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R
LCD TVSERVICE MANUAL
CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LA73E
MODEL : 42LC7D 42LC7D-UB
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION................................................................11
TROUBLE SHOOTING & BLOCK DIAGRAM ........................................17
EXPLODED VIEW .................................................................................. 43
REPLACEMENT PARTS LIST ............................................................... 45
SVC. SHEET ...............................................................................................
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument'sexposed METALLIC PARTS
Good Earth Groundsuch as WATER PIPE,CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
- 4 -
CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.
2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of itsassemblies.
4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.
7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the
unit under test.2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.
4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).
7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within therange or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500 F to 600 F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating thecircuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500 F to 600 F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
- 5 -
IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the soldermelts.
2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as
possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as
possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.3. Solder the connections.
CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).
1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.
- 6 -
SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
4. General Specification(TV)
No. Item Specification Remark
1. Receiving System ATSC/64 & 256 QAM/ NTSC-M
2. Available Channel 1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
3. Input Voltage 1) AC 100 ~ 240V 50/60Hz
4. Market NORTH AMERICA
5. Screen Size 26 inch Wide – 26 inches(582.96mm) For 26LC7D-UB
32 inch Wide - 31.51inches(800.4mm) For 32LC7D-UB,32LC4D-UA
37 inch Wide – 32.02 inches(940.3mm) For 37LC7D-UB
42 inch Wide – 42.02 inches(1067.308mm) For 42LC7D-UB,42LC4D-UA
6. Aspect Ratio 16:9
7. Tuning System FS
8. LCD Module T260XW02-V5 For 26LC7D-UE
LC320WX4-SLA1 For 32LC7D-UB,32LC4D-UA
LC370WX3-SLA1 For 37LC7D-UB
LC420WX6-SLA1 For 42LC7D-UB,42LC4D-UA
9. Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
10. Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : 0 ~ 90 %
1. Application Range. This spec sheet is applied to the 37"/42" LCD TV used LA73Echassis.
2. Especificación Each part is tested as below without special appointment
2.1 Temperature : 20 ±5°C 2.2 Relative Humidity : 65 ±10% 2.3 Power Voltage : Standard input voltage
(100~240V@ 50/60Hz) • Standard Voltage of each products is marked by models
2.4 Specification and performance of each parts are followedeach drawing and specif ication by part number inaccordance with BOM .
2.5 The receiver must be operated for about 20 minutes priorto the adjustment.
3. Test method
3.1 Performance : LGE TV test method followed.3.2 Demanded other specification
Safety : UL, CSA, IEC specification3.3 EMC : FCC, ICES, IEC specification
- 7 -
5. Chroma & Brightness5-1. 37LC7D-UB
CONDITION : EZ-Picture "Daylight"
5-2. 42LC7D-UB, 42LC4D-UACONDITION : EZ-Picture "Daylight"
No Item Min Typ Max Unit Remark
1. White peak brightness 360 450 cd/m2 HDMI input, full white,
Video Black level=High
2. Contrast ratio 700:1 900:1 Non dimming mode
(PC Mode)
3000:1 4000:1 5000:1 Dimming mode
1. Input full black, wait 10 minute,
measure black level
2. Input full white , wait 10 minute,
measure white level
3. Brightness uniformity 1.3 Refer to LCD SPEC.
4. Color coordinate RED X 0.633 +/- 0.03
Y 0.339 +/- 0.03
GREEN X 0.286 +/- 0.03
Y 0.610 +/- 0.03
BLUE X 0.147 +/- 0.03
Y 0.065 +/- 0.03
WHITE X 0.276 +/- 0.03
Y 0.283 +/- 0.03
5. Viewing angle 178 R/L, U/D
6. Color Temperature Standard 8,300 9,300 10,300 <Test Signal>
Cool 10,000 11,000 12,000 HDMI input, With 16-gray pattern
Warm 5,500 6,500 7,500 6th bar from right
No Item Min Typ Max Unit Remark
1. White peak brightness 360 450 cd/m2 HDMI input, full white,
Video Black level=High
2. Contrast ratio 800:1 1000:1 Non dimming mode
(PC Mode)
3000:1 4000:1 5000:1 Dimming mode
1. Input full black, wait 10 minute,
measure black level
2. Input full white , wait 10 minute,
measure white level
3. Brightness uniformity 1.3 Refer to LCD SPEC.
4. Color coordinate RED X 0.633 +/- 0.03
Y 0.339 +/- 0.03
GREEN X 0.286 +/- 0.03
Y 0.610 +/- 0.03
BLUE X 0.147 +/- 0.03
Y 0.065 +/- 0.03
WHITE X 0.276 +/- 0.03
Y 0.283 +/- 0.03
5. Viewing angle 178 R/L, U/D
6. Color Temperature Standard 8,300 9,300 10,300 <Test Signal>
Cool 10,000 11,000 12,000 HDMI input,
Warm 5,500 6,500 7,500 Daylight/Cool 85 IRE
- 8 -
6. Component Video Input (Y, PB, PR)
No.Specification
RemarkResolution H-freq(kHz) V-freq(Hz)
1. 720*480 15.73 59.94 SDTV ,DVD 480I
2. 720*480 15.73 60.00 SDTV ,DVD 480I
3. 720*480 31.47 59.94 SDTV 480P
4. 720*480 31.50 60.00 SDTV 480P
5. 1280*720 44.96 59.94 HDTV 720P
6. 1280*720 45.00 60.00 HDTV 720P
7. 1920*1080 33.72 59.94 HDTV 1080I
8. 1920*1080 33.75 60.00 HDTV 1080I
9. 1920*1080 27 24 HDTV 1080P
10. 1920*1080 33.75 30 HDTV 1080P
No.Specification
RemarkResolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz)
