32LH20R-MA

LCD TVSERVICE MANUAL

CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LP91A

MODEL : 32LH20R 32LH20R-MA

North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com

Internal Use Only

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

C 2009 LGE Internal Use Only- 2 -

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION................................................................11

TROUBLE SHOOTING ............................................................................16

BLOCK DIAGRAM...................................................................................19

EXPLODED VIEW .................................................................................. 20

SVC. SHEET ...............................................................................................



SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.

It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.

Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1M and 5.2M. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.

Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrumentsexposed METALLIC PARTS

Good Earth Groundsuch as WATER PIPE,CONDUIT etc.

AC Volt-meter

When 25A is impressed between Earth and 2nd Groundfor 1 second, Resistance must be less than 0.1*Base on Adjustment standard

IMPORTANT SAFETY NOTICE

0.15uF



CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.

General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power

source before;a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.

2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of itsassemblies.

4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.

7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.

Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the

unit under test.2. After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.

4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).

7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.

8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)

General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate

tip size and shape that will maintain tip temperature within therange or 500F to 600F.

2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.

(500F to 600F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature

(500F to 600F)b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS



IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.

Removal1. Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the soldermelts.

2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.

Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and

solder it.3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as

possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining

on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.

Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit

board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.

Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as

possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit

board.3. Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.

Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow

stake.2. Securely crimp the leads of replacement component around

notch at stake top.3. Solder the connections.

CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.

Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.

At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).

1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.

At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.

1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.



SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.

4. Electrical specification4.1 General Specification

1. Application rangeThis spec sheet is applied to LCD TV used LP91A chassis.

2. SpecificationEach part is tested as below without special appointment.

1) Temperature : 255C (779F), CST : 405C2) Relative Humidity : 6510%3) Power Voltage : Standard input voltage(100~240V@50/60Hz)

* Standard Voltage of each products is marked by models.4) Specification and performance of each parts are followed

each drawing and specif ication by part number inaccordance with BOM.

5) The receiver must be operated for about 5 minutes prior tothe adjustment.

3. Test method1) Performance: LGE TV test method followed 2) Demanded other specification

- Safety: CE, IEC specification- EMC : CE, IEC

No Item Specification Measurement Remark1 Screen Size 32 wide Color Display Module Resolution: 1366*768 / 1920*10802 Aspect Ratio 16:93 LCD Module 32 TFT WXGA LCD HD4 Operating Environment Temp.: 0 ~ 40 deg

Humidity : 0 ~ 80 %5 Storage Environment Temp.: -20 ~ 60 deg

Humidity : 0~ 85 %6 Input Voltage AC100-240V~, 50/60Hz

150 W 32 HD7 LDC Module HD 760 x 450 x 48 with inverter

(Maker : LGD) 0.17025 x 0.5107512 EEFL

Coating 3H


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No. Item Min. Typ. Max. Unit Maker Remark1. Luminance 400 500 cd/m2

(W/O PC mode)2. VIew angle (R/L, U/D) 178/ 178 degree LGD CR > 103. Color Coordinates White Wx Typ 0.279 Typ LGD 32(HD)

Wy -0.03 0.292 +0.03RED Xr 0.636

Yr 0.335Green Xg 0.291

Yg 0.613Blue Xb 0.146

Yb 0.0614. Contrast ratio 800:1 1100:1 LGD 32(HD)5. Luminance Variation 1.3

- 7 - LGE Internal Use Only

5. Chroma& Brightness (Optical)5.1. LCD Module

the Color Coordinates check condition - 50cm from the surface, Full White Pattern- Picture mode Vivid

8. Component Video Input (Y, PB, PR)No Specification Remark

Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz4 720* 480 31.47 59.94 27.000 SDTV 480P5 720* 480 31.50 60.00 27.027 SDTV 480P6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz7 1280* 720 44.96 59.94 74.176 HDTV 720P8 1280* 720 45.00 60.00 74.250 HDTV 720P9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,11 1920* 1080 33.72 59.94 74.176 HDTV 1080I12 1920* 1080 33.75 60.00 74.25 HDTV 1080I13 1920* 1080 56.25 50 148.5 HDTV 1080P14 1920* 1080 67.432 59.94 148.350 HDTV 1080P15 1920* 1080 67.5 60.00 148.5 HDTV 1080P


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No Specification RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)

1 640* 350 31.468 70.09 25.17 EGA2 720* 400 31.469 70.09 28.32 DOS3 640* 480 31.469 59.94 25.17 VESA( VGA)4 800* 600 37.879 60.317 40 VESA( SVGA)5 1024* 768 48.363 60.004 65 VESA( XGA)6 1280* 768 47.776 59.87 79.5 VESA( WXGA)7 1360* 768 47.72 59.799 84.75 VESA( WXGA)8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model

9. RGB 9.1 Analog PC, RGB- DTV NOT SUPPORT

10. HDMI Input 10.1 PC Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable) No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark1 640 x 480 31.469 59.94 25.17 VESA( VGA)2 800 x 600 37.879 60.317 40.00 VESA( SVGA)3 1024 x 768 48.363 60.004 65.00 VESA( XGA)4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)5 1360 x 768 47.72 59.799 84.62 VESA( WXGA) 6 1366 x 768 47.7 60.00 84.62 WXGA7 1280 x 1024 63.595 60.00 108.875 SXGA8 1920 x 1080 66.647 59.988 138.625 WUXGA

10.2 DTV Mode

No Specification RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)

1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I)2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) Spec. out3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz but display.4 720 x 480 31.47 59.94 27 SDTV 480P5 720 x 480 31.5 60.00 27.027 SDTV 480P6 720 x 576 31.25 50.00 27 SDTV 576P7 1280 x 720 44.96 59.94 74.176 HDTV 720P8 1280 x 720 45 60.00 74.25 HDTV 720P9 1280 x 720 37.5 50.00 74.25 HDTV 720P

10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P16 1920 x 1080 27 24.00 74.25 HDTV 1080P17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P

1) Gap between Front Frame /Back cover and Middle Cabinet2) Gap between Front Frame /Middle Cabinet

- 9 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes

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Top View

Back Cover

Front Frame

Middle Cabinet"b

"b

Gap b between Front Frame (Back cover) and Middle Cabinet-> 0 b B (Side gap)

Gap a between Front Frame and Middle Cabine-> 0 a A (Side gap)

"b

"a

Gap a between Front Frame and Middle Cabine-> 0 a A (Left/ Right gap)

3) Gap between Back Cover and Side AV

Back View Side View

Side AV

Back Cover

Gap f between Back Cover and Side AV-> 0 f 1.0Gap g between Back Cover and Side AV-> 0 g 1.0

11. Mechical spec. No Item Min Typ Max Unit 1. C/ A + B/ C top gap 0.5 1 1.5 mm2. C/ A + B/ C side gap 0.5 1 1.5 mm3. C/ A + Deco Front gap( ONE SIDE). 0.8 1 1.2 mm

*Active area1. Active area of LCD PANEL is in bezel of cabinet2. Interval between active area and bezel

|A-B|< 2.0 mm ,|C-D|< 2.0 mmA:Interval between left of active area and bezelB:Interval between right of active area and bezelC:Interval between top of active area and bezelD:Interval between bottom of active area and beze

4)Gap between Back Cover and Side AV


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Side View "h"

Control Braket

Back Cover

Gap h between Back Cover and Control Bracket-> 0 h 0.8

C

B

D

AActive Area

Bezel



ADJUSTMENT INSTRUCTION1. Application Range

This specification sheet is applied to all of the LCD TV,LP91A/B/C/D chassis.

