequency vs VDD for [-40 105]degC

5MHz

10MHz

20MHz

18V 55V27V 45V

Safe Operating Area

44 Power Considerations

The average die junction temperature TJ (in degC) is given from the formula

TJ = TA+PD RθJA

where PD is the total power dissipation

The total thermal resistance of a package (RθJA) can be separated into two components RθJC and RθCArepresenting the barrier to heat flow from the semiconductor junction to the package (case) surface (RθJC)and from the case to the outside ambient air (RθCA) These terms are related by the equation

RθJA = RθJC + RθCA

RθJC is device related and cannot be influenced by the user However RθCA is user dependent and canbe minimized by thermal management techniques such as heat sinks ambient air cooling and thermalconvection Thus good thermal management on the part of the user can significantly reduce RθCA so thatRθJA approximately equals RθJC

The power dissipation curve is negatively sloped as ambient temperature increase The maximum powerdissipation is therefore at minimum ambient temperature while the highest junction temperature occurs atthe maximum ambient temperature

Table 4-4 Power Dissipation and Junction Temperature vs Temperature

Package TA Range RθJA (degCW) PD (W) Typical TJ - TA(degC) Typical

UQFN48 -40degC to 125degC 10

TQFP48 -40degC to 125degC 10

45 Power ConsumptionThe values are measured power consumption under the following conditions except where noted

bull VDD=3Vbull TA=25degCbull OSC20M used as system clock source except where otherwise specified

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 11

bull System power consumption measured with peripherals disabled and IO ports driven low with inputsdisabled

Table 4-5 Power Consumption in Active and Idle Mode

Mode Description Condition Typ Max Unit

Active Active power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 85 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 43 - mA

VDD=3V 23 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 22 - mA

VDD=3V 12 - mA

VDD=2V 075 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 164 - microA

VDD=3V 90 - microA

VDD=2V 60 - microA

Idle Idle power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 28 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 14 - mA

VDD=3V 08 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 07 - mA

VDD=3V 04 - mA

VDD=2V 025 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 56 - microA

VDD=3V 28 - microA

VDD=2V 18 - microA

Table 4-6 Power Consumption in Power-Down Standby and Reset Mode

Mode Description Condition Typ25degC

Max85degC(1)

Max125degC

Unit

Standby Standby powerconsumption

RTC running at 1024kHz from externalXOSC32K (CL=75pF)

VDD=3V 07 - - microA

RTC running at 1024kHz from internalOSCULP32K

VDD=3V 07 60 160 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 12

continuedMode Description Condition Typ

25degCMax85degC(1)

Max125degC

Unit

PowerDownStandby

Power downStandby powerconsumption are thesame when allperipherals arestopped

All peripheralsstopped

VDD=3V 01 50 150 microA

Reset Reset powerconsumption

RESET line pulled low VDD=3V 100 - - microA

Note 1 These parameters are for design guidance only and are not tested

46 Peripherals Power ConsumptionThe table below can be used to calculate the additional current consumption for the different IOperipherals in the various operating modes

Some peripherals will request the clock to be enabled when operating in STANDBY See the peripheralchapter for further information

Operating conditionsbull VDD=3Vbull T=25degCbull OSC20M at 1 MHz used as system clock source except where otherwise specifiedbull In Idle Sleep mode except where otherwise specified

Table 4-7 Peripherals Power Consumption

Peripheral Conditions Typ(1) Unit

BOD Continuous 19 microA

Sampling 1 kHz 12

TCA 16-bit count 1 MHz 130 microA

TCB 16-bit count 1 MHz 74 microA

RTC 16-bit count OSCULP32K 12 microA

WDT (including OSCULP32K) 07 microA

OSC20M 130 microA

AC Fast Mode(2) 92 microA

Low-Power Mode(2) 45 microA

ADC(3) 50 ksps 330 microA

100 ksps 340 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 13

continuedPeripheral Conditions Typ(1) Unit

XOSC32K CL=75 pF 05 microA

OSCULP32K 04 microA

USART Enable 9600 Baud 130 microA

SPI (Master) Enable 100 kHz 21 microA

TWI (Master) Enable 100 kHz 240 microA

TWI (Slave) Enable 100 kHz 170 microA

Flash programming Erase Operation 15 mA

Write Operation 30

Note 1 Current consumption of the module only To calculate the total internal power consumption of the

microcontroller add this value to the base power consumption given in ldquoPower Consumptionrdquosection in electrical characteristics

2 CPU in Standby mode3 Average power consumption with ADC active in Free-Running mode

47 BOD and POR CharacteristicsTable 4-8 Power Supply Characteristics

Symbol Description Condition Min Typ Max Unit

SRON(1) Power-on Slope - - 100(2) Vms

Note 1 For design guidance only and not tested in production2 A slope faster than the maximum rating can trigger a reset of the device if changing the voltage

level after an initial power-up

Table 4-9 Power-on Reset (POR) Characteristics

Symbol Description Condition Min Typ Max Unit

VPOR POR threshold voltage on VDDfalling

VDD fallsrises at 05Vms or slower 08(1) - 16(1) V

POR threshold voltage on VDDrising

14(1) - 18

Note 1 For design guidance only and not tested in production

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 14

Table 4-10 Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min Typ Max Unit

VBOD BOD detection level (fallingrising)

BODLEVEL0 17 18 20 V

BODLEVEL2 24 26 29

BODLEVEL7 39 43 45

VHYS Hysteresis BODLEVEL0 - 25 - mV

BODLEVEL2 - 40 -

BODLEVEL7 - 80 -

tBOD Detection time Continuous - 7 - micros

Sampled 1 kHz - 1 - ms

Sampled 125 Hz - 8 -

tstartup Start-up time Time from enable to ready - 40 - micros

VINT Interrupt level 0 Percentage above the selectedBOD level

- 4 -

Interrupt level 1 - 13 -

Interrupt level 2 - 25 -

48 External Reset CharacteristicsTable 4-11 External Reset Characteristics

Mode Description Condition Min Typ Max Unit

VVIH_RST Input Voltage for RESET 07timesVDD - VDD+02 V

VVIL_RST Input Low Voltage for RESET -02 - 03timesVDD

tMIN_RST Minimum pulse width on RESET pin(1) - - 25 micros

Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note 1 These parameters are for design guidance only and are not production tested

49 Oscillators and ClocksOperating conditions

bull VDD=3V except where specified otherwise

Table 4-12 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25degC 30V 16 MHz

FREQSEL=1 20

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 15

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 10: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Table 4-2 General Operating Conditions

Symbol Description Condition Min Max Unit

VDD Operating Supply Voltage 18(1) 55 V

TA Operating temperature range -40 125 degC

Note 1 Operation is guaranteed down to 18V or VBOD with BODLEVEL0 whichever is lower

Table 4-3 Operating Voltage and Frequency

Symbol Description Condition Min Max Unit

fCLK_CPU Nominal operating system clock frequency VDD=[18 55]VTA=[-40 105]degC(1)(4)

0 5 MHz

VDD=[27 55]VTA=[-40 105]degC(2)(4)

0 10

VDD=[45 55]VTA=[-40 105]degC(3)(4)

0 20

VDD=[27 55]VTA=[-40 125]degC(2)

0 8

VDD=[45 55]VTA=[-40 125]degC(2)

0 16

Note 1 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL02 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL23 Operation is guaranteed down to BOD triggering level VBOD with BODLEVEL74 These specifications do not apply to automotive range parts (-VAO)

The maximum CPU clock frequency depends on VDD As shown in the figure below the MaximumFrequency vs VDD is linear between 18V lt VDD lt 27V and 27V lt VDD lt 45V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 10

Figure 4-1 Maximum Frequency vs VDD for [-40 105]degC

5MHz

10MHz

20MHz

18V 55V27V 45V

Safe Operating Area

44 Power Considerations

The average die junction temperature TJ (in degC) is given from the formula

TJ = TA+PD RθJA

where PD is the total power dissipation

The total thermal resistance of a package (RθJA) can be separated into two components RθJC and RθCArepresenting the barrier to heat flow from the semiconductor junction to the package (case) surface (RθJC)and from the case to the outside ambient air (RθCA) These terms are related by the equation

RθJA = RθJC + RθCA

RθJC is device related and cannot be influenced by the user However RθCA is user dependent and canbe minimized by thermal management techniques such as heat sinks ambient air cooling and thermalconvection Thus good thermal management on the part of the user can significantly reduce RθCA so thatRθJA approximately equals RθJC

The power dissipation curve is negatively sloped as ambient temperature increase The maximum powerdissipation is therefore at minimum ambient temperature while the highest junction temperature occurs atthe maximum ambient temperature

Table 4-4 Power Dissipation and Junction Temperature vs Temperature

Package TA Range RθJA (degCW) PD (W) Typical TJ - TA(degC) Typical

UQFN48 -40degC to 125degC 10

TQFP48 -40degC to 125degC 10

45 Power ConsumptionThe values are measured power consumption under the following conditions except where noted

bull VDD=3Vbull TA=25degCbull OSC20M used as system clock source except where otherwise specified

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 11

bull System power consumption measured with peripherals disabled and IO ports driven low with inputsdisabled

Table 4-5 Power Consumption in Active and Idle Mode

Mode Description Condition Typ Max Unit

Active Active power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 85 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 43 - mA

VDD=3V 23 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 22 - mA

VDD=3V 12 - mA

VDD=2V 075 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 164 - microA

VDD=3V 90 - microA

VDD=2V 60 - microA

Idle Idle power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 28 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 14 - mA

