2N6387, 2N6388
Transcript of 2N6387, 2N6388
-
8/13/2019 2N6387, 2N6388
1/6
Semiconductor Components Industries, LLC, 2011
October, 2011 Rev. 141 Publication Order Number:
2N6387/D
2N6387, 2N6388
Plastic Medium-PowerSilicon Transistors
These devices are designed for generalpurpose amplifier and
low
speed switching applications.
Features
High DC Current Gain hFE= 2500 (Typ) @ IC= 4.0 Adc
CollectorEmitter Sustaining Voltage @ 100 mAdc
VCEO(sus) = 60 Vdc (Min) 2N6387
= 80 Vdc (Min) 2N6388
Low CollectorEmitter Saturation Voltage
VCE(sat) = 2.0 Vdc (Max) @ IC
= 5.0 Adc 2N6387, 2N6388
Monolithic Construction with BuiltIn BaseEmitter Shunt Resistors
TO220AB Compact Package
Pb
Free Packages are Available*
MAXIMUM RATINGS (Note 1)
Rating Symbol Value Unit
CollectorEmitter Voltage 2N63872N6388
VCEO 6080
Vdc
CollectorBase Voltage 2N63872N6388
VCB 6080
Vdc
EmitterBase Voltage VEB 5.0 Vdc
Collector Current ContinuousPeak
IC 1015
Adc
Base Current IB 250 mAdc
Total Power Dissipation @ TC= 25CDerate above 25C
PD 650.52
WW/C
Total Power Dissipation @ TA= 25CDerate above 25C
PD 2.00.016
WW/C
Operating and Storage Junction,Temperature Range
TJ, Tstg 65 to +150 C
THERMAL CHARACTERISTICS
Characteristics Symbol Max Unit
Thermal Resistance, JunctiontoCase RJC 1.92 C/W
Thermal Resistance, JunctiontoAmbient RJA 62.5 C/W
Stresses exceeding Maximum Ratings may damage the device. MaximumRatings are stress ratings only. Functional operation above the RecommendedOperating Conditions is not implied. Extended exposure to stresses above theRecommended Operating Conditions may affect device reliability.1. Indicates JEDEC Registered Data.
*For additional information on our PbFree strategy and soldering details, pleasedownload the ON Semiconductor Soldering and Mounting TechniquesReference Manual, SOLDERRM/D.
DARLINGTON NPN SILICON
POWER TRANSISTORS
8 AND 10 AMPERES
65 WATTS, 60 80 VOLTS
TO220AB
CASE 221A
STYLE 1
12
3
4
http://onsemi.com
2N638x = Device Codex = 7 or 8
G = Pb
Free PackageA = Assembly LocationY = YearWW = Work Week
MARKING
DIAGRAM
2N638xGAYWW
2N6388 TO220AB 50 Units / Rail
2N6388G TO220AB
(Pb
Free)
50 Units / Rail
Device Package Shipping
2N6387 TO220AB 50 Units / Rail
2N6387G TO220AB(PbFree)
50 Units / Rail
ORDERING INFORMATION
-
8/13/2019 2N6387, 2N6388
2/6
2N6387, 2N6388
http://onsemi.com
2
80
40
20
020 40 80 100 120 160
Figure 1. Power Derating
T, TEMPERATURE (C)
PD
,POWERD
ISSIPATION(WATTS)
60
TA TC4.0
2.0
1.0
3.0
0 60 140
TA
TC
ELECTRICAL CHARACTERISTICS (TC
= 25C unless otherwise noted) (Note 2)
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
CollectorEmitter Sustaining Voltage (Note 3)(IC= 200 mAdc, IB= 0) 2N6387
2N6388
