169862698-Qb-Emic-Ap9256-Feb13-Final

8/12/2019 169862698-Qb-Emic-Ap9256-Feb13-Final

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EASWARI ENGINEERING COLLEGE / DEPARTMENT OF ECE

AP 9256: Electroma!et"c I!ter#ere!ce a!$ Com%at"&"l"t' "! S'(tem De("!)*+e(t"o! ,a!-

.NIT)I :: EMI/EMC CONCEPTS / PART A

S0No *+e(t"o! E1am

0 What is meant by electromagnetic compatibility? JA-112. Define ESD. JA-11

3. What are the three criteria to be satisfied by any system to become electromagneticallycompatible?

J-1!JA-!"

#. $o% do yo& pre'ent emission? J-1!(-!"

). Why is E*+ a 'ital problem? JA-1!

,. Why do %e feel electric shoc at times %hen %e to&ch /0 and +omp&ter monitors? JA-1!

. ist the so&rces of E*. (-!"

(-!,

". What is cond&cted co&pling of E*? (-!"

4. A bie started or a mi5ie &nder r&nning condition dist&rbs a /0 recei'ers f&nctioning. Why? (-!,1!. Dra% an e6&i'alent circ&it model for electrostatic discharge. (-!,

11. What are the 'ario&s type of radiation co&pling in E*? (-!,

12. What is cond&cted interference? (-!)

13. s it possible to de'elop circ&it models of E*? (-!)

1#. (ame the t%o factors that tend to affect the amo&nt of interference that %o&ld other%ise be

transmitted along a cond&cted path.

(-!)

1). Define E* and E*+.

1,. What is transient s&ppression?

1. $o% to classify E*7E*+?

1". What are the different &nits of parameters for the meas&rements of E*?

14. What are +E and 8E?

2!. What is E*9?

21. What do yo& &nderstand abo&t the effect of E* on sec&red comm&nications?

22. Determine the ratio of :a; t%o po%ers 91 < 1mW and 92 < 2! W:b; t%o 'oltages '1 < 1! m0 and '2 < 2! m0 and

:c; t%o c&rrents i1 < 2 mA and i2 < !.) A in d=.

Ans%ers> #3 d= 2)# d= #" d=.

23. Determine the follo%ing 6&antities in the indicated &nits>

2!m0 :d=m0; )! m0 :d=m0; 1!!mA :d=mA; 3! W :d=W; 3!! mW :d=m;.Ans%ers> ", d=m0 2, d=m0 #! d=mA 1#> d=W )>23 d=m.

2#. Determine the absol&te 'al&es of the follo%ing 6&antities> ,! d=m07m 12! d=m07m 3!d=m0 ,, d=m. Ans%ers> 1 m07m 1 07m 31., m0 34"1 W.

2). Determine the %a'elength at the follo%ing fre6&encies in metric &nits> :a; ,!! *$@ in epo5y

glass:r < #.; :b; 3 B$@ in air :c; ) *$@ in poly'inyl chloride:r < 3.);.

*- Apr7 *ayC (- (o'7 DecC JA JanC J- J&ne 9age 1 of 1!


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EMIC/ *,/ FE, 232

.NIT)I :: EMI/EMC CONCEPTS / PART ,

S0No *+e(t"o! E1am Mar-(

0 Disting&ish bet%een the feat&res of cond&cted E* and radiated E*. JA-11 1,

20 What are the so&rces and 'ictims of E*? E5plain %ith e5amples. JA-11 1,

40 :i;What are the so&rces of E*? Bi'e e5amples.:ii; E5plain in detail the cond&cted E* and radiated E* %ith e5amples.

J-1! )11

0 :i; +ompare time domain E* %ith fre6&ency domain E*.

:ii; E5plain ESD in detail. What are all the remedial proced&res?

J-1! ""

50 Why is E* significant in system design? E5plain %ith ind&stry citations. What

are the so&rces and 'ictim of E*?

JA-1! 1,

60 $o% do electrostatic discharges occ&r? E5plain in detail E* radiation $a@ards. JA-1! 1,

0 $o% are the 'ario&s so&rces of E* ept &nder control and meas&red? What are

the 'ario&s parameters of meas&rement? Bi'e their rele'ant &nits.