PC DDC
1. 640*350 31.469 70.08 25.17 DOS
2. 720*400 31.469 70.08 28.32 DOS O
3. 640*480 31.469 59.94 25.17 VESA(VGA) O
4. 800*600 37.879 60.31 40.00 VESA(SVGA) O
5. 1024*768 48.363 60.00 65.00 VESA(XGA) O
6. 1280*768 47.776 59.87 79.50 CVT(WXGA) O
7. 1360*768 47.720 59.799 84.75 CVT(WXGA) O
8. 1366*768 47.13 59.65 72
7. RGB PC - RGB PC INPUT Mode Table
- HDMI INPUT(PC/DTV)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
PC DDC
1. 640*480 31.469 59.94 25.17 VESA(VGA) O
2. 800*600 37.879 60.31 40.00 VESA(SVGA) O
3. 1024*768 48.363 60.00 65.00 VESA(XGA) O
4. 1280*768 47.776 59.87 79.50 CVT(WXGA) O
5. 1360*768 47.720 59.799 84.75 CVT(WXGA) O
6. 1366*768 47.13 59.65 72
DTV
7. 720*480 31.469 59.94 27.00 SDTV 480P
8. 720*480 31.500 60.00 27.03 SDTV 480P
9. 1280*720 44.96 59.94 74.17 HDTV 720P
10. 1280*720 45.00 60.00 74.25 HDTV 720P
11. 1920*1080 33.72 59.94 74.17 HDTV 1080I
12. 1920*1080 33.75 60.00 74.25 HDTV 1080I
13. 1920*1080 27 24.00 74.25 HDTV 1080P
14. 1920*1080 33.75 30.00 74.25 HDTV 1080P
- 9 -
8. Mechanical specification 1) 37LC7D
No. Item Content Unit Remark
1. Product Widt(W) Length(D) Height(H) mm
Dimension Before Packing 927 280.5 692.8 mm With Stant
After Packing 999 264 874 mm
2. Product Only SET 20 Kg
With BOX 25 Kg
2) 42LC7D
No. Item Content Unit Remark
1. Product Widt(W) Length(D) Height(H) mm
Dimension Before Packing 1033.4 287.6 750 mm With Stant
After Packing 1119 374 858 mm
2. Product Only SET 24.9 Kg
With BOX 30.4 Kg
- 10 -
9. Customer Menu Setup (Shipment Condition)
No Item Condition Remark
1. Input Mode TV02CH
2. Volume Level 30
3. Mute Off
4. Aspect Ratio 16:9
5. Video EZ Picture Daylight
Contrast 100
Brightness 40
Color 70
Sharpness 70
Tint 0
Color-temperature Cool
XD Auto(On)
Advanced Cinema3:2 Mode(Off)
Black Level(RF,HDMI=>Low),(AV=>High)( RGB-PC,Component=>Disable)
6. Audio Audio Language Off
EZ Sound Normal
Balance 0
Bass 50
Front Surround Off
TV Speaker On
7. Timer Auto clock Off
Manual Clock Off
Off Timer Off
On Timer Off
Sleep Timer Off
Auto Off Off
8. Option Aspect Ratio 16:9
Caption/Text Off
Caption Option Set By Program
Language English
Simplink On
9. Lock Lock System Off
Set password On (Default:0000)
Block channel None
Movie Rating Off
TV Rating-Children None
TV Rating-General None
Input Block Off
10. Channel Memory RF : 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 30, 51, 63
CATV : 15, 16, 17
- 11 -
ADJUSTMENT INSTRUCTION
1. Application ObjectThese instructions are applied to all of the LCD TV, LA73E.
2. Notes(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolationtransformer will help protect test equipment.
(2) Adjustments must be done in the correct order.(3) The adjustments must be performed in the circumstance of
20±5°C of temperature and 65±10% of relative humidity ifthere is no specific designation.
(4) The input voltage of the receiver be must kept 110V, 60Hzwhen adjusting.
(5) The receiver must be operational for about 15 minutesprior to the adjustments.
Perform preliminary operation after receiving 100% White
Pattern (06CH).
(Or 3. White Pattern status of Ez-Adjust)
White Pattern entry method
A) Enter into Ez-Adjust by pressing the ADJ key on the
adjustment R/C.
B) 100% FULL WHITE PATTERN appears if pressing the
OK ( ) key after selecting the 3.WHITE PATTERN with
the CH + / - KEY.
* It is possible to heat run the set without a separatesignal generator in this mode.
Caution : Care must be taken as afterimagephenomena may occur about the black level part ofscreen If leaving pause image turned on for morethan 20 minutes (especially inner digital pattern (13CH), Cross Hatch Pattern (09CH) with significantblack/white contrast).
3. MICOM Download(Option)
3-1. Required Test Equipment(1) JIG-LEVER TYPE for adjusting: 1EA(2) PC & MONITOR: 2EA(3) BOARD for INTERFACE: IIC & ISP BOARD: 2EA(4) 15P D-SUB CABLE: 2EA(5) Using the 12/15 line of D-SUB 15P
12-SDA/15-SCL
3-2. JIG Connection
3-3. Establishment Program(1) Establish LGE Monitor Tools v1.1(2) The program work and it is opened program window as
seen below.
connect ion to PC
connect ion to PC
- 12 -
(3) Click the first icon shown in fig.9. The window seen infig.10 should appear.
3-4. Set Method(1) MCU Select: MTV512M64(2) Option
R/W Option: Auto Write(Verity)Jig Option: MysonTransmit Speed: Medium
(3) Check: Just do it with blank micom.(4) PORT
Chose Parallel Port (normal LPT1)Attention: You must chose EPP when select Rom BIAS atLPT
3-5. Download Method(1) Click the Load File.
(2) Locate and select the correct file from your computer.(*.hex).
(3) Click the Send.
(4) When you see (ISP COMPLETE) the download iscomplete.
- 13 -
6. ADC-Set Adjustment
6-1. SynopsisADC-Set adjustment to set the black level and the Gain tooptimum.
6-2. Test Equipment Service R/C, 801GF(802V, 802F, 802R) or MSPG925FAPattern Generator(480i/1080i The Horizontal 100% Color Bar Pattern adjust towithin 0.7±0.1Vp-p)
[ADC adjustment (MSPG-925Fx series) Model No. & Pattern No.]- Model No.: #209(480i adjustment), #223(1080i adjustment)- Pattern No.: #65(7ColorBar Pattern)
6-3. Adjustment(1) Select Component1 as the input with 100% Horizontal
Color Bar Pattern(HozTV31Bar) in 480i Mode(2) After receiving signal for at least 1 second, press the ADJ
Key on the Service R/C to enter the ‘Ez - Adjust’ and selectthe ‘2. ADC 480i Comp1’.Pressing the Enter Key to adjust automatically.
(3) When the adjustment is over, 'MST3361 ComponentSuccess’ is displayed. If the adjustment has errors,'MST3361 Configuration Error’ is displayed.
(4) Select Component1 as the input with 100% HorizontalColor Bar Pattern(HozTV31Bar) in 1080i Mode.
