20100824123350_piraña3plechip

8/3/2019 20100824123350_piraña3plechip

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SPEC NO.: REV NO.:A/2 DATE:Oct/4/2006 PAGE:1/5

Package Dimensions

Dimension Torlerance (UNIT:mm)Torlerance

Grade 0.5~3 3~6 6~30 30~120

Medium(m) ±0.1 ±0.1 ±0.2 ±0.3

Chip Lens Color

Material Emitting Color

InGaN WhiteWater Clear

ATTENTION OBSERVE PRECAUTIONS

FOR HANDLING

ELECTROSTATIC

DISCHARGE

SENSITIVE

DEVICES

Features

•φ5 Super Flux LED.

•LOW POWER CONSUMPTION.

•WIDEVIEWING ANGLE.

•IDEAL FOR BACKLIGHT AND INDICATOR.

•PACKAGE: 60PCS / PIPE.

Description

This devices are made with TS InGaN.

HL-112H159W3C-5

7 .

6 2

6 .

7

7.62

5.08

0.4

2 .

5

5.08

1.5C

0.8

0.7

2 .

5

5.03°

-

-+

+

-+

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■ Absolute Maximum Rating

Item Symbol Absolute Maximum Rating Unit

Forward Current IF 60 mA

Peak Forward Current* IFP 300 mA

Reverse Voltage VR 5 V

Power Dissipation PD 200 mW

Electrostatic discharge ESD 800 V

Operation Temperature Topr -25∽+80 ℃

Storage Temperature Tstg -5∽+45 ℃

Lead Soldering Temperature* Tsol Max. 260℃ for 5sec Max.

*IFP Conditions：Pulse Width≤10msec

*Tsol Conditions：3mm from the base of the epoxy bulb

■ Typical Optical/ Electrical Characteristics

Item Symbol Condition Min. Typ. Max. Unit

Forward Voltage VF 2.8 3.2 3.6 V

50% Power Angle 2θ

1/2 -- 80 -- degLuminous Intensity Iv 3000 5500 -- mcd

Luminous Flux φV -- 10.0 -- lm

X -- 0.30 -- X:±0.015Chromaticity

coordinates Y -- 0.31 -- Y:±0.025

Prcp Wavelength λD

IF=60mA

-- -- -- nm

Recommend Forward

CurrentIF(rec) -- -- -- 60 mA

Reverse Current IR Vr=5V -- -- 10 uA

Notes:

1.Absolute maximum ratings Ta=25℃.

2.Tolerance of measurement of forward voltage±0.1V.

3.Tolerance of measurement of peak Wavelength±2.0nm.

4.Tolerance of measurement of luminous intensity±15%. 5.Tolerance of measurement of angle intensity±15%.

8/3/2019 20100824123350_piraña3plechip



■ Reliability Performance

Test Items And Result

Test

Classification Test Item Test Conditions

Test

Duration

Sample

Size AC/RE

Life TestRoom Temperature

DC Operating Life TestTa=25℃±5℃，IF=20mA 1000 hrs 22 pcs 0/1

Thermal Shock Test-10℃±5℃←→+100℃±5℃

5min. 10sec. 5min.50 cycles 22 pcs 0/1

Temperature Cycle Test-40℃±5℃←→+85℃±5℃

30min. 5min. 30min.50 cycles 22 pcs 0/1

High Temperature ＆

High Humidity Test

Ta=85℃±5℃

RH =85%±0.5 %RH1000 hrs 22 pcs 0/1

High Temperature

StorageTa=100℃±5℃ 1000 hrs 22 pcs 0/1

Environment

Test

Low Temperature

StorageTa=-55℃±5℃ 1000 hrs 22 pcs 0/1

Resistance to

Soldering HeatTa=230℃±5℃ 5sec. 22 pcs 0/1

Mechanical

TestLead Integrity

Load 2.5N(0.25kgf)

0° ~ 90° ~0° 3times 22 pcs 0/1

Typical Optical/Electrical Characteristics Curves

(Ta=25℃ Unless Otherwise Noted)

3.2

F o r w a r d

V o l t a g e

V F ( V )

F o r w a r d

C u r r e n t

I f ( m A )

Ambient Temperature Ta(℃)

2.00

30

5.04.54.03.53.02.5

Forward Volta e VF(V)

1007525 50-25 02. 8

3.0

125

Forward Voltage vs. Ambient Temperature

Relative Intensity vs. Ambient Temperature

Ambient Temperature Ta(℃)

F o r w a r d

C u r r e n t

I f ( m A )

R e l a t i v e

I n t e n s i t y

I V % ( m c d )

30

Forward Current vs.Forward Voltage

60

90

120

150

0

3.4

3.6

3.8

4.0

Ambient Temperature Ta(℃)0 20 40 60 80 1 00 1 20

0. 4-25

0.6

0 25 50 7 5

240

150

120

60

90

Forward Current vs. Ambient Temperature

1.2

1.0

0.8

1.4

1.6

1 00 1 25

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(0.345,0.33)(0.28,0.325)

0.21

0.16

0.200.190.180.170.160.15 0.320.310.300.290.280.270.260.250.240.230.22 0.440.430.420.410.400.390.380.370.360.350.340.33

