400G and Beyond: The Role of Silicon Photonics in High ... · ... The Role of Silicon Photonics in...

© Finisar Corporation Confidential 1

Tony Pearson

Sr. Dir. Business Development

400G and Beyond: The Role of Silicon Photonics

in High-Speed Optics


Finisar Corporation

Key Messages

Message 1

Message 2

Message 3

Key Messages

Message 1

Message 2

Message 3

World’s Largest Supplier of Fiber Optic Components

and Subsystems

• Optics industry leader with $1.4B+ in annual revenue

• Founded in 1988

• IPO in 1999 (NASDAQ: FNSR)

• 14,000 employees

• Best-in-class broad product line

• Vertically integrated with low cost manufacturing

• Significant focus on R&D and capacity expansion

• ~30% market share

• Experienced management team

• 1300+ Issued U.S. patents

Corporate Headquarters: Sunnyvale, CA USA


CFPSFP+SFP

X2/XENPAKActive Optical Cables

QSFP/QSFP28

CXPOptical Engine

(BOA) XFP

CFP2/ CFP4

Broad Product Portfolio and Customer Base

Key MessagesKey MessagesDATACOM TELECOM

PR

OD

UC

TS

CU

ST

OM

ER

S

PR

OD

UC

TS

CU

ST

OM

ER

S

XFP

ROADM line card

Tunable laser

SFP

PON

WSS

SFP+

CATV

WDM Passives

Coherent Transponder

High speed components

Amplifiers

CFP2-ACO

http://www.h3c.com/portal

http://www.h3c.com/portal

http://www.juniper.net/us/en/

http://www.juniper.net/us/en/


Finisar is the Leader in High-Volume and Low Cost Manufacturing

640k sq ft facility with 200k sq ft clean room

Ipoh manufactured products High-volume transceivers / transponders

CATV products

22.2M units shipped FY 2016

Ipoh, Malaysia

Two multi-floor buildings providing 800k sq ft

on 550k sq ft land

Wuxi manufactured products Passive components

Parallel products

WSS modules / ROADM linecards

TOSAs / ROSAs

ISO 9001 certified

Wuxi, China

ISO 9001

and 14001

certified

ISO 9001

and 14001

certified

Ipoh, Malaysia

High-volume, high mix production of

transceivers/ transponders

640,000 sq ft facility with 240,000 sq ft clean

room on 20 acres of land

22.8 million transceivers produced in FY2016

ISO9001 QMS and IS014001 EMS Certified by

DQS

6,000 employees

Wuxi, China

Production of multi-channel TOSAs/ROSAs,

transceivers and WSS/ROADM products

Significant capacity for advanced packaging

and testing

Approximate ~800,000 sq ft facility

ISO 9001 and 14001 certified

6,000 employees


Finisar is vertically Integrated

Technology Toolbox:

Multimode VCSEL

Singlemode InP lasers

Photo Detectors

Integrated InP MZ

Si-Ge IC design

Silicon Photonics Optical IC design

Optical packaging

Transceiver Integration

TOP VIEW

BOTTOM VIEW

detector

amplifier

IC (TIA)

laser

TOSAcontroller

IC

laser driver post

amplifier IC

DESIGNED BY FINISAR

Optical Chips (lasers, detectors)

Optical Packaging

Integrated Circuits

ROSA

monitor

photodiode

optical

isolator


28Gb/s 40Gb/s

51Gb/s 56Gb/s

Silicon Photonics is Predictable, Deterministic and Repeatable


Finisar is Technology Agnostic; We Use the Best Tool for the Job

VCSEL,

multimode

Silicon

Photonics

DML (Directly

Modulated Lasers)

EML (Electro-

absorption

Modulated Lasers)

PIN photodiode

APD (Avalanche

Photodiodes)

Stacking,

Packaging,

Alignment

IC/Gearbox


The data center application space for 10G and 100 G today

Today’s application space is divided by fiber type and reach:

0-100 m MM MM VCSEL today

0-300 m MM MM VCSEL (10 G today, 100 G soon)

500m-2 km SM DML,Si Photonics (New space)

2km-10 km SM EML, DML

Average Optical Link Length Distributions Moving

to Longer Lengths… and then to Shorter

0m 10 km500m100m 300m 1000m

2016?

Distribution0m 1000m500m100m 300m

4% links

25%

links

3m

60% links

Optics take over intra-rack

10-15% links

2014


70-80% links

Data centers get larger

<5% links10-20% links

2018?