(-!" 1,

70 Discriminate time domain and fre6&ency domain emi. %hy does one analy@e in

fre6&ency approach analysis. design and location of high 'oltage e6&ipments.

(-!" 1,

90 E5plain the different so&rces of E* in detail. J-!" 1,

30 Disc&ss ho% lightning discharges affect the transmission line comm&nication.

E5plain the transient effects and ho% to minimi@e the transient effects?

(-!, 1,

0 Disc&ss in detail the design practice for minimi@ing cond&cti'e interference. (-!) 1,

20 An ESD discharge is modeled as a capacitance of 1)!pf. +harged to 2 F0 and

discharged thro&gh a resistance of 1 ohms.

i. Write do%n the e5pression for the c&rrent %a'eform

ii. Appro5imating the c&rrent %a'eform as a short dipolecalc&late the interference po%er at a distance of 1!cm and find

its 'ariation %ith time.

(-!) 1,

40 E5plain in detail classification of interference? $o% do yo& minimi@e each? (-!) 1,

0 E5plain abo&t transients and its remedies.

50 E5plain in detail classification of E*7E*+. $o% do yo& minimi@e each?

60 Disc&ss ho% lightning discharges affects the transmission lines comm&nication.

0 E5plain the transient effects. $o% to minimi@e them?

70 With s&itable e5amples e5plain intentional and &nintentional electromagneticemissions d&ring operation of 'ario&s e6&ipments. $o% to control them?



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EMIC/ *,/ FE, 232

.NIT)II :: EMI COUPLING PRINCIPLES / PART A


Sl0No0 *+e(t"o! E1am

0 ist o&t the types of co&pling bet%een cables.7ist the E* co&pling methods. JA-11

2. Define Bro&nd co&pled nterference. JA-11

3. Define edge rate. J-1!

#. What is transient co&pling?

Define /ransient +o&pling.

J-1!

J-!"

). Define cross tal %ith reference to E*7E*+ design iss&es? J-1!JA-1!

JA-!"

J-!"

,. Define GBro&ndH %ith respect to %oring on electrical gadgets. JA-1!

. What is electromagnetic emission? JA-!4

". $o% does one a'oid po%er mains interference? JA-!4

4. Why is a limit on the lo%er fre6&ency portion of the cond&cted emission and %hich

is the standard follo%ed d&ring the testing accordingly?

JA-!

1!. What are the steps in the proced&re to analy@e E*9 s&sceptibility? JA-!,

11. What allo%s a cond&cti'e transfer to occ&r? JA-!,

12. What does co&pling mean?

13. What is mean by gro&nd loop co&pling? 7 What is B+?

1#. Dra% common mode and differential mode co&pling in circ&its.

1). ist the dra%bacs of 'ario&s co&pling mechanisms.

1,. =rief abo&t po%er s&pply and po%er main co&pling?

1. $o% field co&pling affects the systems?

1". Define S(.

14. Dra% +* and D* co&pling in circ&its.

2!. $o% field co&pling affects the system?


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EMIC/ *,/ FE, 232

.NIT)II :: EMI COUPLING PRINCIPLES / PART ,

Sl0No0 *+e(t"o! E5am *ars

0 Describe the differences bet%een radiated D* and +* co&pling %ith

s&itable e5ample.

JA-11 1,

20 Disc&ss in detail abo&t gro&nd loop co&pling and po%er s&pply

co&pling.

JA-11 ""

40 E5plain in detail the cond&cted radiated and common impedancegro&nd co&plings %ith e5amples.

J-1! 1,

0 What is radiated differential mode co&pling? n %hat %ay this is

different from the radiated common mode co&pling? E5plain this %ith

e5ample.

J-1! 1,

50 E5plain cable co&pling and its electromagnetic impact in system design. JA-1! 1,

60 What is Differential mode co&pling:D*+;? $o% do radiated co&pling

and transient co&pling 'ary from D*+?

JA-1! 1,

0 Disc&ss the impact of radiated common mode and radiated differential

mode co&pling? Also e5plain ho% do common mains s&pply is afre6&ent so&rce of cond&cted interference. $o% do s&rges on main

po%er s&pply affect appliances? $o% to a'oid it %ith appropriate

design and location?