VDD=3V 08 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 07 - mA

VDD=3V 04 - mA

VDD=2V 025 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 56 - microA

VDD=3V 28 - microA

VDD=2V 18 - microA

Table 4-6 Power Consumption in Power-Down Standby and Reset Mode

Mode Description Condition Typ25degC

Max85degC(1)

Max125degC

Unit

Standby Standby powerconsumption

RTC running at 1024kHz from externalXOSC32K (CL=75pF)

VDD=3V 07 - - microA

RTC running at 1024kHz from internalOSCULP32K

VDD=3V 07 60 160 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 12

continuedMode Description Condition Typ

25degCMax85degC(1)

Max125degC

Unit

PowerDownStandby

Power downStandby powerconsumption are thesame when allperipherals arestopped

All peripheralsstopped

VDD=3V 01 50 150 microA

Reset Reset powerconsumption

RESET line pulled low VDD=3V 100 - - microA

Note 1 These parameters are for design guidance only and are not tested

46 Peripherals Power ConsumptionThe table below can be used to calculate the additional current consumption for the different IOperipherals in the various operating modes

Some peripherals will request the clock to be enabled when operating in STANDBY See the peripheralchapter for further information

Operating conditionsbull VDD=3Vbull T=25degCbull OSC20M at 1 MHz used as system clock source except where otherwise specifiedbull In Idle Sleep mode except where otherwise specified

Table 4-7 Peripherals Power Consumption

Peripheral Conditions Typ(1) Unit

BOD Continuous 19 microA

Sampling 1 kHz 12

TCA 16-bit count 1 MHz 130 microA

TCB 16-bit count 1 MHz 74 microA

RTC 16-bit count OSCULP32K 12 microA

WDT (including OSCULP32K) 07 microA

OSC20M 130 microA

AC Fast Mode(2) 92 microA

Low-Power Mode(2) 45 microA

ADC(3) 50 ksps 330 microA

100 ksps 340 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 13

continuedPeripheral Conditions Typ(1) Unit

XOSC32K CL=75 pF 05 microA

OSCULP32K 04 microA

USART Enable 9600 Baud 130 microA

SPI (Master) Enable 100 kHz 21 microA

TWI (Master) Enable 100 kHz 240 microA

TWI (Slave) Enable 100 kHz 170 microA

Flash programming Erase Operation 15 mA

Write Operation 30

Note 1 Current consumption of the module only To calculate the total internal power consumption of the

microcontroller add this value to the base power consumption given in ldquoPower Consumptionrdquosection in electrical characteristics

2 CPU in Standby mode3 Average power consumption with ADC active in Free-Running mode

47 BOD and POR CharacteristicsTable 4-8 Power Supply Characteristics

Symbol Description Condition Min Typ Max Unit

SRON(1) Power-on Slope - - 100(2) Vms

Note 1 For design guidance only and not tested in production2 A slope faster than the maximum rating can trigger a reset of the device if changing the voltage

level after an initial power-up

Table 4-9 Power-on Reset (POR) Characteristics

Symbol Description Condition Min Typ Max Unit

VPOR POR threshold voltage on VDDfalling

VDD fallsrises at 05Vms or slower 08(1) - 16(1) V

POR threshold voltage on VDDrising

14(1) - 18

Note 1 For design guidance only and not tested in production

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 14

Table 4-10 Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min Typ Max Unit

VBOD BOD detection level (fallingrising)

BODLEVEL0 17 18 20 V

BODLEVEL2 24 26 29

BODLEVEL7 39 43 45

VHYS Hysteresis BODLEVEL0 - 25 - mV

BODLEVEL2 - 40 -

BODLEVEL7 - 80 -

tBOD Detection time Continuous - 7 - micros

Sampled 1 kHz - 1 - ms

Sampled 125 Hz - 8 -

tstartup Start-up time Time from enable to ready - 40 - micros

VINT Interrupt level 0 Percentage above the selectedBOD level

- 4 -

Interrupt level 1 - 13 -

Interrupt level 2 - 25 -

48 External Reset CharacteristicsTable 4-11 External Reset Characteristics

Mode Description Condition Min Typ Max Unit

VVIH_RST Input Voltage for RESET 07timesVDD - VDD+02 V

VVIL_RST Input Low Voltage for RESET -02 - 03timesVDD

tMIN_RST Minimum pulse width on RESET pin(1) - - 25 micros

Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note 1 These parameters are for design guidance only and are not production tested

49 Oscillators and ClocksOperating conditions

bull VDD=3V except where specified otherwise

Table 4-12 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25degC 30V 16 MHz

FREQSEL=1 20

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 15

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 11: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 4-1 Maximum Frequency vs VDD for [-40 105]degC

5MHz

10MHz

20MHz

18V 55V27V 45V

Safe Operating Area

44 Power Considerations

The average die junction temperature TJ (in degC) is given from the formula

TJ = TA+PD RθJA

where PD is the total power dissipation

The total thermal resistance of a package (RθJA) can be separated into two components RθJC and RθCArepresenting the barrier to heat flow from the semiconductor junction to the package (case) surface (RθJC)and from the case to the outside ambient air (RθCA) These terms are related by the equation

RθJA = RθJC + RθCA

RθJC is device related and cannot be influenced by the user However RθCA is user dependent and canbe minimized by thermal management techniques such as heat sinks ambient air cooling and thermalconvection Thus good thermal management on the part of the user can significantly reduce RθCA so thatRθJA approximately equals RθJC

The power dissipation curve is negatively sloped as ambient temperature increase The maximum powerdissipation is therefore at minimum ambient temperature while the highest junction temperature occurs atthe maximum ambient temperature

Table 4-4 Power Dissipation and Junction Temperature vs Temperature

Package TA Range RθJA (degCW) PD (W) Typical TJ - TA(degC) Typical

UQFN48 -40degC to 125degC 10

TQFP48 -40degC to 125degC 10

45 Power ConsumptionThe values are measured power consumption under the following conditions except where noted

bull VDD=3Vbull TA=25degCbull OSC20M used as system clock source except where otherwise specified

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 11

bull System power consumption measured with peripherals disabled and IO ports driven low with inputsdisabled

Table 4-5 Power Consumption in Active and Idle Mode

Mode Description Condition Typ Max Unit

Active Active power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 85 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 43 - mA

VDD=3V 23 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 22 - mA

VDD=3V 12 - mA

VDD=2V 075 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 164 - microA

VDD=3V 90 - microA

VDD=2V 60 - microA

Idle Idle power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 28 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 14 - mA

VDD=3V 08 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 07 - mA

VDD=3V 04 - mA

VDD=2V 025 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 56 - microA

VDD=3V 28 - microA

VDD=2V 18 - microA

Table 4-6 Power Consumption in Power-Down Standby and Reset Mode

Mode Description Condition Typ25degC

Max85degC(1)

Max125degC

Unit

Standby Standby powerconsumption

RTC running at 1024kHz from externalXOSC32K (CL=75pF)

VDD=3V 07 - - microA

RTC running at 1024kHz from internalOSCULP32K

VDD=3V 07 60 160 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 12

continuedMode Description Condition Typ

25degCMax85degC(1)

Max125degC

Unit

PowerDownStandby

Power downStandby powerconsumption are thesame when allperipherals arestopped

All peripheralsstopped

VDD=3V 01 50 150 microA

Reset Reset powerconsumption

RESET line pulled low VDD=3V 100 - - microA

Note 1 These parameters are for design guidance only and are not tested

46 Peripherals Power ConsumptionThe table below can be used to calculate the additional current consumption for the different IOperipherals in the various operating modes

Some peripherals will request the clock to be enabled when operating in STANDBY See the peripheralchapter for further information

Operating conditionsbull VDD=3Vbull T=25degCbull OSC20M at 1 MHz used as system clock source except where otherwise specifiedbull In Idle Sleep mode except where otherwise specified

Table 4-7 Peripherals Power Consumption

Peripheral Conditions Typ(1) Unit

BOD Continuous 19 microA

Sampling 1 kHz 12

TCA 16-bit count 1 MHz 130 microA

TCB 16-bit count 1 MHz 74 microA

RTC 16-bit count OSCULP32K 12 microA

WDT (including OSCULP32K) 07 microA

OSC20M 130 microA

AC Fast Mode(2) 92 microA

Low-Power Mode(2) 45 microA

ADC(3) 50 ksps 330 microA

100 ksps 340 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 13

continuedPeripheral Conditions Typ(1) Unit

XOSC32K CL=75 pF 05 microA

OSCULP32K 04 microA

USART Enable 9600 Baud 130 microA

SPI (Master) Enable 100 kHz 21 microA

TWI (Master) Enable 100 kHz 240 microA

TWI (Slave) Enable 100 kHz 170 microA

Flash programming Erase Operation 15 mA

Write Operation 30

Note 1 Current consumption of the module only To calculate the total internal power consumption of the

microcontroller add this value to the base power consumption given in ldquoPower Consumptionrdquosection in electrical characteristics

2 CPU in Standby mode3 Average power consumption with ADC active in Free-Running mode

47 BOD and POR CharacteristicsTable 4-8 Power Supply Characteristics

Symbol Description Condition Min Typ Max Unit

SRON(1) Power-on Slope - - 100(2) Vms

Note 1 For design guidance only and not tested in production2 A slope faster than the maximum rating can trigger a reset of the device if changing the voltage

level after an initial power-up

Table 4-9 Power-on Reset (POR) Characteristics

Symbol Description Condition Min Typ Max Unit

VPOR POR threshold voltage on VDDfalling

VDD fallsrises at 05Vms or slower 08(1) - 16(1) V

POR threshold voltage on VDDrising

14(1) - 18

Note 1 For design guidance only and not tested in production

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 14

Table 4-10 Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min Typ Max Unit

VBOD BOD detection level (fallingrising)

