© 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based...

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© 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April 29, 2009 NASA-ESA 2009 PDE Workshop Tom Thurman (Ret.), Michael Benda Rockwell Collins Advanced Manufacturing Technology

Transcript of © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based...

Page 1: © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April.

© 2009 Rockwell Collins, Inc. All rights reserved.

From Paper Based Analysis to Model Based Analysis:Applications of AP 210 at Rockwell Collins

April 29, 2009

NASA-ESA 2009 PDE Workshop

Tom Thurman (Ret.), Michael BendaRockwell CollinsAdvanced Manufacturing Technology

Page 2: © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April.

2Rockwell Collins Proprietary

About Rockwell Collins MBE Vision DFx Paper Based Data Flow Fiducial Example Filled Via Example Model Based Data Flow Immersive Visualization

Topics

Page 3: © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April.

3Rockwell Collins Proprietary

A Leading Supplier Of Aviation Electronics Airborne/Mobile Communication Systems

Roughly Equal Division Between Commercial And Military Sales> 15 Manufacturing Locations

Primarily High Value, High Mix, Relatively Low Volume Products Reliability, Flexibility, Reducing Lead Times Are Important AP 203 & AP 210 Are Key Components Of Our Environment

What Rockwell Collins Does

Page 4: © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April.

Attributes of the Model Based Enterprise (MBE):

Tools and processes are integrated through the application of standard information

All data abstractions for functional needs are accessible through data management interfaces

Performance verified with science based simulation environments and augmented by required physical testing

Knowledge captured and fed back through every stage of the life cycle

Integrated agile & flexible engineering, manufacturing, and operations characterized by modeling, simulation, and optimization, utilizing common processes and

Integrated systems/tools/data standards across the extended enterprise.

Model Based Enterprise Environment

Page 5: © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April.

Design for X (DFx)• Vision: Design rules are implemented to allow early and

consistent evaluations of new designs to identify and resolve issues prior to release for production

• Rockwell Collins first release of DFx has been Printed Circuit Assembly (PCA) Design For manufacturability (DFm):– Abstraction of standard information from CAD data– Manufacturing rules are run against design data– Visual representation communicates to the design team– Developed in a collaborative environment

• Second implementation of DFx is PCA Design For testability (DFt):– Same approach as DFm

• Third implementation of DFx is DFm at the Line Replaceable Unit (LRU) level:– In process

Page 6: © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April.

Design for Manufacturability• Analysis of how Suited a PCA Design is for Manufacturing

– Offline Process can be Run as Often as Needed During Design Process– Process Supports Balance Between Design and Manufacturing Needs

• Native CAD Data– Artwork– Component Terminal Locations– Drill Location, Size– PCA Bill Of Material– Milling

• Data Beyond Scope of Native CAD– Configuration Management (Product ID, Revision, Approvals, Date…)– Deleted/Replaced/Unpopulated Components in PCA– Fiducials– PCB Stackup– Assembly Panel (Tabs, Cutouts)– Standard Component Catalog Data– Component Manufacturing Properties– Component Manufacturing Classification– Textual Assembly Requirements

Page 7: © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April.

Design for Testability• Analysis of how Suited a PCA Design is for Test

– Extension of DFm• Data Added to DFm Data

– Native CAD Data:• Component Reference Designations Realized in Printed Circuit

Board (PCB)• Netlist• Component Placement in PCA• Component Terminal Locations in PCA• Land Locations in PCB• Connector Signal-Pin Outs• CAD-Defined Test Point Locations in PCB

– Data Beyond Scope of Native CAD:• Special Symbols Realized in PCB• Tooling Hole Locations in PCB• Special Lands for Terminals, Jumpers, etc…• Special Test Point Locations in PCB

Page 8: © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April.

