1of2_Adhesives Coatings and Encapsulants Product Training Aug 28 2008

Company Confidential

Adhesives, Coatings and Encapsulants Electronic Materials Training

September 4-5, 2008Jason Sanders

Meeting Title, DateCompany Confidential

INDIANAPOLIS FACILITY PROFILE

•90,000+ Square Foot Facility on 7 acres Located In Indianapolis, Indiana - USA–Manufacturing–60 Employees–2 Overlapping Shifts–12 Million Pounds Produced Annually

•TS 16949 and ISO 9001 registered•ISO 14001•Consolidated EW, PC and FV Manufacturing, Structural Adhesives Mfg.


Automotive ElectronicApplications


Encapsulants, Adhesives and Coatings

Lord Expertise and Capabilities

– Experience in supplying products for automotive electronic applications for over 30 years.

– Electronic materials available in three chemistries; epoxy, urethane and silicone.

– Materials application and electronics reliability test equipment to support product development

– Flexible manufacturing from bulk containers to syringes.

– Global manufacturing and technical support



Potting and encapsulating materials for:– Electronic ignition and engine control modules– Ride level and wheel speed sensors– Tire pressure sensors– Lighting ballasts and HID lighting– Capacitors, switches, connectors and relays– DC/DC converters– Circuit boards– Engine/transmission controller

Adhesives and Conformal Coatings for:– Lid sealing– Circuit board component assemblies– Battery Assembly– Radio boards



Currently Supplying Delphi with…..• Thermally Conductive Adhesive MT-220

• Epoxy Lid Seal Adhesive EP-870

• Silicone Lid Seal Adhesive SC-242

Current Programs at Delphi• Pencil-Type Ignition Coil – Epoxy ES-111

– Approved at Torreon, MEX, Seixal, – Portugal, Korea, China

• DIS Ignition Coil – Epoxy ES-110– Approved at Anderson, IN

• Truck Ignition Coil (Gen III, Gen IV, L6, DCX) –Epoxy ES-115

– Approved at Anderson, Torreon & Seixal


Currently Supplying Other Automotive Electronics Manufacturing Companies….

• Silicone EncapsulantsSC-300M, SC-316, SC-319

• Silicone Conformal CoatingsSC-2002 HV, SC-318

• Silicone Thermal AdhesivesSC-253, MG-122

• Silicone Lid Seal AdhesivesSC-212, SC-254, SC-412

• Silicone Thermal GreasesSG-21, SG-26, Circalok 6754


Currently Supplying Other Automotive Electronics Manufacturing Companies….

• Urethane EncapsulantsUR-312, UR-323, UR-325, UR-329

• Urethane Lid Seal AdhesivesCircalok 6404

• Epoxy Encapsulants302, 340, Circalok 6059, EP-809EP-830, ES-26U, ES-106, ES-95

• Epoxy Lid Seal AdhesivesES-90, ES-107


AUTOMOTIVE INDUSTRY QUALIFICATIONS

1. Air Bag SensorToyota, Ford, ChryslerEP-669, 302/#60, UR-278-5

2. Halogen Headlamp EncapsulantBosch - DC-23

3. Radiator AdhesiveVisteon - EP-701

4. Alternator Bridge RectifierGeneral Motors SC-254, EP-592, EP-593, EP-540

5. Battery AdhesiveGeneral Motors, Ford, Chrysler, Johnson Controls, EnertecEP, 433, EP-672, ES-38, ES-73

6. Hall Effect SensorGeneral Motors – UR-172, EP-830Ford, Chrysler – 300, EP-930, #67, #64AEC – SC-316

7. Radio Board CoatingChryslerSC-2002HV

8. Alternators – Starter MotorsDelco Remy -- RemanEP-445, EP-446, EP-447

9. SCAP SensorVisteon – UR-164Motorola – UR-285

10. Speed Control SensorVisteon – SC-253, ES-41, ME-138

11. Exhaust Re-circulation ControlVisteon, General Motors – EP-936

12. Electronic Spark ControlVisteon – SC-212

13. Electronic Ignition – After MarketFord – DC-23Chrysler – EP-680Flight Systems – CK-6055

14. Voltage RegulatorGeneral Motors – SC-139Chrysler – EP-680Robert Bosch – DC-23Transpo – CK-6700

15. Neutral Back–Up SwitchGeneral Motors – UR-212



16. Mass Air Flow SensorGeneral Motors – EP-139 Visteon – ME-138, SC-242, EP-903, EP-870, MH-205Hitachi – EP-729

17. Ignition CoilVisteon DIS – EP-697FVisteon E-Core – DC-812Chrysler, Honda – EP-760U, EP-929Shenda Motors – ES-44Bobinadores Unidos, Standard Motor Products, Echlin – EP-809Wells Mfg – ES-106Unison – EP-954Weastec – EP-760U, ES-26