JA-! 1,

70 Bi'e s&itable e5amples for intentional and &nintentional electromagnetic

emissions d&ring operation of 'ario&s e6&ipments. $o% to control

them? Also list o&t electric field intensity le'els of 'ario&s homeappliances. Also pro'e +E is more significant than radiated one.

JA-! 1,

90 $o% do cable co&pling near and far co&pling of E* fields prod&cedcan be red&ced? $o% to enhance imm&nity of circ&its7e6&ipments

systems.

JA-! 1,

30 E5plain 'ario&s remedial acti'ities for co&pling in circ&its.

0 E5plain ho% po%er s&pply main affects the system.

20 With neat diagram e5plain gro&nd loop co&pling and near fieldco&pling.

40 With neat diagram e5plain near field co&pling.

0 E5plain in detail 'ario&s co&pling methods7mechanisms.

.NIT)III ::EMI CONTROL TECHNIQUES

/ PART A


0 What is E* shielding? JA-11

2. +lassify E* filters. JA-11

3. What are the ad'antages of m&ltipoint gro&nding? J-1!

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EMIC/ *,/ FE, 232


#. What is the f&nctionality of transient s&ppressors? JA-1!

). What is meant by Gb&lgingH capacitor? JA-1!

,. What is the need for shielding? J-!"

. What does transient s&ppressor mean? JA-!4

". (ame fo&r techni6&es7approaches to combat E*. JA-!

4. What does G+hemical SaltingH mean? JA-!

1!. What is an electrical filter? JA-!,

11. Write the definitions of gro&nding and bonding. JA-!,

12. Dra% the diagram of isolation transformer?

13. What are all the proced&res considered for cable ro&ting?

1#. What is meant by signal control?

1). Bi'e at least 2 proced&res for component selection and mo&nting.

1,. Differentiate 'ario&s shielding methods.

1. What is the need for E* Baset?

1". What is an opto-isolator?

14. Define SE*+A9.

2!. What are all the tests that can be carried o'er in a shielding room?

21. Define shielding effecti'eness.

22. ist any fo&r shielding materials.

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EMIC/ *,/ FE, 232

.NIT)III :: EMI CONTROL TECHNIQUES / PART ,


0 E5plain abo&t the 'ario&s types of non-solid shielding techni6&es. JA-11 1,

20 What ate the factors infl&encing the E* performances of the bonding?

$o% can bonding be made? *ention some g&idelines for good bonds.

JA-11 1,

40 :i; What are solation /ransformers? E5plain in detail.:ii; E5plain 'ario&s method of gro&nding %ith e5amples.

J-1! ""

0 :i;What are transient s&ppressors? E5plain them.

:ii; E5plain briefly the cable ro&ting and signal control techni6&es.

J-1! ""

50 $o% does an isolation transformer control E*? E5plain shielding and

filtering methods of controlling E*.

JA-1! 1,

60 $o% does cable ro&ting control E*? $o% is signal control achie'ed? JA-1! 1,

0 E5plain 'ario&s gro&nding techni6&es &sed in electronic circ&its. J-!" 1,

70 a. sing spherical gro&nd electrodes define gro&nd resistance. $o% does

the gro&nd resistance 'ary %ith different soils?b. What are the 'ario&s preca&tions taen to red&ce gro&nd resistance?

JA-! ""

90 ll&strate ho% the effecti'eness of shielding obtained in S*9S and

ind&strial comp&ters.

JA-! 1,

30 Disc&ss in detail gro&nding design g&idelines. JA-!, 1,

0 Describe the shielding effecti'eness of both solid and non-solid

materials incl&ding m&ltiple soil shields and thin film shielding.

JA-!, 1,

20 Iilters may be designed %ith t%o different types of components. What

are they? Disc&ss all the techni6&es for designing filter.

JA-!, 1,

40 E5plain +hemical salting techni6&e.

0 E5plain 'ario&s proced&res for cable ro&ting.

50 With neat diagram e5plain bonding.

60 E5plain the basics of shielding.E5plain different shielding techni6&es.

E5plain the concepts of shielding?

