1200V SiC Mosfets vs Si IGBT - OIC 기술 시장 자료...REVERSE COSTING® –STRUCTURE, PROCESS &...
Transcript of 1200V SiC Mosfets vs Si IGBT - OIC 기술 시장 자료...REVERSE COSTING® –STRUCTURE, PROCESS &...
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 1
22 Bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
1200V Si IGBT vs SiC MosfetsTechnology & Cost Comparison 2018POWER report by Elena BARBARINI September 2018 – sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Technology & Market 8
Company profile 41
o Infineono STMicroelectronicso Fujio ONSemiconductorso Mitsubishio Rohmo Wolfspeedo Littelfuse
Physical Analysis 59
o 1200V Si IGBT Infineon
IHW40N120R3 IGC99T120T8RL AUIRG4PH50S IRG7PH46UD-EP
STMicroelectronics STP16N65M5 STGWA40S120DF3
Fuji FGW40N120HD
Littelfuse (IXYS) IXGP30N120B3 IXGK120N120A3 IXDN75N120
Mitsubishi CM450DY-24S
ONSemiconductors FGH40N120ANTU NGTB25N120FL2WAG
o 1200V SiC MOSFET Wolfspeed
CMF20120 C2M0080120D C2M0025120D
Rohm SCH2080KE BSM180D12P3C007
STMicroelectronics SCT30N120
Littelfuse LSIC1MO120E0080
Infineon DF11MR12W1M1_B11
Transistor Manufacturing Process 166
Cost & Price Analysis 181
o Summary of the cost analysiso Yields Explanation & Hypotheseso 1200V Si IGBT
Infineon STMicroelectronics Fuji Littelfuse ONSemiconductors Mitsubishi
o 1200V SiC MOSFET Rohm Wolfspeed STMicroelectronics Littelfuse Infineon
Feedback 227
System Plus Consulting services 229
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 3
Overview / Introduction
Technology & Marketo Si IGBTo SiC MOSFET
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost & Price Analysis
Related Reports
About System Plus
Si and SiC Cohabitation
Subject of the report
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 4
Overview / Introduction
Technology & Marketo Si IGBTo SiC MOSFET
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost & Price Analysis
Related Reports
About System Plus
1200V Analyzed Devices
Manufacturer IGBT Year TechnoCurrent @
100°CDie area
mm²Current density
A/mm²Vce sat
Infineon IHW40N120R3 2012 FS trench 40 xxx xxx 1.55
Infineon IGC99T120T8RL 2013 FS trench 100 xxx xxx 1.75
Infineon AUIRG4PH50S 2015 planar 81 xxx xxx 1.47
Infineon IRG7PH46UD-EP 2013 FS trench 57 xxx xxx 1.7
STMicro STGW40H120DF2 2012 FS trench 40 xxx xxx 2.1
STMicro STGWA40S120DF3 2014 FS trench 40 xxx xxx 1.65
Fuji FGW40N120HD 2008 FS trench 40 xxx xxx 1.8
Littelfuse IXGP30N120B3 2004 PT planar 30 xxx xxx 2.96
Littelfuse IXGK120N120A3 2009 PT planar 120 xxx xxx 1.85
Littelfuse IXDN75N120 2000 NPT 95 xxx xxx 2.2
Mitsubishi CM450DY-24S 2015 CSTBT 137 xxx xxx 1.8
ON Semi FGH40N120ANTU 2006 NPT 40 xxx xxx 2.6
ON Semi NGTB25N120FL2WAG 2016 FS trench 25 xxx xxx 2
Manufacturer SiC MOSFET Year Techno Id (A) @ 100°C Die area Current density Rdson
Wolfspeed/Cree CMF20120 2011 Gen 1 planar 24 xxx xxx 0.08 ohm
Wolfspeed C2M0080120D 2015 Gen 2 planar 24 xxx xxx 0.08 ohm
Rohm SCH2080KE 2012 Gen 2 planar 28 xxx xxx 0.08 ohm
Rohm BSM180D12P3C007 2016 Gen 3 trench 36 xxx xxx 0.03 ohm
ST Microelectronics STC30N120 2012 Gen 1 planar 34 xxx xxx 0.09 ohm
Littelfuse LSIC1MO120E0080 2017 Gen 1 planar 25 xxx xxx 0.08 ohm
Infineon DF11MR12W1M1 2016 Gen 1 trench 50 xxx xxx 0.023 ohm
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 5
Overview / Introduction
Technology & Marketo Si IGBTo SiC MOSFET
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost & Price Analysis
Related Reports
About System Plus
Identified SiC Discrete Transistors
Values based on Datasheet
0
200
400
600
800
1000
1200
0 200 400 600 800 1000 1200 1400 1600 1800
Cu
rren
t (A
)
