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» Computer-on-Modules 2012 «

» ARM Computer-on-Modules «

Ultra-low Power Computer-on-Modules (82 x 50 mm)

ULP-COM-sA3874i ULP-COM-sAMX6i ULP-COM-sAT30

Processor TI Sitara AM3874, Single core Cortex A8, Up to 1.0 GHz

Freescale i.MX 6 Solo, Dual and Quad Core ARM Cortex-A9, Up to 1.2GHz

NVIDIA® Tegra 3 (Kel-Al), Quad Core™ ARM Cortex A9 1.2 GHz

Memory DDR3 memory, 1 GB, down DDR3 up to 2 GB, memory down DDR3, 1 or 2 GB, down

Flash Up to 32GB NAND (optionally) Up to 64GB NAND/eMMC (optionally) Up to 64 GB NAND/eMMC (optionally)

Ethernet 10/100/1000 Gbit 10/100/1000 Mbit/sec 10/100/1000 Mbit/sec

USB 2x USB 2.0 (one OTG) 3x USB 2.0 port (one OTG) 3x USB 2.0 port (one OTG)

Display Parallel LCD 18/24bit LVDS Single Channel HDMI

Parallel LCD 18/24 bit LVDS Single Channel 18/24bit HDMI

Parallel LCD 18 / 24 bit LVDS Single Channel 18 bit / 24 bit - 18 bit compatible Support for dual channel 24 bit LVDS (Carrier board xmitter) HDMI

Graphics 3D graphics acceleration HD video processing

Dual Display HD 1080p encode and decode 2D and 3D acceleration

Dual Displays HD Video Decode, including MPEG2 HD Video Encode 2D and 3D acceleration GPU ULP GeForce / 12 cores

Additional Interface 1x PCIe; I2C; I2S; 4x UART; 2x CAN; GPIO Battery and System Management; SATA

Up to 3 PCIe x1, MLB150, 12xGPIOs, SDIO, SATA eMMC, 2x SPI, 5x I2C, 2x I2S, SPDIF, WDT, 2x CAN, Battery and System Management

PCIe Gen 1 x1 lane width, 2 links plus support signals SATA, SD Card, eMMC, 2x SPI, 5x I2C, 3x I2S, 4x UART, 12x GPIO, SPDIF, WDT, Battery and System Management

Image Capture Interfaces Camera 10bit parallel interface 1x PCAM, 1x CSI 2x Camera Ports CSI-2, dual lane

SW Support Windows WEC7, Android, Linux Windows WEC7, Android, Linux Android ICS, Linux

Power Typ. 2 Watts tbd 5 Watts typical

Thermal Industrial temperature: -40°C to +85°C

Commercial temperature: 0°C to +60°C Industrial temperature: -40°C to 85°C (800 MHz)

Operating temperature: 0°C to 70°C Industrial version planned

Preliminary

Bootloader» Configuration Services» Customer specific bootloader

development and variant handling

OS/Licenses» Evaluation Images» Support for Getting Started» Image Building» Microsoft Embedded Licenses

Board Support Package» For WEC7, Linux, Android available» QNX, VxWorks on request» Customization and Driver Development Services

Support&Services» Getting Started Support» ARM Baseboard & Software Training» Enhanced Software Support» Customization, Software Development and

Migration Services

–40°C to +85°C

» Software & Services for ARM «

kontron.com/mysafechoice

» QorIQ™ Computer-on-Modules «

COM Express® QorIQ™ Computer-on-Modules

COMe-cP2020* COMe-cP5020*

Processor Freescale QorIQ™ P2020 e500 Power Architecture (2x 1.2 GHz commercial temp. / 1.0 GHz industrial temp.)

Freescale QorIQ™ P5020 (P5010) e5500 Power Architecture (2x 2.0 GHz (2x 1.6 GHz))

Cache 32 KB L1 instruction cache and 32 KB L1 data cache for each core; 512 KB L2 cache with ECC.

