2 Fundamental Solid-State Principles

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    Fundamental Solid-State PrinciplesSemiconductors

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    A semiconductor is a material that is neither agood conductor nor a good insulator, butrather, lies in between the two. In their purestform, semiconductors have few applications

    in electronics.However, when the characteristics of a pure

    semiconductor are altered through a processknown as doping, many useful electronic

    devices can be developed.

    Introduction

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    1. atomic theory

    2. doping

    3. pn junction

    4. bias

    Outline

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    Atom

    Bohr model

    1. Atomic theory

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    Valence shelloutermost shell

    Determines the conductivity of the atom

    Can contain up to 8 e-

    Atomic Theory

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    1 valence e- perfect conductor

    8 valence e- insulator

    4 valence e- semiconductor

    Conductivity decreases with an increase in thenumber of valence electrons.

    Atomic theory

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    Silicon (Si) - 14Germanium (Ge) - 32

    Carbon (C) 6

    Carbon is used primarily in the production ofresistors and potentiometers.

    Silicon is commonly used than germanium

    because it is more tolerant of heat.

    Semiconductors

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    The net charge of an atom is zero. Positive net charge Negative net charge

    Fundamental laws Electrons travel in orbital shells

    Each orbital shell relates to a specific energy range(Which orbital electrons have higher energy levels?) For an electron to jump from its shell to one having a

    higher energy level, it must absorb enough energy tomake up the difference between the energy levels ofthe two shells.

    If an electron absorbs enough energy to jump from one

    shell to another, it will eventually give up the energyit absorbed and return to a lower-energy shell.

    Charge and conduction

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    Energy gap difference between energy levels of any two orbitalshells

    For conductors, semiconductors, and insulators, the valence toconduction-band energy gaps are approximately 0.4, 1.1, and 1.8eV.

    The higher the energy gap, the harder it is to cause conduction.(Why?)

    Excited state

    Energy gaps

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    Covalent bonding a means of holding atoms together bysharing valence electrons.The atoms are held together, forming a solid substance.The atoms are electrically stable, because their valence shells

    are complete.The completed valence shells cause the silicon to act as an

    insulator. Thus, intrinsic (pure) silicon or germanium is avery poor conductor.

    Covalent bonding

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    At room temperature, a silicon crystal hasfewer free electrons than a germanium.Hence, silicon is a better insulator ( desirablecharacteristic).

    How about carbon?

    Why is silicon more often used thangermanium?

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    Hole a gap in the covalent bond

    Electron-hole pair a free electron and itsmatching valence band hole

    Recombination when a free electron returnsto the valence shell

    Lifetime the time from electron-hole pairgeneration to recombination

    Conduction

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    At room temperature, thermal energy(heat)causes the constant creation of electron-holepairs, with their subsequent recombination.

    A semiconductor always has some number offree electrons even when no voltage isapplied to the element.

    temperature, free electrons-273 degree Celsius absolute zero!!!Conductivity in a semiconductor varies

    directly with temperature.

    Conduction versus Temperature

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    1.What are the 3 particles that make up the atom?2.What is the relationship between the number of

    valence electrons and the conductivity of agiven element?

    3.How many valence e- are there in a conductor? Aninsulator? A semiconductor?

    4.What 3 semiconductor elements are mostcommonly used in electronics?

    5.What are the relationships between electrons and

    orbital shells ?6.What is an energy gap? What are the energy gap

    values for insulators, semiconductors, andconductors?

    7.What forms of energy are given off by an electronthat is falling into the valence band from the

    SECTION REVIEW

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    8. What is covalent bonding?9. What are the effects of covalent bonding on

    intrinsic semiconductor materials?10. What is an electron-hole pair?11. What is recombination?12. How long is the typical lifetime of an

    electron-hole pair?13. What is the relationship between

    temperature and conductivity?14. Why arent electron-hole pairs generated in

    a semiconductor when its temperature dropsto absolute zero?

    SECTION REVIEW

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    Doping process of adding impurity atoms tointrinsic silicon or germanium to improve theconductivity of the semiconductor.

    Extrinsic impure

    Two element types used for dopingTrivalent (acceptor atoms)Pentavalent (donor atoms)

    P-type material

    N-type material

    2. Doping

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    Trivalent impurities Pentavalent impurities

    Aluminum (Al) Phosphorus (P)

    Gallium (Ga) Arsenic (As)

    Boron (B) Antimony (Sb)Indium (In) Bismuth (Bi)

    Doping elements

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    Pentavalent + intrinsic = n-type

    N-type materials are still electrically neutral!