Voltage (V)
SiC Discrete Transistors Benchmark
Rohm
Wolfspeed
STMicro
Littelfuse
GeneSic
USCi
Availables products
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 6
Overview / Introduction
Technology & Market
Company Profile & Supply Chain
Physical Analysis o 1200V Si IGBTo Infineono STMicroelectronicso FUJIo Littelfuseo Mitsubishio ON Semiconductors
o SiC MOSFETo Wolfspeedo Rohmo ST Microelectronicso Littelfuseo Infineon
Manufacturing Process Flow
Cost & Price Analysis
Related Reports
About System Plus
IHW40N120R3
• The package type is a TO247
• Package size : 15.7mm x 20.8mm x 4.83mm
• Pin pitch : 5.44mm
• The package markings include the following markings :
H40R1203
HAE530
The component is composed by a monolithic IGBT
Package opening
Package overview
Gate
(G)
Collector
Emitter
(E)
Gate
(G)
Emitter
(E)Collector
Reference of component
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 7
Overview / Introduction
Technology & Market
Company Profile & Supply Chain
Physical Analysis o 1200V Si IGBTo Infineono STMicroelectronicso FUJIo Littelfuseo Mitsubishio ON Semiconductors
o SiC MOSFETo Wolfspeedo Rohmo ST Microelectronicso Littelfuseo Infineon
Manufacturing Process Flow
Cost & Price Analysis
Related Reports
About System Plus
IHW40N120R3
Die cross section
Die cross section
• Trench depth: xxx µm
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 8
Overview / Introduction
Technology & Market
Company Profile & Supply Chain
Physical Analysis o 1200V Si IGBTo Infineono STMicroelectronicso FUJIo Littelfuseo Mitsubishio ON Semiconductors
o SiC MOSFETo Wolfspeedo Rohmo ST Microelectronicso Littelfuseo Infineon
Manufacturing Process Flow
Cost & Price Analysis
Related Reports
About System Plus
Die cross section
Die cross section
Die thickness
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 9
Overview / Introduction
Technology & Market
Company Profile & Supply Chain
Physical Analysis o 1200V Si IGBTo Infineono STMicroelectronicso FUJIo Littelfuseo Mitsubishio ON Semiconductors
o SiC MOSFETo Wolfspeedo Rohmo ST Microelectronicso Littelfuseo Infineon
Manufacturing Process Flow
Cost & Price Analysis
Related Reports
About System Plus
Die transistor
Die cross section
Die cross section
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 10
Overview / Introduction
Technology & Market
Company Profile & Supply Chain
Physical Analysis o 1200V Si IGBTo Infineono STMicroelectronicso FUJIo Littelfuseo Mitsubishio ON Semiconductors
o SiC MOSFETo Wolfspeedo Rohmo ST Microelectronicso Littelfuseo Infineon
Manufacturing Process Flow
Cost & Price Analysis
Related Reports
About System Plus
Rohm Analysed Devices
SiC dieVoltage breakdo
wn
Current @ 100°C
Die areaCurrent density
Rdson
SCT2080KE 1200V 28 A xxx mm² xxx A/mm² xxx ohm
BSM180D12P3C007 1200 V 36 A xxx mm² xxx A/mm² -
1200V 40A Planar Mosfet1200V 36A Trench Mosfet
MOSFETVoltage
breakdownCurrent at 100°C
Die area Epitaxy depthPitch
WidthWaferCost
Die costAmpere cost (silicon
level)
SCT2080KE 1200V 28 A xxx mm² xxx µm xxx µm $ xxx $ xxx $xxx
BSM180D12P3C007 1200 V 36 A xxx mm² xxx µm xxx µm $ xxx $ xxx $ xxx
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 11
Overview / Introduction
Technology & Market
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost & Price Analysiso 1200V Si IGBTo Infineono STMicroelectronicso FUJIo Littelfuseo Mitsubishio ON Semiconductors
o SiC MOSFETo Wolfspeedo Rohmo ST Microelectronicso Littelfuseo Infineon
Related Reports
About System Plus
Si IGBT Front-End Cost
The front-end cost ranges from $xxxx to $xxx accordingto years.