32 KB L1 instruction cache and 32 KB L1 data cache for each core; 512 KB L2 cache/Core; 2MB L3 cache shared

Memory Up to 4GB DDR3-667 72-bit Up to 8GB DDR3-1333 MHz ECC

Storage/Flash 64kbit I²C EEPROM / up to 2GB NAND Flash + 2MB NOR Flash; 2nd 2MB SPI NOR Flash for boot recovery purposes; 512kB MRAM

64kbit I²C EEPROM / up to 2GB NAND Flash; 2MB NOR Flash; 2nd 2MB SPI NOR Flash for boot recovery purposes; 2x SATA multiplexed with SERDES; 512kB MRAM

Micro SD Card MicroSD card slot / bootable MicroSD card slot/ bootable

USB 4x USB 2.0 5x USB 2.0 (one channel device capable)

PCI Express See SERDES See SERDES

SERDES* Options 4x SERDES up to 3.125 Gbps multiplexed across controllers can be configured as: PCIexpress, sRIO, GbE; Example: 1x PCIe x42x PCIe x1 + 1PCIe x2 2.5 Gbps1x PCIe x2 + 2x 1GbE SGMII2x SRIO x1 2.5Gbps + 2x GbE SGMII2x SRIO x1 3.125 Gbps1x SRIO x4 with 1.25/2.5 or 3.125 Gbps

18x SERDES lanes configurable; pre-selected standard configurations: 2x PCIe x4 + 4x 1 GbE SGMII + 1x SATA2x PCIe x4 + 4x 1 GbE SGMII + 1x XAUI2x PCIe x4 + 1x XAUI + 1x SATA2x sRIO x4 + 4x 1 GbE SGMII + 1x SATA

Serial 2x UART 2x UART (2x FourWire/ 2x TX/RX)

Serial Rapid I/O See SERDES See SERDES

Ethernet 3x 10/100/1000 Base-T 1x 10/100/1000 Base-T

SPI Yes Yes

GPIO 2x GPIO (exclusive with SDHC usage); additional GPIO on project base

12x GPIO

I²C 2x I²C 1x I²C

IEEE 1588 2x IEEE 1588 control IEEE 1588 control

Interface Others 1x SDHC; 1x MDIO (IEEE 802.3 clause 22); 5x IRQ; 1x IRQ OUT; 16 bit eLBC (2 Devices); Processor Local Bus

1x SDHC; 2x MDIO (iEEE 802.3 clause 22 + clause 45) 5x IRQ Interrupts; Processor Local Bus

Other Features Watchdog, JTAG debug, Real time clock; LEDs Watchdog, JTAG debug, Aurora debug; Temperatur Monitor; LEDs

Bootloader U-Boot U-Boot

Operating Systems Linux; Wind River VxWorks 6.9.2 Linux; Wind River VxWorks 6.9.2

Power 12 V +/- 5% (optional RTC supply voltage of 3.3V) 12 V +/- 5% (optional RTC supply voltage of 3.3V)

Power Consumption Est. 12W/12V Est. 30W/12V

Temperature c-version 0°C to +60°C; i-version -40°C to +70°C 0°C to 60°C

Humidity 93% relative Humidity at 40 °C, non-condensing (acc. to IEC 60068-2-78)

93% relative Humidity at 40°C, non-condensing (acc. to IEC 60068-2-78)

Compliance Com Express® compact, 95x95 mm Com Express® basic, 95x125 mm

* Please consult our sales support team for other processor versions and SERDES configurations.

–40°C to +85°C

–40°C to +85°C

COM Express®COM Express® ETX®(114x95mm)

COMe-mSP1(nanoETXexpress-SP)

COMe-mTT10 (nanoETXexpress-TT)

COMe-mCT10 COMe-cSP2 (microETXexpress®-SP)

COMe-cXLi2 (microETXexpress®-XL)

COMe-cPV2 (microETXexpress®-PV)

COMe-cDC2 (microETXexpress®-DC)

COMe-cPC2 (microETXexpress®-PC)

COMe-cOH# (microETXexpress®-OH)

COMe-cTH6 COMe-cCT6 COMe-bPC2 (ETXexpress®-PC)

COMe-bAI# (ETXexpress®-AI)

COMe-bSC# (ETXexpress®-SC)

COMe-bIP# ETX®-DC ETX®-OH

CPU Intel® Atom™ Z510, Z530

Intel® Atom™ E6xx / E6xxT

Intel® Atom™ N2600, N2800, D2700

Intel® Atom™ Z510, Z530

Intel® Atom™ Z520PT

Intel® Atom™ D510, D410, N450, D525

Intel® Atom™ N270

Intel® Core™ 2 Duo SL9400, SU9300, Intel® Celeron® M Processor 722, 723

AMD® G-Series T16R, T44R, T52R, T40N, T56N

AMD® eTrinity R-460L, R-452L, R-260H

Intel® Atom™ N2600, N2800, D2700

Intel® Core™2 Duo SP9300, SL9400, SU9300, T9400, P8400, Celeron® M575

Intel® Core™ i7-610E, i7-620LE, i7-620UE, i5-520E

Intel® Core™ i7-2715QE, i7-2655LE, i7-2610UE, i5-2515E, i3-2310OE, i3-2340UE, Celeron® B810E, 847E

