Certified Memory Modules

2017/H2 Roadmap

PAPS Product Management

Lindsay Chou

2017 DRAM Market Trend The new, higher-speed DDR4 DRAM generation gained significant

market share in 2016, representing 45% of total DRAM sales.

Previously, DDR3 DRAM, including low power versions used in tablets,

smartphones, and notebook PCs, accounted for 84% of total DRAM

sales in 2014 and 76% in 2015, but in 2016, DDR4 price premiums

evaporated and prices fell to nearly the same ASP as DDR3 DRAMs.

A growing number of

microprocessors, like Intel’s

newest 14nm x86 Core

processors, now contain DDR4

controllers and interfaces. As

a result, DDR4 to become the

dominant DRAM generation in

2017 with 58% market share

versus 39% for DDR3

QUALITY RELIABILITY LONGEVITY LIFE-TIME

WARRANTY

Advantech Qualified DIMM

COMPABILITY

AQD Product Feature

PCB 30μ gold finger All AQD DRAM applies IPC-2221,using 30u Golden plated

connector to ensure DRAM’s stability in any given

circumstances

Best Quality Component AQD only use best quality and most durable components for industrial applications. Original IC: Samsung/Micron/Hynix

Rigorous Reliability Tests 100% Module On Board Testing

Shock & Vibration Test

Chamber Test

Functional Test

Minimum 3 years Longevity Stability and longevity for industrial applications

with extensive design-in or requalification requirements.

Warranty Life Cycle Warranty

Design for industrial application

Quality assurance

Long term support

Ideal solution for Transportation ,Energy, Military and Outdoor system

-40~85℃ Wide Temperature

PCB: 30μ gold finger

Industrial 4.0 , Machine Automation Solutions , Power & Energy Solutions Intelligent Video Solutions , Industrial Computers , Transportation Solutions

AQD wide temperature memory module designed for extreme environment. AQD wide temperature module use Anti-sulfur resistor and all of wide temp. products will process rigorous test ensure that all devices can be operated under even the harshest conditions.

Anti-sulfur

AQD Wide Temperature Module

DRAM Module Product Portfolio

General DRAM modules meant to be used as standard products (80% of demands)

Designed to detect and correct single-bit errors that occur during data storage and transmission.

Designed to ensure data integrity at both the device-level and system-level of the server.

Designed for industrial systems in extreme environments, -40°C to 85°C.

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DDR3 Roadmap AQD-DDR3

• DDR3 240PIN 0~70C • 1600Mhz / 1866Mhz • Standard Height / Very Low Profile • 1G/2G/4G/8G • Samsung / Micron / Hynix Chips

AQD-SO-DDR3 • DDR3 204PIN 0~70C • 1600Mhz / 1866Mhz • Standard Height • 1G/2G/4G/8G • Samsung / Micron / Hynix Chips

• DDR3 240PIN 0~70C • 1600Mhz • Standard Height • 2G/4G/8G • Samsung Chips

AQD-DDR3-ECC AQD-SO-DDR3-ECC • DDR3 204PIN 0~70C • 1600Mhz • Standard Height • 4G/8G • Samsung / Micron Chips

AQD-SO-DDR3-Ind. • DDR3 204PIN -40~85C • 1600Mhz Standard Height • 2G/4G/8G • Anti-Sulfur Chip Resistors • Micron Chips

AQD-DDR3-Reg. • DDR3 240PIN 0~70C • 1600Mhz • Standard Height / Very Low Profile • 4G/8G/16G • Samsung Chips

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Developing Planning Available

DDR4 Roadmap AQD-DDR4

• DDR4 288PIN 0~70C • 2400Mhz • Standard Height • 4G/8G/16G • Samsung / Hynix Chips

AQD-SO-DDR4 • DDR4 260PIN 0~70C • 2400Mhz • Standard Height • 4G/8G/16G • Samsung / Hynix Chips

AQD-DDR4-ECC • DDR4 288PIN 0~70C • 2400Mhz • Standard Height • 4G/8G/16G • Samsung / Hynix Chips

AQD-SO-DDR4-ECC • DDR4 260PIN 0~70C • 2400Mhz • Standard Height • 4G/8G/16G • Samsung / Hynix Chips

AQD-SO-DDR4-Ind. • DDR4 260PIN -40~85C • 2400Mhz Standard Height • 4G/8G • Anti-Sulfur Chip Resistors • Hynix Chips

AQD-DDR4-Reg. • DDR4 288PIN 0~70C • 2133Mhz/2400Mhz • Standard Height / Very Low Profile • 4G/8G/16G • Samsung / Hynix Chips

AQD-DDR4-Reg. • DDR4 288PIN 0~70C • 2666Mhz • Standard Height / Very Low Profile • 8G/16G/32G • Samsung / Hynix Chips

AQD-DDR4-Reg. • DDR4 288PIN 0~70C • 2400Mhz • Standard Height • 32G • Samsung Q3 ’17

Developing Planning Available

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M/P 2018/H1