2. Specification1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolationtransformer will help protect test instrument.

2) Adjustment must be done in the correct order.3) The adjustment must be performed in the circumstance of

25 5 C of temperature and 6510% of relative humidity ifthere is no specific designation.

4) The input voltage of the receiver must keep 100~220V,50/60Hz.

5) Before adjustment, execute Heat-Run for 5 minutes at RFno signal.

3. Adjustment items3.1. PCB assembly adjustment items

(1) Download the MSTAR main software(IC800, Mstar ISP Utility)1) Using D/L Jig2) Using USB Memory Stick.

(2) ADC Calibration RGB / Component(3) Input Tool-Option/Area option.(4) Check SW Version.

4. PCB assembly adjustment method4.1. Mstar Main S/W program download4.1.1. Using D/L Jig

(1) Preliminary steps1) Connect the download jig to D-sub(RGB) jack

(2) Download steps1) Execute ISP Tool program, the main window(Mstar ISP

utility Vx.x.x) will be opened2) Click the Connect button and confirm Dialog Box

3) Click the Config. button and Change speed I2C Speedsetting : 350Khz~400Khz

4) Read and write bin file.Click (1)Read tab, and then load downloadfile(XXXX.bin) by clicking Read.

- LH20/ LH30

1

Filexxx.bin

1

Filexxx.bin

5) Click (2)Auto tab and set as below6) Click (3)Run.7) After downloading, you can see the (4)Pass message.

4.1.2. Using the Memory Stick* USB download : Service Mode1) Insert the USB memory stick to the ISB port.2) Automatically detect the SW Version.

-> S/W download process is executed automatically.3) Show the message Copy the file from the Memory

4) After Finished the Download, Automatically DC Off -> On

5) Check The update SW Version.

4.2. Adjust tool/area option.Adjust tool/area option refer to the BOM.

4.3. Adjust tool/area option.Adjust tool/area option refer to the BOM.

4.4. EDID D/L methodRecommend that dont connect HDMI and RGB(D-SUB) cablewhen downloading the EDID.If not possible, recommend that connect the MSPG equipment.There are two methods of downloading the edid data

4.4.1. 1st MethodEDID datas are automatically downloaded when adjusting theTool Option2.Automatically downloaded when pushing the enter key afteradjusting the tool option2.It takes about 2seconds.

4.4.2. 2nd Method* Caution :

Must be checked that the tool option is right or not. If tool option is wrong, hdmi edid data could not bedownloaded well.

1) Press the ADJ key2) Move to the EDID D/L and Press the right direction key(G)3) Press the right direction key(G) at Start.4) After about a few seconds, appear OK, then compele.

4.4.3. RS-232C command Method(1) Command : AE 00 10

* Caution Don t connect HDMI and RGB(D-SUB) cable whendownloading the EDID.If the cables are connected, Downloading of edid could befailed.


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1

Filexxx.bin

4.4.4. EDID data(1) HD MODEL

4.5. ADC Calibration4.5.1. ADC Calibration - Component (Using External pattern)

(1) Required Equipments- Remote controller for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

(2) Process1) Change the Input to Component1 or 2 mode.2) Input the Component 480i@60Hz 100% Color Bar

YPbPr signal into Component1 or 2.(MSPG-925F Model: 209 / Pattern: 65 )

3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is 0 0 0 0.5) Select 0. ADC calibration : Component by using D/E

(CH +/-) and press ENTER(A).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear

4.5.2. ADC Calibration - RGB (Using External pattern)(1) Required Equipments

- Remote controller for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

(2) Process1) Change the Input to RGB mode..2) Input the PC 1024x768@60Hz Horizontal Color Bar

signal into RGB.(MSPG-925F Model: 60 / Pattern: 65 )

3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is 0 0 0 0.5) Select 0. ADC calibration : RGB by using D/E(CH +/-)

and press ENTER(A).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear


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OK

OK

4.6. Input Tool-Option, Area Option.## TOOL Option, Area Option change and AC offBefore PCBA check, you have to change the Tool option,Area option and have to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)

4.6.1. Profile: Must be changed the option value because being differentwith some setting value depend on module maker, inch andmarket

4.6.2. Equipment : adjustment remote control.

4.6.3. Adjustment methodThe input methods are same as other chassis.(Use IN-STARTKey on the Adjust Remocon.)(If not changed the option, the input menu can differ themodel spec.)* Refer to Job Expression of each main chassis ass y

(EBTxxxxxxxx) for Option value * Never push the IN-STOP KEY after completing the functioninspection.

4.7. Check SW Version(1) Method

1) Push In-star key on Adjust remote-controller.2) SW Version check

Check SW VER : V3.xx LH20

5. White Balance adjstment5.1. Overview

(1) Purpose : Adjust the color temperature to reduce thedeviation of the module color temperature.

(2) Principle : To adjust the white balance without thesaturation, Fix the one of R/G/B gain to 192 (default data)and decrease the others.

(3) Adjustment mode : Three modes Cool / Medium / Warm

5.2. Required Equipment(1) Remote controller for adjustment (2) Color Analyzer : CA100+ or CA-210 or same product -

LCD TV (ch:9)(should be used in the calibrated ch by CS-1000)

(3) Auto W/B adjustment instrument(only for Auto adjustment)

5.3. Connecting diagram of equipment formeasuring (For automatic adjustment)

* LP91A~D Support RS-232C & I2C DDC Communication-WhiteBalance Mode.

(1) Enter the adjustment mode of DDC- Set command delay time : 50ms- Enter the DDC adjustment mode at the same time heat-

run mode when pushing the power on by power only key- Maintain the DDC adjustment mode with same condition

of Heat-run => Maintain after AC off/on in status of Heat-run pattern display)

(2) Release the DDC adjustment mode- Release the adjust mode after AC off/on or std-by off/on

in status of finishing the Hear-run mode- Release the Adjust mode when receiving the aging off

command(F3 00 00) from adjustment equipment.- Need to transmit the aging off command to TV set after

finishing the adjustment.- Check DDC adjust mode release by exit key and release

DDC adjust mode)

(3) Enter the adjust mode of white balance)- Enter the white balance adjustment mode with aging

command (F3, 00, FF)* Luminance min value is 150cd in the Cool/Medium/Warm

mode(For LCD)

5.3. Adjustment of White Balance (for Manualadjustment)

(1) Color analyzer(CA100+, CA210) should be used in thecalibrated ch by CS-1000

(2) Operate the zero-calibration of the CA100+ or CA-210,then stick sensor to the module when adjusting.

(3) For manual adjustment, it is also possible by the followingsequence.1) Select white pattern of heat-run by pressing POWER

ON key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)

2) Push Exit key.3) Change to the AV mode by remote control.4) Input external pattern (85% white pattern)5) Push the ADJ key -> Enter 0000 (Password)6) Select 3. W/B ADJUST7) Enter the W/B ADJUST Mode8) Stick the sensor to the center of the screen and select

each items (Red/Green/Blue Gain and Offset) usingD/E(CH +/-) key on R/C..

