3D-MINTEGRATION The Grand Challenge David Topham · 3D-MINTEGRATION The Grand Challenge David...

The design and manufacture of 3D miniaturised integrated products

3D-MINTEGRATION

The Grand Challenge

David Topham


This project has some very interesting and unforeseen problems!

Pay attention, you may be able to help!


What is it all about?

A project to develop radically new ways of thinking for the end-to-end

DesignProcessingAssemblyPackagingIntegrationand Testing

of complete 3D miniaturised/integrated “3D-MINTEGRATED” products


The silicon revolution

It has to be cut up and put back together somehow to fit in our pockets!But silicon is just so, well, flat!


Visionary

Our vision is a momentous departure from the production of silicon-based "microsystems" whose processing derives from the flat-land of semiconductors

Our intention is to– Design in 3D– Manufacture in 3D– Test in 3D

And at the same time save materials…...and eradicate capital-intensive plant…...and break down restrictive supply chains


Industrially focused

Market driven: The work will underpin next generation automotive, aerospace, telecommunications, medical and consumer products

Tangible deliverables: The project will push breakthrough processes into companies by delivering fundamental design and manufacturing toolsets

Practical: The toolsets will validated through industrially-relevant demonstrators that embody and probe the complex issues behind 3D-MINTEGRATION


Large

We have 20 companies on board

We have a £9.2M 4-year programme involving 7 Research Institutes

With 100 Man/Years of research, a new equipment spend of £1.1m, and an existing equipment asset base of £7m, this is big!


Radical

The Grand Challenge faced by the 3D-MINTEGRATION project is to develop the technologies and strategic approaches required to break the compromises of conventional manufacturing

This is a giant leap from the customary planar integration of semiconductors and silicon microsystems

It meets all of design and manufacture and test head on

It is difficult!

It is why 3D-MINTEGRATION won £4.1m funding under the EPSRC’s UK-wide Grand Challenge Competition


Radical - but organised

The research is organised in 5 themes, spanning from raw materials to products

&3D ProcessingPackaging

IntegrationMicroassembly

Design

Simulation&

Measurement

Materials

&Test

Products


With a direction….

Package device interactionGeneric packaging platforms‘The disappearing package’

Volume independentHighly responsive

Low cost entry

Multi-probe metrologyIn-process testing methodsTrace-ability and calibration

Manufacturingstrategy

Economy of ScaleArtificial Constraints

Test & Measurement

Thought of last, done last. Lab-based practices

Packaging & Integration Discrete Costly Approach

Miocroassembly Product Specific

High throughput 3D technologiesMulti materials

Low cost customisation3D Processing 2D Technologies

20th Century Si fabrication

MultidisciplinaryImmersive design

Risk MitigationConcurrent product & process design

Design & Simulation 19th Century Approach20th Century Tools

Tomorrow (2014)Today (2006)


….and a framework….

Design &

Simulation

Deliverables

3D Processing

Deliverables

Microassem

blyD

eliverables

Packaging &

Integration D

eliverables

Test & M

easurement

Deliverables

Workpackage 1

Design & Simulation

Chris Bailey Greenwich

Workpackage 2

3D Processing

David Allen Cranfield

Workpackage 3

Microassembly

Svetan RatchevNottingham

Workpackage 4Packaging & Integration

Paul Conway Loughborough

Workpackage 5

Test & Measurement

Richard Leach NPL

HUMMS demonstratorBCF & MBDA

Mini-Fluidic demonstrator

Syngenta & Unilever

Miniaturised Electro-Mechanical

demonstratorMBDA & Flomerics

Project Management


….and a plan of action

Build Demonstrator 1



Develop and Build Testbed

Develop design methodology for capturing key product and process characteristics

Develop a front-end design environment, including needs capture, haptic sensing, visualisation and simulation

DesignDemonstrator 1

Design Demonstrator 2

Design Demonstrator 3

Conceptualise Demonstrator 1



Develop parts and processes

Validate Demonstrator 1



Identification and analysis of the key metrology and testing issues


Design & Simulation

Radical change - a risky business?



Design

Simulation&

Measurement

Materials

&Test

Products


Design & Simulation

Innovative thinking:Rapid real-time feedback to integrate and optimise product, tool and process design - Cost implications; Risk factors; and multi-physics simulation of combined materials in unfamiliar environments

Understanding riskIdentify key process and

product characteristics Mitigate risk early in the

design

Fast modellingAnalyse the design space and characterise uncertainty in real timeMulti-physics reduced order models to optimise designs in terms of product and process


Design & Simulation

Innovative thinking:The project is exploring the use of a virtual reality design environment - immersing designers into their own 3D micro-world.

Through 3D-visualisation and hapticfeedback, designers will actually feel

the different emphases of forces, intense heat gradients, stiction, electrostatics and magnetics…...in a totally alien world made

real


3D Processing

Fuelling the step change that is needed



Design

Simulation&

Measurement

Materials

&Test

Products


3D Processing

Innovative thinking:

Micro manufacturing currently uses complex and high cost processes to realise low cost microchips through economies of scale.

The very high cost of entry at present limits the spread of micro manufacturing activities, restricting the market to large industrial enterprises.

