© 2015 Synopsys, Inc. All Rights...

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© 2015 Synopsys, Inc. All Rights Reserved.

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The Rise Of The Internet Of Things And the Role of EDA

Victor Grimblatt

R&D Group Director

Synopsys

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© 2015 Synopsys, Inc. All Rights Reserved. Fairchild Type-F ”LOGIC”, the 1st Monolithic Integrated Circuit, 1960; Source: Computer History Museum

Integrated Circuits Back Then Indeed, a Giant Leap for Mankind!

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Computers Back Then, And Today We Have Made a Great Deal of Progress!

Sperry Univac 1108, 1969; Source: Sperry Rand Brochure

Titan Cray XK7, 2012; Source: Oak Ridge National Laboratory, DoE

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Data Centers Back Then, And Today We Have Made a Great Deal of Progress!

Los Angeles County Tapes Library in Downey, CA, 1976; Source: UCLA;

Google Data Center, Council Bluffs, IA, 2012; Source: Google Corp.

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Electric Cars Back Then, And Today We Have Made a Great Deal of Progress!

General Motors Urban Electric Vehicle, 1973; Source: U.S. National Archives;

General Motors EN-V Pride (Jiao, 骄), 2014; Source: Wikipedia

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Driving Directions Back Then, And Today We Have Made a Great Deal of Progress!

Navigation Hotline, 1963; Source: BoredomTherapy.com

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Moore’s Law Golden Anniversary (April 19th, 2015) Every New Technology Node Brings Twice the Number of Transistors

Within the Same Silicon Area, at the Same Cost

Back Then Today A Great Deal Of

Progress

Technology

Node

~ 100

Microns

“10”

Nanometers

10,000

Times Smaller

Integration

Capacity

~ 1,000

Transistors

100,000,000,000

Transistors

100,000,000

Times More

Market

Size

~ 1,000

Units

1,000,000,000

Units

1,000,000

Times Larger

Source: G. Moore, “Cramming More Components onto Integrated Circuits”, Electronics 38/8, April 19th, 1965

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Moore’s Law Golden Anniversary (April 19th, 2015) The Last 20 Years of Moore’s Law Explained with… Lara Croft

Source: Evolution of Tomb Raider’s Lara Croft Face from 1996 to 2014, Mingoos, 2015;

Nvidia Riva & GeForce GPU, 1995-2015

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Fairchild Type-F ”LOGIC”, the 1st Monolithic Integrated Circuit, 1960; Source: Computer History Museum;

Intel “Broadwell” 14 Nanometer Wafer; Source: Intel Corp., 2014; not Drawn to Scale

Integrated Circuits Back Then, And Today We Have Made a Great Deal of Progress,

But this Is not the End!

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© 2015 Synopsys, Inc. All Rights Reserved. Intel Curie, MCU + FLASH/SRAM + DSP + Bluetooth + 6-Axis MEMS Combo + Li Battery, CES 2015; Source: Intel Corp.

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© 2015 Synopsys, Inc. All Rights Reserved. Samsung President & CSO, Y. Sohn, showing Artik (CPU + GPU + FLASH/SRAM + Bluetooth/WiFi + 9-Axis MEMS Combo) at IoT World 2015; Source: Samsung Electronics

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Tomorrow Will Be Nothing Like Today!

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2013 2015 2017 2019 2021 2023 2025 202x

“Technology Node” (nm) “14” “10” “7” “5” “3.5” “2.5” “1.8” “1.3”

DRAM ½ Pitch (nm) 28 24 20 17 14 12 10 7.7

MPU/ASIC ½ Pitch (nm) 40 32 25 20 16 13 10 7 FLASH ½ Pitch (nm) 18 15 13 11 9 8 8 8

MPU Printed Gate Length (nm) 28 22 18 14 11 9 7 5

MPU Physical Gate Length (nm) 20 17 14 12 10 8 7 5

Theoretical Integration Capacity (BT) 64 128 256 512 1024 2048 4096 8192

Infinitely Large, Infinitely Small,… 1T Transistors by the End of This Decade, “1” Nanometer by the End of the Next

Source: ITRS, 2014; G.-Q. Zhang, et al. “Evolution of the Internet and its Cores.” New Journal of Physics, 2008