0 Differentiate bet%een single and do&ble shields. =riefly e5plain abo&t

shielding discontin&ities.

70 What are E* Basets? E5plain. ist the applications of Basets.

.NIT)I8 :: EMC DESIGN OF PCBS / PART A

Sl.(o. &estion E5am1. ist o&t the co&pling sit&ations to be addressed d&ring the physical layo&t process. JA-11

2. Define > 9+= trace impedance %ith respect to E*. JA-11

3. What is Koning?Define @oning.

J-1!JA-!4

#. What is meant by /ermination in 9+= fabrication? JA-1!

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EMIC/ *,/ FE, 232

Sl.(o. &estion E5am

). What do yo& &nderstand by Gro&tingH %ith reference to 9+= design and fabrication? JA-1!

,. $o% does cable ro&ting a'oid E*? JA-!4

. ist some proced&res for red&cing cross tal. 7 $o% to a'oid cross tal in 9+=

design.

JA-!

". Define the term trace in 9+=.

4. What is the &se of deco&pling capacitors?

1!. Why gro&nding is s&ch an important iss&e in 9+= design?

11. ist some proced&res for effecti'e gro&nding in 9+= design.

12. What is impedance control in 9+=s?

13. $o% effecti'ely 9+=s are designed?

1#. ist the important consideration of the 9+= si@ing.

1). Bi'e at least t%o proced&res for component mo&nting.

1,. What is the relation bet%een 8adiation and loop area in 9+= design?

1. Dra% the circ&it e6&i'alent of and + &sed in 9+= design.

.NIT)I8 :: EMC DESIGN OF PCBS / PART ,


0 :i; Disc&ss abo&t the 'ario&s factors to be considered for E*+ design

of 9+=.:ii; E5plain in detail abo&t 0As connection and termination.

JA-11 ""

20 :i; What is meant by s&sceptibility le'el? E5plain the relationship

bet%een 9+= traces and s&sceptibility le'el.:ii; Disc&ss briefly on control de'ices for cross tal.

JA-11 ""

40 :i; $o% do yo& control the impedance 'al&e %hile designing the 9+=?

E5plain.:ii; E5plain the po%er distrib&tion deco&pling concept.

J-1! ""

0 Write short notes on the follo%ing > :i; 9+= *otherboard design :ii;

9ropagation delay.

J-1! ""

50 Disc&ss ho% electromagnetic compatibility is achie'ed %hile 9+= is

prepared for ind&stry applications.

JA-1! 1,

60 Write short notes on the follo%ing > :i; Koning :ii; 9o%er distrib&tiondeco&pling :iii; /ermination

JA-1! ,))

0 What is cross tal %ith reference to the design of 9+=s and ho% to JA-!4 1,

*- Apr7 *ayC (- (o'7 DecC JA JanC J- J&ne 9age of 1!


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EMIC/ *,/ FE, 232


minimi@e it %hen miniat&ri@ation is the concern of todayHs technology? JA-!

70 Disc&ss ho% component selection and mo&nting control E*? JA-!4 1,

90 What are all the proced&res &sed for effecti'e gro&nding in 9+= design? J-!" 1,

30 $o% do motherboard designs and performance models help for betterperformance?

JA-! 1,

0 E5plain in detail the steps in'ol'ed in motherboard design. JA-!, 1,

20 Select and recommend a s&itable capacitor of a standard 'al&e to offerma5im&m filtering and also meet the safety re6&irement of less than)mA leaage c&rrent %hen connected bet%een the line and gro&nd of a

23!0)!$@ po%er s&pply.

JA-!, 1,

40 E5plain @oning in 9+= design.

0 E5plain 'ario&s proced&res for red&cing cross tal.

50 Why digital circ&its are so sensiti'e in 9+=s. E5plain.

60 E5plain 'ario&s s&ppression techni6&es in 9+= design.

0 E5plain the importance of 9+= design.

.NIT)8 :: EMI MEASUREMENTS AND STANDARDS / PART A


0 What is the main difference bet%een radiated meas&rements for class A de'ices andothers?

JA-11

2. What is the significance of narro% band test? JA-11

3. What for * S/D #,1 #,2 and #,3 are &sed? J-1!

#. What are class A de'ices %ith reference to I++? J-1!