0.16

0.45

(0.315,0.30)

G1-2

G1-1(0.205,0.190)

0.24

0.23

0.22

0.21

0.20

0.19

0.18

0.17

G5-4G4-4

G3-4G2-4

G1-4

G5-3G4-3

G3-3G2-3

G1-3

G2-2G3-2

G4-2G5-2

G2-1G3-1

G4-1G5-1

(0.27,0.235)

(0.240,0.175)

(0.235,0.250)

0.32

0.31

0.30

0.29

0.28

0.27

0.26

0.25

(0.295,0.270)

(0.26,0.29)

0.24

0.18

0.19

0.20

0.21

0.22

0.23

0.17

0.30

0.31

0.32

0.25

0.26

0.27

0.28

0.29

0.40

0.39

0.38

0.37

0.36

0.35

0.34

0.33

(0.305,0.36)

0.210.18 0.19 0.200.16 0.170.45

0.44

0.43

0.42

0.41

0.29 0.30 0.31 0.320.23 0.24 0.25 0.26 0.270.22 0.28

(0.44,0.395)

(0.38,0.365)

(0.41,0.38)

(0.35,0.395)

0.36

0.37

0.38

0.39

0.40

0.33

0.34

0.35

(0.44,0.425)

0.44

(0.39,0.41)

0.41 0.42 0.430.35 0.36 0.37 0.38 0.390.33 0.34 0.40 0.45

0.41

0.42

0.43

0.44

0.45

G1-9G2-9

G3-9G4-9

G5-9

F1-1F2-1

F3-1F4-1

F5-1

F1-2F2-2

F3-2F4-2

F5-2

F1-3F2-3

F3-3F4-3

F5-3

F1-4F2-4

F3-4F4-4

F5-4

E1-1E2-1E3-1

E4-1E5-1

D1-1

D2-1

D3-1D4-1

D5-1

C1-1

C2-1

C3-1

C4-1

C5-1

B1-1

B2-1

B3-1

B4-1

B5-1

A1-1

A2-1

A3-1

A4-1

A5-1

A1-2

A2-1

A3-2

A4-2

A5-2

A1-3

A2-3

A3-3

A4-3

A5-3

B1-2

B2-2

B3-2

B4-2

B5-2

B1-3

B2-3

B3-3

B4-3

B5-3

C1-2

C2-2

C3-2

C4-2

C5-2

C1-3

C2-3

C3-3

C4-3

C5-3

C1-4

C2-4

C3-4

C4-4

C5-4

C1-5

C2-5

C3-5

C4-5

C5-5

D1-2

D2-2

D3-2

D4-2

D5-2

D1-3

D2-3

D3-3

D4-3

D5-3

D1-4

D2-4

D3-4

D4-4

D5-4

D1-5

D2-5

D3-5

D4-5

D5-5

E1-2

E2-2

E3-2E4-2

E5-2

E1-3

E2-3E3-3

E4-3E5-3

E1-4

E2-4

E3-4

E4-4E5-4

E1-5

E2-5

E3-5E4-5

E5-5

F1-5F2-5

F3-5F4-5

F5-5

F1-6F2-6

F3-6F4-6

F5-6

G1-5G2-5

G3-5G4-5

G5-5

G1-6

G2-6G3-6G4-6

G5-6

G1-7G2-7

G3-7G4-7

G5-7

G1-8G2-8

G3-8G4-8

G5-8

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Package means

Notes: Each Adhesive Pipe 60pcs.

Soldering:1. Manual Of Soldering

The temperature of the iron tip should not be higher than 260℃(500℉) and Soldering within 3 seconds per

solder-land is to be observed.2. DIP soldering (Wave Soldering):

Preheating:120℃~150℃,within 120~180 sec.

Operation heating:245℃±5℃ within 5 sec.260℃(Max)

Gradual Cooling (Avoid quenching).

Handling:Care must be taken not to cause to the epoxy resin portion of LED while it is exposed to high temperature.

Care must be taken not rub the epoxy resin portion of LED with hard or sharp article such as the sand blast

and the metal hook.

Care must be taken there should be more than 3mm from jointing point to the epoxy resin.

Notes for designing:

Care must be taken to provide the current limiting resistor in the circuit so as to drive the LED within therated figures .Also caution should be taken not to overload LED with exorbitant voltage at the turning ON

and OFF of the circuit.

When using the pulse drive care must be taken to keep the average current within the rated figures .Also the

circuit should be designed so as be subjected to reverse voltage when turning off the LED.

Storage:In order to avoid the absorption of moisture . it is recommended to solder LED as soon as possible after

unpacking the sealed envelope.

If the envelope is still packed to store it in the environment as following:

Temperature:-5℃~45℃(23℉~113℉)Humidity : RH 60% Max.

Lable

8.69.6

1 2 . 5

4.6

1 1 . 5

2.4

5.6

2.5

0.5

486.0 1 2 . 5

广州市鸿利光电子有限公司 Q'TY:60PCSPART NO:HL- DATE:2006- - BIN COOD:

20100824123350_piraña3plechip

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