12500 TI Boulevard, MS 8640, Dallas, Texas 75243 · Texas Instruments, Inc. PCN# 20090903001 12500...

Texas Instruments, Inc. PCN# 20090903001

12500 TI Boulevard, MS 8640, Dallas, Texas 75243

PCN# 20090903001 Addition of TI Philippines Assembly test site for MSP430 products in the ”PM”

package Final Change Notification / Sample Request

Date: 11/4/2009 To: Brian Morrow Dear Customer:

This is an announcement of change to a device that is currently offered by Texas Instruments. The details of this change are on the following pages.

This notice does not change the end-of-life status of any product. Should product affected be on a previously issued product withdrawal/discontinuance notice, this notification does not extend the life of that product or change the life time buy offering/discontinuance plan.

We request you acknowledge receipt of this notification within 30 days of the date of this notice. If you require samples to conduct an evaluation, please make any request within the 30 days—samples are not built ahead of the change. Please see the schedule on the following pages for availability dates. You may contact the PCN Manager or your local Field Sales Representative to acknowledge this PCN and request samples.

The changes discussed within this PCN will not take effect any earlier than 90 days from the

date of this notification, unless customer agreement has been reached on an earlier implementation of the change. This notification period is per TI’s standard process. Any negotiated alternative change requirements will be provided via the customer’s defined process. Customers with previously negotiated, special requirements will be handled separately. Any inquiries should be directed to your local Field Sales Representative.

For questions regarding this notice, contact your local Field Sales Representative or the PCN Manager ([email protected]). Sincerely, PCN Team SC Business Services

Phone: +1(214) 480-6037 Fax: +1(214) 480-6659

mailto:[email protected]


20090903001 Attachment: 1

Products Affected:

The devices listed on this page are a subset of the complete list of affected devices. According to our records, these are the devices that you have purchased within the past twenty-four (24) months. The corresponding customer part number is also listed, if available.

DEVICE CUSTOMER PART NUMBER MSP430F133IPM null MSP430F135IPM null MSP430F1471IPM null MSP430F147IPM null MSP430F1481IPM null MSP430F148IPM null MSP430F1491IPM null MSP430F149IPM null MSP430F149IPMR null MSP430F412IPM null MSP430F413IPM null MSP430F413IPMR null

Technical details of this Product Change follow on the next page(s).


PCN Number: 20090903001 PCN Date: 11/04/2009

Title: MSP430 Products : Addition of TIPI AT site for the ―PM‖ package

Customer

Contact: [email protected] Phone: +1(214)480-6037 Dept:

Quality

Services

Proposed 1st Ship Date: 02/04/2010 Estimated Sample Availability: 12/15/2009

Change Type:

Assembly Site Assembly Process Assembly Materials

Design Electrical Specification Mechanical Specification

Test Site Packing/Shipping/Labeling Test Process

Wafer Bump Site Wafer Bump Material Wafer Bump Process

Wafer Fab Site Wafer Fab Materials Wafer Fab Process

PCN Details Description of Change:

Qualification of TIPI as an Assembly and Test for MSP430F13x/F14X family and MSP430F412/F413 in PM package

Reason for Change:

Capacity increase to meet market demands.

Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):

No change.

Changes to product identification resulting from this PCN:

MADE IN: Assembly site Origin (22L) Assembly countryOrigin (23L)

Philippines PHI PHL

Device marking: Assembly site Code for TI Philippines = W

YM = Year/Month

LLLL = Lot Trace Code

S = Assembly Site Code

E1 = JEDEC Terminal finish SnAgCu

O = Pin 1

\T/

TAIC34I

YMLLLLS

O E1


Product Affected:

MSP430A001IPM MSP430A048IPM MSP430F1471IPM MSP430F412IPMR

MSP430A001IPMR MSP430A048IPMR MSP430F1471IPMR MSP430F413IPM

MSP430A002IPM MSP430A049IPM MSP430F1471IPMRG4 MSP430F413IPMR

MSP430A002IPMR MSP430A049IPMR MSP430F147IPM MSP430V103IPM

MSP430A006IPWR MSP430A050IPM MSP430F147IPMR MSP430V103IPMR

MSP430A007IPWR MSP430A050IPMR MSP430F147IPMRG4 MSP430V111IPM

MSP430A009IPM MSP430A051IPM MSP430F147IPMR-KAM MSP430V111IPMR

MSP430A009IPMR MSP430A051IPMR MSP430F1481IPM MSP430V118IPMR

MSP430A010IPM MSP430A064IPM MSP430F1481IPMR MSP430V123IPMR

MSP430A010IPMR MSP430A080IPM MSP430F148IPM MSP430V142IPMR

MSP430A013IPMR MSP430A108IPMR MSP430F148IPMG4 MSP430V151IPMR

MSP430A015IPM MSP430A109IPMR MSP430F148IPMR MSP430V158IPM

MSP430A015IPMR MSP430A114IPMR MSP430F1491IPM MSP430V160IPMR

MSP430A023IPM MSP430A118IPMR MSP430F1491IPMG4 MSP430V163IPMR

MSP430A023IPMR MSP430A120IPMR MSP430F1491IPMR MSP430V174IPM

MSP430A024IPM MSP430A122IPMR MSP430F1491IPMRG4 MSP430V187IPMR

MSP430A025IPM MSP430A123IPMR MSP430F149IPM MSP430V195IPMR

MSP430A025IPMR MSP430A124IPMR MSP430F149IPMG4 MSP430V197IPMR

MSP430A026IPM MSP430F133IPM MSP430F149IPMR MSP430V198IPMR

MSP430A026IPMR MSP430F133IPMR MSP430F149IPMRG4 MSP430V222IPMR

MSP430A027IPM MSP430F135IPM MSP430F149IPMR-KAM MSP430V230IPMR

MSP430A044IPM MSP430F135IPMR MSP430F412IPM

Qualification Data: This TI Philippines (Baguio) assembly site has qualified and in series production for TQFP and LQFP package families since 1990’s where this is a high volume production site for TI

Application Specific Products. The build of materials will be the same as the existing qualified assembly site of TI Taiwan.

(See Appendix A for qual results)

Product from TIPI site will be identified with a suffix ―W‖ in the Lot trace code symbolized on

the device.


APPENDIX A Enterprise Qualification Report

For

Green/Pb-Free @ 260C Reflow in Taiwan & Philippines for

TQFP/LQFP packages

07/28/2004

The TQFP/LQFP packages at 260C Reflow temperature capability and green material sets are

fully qualified and meet the Texas Instruments quality and reliability standards for ALL SC Products per the testing described below.

