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3D Circuitry on Thermoplastics Creating Molded Interconnect Devices with Laser Direct Structuring

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Shane Stafford Creative Marketing Specialist LPKF Laser & Electronics North America Stephan Schmidt President LPKF Laser & Electronics North America Don Porter Global Account Manager LPKF Laser & Electronics North America

Our presenters

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Questions

• Submit questions via…

- Your GoTo Webinar panel - Twitter: @LPKF_USA

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What’s on slate for today

1. The rise, fall, and rise of MIDs

2. MID manufacturing methods

3. An analysis of the laser direct structuring process

4. Applications

5. Next steps

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Molded Interconnect Device (MID)

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Circuit board Housing Connector Cable

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MID features

• Fewer components/parts

• Saves space, reduces weight,

lowers cost • 3D workspace opens up design

possibilities

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MID history

• Broke onto the scene in the 1980s

• Despite early fanfare, didn’t catch

on - High threshold for entry

• In recent years, demand for MIDs

has picked up - Miniaturization - New methods lower threshold

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MID apps

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What’s important about MIDs? • Stephan: 3D workspace

• Don: Reducing components

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Common MID manufacturing methods

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Method Parts Moldings App. size Circuit design Manufacturing volume

Two-shot molding

- 1 platable plastic part, 1 non-platable plastic part

- Complex - Large - Medium

- Tied to molding of part - Ideal for simple designs

- Large batch

Laser direct structuring

- 1 platable plastic part - Simple - Medium - Small - Micro

- Independent of molding - Ideal for complex designs

- Large batch - Small batch - Prototyping

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What is laser direct structuring (LDS)?

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• 3-step physiochemical process for

creating 3D circuitry on MIDs

1. Injection molding 2. Laser activation 3. Metallization

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Injection Molding

• 1-shot injection molding of doped

thermoplastics

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Result - Injection Molding

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Laser activation

• Physiochemical reaction etches the

wiring pattern on the plastic and prepares material for selective metallization

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Laser activation

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Laser radiation

Metal Nitrogen Oxygen

polymer + metal-organic complex

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metal seeds

polymer + metallorganic complex

Laser activation

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organic ligands

metal atom

Metal Nitrogen Oxygen

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Laser activation

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Micro-etched, laser activated surface

Smooth, unactivated surface

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Animation

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Result - Laser Activation

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Metallization

• Electroless copper plating

- Metallization only in the laser activated areas

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Metallization

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Immersion Au 0.1µm

Ni 3 µm

Cu 5 µm

Modified polymer

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Result - Selective Metallization

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Applications

• Telecommunications

- You probably have an LDS antenna in your pocket right now!

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Applications

• Automotive

- Steering wheel

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Applications

• Automotive

- Motorcycle handlebar

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Applications

• Automotive

- Motorcycle handlebar

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Applications

• Medical

- Hearing aids

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Applications

• Security

- Drill shield

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Applications

• Fine pitch capabilities

- 6 mil trace/6 mil space or smaller

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Applications

• RFID

- Transponder

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• Sensors

- Pressure sensor

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Source: VTI Oy

Applications

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Why should you consider MIDs?

• Fewer components

• Lighter parts • 3D workspace/design versatility

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Why should you consider LDS?

• Ideal for high mix manufacturing

environments • Complex circuitry

• Cost-effective entry into the world of

MIDs

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Where to go from here?

If you’re interested in laser direct structuring… We can help you… • Find an LDS service provider

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Where to go from here?

Or… • Start working with LDS yourself

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LPKF Laser & Electronics · 503-454-4219

www.lpkfusa.com · sales@lpkfusa.com

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Thank you for your attention!

LPKF Laser & Electronics · 503-454-4208 www.lpkfusa.com · dporter@lpkfusa.com