18. Linear Position SensorFord – UR-190, UR-312

19. Brake Fluid Level DetectorChrysler, General Motors - 300#75

20. Transmission SensorChrysler – PR-30, ES-100, MT-220

21. Exhaust Leak Detector PumpChrysler, General Motors – UR-310

22. Engine Control ModuleChrysler – UR312, SC-300MThunder Heart Performance – UR-324Kimball – SC-254, SC-294

23. Fluorescent Lighting BallastFord – UR-212

24. ABS Wheel Speed SensorChrysler – EP-900#67Tractor/Trailer – UR-190

25. Auto Select Transmission ControlTractor/Trailer – UR-190

26. Windshield Washer Reservoir MotorGeneral Motors – EP-373



27. Windshield Wiper MotorGeneral Motors – 300/#25

28. Audio Power AmplifierChrysler – UR-310

29. Heated - Side View MirrorsGentex – CK6404Magna Donnelly – CK-6403

30. ABS – Electronic Control ModuleDelphi – MT-220

31. Oil Temperature SensorHi-Stat – CK6754

32. Electrical Steering ModuleEaton Corp. – UR-190


VACUUM PRESSURE AND IMPREGNATION

VPI Materials for:• Automotive ignition coils• Alternator and starter windings• Television fly-back coils• Aircraft ignition coils• Electrical and electronic applications• Power supplies


AUTOMOTIVE IGNITION COIL QUALIFICATIONS

Customer Application Product

Delphi Corporation DFI, DIS, COP and Pencil Coils Epoxy EncapsulantES-110, ES-115

Visteon Automotive Systems DIS and Pencil Coils Epoxy Encapsulant EP-697F

Wells Manufacturing After-market Ignition Coils Epoxy Encapsulant ES-106

Automotive Controls After-market Ignition Coils Epoxy Encapsulant EP-809

Standard Motor Products After-market Ignition Coils Epoxy Encapsulant EP-809

Weastec, Inc. OEM Coils – Chrysler, GM and Honda

Epoxy Encapsulant EP-760U, ES-26U

Walbro Engine Small Motor Coils Epoxy Encapsulant EP-809


Ignition Coil Encapsulants

• Epoxy/Anhydride Chemistries

• 40 – 60 % Filled Systems

• Vacuum Impregnation Dispensing

• Automated Preheat, Dispense and Cure Lines

• Multiple Designs of Coils


Industrial ElectronicApplications


Encapsulants, Adhesives and Coatings Product Properties

– High temperature epoxy and silicones for harsh environment exposures.

– Low modulus urethane encapsulants for protection of delicate electronics.

– Low shrink, low stress epoxy encapsulants and adhesives for delicate electronics and harsh environments.

– Fast cure one-component epoxy and silicone encapsulants, adhesives and coatings.

– Unique hybrid epoxy-silicone and urethane-polyester chemistries.


Encapsulants, Adhesives & CoatingsProduct Selector Guide

Product Name Description Typical Applications Type1 or 2

Component

300/#72 Filled 1 to 1 Epoxy System Encapsulant for Electrical/Electronic Devices Epoxy 2340/#70 Thermally Conductive Epoxy System Encapsulant for Electrical/Electronic Devices Epoxy 2EL-636 Highest Temperature Resistant Epoxy System Encapsulant for High Temperature, 180° Requirments Epoxy 2EP-20/#65 Unfilled 2 to 1 Epoxy System Encapsulant for Electrical/Electronic Devices Epoxy 2EP-809 General Purpose Epoxy Coil Encapsulant Encapsulant for Ignition Coils Epoxy 2EP-830 High Tg Epoxy Encapsulant Encapsulant for Ignition Coils Epoxy 2EP-870 High Viscosity Epoxy One Component Electronic Modules/Lid Seal Epoxy 1EP-937 Medium Viscosity Epoxy One Component Encapsulant/coating for Electronic Devices Epoxy 1ES-73 Unfilled 1 to 1 Epoxy System Battery (Auto/Marine) Epoxy 2ES-86 Fire Retardant Epoxy System Encapsulant for Power Devices Epoxy 2ES-106 Economical, Epoxy Coil Encapsulant Encapsulant for Ignition Coils Epoxy 2SC-102 Unfilled 1 to 1 Silicone System Encapsulant for Electronic Devices Silicone 2SC-242 Primerless, Filled Silicone, One Component Encapsulant/Coating/Adhesive for Electronic Devices Silicone 1SC-253 Thermally Conductive Silicone System Adhesive for Power Components Silicone 2SC-254 High Strength Unfilled Silicone One Component Coating/Sealant for Alternator Silicone 1SC-294 Primerless Unfilled Silicone One Component Encapsulant/coating for Electronic Devices Silicone 1SC-300M Low Modulus 1 to 1 Silicone Gel Encapsulant for Electronic Modules Silicone 2SC-308 Low Tg Thermally Conductive Silicone Encapsulant for Power Devices Silicone 2SC-309 Low Viscosity Thermally Conductive Silicone Encapsulant for Power Devices Silicone 2SC-2002HV Low Viscosity One Component Silicone Conformal Coating for Circuit Board Silicone 1UR-312 Low Modulus Urethane Gel Encapsulant for Electronic Modules Urethane 2UR-322 1 to 1 Unfilled Urethane Systems Encapsulant for Electrical/Electronic Devices Urethane 2UR-325 High Strength Urethane Encapsulant Encapsulant for Electrical/Electronic Devices Urethane 2UR-340 Economical, Urethane Encapsulant Encapsulant for Electrical/Electronic Devices Urethane 2