(5) After receiving signal for at least 1 second, press the ADJKey on the Service R/C to enter the ‘Ez - Adjust’ and selectthe ‘3. ADC 1080i Comp1/RGB’.Pressing the Enter Key to adjust automatically.
(6) When the adjustment is over, 'MST3361 ComponentSuccess’ is displayed. If the adjustment has errors,'MST3361 Configuration Error’ is displayed.
(7) After the Component MST3361 adjustment is over, convertthe RGB-DTV Mode and display Pattern. When the adjustment is over, 'MST3361 RGB_DTVSuccess’ is displayed.
(8) Readjust after confirming the case Pattern or adjustmentcondition where the adjustment errors.
(9) After adjustment is complete, exit the adjustment mode bypressing the ADJ KEY.
<Fig. 2> Adjustment Mode
<Fig. 3> Adjustment Pattern: 480i/1080i 60Hz HozTV30 BarPattern
- 14 -
7. EDID(The Extended Display Identification Data)/DDC(Display Data Channel) Download
This is the function that enables “Plug and Play".
7-1. HDMI EDID Data Input
(1) Required Test Equipment1) PC, Jig for adjusting DDC. (PC serial to D-sub
Connection equipment)2) S/W for writing DDC(EDID data write & read)3) D-Sub cable4) Jig for HDMI Cable connection
(2) Preparation for Adjustments & Setting of Device
1) Set devices as below and turn on the PC and JIG.2) Open S/W for writing DDC (EDID data write & read).
(operated in DOS mode)
7-2. EDID DATA for LA73E
:EDID for HDMI-1 (DDC (Display Data Channel) Data)EDID Block 0 table =
EDID Block 1 table =
:EDID for HDMI-2 (DDC (Display Data Channel) Data)EDID Block 0 table =
EDID Block 1 table =
:EDID for RGB-PCEDID Block 0 table =
0 | 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 | 00 11 01 03 80 73 41 96 0A CF 74 A3 57 4C B0 23 20 | 09 48 4C 2F CE 00 31 40 45 40 61 40 01 01 01 01 30 | 01 01 01 01 01 01 66 21 50 B0 51 00 1B 30 40 70 40 | 36 00 C4 8E 21 00 00 1E 0E 1F 00 80 51 00 1E 30 50 | 40 80 37 00 C4 8E 21 00 00 1C 00 00 00 FD 00 38 60 | 4B 1F 3C 09 00 0A 20 20 20 20 20 20 00 00 00 FC 70 | 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 98
0 | 02 03 16 F1 46 84 05 03 02 20 22 23 15 07 50 66 10 | 03 0C 00 10 00 80 01 1D 00 72 51 D0 1E 20 6E 28 20 | 55 00 C4 8E 21 00 00 1E 01 1D 80 18 71 1C 16 20 30 | 58 2C 25 00 C4 8E 21 00 00 9E 8C 0A D0 8A 20 E0 40 | 2D 10 10 3E 96 00 C4 8E 21 00 00 18 8C 0A D0 8A 50 | 20 E0 2D 10 10 3E 96 00 13 8E 21 00 00 18 00 00 60 | 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 70 | 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 25
0 | 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 | 00 11 01 03 80 73 41 96 0A CF 74 A3 57 4C B0 23 20 | 09 48 4C 2F CE 00 31 40 45 40 61 40 01 01 01 01 30 | 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28 40 | 55 00 C4 8E 21 00 00 1E 01 1D 80 18 71 1C 16 20 50 | 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00 FC 00 4C 60 | 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD 70 | 00 38 4B 1F 3C 09 00 0A 20 20 20 20 20 20 01 66
0 | 02 03 16 F1 46 84 05 03 02 20 22 23 15 07 50 66 10 | 03 0C 00 20 00 80 8C 0A D0 8A 20 E0 2D 10 10 3E 20 | 96 00 C4 8E 21 00 00 18 8C 0A D0 8A 20 E0 2D 10 30 | 10 3E 96 00 13 8E 21 00 00 18 00 00 00 00 00 00 40 | 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 50 | 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 60 | 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 70 | 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 B3
0 | 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 | 00 11 01 03 68 73 41 96 0A CF 30 A3 57 4C B0 23 20 | 09 50 4E A1 08 00 01 01 01 01 01 01 01 01 01 01 30 | 01 01 01 01 01 01 66 21 50 B0 51 00 1B 30 40 70 40 | 36 00 C4 8E 21 00 00 1E 0E 1F 00 80 51 00 1E 30 50 | 40 80 37 00 C4 8E 21 00 00 1C 00 00 00 FD 00 38 60 | 4B 1F 3C 09 00 0A 20 20 20 20 20 20 00 00 00 FC 70 | 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 00 D0
LCD TV SET(or Digital Board)
- 15 -
8. Adjustment of White Balance
8-1. The Purpose and Principal of Color Temperature Adjustment
(1) Purpose: to reduce the difference in color temperatureamong modules
(2) Principal: A module is in full dynamic range when RGBGain on OSD is 192. To adjust the white balance withoutcausing full dynamic range and full data, fix one of RGBGains at 192 and control the other two by reducing themfrom 192.
8-2. Required Equipment(1) Color Analyzer : CA-110 or CA-210
(2) Automatic adjustor (with automatic adjustment necessityand the RS-232C communication being possible)
8-3. Connection Diagram of Equipment for Measuring (Automatic Adjustment)
Use the internal pattern to adjust White Balance. The patternis automatically given when the automatic adjustment deviceis connected or when a user presses ADJ on the remotecontroller to start Ez Adjust and then selects 6.White-Balance.
[ Requirements for Automatic Adjustment
(1) The illuminance of surroundings10 lux or less; preventing light in surroundings as much aspossible
(2) The location of the Probe1) For PDP: place the color analyzer (CA-110, CA-210)
close to the surface of a module and start theadjustment.
2) For LCD: place the color analyzer (CA-110, CA-210)close to the surface of a module within 10 cm and keepthe probe of the color analyzer at 80° to 100° angle fromthe surface of a module.
(3) Aging time1) Once Aging is started, keep the power on without power
supply interruption for at least 15 minutes for heat run.2) For PDP, use the internal pattern to adjust White
Pattern.3) For LCD, use NO SIGNAL or Full White Pattern to
ensure the backlight is turned on.