8© Rockwell Collins 2006, 2009

Drawing Creation

(Scripting with ECAD Tool)

ECADECAD

PanelPanelModelModel

FabricationFabricationRequirementsRequirements

CMCM

Product dataProduct dataRequirements dataRequirements data

Paper Based Data Flow

AssemblyAssemblyRequirementsRequirements

MaterialMaterialStackupStackupModelModel

Native CAD; Basic geometry, Netlist

Product ID, Approvals Drawing Review

Page 9: © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April.

Departmental Specific Encoding of Domain Specific Features: Fiducial• In the printed circuit card manufacturing domain, a Fiducial

is a small mark included in a PCB used to align components• Fiducials are required to be included in a PCB design and

must be identified to facilitate design review and Computer Aided Manufacturing (CAM) tools.

• A Fiducial is represented in a Specific Design Department by a part with a name = “FIDUCIAL”. “FIDUCIAL” is not a material item so the originating Department filters any Bill Of Material (BOM) related data before publishing. Another Design Department may represent a Fiducial by assigning a name to some other CAD data type; the identification string varies.

• Fiducial is a predefined feature data type in the layout view in AP 210. If a Department published BOM-related data from an AP 210 database, no filtering would be needed, because features are not parts, thereby reducing maintenance costs.

Page 10: © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April.

CADTOOL

Departmental Specific Encoding of

Domain Specific Features in CAD

Domain SpecificFeatures Data

(Out of Scope ofCAD Tool)

NativeCAD ToAP 210Mapping

Departmental Encoding To

AP 210Mapping

Domain Specific Features: Sharing Fiducial Data Between Departments

in A Supply Chain

Design Intent

CADNativeData

Model

CAMTOOL

CAMNativeData

Model

AP 210To CAMMapping

Domain SpecificFeatures Data(In Scope of CAM Tool)

AP 210 Data Set

Page 11: © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April.

Departmental Specific Encoding of Domain Specific Features: Filled Via• In the PCB manufacturing domain, a filled via is a

small plated hole that is filled after the lamination process.

• Filled vias may be included for various reasons.• A Filled Via is represented in a Specific Design

Department by a user defined classification defined in the released drawing. The identification of the fill material is included in a note.

• Filled_via is a predefined data type in AP 210. • Material_identification is a predefined data type

in STEP that is related to the fill material through a predefined relationship in AP 210.

Page 12: © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April.

Design Intent

CADTOOL

Departmental Specific Encoding of

Filled via, material

Departmental Encoding To

AP 210Mapping

Domain Specific Features: Analyzing Filled Via Impact on Product Properties

AnalysisTOOL

AP 210To Analysis

Mapping

Display Filled ViaImpact

AP 210 Data SetNative

CAD ToAP 210Mapping

Filled viaClasses

Filled viaMaterial

Page 13: © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April.

13© Rockwell Collins 2006, 2009

LKSoft Mapping Engine

ECADECAD

Component Information

System

PanelPanelModelModel

CIM Global Library

DFXpert Rules

EnginePart &Design Data

FabricationFabricationRequirementsRequirements

CMCM

AP210 (P21)

Part dataPart dataProduct dataProduct dataRequirements dataRequirements data

AP210 (P28)Part Data

Results

(Daily)(Daily)

AssemblyAssemblyRequirementsRequirements

MaterialMaterialStackupStackupModelModel

Native CAD; Basic geometry, Netlist

Product ID, Approvals

MappingSpecifications

Model Based Data Flow

Page 14: © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April.

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Will Provide Advanced 3-D Visualization Including Domain Specific Features

Allow Designers To See How Everything Will (Or Will Not) Fit Together

Design Reviews Can Use Virtual Touchable Models

AP210

SIMULATIONTOOL

AP203

AP 210 Standard Model

3-D Component

ModelsAP210

Immersive Visualization

Page 15: © 2009 Rockwell Collins, Inc. All rights reserved. From Paper Based Analysis to Model Based Analysis: Applications of AP 210 at Rockwell Collins April.

© 2009 Rockwell Collins, Inc. All rights reserved.

Questions?