Intel® Core™ i7-3615QE, i7-3612QE, i7-3555LE, i7-3517UE, i5-3610ME, i3-3210ME,i3-3217UE

Intel® Atom™ N270

AMD® G-Series, T16R, T40R, T52R, T40E, T56N

CPU

CPU Clock 1.1 GHz up to 1.6 GHz 0.6 GHz up to 1.6 GHz Up to 2x 2.13 GHz Up to 1.6 GHz 1.33 GHz Up to 2x 1.66 GHz 1.6 GHz Up to 2x 1.86 GHz Up to 2x 1.6 GHz Up to 4x 2.0 GHz Up to 2x 2.13 GHz Up to 2x 2.53 GHz Up to 2x 2.53 GHz Up to 2x 2.5 GHz resp. 4x 2.1 GHz Up to 2x 2.7 GHz resp. 4x 2.3 GHz 1.6 GHz Up to 2x 1.65 GHz CPU Clock

Cache 32 kB Instruction Cache + 24 kB L1/512 kByte L2

32 kB Instruction Cache + 24 kB L1 Cache, 512 kB L2 Cache

32 KB Instructions cache + 24 KB L1 Cache, 1MB L2 Cache

32 kB Instruction Cache + 24 kB L1, up to 512kB L2

512 kB L2 Up to 1 MB L2 512kB L2 Up to 6 MB L2 512 kB L2 tbd 32 KB Instructions cache + 24 KB L1 Cache, 1MB L2 Cache

Up to 6 MB L2 Up to 4 MB L2 Up to 6 MB L2 Cache Up to 6 MB L2 512 kB L2 2x 512 kB L2 Cache

Chipset Intel® SCH US15W Intel® PCH EG20 / EG20T Intel® SCH NM10 Express Intel® SCH US15W Intel® SCH US15WPT Intel® 82801HM Intel® 945GSE, ICH7M

Intel® GS45, ICH9M SFF

AMD® FCH A50M AMD® A70 Intel® SCH NM10 Express Intel® GS45, ICH9M SFF, Intel® GM45, ICH9EM, Intel® GL40, ICH9M

Intel® Mobile Platform Controller Hub QM57

Intel® Mobile Platform Controller Hub QM67 resp. HM65

tbd Intel® 945GSE, ICH7M AMD® FCH A55M Chipset

Bus Speed 400/533 MHZ FSB n/a n/a 400/533 MHz FSB 533 MHz FSB 667/800 MHz 400/533 MHz FSB 800/1066 MHz FSB 800/1066 MHz FSB tbd n/a 800/1066 MHz FSB 800/1066 FSB n/a n/a 400/533 MHz 1066 MHz FSB Bus Speed

Memory Onboard up to 2 GB DDR2 Onboard up to 2 GB DDR2-800 Onboard up to 4 GB DDR3 (800/1066 MHz)

Up to 2 GB DDR2 Onboard up to 2 GB DDR2 (industrial temperature range)

Up to 2x 2 GB DDR2/DDR3 Up to 2 GB DDR2 Up to 4 GB DDR3 Up to 2x 4 GB DDR3 Up to 2x 4 GB DDR3 Up to 4 GB DDR3 Up to 2x 4 GB DDR3, Dual Channel

Up to 2x 4 GB DDR3, Dual Channel with ECC

Up to 2x 8 DDR3, Dual Channel with ECC

Up to 2x 8 GB DDR3, Dual Channel Up to 2 GB DDR2 Up to 4 GB DDR3 Memory

Hard Disk 1x onboard SSD up to 4 GByte, 1 SDIO port (shared with GPIO)

2x SerialATA 300, 1x microSD-Card Slot on GPIO alternatively, 1x SATA 300, 1x SATA E2 SSD up to 8 GB

2x Serial ATA external supporting 3Gb/s alternatively: 1x SATA + 1x SATA onBoard SSD Flash drive up to 8GB SLC / 32GB MLC