(450 Millimeter Wafers in Production in 2018, EUV in Production after 10 Nanometers)

2013 2015 2017 2019 2021 2023 2025 202x

Size of Internet (IP Addresses) 25B ~ 50B 100B

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1.0E+00

1.0E+03

1.0E+06

1.0E+09

1.0E+12

1965 1975 1985 1995 2005 2015 2025 2035

IoT

Smart

Everything

Tomorrow Will Be Nothing Like Today! Computers, Phones, …and Infinitely Many “Things”

In 2020, There Will Be 50 Billion Connected Devices

Mini

IBM

PC

Laptop

802.11

Mobile

Phone

2G, 802.15

Smartphone

Tablet

3G, 4G

802.11ac

IBM

Mainframe

AGC1

Computer

Mobile

Phone

DEC

VAX-780

Source: Wikipedia, 2015; Cisco Systems, VNI Forecast 2014

4 2 1 8

Connected Devices per Person

IoT

Smart Cars

Smart Energy IoT

Smartphone

5G, NFC

0

Electronic Market

(Units/Year)

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IoT

Smart

Everything IoT

Smart Cars

Smart Energy

1.0E+00

1.0E+03

1.0E+06

1.0E+09

1.0E+12

1965 1975 1985 1995 2005 2015 2025 2035

Source: Wikipedia, 2015; Cisco Systems, VNI Forecast 2014; Huawei, GCI Forecast 2014

IBM

PC

Laptop

802.11

Mobile

Phone

2G, 802.15

Smartphone

Tablet

3G, 4G

802.11ac

Mobile

Phone

IoT

Smartphone

5G, NFC

Mini

IBM

Mainframe

AGC1

Computer

Tomorrow Will Be Nothing Like Today! In 2020, There Will Be 160 Million Terabytes per Month of IP Traffic

90% Will Be Video, and 90% Will Come from Sensors

Global IP Traffic

(Terabytes/Month)

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Tomorrow Will Be Nothing Like Today! “Next Time You Hear Someone Scoff at an Average $1 IC Content,

Tell Them about the Power of 10”

The Power of 10 2015(E) 2020(E)

Computers 100M

Units

$100

IC

Content

$10B Market

300M Units

$160 IC

Content

$46B Market

Phones 1B

Units

$10

IC

Content

$10B Market

2B Units

$25 IC

Content

$51B Market

“Things” 10B

Units

$1

IC

Content

$10B Market

50B Units

$1 IC

Content

$50B Market

Source: D. Hutchison, VLSI Research, DEC2014

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The Rise Of The Internet Of “Things”

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The Rise Of The Internet Of “Things” Smarter Phones/Cases

Prynt Case, CES 2015; Source: Prynt, Paris, France

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The Rise Of The Internet Of “Things” Smarter Printers

ZUtA, CES 2015; Source: ZUtA Labs, Jerusalem, Israel

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The Rise Of The Internet Of “Things” Smarter Surfaces

Bird, CES 2015; Source: MUV Interactive, Herzliyya, Israel

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The Rise Of The Internet Of “Things” Smarter Homes

(Energy, Entertainment, Heating/Cooling, Lightning, Security)

DigitalSTROM, CES 2015; Source: DigitalSTROM, Zurich, Switzerland

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The Rise Of The Internet Of “Things” Smarter Cars: Autonomous Driving

F015 Autonomous Driving Car, CES 2015; Source: Mercedes, Stuttgart, Germany

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The Rise Of The Internet Of “Things” Smarter Cities: Car Sharing (1 Car per 100 Customers!)

Enjoy Is in the Cloud, Your Smartphone App Is on the Edge, and the Car Is the “Thing”

Source: Enjoy, 2015

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The Rise Of The Internet Of “Things” Smarter Herds: Geolocalization/Monitoring

One Cow per Human Being in South America, to Say Nothing about the Sheep

Courtesy of A. Gat, Moonitor Cows, Israel

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The Rise Of The Internet Of “Things” Smarter “Things”: Geolocalization

200M TEU Travel the World at Any Point in Time, 10K Get Lost Every Year

APY Low Power (1-Year Battery) Geolocation, CES 2015; Source: Abeeway, Meylan, France