VCEO(sus)
6080
Vdc
Collector Cutoff Current(VCE= 60 Vdc, IB= 0) 2N6387(VCE= 80 Vdc, IB= 0) 2N6388
ICEO
1.01.0
mAdc
Collector Cutoff Current(VCE= 60 Vdc, VEB(off)= 1.5 Vdc) 2N6387(VCE80 Vdc, VEB(off)= 1.5 Vdc) 2N6388(VCE= 60 Vdc, VEB(off)= 1.5 Vdc, TC= 125C) 2N6387(VCE= 80 Vdc, VEB(off)= 1.5 Vdc, TC= 125C) 2N6388
ICEX
3003003.0
3.0
Adc
mAdc
Emitter Cutoff Current (VBE= 5.0 Vdc, IC= 0)
IEBO
5.0
mAdc
ON CHARACTERISTICS(Note 3)
DC Current Gain(IC= 5.0 Adc, VCE= 3.0 Vdc) 2N6387, 2N6388(IC= 1 0 Adc, VCE= 3.0 Vdc) 2N6387, 2N6388
hFE
1000100
20,000
CollectorEmitter Saturation Voltage(IC= 5.0 Adc, IB= 0.01 Adc) 2N6387, 2N6388(IC= 10 Adc, IB= 0.1 Adc) 2N6387, 2N6388
VCE(sat)
2.03.0
Vdc
BaseEmitter On Voltage(IC= 5.0 Adc, VCE= 3.0 Vdc) 2N6387, 2N6388(IC= 10 Adc, VCE= 3.0 Vdc) 2N6387, 2N6388
VBE(on)
2.84.5
Vdc
DYNAMIC CHARACTERISTICS
SmallSignal Current Gain (IC= 1.0 Adc, VCE= 5.0 Vdc, ftest= 1.0 MHz)
|hfe|
20
Output Capacitance (VCB= 10 Vdc, IE= 0, f = 1.0 MHz)
Cob
200
pF
SmallSignal Current Gain (IC= 1.0 Adc, VCE= 5.0 Vdc, f = 1.0 kHz)
hfe
1000
2. Indicates JEDEC Registered Data.3. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.
-
8/13/2019 2N6387, 2N6388
3/6
2N6387, 2N6388
http://onsemi.com
3
Figure 2. Switching Times Test Circuit
7.0
0.1
Figure 3. Switching Times
IC, COLLECTOR CURRENT (AMPS)
t,TIME(s
)
5.0
0.7
0.3
0.2
0.2 10
VCC= 30 V
IC/IB= 250
IB1= IB2TJ= 25C
tf
0.071.0 5.0
ts
tr
0.1
1.0
3.0
0.5 2.0
0
VCC+ 30 V
SCOPETUT
- 4.0 V
tr, tf10 ns
DUTY CYCLE = 1.0%
RC
D1MUST BE FAST RECOVERY TYPES, e.g.,
1N5825 USED ABOVE IB100 mA
MSD6100 USED BELOW IB100 mA
25 s
D151
RBAND RCVARIED TO OBTAIN DESIRED CURRENT LEVELS
V1
APPROX
+ 12 V
V2
APPROX
- 8 V
8.0 k 120
FOR tdAND tr, D1IS DISCONNECTED
AND V2= 0
RB
td
Figure 4. Thermal Response
t, TIME (ms)
1.0
0.010.01
0.7
0.5
0.3
0.2
0.1
0.07
0.050.03
0.02
0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 1.0 k500
ZJC(t) = r(t) RJCRJC= 1.92C/W MAX
D CURVES APPLY FOR POWERPULSE TRAIN SHOWN
READ TIME AT t1TJ(pk)- TC= P(pk)ZJC(t)
P(pk)
t1t2
DUTY CYCLE, D = t1/t2
D = 0.5
0.2
0.05
0.02
0.01SINGLE PULSE
0.1
r(t)
,TRANSIE
NTTHERMALRESISTANCE
(NORMALIZED)
-
8/13/2019 2N6387, 2N6388
4/6
2N6387, 2N6388
http://onsemi.com
4
BONDING WIRE LIMITED
THERMALLY LIMITED @ TC= 100C
SECOND BREAKDOWN LIMITED
20
1.0
Figure 5. Active-Region Safe Operating Area
2.0
0.0310 20 80
TJ= 150C
0.2
5.0
0.5
IC,
COLLE
CTORCURRENT(AMPS)
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
10
40
1.0
0.1
dc
2.0 604.0 6.0
50 s
10 s
CURVES APPLY BELOW RATED VCEO
5 ms
1 ms50 ms
2N6387
2N6388
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate ICVCElimits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 5is based on TJ(pk)= 150C; TCis