9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.10) Adjust three modes all (Cool / Medium / Warm) : Fix

the one of R/G/B gain and change the others11) When adjustment is completed, Enter COPY ALL.12) Exit adjustment mode using EXIT key on R/C.


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* CASEFirst adjust the coordinate far away from the target value(x, y).1. x, y > target

i) Decrease the R, G. 2. x, y < target

i) First decrease the B gain, ii) Decrease the one of the others.

3. x > target, y < targeti) First decrease B, so make y a little more than the target.ii) Adjust x value by decreasing the R

4. x < target, y > targeti) First decrease B, so make x a little more than the target.ii) Adjust x value by decreasing the G

(4) Standard color coordinate and temperature when using theCA100+ or CA210 equipment

To check the Coordinates of White Balance, you have tomeasure at the below conditions.Picture Mode : User 1Dynamic Contrast : OffDynamic Colour : Off(If you miss the upper condition, the coordinates of W/Bcan be lower than the spec.)


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Coordinate Mode

x y Temp uv

Cool 0.2760.002 0.2830.002 11000K 0.000Medium 0.2850.002 0.2930.002 9300K 0.000Warm 0.3130.002 0.3290.002 6500K 0.003



TROUBLESHOOTING

No power(LED indicator off)

Check 24V, 12V, 5,2V of Power B/D

Check short of Main B/D or Change Power B/D

Pass

Check Output of IC1001, IC1003, IC1007

Check P307 Connector

Change LED Assy

: [A] PROCESS

Fail

Fail

Pass

Pass

Check LED Assy

Change IC1002,, Q1003

Pass

Check short of IC1001, IC1003, IC1007

Fail

Re-soldering or Change defectpart of IC1001, IC1003, IC1007

Fail

No Raster [B]: Process

Check LED statusOn Display Unit Repeat A PROCESS

Pass

Fail

Check Output of IC802 Change IC802Fail

Change Inverter ConnectorOr InverterFail

Pass

Fail

Pass

Change ModuleFail

Check LVDS Cable

Pass

Check Panel Link Cable Or Module

Change Panel Link CableOr Module

Check Inverter ConnectorOr Inverter

Pass



No Raster on PC Signal

Check Input source Cable And Jack

Pass

Re-soldering or Change the defect part

Pass

Check the Input/OutputOf IC100 Fail

Re-soldering or Change the defect part,Check RGB EDID Data

Repeat [A], & [B] Process

Pass

Check the Input/OutputOf J104 Fail

Pass



Pass

No Raster on COMMPONENT Signal


Pass


Pass




Check The Input/OutputOf JK101 Fail

Pass

No Raster on HDMI Signal


Pass

Check the Input/OutputOf JK301, JK302, JK303 Fail


Pass

Pass



Pass



Pass

Check the Input/OutputOf IC300, IC301, JK302 Fail

Re-soldering or Change the defect partCheck HDMI EDID Data

Re-download HDCP

Pass

Pass






No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal


Pass


Pass

Check The Input/OutputOf JK101, JK201

Pass


Pass

Fail

Pass




Pass

Check The Input/OutputOf TU500

Pass


Pass

Fail




No Sound

Check The Input Sourse

Check The Input/OutputOf IC600

Re-soldering or Change the defect partFail

Pass

Pass

Check The Speaker Change Speaker Fail

Check The Speaker Wire

Pass

Change The Source InputFail



BLOCK DIAGRAM

RG

B_

PC

PC_

Audi

o

TV (RF)

CO

MP1

HD

MI1

HD

MI2

RS2

32

TX

232C

D

rive

rST

3232

CTx

/Rx

:

15Vp

p

PC_

R/G

/B/H

S/VS

PC_

Au

dio

_L/

R :7

00m

Vrm

s

MN

T_O

UT:

1Vp

p

SID

E_V

:1Vp

p

SID

E_L/

SID

E_R

:500m

Vrm

s

DD

R2(

512M

B)

L_SP

K_O

UT

R_

SPK_

OU

T

EEPR

OM

24C

02

Com

p1_

L/R

:500m

Vrm

s

TUN

ER

AV1

_VI

N:

1Vpp

AV1

1_LI

N/R

IN :5

00m

Vrm

s

PWM

NTP

3100

L

MN

T_O

UT

MN

T_LO

UT/

RO

UT:

500m

Vrm

s

AV2

(Sid

e A

V)

MAI

N SC

ALER

TXD

/R

XD : 5

V D

igita

l

CO

MP1

_Y/

Pb/P

r: 1/

0.7V

ppC

OM

P2_

Y/Pb

/Pr: 1/

0.7V

pp

IR HD

MI_

DAT

A_1

HD

MI_

DAT

A_2

HD

MI1

_SC

L/SD

A

OU

T_E_

TX_

CLK

OU

T_E_

TX_

EO

UT_

E_TX

_D

OU

T_E_

TX_

CO

UT_

E_TX

_B

OU

T_E_

TX_

ATU

_M

AIN

S I F

CO

MP1

_Y/

Pb/P

r 1/

0.7V

pp

AV1

_VI

N

PC_

Au

dio

_L/

R

CO

MP1

_LI

N/R

IN

L_C

HR

_CH

LVDSconnector

TU_

MA

INSU

B_

SCL

SDA

EEPR

OM

24C

02

EEPR

OM

24C

02

SIF

AV1

_LI

N/R

IN

MN

T_L/

R O

UT

AV1

MN

T_O

UT

Com

p2_

L/R

:500m

Vrm

s

CO

MP2

_Y/

Pb/

:1/

0.7V

pp

CO

MP2

_LI

N/R

IN

CO

MP2

OU

T_O

_TX

_C

LK

OU

T_O

_TX

_E

OU

T_O

_TX

_D

OU

T_O

_TX

_C

OU

T_O

_TX

_B

OU

T_O

_TX

_A

PC_

R/G

/B/H

S/VS

HD

M2_

SCL/

SDA

PC_

SCL/

SDA

MN

T_VO

UT

AV2

_VI

NA

V2_

LIN

/RIN

IIS_

OU

T

USB

USB

_D

N/P

N

AUD

IOAM

P

HD

MI3

_SC

L/SD

AEE

PRO

M24

C02

HD

MI_

DAT

A_3

TMD

STM

DS

TMD

SH

DM

I3

USB

For

D/L

EEPR

OM

(256

K)

Seri

al F

las

h(8

MB

yte

)R

GB

_PC

PC_

Audi

o

TV (RF)

CO

MP1

HD

MI1

HD

MI2

RS2

32

TX

232C

D

rive

rST

3232

C

PC_

R/G

/B/H

S/VS

PC_

Au

dio

_L/

R :7

00m

Vrm

s

MN

T_O

UT:

1Vp

p

SID

E_V

:1Vp

p

SID

E_L/

SID

E_R

:500m

Vrm

s

DD

R2(

512M

B)

EEPR

OM

24C

02

Com

p1_

L/R

:500m

Vrm

s

TUN

ER

AV1

_VI

N:

1Vpp

AV1

1_LI

N/R

IN :5

00m

Vrm

s

PWM

NTP

3100

L

MN

T_O

UT

MN

T_LO

UT/

RO

UT:

500m

Vrm

s

AV2

(Sid

e A

V)

MAI

N SC

ALER

TXD

/R

XD : 5

V D

igita

l

CO

MP1

_Y/

Pb/P

r: 1/

0.7V

ppC

OM

P2_

Y/Pb

/Pr: 1/

0.7V

pp

HD

MI_

DAT

A_1

HD

MI_

DAT

A_2

_

OU

T_E_

TX_

CLK

OU

T_E_

TX_

OU

T_E_

TX_

OU

T_E_

TX_

C

OU

T_E_

TX_

B

OU

T_E_

TX_

A

TU_

MA

IN

S I F

CO

MP1

_Y/

Pb/P

:1/

0.7V

pp

AV1

_VI

N

PC_

Au

dio

_L/

R

CO

MP1

_LI

N/R

IN

L_C

HR

_CH

LVDSconnector

TU_

MA

IN/

EEPR

OM

24C

02

EEPR

OM

24C

02

SIF

AV1

_LI

N/R

IN

MN

T_L/

R O

UT

AV1

MN

T_O

UT

Com

p2_

L/R

:500m

Vrm

s

CO

MP2

_Y/

Pb/P

r1/

0.7V

pp

CO

MP2

_LI

N/R

IN

CO

MP2

OU

T_O

_TX

_C

OU

T_O

_TX

_E

OU

T_O

_TX

_D

OU

T_O

_TX

_C

OU

T_O

_TX

_B

OU

T_O

_TX

_A

PC_

R/G

/B/H

S/VS

PC_

SCL/

SDA

PC_

SCL/

SDA

MN

T_VO

UT

AV2

_VI

NA

V2_

LIN

/RIN

IIS_

OU

T

USB

USB

_D

N/P

N

AUD

IOAM

P

HD

MI3

_SC

L/SD

AH

DM

I3_

SCL/

SDA

EEPR

OM

24C

02H

DM

I_D

ATA_

3

TMD

STM

DS

TMD

SH

DM

I3

USB

For

D/L

EEPR

OM

(256

K)

Seri

al F

las

h(8

MB

yte

)


LGE Internal Use Only- 20 -

300

200

200T

200N

801

802

803

804

805

806

520

530

540

550

400

900

120

510

500

310

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

A2LV

1A1

0

MULT

I_PW_

SW

10R8

59

56

AR812

SUB_

SDA

HPD_MST_3

+1.8V

_DDR

COMP

2_PB

RT1C

3904

-T11

2Q8

02E

BC

DDR2

_DQM

0

100 R825

0.04

7uF

C828

KEY1

RL_ON

MX25

L640

5DMI

-12G

IC80

2

3NC

_1

2VC

C

4NC

_2

1HO

LD

6NC

_4

5NC

_3

7CS

8SO

/SIO

19

WP/AC

C

10GN

D

11NC

_5

12NC

_6

13NC

_7

14NC

_8

15SI

.SIO

016

SCLK

0.01

uFC8

64

0.1uF C882

I2S_SCK

TMDS

2_RX

2-0.

1uF

C833

I2S_MCLK

USB_DN

100

R882

MAIN

_SIF

PC_G

100 R8024

33R8

44

10 R801

HDMI3_SIDE

0.04

7uF

C830

PANEL_STATUS

TMDS

2_RX

0+

MNT_

VOUT

_T

TMDS3_RX0+

0.1u

FC8

42

SW_R

ESET

RXD

0.01

uFC8

58

TMDS

2_RX

2+

+3.3V

_MUL

TI_MS

T

0.1uF C813

12MHz

X801

10R8

74

1M

R839

4.7u

FC8

12

RL_O

N

M_SDA

DDC_SDA3

+3.3V

_MUL

TI_MS

T

+3.3V

_MST

MUTE

_LINE

EEP_

SCL

E-DIM

SIDE_

RIN

10R8

62

56AR80

5 DDR2

_DQM

1

10 R848

HDMI3_SIDE

EEP_SCL

CEC_C

10

uF

C86

6

0.01

uFC8

60

47R8

34

56

AR813

TMDS3_RX1+

SYS_RESET

SPI_CZ

I2S_SDO

0.1u

FC8

15

22K

R842TM

DS2_R

XC+

DDC_SCL1

0.04

7uF

C837

POWER_SW

47R8

32

TMDS

2_RX

C-

+5VS

T_MS

T

0.1u

FC8

48

56AR81

0

10 R841

HDMI3_SIDE

0.1u

FC8

38

+1.2V

_VDD

C_MS

T

+3.3V

_MUL

TI_MS

TJT

P-11

27W

EMSW

800

1

2 4

3

MNT_

L_AMP

0.1

uF

C81

1

MNT_

VOUT

DDR2_CASZ

PANE

L_ON

1000

pFC8

35

0.1u

FC8

49

PC_B

TMDS3_RX2+

+3.3V

_MUL

TI_MS

T

0.04

7uF

C829

DDC_SCL3

DDR2_BA1

DISP_

EN/VA

VS_O

N

DDR2_RASZ

DDR2

_D[0-

15]

TMDS3_RX0-

10R8

54

COMP

2_Y

33

AR818

0.04

7uF

C832

PC_AUD_L

PC_VS

CVBS_LIN

SPI_D

I

402

R807 R

EADY

0.1uF C883

DDR2_BA0

EEP_

SCL

10 R820

HDMI3_SIDE

0.01

uFC8

59

+3.3V

_MUL

TI_MS

T

DDR2

_DQS

0M

SIDE_

LIN

SIDE_

V0.

047u

FC8

31

0.01

uFC8

03

TMDS

2_RX

1+

+1.8V

_DDR

DDC_SDA1

SUB_

SCL

DSUB_SDA

10R8

90

100

R881

CAT2

4WC0

8W-T

IC80

3

3A

2

2A

1

4V

SS

1A

0

5SD

A

6S

CL

7W

P

8VC

C

DDR2_CKE

+12V

_AUD

IO

SPI_CLK

+3.3V

_MUL

TI_MS

T

DDR2

_DQS

1M

0.01

uFC8

07

KDS1

81D8

03USB_DP

+3.3V

_MST

100 R8025

+3.3V

_MUL

TI_MS

T

56AR80

9

I-DIM

SPI_C

Z

0.1uF C808

0.1u

FC8

04

56 R852

IR

0.01

uFC8

41

EEP_SDA

DDR2

_A[0-

12]

+3.3V

_MUL

TI_MS

T 10 R822HDMI3_SIDE

CVBS

_VIN

10R8

51

DDR2

_DQS

1P

10 R823

HDMI3_SIDE

TMDS3_RXC-

MNT_

VOUT

_T

TMDS

2_RX

0-

+3.3V

_MUL

TI_MS

T

DDR2

_DQS

0P

10 R821

HDMI3_SIDE

10R8

69

47R8

37

DDR2

_MCL

KZ

DDR2_WEZ

TXD

56AR80

6

0.04

7uF

C834

EEP_

SDA

TMDS

1_RXC

+

24LC

256-

I/SM

IC80

1

3A

2

2A

1

4V

SS

1A

0

5SD

A

6S

CL

7W

P

8VC

C

COMP2_R

M_SCL

+3.3V

_MUL

TI_MS

T

PC_HS

TMDS

1_RX

2-

0.01

uFC8

50

+3.3V

_MUL

TI_MS

T

TMDS3_RXC+

47uF

25V

C870

+3.3V

_MUL

TI_MS

T

470

R835

10R8

91

KDS1

81D8

02

TV_M

AIN

1000pF C818

COMP

2_PR

RT1C

3904

-T11

2Q8

04N

ON

19_

22"

