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TN1625-G

January 1998- Ed: 4

SCR

Symbol Parameter Value Unit

IT(RMS) RMS on-state current

(180

conductionangle)

Tc= 110C 16 A

IT(AV) Average on-state current(180 conductionangle)

Tc= 110C 10 A

ITSM Non repetitive surge peak on-state current tp = 8.3 ms 199 A

(Tj initial = 25C) tp = 10 ms 190

I2t I2

t Value for fusing tp = 10ms 180 A2s

dI/dt Critical rateof rise of on-statecurrentIG = 100 mA dIG/dt = 1 A/s.

100 A/ s

TstgTj

Storage junction temperature rangeOperatingjunction temperature range

- 40 to + 150- 40 to + 125

C

Tl Maximum temperature for soldering during 10 s 260 C

ABSOLUTE MAXIMUM RATINGS

D2PAK

HIGHSURGE CAPABILITY

HIGH ON-STATE CURRENT

HIGH STABILITY AND RELIABILITY

FEATURES

The TN1625series of Silicon Controlled Rectifiersuses a high performance glass passivated tech-nology.

This SCR is designed for power supplies up to400Hz on resistive or inductiveload.

DESCRIPTION

K

A G

A

Symbol ParameterTN1625-

Unit600G 800G

VDRMVRRM

Repetitivepeak off-state voltageTj = 125C

600 800 V

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PG (AV)= 1W PGM = 10 W (tp = 20s) IGM = 4 A (tp = 20s) VRGM = 5V

GATE CHARACTERISTICS

Symbol Parameter Value Unit

Rth(j-a) Junctionto ambient (S=1cm2

) 45 C/W

Rth(j-c) Junction to case for D.C 1.1 C/W

THERMAL RESISTANCES

Symbol Test Conditions Type Value Unit

IGT VD = 12V (DC) RL= 33 Tj= 25C MIN 3 mA

MAX 25

VGT VD = 12V (DC) RL= 33 Tj= 25C MAX 1.3 V

VGD VD = VDRM RL = 3.3k Tj= 125C MIN 0.2 V

IH IT= 100mA Gate open Tj= 25C MAX 40 mA

IL IG = 1 . 2 IGT Tj= 25C MAX 60 mA

VTM ITM= 32A tp= 380s Tj= 25C MAX 1.5 V

IDRM VD = VDRM Tj= 25

C MAX 5 AIRRM VR = VRRM Tj= 125C MAX 2 mA

dV/dt VD=67%VDRM Gate open Tj= 125C MIN 500 V/ s

ELECTRICALCHARACTERISTICS

ORDERING INFORMATION

TN 16 25 - 600 G

SCR

CURRENT

PACKAGES :G: D2PAK

VOLTAGESENSITIVITY

Add -TR suffix for Tape & Reel shipment

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0 25 50 75 100 1250

2

4

6

8

10

12

14

16

18

I (A)T(AV)

D.C.

=180

Tcase( C)

Fig. 3: Average and D.C. on-state current versuscase temperature.

-40 -20 0 20 40 60 80 100 120 1400.0

0.5

1.0

1.5

2.0

2.5

I ,I [Tj]/I ,I [Tj=25C]GT H GT H

IGT

IH

Tj(C)

Fig.5: Relativevariation of gate trigger currentandholding current versus junction temperature.

1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+20.01

0.10

1.00

K=[Zth/Rth]

Zth(j-c)

Zth(j-a)

tp(s)

Fig. 4: Relative variation of thermal impedanceversus pulse duration.

1 10 100 10000

40

80

120

160

200

I (A)TSM

Tj initial=25C

F=50Hz

Number of cycles

Fig. 6: Non repetitive surge peak on-state currentversus number of cycles.

0 2 4 6 8 10 12 14 16

0

2

4

6

8

10

12

14

16

P(W)

=180

=120

=90

=60

=30

D.C.

I (A)T(AV)

Fig. 1: Maximum average power dissipation ver-sus average on-state current .

1250 20 40 60 80 100 120 140

0

2

4

6

8

10

12

14

16

P(W) Tcase (C)

=180

Rth=0C/WRth=2C/WRth=4C/WRth=6C/W

110

115

120

Tamb(C)

Fig. 2 : Correlation between maximum averagepower dissipation and maximum allowable tem-peratures (Tamb and Tcase) for different thermalresistances heatsink+contact.

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0 4 8 12 16 20 24 28 32 36 400

10

20

30

40

50

60

70

80

Rth(j-a) (C/W)

S(Cu) (cm )

Fig. 9: Thermal resistancejunction to ambient ver-sus coppersurfaceunder tab (Epoxyprinted circuitboard FR4, copperthickness: 35m).

1 2 5 10100

200

500

1000

I (A),I t(A s)TSM

Tj initial=25C

ITSM

I t

tp(ms)

Fig. 7: Non repetitive surge peak on-state currentfor a sinusoidal pulse with width tp

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PACKAGE MECHANICAL DATAD2PAK

A

C2

D

R

2.0 MIN.FLAT ZONE

A2

V2

C

A1

G

L

L3

L2

B

B2

E

REF.

DIMENSIONS

Millimeters InchesMin. Typ. Max. Min. Typ. Max.

A 4.30 4.60 0.169 0.181

A1 2.49 2.69 0.098 0.106

A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037

B2 1.40 0.055

C 0.45 0.60 0.017 0.024

C2 1.21 1.36 0.047 0.054

D 8.95 9.35 0.352 0.368

E 10.00 10.28 0.393 0.405

G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624

L2 1.27 1.40 0.050 0.055

L3 1.40 1.75 0.055 0.069

R 0.40 0.016

V2 0 8 0 8

MARKING: TN1625

x00G

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for theconsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. Nolicense is granted by implication or otherwise under any patentor patentrights of SGS-THOMSON Microelectronics.Specifications mentionedin this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.SGS-THOMSON Microelectronics products are not authorizedfor use as critical componentsin life support devices or systems without expresswritten approval of SGS-THOMSON Microelectronics.

1998 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.

SGS-THOMSON Microelectronics GROUP OF COMPANIES

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The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan -T hailand - United Kingdom - U.S.A.

8.90

3.70

1.30

5.08

16.90

10.30

FOOT PRINT DIMENSIONS (in millimeters)

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