variable depending on conditions. Second breakdown pulse
limits are valid for duty cycles to 10% provided TJ(pk)< 150C. TJ(pk)may be calculated from the data in Figure
4. At high case temperatures, thermal limitations will reduce
the power that can be handled to values less than the
limitations imposed by second breakdown
10,000
1.0
Figure 6. Small
Signal Current Gain
f, FREQUENCY (kHz)
102.0 5.0 10 20 50 100 200 1000
500
300
100
5000
hFE
,SMALL
-SIGNALCURRENTG
AIN
20
3000
200
500
2000
1000
3050
TC= 25C
VCE= 4.0 Vdc
IC= 3.0 Adc
300
0.1
Figure 7. Capacitance
VR, REVERSE VOLTAGE (VOLTS)
301.0 2.0 5.0 20 10010
C,
CAPACITANCE(pF)
200
100
70
50
Cib
Cob
500.2 0.5
TJ= 25C
VCE
,COLLEC
TOR
-EMITTERVOLTAGE(VOLTS)
0.1
Figure 8. DC Current Gain
IC, COLLECTOR CURRENT (AMP)
0.2 0.3 0.5 0.7 1.0 2.0 10
500
300
hFE
,DCCURRENTGAIN
TJ= 150C
25C
-55C
VCE= 4.0 V
2007.0
20,000
5000
10,000
30002000
1000
3.0 5.0
Figure 9. Collector Saturation Region
3.0
IB, BASE CURRENT (mA)
0.3 0.5 1.0 2.0 3.0 5.0 7.0 30
2.6
2.2
1.8
1.4
IC= 2.0 A
TJ= 25C
4.0 A 6.0 A
1.00.7 2010
-
8/13/2019 2N6387, 2N6388
5/6
-
8/13/2019 2N6387, 2N6388
6/6
2N6387, 2N6388
http://onsemi.com
6
PACKAGE DIMENSIONS
TO220CASE 221A09
ISSUE AGNOTES:
1. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALLBODY AND LEAD IRREGULARITIES AREALLOWED.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.570 0.620 14.48 15.75B 0.380 0.405 9.66 10.28C 0.160 0.190 4.07 4.82D 0.025 0.036 0.64 0.91F 0.142 0.161 3.61 4.09
G 0.095 0.105 2.42 2.66H 0.110 0.161 2.80 4.10J 0.014 0.025 0.36 0.64K 0.500 0.562 12.70 14.27L 0.045 0.060 1.15 1.52N 0.190 0.210 4.83 5.33Q 0.100 0.120 2.54 3.04R 0.080 0.110 2.04 2.79S 0.045 0.055 1.15 1.39T 0.235 0.255 5.97 6.47U 0.000 0.050 0.00 1.27
V 0.045 --- 1.15 ---Z --- 0.080 --- 2.04
B
Q
H
Z
L
V
G
N
A
K
F
1 2 3
4
D
SEATINGPLANET
C
ST
U
R
J
STYLE 1:PIN 1 . BASE
2. COLLECTOR3 . EMITT ER4. COLLECTOR
ON Semiconductorand are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.Typical parameters which may be provided in SCILLC data sheets and/or specif ications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiar ies, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll FreeUSA/Canada
Europe, Middle East and Africa Technical Support:Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81358171050
2N6387/D
LITERATURE FULFILLMENT:Literature Distribution Center for ON SemiconductorP.O. Box 5163, Denver, Colorado 80217 USAPhone: 3036752175 or 8003443860 Toll Free USA/CanadaFax: 3036752176 or 8003443867Toll Free USA/CanadaEmail: [email protected]
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your localSales Representative