The main part of the wafer cost in 2018 is due to the xxxx(xxx%).
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 12
Overview / Introduction
Technology & Market
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost & Price Analysiso 1200V Si IGBTo Infineono STMicroelectronicso FUJIo Littelfuseo Mitsubishio ON Semiconductors
o SiC MOSFETo Wolfspeedo Rohmo ST Microelectronicso Littelfuseo Infineon
Related Reports
About System Plus
SiC MOSFET Die Cost
The MOSFET die cost ranges from $xxxx to $xxxxaccording to years.
The Front-end manufacturing represents xxxx of thecomponent cost in 2018.
Probe test, dicing and scrap account for xxxx of thecomponent cost.
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 13
Overview / Introduction
Technology & Market
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost & Price Analysis
Related Reports
About System Plus
Estimated Manufacturer Price
The module manufacturing cost ranges from$xxx to $xxx according to years.
By taking into account a gross margin of 39%for ST (2017 results), the modulemanufacturer price is estimated to range from$xxxx to $xxxxx according to years.
Gross Margin 39.0%
STMicroelectronics
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 14
Overview / Introduction
Technology & Market
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost & Price Analysiso 1200V Si IGBTo Infineono STMicroelectronicso FUJIo Littelfuseo Mitsubishio ON Semiconductors
o SiC MOSFETo Wolfspeedo Rohmo ST Microelectronicso Littelfuseo Infineon
Related Reports
About System Plus
Comparison between ST, Cree and Rohm 1200V SiC MOSFET
C2M0040120DSCT30N120
MOSFETVoltage
breakdownCurrent at 25°C
Wafer size Die area PitchCurrent density
A/mm²Rdson Qg
FOM ohm*nC
LSIC1MO120E0080 1200V 39A xxxmm xxx mm² xx µm xxx 0.08 xxnC xxx
C2M0080120D 1200V 36A xxxmm xxx mm² xxx µm xxx 0.04 xxnC xxx
SCT30N120 1200V 45A xxxmm xxx mm² xxx µm xxx 0.09 xxnC xxx
LSIC1MO120E0080
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 15
Overview / Introduction
Technology & Market
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost & Price Analysis
Related Report
About System Plus
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
POWER ELECTRONICS • Status of the Power Electronics Industry 2018• Power SiC 2018: Materials, Devices and Applications• Power Module Packaging 2018: Material Market and Technology
Trends• IGBT Market and Technology Trends 2017
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
POWER ELECTRONICS• Rohm SiC MOSFET Gen3 Trench Design Family• Infineon FS820R08A6P2B HybridPACK Drive IGBT Module• STMicroelectronics 1200V SiC MOSFET STC30N120
Silicon (Si)-based IGBTs have been on the
market for more than 30 years. The
technology has quickly evolved, reducing
the costs and improving performance at
the same time. As Si devices approach
their physical limits, wide-band-gap
devices, in particular made from silicon
carbide (SiC), have emerged on the
market, offering better performance
thanks to their intrinsic properties.
SiC MOSFETs and Si IGBTs are in
competition in various applications in the
1200V range. As of 2018, the SiC MOSFET
market is still small compared to that for
Si IGBTs due to lack of maturity and high
cost. However, market acceptance is
increasing as the technology improves,
costs fall and more device manufacturers
enter the market.
In this report, System Plus Consulting
presents an overview of the state of the
art of 1200V Si IGBTs and SiC MOSFETs.
We highlight the differences in design and
manufacturing processes, and their
impact on device size and production cost.
We have analysed different Si and SiC
devices from Infineon, STMicro-
electronics, Fuji, ON Semiconductor,
Mitsubishi, Rohm, Wolfspeed and
Littelfuse. The report includes detailed
optical and Scanning Electron Microscope
pictures of the transistor design, cross
sections and epitaxy.