BODLEVEL0 17 18 20 V

BODLEVEL2 24 26 29

BODLEVEL7 39 43 45

VHYS Hysteresis BODLEVEL0 - 25 - mV

BODLEVEL2 - 40 -

BODLEVEL7 - 80 -

tBOD Detection time Continuous - 7 - micros

Sampled 1 kHz - 1 - ms

Sampled 125 Hz - 8 -

tstartup Start-up time Time from enable to ready - 40 - micros

VINT Interrupt level 0 Percentage above the selectedBOD level

- 4 -

Interrupt level 1 - 13 -

Interrupt level 2 - 25 -

48 External Reset CharacteristicsTable 4-11 External Reset Characteristics

Mode Description Condition Min Typ Max Unit

VVIH_RST Input Voltage for RESET 07timesVDD - VDD+02 V

VVIL_RST Input Low Voltage for RESET -02 - 03timesVDD

tMIN_RST Minimum pulse width on RESET pin(1) - - 25 micros

Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note 1 These parameters are for design guidance only and are not production tested

49 Oscillators and ClocksOperating conditions

bull VDD=3V except where specified otherwise

Table 4-12 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25degC 30V 16 MHz

FREQSEL=1 20

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 15

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 12: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

bull System power consumption measured with peripherals disabled and IO ports driven low with inputsdisabled

Table 4-5 Power Consumption in Active and Idle Mode

Mode Description Condition Typ Max Unit

Active Active power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 85 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 43 - mA

VDD=3V 23 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 22 - mA

VDD=3V 12 - mA

VDD=2V 075 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 164 - microA

VDD=3V 90 - microA

VDD=2V 60 - microA

Idle Idle power consumption fCLK_CPU=20 MHz (OSC20M) VDD=5V 28 - mA

fCLK_CPU=10 MHz (OSC20M div2) VDD=5V 14 - mA

VDD=3V 08 - mA

fCLK_CPU=5 MHz (OSC20M div4) VDD=5V 07 - mA

VDD=3V 04 - mA

VDD=2V 025 - mA

fCLK_CPU=32768 kHz (OSCULP32K) VDD=5V 56 - microA

VDD=3V 28 - microA

VDD=2V 18 - microA

Table 4-6 Power Consumption in Power-Down Standby and Reset Mode

Mode Description Condition Typ25degC

Max85degC(1)

Max125degC

Unit

Standby Standby powerconsumption

RTC running at 1024kHz from externalXOSC32K (CL=75pF)

VDD=3V 07 - - microA

RTC running at 1024kHz from internalOSCULP32K

VDD=3V 07 60 160 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 12

continuedMode Description Condition Typ

25degCMax85degC(1)

Max125degC

Unit

PowerDownStandby

Power downStandby powerconsumption are thesame when allperipherals arestopped

All peripheralsstopped

VDD=3V 01 50 150 microA

Reset Reset powerconsumption

RESET line pulled low VDD=3V 100 - - microA

Note 1 These parameters are for design guidance only and are not tested

46 Peripherals Power ConsumptionThe table below can be used to calculate the additional current consumption for the different IOperipherals in the various operating modes

Some peripherals will request the clock to be enabled when operating in STANDBY See the peripheralchapter for further information

Operating conditionsbull VDD=3Vbull T=25degCbull OSC20M at 1 MHz used as system clock source except where otherwise specifiedbull In Idle Sleep mode except where otherwise specified

Table 4-7 Peripherals Power Consumption

Peripheral Conditions Typ(1) Unit

BOD Continuous 19 microA

Sampling 1 kHz 12

TCA 16-bit count 1 MHz 130 microA

TCB 16-bit count 1 MHz 74 microA

RTC 16-bit count OSCULP32K 12 microA

WDT (including OSCULP32K) 07 microA

OSC20M 130 microA

AC Fast Mode(2) 92 microA

Low-Power Mode(2) 45 microA

ADC(3) 50 ksps 330 microA

100 ksps 340 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 13

continuedPeripheral Conditions Typ(1) Unit

XOSC32K CL=75 pF 05 microA

OSCULP32K 04 microA

USART Enable 9600 Baud 130 microA

SPI (Master) Enable 100 kHz 21 microA

TWI (Master) Enable 100 kHz 240 microA

TWI (Slave) Enable 100 kHz 170 microA

Flash programming Erase Operation 15 mA

Write Operation 30

Note 1 Current consumption of the module only To calculate the total internal power consumption of the

microcontroller add this value to the base power consumption given in ldquoPower Consumptionrdquosection in electrical characteristics

2 CPU in Standby mode3 Average power consumption with ADC active in Free-Running mode

47 BOD and POR CharacteristicsTable 4-8 Power Supply Characteristics

Symbol Description Condition Min Typ Max Unit

SRON(1) Power-on Slope - - 100(2) Vms

Note 1 For design guidance only and not tested in production2 A slope faster than the maximum rating can trigger a reset of the device if changing the voltage

level after an initial power-up

Table 4-9 Power-on Reset (POR) Characteristics

Symbol Description Condition Min Typ Max Unit

VPOR POR threshold voltage on VDDfalling

VDD fallsrises at 05Vms or slower 08(1) - 16(1) V

POR threshold voltage on VDDrising

14(1) - 18

Note 1 For design guidance only and not tested in production

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 14

Table 4-10 Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min Typ Max Unit

VBOD BOD detection level (fallingrising)

BODLEVEL0 17 18 20 V

BODLEVEL2 24 26 29

BODLEVEL7 39 43 45

VHYS Hysteresis BODLEVEL0 - 25 - mV

BODLEVEL2 - 40 -

BODLEVEL7 - 80 -

tBOD Detection time Continuous - 7 - micros

Sampled 1 kHz - 1 - ms

Sampled 125 Hz - 8 -

tstartup Start-up time Time from enable to ready - 40 - micros

VINT Interrupt level 0 Percentage above the selectedBOD level

- 4 -

Interrupt level 1 - 13 -

Interrupt level 2 - 25 -

48 External Reset CharacteristicsTable 4-11 External Reset Characteristics

Mode Description Condition Min Typ Max Unit

VVIH_RST Input Voltage for RESET 07timesVDD - VDD+02 V

VVIL_RST Input Low Voltage for RESET -02 - 03timesVDD

tMIN_RST Minimum pulse width on RESET pin(1) - - 25 micros

Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note 1 These parameters are for design guidance only and are not production tested

49 Oscillators and ClocksOperating conditions

bull VDD=3V except where specified otherwise

Table 4-12 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25degC 30V 16 MHz

FREQSEL=1 20

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 15

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 13: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

continuedMode Description Condition Typ

25degCMax85degC(1)

Max125degC

Unit

PowerDownStandby

Power downStandby powerconsumption are thesame when allperipherals arestopped

All peripheralsstopped

VDD=3V 01 50 150 microA

Reset Reset powerconsumption

RESET line pulled low VDD=3V 100 - - microA

Note 1 These parameters are for design guidance only and are not tested

46 Peripherals Power ConsumptionThe table below can be used to calculate the additional current consumption for the different IOperipherals in the various operating modes

Some peripherals will request the clock to be enabled when operating in STANDBY See the peripheralchapter for further information

Operating conditionsbull VDD=3Vbull T=25degCbull OSC20M at 1 MHz used as system clock source except where otherwise specifiedbull In Idle Sleep mode except where otherwise specified

Table 4-7 Peripherals Power Consumption

Peripheral Conditions Typ(1) Unit

BOD Continuous 19 microA

Sampling 1 kHz 12

TCA 16-bit count 1 MHz 130 microA

TCB 16-bit count 1 MHz 74 microA

RTC 16-bit count OSCULP32K 12 microA

WDT (including OSCULP32K) 07 microA

OSC20M 130 microA

AC Fast Mode(2) 92 microA

Low-Power Mode(2) 45 microA

ADC(3) 50 ksps 330 microA

100 ksps 340 microA

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 13

continuedPeripheral Conditions Typ(1) Unit

XOSC32K CL=75 pF 05 microA

OSCULP32K 04 microA

USART Enable 9600 Baud 130 microA

SPI (Master) Enable 100 kHz 21 microA

TWI (Master) Enable 100 kHz 240 microA

TWI (Slave) Enable 100 kHz 170 microA

Flash programming Erase Operation 15 mA

Write Operation 30

Note 1 Current consumption of the module only To calculate the total internal power consumption of the

microcontroller add this value to the base power consumption given in ldquoPower Consumptionrdquosection in electrical characteristics

2 CPU in Standby mode3 Average power consumption with ADC active in Free-Running mode

47 BOD and POR CharacteristicsTable 4-8 Power Supply Characteristics

Symbol Description Condition Min Typ Max Unit

SRON(1) Power-on Slope - - 100(2) Vms

Note 1 For design guidance only and not tested in production2 A slope faster than the maximum rating can trigger a reset of the device if changing the voltage

level after an initial power-up

Table 4-9 Power-on Reset (POR) Characteristics

Symbol Description Condition Min Typ Max Unit

VPOR POR threshold voltage on VDDfalling

VDD fallsrises at 05Vms or slower 08(1) - 16(1) V

POR threshold voltage on VDDrising

14(1) - 18

Note 1 For design guidance only and not tested in production

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 14

Table 4-10 Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min Typ Max Unit

VBOD BOD detection level (fallingrising)