8-4. Adjustment of White Balance(Automatic Adjustment)
(1) Turn on the POWER ON( ) of the remote controller to setthe adjustment and then start the automatic adjustment orset the Baud Rate to 115200.Â) of the remote controller to
(2) Start the adjustment from “wb 00 00” and complete it at“wb 00 ff”. (Adjust the offset if necessary)
wb 00 00 the automatic adjustment of White Balance isstarted.wb 00 10 adjusting gain (internal pattern appears) isstarted.ja 00 ff adjusting datajb 00 c0...wb 00 1f adjusting gain is completed.Adjust the offset (from wb 00 20 to wb 00 2f) if necessary.wb 00 ff the automatic adjustment of White Balance(internal pattern disappears) is completed.
C A -100+
C O L O R
A N A L Y Z E R
T Y PE ; C A -100+
F u l l W h i t e Pat t er n
R S-232C
Connection Diagram of Automatic Adjustment
- 16 -
[[ RS-232C Command (Automatic Adjustment)
LA73E Chassis Model All]
8-5. Adjustment of White Balance(Manual Adjustment)
Required Equipment : CA-210
(1) Enter ‘Ez - Adjust’ by pressing ADJ KEY on the ServiceRemote Control.
(2) Select "9. TEST PATTERN" using CH +/- Key and HEATRUN at least 30 minutes by pressing the ENTER Key.
(3) Zero Calibrate of the Color Analyzer, then attach sensor toLCD module surface when you adjust.
(4) Select ‘6. White-Balance’ of ‘Ez - Adjust’ by pressing theADJ KEY on the Service R/C. Then enter adjustment modeby pressing the Right KEY (G ) .(The internal pattern of full white appears by pressing G )
(5) The adjustment is conducted in three levels of colortemperature; COOL, MEDIUM, and WARM.
[ Color temperature: Cool, Medium, Warm
(1) When R Gain is fixed at 192,Control G Gain and B Gain by reducing them from 192.
(2) When B Gain is fixed at 192,Control R Gain and G Gain by reducing them from 192.
(3) When G Gain is fixed to 192,Control R Gain and B Gain by reducing them from 192.
Fix one of three Gains (R Gain, G Gain, and B Gain) at 192and control the other two by reducing values from 192 toprevent it from increasing.
(When RGB Gains are all 192, the module is in full dynamicrange.)
R Gain
G Gain
B Gain
R Cut
G Cut
B Cut
jg
jh
ji
Cool
ja
jb
jc
Mid
RS-232C COMMAND
[CMD ID DATA]
CENTER
(DEFAULT)(Decimal)
jd
je
jf
00
00
00
192
192
192
Warm
Min
Max
(Deci
mal)
64
64
64
Cool
64
64
64
Mid
64
64
64
Warm
9. USB S/W Download (Option)
9-1. OverviewUSB Download enables quick response to S/W upgradingand helps to configure the panel to the latest updates.
9-2. How to Download(1) Before starting USB download, ensure that the power is
turned off and the display is turned on.(2) Once the USB memory stick containing the upgraded file
is connected to the USB port on the main board, thefollowing picture appears on the screen.
(3) Check the current version at [Current TV Software VersionInformation] and the target version at [New Found TVSoftware Version Information]. Press Enter on the remotecontroller to confirm the upgrade.
(4) The following picture shows the downloading in progress.Once the download is completed, the power isautomatically turned on and off. (Otherwise, please turnthe power on and off)
(5) Once the download is completed, remove the USBmemory stick from the USB port. Press IN-START on theremote controller to check the upgraded S/W version atthe top of the screen while the display is turned on.
Do not plug off.
Press EXIT to cancel the upgrade.
<S/W Upgrade Screen>
The software upgrade is now in progress.
Until the whole process if completed, please.
- Do not remove the memory card from the slot.
- Do not plug off.
Reading the file---Done
Upgrading---Done
The TV will restart automatically in 0 seconds.
<Downloading in progress Screen>
- 17 -
NoRGB DTV
YesAdaptive Picture Mode