2x SerialATA (RAID 0,1), 1x PATA 1x SerialATA, 1x PATA, Optional industrial temperature range SSD onboard

3x SerialATA 2x SerialATA (AHCI), 1x PATA, optional SSD flash onboard

3x SerialATA 2, 1x PATA

4x SerialATA 3 4x SerialATA 600 2x SerialATA 2 4x SerialATA 2, 1x PATA (optional Flash onboard)

4x SerialATA 2 PATA (on Type 2 only)

2x SerialATA 3, 2x SerialATA 2 PATA (on Type 2 only)

2x SerialATA 3, 2x SerialATA 2 PATA (on Type 2 only)

2x SerialATA (AHCI), 2x PATA

2x SerialATA (AHCI), 2x PATA

Hard Disk

USB USB 2.0, 8 ports (1 USB Client)

USB 2.0, 6 ports + USB Client port USB 2.0, 8 ports USB 2.0, 8 ports (1x USB Client) USB 2.0, 8 ports USB 2.0, 8 ports USB 2.0, 8 ports USB 2.0, 8 ports USB 3.0 (type 6 only), 2 ports and USB 2.0, 6 ports

USB 3.0, 4 ports and USB 2.0, 4 ports

USB 2.0, 8 ports USB 2.0, 8 ports USB 2.0, 8 ports Type 2: USB 2.0, up to 8 ports Type 6: USB 3.0, 2 ports and USB 2.0, 6 ports

Type 2: USB 2.0, 8 ports Type 6: USB3.0, 4 ports and USB 2.0, 4 ports

USB 2.0, 4 ports; opt. 6 ports

USB 2.0, 4 ports; opt. 2x miniUSB 2.0

USB

PCI Express 1 PCIe x1 lane (opt. 2 PCIe x1 if no onboard LAN)

3x PCIe x1 lanes 4x PCI Express x1 Lanes, one for LAN onboard

2 PCIe x1, optional up to 5 PCIe x1 2 PCIe x1 lanes 5 PCIe x1 lanes 3 PCIe x1 5 PCIe x1 1 PEG x16

6 PCIe x1 7 PCIe Gen 2.0 x1, 1 PEG x8 4x PCI Express x1 Lanes, one for LAN onboard

5 PCIe x1 1 PEG x16

Type 2: 6 PCIe x1, 1 PEG x16 Type 6: 7 PCIe x1, 1 PEG x16

Type 2: 5 PCIe Gen 2.0 x1, 1 PEG x16; Type 6: 7 PCIe Gen 2.0 x1, 1 PEG x16 (Gen 2.0)

Type 2: 5 PCIe Gen 2.0 x1, 1 PEG x16 Gen 2.0; Type 6: 7 PCIe Gen 2.0 x1, 1 PEG x16 Gen 3.0

– – PCI Express

PCI – – - PCI 2.3, 32 bit/33 MHz PCI 2.3, 32 bit/33 MHz PCI 2.3, 32 bit/33 MHz PCI 2.3, 32 bit/33 MHz PCI 2.3, 32 bit/33 MHz PCI 2.3, 32 bit/33 MHz (Type 2 only) - - PCI 2.3, 32 bit / 33 MHz PCI 2.3, 32 bit/33 MHz (Type 2 only) PCI 2.3, 32 bit/33 MHz (Type 2 only) PCI 2.3, 32 bit/33 MHz (Type 2 only) PCI 2.3, 32 bit/33 MHz PCI 2.3, 32 bit/33 MHz PCI

ISA – – - – – – – – – - - – – – - ISA Bus (ETX® 3.0 compliant) ISA Bus (ETX® 3.0 compliant) ISA

Serial Ports – 2x 2-wire TTL 2x 2-wire TTL optional – – – – – 1x 2-wire TTL 2x 2-wire TTL 2x 2-wire TTL optional – – – - 2x full COM ports TTL 2x full COM ports TTL Serial Ports