    Majority carriers: conduction band/free electrons

    Minority carriers: valence band holes

    N-type vs P-type materials

    oTrivalent + intrinsic = p-typeoMajority carriers : hole

    oMinority carriers: free electrons

    oP-type materials are still electrically neutral!

    N-type materials

    P-type materials

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    1.What is doping? Why is it necessary?2.What is an impurity element?

    3.What are trivalent and pentavalent elements?

    4.Despite their respective characteristics, n-typeand p-type materials are still electricallyneutral. Why?

    5.In what ways are n-type and p-type materials

    similar? In what ways are they different?

    Section review

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    n-type + p-type = useful pn junction

    Diffusion results:One net + charge in the n-type material

    One net charge in the p-type material

    1-3 The PN Junction

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    At a large-scale picture:Each electron that diffuses across thejunction leaves one positively chargedbond in the n-type material and producesone negatively charged bond in the p-typematerial.

    Both conduction-band electrons (freeelectrons) and valence-band holes areneeded for conduction through thematerials.When an electron diffuses across a

    junction, the n-type material lost aconduction-band electron. When theelectrons fall into a hole in the p-typematerial, the material has lost avalence band- hole.

    Both bonds have been depleted ofcharge carriers.

    Depletion layer

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    1.What is the overall charge on an n-typecovalent bond that has just given up aconduction-band electron?

    2.What is the overall charge on an p-type

    covalent bond that has just accepted anextra valence-band electron?

    3.Describe the forming of the depletion layer.

    4.What is barrier potential? What causes it?

    Section review

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    A PN junction is useful because we can controlthe width of the depletion layer.

    By controlling the depletion layer width, we

    control the resistance, thus we can control theamount of current that can pass through adevice.dep. layer width, resistance, junction current dep. layer width, resistance, junction current

    Bias potential applied to a pn junction toobtain a desirable mode of operation.

    1-4 Bias

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    Two types:Forward biasReverse bias

    Forward bias potential used to reduce the

    resistance of the pn junctionReverse bias potential used to increase the

    resistance of the pn junction

    Bias

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    When the applied voltage causes the n-type material tobe more negative than the p-type material.

    Allows current to pass

    Majority carriers in the n-type and p-type materials are

    pushed toward the junction.Minority carriers in the n-type and p-type materials are

    drawn away from the junction.

    Forward Bias

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    Bulk resistancecombined resistance of the n-type and p-type

    materials in a FB pn junctionTypically in the range of 5 ohms or less

    Forward voltage (VF

    )

    Voltage across a FB pn junction0.7 v for silicon0.3 v for germanium

    Two ways of forward biasing a pn junction:

    By applying a potential to the n-material thatdrives it more negative than the p-material

    By applying a potential to the p-material thatdrives it more positive than the n-material

    Forward bias

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    When the applied potential causes the n-type material to bemore positive than the p-type material.Depletion layer becomes wider, junction current reduced to

    near zeroMajority carriers in the n-type and p-type materials are

    drawn away from the junction

    Minority carriers in the n-type and p-type materials arepushed toward the junctionDiffusion current

    Majority carrier current during the time the depletionlayer is growing

    Reverse bias

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    Two ways to reverse bias a junction:By applying a potential to the n-type material

    that drives it morepositive than the p-typematerial

    By applying a potential to the p-type materialthat drives it more negative than the n-typematerial

    Reverse bias

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    Bias type Junctionpolarities

    Junctionresistance

    Forward N-type is more(-) than p-type

    Extremely low

    reverse P-type is more

    (-) than n-type

    Extremely high

    Bottom line

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    Silicon is more tolerant of heat and moreabundant than germanium. It is also a betterinsulator than germanium (at roomtemperature)

    Germanium oxide is water soluble, makinggermanium more difficult to process thansilicon.

    When heated, silicon readily produces silicondioxide, which is critical to the production ofintegrated circuits. Germanium lacks anycomparable property.

    Final Note

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    1.What are the resistance and currentcharacteristics of a pn junction when itsdepletion layer is at its maximum width? Itsminimum width?

    2.What purpose is served by the use of bias?3.What effect does forward bias have on

    depletion layer width of a pn junction?

    4.What is the junction resistance of a FB pnjunction?

    5.What are the approximate values of VF for FB Si

    and Ge pn junctions?

    Section review

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    6.List the commonly used methods for forwardbiasing a pn junction?

    7.What effect does reverse bias have on thedepletion layer width of a pn junction?

    8.What is the junction resistance of a reverse-biased pn junction?

    9.List the commonly used methods for reverserbiasing a pn junction.

    10.Why is silicon more commonly used than thegermanium in the production of solid-statecomponents?

    11.

    12

    Section review