(1)Introduction of MEMs
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TFIT-2 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
What is MEMs ?What is MEMs ?
MicroelectromechanicalMicroelectromechanical Systems, or MEMS,Systems, or MEMS,
areare integrated micro devicesintegrated micro devices oror systemssystems
combining electrical and mechanicalcombining electrical and mechanicalcomponentscomponents..
They are fabricated usingThey are fabricated using integrated circuitintegrated circuit
(IC) batch processing techniques and can(IC) batch processing techniques and canrange in size fromrange in size from micrometers to millimetersmicrometers to mill imeters..
These systems can sense, control and actuateThese systems can sense, control and actuate
on the micro scale, and function individually oron the micro scale, and function individually orin arrays to generate effects on thein arrays to generate effects on the macromacro
scalescale..
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TFIT-3 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
History of MEMS Technology (History of MEMS Technology ())
Richard Feynman says, Theres Plenty of Room at the Bottom- Presentation given Decmber 26, 1959 at California Institute of Technology
- Tries to spur innovative miniature fabrication techniques for micromechanics
- Fails to generate a fundamentally new fabrication technique
Westinghouse creates the Resonant Gate FETin 1969- Mechanical curiosity based on new microelectronics fabrication techniques
Bulk-etched silicon wafers used as pressure sensors in 1970s
Kurt Petersen published Silicon as a Structure Materialsin 1982- Reference for materials properties and etched data for silicon
Early experiments in surface-micromachined polysilicon in 1980s
- First electrostatic comb drive actuators
- Micropositioning disc drive heads Micromachining leverages microelectronics industry in late 1980s
- Widespread experimentation and documentation increases public interest
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TFIT-4 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
History of MEMS Technology (History of MEMS Technology ())
Early transduction and actuation methods produce simple actuators
- Piezoresistive , capacitive , field emitters , electrostatic , bimorph , piezoelectric
Methods of micromachining aimed toward improving sensors- Thermal and electrical isolation between layers with suspended structures
Government agencies start large MEMs support programs
- AFORS supports basic research in materials and MEMs research
- DARPA creates MUMPS foundry service with MCNC in 1993
- NIST supports commercial foundries for CMOS and MEMS
Chris Pister (UCLA) creates first micromachined hinge in 1992
- Hinged features open possibilities for pseudo-3D structure and assembly
Later actuation and fabrication methods produce advanced systems
- Deep reactive ion etching , laser machining , fluidics , tunneling , deep UV
shape memory alloys , magnetic materials , extrusion , combustion
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TFIT-5 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Technology Trend and RoadmapTechnology Trend and Roadmap
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TFIT-6 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Micromachine center
Market of MEMs (Japan)Market of MEMs (Japan)
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TFIT-7 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Market of MEMs (USA)Market of MEMs (USA)
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TFIT-8 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
MEMsMEMs of Electronicsof Electronics
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TFIT-9 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Sensor and ActuatorSensor and Actuator
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TFIT-10 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
WordwideWordwide MEMs GrowthMEMs Growth
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TFIT-11 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
1.Hard disk driver heads
2.Inkjet printer heads
3.Heart pace makers
4.In-vitro diagnostic devices
5.Hearing aids
6.Pressure sensors
7.Chemical sensors
1.Drug-delivery systems
2.Optical switches
3.Lab-on chip system
4.Magneto-optical heads5.Projection light valves
6.Coil-on-chip
7.Micro-relays
8.Micro-motors
1.IT peripherals
2.Medical / Biomedical Engineering application
3.Industry and automation
4.Tele-communications
5.Automotive applications
6.Environmental monitoring
2002
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TFIT-12 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
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TFIT-13 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
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TFIT-14 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
IC -,,,
,
,
-,,,
-,,,, - -()-, ..()-,,,,()-,, -,,
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TFIT-16 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Defense ApplicationDefense Application
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TFIT-17 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Commercial ApplicationCommercial Application
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TFIT-18 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
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TFIT-19 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
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TFIT-20 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
MicroMicro--Technology ClassificationTechnology Classification
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TFIT-21 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
MultiMulti --technology for MEMS applicationstechnology for MEMS applications
Mechanical
Chemical
Materials
Biological
Electronic Physical
MEMs
Optical
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TFIT-22 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
MicrosensorsMicrosensors of Classificationof Classification
Thermal sensorsThermal sensors
--Thermocouples,Thermocouples, ThermoresistorsThermoresistors, Thermal flow, Thermal flow--raterate
sensors.sensors.