Ethernet Intel® 82574L Hartwell, 10/100/1000 MBit

MAC in Chipset integrated, Phy: Broadcom BCM54610, 10/100/1000 MBit

Intel® 82574L (Hartwell) 10/100/1000 Mbit

Intel® 82574L, 10/100/1000 MBit

Intel® 82574 (Industrial Temperature Range), 10/100/1000 MBit

Intel® 82567, 10/100/1000 MBit

Intel® 82574L, 10/100/1000 MBit

Intel® 82567, 10/100/1000 MBit

Intel® 82574L, 10/100/1000 MBit

Intel® WGI210AT, 10/100/1000 MBit

Intel® 82574L (Hartwell) 10/100/1000 Mbit

Intel® 82567, 10/100/1000 MBit

Intel® 82557, 10/100/1000 MBit

Intel® 82579, 10/100/1000 MBit

Intel® 82579, 10/100/1000 MBit

Intel® 82562V, 10/100 MBit

Broadcom BCM54610 10/100 MBit

Ethernet

Sound Intel® High Definition Audio Intel® High Definition Audio Intel® High Definition Audio w/ HDMI 1.3a support

Intel® High Definition Audio Intel® High Definition Audio Intel® High Definition Audio Intel® High Definition Audio, AC97 Intel® High Definition Audio Intel® High Definition Audio Intel® High Definition Audio Intel® High Definition Audio w/ HDMI 1.3a support

Intel® High Definition Audio Intel® High Definition Audio Intel® High Definition Audio Intel® High Definition Audio Realtek ALC886GR HDA Realtek ALC886GR HDA Sound

Graphics Controller Integrated Intel® Graphics HDTV/HD capable, Decoder for MPEG2(HD)/H.264

Integrated 2D/3D Graphics Engine, Gfx Core 333/400 MHz, shared VRAM Video Encode: MPEG4, H.263, H.264 Video Decode: MPEG2, MPEG4, VC1, WMV9, H.264

Integrated 2D/3D Graphics Engine, GMA 3650/3600, Gfx clock 640/400MHz, DirectX® 9.1, Video Decode: MPEG2, Blu-Ray Disk 2.0, VC-1, H.264, WMV9 up to 1080p

Intel® GMA 500, DirectX® 9, PS 3.0

Intel® GMA 500, DirectX® 9, PS 3.0

Integrated in Atom™ CPU, GMA950 (200 MHz) with DirectX® 9, PS 2.0

Intel® GMA950, DirectX® 9, PS 2.0

Intel® GMA X4500, DirectX® 10, PS 4.0

AMD® Mobility Radeon HD6250/HD6310, DirectX® 11, OpenCL 1.0, PS 5.0,H.264, VC-1 (ATI Avivo HD)

Integrated Radeon™ HD 7000 series

Intel® GMA 5650/560 DirectX® 9.1, OpenGL 3.0, BluRay 2.0

Intel® GMA X4500 DirectX® 10, PS 4.0

Intel® iGFX GMA HD/5700MHD, DirectX® 10, PS 4.0

Intel® iGFX HD3000/HD2000 integrated, DirectX® 10.1, PS 4.0, OpenGL 3.0

Intel® iGFX HD4000 integrated, DirectX® 11, PS 5.0, OpenGL 4.0, OpenCL 1.1

Intel® GMA 950 Integrated Radeon HD6310 / HD6250 DirectX® 11, PS 5.0, OpenGL 3.2 ATI Avivo HD with H.264, VC-1, Blu-ray support

Graphics Controller

Graphics Memory Up to 256 MB, DVMT Up to 352 MB, DVMT tbd Up to 256 MB DVMT Up to 1024 MB DVMT Up to 384 MB DVMT Up to 256 MB DVMT Up to 1024 MB DVMT tbd tbd tbd Up to 1700 MB DVMT Up to 1700 MB DVMT Up to 1700 MB DVMT Up to 1700 MB DVMT Up to 224 MB DVMT 3.0 tbd Graphics Memory

Display Interfaces Single Chanel LVDS 18/24 Bit 1366x768; SDVO (optional) up to 1920x1080

LVDS 18/24bit 1280x768@60Hz SDVO 1920x1080@50Hz

LVDS 18bit (N2600/2800) 1366x768@112MHz LVDS 18/24bit (D2700) 1440x900@112MHz 1x DP++ (HDMI/DVI/DisplayPort)

SDVO 1920x1080, Single-Channel LVDS 18/24 Bit, JILI support

Single channel 24 bit LVDS, Single SDVO channel

LVDS, VGA Single/Dual Channel LVDS up to 1600 x 1200, CRT up to 2048x1536, SDVO, TVout, JILI support

Dual SDVO multiplexed with PEG, DisplayPort and HDMI, Single/Dual Channel, LVDS 18/24 Bit up to 1600x1200, TVout, CRT up to 2048x1536