BODLEVEL0 17 18 20 V

BODLEVEL2 24 26 29

BODLEVEL7 39 43 45

VHYS Hysteresis BODLEVEL0 - 25 - mV

BODLEVEL2 - 40 -

BODLEVEL7 - 80 -

tBOD Detection time Continuous - 7 - micros

Sampled 1 kHz - 1 - ms

Sampled 125 Hz - 8 -

tstartup Start-up time Time from enable to ready - 40 - micros

VINT Interrupt level 0 Percentage above the selectedBOD level

- 4 -

Interrupt level 1 - 13 -

Interrupt level 2 - 25 -

48 External Reset CharacteristicsTable 4-11 External Reset Characteristics

Mode Description Condition Min Typ Max Unit

VVIH_RST Input Voltage for RESET 07timesVDD - VDD+02 V

VVIL_RST Input Low Voltage for RESET -02 - 03timesVDD

tMIN_RST Minimum pulse width on RESET pin(1) - - 25 micros

Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note 1 These parameters are for design guidance only and are not production tested

49 Oscillators and ClocksOperating conditions

bull VDD=3V except where specified otherwise

Table 4-12 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25degC 30V 16 MHz

FREQSEL=1 20

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 15

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 14: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

continuedPeripheral Conditions Typ(1) Unit

XOSC32K CL=75 pF 05 microA

OSCULP32K 04 microA

USART Enable 9600 Baud 130 microA

SPI (Master) Enable 100 kHz 21 microA

TWI (Master) Enable 100 kHz 240 microA

TWI (Slave) Enable 100 kHz 170 microA

Flash programming Erase Operation 15 mA

Write Operation 30

Note 1 Current consumption of the module only To calculate the total internal power consumption of the

microcontroller add this value to the base power consumption given in ldquoPower Consumptionrdquosection in electrical characteristics

2 CPU in Standby mode3 Average power consumption with ADC active in Free-Running mode

47 BOD and POR CharacteristicsTable 4-8 Power Supply Characteristics

Symbol Description Condition Min Typ Max Unit

SRON(1) Power-on Slope - - 100(2) Vms

Note 1 For design guidance only and not tested in production2 A slope faster than the maximum rating can trigger a reset of the device if changing the voltage

level after an initial power-up

Table 4-9 Power-on Reset (POR) Characteristics

Symbol Description Condition Min Typ Max Unit

VPOR POR threshold voltage on VDDfalling

VDD fallsrises at 05Vms or slower 08(1) - 16(1) V

POR threshold voltage on VDDrising

14(1) - 18

Note 1 For design guidance only and not tested in production

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 14

Table 4-10 Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min Typ Max Unit

VBOD BOD detection level (fallingrising)

BODLEVEL0 17 18 20 V

BODLEVEL2 24 26 29

BODLEVEL7 39 43 45

VHYS Hysteresis BODLEVEL0 - 25 - mV

BODLEVEL2 - 40 -

BODLEVEL7 - 80 -

tBOD Detection time Continuous - 7 - micros

Sampled 1 kHz - 1 - ms

Sampled 125 Hz - 8 -

tstartup Start-up time Time from enable to ready - 40 - micros

VINT Interrupt level 0 Percentage above the selectedBOD level

- 4 -

Interrupt level 1 - 13 -

Interrupt level 2 - 25 -

48 External Reset CharacteristicsTable 4-11 External Reset Characteristics

Mode Description Condition Min Typ Max Unit

VVIH_RST Input Voltage for RESET 07timesVDD - VDD+02 V

VVIL_RST Input Low Voltage for RESET -02 - 03timesVDD

tMIN_RST Minimum pulse width on RESET pin(1) - - 25 micros

Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note 1 These parameters are for design guidance only and are not production tested

49 Oscillators and ClocksOperating conditions

bull VDD=3V except where specified otherwise

Table 4-12 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25degC 30V 16 MHz

FREQSEL=1 20

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 15

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 15: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Table 4-10 Brown-out Detector (BOD) Characteristics

Symbol Description Condition Min Typ Max Unit

VBOD BOD detection level (fallingrising)

BODLEVEL0 17 18 20 V

BODLEVEL2 24 26 29

BODLEVEL7 39 43 45

VHYS Hysteresis BODLEVEL0 - 25 - mV

BODLEVEL2 - 40 -

BODLEVEL7 - 80 -

tBOD Detection time Continuous - 7 - micros

Sampled 1 kHz - 1 - ms

Sampled 125 Hz - 8 -

tstartup Start-up time Time from enable to ready - 40 - micros

VINT Interrupt level 0 Percentage above the selectedBOD level

- 4 -

Interrupt level 1 - 13 -

Interrupt level 2 - 25 -

48 External Reset CharacteristicsTable 4-11 External Reset Characteristics

Mode Description Condition Min Typ Max Unit

VVIH_RST Input Voltage for RESET 07timesVDD - VDD+02 V

VVIL_RST Input Low Voltage for RESET -02 - 03timesVDD

tMIN_RST Minimum pulse width on RESET pin(1) - - 25 micros

Rp_RST RESET pull-up resistor VReset=0V 20 35 50 kΩ

Note 1 These parameters are for design guidance only and are not production tested

49 Oscillators and ClocksOperating conditions

bull VDD=3V except where specified otherwise

Table 4-12 20 MHz Internal Oscillator (OSC20M) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSC20M Factory calibration frequency FREQSEL=0 TA=25degC 30V 16 MHz

FREQSEL=1 20

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 15

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 16: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

continuedSymbol Description Condition Min Typ Max Unit

fCAL Frequency calibration range OSC16M(2) 145 175 MHz

OSC20M(2) 185 215 MHz

ETOTAL Total error with 16 MHz and 20MHz frequency selection

From targetfrequency

TA=25degC 30V -15 15

TA=[0 70]degCVDD=[18 36]V

-20 20

Full operationrange

-40 40

EDRIFT Accuracy with 16 MHz and 20MHz frequency selectionrelative to the factory-storedfrequency value

Factory calibratedVDD=3V(1)

TA=[0 70]degCVDD=[18 55]V

-18 18

ΔfOSC20M Calibration step size - 075 -

DOSC20M Duty cycle - 50 -

tstartup Start-up time Within 2accuracy

- 12 - micros

Note 1 See also the description of OSC20M on calibration2 Oscillator Frequencies above speed specification must be divided so the CPU clock is always

within specification

Table 4-13 32768 kHz Internal Oscillator (OSCULP32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fOSCULP32K Factory calibration frequency 32768 kHz

Factory calibration accuracy TA=25degC 30V -3 3

ETOTAL Total error from target frequency TA=[0 70]degC VDD=[18 36]V -10 +10

Full operation range -20 +20

DOSCULP32K Duty cycle 50

tstartup Start-up time - 250 - micros

Table 4-14 32768 kHz External Crystal Oscillator (XOSC32K) Characteristics

Symbol Description Condition Min Typ Max Unit

fout Frequency - 32768 - kHz

tstartup Start-up time CL=75 pF - 300 - ms

CL Crystal load capacitance(1) 75 - 125 pF

CTOSC1TOSC2 Parasitic pin capacitance - 55 - pF

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 16

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 17: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

continuedSymbol Description Condition Min Typ Max Unit

ESR(1) Equivalent Series Resistance - Safety Factor=3 CL=75 pF - - 80 kΩ

CL=125 pF - - 40

Note 1 This parameter is for design guidance only and not production tested

Figure 4-2 External Clock Waveform Characteristics

VIL1

VIH1

Table 4-15 External Clock Characteristics

Symbol Description Condition VDD=[18 55]V VDD=[27 55]V VDD=[45 55]V Unit

Min Max Min Max Min Max

fCLCL Frequency 0 50 00 100 00 200 MHz

tCLCL Clock Period 200 - 100 - 50 - ns

tCHCX(1) High Time 80 - 40 - 20 - ns

tCLCX(1) Low Time 80 - 40 - 20 - ns

tCLCH(1) Rise Time (for

maximum frequency)- 40 - 20 - 10 ns

tCHCL(1) Fall Time (for maximum

frequency)- 40 - 20 - 10 ns

ΔtCLCL(1) Change in period from

one clock cycle to thenext

- 20 - 20 - 20

Note 1 This parameter is for design guidance only and not production tested

410 IO Pin CharacteristicsTable 4-16 IO Pin Characteristics (TA=[-40 85]degC VDD=[18 55]V unless otherwise noted)

Symbol Description Condition Min Typ Max Unit

VIL Input Low Voltage -02 - 03timesVDD V

VIH Input High Voltage 07timesVDD - VDD+02V V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 17

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 18: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

continuedSymbol Description Condition Min Typ Max Unit

IIH IIL IO pin Input Leakage Current VDD=55V pin high - lt 005 - microA

VDD=55V pin low - lt 005 -

VOL IO pin drive strength VDD=18V IOL=15 mA - - 036 V

VDD=30V IOL=75 mA - - 06

VDD=50V IOL=15 mA - - 1

VOH IO pin drive strength VDD=18V IOH=15 mA 144 - - V

VDD=30V IOH=75 mA 24 - -

VDD=50V IOH=15 mA 4 - -

Itotal Maximum combined IO sinksource current per pin group(12)

TA=125degC - - 100 mA

Maximum combined IO sinksource current per pin group(12)

