26 September 2000 High Voltage Plates and Capacitors Jack Fowler.
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Transcript of 26 September 2000 High Voltage Plates and Capacitors Jack Fowler.
26 September 2000Fowler Duke HEP
High Voltage Plate Procurement
Initial pre series received November 1999 We determined that the Kapton was too thick and redesigned.
Second pre series was received in May 2000 Traces on Kapton circuits exhibited cracks after flexing
New Kapton flex circuits ordered in July 2000 New High Voltage plates received September 2000
Currently evaluating changes
Remaining High Voltage Plates to be delivered in 2000
26 September 2000Fowler Duke HEP
Changes to HV Plate
Gold plating was removed from the traces, except for contact regions This was due to the thin layer of Nickel required under the
gold. It was causing the cracking. This was based on several recommendations from experts in
the field of circuit manufacture.
Increased radius and added chamfers to areas on thick plate where bending will occur This was based on recommendations from the manufacturer
of the Kapton material. (DuPont)
26 September 2000Fowler Duke HEP
Consequences of Changes
Due to the changes in gold plating, portions of the Kapton flex circuits had to be remanufactured Added 4 weeks to the delivery time Cost $15,000 for Type 1 and Type 2 HV Plates Type 3 was not affected because only pre-series was on order Thick plate changes had no effects on price
26 September 2000Fowler Duke HEP
Capacitor Procurement
Johanson X7R dielectric turned to “dust” after radiation testing at CERN
Identified alternative sources and dielectrics Samples have been sent to CERN for evaluation Expect 20 to 30 week lead time due to shortage in
electronics market How does this affect module production and
installation?