Single Channel LVDS 18 bit, (type 6) 24 bit (Type 2), 2x DDI (DisplayPort/HDMI/DVI) CRT up to 2560x1600 (Type 6)

Single Channel LVDS, 3x DP++ (HDMI/DVI/DisplayPort) incl. 1x eDP, additional 3x DP (multiplexed with PEG), 1x CRT

Single Channel LVDS,2x DP++ (HDMI/DVI/DisplayPort), CRT up to 1920x1200

Dual SDVO multiplexed with PEG, DisplayPort and HDMI, Single/Dual Channel LVDS 18/24 Bit up to 1600x1200, TVout, CRT up to 2048x1536

Type 2: VGA, LVDS, PEG (Multiplexed) Type 6: VGA, LVDS, 1x DDI (SDVO/DVI/DP/HDMI), 2x DDI (DVI/DP/HDMI), PEG (Multiplexed)

3x DP++ (incl. 1x SDVO, 1x eDP) 1x CRT, 1x Dual Channel LVDS 18/24 bit ( DP++ and PEG multiplexed on Type 2)

3x DP++ (incl. 1x eDP), 1x SDVO, 1x CRT, 1x Dual Channel LVDS 18/24 bit (DP++ and PEG multiplexed on Type 2)

Single/Dual Channel LVDS 18/24 bit up to 1600x1200, SDVO, CRT up to 2048x1536, JILI support

DP++ (DisplayPort/HDMI/DVI), Dual Channel LVDS 18/24 bit up to 1920 x 1200, CRT up to (2560 x 1600)

Display Interfaces

Power Support 4.75 V – 14.7 V; ACPI 3.0 4.75 V – 14.7 V; ACPI 3.0 4.75 V – 20 V, ACPI 3.0 8.5 V – 18 V; ACPI 3.0 4.75 V – 18 V; ACPI 3.0 4.75 V – 18 V; ACPI 3.0 8.5 V – 18 V; ACPI 3.0 8.5 V – 18 V; ACPI 3.0 4.75 V - 18V; ACPI 3.0 4.75 V – 18V; ACPI 3.0 4.75 V – 20 V, ACPI 3.0 8.5 V – 18 V; ACPI 3.0 8 V – 18 V; ACPI 3.0 8.5 V – 18 V; ACPI 3.0 8.5 V – 20 V; ACPI 3.0 5 V; ACPI 2.0 5 V; ACPI 3.0 Power Support

Form Factor COM Express® mini: 84 x 55 mm, Pin-out Type 1

COM Express® mini: 84 x 55 mm, Pin-out Type 10

COM Express® mini: 84 x 55 mm, Pin-out Type 10

COM Express® compact: 95 x 95 mm, Pin-out Type 2

COM Express® compact: 95 x 95 mm, Pin-out Type 2

COM Express® compact: 95 x 95 mm, Pin-out Type 2

COM Express® compact: 95 x 95 mm, Pin-out Type 2

COM Express® compact: 95 x 95 mm, Pin-out Type 2

COM Express® compact: 95 x 95 mm, Pin-out Type 2 or 6

COM Express® compact: 95 x 95 mm, Pin-out Type 2 or 6

COM Express® compact: 95 x 95 mm, Pin-out Type 6

COM Express® basic: 125 x 95 mm, Pin-out Type 2

COM Express® basic: 125 x 95 mm, Pin-out Type 2 or 6

COM Express® basic: 125 x 95 mm, Pin-out Type 2 or 6

COM Express® basic: 125 x 95 mm, Pin-out Type 2 or 6

ETX® 3.0: 95 x 114 mm

ETX® 3.0: 95 x 114 mm

Form Factor

Temperature Operation: 0°C to 60°C Storage: -30°C to 85°C

Operation: 0°C to +60°C Storage: -30°C to +85°C Industrial Temperature Range: -40°C to +85°C

Operation: 0°C to +60°C, Storage: -30° to +85°C, Extended Temperature: -25°C to +75°C on request

Operation: 0°C to +60°C Storage: -30°C to +85°C

Operation: -40°C to +85°C Storage: -40°C to +85°C Industrial Temperature Range: -40°C to +85°C

Operation: 0°C to +60°C, Storage: -30°C to +85°C, Extended Temperature: -25°C to +75°C or -40°C to +85°C (only D525) on request

Operation: 0°C to +60°C, Storage: -30° to +85°C, Extended Temperature: -25°C to 75°C on request