TA=25degC - - 200

tRISE Rise time VDD=30V load=20 pF - 25 - ns

VDD=50V load=20 pF - 15 -

VDD=30V load=20 pFslew rate enabled

- 19 -

VDD=50V load=20 pFslew rate enabled

- 9 -

tFALL Fall time VDD=30V load=20 pF - 20 - ns

VDD=50V load=20 pF - 13 -

VDD=30V load=20 pFslew rate enabled

- 21 -

VDD=50V load=20 pFslew rate enabled

- 11 -

Cpin IO pin capacitance except forTOSC VREFA and TWI pins

- 35 - pF

Cpin IO pin capacitance on TOSC pins - 4 - pF

Cpin IO pin capacitance on TWI pins - 10 - pF

Cpin IO pin capacitance on VREFA pin - 14 - pF

Rp Pull-up resistor 20 35 50 kΩ

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 18

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 19: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Note 1 Pin group A (PA[70]) PF[62]) pin group B (PB[70] PC[70]) pin group C (PD70 PE[30]

PF[10]) For 28-pin and 32-pin devices pin group A and B should be seen as a single group Thecombined continuous sinksource current for each individual group should not exceed the limits

2 These parameters are for design guidance only and are not production tested

411 USARTFigure 4-3 USART in SPI Mode - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-17 USART in SPI Master Mode - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05timestSCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05timestSCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 19

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 20: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

412 SPIFigure 4-4 SPI - Timing Requirements in Master Mode

MSb LSb

tMOS

tMIS tMIH

tSCKW

tSCK

tMOH tMOH

tSCKFtSCKR

tSCKW

MOSI (Data Output)

MISO (Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Figure 4-5 SPI - Timing Requirements in Slave Mode

MSb LSb

tSIS tSIH

tSSCKW

tSSCKW

tSSCK

tSSH

tSOSH

tSSCKR tSSCKF

tSOS

tSSS

tSOSS

MISO(Data Output)

MOSI(Data Input)

SCK (CPOL = 1)

SCK (CPOL = 0)

SS

MSb LSb

Table 4-18 SPI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCK SCK clock frequency Master - - 10 MHz

tSCK SCK period Master 100 - - ns

tSCKW SCK highlow width Master - 05SCK - ns

tSCKR SCK rise time Master - 27 - ns

tSCKF SCK fall time Master - 27 - ns

tMIS MISO setup to SCK Master - 10 - ns

tMIH MISO hold after SCK Master - 10 - ns

tMOS MOSI setup to SCK Master - 05SCK - ns

tMOH MOSI hold after SCK Master - 10 - ns

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 20

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 21: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

continuedSymbol(1) Description Condition Min Typ Max Unit

fSSCK Slave SCK clock frequency Slave - - 5 MHz

tSSCK Slave SCK period Slave 4t Clkper - - ns

tSSCKW SCK highlow width Slave 2t Clkper - - ns

tSSCKR SCK rise time Slave - - 1600 ns

tSSCKF SCK fall time Slave - - 1600 ns

tSIS MOSI setup to SCK Slave 30 - - ns

tSIH MOSI hold after SCK Slave t Clkper - - ns

tSSS SS setup to SCK Slave 21 - - ns

tSSH SS hold after SCK Slave 20 - - ns

tSOS MISO setup to SCK Slave - 80 - ns

tSOH MISO hold after SCK Slave - 13 - ns

tSOSS MISO setup after SS low Slave - 11 - ns

tSOSH MISO hold after SS low Slave - 80 - ns

Note 1 These parameters are for design guidance only and are not production tested

413 TWIFigure 4-6 TWI - Timing Requirements

tSUSTA

tLOW

tHIGH

tLOW

tof

tHDSTA tHDDAT tSUDATtSUSTO

tBUF

SCL

SDA

tr

Table 4-19 TWI - Timing Characteristics

Symbol(1) Description Condition Min Typ Max Unit

fSCL SCL clockfrequency

Max frequency requiressystem clock at 10 MHzwhich in turn requiresVDD=[27 55]V and T=[-40105]degC

0 - 1000 kHz

VIH Input high voltage 07timesVDD - - V

VIL Input low voltage - - 03timesVDD V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 21

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 22: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

continuedSymbol(1) Description Condition Min Typ Max Unit

VHYS Hysteresis ofSchmitt triggerinputs

01timesVDD 04timesVDD V

VOL Output low voltage Iload=20 mA Fast mode+ - - 02xVDD V

Iload=3 mA Normal modeVDDgt2V

- - 04V

Iload=3 mA Normal modeVDDle2V

- - 02timesVDD

IOL Low-level outputcurrent

fSCLle400 kHz VOL=04V 3 - - mA

fSCLle1 MHz VOL=04V 20 - -

CB Capacitive load foreach bus line

fSCLle100 kHz - - 400 pF

fSCLle400 kHz - - 400

fSCLle1 MHz - - 550

tR Rise time for bothSDA and SCL

fSCLle100 kHz - - 1000 ns

fSCLle400 kHz 20 - 300

fSCLle1 MHz - - 120

tOF Output fall timefrom VIHmin toVILmax

10 pF ltcapacitance ofbus line lt 400pF

fSCLle400kHz

20+01timesCB - 300 ns

fSCLle1 MHz 20+01timesCB - 120

tSP Spikes suppressedby the input filter

0 - 50 ns

IL Input current foreach IO pin

01timesVDDltVIlt09timesVDD - - 1 microA

CI Capacitance foreach IO pin

- - 10 pF

RP Value of pull-upresistor

fSCLle100 kHz (VDD-VOL(max)) IOL

- 1000 ns(08473timesCB)

Ω

fSCLle400 kHz - - 300 ns(08473timesCB)

fSCLle1 MHz - - 120 ns(08473timesCB)

tHDSTA Hold time(repeated) Startcondition

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 22

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 23: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

continuedSymbol(1) Description Condition Min Typ Max Unit

tLOW Low period of SCLClock

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

tHIGH High period of SCLClock

fSCLle100 kHz 40 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tSUSTA Setup time for arepeated Startcondition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tHDDAT Data hold time fSCLle100 kHz 0 - 345 micros

fSCLle400 kHz 0 - 09

fSCLle1 MHz 0 - 045

tSUDAT Data setup time fSCLle100 kHz 250 - - ns

fSCLle400 kHz 100 - -

fSCLle1 MHz 50 - -

tSUSTO Setup time forStop condition

fSCLle100 kHz 4 - - micros

fSCLle400 kHz 06 - -

fSCLle1 MHz 026 - -

tBUF Bus free timebetween a Stopand Start condition

fSCLle100 kHz 47 - - micros

fSCLle400 kHz 13 - -

fSCLle1 MHz 05 - -

Note 1 These parameters are for design guidance only and are not production tested

414 VREFTable 4-20 Internal Voltage Reference Characteristics

Symbol(1) Description Min Typ Max Unit

tstart Start-up time - 25 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 23

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 24: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

continuedSymbol(1) Description Min Typ Max Unit

VDD Power supply voltage range for 0V55 18 - 55 V

Power supply voltage range for 1V1 18 - 55

Power supply voltage range for 1V5 18 - 55

Power supply voltage range for 2V5 30 - 55

Power supply voltage range for 4V3 48 - 55

Note 1 These parameters are for design guidance only and are not production tested

Table 4-21 ADC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

1V1 Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-20 20

0V551V52V54V3

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREFCTRLA

register

Table 4-22 AC Internal Voltage Reference Characteristics(1)

Symbol(2) Description Condition Min Typ Max Unit

0V551V11V52V5

Internal reference voltage VDD=[18V 55V]T=[0 - 105]degC

-30 30

0V551V11V52V54V3

Internal reference voltage VDD=[18V 55V]T=[-40 - 125]degC

-50 50

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 24

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 25: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Note 1 These values are based on characterization and not covered by production test limits2 The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREFCTRLA

register

415 ADC

4151 Internal Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 10 pF for 055V reference while it is set to 5 pF for VREFge11Vbull Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted

Table 4-23 Power Supply Reference and Input Range

Symbol Description Conditions Min Typ Max Unit

VDD Supply voltage CLKADC le15 MHz 18 - 55 V

CLKADC gt15 MHz 27 - 55

VREF Reference voltage REFSEL = Internal reference 055 - VDD-05 V

REFSEL = External reference 11 VDD

REFSEL = VDD 18 - 55

CIN Input capacitance SAMPCAP=5 pF - 5 - pF

SAMPCAP=10 pF - 10 -

VIN Input voltage range 0 - VREF V

IBAND Input bandwidth 11VleVREF - - 575 kHz

Table 4-24 Clock and Timing Characteristics(1)

Symbol Description Conditions Min Typ Max Unit

fADC Sample rate 11VleVREF 15 - 115 ksps

11VleVREF (8-bit resolution) 15 - 150

VREF=055V (10 bits) 75 - 20

CLKADC Clock frequency VREF=055V (10 bits) 100 - 260 kHz

11VleVREF (10 bits) 200 - 1500

11VleVREF (8-bit resolution) 200 - 2000

Ts Sampling time 2 2 33 CLKADC cycles

TCONV Conversion time (latency) Sampling time = 2 CLKADC 87 - 50 micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 25

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 26: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

continuedSymbol Description Conditions Min Typ Max Unit

TSTART Start-up time Internal VREF - 22 - micros

Note 1 These parameters are for design guidance only and are not production tested

Table 4-25 Accuracy Characteristics Internal Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

REFSEL =INTERNAL

VREF=055V

fADC=77 ksps - 10 - LSB

REFSEL =INTERNAL or VDD

fADC=15 ksps - 10 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 10 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

REFSEL =INTERNAL

VREF = 055V

fADC=77 ksps - 06 - LSB

REFSEL =INTERNAL

VREF = 11V

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

15VleVREF

fADC=15 ksps - 04 -

REFSEL =INTERNAL or VDD

11VleVREF

fADC=77 ksps - 04 -

REFSEL =INTERNAL

11VleVREF

fADC=115 ksps - 05 -

REFSEL = VDD

18VleVREF

fADC=115 ksps - 09 -

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 26

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 27: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

continuedSymbol Description Conditions Min Typ Max Unit

EABS Absoluteaccuracy

REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- lt10 - LSB

VDD = [18V-36V] - lt15 -

REFSEL = VDD - 25 -

REFSEL =INTERNAL

- lt35 -

EGAIN Gain error REFSEL =INTERNAL

VREF = 11V

T=[0-105]degC

VDD = [18V-36V]

