2012 Smartphone Guide

1
U.S. Semiconductors Romit Shah – NSI 212.298.4326 [email protected] ontact Heading Sidney Ho, CFA, CPA – NSI 212.298.4329 [email protected] Contact Heading Sanjay Chaurasia – NSI 212.298.4305 [email protected] Global Communications Equipment Stuart Jeffrey – NSI 212.298.4709 [email protected] Technology | Semiconductors 2012 Equity Research Components, Key Suppliers, and Market Share Source: Gartner, Company data, Nomura estimates, * not covered by Nomura Source: Gartner, Company data, Nomura estimates Source: Gartner, Company data, Nomura estimates, * not covered by Nomura NAND Flash Display Applications Processor DRAM Baseband GPS Image Sensors Touch Controller RF and FEM Silicon content: $20–22 $18–20 $15–17 $8–10 $10–13 $4–5 $1–2 $2–3 $1–2 PMIC $3–4 Combo-chip (WiFi/BT/FM) $3–4 $3–4 Power Amplifier Broadcom (75%) TI (17%) Marvell (3%) Skyworks* 30–34% RF Micro* 22–25% TriQuint* 15–18% Avago 5–8% Anadigics* 5–6% Atmel 25% Broadcom 25% Cypress 15% Synaptics* 15% TI 10% Qualcomm (45%) MediaTek (13%) Intel (10%) ST Ericsson (11%) Broadcom (5%) Marvell (3%) Qualcomm (35%) TI (20%) Samsung (12%) Nvidia (5%) Samsung (31%) Toshiba (27%) SanDisk (19%) Micron (9%) Qualcomm 40% TI 20% ST Ericsson 12% Maxim 8% Dialog Semi* 6% Skyworks* (34%) RF Micro Devices* (32%) TriQuint* (16%) Avago (7%) Samsung (38%) Hynix (21%) Elpida (16%) Micron (13%) Omnivision (30%) Samsung (25%) Aptina* (20%) Sony (12%) Toshiba (8%) Samsung (25%) Japan Display* (20%) LG Display (15%) Sharp (10%) Chimei (10%) AUO (10%) CSR* (40%) Broadcom (25%) u–blox* (20%) TI (8%) Camera Lens $1 MEMs Microphone $0.70–0.80 Compass IC Substrate Audio Codecs $0.70–0.80 Speaker $0.50–0.60 Gyroscope / Accelerometer $2–3 LCD Driver IC $1–2 $1–2 $1.00–1.50 Camera Module Silicon content: $9–10 Touch Panel $7–11 Battery (Li Polymer) $5–6 HDI PCB $3–5 AAC Tech Holdings (15–20%) Knowles Elec. (15–20%) Akustica* (10–15%) Analog Devices (7–10%) BSE* (10–15%) Simplo 40–50% Dynapack 35–40% Largan 15–20% Kantatsu* 10–15% Diostech* 10–15% Genius* 10–15% STMicro 60–70% InvenSense* 10–15% Analog Devices 5–10% AKM Semiconductor* (30–40%) Memsic* (20–30%) Samsung (10–15%) Samsung (30%) Renesas (20%) Novatek (15%) Himax* (10%) AAC (35%) NXP* (30%) Sharp 10–15% LG Innotek 10–15% Foxconn 8–10% SEMCO 5–10% STM 5–10% Ibiden 15–20% Unimicron 15–20% AT&S* 10–15% SEMCO 10–15% TPK 15–20% Young Fast 15–20% Wintek 10–15% Nissha Printing 10–15% SEMCO 15–20% Ibiden 15–20% Kinsus 10–15% Unimicron 10–15% 2012 Smartphone Guide Smartphone Bill of Materials BOM (front of the phone) Avg. Cost ($) NAND Flash (16GB) $20–22 Display $18–20 Applications Processor $15–17 Baseband $10–13 Touch Screen $11–13 DRAM $8–10 FEM and Misc RF $4–5 Combo-chip (WiFi, BT) $3–4 Power Management $3–4 Power Amplifier $3–4 Touch Controller $2–3 GPS $1–2 Image Sensors ASP $1–2 Smartphone Bill of Materials BOM (back of the phone) Avg. Cost ($) Camera Module $9–10 Touch Panel $7–11 Battery $5–6 HDI PCB $3–5 Gyro/Accelerometer $2–3 LCD driver IC $1–2 Camera Lens $1–2 Digital Compass $0.80–1.00 Speaker $0.50–0.60 Audio Codecs $0.70–0.80 MEMS Microphone $0.70–0.80 IC Substrates (incl. in chip cost) Smartphone Unit Shipments by Vendor (in mn) Smartphone units 2008 2009 2010 2011 Apple 11 25 47 89 Samsung 5 6 25 87 Nokia 61 71 102 85 RIM 23 34 50 52 HTC 7 11 25 43 LG 0 1 6 19 Motorola 3 3 14 17 Sony Ericsson 2 1 10 20 Huawei 0 0 0 16 ZTE 0 0 0 11 Others 27 21 67 34 Total 139 172 299 472 Mobile Semiconductor Market by Device Type Cellular Baseband 54% Apps Processor 9% RF Devices 19% Wireless Connectivity 10% Others 8% Mobile Semiconductor Market Share, 2011 Others 22% Qualcomm 24% TI 12% MediaTek 9% STMicro 9% Intel 6% Broadcom 5% Samsung 4% RFMD 3% Skyworks 3% Renasas 3% Overall Smartphone Market Share, 2011 Others 7% Samsung 19% Nokia 18% Apple 19% RIM 11% HTC 9% ZTE 2% Huawei 3% LG 4% Motorola 4% Sony Ericsson 4% Handset Shipments by Technology, 2009–2016E Handset Shipment (in mn) 2009 2010 2011 2012E 2013E 2014E 2015E 2016E 2G Devices 3G Devices 4G Devcies 2500 2000 1500 1000 500 0 Average Selling Price by OEM, 2011 Average Selling Price (US$) Apple HTC LG Motorola Nokia RIM Samsung Sony Erisson 800 600 400 200 0 Operating Margin by OEM, 2011 Operating Margin Apple HTC LG Motorola Nokia RIM Samsung Sony Ericsson 40% 30% 35% 20% 10% 25% 15% 5% (5%) 0 3G Unit Shipments, 2009–2016E Unit Shipment (in mn) 2009 2010 2011 2012E 2013E 2014E 2015E 2016E CDMA 1x EVDO HSPA W-CDMA TD-SCDMA 1600 1400 1200 1000 400 600 800 200 0 Shipments by Operating System, 2008–2011 Smartphone Shipment 2008 2009 2010 2011 Android iOS Symbian RIM Microsoft BADA Others 100% 80% 60% 40% 20% 0 Smartphone Unit Shipments by Region, 2007–2013E Smartphone Shipment Asia/Pacific Eastern Europe Japan Latin America Middle East & Africa North America Western Europe 100% 80% 60% 40% 20% 0 2009 2010 2011 2012E 2013E 2008 2007