Radiation sensorsRadiation sensors
--Photodiodes, Phototransistors, Charge coupled devicesPhotodiodes, Phototransistors, Charge coupled devices
((CCDsCCDs),), PyroelectricPyroelectric sensors, Integrated optics.sensors, Integrated optics.
Magnetic sensorsMagnetic sensors
Chemical sensors & biosensorsChemical sensors & biosensors
--ISFET sensors, EnzymeISFET sensors, Enzyme--based biosensors, Microelectrodesbased biosensors, Microelectrodes
for neurophysiology.for neurophysiology.
Mechanical sensorsMechanical sensors
--PiezoresistorsPiezoresistors , Piezoelectric sensors, Capacitive sensors,, Piezoelectric sensors, Capacitive sensors,Optical sensors, Resonant sensors, Accelerometers,Optical sensors, Resonant sensors, Accelerometers,
Pressure sensors.Pressure sensors.
http://http://www.dbanks.demon.co.uk/uengwww.dbanks.demon.co.uk/ueng//
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TFIT-23 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
MicroactuatorMicroactuatorof Classificationof Classification
Electrostatic actuatorsElectrostatic actuators
--Comb Drives, WobbleComb Drives, Wobblemotorsmotors
Magnetic actuatorsMagnetic actuators
Piezoelectric actuatorsPiezoelectric actuators
Thermal actuatorsThermal actuators
Hydraulic actuatorsHydraulic actuators
MicrostimulatorsMicrostimulators
http://www.dbanks.demon.co.uk/ueng/
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TFIT-24 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Micro Flow SensorsMicro Flow Sensors
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TFIT-25 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Micro Cooling SystemsMicro Cooling Systems
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TFIT-26 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
IC ProcessesIC Processes
OxidationOxidationDiffusionDiffusion
LPCVDLPCVD
PhotolithPhotolith
EpitaxyEpitaxySputteringSputtering
etcetc
MicromachiningMicromachining
ProcessesProcesses
Bulk MicromachiningBulk Micromachining
Surface MicromachiningSurface Micromachining
Wafer BondingWafer Bonding
Deep Silicon RIEDeep Silicon RIE
LIGALIGA
MicromoldingMicromoldingetcetc
MEMs ProcessesMEMs Processes
MEMs
S C S
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TFIT-27 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Silicon Crystal StructureSilicon Crystal Structure
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TFIT-28 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
MicrofabricationMicrofabrication ProcessesProcesses
IC F b i tiIC F b i ti
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TFIT-29 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
PVDLPCVDCVD
IC FabricationIC Fabrication
,.
,,..
,...
T i l f id ti fT i l f id ti f
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TFIT-30 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Typical wafer oxidation furnaceTypical wafer oxidation furnace
* Thermal oxidation is a high temperature process.
* Used to grow a continuous layer of high-quality.
* Silicon dioxide on silicon substrate.
Dry OxidationOxidation species is oxygen.
Wet Oxidation
Oxidation species is watervapour.
http://www.memsnet.org/
f
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TFIT-31 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
The spin casting process as used forThe spin casting process as used for
photoresistphotoresist in photolithographyin photolithography
http://www.memsnet.org/
Typical Etching (wet etching)Typical Etching (wet etching)
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TFIT-32 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Typical Etching (wet etching)Typical Etching (wet etching)
Wet Etching
This covers any form of etching where etching is
performed by immersing the wafer in a bath of the
chemical etchant. The chemical etchants can be split
into two types, isotropic and anisotropic. Isotropic
etchants will etch a given material at the same rate
what ever direction it is etching in, by
contrast anisotropic etchants will etch
at different rates in a given material
depending on a number of factors,
the most useful one being the crystalstructure and orientation.