- plusmn15 - LSB

VDD = [18V-36V] - plusmn20 -

REFSEL = VDD - 2 -

REFSEL =INTERNAL

- plusmn35 -

EOFF Offset error REFSEL =INTERNAL

VREF = 055V

- -1 - LSB

REFSEL =INTERNAL

11V le VREF

- -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested3 Reference setting and fADC must fulfill the specification in ldquoClock and Timing Characteristicsrdquo and

ldquoPower supply Reference and Input Rangerdquo tables

4152 External Reference CharacteristicsOperating conditions

bull VDD = 18 to 55Vbull Temperature = -40degC to 125degCbull DUTYCYC = 25bull CLKADC = 13 fADC

bull SAMPCAP is 5 pF

The accuracy characteristics numbers are based on the characterization of the following input referencelevels and VDD ranges

bull Vref = 18V VDD = 18 to 55Vbull Vref = 26V VDD = 27 to 55Vbull Vref = 4096V VDD = 45 to 55V

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 27

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 28: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

bull Vref = 43V VDD = 45 to 55V

Table 4-26 ADC Accuracy Characteristics External Reference(2)

Symbol Description Conditions Min Typ Max Unit

Res Resolution - 10 - bit

INL Integral Non-linearity

fADC=15 ksps - 09 - LSB

fADC=77 ksps - 09 -

fADC=115 ksps - 12 -

DNL(1) DifferentialNon-linearity

fADC=15 ksps - 02 - LSB

fADC=77 ksps - 04 -

fADC=115 ksps - 08 -

EABS Absoluteaccuracy

fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EGAIN Gain error fADC=15 ksps - 2 - LSB

fADC=77 ksps - 2 -

fADC=115 ksps - 2 -

EOFF Offset error - -05 - LSB

Note 1 A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing

codes2 These parameters are for design guidance only and are not production tested

416 ACTable 4-27 Analog Comparator Characteristics Low-Power Mode Disabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -20 plusmn5 +20 mV

VIN=[-02V VDD] -40 plusmn20 +40

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 28

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 29: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

continuedSymbol Description Condition Min Typ Max Unit

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV Overdrive VDDge27V - 50 - ns

Table 4-28 Analog Comparator Characteristics Low-Power Mode Enabled

Symbol Description Condition Min Typ Max Unit

VIN Input voltage -02 - VDD V

CIN Input pin capacitance PD1 to PD6 - 35 - pF

PD7 - 14 -

VOFF Input offset voltage 07VltVINlt(VDD-07V) -30 plusmn10 +30 mV

VIN=[0V VDD] -50 plusmn30 +50

IL Input leakage current - 5 - nA

TSTART Start-up time - 13 - micros

VHYS Hysteresis HYSMODE=0x0 - 0 - mV

HYSMODE=0x1 - 10 -

HYSMODE=0x2 - 25 -

HYSMODE=0x3 - 50 -

tPD Propagation delay 25 mV overdrive VDDge27V - 150 - ns

417 UPDI Timing

UPDI Enable Sequence (1)

Symbol Description Min Max Unit

TRES Duration of HandshakeBreak on RESET 10 200 micros

TUPDI Duration of UPDItxd=0 10 200 micros

TDeb0 Duration of Debuggertxd=0 02 1 micros

TDebZ Duration of Debuggertxd=z 200 14000 micros

Note 1 These parameters are for design guidance only and are not production tested

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 29

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 30: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

418 Programming TimeSee the table below for typical programming times for Flash and EEPROM

Table 4-29 Programming Times

Symbol Typical Programming Time

Page Buffer Clear 7 CLK_CPU cycles

Page Write 2 ms

Page Erase 2 ms

Page Erase-Write 4 ms

Chip Erase 4 ms

EEPROM Erase 4 ms

ATmega809160932094809 ndash 48-pinElectrical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 30

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 31: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

5 Typical Characteristics

51 Power Consumption

511 Supply Currents in Active ModeFigure 5-1  Active Supply Current vs Frequency (1-20 MHz) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

Figure 5-2  Active Supply Current vs Frequency [01 10] MHz at T=25degC

0

50

100

150

200

250

300

350

400

450

500

550

600

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 31

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 32: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-3  Active Supply Current vs Temperature (f=20 MHz OSC20M)

00

10

20

30

40

50

60

70

80

90

100

110

120

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

Figure 5-4  Active Supply Current vs VDD (f=[125 20] MHz OSC20M) at T=25degC

00

10

20

30

40

50

60

70

80

90

100

110

120

15 20 25 30 35 40 45 50 55Vdd [V]

Frequency [MHz]1252551020

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 32

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 33: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-5 Active Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

4

8

12

16

20

24

28

32

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

512 Supply Currents in Idle ModeFigure 5-6  Idle Supply Current vs Frequency (1-20 MHz) at T=25degC

00

05

10

15

20

25

30

35

40

45

50

0 2 4 6 8 10 12 14 16 18 20Frequency [MHz]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 33

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 34: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-7  Idle Supply Current vs Low Frequency (01-10 MHz) at T=25degC

0

25

50

75

100

125

150

175

200

225

250

00 01 02 03 04 05 06 07 08 09 10Frequency [MHz]

VDD [V]18222733642555

Figure 5-8  Idle Supply Current vs Temperature (f=20 MHz OSC20M)

00

05

10

15

20

25

30

35

40

45

50

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]45555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 34

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 35: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-9  Idle Supply Current vs VDD (f=32768 kHz OSCULP32K)

0

2

4

6

8

10

12

14

16

18

20

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

513 Supply Currents in Power-Down ModeFigure 5-10  Power-Down Mode Supply Current vs Temperature (all functions disabled)

00

10

20

30

40

50

60

70

80

-40 -20 0 20 40 60 80 100 120Temperature [degC]

VDD [V]18222733642555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 35

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 36: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-11  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-12  Power-Down Mode Supply Current vs VDD (all functions disabled)

00

10

20

30

40

50

60

70

80

25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 36

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 37: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

514 Supply Currents in Standby ModeFigure 5-13  Standby Mode Supply Current vs VDD (RTC running with internal OSCULP32K)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

Figure 5-14  Standby Mode Supply Current vs VDD (Sampled BOD running at 125 Hz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 37

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 38: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-15  Standby Mode Supply Current vs VDD (Sampled BOD running at 1 kHz)

00

10

20

30

40

50

60

70

80

90

100

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

515 Power-on Supply CurrentsFigure 5-16 Power-on Supply Current vs VDD (BOD enabled at 43V level)

0

40

80

120

160

200

240

280

320

360

400

00 05 10 15 20 25 30 35 40 45Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 38

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 39: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

52 GPIO

GPIO Input CharacteristicsFigure 5-17 IO Pin Input Hysteresis vs VDD

00

02

04

06

08

10

12

14

16

18

20

Thre

shol

d [V

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-18 IO Pin Input Threshold Voltage vs VDD (T=25degC)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

TresholdVihVil

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 39

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 40: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-19 IO Pin Input Threshold Voltage vs VDD (VIH)

25

30

35

40

45

50

55

60

65

70

75Th

resh

old

[]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

Figure 5-20 IO Pin Input Threshold Voltage vs VDD (VIL)

25

30

35

40

45

50

55

60

65

70

75

Thre

shol

d [

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature[degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 40

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 41: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

GPIO Output CharacteristicsFigure 5-21 IO Pin Output Voltage vs Sink Current (VDD=18V)

000

005

010

015

020

025

030

035

040

045

050

Vout

put[V

]

00 02 04 06 08 10 12 14 16 18 20

Sink current [mA]

Temperature[degC]-40-200257085105125

Figure 5-22 IO Pin Output Voltage vs Sink Current (VDD=30V)

000

005

010

015

020

025

030

035

040

045

050

0 1 2 3 4 5 6 7 8 9 10Sink current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 41

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 42: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-23 IO Pin Output Voltage vs Sink Current (VDD=50V)

00

01

02

03

04

05

06

07

08

09

10

0 2 4 6 8 10 12 14 16 18 20Sink current [mA]

Temperature [degC]-40-200257085105125

Figure 5-24 IO Pin Output Voltage vs Sink Current (T=25degC)

00

01

02

03

04

05

06

07

08

09

10

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Sink current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 42

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 43: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-25 IO Pin Output Voltage vs Source Current (VDD=18V)

130

135

140

145

150

155

160

165

170

175

180

00 02 04 06 08 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-26 IO Pin Output Voltage vs Source Current (VDD=30V)

20

21

22

23

24

25

26

27

28

29

30

0 1 2 3 4 5 6 7 8 9 10Source current [mA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 43

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 44: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-27 IO Pin Output Voltage vs Source Current (VDD=50V)

40

41

42

43

44

45

46

47

48

49

50

0 2 4 6 8 10 12 14 16 18 20Source current [mA]

Temperature [degC]-40-200257085105125

Figure 5-28 IO Pin Output Voltage vs Source Current (T=25degC)

00

05

10

15

20

25

30

35

40

45

50

Vout

put[V

]

0 2 4 6 8 10 12 14 16 18 20

Source current [mA]

Vdd [V]18222345

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 44

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 45: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

GPIO Pull-Up CharacteristicsFigure 5-29 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=18V)

