1Daniel Dobos University Dortmund 13.08.03Pixel Testbeam July 2003

Daniel DobosUniversity Dortmund

13.08.03 – E4 ATLAS-/Si-Meeting

Pixel Testbeam July 2003

1Daniel Dobos University Dortmund 13.08.03Pixel Testbeam July 2003

Testbeam setup

testbeam setup moved some meters upstream to the NA45 area since may testbeamnew pixel telescope (Genova telescope) inserted for high intensity runs in may testbeam and is now used together with the Bonn Telescope for particle trackingdiode in the Genova Telescope generates additional trigger signal to the scintillator and Bonn Telescope trigger and increases particle scatteringtesting of modules requires cooling them in the testbeam box – testing single chips uncooled at room temperaturenew nitrogen flooded anti frost box prevents condensation on the turning mechanics of the testbeam box

1Daniel Dobos University Dortmund 13.08.03Pixel Testbeam July 2003

new copper plates for modules madeeach module plate is cooled directly with chiller liquid running through a copper tubetried use Lauda RC20 and Julabo FP50 with 2 modules each but Lauda chiller is to weak – FP50 used for all 4 modulesbetter cooling of the nitrogen with conducting it through a first heat exchanger placed directly in the tank of RC20 and through a second heat exchanger in a paper box isolated with polyurethane foam and cooled with the F32 chillernew routing of the nitrogen flow: nitrogen is blown directly to each module and is helping to cool the modulescarbon-carbon plates are glued on the FE's side of each module for better heat conduction with additional use of Dow Corning 340 silicone heat sink compoundmoving of the box and turning of the box can be remote controlled from CRDCS is monitoring the temperatures of the copper plate in two points, the carbon-carbon plate & the module NTC for each module and the air temp. and humidity of the box additionallymodules can be tested at about -6°C, needs improvement to reach ATLAS conditions about -10°C

Cooling of the modules

1Daniel Dobos University Dortmund 13.08.03Pixel Testbeam July 2003

Data flow and power supply

each module is connected with a type0 cable with the PP0 replacement cardsame regulator board used as in Systemtest in Wuppertal in June to power the modules – same problem: VDDA & VDD are oscillating if the cables to the power supplies are to short or the regulator of the power supplies work to fast => high noisefirst used modularity two (one power supply for two regulator channels) but because of the above mentioned problems changed later to modularity onenew PP0 replacement card is used to read out the four modules with a TPCC for each module and can handle up to seven modulesDAQ has to handle now 5 TPLLs (one for each module and one for the Genova Telescope) and the BlueBoard Interface for the Bonn Telescope => problem of scalability, DAQ very unstable since last testbeam: doesn't recognises trigger events, hangs during and during stopping runs, hangs when modules are to noisy, sometimes doesn't read out the Genova Telescope => we're losing much time restarting the DAQ, sometimes after every run => needs improvement DCS is working stable – still some little bugs in the DCS software – no problems with controlling the ISEG since new iseg.dll is useddocumentation is still a problem – more easy problems could be solved by shifters without an expert – but is getting better (DCS and DAQ documentation started) – maybe a website with all important information like schematics of used components and user guides should be set up

1Daniel Dobos University Dortmund 13.08.03Pixel Testbeam July 2003

new testbeam setup in NA45 area

1Daniel Dobos University Dortmund 13.08.03Pixel Testbeam July 2003

modules mounted in the testbeam box

1Daniel Dobos University Dortmund 13.08.03Pixel Testbeam July 2003

PP0 replacement card

1Daniel Dobos University Dortmund 13.08.03Pixel Testbeam July 2003

first week: irradiated modules Ge18 (Tesla) and Bn12 (CiS) at -6/-7°C0 deg: all chips at 600 V, for chip D scan in voltage: 700, 600, 550, 500, 450, 400,

350, 300, 250, 20010 deg: for chips 1, 6, B, C, scan in voltage: 700, 600, 550, 500, 450, 400, 350, 300,

250, 20020 deg: for chips 1, 6, B, C, scan in voltage: 700, 600, 550, 500, 400, 450, 350, 300,

250, 20030 deg: for chip 1 scan in voltage: 700, 600, 550, 500, 400, 350, 300, 250, 200

for chips 6, B, scan in voltage: 600, 550, 500, 450, 400, 350, 300, 250, 200for chip C, scan in voltage: 600, 500, 400, 300Irradiated modules:second week: irradiated modules Bn12, Ge18 and Ge14 at -6/-7°CChip C and chip D: 0 deg: 600 Volt

5 deg: 600 V10 deg: 600 V15 deg: 600 V20 deg: 600 V

30 deg: Voltage scan (300, 400, 500, 600, 700)Corner between 4 chips (C32D): Angular scan and Voltage scanChip 9: 30 deg, Voltage scanSingle chips: FEI2_SCC5, FEI2_SCC2, FEI2_IZM_2D at room temperature

angular scan with beam centered on each chip (0 deg, 10 deg, 20 deg, 30 deg)

high event run 700k at 0 deg for time walk

measurements taken

1Daniel Dobos University Dortmund 13.08.03Pixel Testbeam July 2003

to be analysed...