¥Audio Output 10W*2¥Freeze NoOthers
Phase, SizeAdjust
DOS70,VGA60,SVGA60,
XGA60,WXGA60,SXGA60
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Yes(2D)Enhanced Noise Reduction
USE scalier On/Off OSD MenuYesXD Engine
Use Brief InfoO(PSIP)Program Guide Type
1 RF1 RF(Air /Cable)RF
RemarkBroadcomFeature
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Mea
sure
men
t w
avef
orm
700m
V70
0mV
Mea
sure
men
t da
ta
PAL
NTS
C a
nd P
AL
NTS
C a
nd P
AL
Sys
tem
SC
AR
T-C
VB
SAV
RF
Inpu
t sig
nal
* M
easu
rem
ent d
ata
for R
F/A
V a
mpl
itude
at t
he p
oint
of B
CM
3550
inpu
t pin
- 27 -
- V
ideo
Inpu
t lev
el fo
r S
-Vid
eo/C
ompo
nent
500m
V~1V
700m
V
800m
V70
0mV
480i
@60
Hz,
576i
@50
Hz
NTS
C a
nd P
AL
Com
pone
ntS-
Vide
o
Inpu
tIC
spe
c
Mea
sure
men
t w
avef
orm
Mea
sure
men
t da
ta
Sys
tem
Inpu
t sig
nal
* M
easu
rem
ent d
ata
for S
-vid
eo/C
ompo
nent
inpu
t am
plitu
de a
t the
poi
nt o
f B
CM
3550
inpu
t pin
- 28 -
- M
ain
feat
ure
of B
CM
3550
- 29 -
- M
ain
feat
ure
of B
CM
3550
- 30 -
- W
hole
chi
p in
tern
al b
lock
- 31 -
- B
rief d
iagr
am fo
r ou
r sy
stem
Vide
o N
etw
ork Sw
ithFr
ont
Lbox
Det
ect
Lbox
Det
ect
Vide
o N
etw
ork
Swith
Bac
k
NU
LLN
ULL
2D H
D S
cale
r2D
HD
Sca
ler
2D H
D S
cale
r2D
HD
Sca
ler
MA
DM
AD
CR
CC
RC
Cap
ture
0C
aptu
re 0
Cap
ture
1C
aptu
re 1
Cap
ture
2C
aptu
re 2
TNT/
PEP
TNT/
PEP
VBP
VBP
NU
LLN
ULL
Feed
Bac
kFe
ed B
ack
Com
posi
tor
MPE
G F
eede
rM
PEG
Fee
der
Vide
o Fe
eder
Vide
o Fe
eder
Vide
o Fe
eder
Vide
o Fe
eder
Vide
o Fe
eder
Vide
o Fe
eder
ITU
656
ITU
656
HD
-DVI
HD
-DVI
VDEC
0VD
EC 0
Feed
Bac
kFe
ed B
ack
DN
RD
NR
2D S
D S
cale
r2D
SD
Sca
ler
VEC
UpS
cale
rU
pSca
ler
Gra
phic
Gra
phic
VDEC
1VD
EC 1
HD
MI-R
XH
DM
I-RX
Dig
ital
Inpu
t
- 32 -
- A
DC
/IF D
emod
ulat
or
Inba
ndA
FE12
Bit
A/D
Inba
ndA
FE12
Bit
A/D
AG
C C
ontr
ol
ATS
C V
SBA
dvan
ced
Rec
eive
r
ATS
C V
SBA
dvan
ced
Rec
eive
rA
TSC
FEC
ATS
CFE
CIn
band
Out
put
Inte
rfac
e
Inba
ndO
utpu
tIn
terf
ace
OO
B Q
PSK
Rec
eive
rO
OB
QPS
KR
ecei
ver
OO
B
Out
put
Inte
rfac
e
OO
B
Out
put
Inte
rfac
eD
VS-1
67 F
ECD
VS-1
78 F
ECD
VS-1
67 F
ECD
VS-1
78 F
EC
OO
B A
FE6B
it A
/DO
OB
AFE
6Bit
A/D
AG
C C
ontr
ol
QA
M V
SBA
dvan
ced
Rec
eive
r
QA
M V
SBA
dvan
ced
Rec
eive
r
ITU
-T J
.83
Ann
ex
A/B
/C F
EC
ITU
-T J
.83
Ann
ex
A/B
/C F
EC
NTS
C IF
Dem
odul
ator
NTS
C IF
Dem
odul
ator
Inpu
t Ban
dIn
put B
and
Inpu
t Ban
dIn
put B
and
Inpu
t Ban
dIn
put B
and
Inpu
t B
and
Inpu
t B
and
MU
XM
UX
Inpu
t Ban
dIn
put B
and
BC
M35
60 D
ATA
Tran
spor
t Mod
ule
BC
M35
60 D
ATA
Tran
spor
t Mod
ule
Mem
ory
Con
trol
ler
Mem
ory
Con
trol
ler
Vide
o O
utpu
tVi
deo
Out
put
Aud
io O
utpu
tA
udio
Out
put
HSX
1 Se
rial
HSX
1 Se
rial
MPE
G-2
Tra
nspo
rtD
emux
w/D
VB,D
ESM
PEG
-2 T
rans
port
Dem
uxw
/DVB
,DES
- 33 -
- B
efor
e V
ideo
net
wor
k
Vide
o N
etw
ork
Sw
ithFr
ont
AFE
AFE
Fron
tEn
dFr
ont
End
Y/C
Sepa
ratio
nY/
CSe
para
tion
Chr
oma
Dem
oC
hrom
aD
emo
Bac
kEn
dB
ack
End
VDEC
Blo
ck
BVB
Inte
rfac
eB
VBIn
terf
ace
Mem
ory
Inte
rfac
e (S
CB
)M
emor
y In
terf
ace
(SC
B)
SCB
BU
SSC
BB
US
Cro
ma
Con
vers
ion
Cro
ma
Con
vers
ion
Hor
izon
Pan
Scan
Hor
izon
Pan
Scan
Fram
eB
uffe
rFr
ame
Buf
fer
De-
Inte
rD
e-In
ter
MPE
G F
eede
r
BVB
Inte
rfac
eB
VBIn
terf
ace
SCB
DA
TAB
uffe
r
SCB
DA
TAB
uffe
rPi
xel
Cro
ppin
gPi
xel
Cro
ppin
gC
olor
Expa
nsio
nC
olor
Expa
nsio
nC
olor
Key
Col
orK
eyA
lpha
Pre-
Mul
tipl
Alp
haPr
e-M
ultip
l
Gra
phic
Fee
der B
lock Hor
izon
Scal
erH
oriz
onSc
aler
Gam
ma
Cor
rect
ion
Gam
ma
Cor
rect
ion
Col
orC
onve
rtor
Col
orC
onve
rtor
BVB
Inte
rfac
eB
VBIn
terf
ace
Coe
fTab
leC
oefT
able
CLU
TC
LUT
???
???
RG
BC
onve
rter
RG
BC
onve
rter
Inpu
tTi
min
gA
djus
t
Inpu
tTi
min
gA
djus
t
DVI
-Sec
onda
ry
BVB
Inte
rfac
eB
VBIn
terf
ace
???
???
