2.5ghz Power Amplifier

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General Description The MAX2240 single-supply, low-voltage power amplifi- er (PA) IC is designed specifically for applications in the 2.4GHz to 2.5GHz frequency band. The PA is com- pliant with Bluetooth, HomeRF, and 802.11 standards, as well as other FSK modulation systems. The PA pro- vides a nominal +20dBm (100mW) output power in the highest power mode. The PA includes a digital power control circuit to greatly simplify control of the output power. Four digitally con- trolled output power levels are provided: from +3dBm to +20dBm. A digital input controls the active or shut- down operating modes of the PA. In the shutdown mode, the current reduces to 0.5µA. The IC integrates the RF input and interstage matching to simplify application of the IC. Temperature and sup- ply-independent biasing are also included to provide stable performance under all operating conditions. The IC operates from a +2.7V to +5V single-supply volt- age. No negative bias voltage is required. Current con- sumption is a modest 105mA at the highest power level. The part is packaged in the UCSP™ package signifi- cantly reducing the required PC board area. The chip occupies only a 1.56mm x 1.56mm area. The 3 x 3 array of solder bumps are spaced with a 0.5mm bump pitch.  ________________________Applications Bluetooth HomeRF 802.11 FHSS WLAN 2.4GHz ISM Proprietary Radios Features o 2.4GHz to 2.5GHz Frequency Range o High +20dBm Output Power o 2-Bit Digital Power Control: Four Output Levels o Integrated Input Match to 50o Low 105mA Operating Current o 0.5µA Low-Power Shutdown Mode Current o +2.7V to +5V Single-Supply Operation o Miniature Chip-Scale Package (1.56mm x 1.56mm) A X 2 2 4  0 2.5GHz, +20dBm Power Amplifier IC in UCSP Package Maxim Integrated Products 1 MATCH     L     O     G     I     C     I     N     P     U     T     S 220 pF BIAS 18pF 1.2nH* (BOARD TRACE) D0 D1 SHDN RFIN GND1 GND2 *INDUCTANCE CREATED WITH PC BOARD TRANSMISSION LINE (SEE APPLICATIONS SECTION). RFOUT RFOUT 22nH 10pF 65θ = 41° 75θ = 26° VCC VCC VCC VCC BIAS & POWER CONTROL Typical Application Circuit/Functional Diagram 19-1624; Rev 2; 2/03 Ordering Information 9 UCSP* PIN-PACKAGE TEMP RANGE -40°C to +85°C MAX2240EBL PART *UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and environment. Refer to the UCSP Reliability Notice in the UCSP Reliability section of this data sheet for more information. Pin Configuration appears at end of data s heet.  E  VA  L  UA  T  I  O  N  K  I  T A  VA  I  LA  B  L  E UCSP is a trademark of Maxim Integrated Products, Inc. For pricing , delivery, and order ing informa tion, please contac t Maxim/Dalla s Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

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