© 2009 IBM Corporation Motivation for HPC Innovation in the Coming Decade Dave Turek VP Deep...
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Transcript of © 2009 IBM Corporation Motivation for HPC Innovation in the Coming Decade Dave Turek VP Deep...
© 2009 IBM Corporation
Motivation for HPC Innovation in the Coming Decade
Dave TurekVP Deep Computing, IBM
© 2005 IBM CorporationPage 22
High Performance Computing Trends
Three distinct phases . • Past: Exponential growth in processor performance mostly through CMOS technology advances• Near Term: Exponential (or faster) growth in level of parallelism.• Long Term: Power cost = System cost ; invention required
Curve is not only indicative of peak performance but also performance/$
Supercomputer Peak Performance
1940 1950 1960 1970 1980 1990 2000 2010
Year Introduced
1E+2
1E+5
1E+8
1E+11
1E+14
1E+17
Pea
k S
pee
d (
flo
ps)
Doubling time = 1.5 yr.
ENIAC (vacuum tubes)UNIVAC
IBM 701IBM 704
IBM 7090 (transistors)
IBM StretchCDC 6600 (ICs)
CDC 7600CDC STAR-100 (vectors) CRAY-1
Cyber 205 X-MP2 (parallel vectors)
CRAY-2X-MP4 Y-MP8
i860 (MPPs)
ASCI White
Blue Gene/L
Blue Pacific
DeltaCM-5 Paragon
NWT
ASCI Red OptionASCI Red
CP-PACS
Earth
VP2600/10SX-3/44
Red Storm
ILLIAC IV
SX-2
SX-4
SX-5
S-810/20
T3D
T3E
ASCI Purple
2020
Blue Gene/P
Blue Gene/Q
Past
Near Term
Long Term
1PF: 2008
10PF: 2011
1EF: 201X?
© 2005 IBM CorporationPage 33
10G 100G 1T 10T 100T 1P 10P 100P 1E
Power6 QS22 Blade QS22 Rack
BG/P Rack Roadrunner
BlueGene/P
P505Q Rack 10 BG/P Racks
2 Days forecast 10 Days forecast Multi-Scale Multi-Physics Climate Models
Astrophysics Ocean models Global warming
Hurricane Models
Eng
inee
ring
Geo
scie
nce
sE
nerg
y (n
ucle
ar) Vibroacustic analysis Comp. Photo-Lithogr. Plasma ( Fusion )
Full aircraft design
Solid Earth (Petroleum, Water, Voids)
Nuclear FissionFull automobile
Earthquake
Airfoil design
Wea
ther
C
lima
teLi
fe
Sci
ence
s
In vivo bone anal.
Peptide analysis Mouse brain
Full bone anal.
Rat brain Protein Folding
Human brainG-receptors
Rigid docking Massive rigid docking First principle dockingFree Energy based docking
Mat
eria
ls
Mod
elin
g
First Principle device simulationsPhase TransitionsComp. SpectroscopyElectron Transfer
Electronic Structure Calculations Nano-scale modeling
Multi-scale Material Simulations
High-k materials
P575 Rack
© 2005 IBM CorporationPage 44
Core Frequencies ~ • 2-4 GHz, will not change significantly as we go
forward• 100,000,000 Cores to deliver an Exaflop
Power• At today’s MegaFlops / Watt: 2 GW needed
(~$2B/yr)• Power reduction will force simpler chips, longer
latencies, more caches, nearest neighbor network Memory and Memory Bandwidth
• Much less memory / core (price)• Much less bandwidth / core (power / technology)
Network Bandwidth• Much less network bandwidth per core (price /
core) (Full fat tree ~$1B to $4B) • Local network connectivity
Reliability• Expect algorithms / applications will have to
permit / survive hardware fails. I/O Bandwidth
• At 1 Byte / Flop, an EXAFLOP system will have 1 EXABYTE of Memory.
• No disk system can read / write this amount of data in reasonable time. (BG/P 4TB ~1min but disk array ingest at ~15min)
Computer Design Challenges
Exascale Computing• O(100 M) compute engines working
together
Capability delivered has the potential to be truly revolutionary
However• Systems will be complex• Software will be complex• Applications will be complex• Data Centers will be complex• Maintenance / Management will be
complex
© 2005 IBM CorporationPage 55
Summary Why Exascale?
Applications not possible with smaller machines
Applications with multiple integrated components for complex systems
Applications needing many iterations for sensitivity analysis, etc
Exascale has enormous challenges!• Power
• Cost
• Memory requirements
• Usability
Users will need time on a successive series of larger platforms to get to the exascale. • Code development will be a large undertaking and tools to assist in this effort are critical
.
Thank You
Capability
Understanding
Complexity