Operation: 0°C to +60°C, Storage: -30°C to +85°C, Extended Temperature: -25°C to +75°C on request

Operation: 0°C to +70°C Storage: -30°C to +85°C

Operation: 0°C to +70°C Storage: -30°C to +85°C

Operation: 0°C to +60°C, Storage: -30° to +85°C, Extended Temperature: -25°C to 75°C on request

Operation: 0°C to +60°C, Storage: -30°C to +85°C, Extended Temperature: -25°C to +75°C or -40°C to +85°C on request (esp. Celeron® 722, SU9300, SL9400)

Operation: 0°C to +70°C, Storage: -30°C to +85°C

Operation: 0°C to +60°C, Storage: -30°C to +85°C, Extended Temperature: -25°C to +75°C or -40°C to +85°C (esp. i7-2610UE, i7-2655LE) on request

Operation: 0°C to +60°C, Storage: -30°C to +85°C, Extended Temperature: -25°C to +75°C on request

Operation: 0°C to +60°C, Storage: -30°C to +85°C, Extended Temperature: -25°C to +75°C on request

Operation: 0°C to +60°C, Storage: -30°C to +85°C, Extended Temperature: -25°C to +75°C on request

Temperature

basic (125x95mm)compact (95x95mm)mini (84x55mm)

Computer-on-Modules for Extreme Temperatures

Mission-critical applications in the military, aerospace, transportation, energy and industrial automation markets offer the biggest challenges for extended temperature designs. To achieve functionality in extended temperature ranges, customers have two recommended ways to ensure that COM solutions perform within extended temperature environments – by design (solutions built with all industrial grade components) and by 100 percent extended temperature testing of the solution.The Kontron x86, ARM and Power Architecture® technology COMs in particular COMe-mTTi10, COMe-cXLi2, ULP-COM-sAMX6, ULP-COM-sA3874 and COMe-P2020 offers a "by design" modular solutions fully approved for use under E2 industrial temperature range (-40°C to +85°C) conditions. Kontron also offers other high-performance COMs re-engineered to be reliable under such extreme temperature conditions. A whitepaper detailing the Kontron approach to serving extreme applications also is downloadable from the Kontron website.

The Thermal Concept

COM Express® Heatspreader provides:» Identical mechanical size – all COM Express® modules

fit in the same system» The only surface that needs cooling is the top of the

heatspreader» Additional active and passive Heatsinks are available

» x86 Computer-on-Modules «

Asia Pacific

17 Building,Block #1, ABP. 188 Southern West 4th Ring Road Beijing 100070, P.R.China

Tel.: + 86 10 63751188 Fax: + 86 10 83682438info@kontron.cn

CORPORATE OFFICES

Europe, Middle East & Africa

Oskar-von-Miller-Str. 1 85386 Eching / Munich Germany

Tel.: + 49 (0) 8165 / 77 777 Fax: + 49 (0) 8165 / 77 219info@kontron.com

North America

14118 Stowe Drive Poway, CA 92064-7147 USA

Tel.: + 1 888 294 4558 Fax: + 1 858 677 0898info@us.kontron.com

Boards & More – Individual Carrier Board Design

When Carrier Board design and Computer-on-Modules come from a single source, system functionality can be optimally tuned for the application. Kontrons Boards & More Team offers the correct form factor fit – in the highest quality.With x86, ARM and PowerPC design experience, Kontron develops and delivers any kind of Carrier Board, including test, memory, heatsink, housing, assembly, individual configuration, packaging and shipment.Even if you can't find a suitable module in Kontron's broad product range, we'll take on the design and the manufacturing of complete boards with any desired CPU in any desired form factor.

Find out more on kontron.com/boardsandmore

Broad Knowledge Base Accelerates Time-to-Market

Kontron offers a variety of hardware and software tools to speed up and simplify your R&D processes.

With complete starter kits that, which include all required hard- and software for quick evaluation, engineers can start development while defining their application-specific solution. In addition to the available starter kits Kontron also provides various additional Graphics Adapters help developers to convert panel signals to the required specification of the target application.

Find out more on: kontron.com/mysafechoice

Concentrate on Your Core Business

Thanks to Computer-on-Modules (COM), customers can concentrate on their core business and only have to design the necessary interfaces and circuits for their individual carrier boards. The standardized computer module is then simply plugged into the carrier board. Customers can focus on their application-specific elements without worrying about the computing core.

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