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UW – Madison College of Engineering Shared Facilities

Jerry Hunter, Ph. D.Director of Research User Facilities

(608) 263-1073, jerry.hunter@wisc.edu

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Materials Science Center

Pictures

Shared Instrument Facilities

Wisconsin Center for Applied Microelectronics

Soft Materials Laboratory

Open to all users (industrial, academic, government, institutions, etc.)

UW system schools get internal UW-Madison rate

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• Wisconsin Center for Applied Microelectronics

– Micro and nano-fabrication facility

– 10,000 sq. ft. cleanroom with 60 instruments

College of Engineering Shared Facilities

• Soft Materials Lab– Polymer characterization

laboratory– 10 instruments

• Materials Science Center– High end microscopy and

microanalysis facility– 30 instruments

Director: Jerry Hunter

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Fabrication Toolset

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Fabrication Toolset• Lithography

· Nikon NSR-2005i8A Stepper· Canon PLA-501 Contact Aligner· Suss MA6/BA6 double-sided aligner· Suss MJB-3 Contact Aligner· Suss MJB-3 Contact Aligner (with I.R. backside

alignment)· Headway Photoresist Spinners· Solitec HMDS chamber· (3) Scanning Electron Microscopes with Nabity

electron beam lithography (see microscopy in characterization section below)

• Packaging– WestBond 747677 Wedge Wire Bonder– K+S 4124 Ball Wire Bonder– Karl Suss RA-120 Wafer Scribe– (2) MicroAutomation 1006 Wafer Saw– MEI-720 Die Attacher– Indium Evaporator (die bonding)– YES vacuum oven– Package annealer

• Deposition– Ebeam Evaporator (metals)– CVC-601 DC Sputterer (metals)– Denton  Discovery 24 Sputterer (RF & DC)– PlasmaTherm 74 PECVD (dielectrics)– Telemark Ebeam Evaporator (dielectrics)– Angstrom Ebeam Evaporator (metals)

• Plasma Etch– PlasmaTherm 74 RIE/PECVD (deposition

and etch of oxide, nitride on Si)– STS ICP Multiplex (Deep Silicon Etcher)– Unaxis 790 RIE (general purpose)– PlasmaTherm SLR 770 ECR (compound

semiconductors)– PlasmaTherm 770 ICP (metals)– PlasmaTherm 790-2 ICP (general purpose)– YES Asher– Samco UV Ozone cleaner– SPTS Xetch E1 XeF2 vapor etch

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Fabrication Toolset• Assembly

– EVG Wafer-Wafer Bonder– EVG Wafer-Wafer Bond Aligner– Tousimis Critical Point Dryer– Obducat NIL-25 Nano-imprinter– 400C Oven for polymers– Cooke polyimide vacuum oven

• Wet Chemical– (2) General Purpose Wet Benches– HF Wet Bench– Piranha Wet Bench– Metal Etch Wet Bench– Nitride Strip Wet Bench– KOH / TMAH Wet Etch Bench– (3) Solvent Wet Benches– Spin Rinser-dryers

• Thermal Processing– 4 stack MRL Phoenix Oxidation Tubes

• wet/dry oxides

– 4 stack MRL Phoenix Oxidation Tubes• diffusion/anneals

– 4 Stack Tystar Furnace• LPCVD Nitride• LPCVD Polysilicon• LTO oxide• Thermal oxide

– AG 610 RTA (contact anneal – compound semi)– Pre-furnace clean wet bench

• Metrology Equipment– Tencor Flexus 2320 Film Stress Measurement– Rudolph Ellipsometer– Filmetrics Optical Film Thickness– (2)Tencor Alpha Step 200 Profilometers– Wild M420 Stereo Microscope– Several Inspection Microscopes– Wafer mapping four-point probe

Dan Christensen

Hal Gilles

Srdjan MilicicQuinn LeonardHal Gilles

Dan Christensen, WCAM manager

Felix LuKurt Kupcho

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Imaging and Analysis Toolset

Hysitron TriboIndenter

Cameca Atom Probe

Zeiss Auriga SEM/FIB

Bruker D8 Discover XRD

Aramis Confocal Raman

Leo 1530 FESEM

FEI Titan aberration corrected (S)TEM

Thermo k-alpha XPS

Advanced Rheometric Expansion System

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Imaging and Analysis Toolset

• Microscopy– Zeiss Auriga 1540 XB Cross Beam

(FIB + SEM) with Nabity electron beam lithography

– (2) Leo 1530 SEMs with EDS (1) with EBSD and Nabity electron beam lithography

– Leo 1550 VP SEM with EDS and Nabity electron beam lithography

– Philips CM200UT TEM– FEI Tecnai 12 TEM– FEI Tecnai TF30 cryo-TEM– FEI Titan aberration corrected

(S)TEM – Cameca 3000 X Si Atom Probe

Microscope– Bruker MultiMode 8 AFM  – Bruker Bioscope Catalyst AFM– Zeiss 510 Confocal microscope

• Soft Materials Characterization

– Q1000 Modulated Differential Scanning Calorimetry

– Q500 Thermo Gravimetric Analysis– ARES LS2 Rheometer– RSA III Dynamic Mechanical

Analyzer– Viscotek GPCmax Gel Permeation

Chromatograph– Waters Gel Permeation

Chromatograph– OCA 15/20 Contact Angle

measurement tool– (2) Rudolph Auto EIII Ellipsometers– Thermo Scientific DXRxi Raman

Imaging Microscope– Zetasizer Nano ZSP with Multi

Purpose Titrator MPT-2

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Imaging and Analysis Toolset• Spectroscopy

– Thermo K-Alpha XPS– Physical Electronics Phi 670 Scanning Auger– Zygo 6300 White light profilometer– Horiba Aramis Confocal MicroRaman– Horiba fluorolog spectrofluorometer – Nicolet NicPlan IR Microscope with Nicolet

Magna 550 Fourier Transform Infrared spectrometer

– PE spectrum 19 – UV/VIS/NIR spectrometer

• Mechanical Test– Hysitron  TI 950 TriboIndenter Nanoindenter– Hysitron PI 95 in-situ TEM Picoindenter

• X-ray Analysis– Rigaku Small Angle X-ray scattering– STOE X-ray powder diffractometer– Bruker D8 Discover – XRD– Panalytical X’Pert Pro MRD -- XRD

• Sample Preparation– Leica EM UC7 Cryo Ultramicrotome– FEI Vitrobot cryo vitrifier– Fischione 1040 NanoMill– Fischione 1050 TEM Mill– Fischione 1010 Low Angle Ion Mill

Rick Noll, SEM & FIB Manager

Julie Last, SPM & light microscopy Manager

John Jacobs, Surface Science

Manager

Don Savage, X-Ray systems manager

Alex Kvit, TEM Manager Anna Kiyanova

SML managerMike Efremov

SML