2-3% links

50%

links

3m

40% links

Optics intra-server

8% links

~ 3 dB

Reach

Loss budget ~ 3-4 dB 6.5 dB

Technology

~ 3 dB

EML DML

SMFMMF

MM VCSEL

850 nm = SW

1310nm = LW

DML, Si Photonics


The Market Demands Continuous Improvements in Bandwidth Density

Module

Type

# of

I/O

lanes

Electrical

I/O

I/O

Baud

Rate

Module

BW

Module

Width

(mm)

Module

/rack

Gb/inch

SFP+ 1 10Gb/s-

NRZ

10GB 10Gb/S 13 48 25 (/63)

QSFP+ 4 10Gb/s-

NRZ

10GB 40Gb/S 18 32 67

QSFP28 4 25Gb/s-

NRZ

25GB 100Gb/s 18 32 95

QSFP56 4 50Gb/s-

PAM4

25GB 200Gb/s 18 32 337

QSFP-

DD/

OSFP

8 50Gb/s-

PAM4

25GB 400Gb/s 18 32 674

? 8 100Gb/s-

PAM4

50GB 800Gb/s ? ? ?


Reality Check: VCSEL Beats Silicon Photonics in Cost, Power, Density

VCSEL Tx components:

High speed 850 nm VCSEL, 150um x 150um die, ~8 um diameter

Coupling optics with 10um’s tolerance

VCSEL driver, <10 mA

Non-hermetic packaging

MM Optical alignments: 1

Si photonics Tx components:

High power CW 1310nm DFB, >500 um long

Optical isolator

External modulator

Coupling optics with ~1 um tolerance

Si Photonic PIC + IC driver, several tens of mA

Hermetic box or enclosure

SM optical alignments: 2

Driver

For short reach (<100 m) links, multimode optics have better cost, power, density than silicon photonics

VCSEL

Isolator

MM FiberSM Fiber


100G-PSM4 : A Success Story for Silicon Photonics

100G-PSM4 is a key building

block for today’s networks in

need of tier-to-tier connectivity


Implementation of 100G-PSM4 With Silicon Photonics

Over 84% of the functions are integrated with high yield at wafer level in

a Si fab

SiP integrates 4 modulators, 4 pin diodes, 4 x drivers, 4 x TIAs, CDR in a 3-D

stacked self-hermetic, uncooled chip

Integrated Si photonic PIC

l1

Ge pin

Si MZ

3 D- stacked IC

TIAs, drivers, CDR

Standard grating 25 G/lane

TraditionalWith silicon photonics


Moving Up from 100G-PSM4 to 400G-PSM4

Source: T. Issenhuth, IEEE P802.3cd Sep 2016

400G-PSM4

We can expect the cost-effectiveness of Silicon Photonics to be fully leveraged for

transition from 100G-PSM4 to 400G-PSM4


Silicon Photonics in 400G-PSM4

We expect the same basic structure as 100G-PSM4

Challenges

Retimer IC also includes 8:4 gearbox function

PAM4 modulation and 2x clock frequency limits Rx sensitivity. To make up for it, Tx

Optical Modulation Amplitude (OMA) must also be higher.

This puts extra burden on silicon photonics structures

• losses must be lower

• modulation must be more efficient

• integrated photodetector must have excellent responsivity

• PAM4 error floor must be low enough for FEC to yield very low errors

At Finisar, we are confident that these challenges will be overcome

Silicon Photonics will be a major technology of choice for client-side 400G

optical modules


Silicon Photonics Still Faces Challenges to Become Mainstream

Coupling from small silicon waveguide to fiber is still a major challenge: no cost-effective, high volume method yet in production

“Separate laser” problem. The source of light is still resident in a separate III-V opto-mechanical system or chip

Still not close to CMOS economies of scale (low wafer volumes, special processes, heterogeneous integration)

PDKs are intimately tied to very specific processes and fabs, and not easily transferred or multi-sourced

‘Minimum Unit of Yield’ often is a high-cost sub-assembly, leading to high scrap and rework costs (a major driver of transceiver costs)

“Tweakability” – unlike the traditional discrete component approach, it is difficult to tweak or tune key performance parameters with a SiP designed transceiver


However Silicon Photonics becoming mainstream in 100G Deployments

100G-PSM4

and some

100G-CWDM4


Summary

Long term success in optical modules industry requires scale and vertical

integration

It’s important to maintain a holistic view of all the technology options, and

deploy silicon photonics only where it best serves the purpose

For short reach (<100 m), VCSEL-based multimode optics is still ahead of

silicon photonics in cost/power/density metrics.

Continuing demands to improve density, cost and power over discrete

singlemode optics are key drivers of adoption of silicon photonics at

intermediate and longer reaches

100G PSM4 and some other deployments have established silicon photonics

as a major contender

We expect 400G deployments to strongly leverage silicon photonics in

intermediate reach link segments (500 m - 2 km)


Thank You / Q&A

400G and Beyond: The Role of Silicon Photonics in High ... · ... The Role of Silicon Photonics in...

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