). *ention the t%o 'ery important needs for /E* cell. J-1!

,. Why do +S98 standards e'ol'e? JA-1!

. +an $igh 0oltage lines be allo%ed to cross residential sites? J&stify. JA-1!

1. $o% test bed is selected for ESD testing? JA-!4

". What are +S98 standards for E*+? JA-!4

4. What are +lass A de'ices %ith reference to I++? J-!"

1!. What are * S/D #,1#,2 and #,3? J-!"

11. (ame at least t%o standards for design g&idelines and /est and *eas&rementproced&res p&blished by EEE7A(S.

JA-!

2. What is the obLecti'e of re6&irements +S 1!371!#71!)?

3. E5pand the terms +S98I++?

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#. Differentiate *ilitary standard and +i'ilian standards in meas&rements?

). What are the ad'antages of loop antenna?

,. Specify the antenna &sed for micro%a'e fre6&encies.

. Define the term S(?

". With S( dra% the basic circ&it &sed for 8 meas&rements?

4. What is a c&rrent probe?

1!. What are the ad'antages of MA/S?

11. What are all the dra%bacs of MA/S?

12. What are all the factors to be considered for MA/S?

13. What are all the types of MA/S?

1#. With neat diagrams e5plain /E* +E

1). Bi'e some g&idelines to carry MA/S.

1,. Dra% t%o arrangements of MA/S.

.NIT)8 :: EMI MEASUREMENTS AND STANDARDS / PART ,


0 :i; What is the need for E* standards? E5plain.

:ii;Disc&ss briefly on I++ reg&lations.

JA-11 ""

20 E5plain briefly abo&t the meas&rements &sing an anechoic chamber. JA-11 1,

40 :i; E5plain the ci'ilian standards I++ +S98 and E+ in detail.:ii; *ention the re6&irements for the E* shielded chamber.

J-1! 11)

0 :i; E5plain the * S/D #,1E.

:ii; =riefly e5plain the 'ario&s E* /est instr&ments.:iii; What is EI/ test bed?

J-1! ),)

50 $o% are meas&rements made in the follo%ing > :i; /5 785 Antennas :ii;

E* 85 and spectr&m analyser

JA-1! ""

60 What are the needs for ci'ilian and military standards? +ompare and

contrast these standards %ith reference to E+ and *#,1E#,2.

JA-1! 1,

0 Why do the standards 'ary %ith reference to ci'ilian and militaryapplications? What are the 'ario&s standards for ci'ilian applications?

$o% do they e'ol'e? Disc&ss them in detail.

JA-!4 1,



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70 Disc&ss open area test site proced&re to carry o&t tests. What are its

limitations? $o% does one address them in testing?

JA-!4 1,

90 E5plain the proced&re for selection of MA/S. J-!" 1,

30 E5plain 'ario&s testing antenna and their fre6&encies as specified in+S98 standard.

J-!" 1,

0 What is the need for standards? Why to e'ol'e military and ci'ilianstandards? Disc&ss a test bed for ESD and EI/ based on s&itable

standard.

JA-! 1,

20 What does the standard * #,1D7#,2 emphasi@e? What are the

problems one may face by 'iolating the reg&lations in it? f possible a

case st&dy be referred to s&pport yo&r L&stification.

JA-! 1,

40 E5plain MA/S %ith s&itable diagrams. E5plain abo&t anechoic chamber.

0 $o% does /ime domain method impro'e the effecti'eness of shielding?

50 E5plain I++7+S98 +E and 8E standards.

60 E5plain and test proced&re for *S/D.

0 Write short notes on sensors7nLectors.

70 Write short notes on co&plers?

90 E5plain the t%o types of MA/S meas&rements. 7 E5plain themeas&rement of 8E and 8S &sing MA/S.

230 What is /E* cell? E5plain in detail %ith neat diagram.

20 +ompare shielding %ith MA/S.

Pre%are$ &' A%%roe$ &'

P0MEENAS;I 8ID

169862698-Qb-Emic-Ap9256-Feb13-Final

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Transcript of 169862698-Qb-Emic-Ap9256-Feb13-Final