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The Rise Of The Internet Of Things Cloud, Edge & Things Have Different Requirements

Source: D. Davis, Intel IoT Insights, 2014

Servers &

Big Data

Network &

Infrastructure

Gateways

2020(E)

~ 50B Terabytes

2020(E)

~ 50B Things Cloud

Edge

Things

Smartphones

Smart Cars,

Homes, Cities,

Everything

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Cloud, Edge & Things Have Different Requirements But All Demand for Advanced Design, and Advanced EDA

• Servers/Big Data/Networks

• Emerging Technology Nodes

• Digital, Silicon Highest Performance & Low Power Cloud

• Gateways & Local Hubs (e.g. Smartphones)

• Emerging AND Established Technology Nodes

• Digital + A&M/S, Silicon Performance & Low Power Edge

• Sensors/Actuators

• Established Technology Nodes

• MEMS, RF, Silicon Highest Efficiency & Lowest Power Things

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Cloud, Edge & Things Have Different Requirements But All Demand for Advanced Design, and Advanced EDA

From Silicon to Software !

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The Role Of EDA (Including IP)

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Moore’s Law Is Alive And Well

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Moore’s Law Is Alive And Well 10-track 2-Input NAND Masks and 3D Structure at 7 Nanometers

Quadruple Patterning: SAQP Fins, and LELELELE M1

Source: Synopsys Research, 2014

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Moore’s Law Is Alive And Well 2-Input NAND Masks and 3D Structure at 5 Nanometers

EUV + DSA Nano-Wires Patterning, or… Octuple Patterning


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Design Enablement & Differentiation

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Past Current Future

Application Processor D 45/40nm

32/28nm,

22/20nm 16/14nm

Baseband Processor D

WiFi D

65nm

40nm

28nm

Bluetooth D

NFC Controller D

GPS D 65nm

Transceiver RF

Image Sensors A & M/S

90nm 65nm

40nm

Gesture Recognition A & M/S 65nm

Touchscreen Controller A & M/S 90nm

Audio/Video Codec D

180/130nm 130/90nm 90/65nm Power Management A & M/S

Noise Cancellation A & M/S

Accelerometer/Compass/Gyroscope MEMS ≥ 250nm ≥ 250nm ≥ 250nm ≥ 250

180

130

90

65/55

45/40

32/28

22/20

16/14

≤ 10

Advanced Design, And Advanced EDA The Smartphone Example: Enablement, and Differentiation

Source: H. Jones, IBS, APR2015; ChipWorks, 2014; iFixit 2014

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Tomorrow Will Be Nothing Like Today ! Advanced Design, and Advanced EDA Drive the Change !

• Design enablement, and differentiation

– Design is the enabler at 28 nanometers and below

– Design is the differentiator at every technology node

• We continuously improve “raw” performance

– Because sheer complexity rules, and

– Nothing can be “infinitely” parallelized, Amdahl's law still stands

• We continuously deploy new algorithms

– Heuristics obsolete quickly

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Design Enablement: Efficient Use Of Silicon Area Flat Implementation of a Hierarchical Design at 28 Nanometers

Courtesy of J.C. Parker, LSI, SNUG Silicon Valley 2014; Used by Permission

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Design Differentiation: Efficient Use Of Silicon Area 18% Smaller Size, 13% Higher Utilization, 77% Double Via Rate at 110 Nanometers

Source: IDM, 2014 (110 Nanometers, Mixed-Signal)

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© 2015 Synopsys, Inc. All Rights Reserved. Source: M. Mohan, et al., Imagination Technologies, SNUG Silicon Valley 2014 (28 Nanometers)

Design Enablement: Lowest Power Dynamic Power Reduction at 28 Nanometers

-48%

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Design Differentiation: Lowest Power 12 Supply/Voltage/Shutdown Islands at 180 Nanometers

To Say Nothing about the IC Compiler Custom Designer Round-Trip

Source: G. Conti, STMicroelectronics, SNUG France 2012 (180 Nanometers Mixed-Signal)

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Design Enablement: Efficient Use Of Routing Resources Triple Patterning (M1) and Double Patterning (M2 & M3) at 10 Nanometers