Transcript of 2012 Smartphone Guide

U.S. Semiconductors

Romit Shah – [email protected]

ontact Heading

Sidney Ho, CFA, CPA – [email protected]

Contact Heading

Sanjay Chaurasia – [email protected]

Global Communications Equipment

Stuart Jeffrey – [email protected]

Technology | Semiconductors 2012Equity ResearchComponents, Key Suppliers, and Market Share

Source: Gartner, Company data, Nomura estimates, * not covered by Nomura

Source: Gartner, Company data, Nomura estimates

Source: Gartner, Company data, Nomura estimates, * not covered by Nomura

NAND Flash

Display

Applications Processor

DRAM

Baseband

GPS Image SensorsTouch Controller

RF and FEM

Silicon content: $20–22

$18–20

$15–17

$8–10

$10–13

$4–5

$1–2$2–3 $1–2

PMIC

$3–4Combo-chip (WiFi/BT/FM)

$3–4$3–4Power

Amplifier

� Broadcom (75%)

� TI (17%)

� Marvell (3%)

� Skyworks* 30–34%

� RF Micro* 22–25%

� TriQuint* 15–18%

� Avago 5–8%

� Anadigics* 5–6%

� Atmel 25%

� Broadcom 25%

� Cypress 15%

� Synaptics* 15%

� TI 10%

� Qualcomm (45%)

� MediaTek (13%)

� Intel (10%)

� ST Ericsson (11%)

� Broadcom (5%)

� Marvell (3%)

� Qualcomm (35%)

� TI (20%)

� Samsung (12%)

� Nvidia (5%)

� Samsung (31%)

� Toshiba (27%)

� SanDisk (19%)

� Micron (9%)

� Qualcomm 40%

� TI 20%

� ST Ericsson 12%

� Maxim 8%

� Dialog Semi* 6%

� Skyworks* (34%)

� RF Micro Devices* (32%)

� TriQuint* (16%)

� Avago (7%)

� Samsung (38%)

� Hynix (21%)

� Elpida (16%)

� Micron (13%)

� Omnivision (30%)

� Samsung (25%)

� Aptina* (20%)

� Sony (12%)

� Toshiba (8%)

� Samsung (25%)

� Japan Display* (20%)

� LG Display (15%)

� Sharp (10%)

� Chimei (10%)

� AUO (10%)

� CSR* (40%)

� Broadcom (25%)

� u–blox* (20%)

� TI (8%)

Camera Lens

$1

MEMs Microphone $0.70–0.80 Compass

IC Substrate Audio Codecs $0.70–0.80 Speaker $0.50–0.60

Gyroscope / Accelerometer

$2–3LCD Driver IC

$1–2

$1–2

$1.00–1.50

Camera Module

Silicon content: $9–10

Touch Panel

$7–11

Battery (Li Polymer)

