1/23/2011

Team members:

Duc TranTuan NgoGiang Nguyen

Peter ElabdThien NguyenThe Duong

Advisor: Dr. Mark Weislogel

Capstone 2011

Mobile Environment Chamber -Product Design Specifications

Overview

• Introduction• Project Plan• Product Design Specification• House of Quality• Risk• Conclusion

IntroductionCurrent Chamber:

• Lack of mobility• Non-uniform temp

distribution• Expensiveness

Heating and Cooling System

Chamber

PC

Controller

Actuator

Solid State Drives

Facility

Set T

Facility

Facility

Project Plan

ID Task Name Start Finish Duration27/320/2 6/3

1 19d2/4/20111/14/2011PDS

2 7d1/21/20111/14/2011Customer identification & requirements, existing product

3 7d1/28/20111/21/2011PDS criteria, engineering metrics, HoQ

3/4

Feb 2011

6/2 8/5

Mar 2011 Apr 2011

10/4 17/4 24/413/3 22/523/1 1/513/2

Jan 2011 May 2011

16/1 20/3 15/530/1 27/2

6d2/4/20111/30/2011Review, update tasks4

12d2/13/20111/31/2011External search5

7

14d2/17/20112/2/2011Internal search

14d2/28/20112/13/2011Concept evaluation & selection

6d2/18/20112/13/2011Review ideas8

9 9d2/28/20112/18/2011Finalize concept

6

Main task Sub task

12

11

10 18d4/15/20113/27/2011Detailed design

20d5/1/20114/8/2011Manufacturing, Prototyping

18d5/22/20115/2/2011Testing, optimization, review

Legend:

Product Design SpecificationCriteria Priority

Performance 1

Environment 1

Safety 1Cost 1

Mobility 1

Timelines 1

Ergonomics 2

Testing 2

Quantity 2

Maintenance 2

Materials 2

Quality and Reliability 3

Regulatory 3

Documentation (processes) 3

Company constraints and procedures 3

Legend High priority Medium priority Low priority

Product Design Specification

Mechanical AspectMobility• 19- inch rack form factor• Density: 75 lb./sq. ft. or less• Capacity: 4-12 Devices Under Test

(DUT)

Performance• Temperature range: -5 oC to 105 oC with ± 2 oC accuracy• Temperature uniformity: ±4oC throughout the chamber• Temperature transient:10 oC /minute • Airflow: 0.5 to 5 m/s across DUTs

Product Design Specifications

Input Power• Voltage : 120 - 240 VAC• Frequency: 50 Hz / 60 Hz• Real time communication with PC: read/write

current set-point temp and actual temp• Over-limit protection: An alarm activates when

thermal over-limit condition detected or EMO is pushed

FeaturesElectrical Aspect

Product Design SpecificationsOthers

Cost• 150 – 450 USD/DUT slot

Safety

• Comply with Semiconductor Equipment and Materials International (SEMI)

House of Quality

Risk Management

• Team Communication and Alignment

• Supplier Issues and Availability of Parts

• Project Exceed Budget

Conclusion

• All criteria are well defined

• The team is ready for the next phase!!!

• An agreement between design team and customers is specified

Q&A

Back up

http://flexstar.com/environmentchamber.php

Intel requirements + SEMI links