1 Interconnect and Packaging Lecture 3: Skin Effect Chung-Kuan Cheng UC San Diego.
1 Interconnect and Packaging Lecture 7: Distortionless Communication Chung-Kuan Cheng UC San Diego.
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Transcript of 1 Interconnect and Packaging Lecture 7: Distortionless Communication Chung-Kuan Cheng UC San Diego.
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Interconnect and Packaging
Lecture 7: Distortionless Communication
Chung-Kuan ChengUC San Diego
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Distortionless Communication
1. Introduction of distortionless interconnect
2. Architecture of Surfliner
3. Implementation
4. Applications
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I. Interconnect Models
RΔl LΔlCΔl
RΔl LΔl
CΔl …
i(z,t)
RΔl LΔl RΔl LΔl
Voltage drops through serial resistance and inductance
Current reduces through shunt capacitance
Resistance increases due to skin effect
Shunt conductance is caused by loss tangent
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I. Interconnect Models
• Telegrapher’s equation:
),(),(),(
),(),(
),(
tzGVdt
tzdVC
dz
tzdIdt
tzdILtzRI
dz
tzdV
• Propagation Constant:
jCjGLjR ))((
• Wave Propagation:
//,),( 0 tzveVtzV tjzjz
• Characteristic Impedance
)/()( CjGLjRZ
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I. Introduction of Distortionless Interconnect
• Distortion:
Transfer function H(S) != const.
Digital signal contains multiple freqs.
Intersymbol interference
• Usage of limited frequency range
• Pre-emphasis at transmitter HT(S)
Equalization at receiver HR(S)
HT(S)H(S)HR(S) ~= const.
• Surfliner: HSurfliner(S) = const.
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II. Distortion: Frequency Ranges and Equalization
Input Signal Frequency Range Trimming
• Encoding (8B/10B)
• Data Scrambling
• Aliasing
Equalization
HE=a+bZ-1+cZ-2
Z-1 Z-1
a
bc
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II. Equalization
Courtesy of Ed Lee
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III. Distortionless Interconnect
• On-chip Global Interconnect trend
• Concerns: Speed, Power, Cost, Reliability
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40
80
120
160
200
180 150 130 100 90 80 70 65 57 50Process Technology Node (nm)
Dela
y (p
s)
1mm Global I nterconnect with Scattering(source: I TRS Roadmap 2004)
FO4 I nverter Delay (Estimated by0.36*Ldraw)
1mm distortionless Transmission Line (Speedof Light)
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III. Introduction of distortionless interconnect
• Speed-of-the-light on-chip communication• < 1/5 Delay of Traditional Wires
• Low Power Consumption• < 1/5 Power Consumption
• Robust against process variations• Short Latency• Insensitive to Feature Size
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IV. Architecture of Surfliner
RΔl LΔlGΔl CΔl
RΔl LΔl
GΔl CΔl …
i(z,t)
RΔl LΔl RΔl LΔl
Differential Lossy Transmission Line Surfliner
RΔl LΔlCΔl
RΔl LΔl
CΔl …
i(z,t)
RΔl LΔl RΔl LΔl
Current loss through shunt capacitance
Frequency dependent phase velocity (speed) and attenuation
Add shunt conductance to compensate current loss R/G = L/C
Flat from DC Mode to Giga Hz
Telegraph Cable: O. Heaviside in 1887.
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IV. Architecture of Surfliner
• Set R/G=C/L• Frequency Independent speed and attenuation:
LCjCLRCjGLjRj //))((
• Characteristic impedance: (pure resistive)
CLZ /0 • Phase Velocity (Speed of light in the media)
LCv /1• Attenuation:
lZ
R
elA 0)(
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IV. Architecture: Signal Response
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IV. Architecture: Eye Diagram
• Injected 1.0V voltage falls to 365mv over a 2cm wire
120 stage, 2.1ps jitter
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IV. Architecture: Speed, Power, Variations
• Speed of Light: 5ps/mm or 50ps/cm
• Power: 10mW at >GHz
• Conductance variation = 10%, f=10MHz~10GHz• Phase velocity variation < 1%
• Attenuation variation < 5%
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V. Implementation
• Add shunt conductance between differential wires
• Resistors realized by serpentine unsilicided poly, diffusion resistors, or high resistive metal
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V. Implementation• Configuration of wires
• Characteristic Impedance (at 10GHz) : 39.915 Ohm
• Inductance: 0.22nH/mm Capacitance: 141fF/mm
• Attenuation: 253mv magnitude at receiver’s end (assuming 1V at sender’s end)
• Using Microstrip (free space above the wires): impedance can be improved to 52.8Ohm
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V. Simulation
• Agilent ADS Momentum extract 4-port S-parameters
• HSpice: Transient analysis
• Assume 1023 bit pseudo random bit sequence (PRBS)
• 15GHz clock
• 10% of clock period transition slope for each rising and falling edge
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V. Simulation Results
4 Stages 120 Stages
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V. Simulation Results
Jitter and silicon area usage
#Stages 4 10 20 40 80 120 160
Jitter (ps) 27 9.5 5.4 4.2 3.9 2.1 2.08
Area (um2) 0.52 3.25 13.0 52 208 468 832
Power w/ different width and separation
(w, s) (um) (3,3) (4,4) (5,4) (10,5)
Power (mW) 4.98 3.62 3.02 2.13
Attenuation 0.307 0.415 0.496 0.60
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VI. Applications of Surfliner
1.Clock distributions
2. Data communications: Buses Between CPUs, DSPs, Memory Banks
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VI. Application of Surfliner
3. High Performance Low Power Wafer Packaging
IC IC IC
Distortionless On-Wafer Transmission Lines for Data Communication and Clock Distributions
CoupledCapacitors
Differential Driver Sense-amps