$5–6

HDI PCB$3–5

� AAC Tech Holdings (15–20%)

� Knowles Elec. (15–20%)

� Akustica* (10–15%)

� Analog Devices (7–10%)

� BSE* (10–15%)

� Simplo 40–50%

� Dynapack 35–40%

� Largan 15–20%

� Kantatsu* 10–15%

� Diostech* 10–15%

� Genius* 10–15%

� STMicro 60–70%

� InvenSense* 10–15%

� Analog Devices 5–10%

� AKM Semiconductor* (30–40%)

� Memsic* (20–30%)

� Samsung (10–15%)

� Samsung (30%)

� Renesas (20%)

� Novatek (15%)

� Himax* (10%)

� AAC (35%)

� NXP* (30%)

� Sharp 10–15%

� LG Innotek 10–15%

� Foxconn 8–10%

� SEMCO 5–10%

� STM 5–10%

� Ibiden 15–20%

� Unimicron 15–20%

� AT&S* 10–15%

� SEMCO 10–15%

� TPK 15–20%

� Young Fast 15–20%

� Wintek 10–15%

� Nissha Printing 10–15%

� SEMCO 15–20%

� Ibiden 15–20%

� Kinsus 10–15%

� Unimicron 10–15%

� Cirrus Logic* 15–20%

� TI 15–20%

� Wolfson Micro* 10–15%

� STMicro 10–15%

� Analog Devices 10–15%

2012 Smartphone Guide

Smartphone Bill of Materials

BOM (front of the phone) Avg. Cost ($)

NAND Flash (16GB) $20–22

Display $18–20

Applications Processor $15–17

Baseband $10–13

Touch Screen $11–13

DRAM $8–10

FEM and Misc RF $4–5

Combo-chip (WiFi, BT) $3–4

Power Management $3–4

Power Amplifier $3–4

Touch Controller $2–3

GPS $1–2

Image Sensors ASP $1–2

Smartphone Bill of Materials

BOM (back of the phone) Avg. Cost ($)

Camera Module $9–10

Touch Panel $7–11

Battery $5–6

HDI PCB $3–5

Gyro/Accelerometer $2–3

LCD driver IC $1–2

Camera Lens $1–2

Digital Compass $0.80–1.00

Speaker $0.50–0.60

Audio Codecs $0.70–0.80

MEMS Microphone $0.70–0.80

IC Substrates (incl. in chip cost)

Smartphone Unit Shipments by Vendor (in mn)

Smartphone units 2008 2009 2010 2011

Apple 11 25 47 89

Samsung 5 6 25 87

Nokia 61 71 102 85

RIM 23 34 50 52

HTC 7 11 25 43

LG 0 1 6 19

Motorola 3 3 14 17

Sony Ericsson 2 1 10 20

Huawei 0 0 0 16

ZTE 0 0 0 11

Others 27 21 67 34

Total 139 172 299 472

Mobile Semiconductor Market by Device Type

Cellular Baseband

54%

Apps Processor9%

RF Devices19%

Wireless Connectivity

10%

Others8%

Mobile Semiconductor Market Share, 2011

Others22% Qualcomm

24%

TI12%

MediaTek9%STMicro

9%

Intel6%

Broadcom5%

Samsung4%

RFMD3%

Skyworks3%

Renasas3%

Overall Smartphone Market Share, 2011

Others7% Samsung

19%

Nokia18%

Apple19%

RIM11%

HTC9%

ZTE2%

Huawei3%

LG4%

Motorola4%

Sony Ericsson4%

Handset Shipments by Technology, 2009–2016E

Handset Shipment (in mn)

2009 2010 2011 2012E 2013E 2014E 2015E 2016E

2G Devices 3G Devices 4G Devcies

2500

2000

1500

1000

500

0

Average Selling Price by OEM, 2011

Average Selling Price (US$)

Apple HTC LG Motorola Nokia RIM Samsung SonyErisson

800

600

400

200

0

Operating Margin by OEM, 2011

Operating Margin

Apple HTC LG Motorola Nokia RIM Samsung SonyEricsson

40%

30%

35%

20%

10%

25%

15%

5%

(5%)

0

3G Unit Shipments, 2009–2016E

Unit Shipment (in mn)

2009 2010 2011 2012E 2013E 2014E 2015E 2016E

CDMA 1x EVDO HSPA W-CDMA TD-SCDMA

1600

1400

1200

1000

400

600

800

200

0

Shipments by Operating System, 2008–2011

Smartphone Shipment

2008 2009 2010 2011

Android iOS Symbian RIMMicrosoft BADA Others

100%

80%

60%

40%

20%

0

Smartphone Unit Shipments by Region, 2007–2013E

Smartphone Shipment

Asia/Paci�c Eastern Europe Japan Latin AmericaMiddle East & Africa North America Western Europe

100%

80%

60%

40%

20%

02009 2010 2011 2012E 2013E20082007