RG
BC
onve
rter
RG
BC
onve
rter
Inpu
tTi
min
gA
djus
t
Inpu
tTi
min
gA
djus
t
DVI
-Prim
ary
BVB
Inte
rfac
eB
VBIn
terf
ace
HD
MI
Rec
eive
Dec
ode
HD
MI
Rec
eive
Dec
ode
HD
CP
Dec
rypt
HD
CP
Dec
rypt
HD
MI B
lock
HD
MI
TMD
SPi
ns
HD
MI
TMD
SPi
ns
Lbox
Det
ect
Lbox
Det
ect
TAB
2D -
Scal
erTA
B2D
-Sc
aler
2D -
Scal
er2D
-Sc
aler
MA
D-IT
MA
D-IT
NU
LLN
ULL
Feed
Bac
kFe
ed B
ack
SCB
BU
SSC
BB
US
Cro
ma
Con
vers
ion
Cro
ma
Con
vers
ion
Hor
izon
Pan
Scan
Hor
izon
Pan
Scan
Fram
eB
uffe
rFr
ame
Buf
fer
De-
Inte
rD
e-In
ter
Vide
o Fe
eder
BVB
Inte
rfac
eB
VBIn
terf
ace
AN
ALO
GPi
nsA
NA
LOG
Pins
HD
MI
Pins
HD
MI
PinsDVI
Pins
DVI
Pins
- 34 -
- S
cale
r an
d M
AD
Vide
o N
etw
ork
Sw
ithFr
ont
Lbox
Det
ect
Lbox
Det
ect
MU
XM
UX
BVB
Rec
eive
rB
VBR
ecei
ver
Vert
ical
Scal
erVe
rtic
alSc
aler
TAB
TAB
MU
XM
UX
MU
XM
UX
Hoa
rizon
alSc
aler
Hoa
rizon
alSc
aler
TAB
2D
-Sca
ler
MU
XM
UX
BVB
Rec
eive
rB
VBR
ecei
ver
Vert
ical
Scal
erVe
rtic
alSc
aler
MU
XM
UX
MU
XM
UX
Hoa
rizon
alSc
aler
Hoa
rizon
alSc
aler
2D-S
cale
r
BVB
Rec
eive
rB
VBR
ecei
ver
Pixe
lD
istr
ibut
ion
Blo
ck
Pixe
lD
istr
ibut
ion
Blo
ckPi
xel
Proc
essi
ngB
lock
Pixe
lPr
oces
sing
Blo
ck
SCB
Out
put
SCB
Out
put
BVB
Inte
rfac
eB
VBIn
terf
ace
Fiel
d C
ontr
ol B
lock
Fiel
d C
ontr
ol B
lock
MA
DVi
deo
Net
wo
rk
Swith
Bac
k
CR
CC
RC
Cap
ture
0C
aptu
re 0
Cap
ture
1C
aptu
re 1
Cap
ture
2C
aptu
re 2
NU
LLN
ULL
NU
LLN
ULL
Feed
Bac
kFe
ed B
ack
VBP
VBPCom
posi
tor
Com
posi
tor
PEP
PEP
Gra
phic
Fee
der B
lock
- 35 -
- P
EP
and
Com
posi
tor
Vide
o N
etw
ork
Sw
ithFr
ont
CR
CC
RC
Vide
o N
etw
ork
Sw
ithFr
ont
BVB
Rec
eive
rB
VBR
ecei
ver
Pack
ing&
RD
MA
Trig
Pack
ing&
RD
MA
Trig
Bur
stFI
FOB
urst
FIFO
Cap
ture
Blo
ck
DM
AD
MA
SCB
BU
SSC
BB
US
NU
LLN
ULL
Feed
Bac
kFe
ed B
ack
VBP
(Vid
eo B
ypas
s)VB
P(V
ideo
Byp
ass)
Gra
phic
Fee
der B
lock
BVB
Rec
ieve
rB
VBR
ecie
ver
CA
BC
AB
422
TO 4
44C
onve
rsio
n42
2 TO
444
Con
vers
ion
LAB
LAB
Col
orC
LIP
Col
orC
LIP
Vide
o In
tra-
Surf
ace
(With
PEP
)
Lum
aK
eyin
gLu
ma
Key
ing
BVB
Inte
rfac
eB
VBIn
terf
ace
Col
or B
right
Adj
ust
(Mat
rix)
Col
or B
right
Adj
ust
(Mat
rix)
Cro
ppin
gC
ropp
ing
Bac
kGro
und
Col
or
Y/C
b/C
r Reg
iste
rY/
Cb/
Cr R
egis
ter
BVB
Rec
ieve
rB
VBR
ecie
verGra
phic
s In
tra-
Surf
ace
Cro
ppin
gC
ropp
ing
BV
BIn
terfa
ceB
VB
Inte
rface
Scre
enC
ompo
site
rSc
reen
Com
posi
ter
Surf
aces
MU
XSu
rfac
esM
UX
Ble
nd0
Ble
nd0
Ble
nd1
Ble
nd1
Ble
nd2
Ble
nd2
Fore
Gro
und
Fore
Gro
und
Fore
Gro
und
Bac
kG
roun
d
Bac
kG
roun
d
Bac
kG
roun
d
BVB
Inte
rface
BVB
Inte
rface
PEP
CO
MPO
SITO
R
BVB
Rec
ieve
rB
VBR
ecie
ver
422
TO 4
44C
onve
rsio
n42
2 TO
444
Con
vers
ion
Vide
o In
tra-
Surf
ace
(With
out P
EP)
Col
or B
right
Adj
ust
(Mat
rix)
Col
or B
right
Adj
ust
(Mat
rix)
Lum
aK
eyin
gLu
ma
Key
ing
Cro
ppin
gC
ropp
ing
BVB
Inte
rfac
eB
VBIn
terf
ace
- 36 -
- B
ack
end(
Dig
ital a
nd A
nalo
g)
VBP
(Vid
eo B
ypas
s)VB
P(V
ideo
Byp
ass)
Vide
oC
ompo
sito
rVi
deo
Com
posi
tor
Mux
Mux Mux
Mux
CSC
(Mat
rix)
CSC
(Mat
rix)
Dig
ital
Vide
oFo
rmat
ter
Dig
ital
Vide
oFo
rmat
ter
VID
EO
_EN
C_P
RIM
_CO
NTR
OL.
SE
LEC
T
656
656
CSC
(Mat
rix)
CSC
(Mat
rix)
Dig
ital
Vide
oFo
rmat
ter
Dig
ital
Vide
oFo
rmat
ter
DVI
Inte
rfac
eD
VIIn
terf
ace
Mux
Mux Mux
Mux
Cro
ssB
arC
ross
Bar
CSC
(Mat
rix)
CSC
(Mat
rix)
Vide
oFo
rmat
ter
Vide
oFo
rmat
ter
SUB
-Car
rier
Mod
ulat
orSU
B-C
arrie
rM
odul
ator
Inpu
tTi
min
gIn
put
Tim
ing
VID
EO
_EN
C_B
YPA
SS
_CO
NTR
OL.
SE
LEC
T
Dig
ital
Tim
ing
RAM
Dig
ital
Tim
ing
RAM
Dig
ital
Tim
ing
Gen
erat
or
Dig
ital
Tim
ing
Gen
erat
or
Dig
ital
Tim
ing
Gen
erat
or
Dig
ital
Tim
ing
Gen
erat
or
MIS
C_I
TU65
6_IN
_MU
X.S
ELE
CT
MIS
C_D
VI_
IN_M
UX
.SE
LEC
T
656
DV
I
DA
C3
DA
C2
DA
C1
DA
C0
- 37 -
- E
xpla
natio
n
Mpe
g Fe
eder
And
Vid
eo F
eede
r (M
FD a
nd V
FD)
-Mpe
g Fe
eder
is a
dat
a pa
th o
f VS
B o
r QA
M d
ecod
ed s
igna
l. Th
ese
sign
als
go to
the
Min
itita
nof
BC
M35
50.
-In th
e m
initi
tan
bloc
k do
pro
cess
ing
the
MP
EG
and
vid
eo.