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Design Differentiation: Efficient Use Of Routing Resources 4 Layers (Instead of 6), 77% Utilization, 80% Double-Via Rate at 150 Nanometers

Source: IDM, 2012 (150 Nanometers Mixed Signal)

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Design Enablement & Differentiation : A&M/S Simulation Average Runtime Speedup of Full-Chip Simulation vs. Third-Party Solution

Source: IDM, 2014 (40 Nanometers, Mixed Signal, 70M Devices; VCS AMS)

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Design Enablement & Differentiation : A&M/S Simulation Average Runtime Speedup of Full-Chip Simulation vs. Previous Release

Source: P. Daglio, STMicroelectronics, DAC 2015 (180-130 Nanometers, Mixed Signal;

CustomSim 2014.09 SP5 vs. 2013.12)

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Tomorrow Will Be Nothing Like Today! IC Compiler II, Codenamed “Newton”, Drives the Change

300 Engineer Years, More than 5M Lines of New Code, More than 50 Patents

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Design Enablement: IC Compiler II Runtime Speedup at 16 Nanometers FinFET

Courtesy of M. Nishibori, Renesas, SNUG Silicon Valley 2015; Used by Permission

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Design Enablement: IC Compiler II Runtime Speedup at 14 Nanometers FD-SOI

Source: Early Partner, 2015 (14 Nanometer FD-SOI, 6M Instances)

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Design Differentiation: IC Compiler II Runtime Speedup at 65 Nanometers

Source: Early Partner, 2015 (65 Nanometer Mixed-Signal, 1.9M Instances)

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Tomorrow Will Be Nothing Like Today! Advanced Design, and Advanced EDA Drive the Change

IC Compiler II, One Year in Review

• We continuously re-think and re-build our “bricks”

– To keep, and even exceed the pace of Moore’s law

Source: Synopsys Research, AUG2015

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IP And More

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DesignWare IP Sub-Systems E.g.: Sensor & Control Sub-System

Software, IP, Prototyping, Verification, Implementation, Silicon Proven

Source: Fabless, 2015 (40 Nanometers)

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DesignWare IP Prototyping Kits Immediate Productivity for H/W Engineers & S/W Developers • Out-of-the-box

reference design

(controller + PHY +

system logic)

• Proven target for

early software

development

• Pre-optimized, pre-

loaded Linux OS &

reference driver

• Fast iteration flow

for easy

modification of IP

HAPS-DX Board ARC Software

Development Platform

HAPS Track Connector

PHY Daughter Card

Linux OS Software Drivers

App Examples

FPGA Bit File with

Reference Design

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DesignWare IP Prototyping Kits Cut Months from Integration, Prototyping and Software Schedule

Work out-of-the-Box, Up and Running in Minutes

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Besides Hardware, [Embedded] Software

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Tomorrow Will Be Nothing Like Today! Besides Hardware, [Embedded] Software…

Some Codebase Size Sample… at $10-20 per Line of Code

Source: www.informationisbeautiful.net, 2014; Synopsys Research, 2015

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Tomorrow Will Be Nothing Like Today! Testing Software for Defects that Could Lead to Product Crashes, Unexpected

Behavior, Security Breaches, or Catastrophic System Failures

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We Keep Climbing, Together !

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We Keep Climbing, Together Cumulative Designs and Tapeouts at 16/14 Nanometers

Vast Majority (~ 86%) Using Galaxy Design Platform


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We Keep Climbing, Together Cumulative Designs and Tapeouts at 10 Nanometers

Vast Majority ;-) (~100%) Using Galaxy Design Platform


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We Keep Climbing, Together Advanced Design, and Advanced EDA, from Software to Silicon

Drive the Change !

• Tomorrow will be nothing like today !

– After computers and phones, things; billions, possibly trillions of things

– Opportunities are immense

• Advanced design, and advanced EDA

– Will represent a competitive advantage

– Greatly simplifying the “siliconization” of the internet of things

• We keep climbing, together

– Technology leadership, and collaboration help accelerating the adoption

of innovation

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IEEE CASS R9 Summer School

Cartago, Costa Rica

18-19 Agosto 2015

San Jose; Source: ISS030-E-82316, NASA, 2012

Gracias!

© 2015 Synopsys, Inc. All Rights...

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