Manufacturers of Power Converters


Manufacturers of Instrument Transformers,Metering Devices and Peripherals


Manufacturers of Power Supplies,Charging Devices, Marine Accessories


Manufacturers of Cast Coils andHigh Voltage Commercial Transformers


CONSUMER ELECTRONICS

• Power Transformers

• Pumps (Submersible & Ambient Operations)

• Surge Suppressors

• Relays

• Ignition Devices

• Heating Elements

• Typically Require Compliance to Underwriters Laboratory Certification

• Component vs. Material Compliance


Regulatory Issues

• Directive 2002/95/EC of the European Parliament• RoHS - Restriction of Hazardous Substances Directive• WEEE – Waste Electrical & Electronic Equipment Directive• Address EU Disparities in Hazardous Substance Regulation• Targets Lead,Cadmium,Mercury, Polybrominated FR


Application Chemistry

Parameter Urethane Epoxy SiliconeCost Moderate Moderate HighProcessing Most Difficult Best ModerateOperating Range -50°C to + 105°C -40°C to + 130°C -120°C to + 200°CRepairability Good Poor ExcellentAdhesive Strength Moderate High LowModulus Moderate High LowChemical Resistance Moderate High LowElectrical Insulation Good Excellent ExcellentDielectric Constant Moderate Moderate Low


Epoxies


Epoxies for E/E Applications

Excellent electrical properties Good adhesion due to presence of polar groups Low shrinkage Good impact resistance Superior Moisture & Chemical resistance


Epoxy EncapsulantEP-20 Resin

• Industry Standard, Two Component, RT or Heat Cured

• Black, Unfilled Epoxy Resin

• Available with Multiple Hardeners

Typical Application – Small Switches, Relays, Sensors


EP-20 Resin Product LineNo. 18 No. 66 No. 65 No. 67 No. 71

Mix Ratio (resin to hardener)By weight 100:14 Variable 100:40 100:24 100:100By volume 100:16 Variable 100:50 100:30 100:120Mixed Viscosity @ 25°C (cps) 3,200 30,000 1,200 2,000 3,000Working Life @ 25°C 20 min 75 min 50 min 60 min 60 min

(100g) (400g) (200g) (200g) (200g)Typical Cure Schedules 24 hrs 24 hrs 24 hrs 2 hrs 24 hrs

@25°C @25°C @25°C @100°C @25°C

Physical Properties:Hardness (Shore D) 88 82 85 92 60ASTM D 2240Specific Gravity @ 25°C 1.04 1.06 1.09 1.11 1.08

Temperature Rating Guide* 130°C 105°C 130°C 155°C 130°CTensile Strength (psi) 11,200 7,500 9,000 10,900 2,300Tensile Elongation 3.6% 4.5% 4.5% 5.2% 55%Izod Impact Strength (ft lb/in) 0.38 1.50 0.55 0.32 2.50Water Absorption (24 hours) 0.18% 0.35% 0.22% 0.20% 0.85%

Electrical Properties:Dielectric Constant 3.9 3.7 4.2 4.4 4.2Dissipation Factor 0.02 0.016 0.016 0.038 0.021Volume Resistivity (ohms/cm)

@ 25°C 1015 1015 1015 1016 1014

@ 105°C 1013 1011* 1011 1014 1010

@ 130°C <1010 <109 <109 1013 109


Epoxy Encapsulant300 Resin

• Industry Standard, Two Component, RT or Heat Cured

• Black, Silica-filled Epoxy Resin

• Available with Multiple Hardeners

Typical Application – Transformer Encapsulant, Power Supplies

1of2_Adhesives Coatings and Encapsulants Product Training Aug 28 2008

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