VD
EC
( V
ideo
Dis
play
Dec
oder
)
-Thi
s bl
ock
has
seve
ral d
etai
led
bloc
k. It
can
han
dle
the
inpu
t com
posi
te s
igna
l fo
r exa
mpl
e, Y
/C s
epar
atio
n,co
lor d
ecod
ing,
aut
o ga
in c
ontro
l, et
c.
AFE
AFE
Fron
tEn
dFr
ont
End
Y/C
Sepa
ratio
nY/
CSe
para
tion
Chr
oma
Dem
oC
hrom
aD
emo
Bac
kEn
dB
ack
End
VDEC
Det
ail B
lock
BVB
Inte
rfac
eB
VBIn
terf
ace
Dig
ital I
nput
-Dig
ital i
nput
can
han
dle
digi
tal v
ideo
sig
nal.
In o
ur s
yste
m th
roug
h th
is p
ath,
com
pone
nt,R
GB
PC, H
DM
I/DVI
sig
nals
are
deco
ded.
So
this
pat
h is
ver
y im
porta
nt b
lock
in o
ur s
yste
m.
Expl
anat
ion
- 38 -
- T
V/C
AT
V d
oesn
't di
spla
y
Che
ck T
U40
01 P
in9(
Vide
o ou
tput
)C
an y
ou s
ee th
e no
rmal
sig
nal?
Che
ck th
e in
put(P
in63
) of A
V sw
itch(
IC50
03).
Can
you
see
the
norm
al w
avef
orm
?
Che
ck th
e ou
tput
(Pin
56) o
f AV
switc
h(IC
5003
).C
an y
ou s
ee th
e no
rmal
wav
efor
m?
Che
ck th
e in
put(P
in1)
of L
PF(IC
4006
).C
an y
ou s
ee th
e no
rmal
wav
efor
m?
YES YE
S
YES
NO
Cou
ld y
ou m
easu
re v
olta
ge o
f TU
4001
&
IIC li
nes?
Are
they
all
norm
al?
Che
ck th
e ou
tput
(Pin
8) o
f LPF
(IC40
06).
Can
you
see
the
norm
al w
avef
orm
?
YES
Che
ck th
e in
put(P
inH
26) o
f B
CM
3550
(IC40
06).
Mea
sure
wav
efor
m a
t C10
10 b
ecau
se it
s
mor
e ea
sy to
che
ck.
Can
you
see
the
norm
al w
avef
orm
?
YES
NO
You
shou
ld c
heck
pow
er li
ne
& II
C li
nes.
YES
You
shou
ld re
plac
e TU
NER
.
NO
Afte
r che
ckin
g th
e Po
wer
of A
V sw
itch
you
shou
ld d
ecid
e to
repl
ace
AV
switc
h or
not
.
NO
Afte
r che
ckin
g th
e Po
wer
of A
V sw
itch
you
shou
ld d
ecid
e to
repl
ace
AV
switc
h or
not
.
NO
Afte
r che
ckin
g th
e Po
wer
of L
PF y
ou s
houl
d de
cide
to re
plac
e LP
F o
r not
.
NO
Afte
r che
ckin
g th
e Po
wer
of L
PF y
ou s
houl
d de
cide
to re
plac
e LP
F o
r not
.
YEX
This
boa
rd h
as b
ig p
robl
em b
ecau
se M
ain
chip
(BC
M35
50) h
ave
som
e tr
oubl
es.
Afte
r che
ckin
g th
orou
ghly
all
path
onc
e ag
ain,
Yo
u sh
ould
dec
ide
to re
plac
e B
CM
3550
or n
ot.
- 39 -
- V
ideo
doe
sn't
disp
lay
Che
ck J
5007
Pin
3CC
an y
ou s
ee th
e no
rmal
wav
efor
m?
Che
ck th
e in
put(P
in1
or P
in8)
of A
V sw
itch(
IC50
03).
Pin1
is fo
r vid
eo1,
Pin8
is
for v
ideo
2.
Can
you
see
the
norm
al w
avef
orm
?
Che
ck th
e ou
tput
(Pin
56) o
f AV
switc
h(IC
5003
).C
an y
ou s
ee th
e no
rmal
wav
efor
m?
Che
ck th
e in
put(P
in1)
of L
PF(IC
4006
).C
an y
ou s
ee th
e no
rmal
wav
efor
m?
YES YE
S
YES
NO
J500
7 m
ay h
ave
prob
lem
. Rep
lace
this
Ja
ck.
Che
ck th
e ou
tput
(Pin
8) o
f LPF
(IC40
06).
Can
you
see
the
norm
al w
avef
orm
?
YES
Che
ck th
e in
put(P
inH
26) o
f B
CM
3550
(IC40
06).
Mea
sure
wav
efor
m a
t C10
10 b
ecau
se it
s
mor
e ea
sy to
che
ck.
Can
you
see
the
norm
al w
avef
orm
?
YES
NO
Afte
r che
ckin
g th
e Po
wer
of A
V sw
itch
you
shou
ld d
ecid
e to
repl
ace
AV
switc
h or
not
.
NO
Afte
r che
ckin
g th
e Po
wer
of A
V sw
itch
you
shou
ld d
ecid
e to
repl
ace
AV
switc
h or
not
.
NO
Afte
r che
ckin
g th
e Po
wer
of L
PF y
ou s
houl
d de
cide
to re
plac
e LP
F o
r not
.
NO
Afte
r che
ckin
g th
e Po
wer
of L
PF y
ou s
houl
d de
cide
to re
plac
e LP
F o
r not
.
YEX
This
boa
rd h
as b
ig p
robl
em b
ecau
se M
ain
chip
(BC
M35
50) h
ave
som
e tr
oubl
es.
Afte
r che
ckin
g th
orou
ghly
all
path
onc
e ag
ain,
Yo
u sh
ould
dec
ide
to re
plac
e B
CM
3550
or n
ot.
- 40 -
- C
ompo
nent
doe
sn't
disp
lay
Che
ck J
5004
,J50
05.
Can
you
see
the
norm
al w
avef
orm
?
Che
ck th
e in
put o
f Com
pone
nt
switc
h(IC
5001
,IC50
02).
Can
you
see
the
norm
al w
avef
orm
?
Che
ck th
e ou
tput
of C
ompo
nent
sw
itch(
IC50
01,IC
5002
). C
an y
ou s
ee th
e no
rmal
wav
efor
m?
Che
ck th
e in
put o
f MST
3361
(IC70
04
Pin4
1,44
,46)
.C
an y
ou s
ee th
e no
rmal
wav
efor
m?