EB

C

0.1

uF

C86

7

22K

R845

100 R8026

TMDS3_RX1-

P_24

V_SM

ALL_

15V

0.01uF C840

2.2u

FC8

61

HPD_

MST_

1

10R8

73

10R8

80

SPI_D

O

PC_AUD_R

0.01

uFC8

10

56

AR814

+1.2V

_VDD

C_MS

T

100 R8023

TMDS

2_RX

1-

DDC_SCL2

10R8

58

10R8

92

TMDS

1_RX

1+

10R8

71

TMDS

1_RX

2+

EEP_

SDA

56

AR800

10 R805

HDMI3_SIDE

KDS1

81D8

01

DDR2_ODT

TMDS

1_RX

C-

SPI_DI

I2S_WS

DDR2

_MCL

K

0.04

7uF

C826

TMDS

1_RX

0-

10R8

72

MNT_

R_AM

P

10R8

79

HPD_

MST_

2

0.1u

FC8

53

0.01

uFC8

39

DSUB_SCL

0.01

uFC8

65

COMP2_L

10uF16V C809

+1.8V

_DDR

0.01

uFC8

62

+1.2V

_VDD

C_MS

T

TMDS

1_RX

1-

4.7uF C820

100 R824

100 R829

KEY2

56

AR815

TMDS

1_RX

0+

0.01

uFC8

57

CVBS_RIN

2.2u

FC8

56

0.1u

FC8

69

+5VS

T_MS

T

0.1u

FC8

14

PC_R

SPI_C

LK

33R8

43

0.1uF C844

10R8

56

TMDS3_RX2-

0.01uF C876

DDC_SDA2

SPI_DO

P_12

V_SM

ALL_

15V

+5VS

T_MS

TPO

WER_

DET

POWER_DET

RT

1C

3904

-T11

2Q

803

E

B

C

+5VS

T_MS

T

SYS_

RESE

T

100 R8012

0.01

uFC8

770.

01uF

C878

0.01

uFC8

79

TXD

RXD

0.1uF C863

ISA1

530A

C1Q8

00E

BC

ISA1

530A

C1Q8

01

EB

C

2.2

uF

16V

C80

00R

EAD

Y

+3.3V

_MUL

TI_MS

T

0

R806

0 R870

S_VID

EO_D

ET

SIDE_

YSID

E_C

DDC_

WP

OPC_

EN

4.7K

R877

4.7K

R800

44.

7KR8

17

470

R809

47

R80

41

220

R808

68R810

0R80

0RE

ADY

0R800

1

390

R840

47R8

14

47R8

1647

R818

47R8

38

47R8

33

47R8

36

470

R803

47R8

0447

R815

47R8

9747

R802

47R8

3147

R857

47R8

30

47R8

7547

R876

100

R846

100

R847

100

R8039

HDMI3_SIDE

100

R8040

HDMI3_SIDE

4.7K

R863

4.7K

R864

10

0R

8042

1KR

8038

1KR

8018

4.7K

R865

4.7K

R866

1K R867

1K R868

100R8021

100R8022

100 R850

100 R849

100 R895

0

READY

R8017

0

READY

R8016

0 R8033

READY

0 R8034

0 R8035

10K

R80

20

10K

R800

3

0.04

7uF

C800

0.04

7uF

C801

0.04

7uF

C827

0.04

7uF

C825

0.04

7uF

C847

0.04

7uF

C845

0.04

7uF

C843

0.04

7uF

C836

0.1u

FC8

68

1000

pFC8

46

1KR884

READ

Y1KR8

89

1KR811

READ

Y1KR8

83

4.7K

R802

84.

7KR8

027

22R8

12

22R8

13

0.1u

FC8

19

0.1u

FC8

060.

1uF

C805

4.7K

Non_

Small

_FHD

R801

0-*2 4.

7KSm

all_F

HD

R801

0-*1

4.7K

Small

_HD

R896

4.7K

Apol

lo

R801

0-*3

4.7K

Small

_FHD

R896

-*1

4.7K

Non_

Small

_HD

R801

1-*1

4.7K

Non_

Small

_HD

R896

-*2

4.7K

Apol

lo

R801

1-*2

4.7K

Apol

lo

R898

-*14.7

KNo

n_Sm

all_F

HDR8

98

4.7K

100H

zR8

011-

*34.

7K10

0Hz

R898

-*2

4.7K

R801

1Sm

all_F

HD4.

7KR8

010

Small

_HD

22R8

005

22R8

006

0 R826

0 R827

4.7

uF

10V

C87

1

REA

DY

12

0-o

hm

L8

00

120-ohm

L801

12

0-o

hm

L8

02

2.2uF C823

2.2uF C824

2.2uF C821

2.2uF C873

2.2uF C822

2.2uF C874

2.2uF C802

2.2uF C875

MST9

9A88

ML(MA

TRIX B

ASIC)