00

03

05

08

10

13

15

18

20

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

Figure 5-30 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=30V)

10

13

15

18

20

23

25

28

30

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 45

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 46: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-31 IO Pin Pull-Up Resistor Current vs Input Voltage (VDD=50V)

30

33

35

38

40

43

45

48

50

0 5 10 15 20 25 30 35 40 45 50Pull-up resistor current [microA]

Temperature [degC]-40-200257085105125

53 VREF CharacteristicsFigure 5-32 Internal 055V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 46

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 47: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-33 Internal 11V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]235

Figure 5-34 Internal 25V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10

Vref

erro

r [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]35

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 47

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 48: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-35 Internal 43V Reference vs Temperature

-10

-08

-06

-04

-02

00

02

04

06

08

10Vr

ef e

rror [

]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]5

54 BOD Characteristics

BOD Current vs VDDFigure 5-36 BOD Current vs VDD (Continuous Mode Enabled)

0

5

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 48

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 49: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-37 BOD Current vs VDD (Sampled BOD at 125 Hz)

00

05

10

15

20

25

30

35

40

45

50Id

d [micro

A]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

Figure 5-38 BOD Current vs VDD (Sampled BOD at 1 kHz)

00

05

10

15

20

25

30

35

40

45

50

Idd

[microA]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-400257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 49

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 50: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

BOD Threshold vs TemperatureFigure 5-39 BOD Threshold vs Temperature (Level 18V)

170

172

174

176

178

180

182

184

186

188

190

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

Figure 5-40 BOD Threshold vs Temperature (Level 26V)

256

258

260

262

264

266

268

270

272

274

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 50

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 51: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-41 BOD Threshold vs Temperature (Level 43V)

416

418

420

422

424

426

428

430

432

434

BOD

leve

l [V]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Falling VDDRising VDD

55 ADC CharacteristicsFigure 5-42 Absolute Accuracy vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 51

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 52: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-43 Absolute Accuracy vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80

90

100Ab

solu

te A

ccur

acy

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-44 DNL Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 52

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 53: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-45 DNL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20D

NL

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-46 Gain Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 53

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 54: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-47 Gain Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

10

20

30

40

50

60

70

80G

ain

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-48 INL vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 54

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 55: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-49 INL vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

00

02

04

06

08

10

12

14

16

18

20

11 15 25 43 VDD

INL

[LSb

]Temperature [degC]

-402585105

Vref [V]

Figure 5-50 Offset Error vs VDD (fADC=115 ksps) at T=25degC REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V]11152543VDD

Offs

et [L

Sb]

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 55

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 56: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-51 Offset Error vs Vref (VDD=50V fADC=115 ksps) REFSEL = Internal Reference

-20

-16

-12

-08

-04

00

04

08

12

16

20O

ffset

[LSb

]

11 15 25 43 VDD

Vref [V]

Temperature [degC]-402585105

Figure 5-52 Absolute Accuracy vs VDD (fADC=115 ksps T=25degC) REFSEL = External Reference

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 56

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 57: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-53 Absolute Accuracy vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

90

100

Abso

lute

Acc

urac

y [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-54 DNL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 57

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 58: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-55 DNL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

DN

L [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-56 Gain vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-10

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 58

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 59: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-57 Gain vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

10

20

30

40

50

60

70

80

Gai

n [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-58 INL vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 59

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 60: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-59 INL vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

00

02

04

06

08

10

12

14

16

18

20

INL

[LSb

]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

Figure 5-60 Offset vs VDD (fADC=115 ksps T=25degC REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

15 20 25 30 35 40 45 50 55

Vdd [V]

Vref [V] 1826409643

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 60

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 61: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-61 Offset vs VREF (VDD=50V fADC=115 ksps REFSEL = External Reference)

-20

-16

-12

-08

-04

00

04

08

12

16

20

Offs

et [L

Sb]

18 26 4096 43

Vref [V]

Temperature [degC]-402585105

56 AC CharacteristicsFigure 5-62 Hysteresis vs VCM - 10 mV (VDD=5V)

0

2

4

6

8

10

12

14

16

18

20

Hys

tere

sis

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 61

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 62: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-63 Hysteresis vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

8

16

24

32

40

48

56

64

72

80H

yste

resi

s [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

Figure 5-64 Offset vs VCM - 10 mV (VDD=5V)

00

10

20

30

40

50

60

70

80

90

100

Offs

et [m

V]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

Temperature [degC]-40-200255585105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 62

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 63: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-65 Offset vs VCM - 10 mV to 50 mV (VDD=5V T=25degC)

0

1

2

3

4

5

6

7

8

9

10O

ffset

[mV]

-05 00 05 10 15 20 25 30 35 40 45 50 55

Vcommon mode [V]

HYSMODE10mV25mV50mV

57 OSC20M CharacteristicsFigure 5-66 OSC20M Internal Oscillator Calibration Stepsize vs Calibration Value (VDD=3V)

00

02

04

06

08

10

12

14

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 63

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 64: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-67 OSC20M Internal Oscillator Frequency vs Calibration Value (VDD=3V)

10

12

14

16

18

20

22

24

26

28

30

32

0 16 32 48 64 80 96 112 128OSCCAL [x1]

Temperature [degC]-40-200257085105125

Figure 5-68 OSC20M Internal Oscillator Frequency vs Temperature

195

196

197

198

199

200

201

202

203

204

205

-40 -20 0 20 40 60 80 100 120Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 64

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 65: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-69 OSC20M Internal Oscillator Frequency vs VDD

195

196

197

198

199

200

201

202

203

204

205

15 20 25 30 35 40 45 50 55Vdd [V]

Temperature [degC]-40-200257085105125

58 OSCULP32K CharacteristicsFigure 5-70 OSCULP32K Internal Oscillator Frequency vs Temperature

300

310

320

330

340

350

360

370

380

390

400

Freq

uenc

y [k

Hz]

-40 -20 0 20 40 60 80 100 120

Temperature [degC]

Vdd [V]182227336555

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 65

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 66: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Figure 5-71 OSCULP32K Internal Oscillator Frequency vs VDD

300

310

320

330

340

350

360

370

380

390

400Fr

eque

ncy

[kH

z]

15 20 25 30 35 40 45 50 55

Vdd [V]

Temperature [degC]-40-200257085105125

ATmega809160932094809 ndash 48-pinTypical Characteristics

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 66

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 67: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

6 Ordering Informationbull Available ordering options can be found by

ndash Clicking on one of the following product page linksbull ATmega809 Product Pagebull ATmega1609 Product Pagebull ATmega3209 Product Pagebull ATmega4809 Product Page

ndash Searching by product name at microchipdirectcomndash Contacting your local sales representative

Figure 6-1 Product Identification SystemTo order or obtain information for example on pricing or delivery refer to the factory or the listed salesoffice

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

ATmega809160932094809 ndash 48-pinOrdering Information

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 67

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 68: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

7 Online Package DrawingsFor the most recent package drawings

1 Go to httpwwwmicrochipcompackaging2 Go to the package type specific page for example VQFN3 Search for either Drawing Number or Style to find the most recent package drawings

Table 7-1 Drawing Numbers

Package Type Drawing Number Style

UQFN48 C04-153 MV

TQFP48 C04-300 PT

ATmega809160932094809 ndash 48-pinOnline Package Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 68

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 69: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

8 Package Drawings

81 48-Pin TQFP

CSEATING

PLANE

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

Microchip Technology Drawing C04-300-PT Rev A Sheet 1 of 2

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

TOP VIEW

EE1

D

020 H A-B D4X

D12

1 2

A B

AA

D

D1

A1

A

H010 C

008 C

SIDE VIEW

N

020 C A-B D48X TIPS

E14

D14

A2

E12

e

48x b008 C A-B D

NOTE 1

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 69

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 70: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

H

L(L1)

c

SECTION A-A

21

4BSC Basic Dimension Theoretically exact value shown without tolerancesREF Reference Dimension usually without tolerance for information purposes only

3protrusions shall not exceed 025mm per side

Mold Draft Angle Bottom

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Notes

Foot Length

Lead WidthLead ThicknessMolded Package LengthMolded Package WidthOverall LengthOverall WidthFoot AngleFootprint

StandoffOverall HeightLead PitchNumber of Leads

12deg 11deg 13deg

075060045L

12deg022

700 BSC700 BSC900 BSC900 BSC

35deg100 REF

c

b

D1E1

00901711deg

DE

L10deg

13deg027016-

7deg

100

050 BSC48

NOMMILLIMETERS

A1A2

Ae

005095

-

Units

NMIN

105015120

--

MAX

Chamfers at corners are optional size may varyPin 1 visual index feature may vary but must be located within the hatched area

Dimensioning and tolerancing per ASME Y145M

Dimensions D1 and E1 do not include mold flash or protrusions Mold flash or

5plastic body at datum plane HDatums A-B and D to be determined at center line between leads where leads exit

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 70

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 71: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

RECOMMENDED LAND PATTERN

Dimension LimitsUnits

C2Contact Pad Spacing

Contact Pitch

MILLIMETERS

050 BSCMIN

EMAX

840

Contact Pad Length (X48)Contact Pad Width (X48)

Y1X1

150030

Microchip Technology Drawing C04-2300-PT Rev A

NOM

48-Lead Thin Quad Flatpack (PT) - 7x7x10 mm Body [TQFP]

C1

C2

E

X1

Y1

G

C1Contact Pad Spacing 840

Distance Between Pads G 020

BSC Basic Dimension Theoretically exact value shown without tolerances

NotesDimensioning and tolerancing per ASME Y145M

For best soldering results thermal vias if used should be filled or tented to avoid solder loss duringreflow process

