11 To: Mouser Electronics · 85℃, 85%RH, Maximum voltage 135 1,000 H 0 Pass High Temp storage ......

Microdevices Operations Division http://www.epson.com

11th October, 2013

To: Mouser Electronics

Change Notice on Package Products

First of all we would like to take this opportunity to thank you for the excellent business

relationship between the two companies and we look forward to a successful on-going partnership

in future.

In this letter, we would like to inform Engineering change of small type QFP (Quad Flat

Package) products which are assembled at one of our subcontractors.

1. Description of Change

- Lead-frame, Mold compound material, Chip thickness

Please refer to attached sheets for detail.

2. Reason of Change

- Because of discontinuation of relevant lead-frame, our subcontractor needs to change lead

-frame supplier. In this opportunity, they proposed to apply standard condition to those

package products.

- We verified that their plan could achieve same quality level as for current parts.

3. Objective Products

Epson P/N: Please see attached list

Applicable packages are as follows;

P-LQFP048-0707-0.50 (QFP12-48Pin) P-TQFP048-0707-0.50 (TQFP12-48Pin)

P-LQFP100-1414-0.50 (QFP15-100Pin) P-TQFP100-1414-0.50 (TQFP15-100Pin)

P-LQFP128-1414-0.40 (QFP15-128Pin) *( ) Epson Package name

4. Implementation Schedule

- To start EC parts shipments in May 2014

- Depending on your order quantity and our inventory status, the concrete schedule will be

determined. It will be available at your sales contact.

5. Requests

In order to secure current lead-frame, please inform us your ordering plan through Apr.2014

by 24th Oct.2013.

If you have any questions or concerns, please also let us know by 24th Oct.2013.

Your understanding and cooperation will be highly appreciated.

Sincerely yours,

Tomomasa Sakashita

General Manager of IC sales department

Micro Devices Operations Division

SEIKO EPSON CORP.

Microdevices Operations Division http://www.epson.com

0106-0005-01(Rev.1.1)

Epson P/N PKG TYPE

S1D13503F01A200 P-LQFP100-1414-0.50 (QFP15-100Pin)



S1R72U06F12E100 P-LQFP048-0707-0.50 (QFP12-48Pin)

*( ) Epson Package name

Microdevices Operations Div. 15-1-2_E

Package Product

Production Condition Change

JEITA Package Name :P-LQFP128-1414-0.40

(Epson Package Name :QFP15-128)

Seiko Epson Corp.

Microdevices Operations Division

Page.2 Microdevices Operations Div. 15-1-2_E

Change Contents and Background

<Change contents>

Lead-frame, Mold compound material, IC chip thickness

<Background>

We have subcontracted assembly process of some products since 2003.

While the subcontractor has proceeded engineering changes, it had been

agreed that the changes would not applied to our existing products, but only

to new products, in consideration of long term relation ship.

However, it becomes unavoidable this time, because discontinuation of

relevant lead-frame was decided.

Through several discussion with subcontractor, we determined to accept their

proposal to apply their standard condition, in order to maintain stable supply

of applicable package products for long term.


Description of Change

Current New Changing

point Reason

Lead-

frame Cu frame Cu frame

Maker

Discontinuation at current

supplier

Mold

compound

material

CEL9000series UL Flammability;

UL-94 V-0

Halogen free

EME-G600series UL Flammability:

UL-94 V-0

Halogen free

Maker/

Low

material

Apply standard mold

compound material and

process condition for new lead-

frame

IC chip

thickness 400μm 300μm

Thickness

Take standard thickness and


frame at subcontractor


Changing point /Anxious point Verification Results

Changing

point Anxious point Verification item Results Data

Lead-

frame Maker

Dimensions/Tolera

nce Dimensions data OK Page5,6

Lead strength Lead strength

test OK Page8

Solderability Solderbility test OK Page8

Mold

compound

material

Maker/

Low

material

Reliability Reliability test

OK

Page8

IC chip

thickness Thickness

IC Chip damage

due to stress from

IR reflow and field

condition

Analysis after

soldering heat-

resistance and

Temperature

cycle test

OK

Page9


Comparison of each dimension before/ after the change

Package length, width：D, E

Overall length, width

：HD, HE

Co planarity：y

Seated height：AMAX

Stand-off height：A1

Package height：A2

Terminal pitch：e

Terminal width：b

Terminal thickness：c

Length of flat part

of terminal：L

Terminal length：L1

Angle of terminal

flat portions：θ

Measurement Result of External Dimension


Item / Spec. Current New

Average Cpk Average Cpk

E 7±0.1 6.988 7.67 6.988 8.10

D 7±0.1 6.990 6.21 6.997 8.25

HE 9±0.4 9.003 14.12 9.004 12.14

HD 9±0.4 9.004 11.75 9.001 16.52

AMAX Max 1.7 1.520 8.05 1.557 9.91

A1 0.1 -0.08/+0.1 0.121 6.84 0.120 5.17

A2 1.4±0.1 1.406 5.73 1.405 7.88

e 0.5±0.08 0.502 9.77 0.501 18.82

b 0.13～0.27 0.224 4.09 0.226 4.63

c 0.09～0.2 0.160 3.51 0.162 2.34

θ 0～10° 3.6° 3.81 3.8° 5.60

L 0.3～0.7 0.554 8.20 0.552 6.63

L1 1±0.3 1.010 13.07 0.997 21.11

y Max 0.08 0.017 6.56 0.014 9.47

Unit（mm）

Judged no problem, because measurement data of each dimension shows over Cpk1.67.



Comparison of Appearance

Though external appearance is different at Index mark ( ),

there are no change of external dimension and its tolerance.

Appearance of current part and EC part is as follows;

Current New


We judged that the Engineering change makes no problem, based on the test result performed in same condition as for current parts.

Reliability Test Results of EC parts

Test Items Test condition n Terms of Test Failure

count

Judgment

High Temp Bias Test 125℃, Maximum voltage 135 1,000 H 0 Pass

High Temp and

High Humidity Bias Test

85℃, 85%RH, Maximum voltage 135 1,000 H 0 Pass

High Temp storage

Test

Ta=150℃ 45 1,000 H 0 Pass

Temp cycle Test -65℃～150℃ each 10 minute 45 200 cyc. 0 Pass

Pressure cooker

Test

Ta=121℃, 100%RH 2.0E5 Pa 45 200 H 0 Pass

Reflow Test Moisture treatment Reflow 45 3 Times 0 Pass

lead strength (Pull) 2.5N, 10sec 22 1 Time 0 Pass

Lead strength

(Bending)

90°Bending 22 2 Times 0 Pass

Solderability1 Steam aging 4H→Solder dipping

245℃, 5sec

22 1 Time 0 Pass

Solderability2 150℃,16H →Solder dipping 245℃,

5sec

22 1 Time 0 Pass


Purpose : Check IC chip damage by change of IC chip thickness

Product ：Sampling per each Package type Evaluation condition：Pre-condition(Soldering Heat-resistance)

+Temperature Cycle Test -65℃～150℃ 500cyc. -> Decap Mold compound material ->Dipping in KOH

aqueous solution(10wt%)for 10min.-> Chip visual inspection

Result : No damage remarked on IC after Stress test

<sample photo>

No damage to Passivation

and Al-interconnection

Analysis after Soldering Heat-resistance and Temperature Cycle Test


Summary of Qualification Result

・Lead-frame

Material, External dimension : no change

Terminal strengthen and solderability : equal to current parts

・Mold Compound Material

Heat-resistance, Reliability : equal to current parts

Flammability (UL-94 V-0), Halogen Free compliance : no change

・IC Chip thickness

Change of IC chip thickness makes no damage to IC chip.

・Conclusion

We judged that there should be no concern with new parts, because any

problem was not remarked in our evaluation. We also refer to the fact that

our subcontractor has produced over 1000Mpcs in this condition as their

standard since 2009.

-> You can take the EC parts in your production by current handling

way without any adjustment.