YES YE
S
YES
NO
J500
4,J5
005
may
hav
e pr
oble
m. R
epla
ce th
is
Jack
.
Che
ck th
e ou
tput
of M
ST33
61(IC
7004
).C
an y
ou s
ee th
e no
rmal
wav
efor
m?
YES
Che
ck th
e in
put a
nd o
utpu
t of
BC
M35
50(IC
4006
). Es
peci
ally
you
sho
uld
chec
kTh
e H
,V s
ync
and
cloc
k.C
an y
ou s
ee th
e no
rmal
wav
efor
m?
YES
NO
Afte
r che
ckin
g th
e in
put T
R o
f com
pone
nt, y
ou
shou
ld d
ecid
e to
repl
ace
com
pone
nt s
witc
h or
no
t.
NO
NO
Afte
r che
ckin
g th
e Po
wer
of M
ST33
61 y
ou
shou
ld d
ecid
e to
repl
ace
MST
3361
or n
ot.
NO
YEX
This
boa
rd h
as b
ig p
robl
em b
ecau
se M
ain
chip
(BC
M35
50) h
ave
som
e tr
oubl
es.
Afte
r che
ckin
g th
orou
ghly
all
path
onc
e ag
ain,
Yo
u sh
ould
dec
ide
to re
plac
e B
CM
3550
or n
ot.
Afte
r che
ckin
g th
e Po
wer
of c
ompo
nent
sw
itch
you
shou
ld d
ecid
e to
repl
ace
com
pone
nt s
witc
h or
not
.
Afte
r che
ckin
g th
e Po
wer
of M
ST33
61 y
ou
shou
ld d
ecid
e to
repl
ace
MST
3361
or n
ot.
- 41 -
- R
GB
_PC
doe
sn't
disp
lay
Che
ck in
put c
onne
ct P
7004
.C
an y
ou s
ee th
e no
rmal
wav
efor
m?
Che
ck th
e in
put o
f Com
pone
nt
switc
h(IC
5002
). C
an y
ou s
ee th
e no
rmal
wav
efor
m?
Che
ck th
e ou
tput
of C
ompo
nent
sw
itch(
IC50
02).
Can
you
see
the
norm
al w
avef
orm
?
Che
ck th
e in
put o
f MST
3361
(IC70
04
Pin4
1,44
,46)
.C
an y
ou s
ee th
e no
rmal
wav
efor
m?
YES YE
S
YES
NO
P700
4 m
ay h
ave
prob
lem
. Rep
lace
this
Jac
k.
Che
ck th
e ou
tput
of M
ST33
61(IC
7004
).C
an y
ou s
ee th
e no
rmal
wav
efor
m?
YES
Che
ck th
e in
put a
nd o
utpu
t of
BC
M35
50(IC
4006
). Es
peci
ally
you
sho
uld
chec
kTh
e H
,V s
ync
and
cloc
k.C
an y
ou s
ee th
e no
rmal
wav
efor
m?
YES
NO
Afte
r che
ckin
g th
e in
put T
R o
f RG
BH
V, y
ou
shou
ld d
ecid
e to
repl
ace
thes
e co
mpo
nent
s or
no
t.
NO
NO
Afte
r che
ckin
g th
e Po
wer
of M
ST33
61 y
ou
shou
ld d
ecid
e to
repl
ace
MST
3361
or n
ot.
NO
YEX
This
boa
rd h
as b
ig p
robl
em b
ecau
se M
ain
chip
(BC
M35
50) h
ave
som
e tr
oubl
es.
Afte
r che
ckin
g th
orou
ghly
all
path
onc
e ag
ain,
Yo
u sh
ould
dec
ide
to re
plac
e B
CM
3550
or n
ot.
Afte
r che
ckin
g th
e Po
wer
of R
GB
sw
itch
you
shou
ld d
ecid
e to
repl
ace
com
pone
nt s
witc
h or
no
t.
Afte
r che
ckin
g th
e Po
wer
of M
ST33
61 y
ou
shou
ld d
ecid
e to
repl
ace
MST
3361
or n
ot.
- 42 -
- H
DM
I doe
sn't
disp
lay
Che
ck in
put c
onne
ct P
7007
.C
an y
ou s
ee th
e no
rmal
wav
efor
m?
Che
ck D
DC
com
mun
icat
ion
lines
(IC70
13
Pin5
,6)
Che
ck th
e in
put o
f MST
3361
(IC70
04)
This
sig
nal i
s TM
DS.
Can
you
see
the
norm
al w
avef
orm
?
YES YE
S
NO
P700
7 m
ay h
ave
prob
lem
. Rep
lace
this
Jac
k.
Che
ck th
e ou
tput
of M
ST33
61(IC
7004
).C
an y
ou s
ee th
e no
rmal
wav
efor
m?
YES
Che
ck th
e in
put a
nd o
utpu
t of
BC
M35
50(IC
4006
). Es
peci
ally
you
sho
uld
chec
kTh
e H
,V s
ync
and
cloc
k.C
an y
ou s
ee th
e no
rmal
wav
efor
m?
YES
NO
NO
Afte
r che
ckin
g th
e tr
ace
of T
MD
S lin
es a
nd p
ower
of
MST
3361
, you
sho
uld
deci
de to
repl
ace
MST
3361
or
not.
NO
YEX
This
boa
rd h
as b
ig p
robl
em b
ecau
se M
ain
chip
(BC
M35
50) h
ave
som
e tr
oubl
es.
Afte
r che
ckin
g th
orou
ghly
all
path
onc
e ag
ain,
Yo
u sh
ould
dec
ide
to re
plac
e B
CM
3550
or n
ot.
Afte
r che
ckin
g th
e Po
wer
of t
his
chip
, you
sh
ould
dec
ide
to re
plac
e th
is o
r not
.
Afte
r che
ckin
g th
e Po
wer
of M
ST33
61 y
ou
shou
ld d
ecid
e to
repl
ace
MST
3361
or n
ot.
YES
Che
ck H
DC
P co
mm
unic
atio
n lin
es(IC
7005
Pi
n5,6
)
NO
Afte
r che
ckin
g th
e Po
wer
of t
his
chip
, you
sh
ould
dec
ide
to re
plac
e th
is o
r not
.
- 43 -
300
200
310
500
510
120
820
801
802
80380
0
804
600
610
530
520
400
810
840
900
807
830
80580
6
EXPLODED VIEW
200T
Feb., 2007Printed in KoreaP/NO : MFL36768812