1

2

For the most current package drawings please see the Microchip Packaging Specification located athttpwwwmicrochipcompackaging

Note

SILK SCREEN

1 2

48

Table 8-1 Device and Package Maximum Weight

140 mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 71

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 72: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Table 8-2 Package Characteristics

Moisture Sensitivity Level MSL3

Table 8-3 Package Reference

JEDEC Drawing Reference MS-026

J-STD-609 Material Code e3

Table 8-4 Package Code

Y8X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 72

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 73: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

82 48-Pin UQFN

2009 Microchip Technology Inc DS00049BC-page 95

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 73

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 74: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

DS00049BC-page 94 2009 Microchip Technology Inc

MPackaging Diagrams and Parameters

Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 74

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 75: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Table 8-5 Device and Package Maximum Weight

TBD mg

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 75

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 76: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Table 8-6 Package Characteristics

Moisture Sensitivity Level MSL1

Table 8-7 Package Reference

JEDEC Drawing Reference MO-220

J-STD-609 Material Code e3

Table 8-8 Package Code

R7X

ATmega809160932094809 ndash 48-pinPackage Drawings

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 76

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 77: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

9 Conventions

91 Memory Size and TypeTable 9-1 Memory Size and Bit Rate

Symbol Description

KB kilobyte (210 = 1024)

MB megabyte (220 = 10241024)

GB gigabyte (230 = 102410241024)

b bit (binary lsquo0rsquo or lsquo1rsquo)

B byte (8 bits)

1 kbits 1000 bits rate (not 1024 bits)

1 Mbits 1000000 bits rate

1 Gbits 1000000000 bits rate

word 16-bit

92 Frequency and TimeTable 9-2 Frequency and Time

Symbol Description

kHz 1 kHz = 103 Hz = 1000 Hz

KHz 1 KHz = 1024 Hz 32 KHz = 32768 Hz

MHz 1 MHz = 106 Hz = 1000000 Hz

GHz 1 GHz = 109 Hz = 1000000000 Hz

ms 1 ms = 10-3s = 0001s

micros 1 micros = 10-6s = 0000001s

ns 1 ns = 10-9s = 0000000001s

ATmega809160932094809 ndash 48-pinConventions

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 77

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 78: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

10 Data Sheet Revision HistoryNote  The data sheet revision is independent of the die revision and the device variant (last letter of theordering number)

101 RevB - 032019

Chapter Changes

Entire Document bull Added ATmega809ATmega1609bull Updated Electrical Characteristics section and

Typical Characteristics sectionbull Added package drawing for UQFNbull Updated package drawing for TQFP

102 Rev A - 022018Initial release

ATmega809160932094809 ndash 48-pinData Sheet Revision History

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 78

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 79: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

The Microchip Web Site

Microchip provides online support via our web site at httpwwwmicrochipcom This web site is used asa means to make files and information easily available to customers Accessible by using your favoriteInternet browser the web site contains the following information

bull Product Support ndash Data sheets and errata application notes and sample programs designresources userrsquos guides and hardware support documents latest software releases and archivedsoftware

bull General Technical Support ndash Frequently Asked Questions (FAQ) technical support requests onlinediscussion groups Microchip consultant program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releaseslisting of seminars and events listings of Microchip sales offices distributors and factoryrepresentatives

Customer Change Notification Service

Microchiprsquos customer notification service helps keep customers current on Microchip productsSubscribers will receive e-mail notification whenever there are changes updates revisions or erratarelated to a specified product family or development tool of interest

To register access the Microchip web site at httpwwwmicrochipcom Under ldquoSupportrdquo click onldquoCustomer Change Notificationrdquo and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Field Application Engineer (FAE)bull Technical Support

Customers should contact their distributor representative or Field Application Engineer (FAE) for supportLocal sales offices are also available to help customers A listing of sales offices and locations is includedin the back of this document

Technical support is available through the web site at httpwwwmicrochipcomsupport

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 79

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 80: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

Product Identification System

To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office

Carrier TypeAT mega 4809 - MFR

Flash size in KBSeries name

Pin count9=48 pins (PDIP 40 pins)8=32 pins (SSOP 28 pins)

Package TypeA=TQFPM=QFN (UQFNVQFN)P=PDIPX=SSOP

Temperature Range F=-40degC to +125degC

R=Tape amp ReelAVR product familyBlank=Tube or Tray

Note  Tape and Reel identifier only appears in the catalog part number description This identifier isused for ordering purposes Check with your Microchip Sales Office for package availability with the Tapeand Reel option

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specification contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is one of the most secure families of its kind on the

market today when used in the intended manner and under normal conditionsbull There are dishonest and possibly illegal methods used to breach the code protection feature All of

these methods to our knowledge require using the Microchip products in a manner outside theoperating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so isengaged in theft of intellectual property

bull Microchip is willing to work with the customer who is concerned about the integrity of their codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their

code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo

Code protection is constantly evolving We at Microchip are committed to continuously improving thecode protection features of our products Attempts to break Microchiprsquos code protection feature may be aviolation of the Digital Millennium Copyright Act If such acts allow unauthorized access to your softwareor other copyrighted work you may have a right to sue for relief under that Act

Legal Notice

Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates It is your responsibility to ensure that yourapplication meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITSCONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSEMicrochip disclaims all liability arising from this information and its use Use of Microchip devices in lifesupport andor safety applications is entirely at the buyerrsquos risk and the buyer agrees to defendindemnify and hold harmless Microchip from any and all damages claims suits or expenses resulting

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 80

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 81: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo AnyRate AVR AVR logo AVR Freaks BitCloudchipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR Heldo JukeBlox KeeLoqKleer LANCheck LINK MD maXStylus maXTouch MediaLB megaAVR MOST MOST logo MPLABOptoLyzer PIC picoPower PICSTART PIC32 logo Prochip Designer QTouch SAM-BA SpyNIC SSTSST Logo SuperFlash tinyAVR UNIO and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

ClockWorks The Embedded Control Solutions Company EtherSynch Hyper Speed Control HyperLightLoad IntelliMOS mTouch Precision Edge and Quiet-Wire are registered trademarks of MicrochipTechnology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BodyComCodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEMdsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial ProgrammingICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWimotorBench MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach OmniscientCode Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II TotalEndurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA aretrademarks of Microchip Technology Incorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary ofMicrochip Technology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2019 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-4321-6

Quality Management System Certified by DNV

ISOTS 16949Microchip received ISOTS-169492009 certification for its worldwide headquarters design and waferfabrication facilities in Chandler and Tempe Arizona Gresham Oregon and design centers in Californiaand India The Companyrsquos quality system processes and procedures are for its PICreg MCUs and dsPICreg

DSCs KEELOQreg code hopping devices Serial EEPROMs microperipherals nonvolatile memory andanalog products In addition Microchiprsquos quality system for the design and manufacture of developmentsystems is ISO 90012000 certified

ATmega809160932094809 ndash 48-pin

copy 2019 Microchip Technology Inc Datasheet Preliminary DS40002016B-page 81

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service
Page 82: 48-pin ATmega809/1609/3209/4809 – The …ww1.microchip.com/downloads/en/DeviceDoc/48-pin-Data... · 2019-04-02 · 48-pin 48-pin Data Sheet – megaAVR® 0-series Introduction The

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupporthttpwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4450-2828Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-67-3636Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2019 Microchip Technology Inc Preliminary Datasheet DS40002016B-page 82

  • Introduction
  • Features
  • Table of Contents
  • 1 Block Diagram
  • 2 Pinout
    • 21 48-pin UQFNTQFP
      • 3 IO Multiplexing and Considerations
        • 31 Multiplexed Signals
          • 4 Electrical Characteristics
            • 41 Disclaimer
            • 42 Absolute Maximum Ratings
            • 43 General Operating Ratings
            • 44 Power Considerations
            • 45 Power Consumption
            • 46 Peripherals Power Consumption
            • 47 BOD and POR Characteristics
            • 48 External Reset Characteristics
            • 49 Oscillators and Clocks
            • 410 IO Pin Characteristics
            • 411 USART
            • 412 SPI
            • 413 TWI
            • 414 VREF
            • 415 ADC
              • 4151 Internal Reference Characteristics
              • 4152 External Reference Characteristics
                • 416 AC
                • 417 UPDI Timing
                • 418 Programming Time
                  • 5 Typical Characteristics
                    • 51 Power Consumption
                      • 511 Supply Currents in Active Mode
                      • 512 Supply Currents in Idle Mode
                      • 513 Supply Currents in Power-Down Mode
                      • 514 Supply Currents in Standby Mode
                      • 515 Power-on Supply Currents
                        • 52 GPIO
                        • 53 VREF Characteristics
                        • 54 BOD Characteristics
                        • 55 ADC Characteristics
                        • 56 AC Characteristics
                        • 57 OSC20M Characteristics
                        • 58 OSCULP32K Characteristics
                          • 6 Ordering Information
                          • 7 Online Package Drawings
                          • 8 Package Drawings
                            • 81 48-Pin TQFP
                            • 82 48-Pin UQFN
                              • 9 Conventions
                                • 91 Memory Size and Type
                                • 92 Frequency and Time
                                  • 10 Data Sheet Revision History
                                    • 101 RevB - 032019
                                    • 102 Rev A - 022018
                                      • The Microchip Web Site
                                      • Customer Change Notification Service
                                      • Customer Support
                                      • Product Identification System
                                      • Microchip Devices Code Protection Feature
                                      • Legal Notice
                                      • Trademarks
                                      • Quality Management System Certified by DNV
                                      • Worldwide Sales and Service