This report provides design information,
an estimated production cost for every
transistor and compares the different
components available on the market.
COMPLETE TEARDOWN WITH
• Detailed photos and identification
• Scanning electron microscope and energy-dispersive X-Ray analyses of transistor structures
• Scanning electron microscopy analysis of epitaxy layers
• Manufacturing process flow
• In-depth economic analysis
• Manufacturing cost breakdown
• Estimated sales price
• Comparison between 20 different devices
Technology and cost analysis of thirteen silicon IGBTs and eight SiC MOSFETsfrom eight different manufacturers shows their potential.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: 1200V Si IGBT vs SiC MOSFET Comparison 2018
Pages: 225
Date: September 2018
Format: PDF & Excel file
Price: EUR 4,990
1200V Silicon IGBT vs SiC MOSFET Comparison 2018
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
• Executive Summary
• Reverse Costing Methodology
Technology and Market
Company Profile
Physical Analysis
• 1200V Si IGBT
Infineon
o IHW40N120R3, IGC99T120T8RL, AUIRG4PH50S, IRG7PH46UD-EP
STMicroelectronics
o STP16N65M5, STGWA40S120DF3
Fuji
o FGW40N120HD
Littlefuse
o IXGP30N120B3, IXGK120N120A3, IXDN75N120
Mitsubishi
o CM450DY-24S
AUTHORS
ONSemiconductors
o FGH40N120ANTU, NGTB25N120FL2WAG
• 1200V SiC MOSFET
Wolfspeed
o CMF20120, C2M0080120D, C2M0025120D
Rohm
o SCH2080KE, BSM180D12P3C007
STMicroelectronics
o SCT30N120
Littlefuse
o LSIC1MO120E0080
Infineon
o DF11MR12W1M1_B11
Transistor Manufacturing Process
Cost and Price Analysis
• Summary of the Cost Analys
• Yields Explanation and Hypotheses
• 1200V Si IGBT
• 1200V SiC MOSFET
System Plus Consulting Services
1200V SILICON IGBT VS SIC MOSFET COMPARISON 2018
RELATED REPORTS
STMicroelectronics 1200V SiCMOSFET STC30N120The 1st generation 1200V SiCMOSFET device from STMicro-electronics has good current density at a very competitive cost.January 2017 - EUR 3,290*
Rohm SiCMOSFET Gen3 Trench Design FamilyTrench technology in Rohm 650V and 1200V SiC MOSFETs.August 2018 - EUR 3,490*
Infineon FS820R08A6P2B HybridPACKDrive IGBT ModuleThe newest HybridPACK Drive power module from Infineon with EDT2 IGBT technology.June 2017 - EUR 3,490*
Elena holds a Master in Nano-technologies and aPhD in Power Electronics.
Elena Barbarini is in charge ofcosting analyses for MEMS, ICand Power Semiconductors.She has a deep knowledge ofElectronics R&D and Manu-facturing environment.
Véronique Le Troadec hasjoined System Plus Consultingas a laboratory engineer.Coming from Atmel Nantes,she has extensive knowledge infailure analysis of components
and in deprocessing of integrated circuits.
COSTING TOOLS
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Process-BasedCosting Tools
ParametricCosting Tools
WHAT IS A REVERSE COSTING®?
Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.
IC Price+
MEMS CoSim+
MEMS Price+
Power CoSim+
Power Price+
LED CoSim+
3D PackageCoSim+
DisplayPrice+
PCBPrice+
SYSCost+
CONTACTS
Headquarters22, bd Benoni GoullinNantes Biotech44200 NantesFrance+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGermany+49 151 23 54 41 [email protected]
America Sales OfficeSteve LAFERRIEREWestern USA+1 [email protected]
Troy BLANCHETTEEastern USA+1 [email protected]
Asia Sales OfficeTakashi ONOZAWAJapan & Rest of Asia+81 3 4405 [email protected]
Mavis WANGGreater China+886 979 336 [email protected]
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting is specialized
in the cost analysis of electronics
from semiconductor devices to
electronic systems.
A complete range of services and
costing tools to provide in-depth
production cost studies and to
estimate the objective selling price of
a product is available.