IC80

0

1RX

BCKN

2RX

BCKP

3RX

B0N

4RX

B0P

5HO

TPLU

GB6

RXB1

N7

RXB1

P8

AVDD

_33_

19

RXB2

N10

RXB2

P11

RXAC

KN12

RXAC

KP13

RXA0

N14

RXA0

P15

AVDD

_33_

216

RXA1

N17

RXA1

P18

GND_

119

RXA2

N20

RXA2

P21

HOTP

LUGA

22RE

XT23

VCLAM

P24

REFP

25RE

FM26

BIN1

P27

SOGI

N128

GIN1

P29

RIN1

P30

BINM

31BI

N0P

32GIN

M33

GIN0

P34

SOGI

N035

RINM

36RI

N0P

37AV

DD_3

3_3

38GN

D_2

39BI

N2P

40GI

N2P

41SO

GIN2

42RI

N2P

43CV

BS6

44CV

BS5

45CV

BS4

46CV

BS3

47CV

BS2

48CV

BS1

49VC

OM1

50CV

BS0

51VC

OM0

52AV

DD_3

3_4

53CV

BSOU

T54

GND_

355

SIF0

P56

SIF0M

57VD

DC_1

58AU

L559

AUR5

60AU

VRM

61AU

OUTL2

62AU

OUTR

263

AUOU

TL164

AUOU

TR1

65AUL0

66AUR0

67AUL1

68AUR1

69AUL2

70AUR2

71AUL3

72AUR3

73AUCOM

74AUL4

75AUR4

76GND_4

77AUVRP

78AUVAG

79AVDD_AU

80GND_5

81VDDC_2

82DDCA_CK

83DDCA_DA

84DDCDA_CK

85DDCDA_DA

86DDCDB_CK

87DDCDB_DA

88GPIO20

89VDDP_1

90VDDC_3

91UART2_RX

92UART2_TX

93DDCDC_CK

94RXCCKN

95RXCCKP

96DDCDC_DA

97RXC0N

98RXC0P

99GND_6

100RXC1N

101RXC1P

102AVDD_DM

103RXC2N

104RXC2P

105HOTPLUGC

106USB1_DM

107USB1_DP

108SCK

109SDI

110SDO

111SCZ

112PWM0

113PWM1

114PWM2

115PWM3

116LVA4P

117LVA4M

118LVA3P

119LVA3M

120LVACKP

121LVACKM

122LVA2P

123LVA2M

124LVA1P

125LVA1M

126LVA0P

127LVA0M

128VDDP_2

129

LVB4

P13

0LV

B4M

131

LVB3

P13

2LV

B3M

133

LVBC

KP13

4LV

BCKM

135

LVB2

P13

6LV

B2M

137

LVB1

P13

8LV

B1M

139

LVB0

P14

0LV

B0M

141

AVDD

_LPL

L14

2GN

D_7

143

VDDC

_414

4GP

IO15

0/I2C

_OUT

_MUT

E14

5GP

IO15

1/I2C

_OUT

_SD2

146

GPIO

152/I

2C_O

UT_S

D314

7GN

D_8

148

GPIO

5114

9GP

IO52

150

GPIO

5315

1GP

IO54

152

GPIO

5515

3GP

IO56

154

GPIO

5715

5GP

IO58

156

VDDP

_315

7VD

DC_5

158

B_MD

ATA[4

]15

9B_

MDAT

A[3]

160

GND_

916

1B_

MDAT

A[1]

162

B_MD

ATA[6

]16

3AV

DD_D

DR_1

164

B_MD

ATA[1

1]16

5B_

MDAT

A[12]

166

GND_

1016

7B_

MDAT

A[9]

168

B_MD

ATA[1

4]16

9AV

DD_D

DR_2

170

B_DD

R2_D

QM[1]

171

B_DD

R2_D

QM[0]

172

GND_

1117

3B_

DDR2

_DQS

[0]17

4B_

DDR2

_DQS

B[0]

175

AVDD

_DDR

_317

6VD

DP_4

177

GND_

1217

8B_

DDR2

_DQS

[1]17

9B_

DDR2

_DQS

B[1]

180

AVDD

_DDR

_418

1B_

MDAT

A[15]

182

B_MD

ATA[8

]18

3GN

D_13

184

B_MD

ATA[1

0]18

5B_

MDAT

A[13]

186

AVDD

_DDR

_518

7B_

MDAT

A[7]

188

B_MD

ATA[0

]18

9B_

MDAT

A[2]

190

B_MD

ATA[5

]19

1B_

MCLK

192

B_MC

LKZ

193 GND_14

194 AVDD_MEMPLL

195 MVREF

196 A_ODT

197 A_RASZ

198 A_CASZ

199 A_MADR[0]

200 A_MADR[2]

201 A_MADR[4]

202 GND_15

203 A_MADR[6]

204 A_MADR[8]

205 A_MADR[11]

206 A_WEZ

207 A_BADR[1]

208 A_BADR[0]

209 A_MADR[1]

210 A_MADR[10]

211 AVDD_DDR_6

212 A_MADR[5]

213 A_MADR[9]

214 A_MADR[12]

215 A_MADR[7]

216 A_MADR[3]

217 A_MCLKE

218 VDDC_6

219 I2S_IN_WS/GPIO67

220 I2S_IN_BCK/GPIO68

221 I2S_IN_SD

222 I2S_OUT_MCK

223 I2S_OUT_WS

224 VDDP_5

225 GND_16

226 VDDC_7

227 I2S_OUT_BCK

228 I2S_OUT_SD

229 SPDIFO

230 UART2_RX/I2CM_SDA

231 UART2_TX/I2CM_SCK

232 UART1_RX/GPIO86

233 UART1_TX/GPIO87

234 GND_17

235 GND_18

236 USB0_DM

237 USB0_DP

238 SAR0

239 SAR1

240 SAR2

241 SAR3

242 AVDD_MPLL

243 XOUT

244 XIN

245 GPIO134

246 GPIO135

247 GPIO138

248 GPIO139

249 GPIO140

250 IRIN

251 HSYNC0

252 VSYNC0

253 HSYNC1

254 VSYNC1

255 CEC

256 HWRESET

LG

E3767A

[MS

T99A

88M

L(M

AT

RIX

ON

LY S

D D

IVX

_ N

ON

RM

) ]

IC8

00

-*1

1R

XBCK

N

2R

XBCK

P

3R

XB0N

4R

XB

0P

5H

OTP

LUG

B

6R

XB1N

7R

XB

1P

8A

VD

D_3

3_1

9R

XB2N

10

RX

B2P

11

RXAC

KN

12

RXA

CKP

13

RXA

0N

14

RX

A0P

15

AV

DD

_33_

2

16

RXA

1N

17

RX

A1P

18

GN

D_1

19

RXA

2N

20

RX

A2P

21

HO

TPLU

GA

22

REX

T

23

VCLA

MP

24

RE

FP

25

REF

M

26

BIN

1P

27

SO

GIN

1

28

GIN

1P

29

RIN

1P

30

BIN

M

31

BIN

0P

32

GIN

M

33

GIN

0P

34

SO

GIN

0

35

RIN

M

36

RIN

0P

37

AV

DD

_33_

3

38

GN

D_2

39

BIN

2P

40

GIN

2P

41

SO

GIN

2

42

RIN

2P

43

CVB

S6

44

CVB

S5

45

CVB

S4

46

CVB

S3

47

CVB

S2

48

CVB

S1

49

VCO

M1

50

CVB

S0

51

VCO

M0

52

AV

DD

_33_

4

53

CVBS

OUT

54

GN

D_3

55

SIF

0P

56

SIF

0M

57

VD

DC

_1

58

AU

L5

59

AUR

5

60

AUVR

M

61

AUO

UTL

2

62

AUO

UTR2

63

AUO

UTL

1

64

AUO

UTR1

65 AUL0

66 AUR0

67 AUL1

68 AUR1

69 AUL2

70 AUR2

71 AUL3

72 AUR3

73 AUCOM

74 AUL4

75 AUR4

76 GND_4

77 AUVRP

78 AUVAG

79 AVDD_AU

80 GND_5

81 VDDC_2

82 DDCA_CK

83 DDCA_DA

84 DDCDA_CK

85 DDCDA_DA

86 DDCDB_CK

87 DDCDB_DA

88 GPIO20

89 VDDP_1

90 VDDC_3

91 UART2_RX

92 UART2_TX

93 DDCDC_CK

94 RXCCKN

95 RXCCKP

96 DDCDC_DA

97 RXC0N

98 RXC0P

99 GND_6

100 RXC1N

101 RXC1P

102 AVDD_DM

103 RXC2N

104 RXC2P

105 HOTPLUGC

106 USB1_DM

107 USB1_DP

108 SCK

109 SDI

110 SDO

111 SCZ

112 PWM0

113 PWM1

114 PWM2

115 PWM3

116 LVA4P

117 LVA4M

118 LVA3P

119 LVA3M

120 LVACKP

121 LVACKM

122 LVA2P

123 LVA2M

124 LVA1P

125 LVA1M

126 LVA0P

127 LVA0M

128 VDDP_2

12

9LV

B4P

13

0LV

B4M

13

1LV

B3P

13

2LV

B3M

13

3LV

BCKP

13

4LV

BCKM

13

5LV

B2P

13

6LV

B2M

13

7LV

B1P

13

8LV

B1M

13

9LV

B0P

14

0LV

B0M

14

1AV

DD

_LPL

L1

42

GN

D_7

14

3V

DD

C_4

14

4G

PIO

150/

I2C

_OU

T_M

UTE

14

5G

PIO

151/

I2C

_OU

T_S

D2

14

6G

PIO

152/

I2C

_OU

T_S

D3

14

7G

ND

_81

48

GP

IO51

14

9G

PIO

521

50

GP

IO53

15

1G

PIO

541

52

GP

IO55

15

3G

PIO

561

54

GP

IO57

15

5G

PIO

581

56

VD

DP

_31

57

VD

DC

_51

58

B_M

DA

TA[4

]1

59

B_M

DA

TA[3

]1

60

GN

D_9

16

1B

_MD

ATA

[1]