3D-MINTEGRATION is developing micro manufacturing technologies that will not only extend the range of materials used, but will increase the take-up of micro manufacturing by establishing processes with a much lower cost of entry


3D Processing

Tool, mould & stencil production

Focused Ion Beam, laser machining, precision

milling, turning, electroforming

Embossing, injection moulding and machining

Design & Simulation

Test & Measurement

… with a focus on costs and industry needs


Microassembly

A paradigm shift in miniature



Design

Simulation&

Measurement

Materials

&Test

Products


Microassembly


The 3D-MINTEGRATION project is concerned with a paradigm shift into the unknown. There may indeed be no "best" microassembly techniques that can be applied across the whole range of products.

The answers sought are those compatible with whole product integration, where 3D Processing, Microassemblyand Packaging are eventually rolled into one seamless process - the ultimate destiny for 3D-Mintegrated products


Microassembly

Today’s ImagingTraditional manufacturing/assembly cell

Desktop factoryCapsule endoscope


Packaging & Integration

Gateways and smart boundaries



Design

Simulation&

Measurement

Materials

&Test

Products




Packaging can be developed to be a smart boundary layer between a product's internal components and also a gateway to the outside world with which the complete product must interact:Polymer packaging, embedding and surface engineering. to create multi-functional integrated systemsReducing the levels of packaging by integration and design whilst preserving the functions and performance of complete 3D systems and sub-systemsSelective polymer microwave and laser processing to create new bonding or sealing technologies that are localized and material selective



Bucking the trends

ComplexityAssembly & joining steps

Materials InterfacesPackagingDesign tools

Func

tions

Sens

ing

Con

trol

Opt

ical

Act

uatio

nFl

uidi

csC

omm

s

Current

trends

Integrat

ed m

ateria

ls

Embedded

inter

connec

t

Smart ch

assis

Substrate

less as

sembly

Integrat

ed pro

cess

es

DfX to

ols

3D-M Goals

3D In

terco

nnect


Test & Measurement

Permeating all activities



Design

Simulation&

Measurement

Materials

&Test

Products


Test & Measurement


The advanced capability of the test laboratory has not yet made it to the production environment, but it will be needed there. Smart, adaptive Test & Measurement must be integrated into every phase of design and manufacture

3D-Mintegrated products, with their buried structures and composite materials, pose tough questions in testing and measurement. These questions spread further, to encompass the validation of tooling and the calibration and control of processes.


Test & Measurement

Early in the project, the Test & Measurement workpackageteamed up with the 3D Processing workpackage to co-develop small scale Co-ordinate Measuring Machine (CMM) stylus manufacture using Ultra-Fast Laser machining.


Three demonstrators

Design &

Simulation

Deliverables

3D Processing

Deliverables

Microassem

blyD

eliverables

Packaging &

Integration D

eliverables

Test & M

easurement

Deliverables

Workpackage 1

Design & Simulation

Chris Bailey Greenwich

Workpackage 2

3D Processing

David Allen Cranfield

Workpackage 3

Microassembly

Svetan RatchevNottingham

Workpackage 4Packaging & Integration

Paul Conway Loughborough

Workpackage 5

Test & Measurement

Richard Leach NPL

HUMMS demonstratorBCF & MBDA

Mini-Fluidic demonstrator

Syngenta & Unilever

Miniaturised Electro-Mechanical

demonstratorMBDA & Flomerics

Project Management


Three demonstrators

Mini-Fluidic systems – The project is concerned with miniaturisation and integration, not

pioneering MEMS fluidics.– There is a particular interest in interfacing, cost/life balance, and graceful

failure modes

Health and Usage Monitoring MicroSystems (HUMMS)– Not inventing new sensor technology but manufacturing and integrating

existing sensor technology. – A “bandage” of sensors and transducers might launch and detect signals

in a cableform, or other kinds of structures including biological structures

Miniaturised Electromechanical systems– Precision engineering at the micro-scale– The demonstrator emphasises the design and simulation problems

entailed by such systems, and the fabrication and testing of critical parts that will enable radical approaches to established applications


Three demonstrators

Creating product ideas to demonstrate and validate the research behind the 3D-MINTEGRATION project presented an unexpected difficulty......thinking of things that have never been done before, because the enabling techniques and processes have not yet been developed, is far more demanding than dreaming up applications for existing expertiseThe project deliverables will push breakthrough processes into companies by introducing fundamental design and manufacturing toolsetsThe demonstrators are intended to validate these toolsets, rather than being deliverables in their own right


Me too?

Zune (and similar) integrate the 3D complexities, mechanics, coatings, magnetics and fluidics of a miniature hard drive, the electrochemistry of both a display and a rechargeable battery, silicon and software, wireless technology and an outer skin and user interface

What does 3D-MINTEGRATION offer in the face of this?


Me too?

These products are the direct result of many years of focused incremental development

But what will these products be?

3D-MINTEGRATION aims to bring similar integration capabilities to a much wider range of products…… through a swift one-time non-incremental product development process


Project partners

Five Innovative Manufacturing Research Centres are providing extensive resources and £2.3m of cash support to the project:– Cambridge Institute for Manufacturing (IFM) – Cranfield Innovative Manufacturing Research Centre (CIMRC) – Loughborough Innovative Manufacturing and Construction Research

Centre (LIMCRC) – Nottingham Innovative Manufacturing Research Centre (NIMRC) – Scottish Manufacturing Institute (SMI)

The consortium is complemented by two leading institutions in Design and Metrology:– University of Greenwich– National Physical Laboratory

£4.1m funding has been received from the UK’s Engineering and Physical Sciences Research Council (EPSRC)Furthermore the project partnership extends to 20 companies, committing some £2.8m of support


Contact info:

www.3d-mintegration.com

Co-ordinator: David [email protected]

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