Qualification Description

New Material Set and Reflow Capability for TQFP/LQFP Packages

Includes Package Families: 5x5x1.0mm (32PBS); TQFP

7x7x1.0mm (32PJT, 48PFB, 64PEG); TQFP

10x10x1.0mm (52PAH, 64PAG); TQFP

12x12x1.0mm (80PFC); TQFP

14x14x1.0mm (100PZT, 128PDT); TQFP

7x7x1.4mm (32VF, 48PT, 64PTA); LQFP

10x10x1.4mm (64PM); LQFP

12x12x1.4mm (80PN); LQFP

14x14x1.4mm (80PZA, 100PZ, 128PBK); LQFP

20x20x1.4mm (144PGE, 176PBL); LQFP

24x24x1.4mm (176PGF); LQFP

28x28x1.4mm (208PDV, 256PEF); LQFP

Device Attributes

Product & Process Related Package Related

Qualification Device: TVP5150PBS Assembly Site: TAIWAN

Die Name: CTVP5150AAIN Package: PBS

Die Revision: A Pin Count: 32

Die Size (mils): 110 X 110 Mold Compound: CEL9200HF13

Transistor Count: Mount Compound: HIT EN-4085S2K3

Wafer Fab Site: DM5 Bond Wire: TS-0.95 Au

Fab Process: 1833C05.X4L Leadframe Material: Copper

Leadframe Finish: NiPdAu

Moisture Sensitivity Level: L3/260C

Flammability Rating: Class UL94-V0


Reliability Test Results for TVP5150PBS

Sample Size/Results

Test Type Conditions/Duration Lot#1 Lot#2 Lot#3

**Autoclave, 121C 240 Hours 77/0 77/0 77/0

**Thermal Shock, -65/150C 1000 Cycles 77/0 77/0 77/0

Temp Cycle, -65/+150C 2000 Cycles 77/0 77/0 77/0

**High-Temp Storage, 150C 1000 hours 77/0 77/0 77/0

Bond Strength 22/0 22/0 22/0

Manufacturability (Assembly) Approved

Preconditioning Information: ** Preconditioning sequence: JEDEC Level 3/260C

TLV320A10Q Attributes


Qualification Device: TLV320A10QPFB Assembly Site: TAIWAN

Die Name: BLEFAC10BIN Package: PFB

Die Revision: Pin Count: 48



Wafer Fab Site: DFAB Bond Wire: TS-0.95 Au

Fab Process: A21 Leadframe Material: Copper




Reliability Test Results for TLV320A10QPFB

Sample Size/Results








Preconditioning Information:** Preconditioning sequence: JEDEC Level 2/260C


SN105210 Attributes


Qualification Device: SN105210PDT Assembly Site: TAIWAN

Die Name: H731972BIN Package: PDT




Wafer Fab Site: MIHO Bond Wire: TS- 0.95 Au

Fab Process: C12 Leadframe Material: Copper




Reliability Test Results for SN105210PDT

Sample Size/Results







Moisture Sensitivity – L3 SAM/X-Section 12/0 12/0 12/0



TNETV901A Attributes


Qualification Device: TNETV901APAG Assembly Site: PHILIPPINES

Die Name: D751874B Package: PAG

Die Revision: B Pin Count: 64

Die Size (mils): 206 X 192 Mold Compound: CEL-9200HF13


Wafer Fab Site: KFAB Bond Wire: TS-0.95 Au

Fab Process: EPIC.35 (C035) Leadframe Material: Copper





Reliability Test Results for TNETV901APAG

Sample Size/Results


**Life Test, 125C 1000 Hours 40/0 40/0 40/0

**THB 85C/85%RH 1000 Hours 26/0 26/0 26/0





ESD CDM:750V 5/0 5/0 5/0


Flammability UL 94 V-0 5/0 5/0 5/0

IEC 695-2-2 5/0 5/0 5/0



Note: C035 Devices shall be released at MSL4 at this time

SN104950 Attributes


Qualification Device: SN104950PAG Assembly Site: TAIWAN

Die Name: H104950DIN Package: PAG

Die Revision: D Pin Count: 64

Die Size (mils): 191 X 158 Mold Compound:

CEL-9200HF13

Transistor Count: Mount Compound:

HIT EN-4085S2K3

Wafer Fab Site: MH6 Bond Wire: TS-0.95 Au

Fab Process: 50A12.23LO Leadframe

Material: Copper

Leadframe Finish:

NiPdAu

Moisture Sensitivity Level:

L2/260C

Flammability Rating:

Class UL94-V0


Reliability Test Results for SN104950PAG

Sample Size/Results

Test Type Conditions/Duration

Lot#1 Lot#2 Lot#3

**Life Test, 155C 240 Hours 40/0 40/0 40/0

**HAST 130C/85%RH 96 Hours 40/0 40/0 40/0

ESD CDM:750V 5/0 5/0 5/0



IEC 695-2-2 5/0 5/0 5/0



TMS320LF2401A Attributes


Qualification Device: DLF2401AVFA Assembly Site: PHILIPPINES

Die Name: C721862C Package: VF

Die Revision: C Pin Count: 32

Die Size (mils): 181 x 192 Mold Compound: CEL-9200HF13


Wafer Fab Site: DM5 Bond Wire: 24.3UM AU-TI

Fab Process: EPIC.35 (F10) Leadframe Material: Copper



L3/260C


Reliability Test Results for TMS320LF2401AVF

Sample Size/Results




**Temp Cycle, -65/+150C 1000 Cycles 77/0 77/0 77/0



ESD CDM:750V 5/0 5/0 5/0



IEC 695-2-2 5/0 5/0 5/0




TLV320AIC22 Attributes


Qualification Device: TLV320AIC22PT Assembly Site: TAIWAN

Die Name: HLV320AIC22BIN Package: PT

Die Revision: B Pin Count: 48



Wafer Fab Site: MH6 Bond Wire: TS-0.95 Au

Fab Process: 33A12 Leadframe Material: Copper



L3/260C


Reliability Test Results for TLV320AIC22PT

Sample Size/Results










TLS1056A Attributes


Qualification Device: TLS1056APZ Assembly Site: TAIWAN

Die Name: JTLS1056AIN Package: PZ




Wafer Fab Site: HIJI Bond Wire: TS-0.95mil Au

Fab Process: Lin-ImpactC50 Leadframe Material: Copper





Reliability Test Results for TLS1056APZ

Sample Size/Results










TMS320F206 Attributes


Qualification Device: TMS320F206PZ Assembly Site: PHILIPPINES

Die Name: F6EC2Z14T22 Package: PZ

Die Revision: 2.2 Pin Count: 100



Wafer Fab Site: HOU Bond Wire: AU T1-24.3UM

Fab Process: EPIC.70 Leadframe Material: Copper


Moisture Sensitivity Level: L17/28/2004 6:03 PM/260C


Reliability Test Results for TMS320F206PZ

Sample Size/Results






ESD CDM:750V 5/0 5/0 5/0



IEC 695-2-2 5/0 5/0 5/0


Preconditioning Information:** Preconditioning sequence: JEDEC Level 1/260C.


Note: Devices with a die area to package area ratio greater than 0.17 will be de-rated to MSL2 @260C

F741719A Attributes


Qualification Device: F741719APDV-A Assembly Site: PHILIPPINES

Die Name: C741719DINH Package: PDV

Die Revision: D Pin Count: 128

Die Size (mils): 142x142 Mold Compound: CEL9200HF13


Wafer Fab Site: DM5 Bond Wire: 24.3 UM (0.95MILS)





Reliability Test Results for F741719APDV

Sample Size/Results






ESD CDM:750V 5/0 5/0 5/0



IEC 695-2-2 5/0 5/0 5/0



F741598 Attributes


Qualification Device: F741598PEF Assembly Site: PHILIPPINES

Die Name: E741598IN Package: PEF

Die Revision: - Pin Count: 256

Die Size (mils): 461 x 458 Mold Compound: CEL9200HF13


Wafer Fab Site: DM4 Bond Wire: 24.3 UM






Reliability Test Results for F741598PEF

Sample Size/Results






ESD CDM:750V 5/0 5/0 5/0



IEC 695-2-2 5/0 5/0 5/0



TMS471R1F138 Attributes


Qualification Device: S471AF138PZQR Assembly Site: PHILIPPINES

Die Name: C721930E Package: PZ

Die Revision: E Pin Count: 100

Die Size (mils): 288x309 Mold Compound: CEL 9200HF13

Transistor Count: Mount Compound:

HIT EN-4085S2K3

Wafer Fab Site: ANA Bond Wire: TS-0.96mils Au

Fab Process: EPIC.40 Leadframe Material:

Copper

Leadframe Finish:

NiPdAu

Moisture

Sensitivity Level: L3/260C

Flammability Rating:

Class UL94-V0


Reliability Test Results for TMS471R1F138

Sample Size/Results


**Life Test, 125C 1000 Hours 40/0 40/0 40/0

**THB 85C/85%RH 1000 Hours 26/0 26/0 26/0



IEC 695-2-2 5/0 5/0 5/0



For questions regarding this notice, e-mails can be sent to the regional contacts shown below or your local Field Sales Representative.

Location E-Mail

USA [email protected]

Europe [email protected]

Asia Pacific [email protected]

Japan [email protected]





12500 TI Boulevard, MS 8640, Dallas, Texas 75243 · Texas Instruments, Inc. PCN# 20090903001 12500...

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