16

2B

_MD

ATA

[6]

16

3AV

DD

_DD

R_1

16

4B

_MD

ATA

[11]

16

5B

_MD

ATA

[12]

16

6G

ND

_10

16

7B

_MD

ATA

[9]

16

8B

_MD

ATA

[14]

16

9AV

DD

_DD

R_2

17

0B

_DD

R2_

DQ

M[1

]1

71

B_D

DR

2_D

QM

[0]

17

2G

ND

_11

17

3B

_DD

R2_

DQ

S[0

]1

74

B_D

DR

2_D

QS

B[0

]1

75

AVD

D_D

DR

_31

76

VD

DP

_41

77

GN

D_1

21

78

B_D

DR

2_D

QS

[1]

17

9B

_DD

R2_

DQ

SB

[1]

18

0AV

DD

_DD

R_4

18

1B

_MD

ATA

[15]

18

2B

_MD

ATA

[8]

18

3G

ND

_13

18

4B

_MD

ATA

[10]

18

5B

_MD

ATA

[13]

18

6AV

DD

_DD

R_5

18

7B

_MD

ATA

[7]

18

8B

_MD

ATA

[0]

18

9B

_MD

ATA

[2]

19

0B

_MD

ATA

[5]

19

1B_

MCL

K1

92

B_M

CLKZ

193GND_14

194AVDD_MEMPLL

195MVREF

196A_ODT

197A_RASZ

198A_CASZ

199A_MADR[0]

200A_MADR[2]

201A_MADR[4]

202GND_15

203A_MADR[6]

204A_MADR[8]

205A_MADR[11]

206A_WEZ

207A_BADR[1]

208A_BADR[0]

209A_MADR[1]

210A_MADR[10]

211AVDD_DDR_6

212A_MADR[5]

213A_MADR[9]

214A_MADR[12]

215A_MADR[7]

216A_MADR[3]

217A_MCLKE

218VDDC_6

219I2S_IN_WS/GPIO67

220I2S_IN_BCK/GPIO68

221I2S_IN_SD

222I2S_OUT_MCK

223I2S_OUT_WS

224VDDP_5

225GND_16

226VDDC_7

227I2S_OUT_BCK

228I2S_OUT_SD

229SPDIFO

230UART2_RX/I2CM_SDA

231UART2_TX/I2CM_SCK

232UART1_RX/GPIO86

233UART1_TX/GPIO87

234GND_17

235GND_18

236USB0_DM

237USB0_DP

238SAR0

239SAR1

240SAR2

241SAR3

242AVDD_MPLL

243XOUT

244XIN

245GPIO134

246GPIO135

247GPIO138

248GPIO139

249GPIO140

250IRIN

251HSYNC0

252VSYNC0

253HSYNC1

254VSYNC1

255CEC

256HWRESET

3.3

KR

819

DSUB_SDA

LED_R

RT1C

3904

-T11

2Q8

05R

EAD

Y

EB

CDD

C_WP

10K

R828

REA

DY

4.7K

R878

4.7K

R893

1KR8

61

0

R80

37N

ON

19_

22"

0 R894

0 R899

2KR886

150

R885

1KR8

60

10K

R800

0

33K

R800

7N

ON

19_

22"

10K

R855

1KR853

100

R888

33K

R887

20K

R80

36

19

_2

2_

26

"

20pF C817

20pF C816

DDR2_A[2]

DDR2

_D[1]

DDR2_A[6]

GND

DDR2

_D[5]

DDR2_A[10]

DDR2

_D[0]

DDR2

_D[10

]

DDR2_A[12]

DDR2

_D[14

]

DDR2_A[0]

DDR2

_D[6]

DDR2_A[5]

DDR2

_D[3]

DDR2_A[4]

DDR2

_D[4]

DDR2

_D[12

]

DDR2_A[9]

DDR2

_D[11

]

DDR2_A[8]

DDR2

_D[8]

DDR2

_D[7]

DDR2

_D[15

]

DDR2

_D[9]

DDR2_A[3]

DDR2

_D[13

]

DDR2_A[11]

DDR2

_D[2]

DDR2_A[1]

DDR2_A[7]

TXCE

4-TX

CE4+

TXCE

3-TX

CE3+

TXCL

KE-

TXCL

KE+

TXCE

2-TX

CE2+

TXCE

1-TX

CE1+

TXCE

0-TX

CE0+

TXCO

4-TX

CO4+

TXCO

3-TX

CO3+

TXCL

KO-

TXCL

KO+

TXCO

2-TX

CO2+

TXCO

1-TX

CO1+

TXCO

0-TX

CO0+

I2S_O

UT HDM

I_3

EEPR

OM

HDMI_1

[MODE

SELE

CTION

]

HDMI_2

C804

/C80

5/C8

06:C

lose

to IC

a

s c

lose

as

poss

ible

GAIN

X 4

RESE

T

Close to IC

with width trace

Clos

e to

IC a

s cl

ose

as p

ossi

ble

HDCP

EEPR

OM

USB PART

SERI

AL FL

ASH

64M

S-V

IDE

O

4.7K

X4.7K

4.7K

X4.

7K

R801

0

X

R898

Non

Small

FHD

4.7K

X4.

7K

Small

HD

*H/

W OP

TION

4.7K

4.7K

4.7K

100H

Z

4.7K

4.7K

4.7K

Apol

lo

Non

Small

HD

R801

1

X

X

X 4.7K

X

R896 X

Smal

l FHD

(27)

4.7KX

** S

ma

ll H

D :

19

/22

/26

In

ch

** N

on

Sm

all

FH

D :

No

rma

l(non

100

Hz)

FH

D M

odel

THE

S

YMBO

L MAR

K OF

THIS

SCH

EMET

IC D

IAGR

AM IN

CORP

ORAT

ESSP

ECIA

L FEA

TURE

S IM

PORT

ANT F

OR P

ROTE

CTIO

N FR

OM X

-RAD

IATIO

N.FI

LRE

AND

ELEC

TRIC

AL S

HOCK

HAZ

ARDS

, WHE

N SE

RVIC

ING

IF IS

ES

SENT

IAL TH

AT O

NLY M

ANUF

ATUR

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ECFIE

D PA

RTS B

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D FO

RTH

E CR

ITICA

L COM

PONE

NTS

IN TH

E S

YMBO

L MAR

K OF

THE

SCHE

METIC

.