Our services:
• STRUCTURE & PROCESS
ANALYSES
• CUSTOM ANALYSES
• COSTING SERVICES
• COSTING TOOLS
• TRAININGS
www.systemplus.fr
Our analysis is performed with our costing tool Power CoSim+.
System Plus Consulting offers powerful costing tools to evaluate the production cost and selling price from
single chip to complex structures.
Power CoSim+
Process based costing tool used to evaluate the manufacturing cost per wafer using your own inputs or usingthe predefined parameters included in the tool.
ORDER FORMPlease process my order for “1200V Silicon IGBT vs SiC MOSFET Comparison 2018” Reverse Costing® – Structure, Process & Cost Report Ref: SP18388
Full Structure, Process & Cost Report : EUR 4,990* Annual Subscription offers possible from 3 reports, including this
report as the first of the year. Contact us for more information.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT1200V SILICON IGBT VS SIC MOSFET COMPARISON 2018
Each year System Plus Consultingreleases a comprehensive collectionof new reverse engineering andcosting analyses in various domains.You can choose to buy over 12months a set of 3, 4, 5, 7, 10 or 15Reverse Costing® reports.
Up to 47% discount!
More than 60 reports released eachyear on the following topics(considered for 2018):• MEMS & Sensors: Accelerometer
– Environment - Fingerprint - Gas - Gyroscope - IMU/Combo -Microphone - Optics - Oscillator -Pressure
• Power: GaN - IGBT - MOSFET - Si Diode - SiC
• Imaging: Camera - Spectrometer• LED and Laser: UV LED – VCSEL -
White/blue LED• Packaging: 3D Packaging -
Embedded - SIP - WLP• Integrated Circuits: IPD –
Memories – PMIC - SoC• RF: FEM - Duplexer• Systems: Automotive - Consumer
- Energy - Telecom
ANNUAL SUBSCRIPTIONS
Return order by: FAX: +33 (0)472 83 01 83MAIL: YOLE DEVELOPPEMENT
75 Cours Emile Zola69100 Villeurbanne – France
*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format*For French customer, add 20 % for VAT*Our prices are subject to change. Please check our new releases and price changes on www.i-micronews.com. The present document is valid 6 months after its publishing date: September 2018
SHIP TO
Name (Mr/Ms/Dr/Pr): .............................................................
Job Title: …….............................................................................
Company: ….............................................................................
Address: …….............................................................................
City: ………………………………… State: ..........................................
Postcode/Zip: ..........................................................................
Country: ……............................................................................
VAT ID Number for EU members: ..........................................
Tel: ……………….........................................................................
Email: .....................................................................................
Date: ......................................................................................Signature: ..............................................................................
BILLING CONTACT
First Name : ............................................................................
Last Name: …….......................................................................
Email: …..................................................................................
Phone: ……..............................................................................
PAYMENT
By credit card:
Number: |__|__|__|__| |__|__|__|__| |__|__|__|__|
|__|__|__|__|
Expiration date: |__|__|/|__|__|
Card Verification Value: |__|__|__|
By bank transfer:HSBC, 1 place de la Bourse, F-69002 Lyon, FranceSWIFT or BIC code: CCFRFRPPBank code : 30056 - Branch code : 00170 - Account : 0170200156587 IBAN: FR76 3005 6001 7001 7020 0156 587
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 16
COMPANYSERVICES
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 17
Overview / Introduction
Technology & Market
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost & Price Analysis
Related Reports
About System Pluso Company serviceso Contact
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
©2018 by System Plus Consulting | 1200V Silicon IGBT vs SiC MOSFET Comparison 2018 18
Overview / Introduction
Technology & Market
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost & Price Analysis
Related Reports
About System Pluso Company serviceso Contact
Contact
Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]
America Sales OfficeSteve LAFERRIEREPhoenix, AZWESTERN UST : +1 310 600 [email protected]
Troy BlanchetteEASTERN UST : +1 704 859 [email protected]
www.systemplus.fr
Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]
Mavis WANGTAIWANT :+886 979 336 [email protected]
NANTESHeadquarter
FRANKFURT/MAINEurope Sales Office
LYONYOLE HQ
TOKYOYOLE KK
GREATER CHINAYOLE
PHOENIXYOLE Inc.
KOREAYOLE