Bulk Micromachining
http://www.tronics-mst.com
anisotropic etching
AnisotropicIsotropic
http://www.el.utwente.nl
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Thin Film DepositionThin Film Deposition
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TFIT-34 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Chemical VapourDeposition (CVD) ProcessCVD is capable of producing thick, dense, ductile, and good adhesive
coatings on metals and non-metals such as glass and plastic.Contrasting to the PVD coating in the "line of sight", the CVD can coat
all surfaces of the substrate.
- APCVD,LPCVD, PECVD. MOCVD
Physical VapourDeposition (PVD) ProcessPVD coatings involve atom-by-atom, molecule-by-molecule, or ion
deposition of various materials on solid substrates in vacuum systems.
- Thermal evaporation, Sputtering
Thin Film DepositionThin Film Deposition
Typical CVD systemTypical CVD system
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TFIT-35 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Processes
APCVD Atmospheric pressure CVD
LPCVD Low pressure CVD
PECVD Plasma enhanced CVD
Reaction Types
Heterogeneous reaction
- Chemical reaction takes place
- Very close to the surface
- Good quality films
Homogeneous reaction
- Chemical reaction takes place
- In the gas phase
- Poor quality films
Reaction Energy
Thermal
Photons
Electrons
Typical CVD systemTypical CVD system
Typical hotTypical hot--wall LPCVD reactorwall LPCVD reactor
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TFIT-36 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Typical hotTypical hot--wall LPCVD reactorwall LPCVD reactor
Reaction rate limited operation
Operates at 0.1 to 1Torr pressure
Good quality films
Conformal coverage
Typically used for HTO, PolySi,
Some metal films and nitridehttp://www.memsnet.org/
Typical system for eTypical system for e--beam evaporation ofbeam evaporation of
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TFIT-37 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
yp yyp y pp
materialsmaterials
Provides very clean andhigh purity metal films
http://www.memsnet.org/
Typical coldTypical cold wall vapor phasewall vapor phase epitaxialepitaxial reactorreactor
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TFIT-38 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Typical coldTypical cold--wall vapor phasewall vapor phase epitaxialepitaxial reactorreactor
The same crystallographicorientation.An amorphous/polycrystallinesubstrate.The films of thick
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TFIT-39 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Typical RF,DC sputtering systemTypical RF,DC sputtering system
DC Sputtering -DC voltage between target and substrate,
used for conductive targets (metal films)
RF Sputtering -RF voltage between target and substrate,
used for insulators (dielectrics)
Magnetron Sputtering - Magnetic field confines electrons near the target,
increasing the number of electrons causing,
ionization collisions and, thereby, deposition rates,
Reactive Sputtering - Sputtering a target material in presence of a
reactive gas, thereby, depositing a compound.
http://www.memsnet.org/
Micromachining ProcessesMicromachining Processes
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TFIT-40 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Micromachining ProcessesMicromachining Processes
LIGA
SurfaceMicromachining
Bulk
Micromachining
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Surface MicromachiningSurface Micromachining
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TFIT-42 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
gg
Two kinds of Surface MicromachiningTwo kinds of Surface Micromachining
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TFIT-43 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
gg
SimpleSimple MicromirrorMicromirrorFabricationFabrication
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TFIT-44 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
pp
SandiaSandia UltraUltra--planar Multiplanar Multi--level MEMSlevel MEMS
T h l (T h l (SUMMiTSUMMiT ))
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TFIT-45 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
An electrostatic microengine output gear
coupled to a double-level gear train that
drives a rack and pinion slider. This gear
train provides a speed-reduction/torque-
multiplication ratio of 9.6 to 1.
A pin-in-maze microcombination lock. Thepin must be electrostatically deflected to
traverse the maze cut into the large gear.
Technology (Technology (SUMMiTSUMMiT ))
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LIGALIGA ((LithographieLithographie,, GalvanoformungGalvanoformung,, AbformungAbformung)) FabricationFabrication
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TFIT-47 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
LIGA ((Lithographieg p ,, Galvanoformungg,,Abformungg)) Fabrication
90,
SummarySummary
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TFIT-48 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
(MEMS
CAD)
ReferencesReferences
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TFIT-49 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
http://www.dbanks.demon.co.uk/ueng/
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TFIT-50 Department of Electronics Engineering and Computer, TFITDepartment of Electronics Engineering and Computer, TFIT
Questions or Comments
Thanks you !