SCHEMATIC DIAGRAM


LGE Internal Use Only

MSTAR

+1.8

V_D

DR

DD

R2_A

[0-1

2]

DD

R2_

BA

0D

DR

2_B

A1

DD

R2_

MC

LKD

DR

2_M

CLK

ZD

DR

2_C

KE

DD

R2_

OD

T

DD

R2_

RA

SZ

DD

R2_

CA

SZ

DD

R2_

WE

Z

DD

R2_

DQ

S0P

DD

R2_

DQ

S1P

DD

R2_

DQ

M0

DD

R2_

DQ

M1

DD

R2_

DQ

S0M

DD

R2_

DQ

S1M

+1.8

V_D

DR

+1.8

V_D

DR

DD

R2_D

[0-1

5]

10

00

pF

C90

5

V_R

EF

56

R90

0

56

R90

1

56

R90

2 56

R90

3

56

R90

4 56

R90

5

0.0

1u

FC

904

0.0

1u

F50

V

C90

0

0.0

1u

FC

901

0.0

1u

FC

902

0.0

1u

FC

903

0.0

1u

FC

906

0.0

1u

FC

907

0.0

1u

FC

908

0.0

1u

FC

909

0.0

1u

FC

910

0.0

1u

FC

911

0.0

1u

FC

912

0.0

1u

FC

913

0.0

1u

FC

914

0.0

1u

FC

915

0.0

1u

FC

916

0.0

1u

FC

917

+1.8

V_D

DR

15

0R

906

REA

DY

THE

SYM

BOL M

ARK

OF TH

IS S

CHEM

ETIC

DIA

GRAM

INCO

RPOR

ATES

SPEC

IAL F

EATU

RES

IMPO

RTAN

T FOR

PRO

TECT

ION

FROM

X-R

ADIA

TION.

FILR

E AN

D EL

ECTR

ICAL

SHO

CK H

AZAR

DS, W

HEN

SERV

ICIN

G IF

IS

ESSE

NTIAL

THAT

ONL

Y MAN

UFAT

URES

SPEC

FIED

PART

S BE

USED

FOR

THE

CRITI

CAL C

OMPO

NENT

S IN

THE

SYM

BOL M

ARK

OF TH

E SC

HEME

TIC.

V_R

EF

0.1

uF

50V

C91

8

HY

B1

8T

C5

12

16

0B

2F

-2.5

IC

90

0

J2

VR

EF

J8

CK

H2

VS

SQ

2

B7

UD

QS

N8

A4

P8

A8

L1N

C4

L2B

A0

R8

NC

3

K7

RAS

F8

VS

SQ

3

F3

LDM

P3

A9

M3

A1

N3

A5

K8

CK

R3

NC

5

L3B

A1

J7

VSS

DL

L7C

AS

F2

VS

SQ

4

B3

UD

M

M2

A10

/AP

K2

CKE

R7

NC

6

M7

A2

N7

A6

M8

A0

J1

VDD

L

K3

WE

E8

LDQ

S

P7

A11

K9

ODT

A2

NC

1

N2

A3

P2

A7

H8

VS

SQ

1

F7

LDQ

S

A8

UD

QS

R2

A12

L8C

S

E2

NC

2

E7

VS

SQ

5D

8V

SS

Q6

D2

VS

SQ

7A

7V

SS

Q8

B8

VS

SQ

9B

2V

SS

Q10

P9

VS

S1

N1

VS

S2

J3

VS

S3

E3

VS

S4

A3

VS

S5

G9

VDD

Q1

G7

VDD

Q2

G3

VDD

Q3

G1

VDD

Q4

E9

VDD

Q5

C9

VDD

Q6

C7

VDD

Q7

C3

VDD

Q8

C1

VDD

Q9

A9

VDD

Q10

R1

VDD

1M

9VD

D2

J9

VDD

3E

1VD

D4

A1

VDD

5

B9

DQ

15B

1D

Q14

D9

DQ

13D

1D

Q12

D3

DQ

11D

7D

Q10

C2

DQ

9C

8D

Q8

F9

DQ

7F

1D

Q6

H9

DQ

5H

1D

Q4

H3

DQ

3H

7D

Q2

G2

DQ

1G

8D

Q0

10

uF

10V

C91

9

1K

R907

1K

R908

DD

R2_

A[0

]

DD

R2_

A[1

2]D

DR

2_A

[11]

DD

R2_

A[1

]D

DR

2_A

[2]

DD

R2_

A[3

]D

DR

2_A

[4]

DD

R2_

A[5

]D

DR

2_A

[6]

DD

R2_

A[7

]D

DR

2_A

[8]

DD

R2_

A[9

]D

DR

2_A

[10]

DD

R2

_D

[0-1

5]

DD

R2_

D[0

]D

DR

2_D

[1]

DD

R2_

D[2

]D

DR

2_D

[3]

DD

R2_

D[4

]D

DR

2_D

[5]

DD

R2_

D[6

]D

DR

2_D

[7]

DD

R2_

D[8

]D

DR

2_D

[9]

DD

R2_

D[1

0]D

DR

2_D

[11]

DD

R2_

D[1

2]D

DR

2_D

[13]

DD

R2_

D[1

4]D

DR

2_D

[15]

DD

R2 M

EM

OR

Y

Clo

se

to

DD

R2

IC

Clo

se

to

DD

R2

IC



DDR2

47uF

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2

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19_

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01uF

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7

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0.01

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SAM2

333

D100

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9

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MULT

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5.6K

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8

30K

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7

S2A

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100u

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8

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MULT

I

AP

21

21

N-3

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20

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13

10K

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3.3TR

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1 ADJ

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10

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10

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11

17

EG

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AB

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2.2K

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2

68uF

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6

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2

NO

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9_22

"

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CIC2

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L100

0

CIC2

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8

FW

2002

0-24

SP

10

00

NO

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9_22

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19

NC

14

12V

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18

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17

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75

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20

Inv

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15

GN

D

10

5.2

V

5G

ND

21

A.D

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2E

rro

r O

ut

23

NC

24

PW

M D

im

120

5%R100

4

56 1%R10

07

10K

R101

7 19_

22

"

2SC3

875S

Q100

51

9_

22

"

123RL

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MULT

I

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015

19

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2"

4.7K

R101

61

9_

22

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120-

ohm

L100

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2012

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2012

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MA

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A

OUT:

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OUT:

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l(19_

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se t

o Q

10

03

THE

S

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L MAR

K OF

THIS

SCH

EMET

IC D

IAGR

AM IN

CORP

ORAT

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ECIA

L FEA

TURE

S IM

PORT

ANT F

OR P

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D PA

RTS B

E USE

D FO

RTH

E CR

ITICA

L COM

PONE

NTS

IN TH

E S

YMBO

L MAR

K OF

THE

SCHE

METIC

.



POWER

0.1u

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0.1u

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0.1u

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AMP_MUTE_HOTEL

+3.3V

_MUL

TI_MS

T

0.1u

FC6

43

DA-8

580

EAP3

8319

32LH20R-MA

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Transcript of 32LH20R-MA