Package Product


JEITA Package Name : P-LQFP100-1414-0.50

(Epson Package Name : QFP15-100)

Seiko Epson Corp.





point Reason

Lead-


Maker


supplier

Mold

compound

material


UL-94 V-0

Halogen free


UL-94 V-0

Halogen free

Maker/

Low

material

Apply standard mold



frame

IC chip


Thickness






Changing


Lead-

frame Maker

Dimensions/Tolera



test OK Page8


Mold

compound

material

Maker/

Low

material


OK

Page8

IC chip

thickness Thickness

IC Chip damage

due to stress from

IR reflow and field

condition

Analysis after

soldering heat-

resistance and

Temperature

cycle test

OK

Page9





：HD, HE

Co planarity：y



Package

height：A2

Terminal pitch：e

Terminal width：b


Length of flat part

of terminal：L


Angle of terminal

flat portions：θ





E 14±0.1 13.972 2.76 13.971 2.74

D 14±0.1 13.976 1.97 13.973 2.69

HE 16±0.4 16.039 5.50 16.028 7.86

HD 16±0.4 16.024 8.51 16.034 7.51

AMAX Max 1.7 1.510 8.29 1.512 12.62

A1 0.1 -0.08/+0.1 0.107 2.40 0.109 4.21

A2 1.4±0.1 1.394 7.19 1.397 5.95

e 0.5±0.08 0.500 6.15 0.500 4.13

b 0.17～0.27 0.210 4.25 0.210 2.67

c 0.09～0.2 0.135 3.23 0.135 3.06

θ 0～10° 3.5° 3.48 3.2° 2.13

L 0.3～0.75 0.473 6.58 0.484 6.03

L1 1±0.3 1.029 7.38 1.035 10.37

y Max 0.08 0.023 4.53 0.025 3.49

Unit（mm）








Current New





count

Judgment


High Temp and



High Temp storage

Test

Ta=150℃ 45 1,000 H 0 Pass


Pressure cooker

Test

Ta=121℃, 100%RH 2.0E5 Pa 45 200 H 0 Pass



Lead strength

(Bending)



245℃, 5sec

22 1 Time 0 Pass


5sec

22 1 Time 0 Pass





aqueous solution(10wt%) for 10min.-> Chip visual inspection


<sample photo>






・Lead-frame








・Conclusion








Package Product


JEITA Package Name :P-LQFP048-0707-0.50

(Epson Package Name : QFP12-48)

Seiko Epson Corp.





point Reason

Lead-


Maker


supplier

Mold

compound

material


UL-94 V-0

Halogen free


UL-94 V-0

Halogen free

Maker/

Low

material

Apply standard mold



frame

IC chip


Thickness






Changing


Lead-

frame Maker

Dimensions/Tolera



test OK Page8


Mold

compound

material

Maker/

Low

material


OK

Page8

IC chip

thickness Thickness

IC Chip damage

due to stress from

IR reflow and field

condition

Analysis after

soldering heat-

resistance and

Temperature

cycle test

OK

Page9





：HD, HE

Co planarity：y



Package height：A2

Terminal pitch：e

Terminal width：b


Length of flat part

of terminal：L


Angle of terminal

flat portions：θ





E 7±0.1 6.988 7.67 6.988 8.10

D 7±0.1 6.990 6.21 6.997 8.25

HE 9±0.4 9.003 14.12 9.004 12.14

HD 9±0.4 9.004 11.75 9.001 16.52

AMAX Max 1.7 1.520 8.05 1.557 9.91

A1 0.1 -0.08/+0.1 0.121 6.84 0.120 5.17

A2 1.4±0.1 1.406 5.73 1.405 7.88

e 0.5±0.08 0.502 9.77 0.501 18.82

b 0.13～0.27 0.224 4.09 0.226 4.63

c 0.09～0.2 0.160 3.51 0.162 2.34

θ 0～10° 3.6° 3.81 3.8° 5.60

L 0.3～0.7 0.554 8.20 0.552 6.63

L1 1±0.3 1.010 13.07 0.997 21.11

y Max 0.08 0.017 6.56 0.014 9.47

Unit（mm）








Current New





count

Judgment


High Temp and



High Temp storage

Test

Ta=150℃ 45 1,000 H 0 Pass


Pressure cooker

Test

Ta=121℃, 100%RH 2.0E5 Pa 45 200 H 0 Pass



Lead strength

(Bending)



245℃, 5sec

22 1 Time 0 Pass


5sec

22 1 Time 0 Pass





aqueous solution（10wt％）for 10min.-> Chip visual inspection


<sample photo>






・Lead-frame








・Conclusion







11 To: Mouser Electronics · 85℃, 85%RH, Maximum voltage 135 1,000 H 0 Pass High Temp storage ......

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Transcript of 11 To: Mouser Electronics · 85℃, 85%RH, Maximum voltage 135 1,000 H 0 Pass High Temp storage ......