Accelerator Based Experiments status report M. Lindgren Fermilab Aspen PAC June 19 -23, 2012
1 W-band Module Production and Other Fermilab Contributions Proposed Significant Partnership in...
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Transcript of 1 W-band Module Production and Other Fermilab Contributions Proposed Significant Partnership in...
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W-band Module Production and Other Fermilab Contributions
Proposed Significant Partnershipin QUIET-II to the Fermilab PAC in November 2009
Modest Fermilab involvementin QUIET-I
Hardware Calibration Tools
3 trips to CIT/JPL to study modules
Shifts in Chile
Hosted a QUIET Collaboration Meeting at Fermilab in June 09
Access to QUIET-I Data Pier Oddone, Fermilab Director
DOE Field Work Proposal In Preparation
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Module bias optimization using Grid
Before
Wire grid
LN2
receiver
AfterKICP Labin Chicago
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Commissioning Detector using Rotating Sparse Wire Grid Polarizer
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The Science Team
Tooling Fabrication: J. Korienek, C. Lindenmeyer,
Mechanical Assembly and Cryogenics: D. Butler, B. Gonzales, T. Hawke, W. Newby, J. Wilson
System Controls: S. Hansen, J. Montes, J. Zimmerman
Electrical Engineering and Testing: D. Kubik
CMB Theory: S. Dodelson, A. Stebbins
RF Technology: D. McGinnis
Detector Fabrication: F. DeJongh, H. Nguyen
The Technical and Engineering Team
Significant Experience
Silicon Tracking Detectors for HEP
Fermi-Glast Satellite Veto Shield
Dark Energy Survey Camera
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Our Proposed Involvement in QUIET Phase II
Assembly of ~1500 W-band Polarization Analyzer Modules
~ 2 year production run
Collaborativeeffort withCaltech and JPL
Precision Placementof 106 components
Components as smallas 200 m x 200 m
Very delicate HEMT components
Precision control of silver epoxy die bonding
Over 200 wirebondsper module
Harsh Cryogenic and Vacuum Environment
Technical Challenges
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Upgrade Machines with powerful Labview and Vision System Software
Meeting the Production Goals
Utilize 4 Coordinate Measurement Machines to Perform Automated Assembly
Strong interests from ATLAS and CMS in using automated assembly tools at Fermilab for the LHC silicon detector upgrades
A natural synergy between QUIET and Fermilab/HEP
Work to be performed at the Fermilab Sidet Facility
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Differences between Phase I and Phase II Assembly and Testing
Phase I Phase II
Module Housing Machining at JPL Module Housing Machining by Vendor using new technique
Die Bonding by NxGen New Die Bonding Technique developed at Fermilab
Manual Conductor Bonding at JPL Automatic Conductor Bonding at Fermilab
- Quality Assurance of Conductor Bonding Mechanical Strength
- Quality Assurance of Epoxy Bonding Mechanical Strength
Comprehensive Testing of ModulePower Draw and RF response -at 20K and Room T Comprehensive Testing of Power Draw at Room T
Comprehensive Testing of RF Response at Room T Comprehensive Thermal Cycling of Modules to 20K Sample Testing of Power Draw at 20K
Sample Testing of RF Response at 20K
Goal: Guarantee quality components and robust procedures in order to reduce need for comprehensive testing.
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Micro Assembly Tools
New Tools for Die Bonding
Automated Wirebonding Machines at Sidet Facility
Will perform R&D of bonding mechanical strength in vacuum and cryogenic environment:
R&D to Guarantee High Assembly Yield
Reduces Need for Extensive Cryogenic Production Testing.
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Quality Assurance is Critical
Epoxy Lap Shear Strength Measurements and Thermal Cycling down to 28 Kelvin
QuickTime™ and aTIFF (Uncompressed) decompressor
are needed to see this picture.
BG2-5
41.180679
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0 0.005 0.01 0.015 0.02 0.025 0.03
Extension (inches)
Load (lbs)
“Instron” Measurement of Die Bonding Adhesionof Epotek H20F Silver Epoxy
Expected breaking point
Manufacturer’s data on cold-temp degradationdoes not exist.
Epotek is interested in our thermal-cycling result !
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Quality Assurance is Critical
Al-Au Wirebond Strength Measurements and Thermal Cycling to 28 Kelvin
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Module Assembly and Receiver Integration Schedule
Q1
Tooling Development
Module Housingand Non-InP
Parts Fabrication
Assembly and Testing
of 1st 500 Modules Assembly and Testing of 2nd 500 Modules
Assembly and Testing of
3rd 500 Modules
Fabrication and Delivery of InP Parts from CIT/JPL
Integration of 1st Receiver and deployment
Fermilab
CIT/JPL
Chicago-Fermilab
Integration of 2nd Receiver
and deployment
Integration of 3rd Receiver
and deployment
KEK/Princeton
Q2 Q3 Q4 2010
Q1 Q2 Q3 Q4 2011
Q1 Q2 Q3 Q4 2012
Q1 Q2 Q3 Q4 2013
Responsibility
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Major Subsystem CostsW-Band Module Production and Testing: Caltech, JPL, Fermilab
Component Delivery Date NSF Cost DOE Cost DOE Contingency. Module Housing/Parts 12-2010 466K - -
Tooling Materials 12-2010 - 138K 28K
Tooling Fabricationand Controls Programming 12-2010 - 104K 31K
Production Labor 12-2010 to 3-2013 - 238K 59K Testing Labor “ - 594K 148K
Total 466K 1074K 266K
W-band Receiver Integration: Chicago, Fermilab
Component Delivery Date NSF Cost DOE Cost DOE Contingency Materials 12-2010 to 4-2012 - 51K 10KTechnician Labor “ - 80K 20K Engineering Labor “ - 94K 24K
Total - 225K 54K
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Summary
Project Construction Tasks
Delivery of 1500 W-band modules in ~2 year production runIntegration and commissioning of 1 Receiver at Fermilab Calibration tools and window engineering analysis
Request to Fermilab/DOE:
Project Cost = $ 1.75M (includes contingency)Operations Cost = $ 224K
Technical and Engineering Labor (no Scientist Labor)Production tooling material costsContribution to Chile site operations costFunds for Travel to Chile for Shifts and Installation
All overheads have been included
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Hogan’s Backup Slides
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